JP2021102016A - Game machine - Google Patents

Abstract

To provide a game machine capable of achieving various high-grade performances without any troubles by suppressing wasted power consumption.SOLUTION: A power supply board is provided with a composite circuit component in which a principal part of a converter circuit CV 12s is constituted by arranging necessary circuit components on a circuit board, and a group of circuit connection bars including a plurality of circuit connection bars connected electrically to the same spot of the principal part are aligned in one row and coated in the projected state. The plurality of circuit connection bars connected electrically to the same spot are connected respectively to one circuit pattern land having an installation width corresponding to the maximum separation distance of the plurality of circuit connection bars.SELECTED DRAWING: Figure 9

Description

The present invention relates to a gaming machine that performs a lottery process caused by a gaming operation and executes an image effect corresponding to the lottery result, and more particularly to a gaming machine having an improved power supply circuit.

A ball game machine such as a pachinko machine is equipped with a symbol start port provided on the game board, a symbol display unit for displaying a series of symbol variation modes by a plurality of display symbols, and a large winning opening for opening and closing the opening / closing plate. It is composed of. Then, when the detection switch provided at the symbol start port detects the passage of the game ball, the winning state is set, and after the game ball is paid out as the prize ball, the displayed symbol is changed for a predetermined time on the symbol display unit. After that, when the symbol is stopped in a predetermined mode such as 7, 7, 7, a big hit state is reached, and the big winning opening is repeatedly opened to generate a game state advantageous to the player.

Whether or not to generate such a game state is determined by a big hit lottery executed on the condition that the game ball wins at the symbol start opening, and the above symbol variation operation is based on the lottery result. It has become a thing. For example, when the lottery result is in the winning state, an effect operation called a reach action or the like is executed for about 20 seconds, and then special symbols are arranged. On the other hand, even in the case of a lost state, the same reach action may be executed. In this case, the player pays close attention to the transition of the production operation while strongly paying attention to the big hit state. Then, if the predetermined symbols are aligned on the stop line at the end of the symbol variation operation, the player is guaranteed to be in the big hit state.

JP-A-2018-130320 JP-A-2018-000601 Japanese Unexamined Patent Publication No. 2015-205117 Japanese Unexamined Patent Publication No. 2015-198716

In this type of gaming machine, there is a high demand for complicated and abundant productions, especially for image productions and character productions. Therefore, in addition to enriching the character production, we also want to enrich the lamp production and image production, but if only a specific game machine consumes a large amount of power, the power supply capacity of the entire game hall will be exceeded. ..

Therefore, it is necessary to enrich various effects within the range of the electric power that can be used for each gaming machine, and the applicant has also proposed various power supply circuits (Cited Documents 1 to 4). .. Specifically, in Cited Documents 1 to 4, the power supply board is made into a component, the thermistor is provided in the path to the effect control board, the DC converter is cut off all at once, and the switch circuit is turned on. Each configuration that bypasses the thermistor is disclosed.

However, further improvement of the power supply circuit is desired, and it is desired to further enhance various production controls within a limited range of power consumption. Moreover, in any case, it is necessary to avoid power supply trouble.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a gaming machine in which wasteful power consumption is further suppressed. Another object of the present invention is to provide a gaming machine that realizes various advanced effects without defects.

In order to achieve the above object, the present invention is a gaming machine that executes various control operations based on a lottery result caused by a predetermined switch signal, and has various levels of direct current based on an AC voltage received from the outside. On the power supply board that forms the voltage, a group of circuits including a plurality of circuits in which necessary circuit components are arranged on a predetermined board to form the main part of the converter circuit and electrically connected to the same part of the main part. A composite circuit component covering the main portion is provided in a state where the connection bars are aligned and protruded in a row, and each of the group of circuit connection bars is in a state of being substantially orthogonal to the composite circuit component. The plurality of circuit connection bars inserted into the power supply board and electrically connected at the same location are each connected to one circuit pattern land having a mounting width corresponding to the maximum separation distance of the plurality of circuit connection bars. It is characterized by that.

According to the above-described invention, it is possible to further suppress unnecessary power consumption and realize various advanced effects without any trouble.

