JP2021110028A - Electroplating device of semiconductor - Google Patents

Abstract

To provide an electroplating device of a semiconductor.SOLUTION: An electroplating device of a semiconductor includes a lower bottom plate. An upper bottom plate is installed on the lower side of the lower bottom plate. When a second push plate presses a second spring and a third spring, a workpiece storage box oscillates vertically to bring a workpiece into sufficient contact with a plating solution. Engagement between a worm gear and a worm lifts an electroplating pool. Engagement between the worm gear and the worm also provides a self-lock effect which can prevent falling of the electroplating pool. In addition, the electroplating device is easy to operate, and its manufacturing cost is low. Oscillating the workpiece storage box vertically allows sufficient contact between the plating solution and the workpiece when performing electroplating, that is, effects of the electroplating can be guaranteed.SELECTED DRAWING: Figure 1

Description

The present invention takes up the field of semiconductor manufacturing technology, and specifically is a semiconductor electroplating apparatus.

In the manufacture of semiconductors, it is necessary to use an electroplating device to perform tin plating on the semiconductor lead wires. The conventional semiconductor electroplating device is divided into a rack system and a barrel system. The barrel system includes a roller and a copper rod placed horizontally in the roller, and the copper rod is energized to act as a cathode for electroplating. , Barrel plating is suitable for small items that are difficult to hang or cannot be hung due to factors such as shape and size, and it is possible to save labor and improve efficiency compared to rack type. It cannot be completely contacted with the lead wire, and the bubbles remaining in the plating solution cannot be treated, which affects the plating efficiency and effect, and increases the manufacturing cost.

Chinese Patent Application Publication No. 104651914

The present application provides a semiconductor electroplating apparatus, and an object of the present application is to eliminate the above-mentioned drawbacks in the prior art.

The invention of the present application is realized through the following technical plan.

The semiconductor electroplating apparatus of the present invention includes a lower bottom plate, an upper bottom plate is installed on the lower side of the lower bottom plate, and the lower bottom plate and the upper bottom plate are fixedly connected by four first support rods. An electroplating pool for accommodating the plating solution is installed on the upper side of the upper bottom plate, and vibrators for vibrating the plating solution are symmetrically and fixedly installed on the left and right inner walls of the electroplating pool. A discharge needle for discharging the plating solution is fixedly installed on the lower inner wall of the electroplating pool, and a lifting device for lifting the electroplating pool is installed between the electroplating pool and the lower bottom plate. The lifting device includes an auxiliary block fixedly installed on the lower bottom plate so as to be symmetrical in the front-rear and left-right directions, a first guide groove is formed on the upper wall of the auxiliary block, and the auxiliary block penetrates the front and back. The second guide groove is formed, and a second support rod slidably connected to the first guide groove is fixedly installed on the outer wall below the electroplating pool, and the lower wall of the second support rod is fixedly installed. The third support rod is fixedly installed so as to be symmetrical, and the pin shaft is fixedly installed between the third support rods on both sides, and the second guide rod is installed in the second guide groove. A conrod is installed, a third guide groove is formed in the first conrod, the pin shaft is slidably installed in the third guide groove, and a support plate is provided between the front and rear auxiliary blocks. It is fixedly installed, and the first transmission shaft extending in the left-right direction is rotatably installed on the support plates on both sides so as to be symmetrical in the front-rear direction, and the end of the first transmission shaft is the first conrod. A transmission device is fixedly installed at the end away from the auxiliary block, and a transmission device capable of rotating the first conrod is installed between the first transmission shafts on both sides.

Based on the above solution, the transmission device includes a worm gear fixedly installed on the first transmission shaft, and a worm meshing with the worm gears on both sides is installed between the worm gears on both sides of the worm. A first motor is mounted on the lower wall, and the first motor is mounted on the upper bottom plate.

Based on the above solution, a storage box for accommodating semiconductors is installed under the lower bottom plate, and the outer wall and the inner wall of the lower part of the storage box are communicated by an entrance to the left and right inner walls of the storage box. The four hanging holes are installed so as to be symmetrical in the front-rear and left-right directions, and a fourth guide groove for inserting a semiconductor into the storage box is installed between the inner wall and the outer wall on the left side of the storage box. A partition plate is installed in the four guide grooves, the fifth guide groove is formed symmetrically on the upper and lower walls of the fourth guide groove, and the first rotation is performed between the fifth guide grooves on both sides. The shaft is rotatably installed, the first rotating shaft is fixedly installed on the partition plate, an auxiliary space is installed in the partition plate, and the partition plate is installed to the left in the auxiliary space. A second rotating shaft extending to the outside of the box is rotatably installed, a sixth guide groove is formed in the second rotating shaft located in the auxiliary space, and a hook is formed in the sixth guide groove. The hook pin is slidably installed, the hook pin and the sixth guide groove are connected by a first spring, and the seventh guide slidably connected to the hook pin on the rear wall of the fourth guide groove. A groove is installed, a first handle is fixedly installed at the left end of the second rotation shaft, and a hanging device for suspending the storage box is installed above the storage box.

