JP2021138134A - Substrate support device for scribe processing of brittle substrate - Google Patents

Abstract

To provide a substrate support device for the scribe processing of a brittle substrate capable of forming a precise scribe line.SOLUTION: A substrate support device is installed adjacently to a scriber (15) forming a scribe line in a brittle substrate (100) transferred along a prescribed passage, is used for preventing the deformation of the brittle substrate (100) by power applied to the brittle substrate (100) upon scribing processing, and comprises a support table (40) installed in the lower part of the brittle substrate (100) so as to be elevatable and surface-contacting with the bottom face of the brittle substrate (100) in an elevated state to prevent the sagging of the brittle substrate (100), an elevation movement means (33b) elevationally moving the support table (40) and a controller (37) controlling the elevation movement means.SELECTED DRAWING: Figure 3

Description

The present invention relates to a scribing device used for cutting a thin substrate having brittleness, and more specifically, the brittleness that suppresses unnecessary movement and bending of the substrate generated during the scribing process and improves the precision of scribing. The present invention relates to a substrate support device for scribe processing of a substrate.

A scribe device equipped with a cutting wheel is used as a tool for cutting a thin brittle substrate including a glass substrate to a required size. The scribe device runs at the same time as applying a load while the cutting wheel is pressed against the surface of the substrate so that the rolling cutting wheel forms a scribing line on the surface of the substrate, and after the scribing line is formed. , It has a structure in which a bending force is applied around a scribe line so that the substrate is cut.

Figure 1 shows the schematic structure of a conventional scribe device.

As shown, the conventional scribe device (10) has an upstream conveyor (11), a cradle (11a), a downstream conveyor (13), a cradle (13a), and a scriber (15). The cradle (11a, 13a) keeps the upstream conveyor (11) and the downstream conveyor (13) at the same height. The upstream conveyor (11) and the downstream conveyor (13) have the same height and at the same time extend in a straight line, and the brittle substrate (100) to be processed is transferred in the direction of arrow a.

The upstream conveyor (11) and the downstream conveyor (13) are separated from each other for a certain period of time. The space between the upstream conveyor (11) and the downstream conveyor (13) is the space where scribing is performed.

The scriber (15) has an upper head (15a) and a lower head (15b), respectively, to which a cutting wheel (17) is mounted. With the upper head (15a) and lower head (15b) lowered and raised respectively and the cutting wheel (17) set to pressurize the brittle substrate (100), the scriber (15) is moved to the brittle substrate (100). When moved in the width direction of, the cutting wheel (17) rolls and forms a scribe line on the brittle substrate (100).

In FIG. 1, the cutting wheel (17) is all applied to the upper and lower parts of the brittle substrate (100), but the scribing device installs a laser irradiation part on the upper part of the brittle substrate (100) and cuts the wheel only on the lower part. In many cases, (17) is applied, the cutting wheel (17) is applied to the upper part, and the laser irradiation part is applied to the lower part. In such a case, the load of the cutting wheel (17) is applied to only one surface of the brittle substrate (100), so that the brittle substrate (100) hangs down or is curved upward.

2a and 2b are diagrams for explaining the problems of the scribe device shown in FIG.

Referring to FIG. 2a, the brittle substrate (100) is hung on the upstream conveyor (11) and the downstream conveyor (13), and the cutting wheel (17) of the upper head (15a) is attached to the brittle substrate (100). The brittle substrate (100) is pressurized to form a scribe line. Since the brittle substrate (100) itself is very thin, the phenomenon of hanging down even when it is floating in the air occurs, but as shown in Fig. 2a, the pressure in the direction of arrow f is more weighted. , The brittle substrate (100) will be further curved downwards. If the cutting wheel (17) is run in this state, a scribe line is formed, but a problem of inferior precision occurs.

In the case of FIG. 2b, the cutting wheel (17) pressurizes the brittle substrate (100) in the direction of arrow g. Since the brittle substrate must be pressurized in order to form the scribe line, the brittle substrate (100) becomes curved upward. Nevertheless, in the case of Fig. 2a, the brittle substrate (100) is supported by the conveyors on both sides, but in Fig. 2b, since the brittle substrate is supported by its own weight, the formation of a precise scribe line should be expected. Is difficult.

Korean Registered Patent Gazette No. 10-1330148

The present invention was created in order to solve the above-mentioned problems, and scribe processing of a brittle substrate capable of forming a precise scribing line by stably maintaining the horizontal state of the brittle substrate during scribe processing. An object of the present invention is to provide a substrate support device for brittleness.