It is a perspective view which shows the pachinko machine of this Example. It is a front view which shows the gaming area of the gaming machine of FIG. It is a block diagram which shows the whole circuit structure of the gaming machine of FIG. It is a block diagram which shows the structure of a power-source board. It is a circuit diagram which shows the relay circuit together with the related circuit. It is a circuit diagram which shows the full-wave rectifier circuit and the power factor improvement circuit. It is a circuit diagram which shows the voltage monitoring circuit. It is a circuit diagram which shows the DC / DC converter of a synchronous rectification type. It is a circuit diagram which shows another DC / DC converter of a synchronous rectification type. It is a circuit diagram which shows the asynchronous rectification type DC / DC converter. It is the schematic which shows the back surface side of the power-source board. It is the schematic which shows the structure of the 1st | 3rd connector of the power-source board. It is a block diagram which shows the circuit structure of the effect control part in a little detail about the game machine of FIG. It is a drawing explaining the composite chip which comprises the effect control part. It is a block diagram which shows the internal structure of the CPU circuit shown in FIG. The memory map of the built-in CPU (effect control CPU) of the CPU circuit is illustrated. It is a drawing explaining various transfer operation modes (a)-(b) and transfer operation procedure (c)-(e) about DMAC. It is a drawing explaining an index space, an index table, a virtual drawing space, and a drawing area. It is a block diagram which described the internal structure of a data transfer circuit together with the related circuit structure. It is a block diagram which described the internal structure of a display circuit together with the related circuit structure. It is a flowchart explaining a power reset operation after a CPU reset. It is a flowchart explaining the memory section initialization process which is a part of FIG. It is a flowchart explaining the main control processing and interrupt processing which are a part of FIG. It is a flowchart explaining the initialization process of CGROM which is a part of the main control process. It is a flowchart explaining a part of the processing contents about another interrupt processing. It is a flowchart explaining the control operation of the effect control CPU 63 when the preloader is not used. It is a time chart which shows an example of a memory READ operation and a memory WRITE operation. It is a drawing explaining the structure of a display list.

Hereinafter, the present invention will be described in detail based on Examples. FIG. 1 is a perspective view showing a pachinko machine GM of this embodiment. This pachinko machine GM consists of a rectangular frame-shaped wooden outer frame 1 that is detachably attached to the island structure and an inner frame 3 that is pivotally attached to the island structure via a hinge 2 fixed to the outer frame 1. It is configured. A game board 5 is detachably attached to the inner frame 3 not from the back side but from the front side, and a glass door 6 and a front plate 7 are pivotally attached to the front side thereof so as to be openable and closable. In this specification, the glass door 6 and the front plate 7 are collectively referred to as a front door member. The inner frame 3 in which the front door member (glass door 6 and front plate 7) is pivotally attached may be referred to as a game frame.

Illumination lamps such as LED lamps are arranged in a substantially C shape on the outer periphery of the glass door 6. On the other hand, a total of three speakers are arranged at the upper left and right positions and the lower side of the glass door 6. The two speakers arranged at the upper part are configured to output the sound of the left and right channels R and L, respectively, and the lower speaker is configured to output the bass sound.

An upper plate 8 for storing a game ball for launch is mounted on the front plate 7, and a lower plate 9 for storing a game ball overflowing or extracted from the upper plate 8 and a launch handle are below the inner frame 3. 10 is provided. The launch handle 10 is interlocked with the launch motor, and the game ball is launched by a striking mallet that operates according to the rotation angle of the launch handle 10.

A chance button 11 is provided on the outer peripheral surface of the upper plate 8. The chance button 11 is provided at a position where it can be operated by the player's left hand, and the player can operate the chance button 11 without releasing the right hand from the firing handle 10. The chance button 11 does not function normally, but when the game state becomes the button chance state, the built-in lamp is turned on and the operation is possible. The button chance state is a game state provided as needed.

Further, a rotary switch type volume switch VLSW is arranged below the chance button 11, and the player operates the volume switch VLSW to move from silence level (= 0) to the highest level (= 7). The speaker volume can be adjusted in 8 steps. The volume of the speaker is initially set by a setting switch (not shown) that can be operated only by the staff, and the default volume is maintained unless the player operates the volume switch VLSW. In addition, the abnormal notification sound for notifying that an abnormal situation has occurred is emitted at the maximum volume regardless of the initial set volume by the staff or the set volume of the player.

On the right side of the upper plate 8, an operation panel 12 for ball lending operation for a card-type ball lending machine is provided, a frequency display unit for displaying the remaining amount of the card with a three-digit number, and a game ball for a predetermined amount. A ball lending switch for instructing lending and a return switch for instructing the return of cards at the end of the game are provided.

