JP2021128752A5 - - Google Patents
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- JP2021128752A5 JP2021128752A5 JP2020191783A JP2020191783A JP2021128752A5 JP 2021128752 A5 JP2021128752 A5 JP 2021128752A5 JP 2020191783 A JP2020191783 A JP 2020191783A JP 2020191783 A JP2020191783 A JP 2020191783A JP 2021128752 A5 JP2021128752 A5 JP 2021128752A5
- Authority
- JP
- Japan
- Prior art keywords
- operand
- tiles
- tile
- module
- memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202062975577P | 2020-02-12 | 2020-02-12 | |
| US62/975,577 | 2020-02-12 | ||
| US16/859,829 US11226816B2 (en) | 2020-02-12 | 2020-04-27 | Systems and methods for data placement for in-memory-compute |
| US16/859,829 | 2020-04-27 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021128752A JP2021128752A (ja) | 2021-09-02 |
| JP2021128752A5 true JP2021128752A5 (enExample) | 2023-10-02 |
| JP7550614B2 JP7550614B2 (ja) | 2024-09-13 |
Family
ID=77177440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020191783A Active JP7550614B2 (ja) | 2020-02-12 | 2020-11-18 | インメモリコンピューティングに対するデータ配置のための方法及びその方法が適用されたメモリモジュール |
Country Status (4)
| Country | Link |
|---|---|
| US (4) | US11226816B2 (enExample) |
| JP (1) | JP7550614B2 (enExample) |
| KR (1) | KR102653014B1 (enExample) |
| TW (1) | TWI848184B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI850513B (zh) * | 2020-03-06 | 2024-08-01 | 南韓商三星電子股份有限公司 | 用於記憶體內計算的方法及用於計算的系統 |
| CN115885344A (zh) * | 2020-06-16 | 2023-03-31 | 格罗克公司 | 用于确定性处理器的确定性近计算存储器以及存储器单元与处理单元之间的增强数据移动 |
| US11901035B2 (en) | 2021-07-09 | 2024-02-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of differentiated thermal throttling of memory and system therefor |
| US12032829B2 (en) | 2021-07-21 | 2024-07-09 | Samsung Electronics Co., Ltd. | Memory device performing in-memory operation and method thereof |
| US20230315920A1 (en) * | 2022-04-02 | 2023-10-05 | Intel Corporation | Apparatus and method to implement homomorphic encyption and computation with dram |
| US20240257851A1 (en) * | 2023-01-27 | 2024-08-01 | Samsung Electronics Co., Ltd. | Memory device and method of operating the same |
| KR20240175962A (ko) * | 2023-06-14 | 2024-12-23 | 삼성전자주식회사 | Dsp 및 이를 이용한 전자 장치 |
| CN119201035A (zh) * | 2023-06-26 | 2024-12-27 | 华为技术有限公司 | 一种数据处理的方法、芯片和计算设备 |
| KR102814916B1 (ko) * | 2023-08-23 | 2025-05-30 | 삼성전자주식회사 | 메모리 장치 및 그 동작 방법 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06215160A (ja) | 1992-08-25 | 1994-08-05 | Texas Instr Inc <Ti> | データ処理方法および装置 |
| US5953738A (en) * | 1997-07-02 | 1999-09-14 | Silicon Aquarius, Inc | DRAM with integral SRAM and arithmetic-logic units |
| US6295586B1 (en) * | 1998-12-04 | 2001-09-25 | Advanced Micro Devices, Inc. | Queue based memory controller |
| JP4250900B2 (ja) * | 2002-03-14 | 2009-04-08 | ソニー株式会社 | 記憶装置 |
| KR100874949B1 (ko) * | 2006-11-15 | 2008-12-19 | 삼성전자주식회사 | 단일 명령 다중 자료 프로세서 및 그것을 위한 메모리어레이 구조 |
| US8477146B2 (en) * | 2008-07-29 | 2013-07-02 | Marvell World Trade Ltd. | Processing rasterized data |
| US8521958B2 (en) * | 2009-06-04 | 2013-08-27 | Micron Technology, Inc. | Internal processor buffer |