The substrate support device for scribing a brittle substrate of the present invention as a means for solving the problems for achieving the above object is installed close to a scriber forming a scribing line on the brittle substrate transferred along a predetermined path. It prevents the brittle substrate from being deformed by the force applied to the brittle substrate during scribing work, and is installed so as to be able to move up and down under the brittle substrate, and is in contact with the bottom surface of the brittle substrate in an elevated state. The brittle substrate is provided with a support table for preventing the brittle substrate from sagging, an elevating movement means for raising and lowering the support table, and a controller for controlling the elevating movement means.

Further, the elevating movement means; has a linear actuator fixed vertically and controlled by the controller, and an elevating slider which moves up and down in the vertical direction by the linear actuator and transmits the elevating movement force to the support table.

Further, the inside of the support table is opened to the upper part of the support table via an intake port and is connected to an external vacuum pump so as to be in contact with the support table when the vacuum pump is operated. An intake passage is formed that acts to attract the brittle substrate to the support table.

At the same time, the inside of the support table is opened to the upper part of the support table via an exhaust port and is connected to an external press-fit pump, and when the press-fit pump is operated, the air provided by the press-fit pump is released. An ejection passage is formed in which the brittle substrate is ejected upward through the exhaust port and the brittle substrate is pressurized upward using air pressure.

The substrate support device for scribing a brittle substrate of the present invention as described above forms a precise scribing line by stably maintaining the horizontality of the brittle substrate during scribing.

It is a front view which shows the schematic structure of the conventional scribe device. (a) and (b) are diagrams for explaining the problem of the scribe device shown in FIG. It is a side view for demonstrating the structure of the substrate support apparatus for scribe processing of a brittle substrate which concerns on one Example of this invention. It is a perspective view which showed separately the support table shown in FIG. (a) is a sectional view taken along line AA of FIG. 4, and FIG. 4B is a sectional view taken along line BB of FIG. It is a figure for demonstrating the operation of the board support device shown in FIG. It is a figure for demonstrating the operation of the board support device shown in FIG. It is a figure for demonstrating the modification of the substrate support apparatus for scribe processing of a brittle substrate which concerns on one Example of this invention.

Hereinafter, an embodiment according to the present invention will be described in more detail with reference to the attached drawings.

The substrate support device for scribe processing of a brittle substrate of the present invention prevents the brittle substrate from being deformed by the force applied to the brittle substrate during scribe processing of the brittle substrate. In other words, it keeps the brittle substrate horizontal even when the force of the cutting wheel is applied to the brittle substrate. The reason for keeping the brittle substrate horizontal is, of course, to improve the precision of scribe machining.

The basic configuration of the substrate support device of the present invention is installed close to a scriber that forms a scribing line on the brittle substrate that is transferred along a predetermined path, and the brittle substrate is deformed by the force applied to the brittle substrate during the scribing operation. A support table that is installed so as to be able to move up and down under the brittle substrate and is in contact with the bottom surface of the brittle substrate in an elevated state to prevent the brittle substrate from sagging. It is composed of an ascending / descending motion means for ascending / descending the support table and a controller for controlling the ascending / descending motion means.

FIG. 3 is a side view for explaining a configuration of a substrate support device (30) for scribe processing of a brittle substrate according to an embodiment of the present invention.

With reference to the drawings, it can be seen that the scriber (15) is installed between the upstream conveyor (11) and the downstream conveyor (13). The scriber (15) provides an upper head (15a) and a lower head (15b), each of which is fitted with a cutting wheel (17) on the upper and lower heads (15a, 15b).

On the other hand, the substrate support device (30) according to the present embodiment includes a fixed structure (31) fixed to the pedestal (13a), a controller (37) supported by the fixed structure (31), and a linear actuator (33). ), A support table (40) that is fixed to a linear actuator (33) and moves up and down in the vertical direction. The position of the controller (37) can be changed in various ways. For example, it can be installed in a separate electrical box.

The fixed structure (31) is a support frame fixed to the lower portion of the cradle (13a) and supports the controller (37) and the linear actuator (33). The structure and size of the fixed structure (31) can vary indefinitely as long as it can provide bearing capacity.

The linear actuator (33) is fixed to the fixed structure (31) and controlled by the controller (37). The vertical guide portion (33a), which is a part of the linear actuator (33), is vertically extended while being fixed to one side surface of the fixed structure (31), and the elevating slider (33b) is the vertical guide portion (33a). Move up and down while being supported by. The height of the elevating slider (33b) is finely adjusted by the controller (37).

Further, a connecting plate (35) is fixed to the elevating slider (33b). The connecting plate (35) is a plate-type member having a certain thickness, and is integrated with the elevating slider (33b) and moves up and down by the operation of the linear actuator (33). The connecting plate (35) and the linear actuator (33) are interconnected and serve as a lifting means for transmitting lifting force to the support table (40).