Based on the above solution, the suspending device includes a first auxiliary plate, and a second auxiliary plate extending upward is fixedly installed on the upper wall of the first auxiliary plate, and the first auxiliary plate of the first auxiliary plate is fixedly installed. The second transmission shaft is installed symmetrically and rotatably at the ends of the left and right parts, pulleys are fixedly installed at the front ends of the second transmission shaft, and the pulleys on both sides are provided by belts. It is movably connected, the belt is mounted so as to have the shape of number 8, the second handle is slidably installed on the left pulley, and the front wall of the first auxiliary plate has a hooking groove. The second connecting rods that are formed and correspond to the positions and numbers of the hanging holes are symmetrically and fixedly installed on the second transmission shafts on both sides, and the third connecting rods are installed in the hanging holes. The third connecting rod is fixedly installed on the second connecting rod, and a vibrating device that can vibrate the storage box up and down is installed on the upper side of the first auxiliary plate.

Based on the above solution, the vibrating device includes a guide block that covers the second auxiliary plate, and the guide block is slidable with respect to the second auxiliary plate and is located on the upper part of the second auxiliary plate. A first push plate is fixedly installed at the end, and an eighth guide groove and a ninth guide groove are formed in this order from the inside to the outside in the first push plate, and the eighth guide groove is positioned. The ninth guide groove is also symmetrical in position, the second push plate is installed on the upper side of the first push plate, and the tenth guide groove is symmetrical on the second push plate. The first guide rod extending downward is symmetrically and fixedly installed on the lower wall of the second push plate so as to be symmetrical, and the first guide rod is downwardly installed on the first guide rod. A position limiting block is fixedly installed at the lower end of the lower end of the first guide rod, and a second guide rod extending upward is symmetrically installed on the upper wall of the guide block. The second guide rod penetrates the ninth guide groove, and the tenth guide groove is fixedly installed on the lower wall of the lower bottom plate so as to be fixedly installed. The lower wall of the plate and the upper wall of the first push plate are connected by a second spring, the lower wall of the first push plate and the upper wall of the position limiting block are connected by a third spring, and the second The guide rod is covered by the second spring, the first guide rod is covered by the third spring, the second motor is mounted on the lower wall of the lower bottom plate, and the third is on the front side of the second motor. A transmission shaft is attached, a disk is fixedly installed on the third transmission shaft, a fixing pin is fixedly installed on the front wall of the disk, and the fixing pin and the upper wall of the second push plate are attached to each other. It is connected via a hinge by a fourth conrod.

In the present invention, by pressing the second spring and the third spring with the second push plate, the storage box vibrates up and down, the work is sufficiently brought into contact with the plating solution, and electroplating is performed by the engagement of the worm gear and the worm. Since the pool is raised and the meshing of the worm gear and the worm has a self-locking effect, it is possible to prevent the electroplating pool from falling. By vibrating, the plating solution can be sufficiently brought into contact with the work when electroplating, that is, the effect of electroplating can be guaranteed.

In order to explain the present invention in detail with reference to FIGS. 1 to 7 below and to explain the present invention in a convenient manner, the following directions are defined as follows: FIG. The left-right front-back direction and the up-down, left-right front-back direction of the self-projection relationship in FIG. 1 are the same.

FIG. 1 is a schematic front view of the present invention. FIG. 2 is a schematic configuration diagram of AA in FIG. FIG. 3 is a schematic configuration diagram of BB in FIG. FIG. 4 is a schematic configuration diagram of C in FIG. FIG. 5 is a schematic configuration diagram of D in FIG. FIG. 6 is a schematic configuration diagram of E in FIG. FIG. 7 is a schematic diagram of the left side configuration of the portion of FIG.

With reference to FIGS. 1 to 7, the semiconductor electroplating apparatus of the present invention includes a lower bottom plate 10, and an upper bottom plate 54 is installed under the lower bottom plate 10, and the lower bottom plate 10 and the upper bottom plate 54 Are fixedly connected by four first support rods 40, an electroplating pool 44 for accommodating the plating solution is installed on the upper side of the upper bottom plate 54, and the plating solution is applied to the left and right inner walls of the electroplating pool 44. The vibrating vibrator 43 is installed symmetrically and fixedly, and a discharge needle 45 for discharging the plating solution is fixedly installed on the lower inner wall of the electroplating pool 44, and the electroplating pool 44 is fixedly installed. A lifting device 68 for lifting the electroplating pool 44 is installed between the lower bottom plate 10 and the lower bottom plate 10, and the lifting device 68 is an auxiliary block fixedly installed on the lower bottom plate 10 so as to be symmetrical in the front-rear and left-right directions. A first guide groove 55 is formed on the upper wall of the auxiliary block 47, and a second guide groove 48 penetrating the front and rear is formed on the auxiliary block 47, and the outer wall below the electroplating pool 44 is formed. A second support rod 46 slidably connected to the first guide groove 55 is fixedly installed, and the third support rod 56 is symmetrically installed on the lower wall of the second support rod 46. It is fixedly installed, a pin shaft 57 is fixedly installed between the third support rods 56 on both sides, a first conrod 59 is installed in the second guide groove 48, and the first conrod is installed. A third guide groove 58 is formed in 59, the pin shaft 57 is slidably installed in the third guide groove 58, and a support plate 49 is fixedly installed between the front and rear auxiliary blocks 47. The first transmission shaft 52 extending in the left-right direction is rotatably installed on the support plates 49 on both sides so as to be symmetrical in the front-rear direction, and the end of the first transmission shaft 52 is the first conrod 59. A transmission device 69 is fixedly installed at the end of the auxiliary block 47 away from the auxiliary block 47, and a transmission device 69 capable of rotating the first conrod 59 is installed between the first transmission shafts 52 on both sides.
In order to move the electroplating pool 44 up and down, the first transmission shaft 52 is rotated to rotate the first connecting rod 59, and the first connecting rod 59 is connected to the pin shaft 57 and the third guide groove 58. The second support rod 46 is slid up and down along the first guide groove 55 by the slidable connection of the second support rod 46, and the electroplating pool 44 is moved up and down by the up and down slide of the second support rod 46.

