TWI848184B - 記憶體模組以及用於在記憶體內進行計算的方法 - Google Patents

記憶體模組以及用於在記憶體內進行計算的方法 Download PDF

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TWI848184B
TWI848184B TW109138406A TW109138406A TWI848184B TW I848184 B TWI848184 B TW I848184B TW 109138406 A TW109138406 A TW 109138406A TW 109138406 A TW109138406 A TW 109138406A TW I848184 B TWI848184 B TW I848184B
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operand
bricks
dram
module
brick
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TW202131190A (zh
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克里希納 特佳 馬拉迪
皇甫文沁
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南韓商三星電子股份有限公司
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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
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  • General Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Pure & Applied Mathematics (AREA)
  • Computational Mathematics (AREA)
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  • Computing Systems (AREA)
  • Human Computer Interaction (AREA)
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Databases & Information Systems (AREA)
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  • Memory System (AREA)
  • Semiconductor Memories (AREA)
  • Executing Machine-Instructions (AREA)
TW109138406A 2020-02-12 2020-11-04 記憶體模組以及用於在記憶體內進行計算的方法 TWI848184B (zh)

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US202062975577P 2020-02-12 2020-02-12
US62/975,577 2020-02-12
US16/859,829 US11226816B2 (en) 2020-02-12 2020-04-27 Systems and methods for data placement for in-memory-compute
US16/859,829 2020-04-27

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TWI848184B true TWI848184B (zh) 2024-07-11

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US20240004646A1 (en) 2024-01-04
TW202131190A (zh) 2021-08-16
US11782707B2 (en) 2023-10-10
CN113254359A (zh) 2021-08-13
KR102653014B1 (ko) 2024-04-01
JP2021128752A (ja) 2021-09-02
US12236239B2 (en) 2025-02-25
KR20210103373A (ko) 2021-08-23
US20210247978A1 (en) 2021-08-12
US20220171620A1 (en) 2022-06-02
JP7550614B2 (ja) 2024-09-13
US20250190216A1 (en) 2025-06-12

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