On the other hand, the support table (40) is a block-type member that provides a substrate support surface (42) having a width capable of contacting the bottom surface of the brittle substrate (100), and is an upper end of the connecting plate (35). It is fixed to the part. As shown in FIGS. 6 and 7, the support table (40) can pull the brittle substrate (100) to the lower part to be attracted and fixed, or can float the brittle substrate (100) to the upper part. A description related to this will be described later.

At the same time, an intake passage (43a in FIG. 5a) and an ejection passage (44a in FIG. 5b) are installed inside the support table (40), and the intake passage (43a) is evacuated via a vacuum hose (45). The pump (51) and the ejection passage (44a) are connected to the pressurizing pump (53) via a press-fit hose (46). The vacuum pump (51) and pressure pump (53) are also controlled by the controller (37).

The vacuum pump (51), for example, serves to maintain the pressure inside the intake passage (43a) at a negative pressure, and the pressurizing pump (53) is responsible for blowing air into the ejection passage (44a). do.

FIG. 4 is a perspective view in which the support table (40) shown in FIG. 3 is separately illustrated, FIG. 5 (a) is a sectional view taken along line AA of FIG. 4, and FIG. 5 (b) is a sectional view of FIG. It is a BB line sectional view.

As illustrated, the support table (40) takes the form of a substantially "dogleg" shaped side surface and provides a horizontal substrate support surface (42) on the top surface. The substrate support surface (42) is a horizontal plane that holds the bottom surface of the brittle substrate (100), and its size can vary as required.

Further, a large number of intake ports (43) and spouts (44) are arranged on the substrate support surface (42). The intake port (43) is a hole for sucking air in the upper part of the substrate support surface (42) to the lower part, and the spout (44) is a hole for ejecting air to the upper part of the support table (40).

The intake port (43) is connected to the intake passage (43a) as shown in FIG. 5a. The intake passage (43a) is an air passage formed inside the support table (40), and the lower end thereof is connected to the vacuum hose (45). When the vacuum pump (51) is operated, the air inside the intake passage (43a) naturally escapes to the lower part. Therefore, for example, as shown in FIG. 6, when the brittle substrate (100) is in contact with the substrate support surface (42), the brittle substrate (100) is adsorbed and fixed on the substrate support surface (42). Will be done.

Further, the spout (44) takes the form of a long hole and is connected to the spout passage (44a) as shown in FIG. 5 (b). The ejection passage (44a) is an air passage formed inside the support table (40), and the lower end thereof is connected to the press-fit hose (46). Therefore, as mentioned above, the high-pressure air generated from the pressurizing pump passes through the press-fit hose (46) and the ejection passage (44a) and is discharged to the upper part of the ejection port (44).

It goes without saying that the appearance and arrangement structure of the intake port (43) and the spout (44) described above can be changed as much as possible.

6 and 7 are diagrams for explaining the operation of the substrate support device (30) shown in FIG.

First, as shown in FIG. 6, the support table (40) is raised to keep the brittle substrate (100) finely hanging at the bottom horizontal. At this time, the substrate support surface (42) is in contact with the bottom surface of the brittle substrate (100).

When the height of the support table (40) is set through the above process, the vacuum pump (51) is operated to adsorb and fix the brittle substrate (100) to the substrate support surface (42). Needless to say, since the brittle substrate (100) is adsorbed on the substrate supporting surface (42), the brittle substrate (100) is not lifted up or pulled toward the cutting wheel (17).

After the brittle substrate (100) is completely adsorbed on the substrate support surface (42), the cutting wheel (17) is lowered and then traveled in the width direction of the brittle substrate (100) to the brittle substrate (100) in the width direction. Form a brittle line. When the formation of the scribe line is completed, the cutting wheel (17) is raised again to transfer the brittle substrate (100) in the direction of arrow c in FIG.

On the other hand, even when the cutting wheel (17) is installed under the brittle substrate (100), the brittle substrate (100) is placed on the substrate support surface (42) after the height of the support table (40) is set. Scribing proceeds in a state of being sucked and fixed. As long as the brittle substrate (100) is adsorbed on the substrate support surface (42), the cutting wheel (17) runs under the brittle substrate, and even if the brittle substrate (100) is pressed upward, the brittle substrate (100) remains at the top. It is possible to perform precise scribing without rising to the surface.

After the scribing is complete, in order to transfer the brittle substrate (100), the vacuum pump (51) is stopped and the pressurizing pump (53) is operated to eject air through the spout (44).

The pressure of the air ejected through the spout (44) is transmitted to the bottom surface of the brittle substrate (100), causing the brittle substrate (100) to float from the substrate support surface (42). As a result, the brittle substrate (100) rises from the substrate support surface (42) by an interval G, as shown in FIG. 7. The levitation interval G varies as needed and is adjusted by the controller (37).