The transmission device 69 includes a worm gear 51 fixedly installed on the first transmission shaft 52, and a worm 50 meshing with the worm gears 51 on both sides is installed between the worm gears 51 on both sides of the worm 50. A first motor 53 is mounted on the lower wall, and the first motor 53 is mounted on the upper bottom plate 54.
The worm 50 is rotated by the first motor 53, and the first transmission shafts 52 on both sides are synchronously rotated by meshing with the worm gears 51 on both sides, so that the transmission between the worm 50 and the worm gear 51 has a self-locking effect. Therefore, when the first motor 53 encounters a sudden power failure, the electroplating pool 44 does not fall.

A storage box 32 for accommodating semiconductors is installed on the lower side of the lower bottom plate 10, an outer wall and an inner wall of the lower part of the storage box 32 are communicated with each other by an inlet 42, and four on the left and right inner walls of the storage box 32. The two hanging holes 33 are installed so as to be symmetrical in the front-rear and left-right directions, and a fourth guide groove 35 for inserting a semiconductor into the storage box 32 is installed between the inner wall and the outer wall on the left side of the storage box 32. A partition plate 36 is installed in the fourth guide groove 35, and the fifth guide groove 41 is formed symmetrically on the upper and lower walls of the fourth guide groove 35, and the fifth guide groove 41 on both sides thereof. A first rotating shaft 61 is rotatably installed between the first rotating shafts 61, the first rotating shaft 61 is fixedly installed on the partition plate 36, and an auxiliary space 62 is installed in the partition plate 36. A second rotating shaft 60 extending to the left to the outside of the partition plate 36 is rotatably installed in the auxiliary space 62, and the second rotating shaft 60 located in the auxiliary space 62 has a second rotation shaft 60. A six guide groove 66 is formed, a hook pin 64 is slidably installed in the sixth guide groove 66, and the hook pin 64 and the sixth guide groove 66 are connected by a first spring 63. A seventh guide groove 65 slidably connected to the hook pin 64 is installed on the rear wall of the fourth guide groove 35, and a first handle 37 is installed at the left end of the second rotating shaft 60. Is fixedly installed, and a hanging device 70 for suspending the storage box 32 is installed on the upper side of the storage box 32.

The suspension device 70 includes a first auxiliary plate 29, and a second auxiliary plate 24 extending upward is fixedly installed on the upper wall of the first auxiliary plate 29, and left and right portions of the first auxiliary plate 29. The second transmission shaft 31 is rotatably installed at the end of the second transmission shaft 31 so as to be symmetrical, and the pulley 30 is fixedly installed at the end of the front portion of the second transmission shaft 31, and the pulleys 30 on both sides are fixedly installed. The belt 23 is movably connected by a belt 23, the belt 23 is mounted so as to have the shape of the number 8, a second handle 39 is slidably installed on the left pulley 30, and the front of the first auxiliary plate 29. A hook groove 67 is formed on the wall, and the second connecting rods 38 corresponding to the positions and numbers of the suspension holes 33 are symmetrically and fixedly installed on the second transmission shafts 31 on both sides. A third connecting rod 34 is installed in the hanging hole 33, the third connecting rod 34 is fixedly installed on the second connecting rod 38, and the storage box 32 is vertically placed on the upper side of the first auxiliary plate 29. A vibrating device 71 that can be vibrated is installed.
When the storage box 32 is hung, the second handle 39 is turned counterclockwise to rotate the second transmission shaft 31 on the left, and the pulley 30 and the belt 23 on both sides rotate the second transmission shaft 31 on the right. (2) The transmission shaft 31 is rotated clockwise, and the second transmission shaft 31 rotates the third control shaft 34 by the second control shaft 38 into the suspension hole 33 about the second transmission shaft 31. By hooking the second handle 39 into the hook groove 67, it is possible to prevent the storage box 32 from falling due to its own weight.

The vibrating device 71 includes a guide block 22 that covers the second auxiliary plate 24, and the guide block 22 is slidable with respect to the second auxiliary plate 24, and is an upper end of the second auxiliary plate 24. A first push plate 19 is fixedly installed in the first push plate 19, and an eighth guide groove 27 and a ninth guide groove 28 are formed in the first push plate 19 in order from the inside to the outside, and the eighth guide groove 27 is also formed. Is symmetrical in position, and the ninth guide groove 28 is also symmetrical in position. A second push plate 15 is installed above the first push plate 19, and the second push plate 15 is provided with a second push plate 15. The tenth guide groove 16 is formed so as to be symmetrical, and the first guide rod 18 extending downward is installed on the lower wall of the second push plate 15 so as to be symmetrical and fixed. The first guide rod 18 passes downward through the eighth guide groove 27, and a position limiting block 21 is fixedly installed at the lower end of the lower end of the first guide rod 18 and above the guide block 22. The second guide rod 11 extending upward is installed symmetrically and fixedly on the wall, the second guide rod 11 penetrates the ninth guide groove 28, and the tenth guide The groove 16 is fixedly installed on the lower wall of the lower bottom plate 10, and the lower wall of the second push plate 15 and the upper wall of the first push plate 19 are connected by a second spring 17, and the first push. The lower wall of the plate 19 and the upper wall of the position limiting block 21 are connected by the third spring 20, the second guide rod 11 is covered by the second spring 17, and the first guide rod 18 is the third. Covered by a spring 20, a second motor 25 is mounted on the lower wall of the lower bottom plate 10, a third transmission shaft 26 is mounted on the front side of the second motor 25, and a disk is mounted on the third transmission shaft 26. 13 is fixedly installed, a fixing pin 12 is fixedly installed on the front wall of the disk 13, and the fixing pin 12 and the upper wall of the second push plate 15 are connected to each other by a fourth conrod 14 via a hinge. Connected,
When the second motor 25 operates to rotate the disk 13, the disk 13 moves the second push plate 15 up and down by the fourth connecting rod 14, and the second push plate 15 descends, the first By pressing the two springs 17, the first push plate 19 is lowered, the first push plate 19 lowers the storage box 32 by the second auxiliary plate 24 and the first auxiliary plate 29, and the first push plate 19 is lowered. When the second push plate 15 rises, the position limiting block 21 presses the third spring 20, so that the first push plate 19 rises and the second spring 17 and the third spring 20 are in a compressed state. Since inertia acts when released from the connecting rod, the first push plate 19 vibrates up and down, and further causes the storage box 32 to vibrate up and down.

