CN2910969Y - Electroplating apparatus for semiconductor package rear terminal frame - Google Patents
Electroplating apparatus for semiconductor package rear terminal frame Download PDFInfo
- Publication number
- CN2910969Y CN2910969Y CN 200620041460 CN200620041460U CN2910969Y CN 2910969 Y CN2910969 Y CN 2910969Y CN 200620041460 CN200620041460 CN 200620041460 CN 200620041460 U CN200620041460 U CN 200620041460U CN 2910969 Y CN2910969 Y CN 2910969Y
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- Prior art keywords
- frame
- groove
- transport tape
- technology
- electroplating
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Abstract
A semiconductor encapsulation later channel lead wire frame electroplating device comprises a frame, a driving device, a transmission belt, at least one process groove, a rowing wind device and a plurality of fixtures, any two adjacent process grooves are fixed and arranged in the frame side by side, any process groove is provided with a feeding port and a discharging port, the feeding port and the discharging port of any adjacent process grooves are in the same horizontal plane, the driving device connected with the transmission belt is arranged in the frame, the transmission belt goes through the feeding port and the discharging port of all process grooves, any process groove is connected with the liquid medicine storage groove by pipe separately, the rowing wind device is arranged in the frame and in the side direction of the process groove, the fixtures are arranged on the transmission belt separately. The utility model uses the transmission belt to transport the electroplating products to all process grooves, the electroplating product can finish the electroplating process by going through every process groove without using drive avehicle to walk and load repeatedly, so the electroplating speed is fast, the electroplating quality is high, and the environment will be protected.
Description
Technical field
The utility model relates to chemical field, relates in particular to electroplating technology, and particularly to the electroplating surface of the semi-conductive lead frame pin after the encapsulation, concrete is road lead frame electroplanting device after a kind of semiconductor packages.
Background technology
In the prior art, the plating of semiconductor lead frame pin utilizes the rack plating production line to carry out.The rack plating production line is made up of 2～3 drivings and some technology grooves, and plated item hangs on the hanger, and hanger is connected with driving, walks by driving then, plated item is moved to according to different processing requirements realize in the technology groove electroplating.Because plated item need be realized moving by the driving walking, so electroplating velocity is slow, is easy to generate environmental pollution in the process of walking, the plating precision is low, and level of automation is low, needs more manual operation.
Summary of the invention
The purpose of this utility model provides road lead frame electroplanting device after a kind of semiconductor packages, after the described this semiconductor packages road lead frame electroplanting device to solve that rack plating production line electroplating velocity in the prior art is slow, environmental pollution, the plating precision is low, level of automation is low technical problem.
Road lead frame electroplanting device is by frame after this semiconductor packages of the present utility model, drive unit, transport tape, at least one technology groove, air exhausting device and a plurality of anchor clamps constitute, wherein, any two adjacent technology grooves all are fixedly installed in the described frame side by side, be provided with an opening for feed and a discharge port on any one technology groove, opening for feed and discharge port on two adjacent arbitrarily technology grooves all are arranged in same horizontal plane, described drive unit is fixedly installed in the frame, described transport tape is connected with drive unit, transport tape from all technology grooves opening for feed and discharge port pass through, any one technology groove all has at least one liquid medicine storage tank by pipe connection separately, described air exhausting device is arranged in the frame and is arranged in the side surface direction of at least one technology groove, and described a plurality of grip separation are arranged on the transport tape.
Further, described drive unit is made of electric motor, speed change mechanism and driving wheel, and described speed change mechanism is connected with the output shaft of electric motor, and described driving wheel is connected with speed change mechanism, and described transport tape is connected with driving wheel.
Further, described anchor clamps are made of the folder spring respectively, and any one described folder spring all is connected on the described transport tape.
Further again, be provided with an installation foot on any one described folder spring, be arranged at intervals with a plurality of open holess on the described transport tape, the installation foot of any one folder spring all is arranged in the described open holes.
Further, the number of described technology groove is nine, comprises a degreasing tank, a deoxidation groove, an activated bath, three plating tanks, a neutralizing well, a rinse bath and a strip groove in described nine technology grooves.
Further, described air exhausting device is made of exhaust duct, and exhaust duct is connected with wind regime, and exhaust duct is provided with air outlet, and exhaust duct is provided with at least one blast inlet, and described blast inlet all is positioned at the side of technology groove.Described wind regime can be made of blower fan.
Concrete, frame described in the utility model, drive unit, transport tape and air exhausting device all can adopt known technology of the prior art, known solution about frame, drive unit, transport tape and air exhausting device, those skilled in the art all understands, and does not repeat them here.
Principle of work of the present utility model is: plated item is hung on the transport tape by anchor clamps, drive unit drives transport tape through each technology groove, the liquid medicine storage tank that is connected with technology groove replenishes liquid medicine in technology groove, during each technology groove of plated item process, be immersed into and carry out chemical treatment in the liquid medicine.In the liquid medicine storage tank, select different liquid medicine, can set suitable processing parameter.