By the way, the support table (40) is lowered by a height corresponding to the interval G so that the flatness of the brittle substrate does not collapse in response to the floating of the brittle substrate (100). Eventually, the support table (40) is separated from the brittle substrate (100) while maintaining the levelness of the brittle substrate (100).

If the brittle substrate (100) is lifted from the substrate support surface (42) in this way, in other words, if the substrate support surface (42) descends while supporting the brittle substrate (100), the upstream / downstream side conveyor (11, 13) is operated to move the brittle substrate (100) in the direction of arrow c. Since the brittle substrate (100) is separated from the substrate support surface (42), there is naturally no damage from the substrate support surface (42).

FIG. 8 is a diagram for explaining a modified example of the substrate support device (30) for scribe processing of a brittle substrate according to an embodiment of the present invention.

The same drawing code as the drawing code in the above-described embodiment indicates the same member having the same function.

The substrate support device (30) of this modification can be used regardless of the direction of the scribe line. For example, the scribe line exerts its function regardless of whether it is in the direction orthogonal to the transfer direction (width direction) of the brittle substrate (100) or in the direction parallel to the transfer direction.

FIG. 8 is a diagram showing how the cutting wheel (17) forms a scribe line in a direction parallel to the transfer direction of the brittle substrate. Such work is performed by the cutting wheel (17) pushing the brittle substrate (100) and performing only a rolling motion on the spot, and the brittle substrate (100) moving in the direction of arrow c.

As shown, the support table (40) located on the downstream side of the cutting wheel (17) raises the brittle substrate (100) from the substrate support surface (42) in the direction of arrow m. The reason for floating the brittle substrate (100) is to prevent the brittle substrate (100) from hitting the substrate support surface (42) as described above. Further, it is the same that the substrate support surface (42) is lowered by the height at which the brittle substrate (100) floats to maintain the flatness of the brittle substrate (100).

Although the present invention has been described in detail through specific examples, the present invention is not limited to the above-mentioned examples, and various modifications can be made by a person having ordinary knowledge within the scope of the technical idea of the present invention. It is possible.

10 Scribe device 11 Upstream side conveyor 11a Cradle 13 Downstream side conveyor 13a Cradle 15 Climber 15a Upper head 15b Lower head 17 Cutting wheel 30 Board support device 31 Fixed structure 33 Linear actuator 33a Vertical guide 33b Lifting slider 35 Connecting plate 37 Controller 40 Support table 42 Board support surface 43 Intake port 43a Intake passage 44 Ejection port 44a Ejection passage 45 Vacuum hose 46 Press-fit hose 51 Vacuum pump 53 Pressurized pump 100 Brittle substrate

Claims (4)

It is installed close to a scriber that forms a scribe line on the brittle substrate that is transferred along a predetermined path, and prevents the brittle substrate from being deformed by the force applied to the brittle substrate during scribing work.
A support table which is installed under the brittle substrate so as to be able to move up and down, and which is in contact with the bottom surface of the brittle substrate in an elevated state to prevent the brittle substrate from sagging.
Ascending / descending motion means for ascending / descending the support table and
A controller that controls the elevating movement means and
A substrate support device for scribe processing of brittle substrates. The elevating movement means
A linear actuator that is fixed vertically and controlled by the controller,
An elevating slider that moves up and down in the vertical direction by the linear actuator and transmits the elevating force to the support table.
The substrate support device for scribe processing of a brittle substrate according to claim 1. Inside the support table,
It is opened to the upper part of the support table via the intake port and is connected to an external vacuum pump.
The substrate support for scribe processing of the brittle substrate according to claim 1, wherein an intake passage is formed so as to attract the brittle substrate in contact with the support table to the support table when the vacuum pump is operated. Device. It is installed close to a scriber that forms a scribe line on the brittle substrate that is transferred along a predetermined path, and prevents the brittle substrate from being deformed by the force applied to the brittle substrate during scribing work.
A support table which is installed under the brittle substrate so as to be able to move up and down, and which is in contact with the bottom surface of the brittle substrate in an elevated state to prevent the brittle substrate from sagging.
Ascending / descending motion means for ascending / descending the support table and
A controller that controls the elevating movement means and
With
Inside the support table,
It is opened to the upper part of the support table through the exhaust port and is connected to an external press-fitting pump.
When the press-fitting pump is operated, the air provided by the press-fitting pump is ejected upward through the exhaust port, and a substrate support for scribing the brittle substrate is formed by forming an ejection passage for upwardly pressurizing the brittle substrate using air pressure. Device.

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