In the initial state, an appropriate amount of plating liquid is put into the electroplating pool 44, the first connecting rod 59 is tilted, the second support rod 46 is accommodated in the first guide groove 55, and the hook is hooked. The pin 64 is caught in the seventh guide groove 65.

Before electroplating, the first handle 37 is turned to separate the hook pin 64 from the seventh guide groove 65, and after the first handle 37 is pulled to open the partition plate 36, the semiconductor The work is put into the storage box 32, the partition plate 36 is closed, and the first handle 37 is rotated in the reverse direction, so that the hook pin 64 is hooked again into the seventh guide groove 65. Therefore, the work can be prevented from falling from the storage box 32, the first motor 53 is operated, the worm 50 is rotated, and the worm 50 operates the lifting device 68 by the transmission device 69. Then, the electroplating pool 44 containing the plating liquid is raised by the lifting device 68, and the storage box 32 is completely immersed in the plating liquid, and the plating liquid enters the storage box 32 from the inlet 42.

At the time of electroplating, the vibrator 43 operates, the plating solution in the electroplating pool 44 is shaken, the discharge needle 45 discharges to perform electroplating, and the second motor 25 performs electroplating. The disk 13 is operated to rotate the disk 13, and the disk 13 operates the vibrating device 71 by the fixing pin 12 and the fourth conrod 14, so that the storage box 32 is a plating solution in the electroplating pool 44. It vibrates up and down inside, which allows the plating solution to come into sufficient contact with the semiconductor, ensuring the effectiveness of electroplating.

The above examples are merely for explaining the technical principle and features of the present invention, and are intended to allow engineers in the field to understand and implement the present invention, and are not intended to limit the present invention. However, any modifications, equivalent substitutions and improvements made under the significance and principles of the present invention should be included in the scope of protection of the present invention.

The present invention takes up the field of semiconductor manufacturing technology, and specifically is a semiconductor electroplating apparatus.

In the manufacture of semiconductors, it is necessary to use an electroplating device to perform tin plating on the semiconductor lead wires. The conventional semiconductor electroplating device is divided into a rack system and a barrel system. The barrel system includes a roller and a copper rod placed horizontally in the roller, and the copper rod is energized to act as a cathode for electroplating. , Barrel plating is suitable for small items that are difficult to hang or cannot be hung due to factors such as shape and size, and it is possible to save labor and improve efficiency compared to rack type. It cannot be completely contacted with the lead wire, and the bubbles remaining in the plating solution cannot be treated, which affects the plating efficiency and effect, and increases the manufacturing cost.

Chinese Patent Application Publication No. 104651914

The present application provides a semiconductor electroplating apparatus, and an object of the present application is to eliminate the above-mentioned drawbacks in the prior art.

The invention of the present application is realized through the following technical plan.

The semiconductor electroplating apparatus of the present invention includes a lower bottom plate, an upper bottom plate is installed on the lower side of the lower bottom plate, and the lower bottom plate and the upper bottom plate are fixedly connected by four first support rods. An electroplating pool for accommodating the plating solution is installed on the upper side of the upper bottom plate, and vibrators for vibrating the plating solution are symmetrically and fixedly installed on the left and right inner walls of the electroplating pool. A discharge needle for discharging the plating solution is fixedly installed on the lower inner wall of the electroplating pool, and a lifting device for lifting the electroplating pool is installed between the electroplating pool and the upper bottom plate. The lifting device includes an auxiliary block fixedly installed on the lower bottom plate so as to be symmetrical in the front-rear and left-right directions, a first guide groove is formed on the upper wall of the auxiliary block, and the auxiliary block penetrates the front and back. The second guide groove is formed, and a second support rod slidably connected to the first guide groove is fixedly installed on the outer wall below the electroplating pool, and the lower wall of the second support rod is fixedly installed. The third support rod is fixedly installed so as to be symmetrical, and the pin shaft is fixedly installed between the third support rods on both sides, and the second guide rod is installed in the second guide groove. A conrod is installed, a third guide groove is formed in the first conrod, the pin shaft is slidably installed in the third guide groove, and a support plate is provided between the front and rear auxiliary blocks. It is fixedly installed, and the first transmission shaft extending in the left-right direction is rotatably installed on the support plates on both sides so as to be symmetrical in the front-rear direction, and the end of the first transmission shaft is the first conrod. A transmission device is fixedly installed at the end away from the auxiliary block, and a transmission device capable of rotating the first conrod is installed between the first transmission shafts on both sides.