As shown in FIG. 2, on the surface of the game board 5, a guide rail 13 composed of an outer rail and an inner rail made of metal is provided in an annular shape, and a central opening HO is provided substantially in the center thereof. A movable effect body (not shown) is concealed below the central opening HO, and the movable effect body is raised to be exposed at the time of the movable notice effect, so that the predetermined reliability is achieved. The notice production is realized. Here, the advance notice effect is an effect of uncertainly notifying the player that a big hit state that is advantageous to the player will be invited, and the reliability of the advance notice effect means the probability that the big hit state will be invited.

A main display device DS1 composed of a large (for example, 1280 horizontal × 1024 vertical pixels) liquid crystal color display (LCD) is arranged in the central opening HO, and a small size (for example, horizontal) is arranged on the right side of the main display device DS1. A movable sub-display device DS2 composed of a liquid crystal color display (480 × 800 pixels in height) is arranged. The main display device DS1 is a device that displays a specific symbol related to a jackpot state in a variable manner and displays a background image, various characters, and the like in an animation manner. The display device DS1 has special symbol display units Da to Dc in the central portion and a normal symbol display unit 19 in the upper right portion. Then, in the special symbol display units Da to Dc, a reach effect that is expected to invite a big hit state may be executed, and an appropriate notice effect or the like is executed in the special symbol display units Da to Dc and its surroundings.

Normally, the sub-display device DS2 displays image information in a stationary state in which the display screen is tilted at an angle that is easy for the player to see. However, at the time of the predetermined advance notice effect, the predetermined advance notice image is displayed while moving to the left side of the drawing while changing the inclination angle to an angle that is easy for the player to see.

That is, the sub-display device DS2 of the embodiment is not only a display device but also functions as a movable effect body that executes a notice effect. Here, the notice effect by the sub-display device DS2 is set with high reliability, and the player pays attention to the moving operation of the sub-display device DS2 with great expectation.

By the way, in the game area where the game ball falls and moves, the first symbol start opening 15a, the second symbol start opening 15b, the first big winning opening 16a, the second big winning opening 16b, the normal winning opening 17, and the gate 18 Are arranged. Each of these winning openings 15 to 18 has a detection switch inside, so that the passage of a game ball can be detected.

At the upper part of the first symbol start port 15a, an effect stage 14 configured to be able to win a prize in the first symbol start port 15 is arranged after the game ball entering from the introduction port IN moves in a seesaw shape or a roulette shape. There is. Then, when the game ball wins a prize in the first symbol start opening 15, the special symbol display units Da to Dc are configured to start the variable operation.

The second symbol start port 15b is configured to be opened and closed by an electric tulip having a pair of left and right opening / closing claws, and when the stop symbol after the change of the normal symbol display unit 19 displays a hit symbol, it is predetermined. The opening / closing claws are opened only for a period of time or until a predetermined number of game balls are detected.

The normal symbol display unit 19 displays a normal symbol, and when a game ball that has passed through the gate 18 is detected, the normal symbol fluctuates by a predetermined time and is extracted when the game ball passes through the gate 18. The stop symbol determined by the lottery random value is displayed and stopped.

The first large winning opening 16a is configured to have a slide board that advances and retreats in the front-rear direction, and the second large winning opening 16b is configured to have an opening / closing plate whose lower end is pivotally supported and opens forward. .. The operation of the first large winning opening 16a and the second large winning opening 16b is not particularly limited, but in this embodiment, the first large winning opening 16a corresponds to the first symbol starting opening 15a and is the second large winning opening. 16b is configured to correspond to the first symbol start port 15b.

That is, when the game ball wins the first symbol start port 15a, the fluctuation operation of the special symbol display units Da to Dc is started, and then when the predetermined jackpot symbols are aligned with the special symbol display portions Da to Dc, the first jackpot The barrel special game is started, and the slide board of the first large winning opening 16a is opened forward to facilitate the winning of the game ball.

On the other hand, as a result of the fluctuating operation started by winning the game ball to the second symbol start opening 15b, when the predetermined jackpot symbols are aligned with the special symbol display units Da to Dc, the second jackpot special game is started and the second jackpot is started. The opening / closing plate of the two major winning openings 16b is opened to facilitate the winning of the game ball. The game value of the special game (big hit state) varies depending on the jackpot symbols that are lined up, but which game value is given is determined in advance based on the lottery result according to the winning timing of the game ball. It is determined.