The utility model and prior art contrast, and its effect is actively with tangible.The utility model utilizes transport tape that plated item is transported in each technology groove; utilize the liquid medicine storage tank to carry liquid medicine according to the processing parameter of setting to each technology groove; plated item is through behind each technology groove; can finish electroplating process; load and need not to utilize driving to walk repeatedly; therefore electroplating velocity is fast, electroplating quality is high, and the protection environment.
Description of drawings
Fig. 1 is the side structure synoptic diagram of road lead frame electroplanting device after the semiconductor packages of the present utility model.
Embodiment
As shown in Figure 1, lead frame electroplanting device in road is by frame 1 after the semiconductor packages of the present utility model, the drive unit (not shown), the transport tape (not shown), at least one technology groove 2, air exhausting device 3 and a plurality of anchor clamps (not shown) constitute, wherein, any two adjacent technology grooves 2 all are fixedly installed in the described frame 1 side by side, be provided with an opening for feed and a discharge port on any one technology groove 2, opening for feed and discharge port on two adjacent arbitrarily technology grooves 2 all are arranged in same horizontal plane, described drive unit is fixedly installed in the frame 1, described transport tape is connected with drive unit, transport tape from all technology grooves 2 opening for feed and discharge port pass through, any one technology groove 2 all is connected with at least one liquid medicine storage tank 4 by pipeline 5 separately, described air exhausting device 3 is arranged in the frame 1 and is arranged in the side surface direction of at least one technology groove 2, and described a plurality of grip separation are arranged on the transport tape.
Further, described drive unit is made of electric motor, speed change mechanism and driving wheel, and described speed change mechanism is connected with the output shaft of electric motor, and described driving wheel is connected with speed change mechanism, and described transport tape is connected with driving wheel.
Further, described anchor clamps are made of the folder spring respectively, and any one described folder spring all is connected on the described transport tape.
Further again, be provided with an installation foot on any one described folder spring, be arranged at intervals with a plurality of open holess on the described transport tape, the installation foot of any one folder spring all is arranged in the described open holes.
Further, the number of described technology groove 2 is nine, comprises a degreasing tank, a deoxidation groove, an activated bath, three plating tanks, a neutralizing well, a rinse bath and a strip groove in described nine technology grooves 2.
Further, described air exhausting device 3 is made of exhaust duct, and exhaust duct is connected with wind regime, and exhaust duct is provided with air outlet, and exhaust duct is provided with at least one blast inlet, and described blast inlet all is positioned at the side of technology groove 2.Described wind regime can be made of blower fan.
In a preferred embodiment of the present utility model, plated item hangs on the transport tape, under the effect of drive unit, realizes high speed electrodeposition according to different processing parameter settings by technology groove 2 then.The folder spring is housed on the transport tape, relies on the clamping force between folder spring and the transport tape that plated item is clamped, bring different technology grooves into wanting galvanized product to bring into according to process sequence by transport tape.Technology groove can be divided into two types of pre-treatment and aftertreatments, in each technology groove, order finishes oil removing, deoxidation, pre-treatment, plating, clean, dry up and oven dry, strip, the step that dries up, blanking then, product after electroplating is well unloaded down from anchor clamps, to anchor clamps strip → clean → dry up, enter next circulation then at last.Electroplating time can shorten to 60 seconds by 18 minutes.The plating precision improves.CPK is greater than 1.67.Have that electroplating velocity is fast, electroplating quality is high, the advantage of environmental protection.
Claims (6)
1. road lead frame electroplanting device after the semiconductor packages, by frame, drive unit, transport tape, at least one technology groove, air exhausting device and a plurality of anchor clamps constitute, it is characterized in that: any two adjacent technology grooves all are fixedly installed in the described frame side by side, be provided with an opening for feed and a discharge port on any one technology groove, opening for feed and discharge port on two adjacent arbitrarily technology grooves all are arranged in same horizontal plane, described drive unit is fixedly installed in the frame, described transport tape is connected with drive unit, transport tape from all technology grooves opening for feed and discharge port pass through, any one technology groove all has at least one liquid medicine storage tank by pipe connection separately, described air exhausting device is arranged in the frame and is arranged in the side surface direction of at least one technology groove, and described a plurality of grip separation are arranged on the transport tape.
2. road lead frame electroplanting device after the semiconductor packages as claimed in claim 1, it is characterized in that: described drive unit is made of electric motor, speed change mechanism and driving wheel, described speed change mechanism is connected with the output shaft of electric motor, described driving wheel is connected with speed change mechanism, and described transport tape is connected with driving wheel.
3. road lead frame electroplanting device after the semiconductor packages as claimed in claim 1 is characterized in that: described anchor clamps are made of the folder spring respectively, and any one described folder spring all is connected on the described transport tape.
4. road lead frame electroplanting device after the semiconductor packages as claimed in claim 3, it is characterized in that: be provided with an installation foot on any one described folder spring, be arranged at intervals with a plurality of open holess on the described transport tape, the installation foot of any one folder spring all is arranged in the described open holes.
5. road lead frame electroplanting device after the semiconductor packages as claimed in claim 1, it is characterized in that: the number of described technology groove is nine, comprises a degreasing tank, a deoxidation groove, an activated bath, three plating tanks, a neutralizing well, a rinse bath and a strip groove in described nine technology grooves.