Based on the above solution, the transmission device includes a worm gear fixedly installed on the first transmission shaft, and a worm meshing with the worm gears on both sides is installed between the worm gears on both sides of the worm. A first motor is mounted on the lower wall, and the first motor is mounted on the upper bottom plate.

Based on the above solution, a storage box for accommodating semiconductors is installed under the lower bottom plate, and the outer wall and the inner wall of the lower part of the storage box are communicated by an entrance to the left and right inner walls of the storage box. The four hanging holes are installed so as to be symmetrical in the front-rear and left-right directions, and a fourth guide groove for inserting a semiconductor into the storage box is installed between the inner wall and the outer wall on the left side of the storage box. A partition plate is installed in the four guide grooves, the fifth guide groove is formed symmetrically on the upper and lower walls of the fourth guide groove, and the first rotation is performed between the fifth guide grooves on both sides. The shaft is rotatably installed, the first rotating shaft is fixedly installed on the partition plate, an auxiliary space is installed in the partition plate, and the partition plate is installed to the left in the auxiliary space. A second rotating shaft extending to the outside of the box is rotatably installed, a sixth guide groove is formed in the second rotating shaft located in the auxiliary space, and a hook is formed in the sixth guide groove. The hook pin is slidably installed, the hook pin and the sixth guide groove are connected by a first spring, and the seventh guide slidably connected to the hook pin on the rear wall of the fourth guide groove. A groove is installed, a first handle is fixedly installed at the left end of the second rotation shaft, and a hanging device for suspending the storage box is installed above the storage box.

Based on the above solution, the suspending device includes a first auxiliary plate, and a second auxiliary plate extending upward is fixedly installed on the upper wall of the first auxiliary plate, and the first auxiliary plate of the first auxiliary plate is fixedly installed. The second transmission shaft is installed symmetrically and rotatably at the ends of the left and right parts, pulleys are fixedly installed at the front ends of the second transmission shaft, and the pulleys on both sides are provided by belts. It is movably connected, the belt is mounted so as to have the shape of number 8, the second handle is slidably installed on the left pulley, and the front wall of the first auxiliary plate has a hooking groove. The second connecting rods that are formed and correspond to the positions and numbers of the hanging holes are symmetrically and fixedly installed on the second transmission shafts on both sides, and the third connecting rods are installed in the hanging holes. The third connecting rod is fixedly installed on the second connecting rod, and a vibrating device that can vibrate the storage box up and down is installed on the upper side of the first auxiliary plate.

Based on the above solution, the vibrating device includes a guide block that covers the second auxiliary plate, and the guide block is slidable with respect to the second auxiliary plate and is located on the upper part of the second auxiliary plate. A first push plate is fixedly installed at the end, and an eighth guide groove and a ninth guide groove are formed in this order from the inside to the outside in the first push plate, and the eighth guide groove is positioned. The ninth guide groove is also symmetrical in position, the second push plate is installed on the upper side of the first push plate, and the tenth guide groove is symmetrical on the second push plate. The first guide rod extending downward is symmetrically and fixedly installed on the lower wall of the second push plate so as to be symmetrical, and the first guide rod is downwardly installed on the first guide rod. A position limiting block is fixedly installed at the lower end of the lower end of the first guide rod, and a second guide rod extending upward is symmetrically installed on the upper wall of the guide block. The second guide rod penetrates the ninth guide groove, and the tenth guide groove is fixedly installed on the lower wall of the lower bottom plate so as to be fixedly installed. The lower wall of the plate and the upper wall of the first push plate are connected by a second spring, the lower wall of the first push plate and the upper wall of the position limiting block are connected by a third spring, and the second The guide rod is covered by the second spring, the first guide rod is covered by the third spring, the second motor is mounted on the lower wall of the lower bottom plate, and the third is on the front side of the second motor. A transmission shaft is attached, a disk is fixedly installed on the third transmission shaft, a fixing pin is fixedly installed on the front wall of the disk, and the fixing pin and the upper wall of the second push plate are attached to each other. It is connected via a hinge by a fourth conrod.

In the present invention, by pressing the second spring and the third spring with the second push plate, the storage box vibrates up and down, the work is sufficiently brought into contact with the plating solution, and electroplating is performed by the engagement of the worm gear and the worm. Since the pool is raised and the meshing of the worm gear and the worm has a self-locking effect, it is possible to prevent the electroplating pool from falling. By vibrating, the plating solution can be sufficiently brought into contact with the work when electroplating, that is, the effect of electroplating can be guaranteed.

In order to explain the present invention in detail with reference to FIGS. 1 to 7 below and to explain the present invention in a convenient manner, the following directions are defined as follows: FIG. The left-right front-back direction and the up-down, left-right front-back direction of the self-projection relationship in FIG. 1 are the same.

FIG. 1 is a schematic front view of the present invention. FIG. 2 is a schematic configuration diagram of AA in FIG. FIG. 3 is a schematic configuration diagram of BB in FIG. FIG. 4 is a schematic configuration diagram of C in FIG. FIG. 5 is a schematic configuration diagram of D in FIG. FIG. 6 is a schematic configuration diagram of E in FIG. FIG. 7 is a schematic diagram of the left side configuration of the portion of FIG.