In a typical big hit state, the opening / closing plate closes when a predetermined time elapses after the opening / closing plate of the big winning opening 16 is opened or when a predetermined number (for example, 10) of game balls win a prize. Such an operation is continued up to, for example, 15 times, and is controlled in a state advantageous to the player. If the stop symbol after the change of the special symbol display units Da to Dc is a specific symbol among the special symbols, the privilege that the game after the end of the special game is in a high probability state (probability change state) is provided. Granted.

FIG. 3A is a block diagram showing an overall circuit configuration of the pachinko machine GM that realizes each of the above operations. Further, FIG. 3B is a circuit diagram showing a circuit configuration of a power supply monitor unit MNT arranged on the payout control board 25.

As shown in FIG. 3A, this pachinko machine GM is mainly responsible for the game control operation and the power supply board 20 that receives AC24V and outputs various DC voltages (35V, 12V, 5V) together with AC24V. The lamp effect, the sound effect, and the image effect are uniformly executed based on the control board 21, the effect interface board 22 equipped with the circuit element SND for the sound effect, and the control command CMD received from the main control board 21. A game in which the payout motor M is controlled based on the effect control board 23, the liquid crystal interface board 24 located between the effect control board 23 and the display devices DS1 and DS2, and the control command CMD'received from the main control board 21. It is mainly composed of a payout control board 25 for paying out balls and a launch control board 26 for firing game balls in response to a player's operation.

The effect interface board 22, the effect control board 23, and the liquid crystal interface board 24 are directly connected to the male connector and the female connector without going through a wiring cable. Therefore, even if the circuit configuration of each electronic circuit is complicated and sophisticated, the storage space of the entire substrate can be minimized, and the noise resistance can be improved by minimizing the connection line.

As shown in the figure, the control command CMD'output by the main control board 21 is transmitted to the payout control board 25. On the other hand, the control command CMD output from the main control board 21 is transmitted to the effect control board 23 via the effect interface board 22. Here, the control commands CMD and CMD'are both 16-bit length, but are transmitted in parallel in two times every 8-bit length.

A computer circuit including a one-chip microcomputer is mounted on the main control board 21 and the payout control board 25. Further, the effect control board 23 is equipped with a composite chip 50 having a built-in computer circuit such as a VDP circuit (Video Display Processor) 52 and a built-in CPU circuit 51. Therefore, these control boards 21, 25, 23, the circuits mounted on the effect interface board 22 and the liquid crystal interface board 24, and the operations realized by the circuits are functionally collectively referred to in the present specification. , The main control unit 21, the effect control unit 23, and the payout control unit 25. The effect control unit 23 and the payout control unit 25 serve as sub-control units for the main control unit 21.

Further, the pachinko machine GM is roughly divided into a frame-side member GM1 surrounded by a broken line in FIG. 3A and a board-side member GM2 fixed to the back surface of the game board 5. The frame-side member GM 1 includes an inner frame 3 to which a glass door 6 and a front plate 7 are pivotally attached, and a wooden outer frame 1 on the outside thereof. It is fixedly installed in. On the other hand, the board-side member GM2 is replaced in response to the model change, and a new board-side member GM2 is attached to the frame-side member GM1 instead of the original board-side member. All except the frame-side member 1 are board-side members GM2.

As shown by the broken line frame in FIG. 3A, the frame side member GM1 includes a power supply board 20, a backup power supply board 33, a payout control board 25, a launch control board 26, a frame relay board 36, and a motor /. A lamp drive board 37 and a lamp drive board 37 are included, and these circuit boards are fixed at appropriate positions in the inner frame 3. On the other hand, on the back surface of the game board 5, the main control board 21 and the effect control board 23 are fixed together with the display devices DS1 and DS2 and other circuit boards. The frame-side member GM1 and the board-side member GM2 are electrically connected by centralized connection connectors C1 to C3 which are centrally arranged at one location.

The power supply board 20 generates three types of DC voltages (35V, 12V, 5V) based on the AC voltage AC24V distributed from the game hall, and transfers each DC voltage via the centralized connector C2. Power is distributed to the face substrate 22. Further, three types of DC voltages (35V, 12V, 5V) are distributed to the payout control board 25 together with the AC voltage AC24V. The DC voltage (35V, 12V, 5V) distributed to the payout control board 25 is configured to be distributed to the main control board 21 via the centralized connector C1 together with the backup power supply BAK.