6. road lead frame electroplanting device after the semiconductor packages as claimed in claim 1, it is characterized in that: described air exhausting device is made of exhaust duct, exhaust duct is connected with wind regime, exhaust duct is provided with air outlet, exhaust duct is provided with at least one blast inlet, and described blast inlet all is positioned at the side of technology groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620041460 CN2910969Y (en) | 2006-04-29 | 2006-04-29 | Electroplating apparatus for semiconductor package rear terminal frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620041460 CN2910969Y (en) | 2006-04-29 | 2006-04-29 | Electroplating apparatus for semiconductor package rear terminal frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2910969Y true CN2910969Y (en) | 2007-06-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620041460 Expired - Lifetime CN2910969Y (en) | 2006-04-29 | 2006-04-29 | Electroplating apparatus for semiconductor package rear terminal frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2910969Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105951135A (en) * | 2016-05-26 | 2016-09-21 | 佛山市蓝箭电子股份有限公司 | Electroplating method of semiconductor package |
| CN103060869B (en) * | 2012-12-31 | 2017-03-15 | 上海新阳半导体材料股份有限公司 | Flexible carrier band electroplanting device |
| CN110965096A (en) * | 2020-01-06 | 2020-04-07 | 台州市椒江南屯电子有限公司 | Semiconductor lead electroplating equipment |
| CN112342575A (en) * | 2020-09-10 | 2021-02-09 | 安徽龙芯微科技有限公司 | Electroplating method of semiconductor packaging piece |
| CN114645307A (en) * | 2020-12-17 | 2022-06-21 | 安徽省东科半导体有限公司 | Electroplating device for processing lead frame |
-
2006
- 2006-04-29 CN CN 200620041460 patent/CN2910969Y/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103060869B (en) * | 2012-12-31 | 2017-03-15 | 上海新阳半导体材料股份有限公司 | Flexible carrier band electroplanting device |
| CN105951135A (en) * | 2016-05-26 | 2016-09-21 | 佛山市蓝箭电子股份有限公司 | Electroplating method of semiconductor package |
| CN110965096A (en) * | 2020-01-06 | 2020-04-07 | 台州市椒江南屯电子有限公司 | Semiconductor lead electroplating equipment |
| CN110965096B (en) * | 2020-01-06 | 2020-11-27 | 泰州市昶宇电气科技有限公司 | Semiconductor lead electroplating equipment |
| CN112342575A (en) * | 2020-09-10 | 2021-02-09 | 安徽龙芯微科技有限公司 | Electroplating method of semiconductor packaging piece |
| CN114645307A (en) * | 2020-12-17 | 2022-06-21 | 安徽省东科半导体有限公司 | Electroplating device for processing lead frame |
| CN114645307B (en) * | 2020-12-17 | 2024-04-12 | 东科半导体(安徽)股份有限公司 | Electroplating device for lead frame processing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: No 1268, Wen Jie Road, Shanghai, Songjiang District: 201616 Patentee after: Xinyang Electrical Plating Apparatus Co., Ltd., Shanghai Address before: No. 328, high tide Road, Jiangqiao Industrial Zone, Shanghai, Jiading District: 201803 Patentee before: Xinyang Electrical Plating Apparatus Co., Ltd., Shanghai |
|
| C56 | Change in the name or address of the patentee |
Owner name: SHANGHAI XINYANG GALVANIZATION EQUIPMENT CO., LTD. Free format text: NEW ADDRESS: NO. 1268, WENHE ROAD, SONGJIANG DISTRICT, SHANGHAI CITY, ZIP CODE:201616 |
|
| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI XINYANG ELECTRONIC CHEMICAL CO., LTD. Free format text: FORMER OWNER: SHANGHAI XINYANG GALVANIZATION EQUIPMENT CO., LTD. Effective date: 20090403 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20090403 Address after: No 1268, Wen Jie Road, Shanghai, Songjiang District: 201616 Patentee after: Shanghai Xinyang Electronic-Chemical Co., Ltd. Address before: No 1268, Wen Jie Road, Shanghai, Songjiang District: 201616 Patentee before: Xinyang Electrical Plating Apparatus Co., Ltd., Shanghai |
|
| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI SINYANG SEMICONDUCTOR MATERIALS CO.,LTD. Free format text: FORMER OWNER: SHANGHAI SINYANG ELECTRONICS CHENMICALS CO., LTD Effective date: 20100513 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201616 NO.1268, WENHE ROAD, SONGJIANG DISTRICT, SHANGHAI CITY TO: 201616 NO.1268, WENHE ROAD, XIAOKUNSHAN TOWN, SONGJIANG DISTRICT, SHANGHAI CITY |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20100513 Address after: 201616, No. 1268, Wen Jie Road, little Kunshan Town, Shanghai, Songjiang District Patentee after: Shanghai Xinyang Semiconductor Material Co., Ltd. Address before: 201616 No. 1268, Wen Jie Road, Shanghai, Songjiang District Patentee before: Shanghai Xinyang Electronic-Chemical Co., Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20070613 |
|
| EXPY | Termination of patent right or utility model |