With reference to FIGS. 1 to 7, the semiconductor electroplating apparatus of the present invention includes a lower bottom plate 10, and an upper bottom plate 54 is installed under the lower bottom plate 10, and the lower bottom plate 10 and the upper bottom plate 54 Are fixedly connected by four first support rods 40, an electroplating pool 44 for accommodating the plating solution is installed on the upper side of the upper bottom plate 54, and the plating solution is applied to the left and right inner walls of the electroplating pool 44. The vibrating vibrator 43 is installed symmetrically and fixedly, and a discharge needle 45 for discharging the plating solution is fixedly installed on the lower inner wall of the electroplating pool 44, and the electroplating pool 44 is fixedly installed. A lifting device 68 for lifting the electroplating pool 44 is installed between the upper bottom plate 54 and the upper bottom plate 54, and the lifting device 68 is an auxiliary block fixedly installed on the lower bottom plate 10 so as to be symmetrical in the front-rear and left-right directions. A first guide groove 55 is formed on the upper wall of the auxiliary block 47, and a second guide groove 48 penetrating the front and rear is formed on the auxiliary block 47, and the outer wall below the electroplating pool 44 is formed. A second support rod 46 slidably connected to the first guide groove 55 is fixedly installed, and the third support rod 56 is symmetrically installed on the lower wall of the second support rod 46. It is fixedly installed, a pin shaft 57 is fixedly installed between the third support rods 56 on both sides, a first conrod 59 is installed in the second guide groove 48, and the first conrod is installed. A third guide groove 58 is formed in 59, the pin shaft 57 is slidably installed in the third guide groove 58, and a support plate 49 is fixedly installed between the front and rear auxiliary blocks 47. The first transmission shaft 52 extending in the left-right direction is rotatably installed on the support plates 49 on both sides so as to be symmetrical in the front-rear direction, and the end of the first transmission shaft 52 is the first conrod 59. A transmission device 69 is fixedly installed at the end of the auxiliary block 47 away from the auxiliary block 47, and a transmission device 69 capable of rotating the first conrod 59 is installed between the first transmission shafts 52 on both sides.
In order to move the electroplating pool 44 up and down, the first transmission shaft 52 is rotated to rotate the first connecting rod 59, and the first connecting rod 59 is connected to the pin shaft 57 and the third guide groove 58. The second support rod 46 is slid up and down along the first guide groove 55 by the slidable connection of the second support rod 46, and the electroplating pool 44 is moved up and down by the up and down slide of the second support rod 46.

The transmission device 69 includes a worm gear 51 fixedly installed on the first transmission shaft 52, and a worm 50 meshing with the worm gears 51 on both sides is installed between the worm gears 51 on both sides of the worm 50. A first motor 53 is mounted on the lower wall, and the first motor 53 is mounted on the upper bottom plate 54.
The worm 50 is rotated by the first motor 53, and the first transmission shafts 52 on both sides are synchronously rotated by meshing with the worm gears 51 on both sides, so that the transmission between the worm 50 and the worm gear 51 has a self-locking effect. Therefore, when the first motor 53 encounters a sudden power failure, the electroplating pool 44 does not fall.

A storage box 32 for accommodating semiconductors is installed on the lower side of the lower bottom plate 10, an outer wall and an inner wall of the lower part of the storage box 32 are communicated with each other by an inlet 42, and four on the left and right inner walls of the storage box 32. The two hanging holes 33 are installed so as to be symmetrical in the front-rear and left-right directions, and a fourth guide groove 35 for inserting a semiconductor into the storage box 32 is installed between the inner wall and the outer wall on the left side of the storage box 32. A partition plate 36 is installed in the fourth guide groove 35, and the fifth guide groove 41 is formed symmetrically on the upper and lower walls of the fourth guide groove 35, and the fifth guide groove 41 on both sides thereof. A first rotating shaft 61 is rotatably installed between the first rotating shafts 61, the first rotating shaft 61 is fixedly installed on the partition plate 36, and an auxiliary space 62 is installed in the partition plate 36. A second rotating shaft 60 extending to the left to the outside of the partition plate 36 is rotatably installed in the auxiliary space 62, and the second rotating shaft 60 located in the auxiliary space 62 has a second rotation shaft 60. A six guide groove 66 is formed, a hook pin 64 is slidably installed in the sixth guide groove 66, and the hook pin 64 and the sixth guide groove 66 are connected by a first spring 63. A seventh guide groove 65 slidably connected to the hook pin 64 is installed on the rear wall of the fourth guide groove 35, and a first handle 37 is installed at the left end of the second rotating shaft 60. Is fixedly installed, and a hanging device 70 for suspending the storage box 32 is installed on the upper side of the storage box 32.

The suspension device 70 includes a first auxiliary plate 29, and a second auxiliary plate 24 extending upward is fixedly installed on the upper wall of the first auxiliary plate 29, and left and right portions of the first auxiliary plate 29. The second transmission shaft 31 is rotatably installed at the end of the second transmission shaft 31 so as to be symmetrical, and the pulley 30 is fixedly installed at the end of the front portion of the second transmission shaft 31, and the pulleys 30 on both sides are fixedly installed. The belt 23 is movably connected by a belt 23, the belt 23 is mounted so as to have the shape of the number 8, a second handle 39 is slidably installed on the left pulley 30, and the front of the first auxiliary plate 29. A hook groove 67 is formed on the wall, and the second connecting rods 38 corresponding to the positions and numbers of the suspension holes 33 are symmetrically and fixedly installed on the second transmission shafts 31 on both sides. A third connecting rod 34 is installed in the hanging hole 33, the third connecting rod 34 is fixedly installed on the second connecting rod 38, and the storage box 32 is vertically placed on the upper side of the first auxiliary plate 29. A vibrating device 71 that can be vibrated is installed.
When the storage box 32 is hung, the second handle 39 is turned counterclockwise to rotate the second transmission shaft 31 on the left, and the pulley 30 and the belt 23 on both sides rotate the second transmission shaft 31 on the right. (2) The transmission shaft 31 is rotated clockwise, and the second transmission shaft 31 rotates the third control shaft 34 by the second control shaft 38 into the suspension hole 33 about the second transmission shaft 31. By hooking the second handle 39 into the hook groove 67, it is possible to prevent the storage box 32 from falling due to its own weight.