The DC 35V is used as a drive power source for the ball feed solenoid and the launch solenoid, and as a drive power source for the electromagnetic solenoid that opens and closes the electric tulip (variable winning device) and the large winning opening 16 in relation to the launching operation of the game ball. Further, DC 12V is used as a drive power supply for LED lamps and motors controlled from each control board, and a power supply voltage for a digital amplifier, while DC 5V is a one-chip microcomputer of the payout control board 25 and the main control board 21. It is used as the power supply voltage of the above and the power supply voltage of the logic element mounted on each control board. Further, the DC 5V is level-dropped by the DC / DC converter of the effect interface board 22, and then the various levels of voltage lowered are used as the power supply voltage of various computer circuits (composite chip 50, audio processor 27, etc.). used.

The backup power supply BAK is a DC 5V DC power supply for holding data in the built-in RAM of the one-chip microcomputer of the main control unit 21 and the payout control unit 25 after the power supply is cut off, and is realized by, for example, an electric double layer capacitor. In this embodiment, a dedicated backup power supply board 33 is provided, and the electric double layer capacitor arranged on the backup power supply board 33 is configured to be charged during the game operation by the DC voltage 5V received from the payout control board 25. Has been done.

On the other hand, after the power is cut off, the backup power supply BAK holds the data of the built-in RAM of the one-chip microcomputer of the main control unit 21 and the payout control unit 25, so that the main control unit 21 and the payout control unit 25 are before the power is cut off. The game operation can be restarted after the power is turned on. An electric double layer capacitor capable of holding the storage contents of the built-in RAM of each one-chip microcomputer is arranged on the backup power supply board 33 for at least several days.

By the way, in this embodiment, unlike the conventional device configuration, the power supply abnormality signal ABN indicating an abnormal decrease in the AC voltage AC24V is configured to be generated not by the power supply board 20 but by the power supply monitor unit MNT of the payout control board 25. (See FIGS. 3 and 4). As shown in FIG. 3B, the power supply monitor unit MNT includes a full-wave rectifier circuit that rectifies AC24 received from the power supply board 20, a photodiode D that receives the output of the full-wave rectifier circuit and emits light by energization, and a power supply board 20. A phototransis TR that operates ON based on the light emission of the photodiode D and an output unit that outputs an H level detection signal ABN (power supply abnormality signal) based on the ON operation of the phototransistor TR, using a DC voltage of 5 V received from the power supply. And, it is configured to have. The photodiode D and the phototransis TR form a photocoupler PH.

In the above configuration, the photocoupler PH is immediately turned on after the power is turned on, so that the power supply abnormality signal ABN becomes the normal level (H). However, after that, when the AC power supply abnormally drops for some reason (normally, the power supply is cut off), the photocoupler PH changes to the OFF state before the timing when the monitoring signals Wm5 and Wm5 shown in FIG. 7 are output. The power supply abnormality signal ABN changes to the abnormality level (L). The power supply abnormality signal ABN is configured to be transmitted to the one-chip microcomputer of the payout control board 25 and also to the one-chip microcomputer of the main control board 21 via the centralized connector C1. Therefore, each one-chip microcomputer that receives the abnormal level power supply abnormality signal ABN executes a backup process that stores necessary information in each internal RAM (see the upper right part of FIG. 7). As described above, since the information in the built-in RAM is maintained by the backup power supply BAK, the game operation before the power is cut off can be restarted after the power is turned on.

FIG. 4A is a block diagram showing the circuit configuration of the power supply board 20 in a little more detail. As shown in the figure, the power supply board 20 includes a filter circuit Fi that receives AC24V, a relay circuit RL that cuts off the energization of AC100V under the control of the energization cutoff circuit CUT, a synchronous rectification type full-wave rectifier circuit REC, and a step-up type. The power factor improvement circuit (power factor improvement component PFC, etc.), the voltage monitoring circuit WTCH, and four types of drop-type DC / DC converters are installed. Each of the four types of DC / DC converters lowers the voltage of DC35V output by the power factor improving circuit, but depending on the output voltage level (5V / 12V), 5V converters CV5m, CV5s and 12V converters CV12m, CV12s And, it is divided into.

