JP2021150459A - 誘電体薄膜、誘電体素子および電子回路基板 - Google Patents
誘電体薄膜、誘電体素子および電子回路基板 Download PDFInfo
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- 229910052712 strontium Inorganic materials 0.000 claims abstract description 7
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 7
- 229910052735 hafnium Inorganic materials 0.000 claims abstract description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 6
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- 229910052802 copper Inorganic materials 0.000 claims description 5
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
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- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
前記誘電体薄膜の膜厚方向に対して垂直な1μm四方の平面視野に存在する結晶粒の中で、19nm以上140nm未満の粒径を有する前記結晶粒が占める個数割合が95%以上であり、
前記平面視野に存在する前記結晶粒の中で、65nm以上77nm未満の粒径を有する第1結晶粒が占める個数割合が20%以上であり、
前記平面視野に存在する前記結晶粒の中で、19nm以上54nm未満の粒径を有する第2結晶粒が占める個数割合が40%以下である。
0<x≦0.15
0<y≦0.15
0.90≦m≦1.15
0<δ≦0.05
を満たしてもよい。
前記電極は、Pt、Ni、CuおよびPdからなる群から選ばれる少なくとも1つであってもよい。
本実施形態に係る薄膜キャパシタの模式図を図1に示す。なお、薄膜キャパシタは誘電体素子の一種である。図1に示す薄膜キャパシタ1は、基板11上に形成される第1電極12と、第1電極12上に形成される誘電体薄膜13と、誘電体薄膜13の表面に形成される第2電極14とを有する。なお、薄膜キャパシタ1は基板11を有していなくてもよい。たとえば第1電極12としては、Ni箔等の金属箔が用いられ、金属箔の上に誘電体薄膜13が成膜されていてもよい。
本実施形態に係る電子回路基板は、上記の誘電体薄膜を備える。電子回路基板は、上記の誘電体薄膜を含む薄膜キャパシタなどの電子部品を備えてもよい。薄膜キャパシタ等の電子部品は、電子回路基板の表面に設置されていてもよい。薄膜キャパシタ等の電子部品は、電子回路基板内に埋め込まれていてもよい。
次に、薄膜キャパシタ1の製造方法について説明する。
次に、電子回路基板90の製造方法について図6Aおよび図6Bを用いて説明する。
まず、成膜用ターゲットとして用いる焼結体の原料として、SrCO3粉末、CaCO3粉末、TiO2粉末、およびHfO2粉末を準備した。最終的に得られる誘電体薄膜においてx、yおよびmが表1または表2に示す値となるように各粉末を秤量した。
11・・・基板
12・・・第1電極
13・・・誘電体薄膜
14・・・第2電極
90・・・電子回路基板
91・・・薄膜キャパシタ
30・・・第1電極
40・・・誘電体薄膜
50・・・第2電極
52・・・貫通電極
54,56・・・取り出し電極
58・・・絶縁性樹脂層
92・・・樹脂基板
92a,92b・・・基板
93・・・樹脂層
93a,93b・・・絶縁性樹脂層
94・・・絶縁性被膜層
95・・・電子部品
96・・・金属配線
Claims (5)
- Ca、Sr、Ti、Hf、OおよびNを含む誘電体薄膜であって、
前記誘電体薄膜の膜厚方向に対して垂直な1μm四方の平面視野に存在する結晶粒の中で、19nm以上140nm未満の粒径を有する前記結晶粒が占める個数割合が95%以上であり、
前記平面視野に存在する前記結晶粒の中で、65nm以上77nm未満の粒径を有する第1結晶粒が占める個数割合が20%以上であり、
前記平面視野に存在する前記結晶粒の中で、19nm以上54nm未満の粒径を有する第2結晶粒が占める個数割合が40%以下である誘電体薄膜。 - 組成式(Sr1−xCax)m(Ti1−yHfy)O3−δNδで表される主成分を有する誘電体薄膜であって、
0<x≦0.15
0<y≦0.15
0.90≦m≦1.15
0<δ≦0.05
を満たす請求項1に記載の誘電体薄膜。 - 請求項1または2に記載の誘電体薄膜を有する誘電体素子。
- 前記誘電体薄膜は電極上に形成されており、
前記電極は、Pt、Ni、CuおよびPdからなる群から選ばれる少なくとも1つである請求項3に記載の誘電体素子。 - 請求項3または4に記載の誘電体素子を有する電子回路基板。
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US17/189,859 US11453615B2 (en) | 2020-03-18 | 2021-03-02 | Dielectric thin film, dielectric element and electronic circuit board |
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Citations (3)
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JP2005512280A (ja) * | 2001-12-06 | 2005-04-28 | パイオニア株式会社 | 電子放出素子及びその製造方法並びに電子放出素子を用いた表示装置 |
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