| US9542101B2 (en) * | 2013-01-22 | 2017-01-10 | Avago Technologies General Ip (Singapore) Pte. Ltd. | System and methods for performing embedded full-stripe write operations to a data volume with data elements distributed across multiple modules |
| US20140331014A1 (en) * | 2013-05-01 | 2014-11-06 | Silicon Graphics International Corp. | Scalable Matrix Multiplication in a Shared Memory System |
| EP3087489A4 (en) * | 2013-12-26 | 2017-09-20 | Intel Corporation | Data reorder during memory access |
| US10185499B1 (en) * | 2014-01-07 | 2019-01-22 | Rambus Inc. | Near-memory compute module |
| US10996959B2 (en) | 2015-01-08 | 2021-05-04 | Technion Research And Development Foundation Ltd. | Hybrid processor |
| US9547441B1 (en) * | 2015-06-23 | 2017-01-17 | Pure Storage, Inc. | Exposing a geometry of a storage device |
| US11079936B2 (en) * | 2016-03-01 | 2021-08-03 | Samsung Electronics Co., Ltd. | 3-D stacked memory with reconfigurable compute logic |
| US10180906B2 (en) * | 2016-07-26 | 2019-01-15 | Samsung Electronics Co., Ltd. | HBM with in-memory cache manager |
| US10175980B2 (en) | 2016-10-27 | 2019-01-08 | Google Llc | Neural network compute tile |
| US10242728B2 (en) | 2016-10-27 | 2019-03-26 | Samsung Electronics Co., Ltd. | DPU architecture |
| US9922696B1 (en) * | 2016-10-28 | 2018-03-20 | Samsung Electronics Co., Ltd. | Circuits and micro-architecture for a DRAM-based processing unit |
| FI3812900T3 (fi) | 2016-12-31 | 2024-02-09 | Intel Corp | Järjestelmät, menetelmät ja laitteet heterogeenistä laskentaa varten |
| JP6988231B2 (ja) | 2017-07-26 | 2022-01-05 | 富士通株式会社 | 情報処理装置、情報処理システム、情報処理方法及び情報処理プログラム |
| US10866900B2 (en) * | 2017-10-17 | 2020-12-15 | Samsung Electronics Co., Ltd. | ISA extension for high-bandwidth memory |
| US20190130291A1 (en) * | 2017-10-27 | 2019-05-02 | Wave Computing, Inc. | Dynamic reconfiguration with partially resident agents |
| US11373088B2 (en) | 2017-12-30 | 2022-06-28 | Intel Corporation | Machine learning accelerator mechanism |
| US10572568B2 (en) | 2018-03-28 | 2020-02-25 | Intel Corporation | Accelerator for sparse-dense matrix multiplication |
| US10664287B2 (en) | 2018-03-30 | 2020-05-26 | Intel Corporation | Systems and methods for implementing chained tile operations |
| US10691182B2 (en) * | 2019-05-20 | 2020-06-23 | Intel Corporation | Layered super-reticle computing: architectures and methods |
| US11237903B2 (en) * | 2019-06-25 | 2022-02-01 | Intel Corporation | Technologies for providing ECC pre-provisioning and handling for cross-point memory and compute operations |
| US12248762B2 (en) * | 2020-01-07 | 2025-03-11 | SK Hynix Inc. | Processing-in-memory (PIM) devices |
-
2020
- 2020-04-27 US US16/859,829 patent/US11226816B2/en active Active
- 2020-08-18 KR KR1020200103072A patent/KR102653014B1/ko active Active
- 2020-11-04 TW TW109138406A patent/TWI848184B/zh active
- 2020-11-18 JP JP2020191783A patent/JP7550614B2/ja active Active
-
2021
- 2021-12-10 US US17/548,220 patent/US11782707B2/en active Active
-
2023
- 2023-09-14 US US18/368,515 patent/US12236239B2/en active Active
-
2025
- 2025-02-21 US US19/060,087 patent/US20250190216A1/en active Pending
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