Further, these converters are classified into asynchronous rectifying converters CV12m and CV5m and synchronous rectifying converters CV12s and CV5s based on the rectifying method. The specific circuit configuration of the DC / DC converter will be described later with reference to FIGS. 8 to 10, but in the present specification, the synchronous rectification type is a transistor (typically) whose ON / OFF control is appropriately controlled by a control signal. Specifically, it refers to a form in which an energizing operation is executed by a MOS type FET), while an asynchronous rectifying type refers to a form in which an energizing operation is executed by a rectifying diode that is not ON / OFF controlled.

As shown in FIG. 3A, various voltages are distributed from the power supply board 20 to the payout control board 25 and the effect interface board 22, and FIG. 4A shows the first connector Main and the AC connector AC. It is shown that the power supply board 20 and the payout control board 25 are connected via the above, and that the power supply board 20 and the effect interface board 22 are connected via the second connector Sub. There is. Further, it is shown that DC12V is directly supplied to the effect motor and the LED lamp arranged on the front door member such as the glass door 6 and the front plate 7 via the third connector Aux.

Corresponding to this configuration, the blue LED and the red LED indicating that normal energization is realized via the first connector Main and the second connector Sub are on the surface side of the power supply board 20 as energization notification lamps. Three of each are arranged on the edge of the LED (see FIG. 4 (b)). Specifically, the power supply board 20 is arranged on the back side, and the payout control board 25 is placed on top of the power supply board 20, but the lighting state of the blue LED and the red LED can be confirmed without removing the payout control board 25. , An energization notification lamp is arranged at the edge of the power supply board 20 on the surface side. It should be noted that these LEDs are preferably formed in a cannonball type.

When checking the energization notification lamp, first, a total of three red LEDs are arranged on the downstream side of the fuse Fu3 and on the downstream side of each of the two asynchronous rectifier converters CV12m and CV5m, corresponding to the first connector Main. ing. These indicate that 35V, 12V, and 5V are distributed to the payout control board 25, respectively, by lighting in red, and turning off any of the LEDs indicates a power distribution stop state.

On the other hand, corresponding to the second connector Sub, a total of three blue LEDs are arranged on the downstream side of the fuse Fu2 and on the downstream side of each of the two synchronous rectifier converters CV12s and CV5s. These indicate that 35V, 12V, and 5V are distributed in blue, respectively, and when any of them is turned off, the distribution is stopped.

As shown in FIG. 4B, a pair of red LEDs and blue LEDs are arranged adjacent to each other on the edge of the power supply board 20 according to the voltage level (5/12 / 35V) to be distributed, and the staff members. Just by opening the inner frame 3 and looking at the back side of the gaming machine, it is possible to immediately recognize whether or not the six energization notification lamps are lit and the lighting color. Therefore, from the position of the LED in the off state among the six energization notification lamps, the voltage level of the voltage that is not distributed and the circuit board for which distribution is stopped are the payout control board 25 or the effect interface board 22. It will be easily recognizable.

By the way, as described above, in this embodiment, the motor driver of the effect motor and the LED driver of the LED lamp arranged on the glass door 6 and the front plate 7 which are the front door members via the third connector Aux. However, DC12V is directly supplied. In a normal device configuration, DC12V is distributed from the effect control board 23 and the effect interface board 22 to the effect motor and LED lamp arranged on the front door member, but in this embodiment, the effect motor and LED are distributed. Since DC12V is directly supplied to the lamp, not only the distribution path is simplified, but also the power loss in the distribution path is significantly reduced, and wasteful power consumption is suppressed.

Hereinafter, the internal configuration of the power supply board 20 shown in FIG. 4A will be described with reference to FIGS. 5 to 10. First, FIG. 5 is a circuit diagram showing an energization cutoff circuit CUT. As shown in the figure, the energization cutoff circuit CUT includes a bridge rectifier circuit BRG that receives AC 24V, a Zener diode ZD1 having a breakdown voltage of about 48V, a Zener diode ZD2 having a breakdown voltage of about 16V, and a Zener diode ZD3 having a breakdown voltage of about 27V. When the Zener diode ZD1 is in a non-yielding state, the transistor TR1 (NPN type bipolar) which continues the OFF operation, the transistor Q0 (n type MOSFET) which continues the ON operation when it is normal, and the half-wave rectifying diode Drec are half. It is configured to include a smoothing capacitor Crec that is charged by a current passing through a wave rectifying diode Drec, and relay coils RL1 and RL2 that turn on the relay contacts CN1 and CN2.