The vibrating device 71 includes a guide block 22 that covers the second auxiliary plate 24, and the guide block 22 is slidable with respect to the second auxiliary plate 24, and is an upper end of the second auxiliary plate 24. A first push plate 19 is fixedly installed in the first push plate 19, and an eighth guide groove 27 and a ninth guide groove 28 are formed in the first push plate 19 in order from the inside to the outside, and the eighth guide groove 27 is also formed. Is symmetrical in position, and the ninth guide groove 28 is also symmetrical in position. A second push plate 15 is installed above the first push plate 19, and the second push plate 15 is provided with a second push plate 15. The tenth guide groove 16 is formed so as to be symmetrical, and the first guide rod 18 extending downward is installed on the lower wall of the second push plate 15 so as to be symmetrical and fixed. The first guide rod 18 passes downward through the eighth guide groove 27, and a position limiting block 21 is fixedly installed at the lower end of the lower end of the first guide rod 18 and above the guide block 22. The second guide rod 11 extending upward is installed symmetrically and fixedly on the wall, the second guide rod 11 penetrates the ninth guide groove 28, and the tenth guide The groove 16 is fixedly installed on the lower wall of the lower bottom plate 10, and the lower wall of the second push plate 15 and the upper wall of the first push plate 19 are connected by a second spring 17, and the first push. The lower wall of the plate 19 and the upper wall of the position limiting block 21 are connected by the third spring 20, the second guide rod 11 is covered by the second spring 17, and the first guide rod 18 is the third. Covered by a spring 20, a second motor 25 is mounted on the lower wall of the lower bottom plate 10, a third transmission shaft 26 is mounted on the front side of the second motor 25, and a disk is mounted on the third transmission shaft 26. 13 is fixedly installed, a fixing pin 12 is fixedly installed on the front wall of the disk 13, and the fixing pin 12 and the upper wall of the second push plate 15 are connected to each other by a fourth conrod 14 via a hinge. Connected,
When the second motor 25 operates to rotate the disk 13, the disk 13 moves the second push plate 15 up and down by the fourth connecting rod 14, and the second push plate 15 descends, the first By pressing the two springs 17, the first push plate 19 is lowered, the first push plate 19 lowers the storage box 32 by the second auxiliary plate 24 and the first auxiliary plate 29, and the first push plate 19 is lowered. When the second push plate 15 rises, the position limiting block 21 presses the third spring 20, so that the first push plate 19 rises and the second spring 17 and the third spring 20 are in a compressed state. Since inertia acts when released from the connecting rod, the first push plate 19 vibrates up and down, and further causes the storage box 32 to vibrate up and down.

In the initial state, an appropriate amount of plating liquid is put into the electroplating pool 44, the first connecting rod 59 is tilted, the second support rod 46 is accommodated in the first guide groove 55, and the hook is hooked. The pin 64 is caught in the seventh guide groove 65.

Before electroplating, the first handle 37 is turned to separate the hook pin 64 from the seventh guide groove 65, and after the first handle 37 is pulled to open the partition plate 36, the semiconductor The work is put into the storage box 32, the partition plate 36 is closed, and the first handle 37 is rotated in the reverse direction, so that the hook pin 64 is hooked again into the seventh guide groove 65. Therefore, the work can be prevented from falling from the storage box 32, the first motor 53 is operated, the worm 50 is rotated, and the worm 50 operates the lifting device 68 by the transmission device 69. Then, the electroplating pool 44 containing the plating liquid is raised by the lifting device 68, and the storage box 32 is completely immersed in the plating liquid, and the plating liquid enters the storage box 32 from the inlet 42.

At the time of electroplating, the vibrator 43 operates, the plating solution in the electroplating pool 44 is shaken, the discharge needle 45 discharges to perform electroplating, and the second motor 25 performs electroplating. The disk 13 is operated to rotate the disk 13, and the disk 13 operates the vibrating device 71 by the fixing pin 12 and the fourth conrod 14, so that the storage box 32 is a plating solution in the electroplating pool 44. It vibrates up and down inside, which allows the plating solution to come into sufficient contact with the semiconductor, ensuring the effectiveness of electroplating.

The above examples are merely for explaining the technical principle and features of the present invention, and are intended to allow engineers in the field to understand and implement the present invention, and are not intended to limit the present invention. However, any modifications, equivalent substitutions and improvements made under the significance and principles of the present invention should be included in the scope of protection of the present invention.

Claims (5)

An upper bottom plate is installed on the lower side of the lower bottom plate including the lower bottom plate, the lower bottom plate and the upper bottom plate are fixedly connected by four first support rods, and the upper side of the upper bottom plate is plated. An electroplating pool for accommodating the liquid is installed, and vibrators for vibrating the plating liquid are symmetrically and fixedly installed on the left and right inner walls of the electroplating pool, and the lower inner wall of the electroplating pool is described. A discharge needle that discharges the plating solution is fixedly installed, a lifting device that can lift the electroplating pool is installed between the electroplating pool and the lower bottom plate, and the lifting device is front and back on the lower bottom plate. The auxiliary block is fixedly installed so as to be symmetrical, a first guide groove is formed on the upper wall of the auxiliary block, and a second guide groove penetrating the front and rear is formed in the auxiliary block. A second support rod slidably connected to the first guide groove is fixedly installed on the outer wall of the lower part of the electroplating pool, and the third support rod is symmetrically installed on the lower wall of the second support rod. The pin shaft is fixedly installed between the third support rods on both sides, the first conrod is installed in the second guide groove, and the first conrod is installed so as to be fixed. A third guide groove is formed in the center, the pin shaft is slidably installed in the third guide groove, and a support plate is fixedly installed between the front and rear auxiliary blocks, and the support on both sides is provided. The first transmission shaft extending in the left-right direction is rotatably installed on the plate so as to be symmetrical in the front-rear direction, and the end of the first transmission shaft is at the end of the first control rod away from the auxiliary block. A semiconductor electroplating apparatus characterized in that a transmission device that is fixedly installed and is capable of rotating the first conrod is installed between the first transmission shafts on both sides. The transmission device includes a worm gear fixedly installed on the first transmission shaft, a worm meshing with the worm gears on both sides is installed between the worm gears on both sides, and a first motor is installed on the lower wall of the worm. The semiconductor electroplating apparatus according to claim 1, wherein the first motor is mounted on the upper bottom plate. A storage box for storing semiconductors is installed on the lower side of the lower bottom plate, the outer wall and the inner wall of the lower part of the storage box are communicated by an entrance, and four hanging holes are front and rear on the left and right inner walls of the storage box. It is installed so as to be symmetrical, and a fourth guide groove for inserting a semiconductor into the storage box is installed between the inner wall and the outer wall on the left side of the storage box, and a fourth guide groove is installed in the fourth guide groove. A partition plate is installed, the fifth guide groove is formed symmetrically on the upper and lower walls of the fourth guide groove, and the first rotation shaft is rotatably installed between the fifth guide grooves on both sides. The first rotating shaft is fixedly installed on the partition plate, an auxiliary space is installed in the partition plate, and the auxiliary space extends to the left to the outside of the partition plate. The two rotating shafts are rotatably installed, a sixth guide groove is formed in the second rotating shaft located in the auxiliary space, and a hook pin is slidably installed in the sixth guide groove. The hook pin and the sixth guide groove are connected by a first spring, and a seventh guide groove slidably connected to the hook pin is installed on the rear wall of the fourth guide groove. The first aspect of claim 1, wherein a first handle is fixedly installed at the left end of the two rotation shafts, and a suspension device for suspending the storage box is installed above the storage box. Electroplating equipment for semiconductors. The suspending device includes a first auxiliary plate, and a second auxiliary plate extending upward is fixedly installed on the upper wall of the first auxiliary plate, and a second auxiliary plate extends to the left and right ends of the first auxiliary plate. The two transmission shafts are installed symmetrically and rotatably, a pulley is fixedly installed at the front end of the second transmission shaft, and the pulleys on both sides are movably connected by a belt. The belt is mounted so as to have the shape of the number 8, a second handle is slidably installed on the left pulley, a hook groove is formed on the front wall of the first auxiliary plate, and the first on both sides. The second connecting rods corresponding to the positions and numbers of the hanging holes are symmetrically and fixedly installed on the two transmission shafts, the third connecting rod is installed in the hanging holes, and the third connecting rod is installed. The electric semiconductor according to claim 3, further comprising a vibrating device fixedly installed on the second connecting rod and capable of vibrating the storage box up and down above the first auxiliary plate. Plating device. The vibrating device includes a guide block that covers the second auxiliary plate, and the guide block is slidable with respect to the second auxiliary plate, and a first push plate is attached to an upper end of the second auxiliary plate. Is fixedly installed, and the eighth guide groove and the ninth guide groove are formed in this order from the inside to the outside on the first push plate, and the eighth guide groove is positioned symmetrically to the left and right. Nine guide grooves are also symmetrical in position, a second push plate is installed on the upper side of the first push plate, and the tenth guide groove is formed on the second push plate so as to be symmetrical. The first guide rod extending downward is symmetrically and fixedly installed on the lower wall of the second push plate, and the first guide rod passes downward through the eighth guide groove. , A position limiting block is fixedly installed at the lower end of the lower part of the first guide rod, and the second guide rod extending upward is fixedly symmetrically installed on the upper wall of the guide block. The second guide rod is installed, the second guide rod penetrates the ninth guide groove, and the tenth guide groove is fixedly installed on the lower wall of the lower bottom plate, and the lower wall of the second push plate and the first The upper wall of the one push plate is connected by the second spring, the lower wall of the first push plate and the upper wall of the position limiting block are connected by the third spring, and the second guide rod is connected to the second spring. The first guide rod is covered by the third spring, the second motor is mounted on the lower wall of the lower bottom plate, and the third transmission shaft is mounted on the front side of the second motor. A disk is fixedly installed on the third transmission shaft, a fixing pin is fixedly installed on the front wall of the disk, and the fixing pin and the upper wall of the second push plate are connected to each other via a hinge by a fourth conrod. The semiconductor electroplating apparatus according to claim 4, wherein the devices are connected to each other.

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