The portions surrounded by the rectangular frame, such as the relay coils RL1 and RL2 and the relay contacts CN1 and CN2, are integrated relay component RLs and are arranged on the surface side of the power supply board 20. Further, the electrolytic capacitor Crec and the film capacitor Cbr described below are also inserted and arranged from the front surface side of the power supply board 20, but all other components are composed of surface mount components and are arranged on the back surface side of the power supply board 20. It is surface-mounted on.

Since the peak value of AC 24V is about 34V, the Zener diode ZD1 does not yield and the bridge rectifier circuit BRG does not function as a full-wave rectifier circuit under normal conditions. On the other hand, since the breakdown voltage of the Zener diode ZD2 is about 16V, the Zener diode ZD2 is in a yield state based on the alternating current 24V (conduction current I2), and the transistor Q0 is based on the voltage across the Zener diode ZD2 of 16V. It will be in the ON operating state.

Therefore, the smoothing capacitor Crec is charged to a level close to the peak value of AC24V based on the current I3, and yields the Zener diode ZD3. Therefore, in the state of being limited by the current limiting resistor R, the current corresponding to the yield voltage 27V of the Zener diode ZD3 constantly flows through the relay coils RL1 and RL2, and the relay contacts CN1 and CN2 are constantly flowing. Maintains the ON state. Since the relay contacts CN1 and CN2 maintain the ON state, the AC 24V via the filter circuit Fi is constantly supplied to the full-wave rectifier circuit RECT and the ball lending machine RNT. The AC 24V is distributed to the ball lending machine RNT via the AC connector AC and the payout control board 25.

The current I normal flowing through the half-wave rectifier diode Drec under _{normal conditions} is the sum of the total current I1 (= IL1 + IL2) of the relay coils RL1 and RL2, the current I2 to the Zener diode ZD3, and the current I3 to the smoothing capacitor Crec ( I _normal = I1 + I2 + I3). Further, the smoothing capacitor Crec is composed of a large-capacity cylindrical electrolytic capacitor of about 700 μF, and is erected on the surface side of the power supply board 20.

By the way, for example, based on the misunderstanding of the staff, AC 100V may be distributed to the gaming machine instead of AC 24V. However, in such a case, the Zener diode ZD1 yields, the film capacitor Cbr is charged, and the transistor TR1 in the OFF state transitions to the ON state, so that the transistor Q0 transitions to the OFF state. Therefore, the path of the illustrated current I3 is cut off, and the energizing current of the relay coils RL1 and RL2 is cut off, so that the relay contacts CN1 and CN2 immediately transition to the OFF state, and the transmission of AC 100V is blocked. Here, since two relay contacts are provided, it is possible to reliably stop the energization of AC 100V regardless of which line is the ground line connected to the frame ground (not shown). Since the operation until the relay contacts CN1 and CN2 are turned OFF is completed in an instant, the fuse Fu1 at the most upstream position is not blown.

As described above, in the present embodiment, even if the staff member makes an installation error, the staff member can recognize the operation error because the gaming machine does not start regardless of whether the power switch is turned on. Further, not only the damage of the gaming machine is prevented, but also the fuse Fu1 at the most upstream position and the other fuses Fu1 to FU6 are not blown, so that the trouble of replacing the fuse is not required. The AC 24V is configured to be transmitted to the ball lending machine RNT via the payout control board 25 (see the right side of FIG. 4A), but the AC 100V may damage the ball lending machine RNT. There is no.

Next, a synchronous rectifier type full-wave rectifier circuit (full-wave rectifier chip) RECT composed of a single circuit component will be described with reference to FIG. 6A. As shown in the figure, for example, the full-wave rectifying chip RECT, which is a hybrid IC, supplies appropriate control voltages TGa and TGb to the four N-type MOS transistors Q1 to Q4 and the gate terminal G of each MOS transistor. , A drive control circuit CTL that realizes synchronous rectification operation is built-in. In the present specification, the term "hybrid IC" is a term contrasted with that of a monolithic IC, and is generally composed of individual parts attached on one insulating substrate and connected by metal wiring to be integrated. , Not particularly limited. In the following description, except for those described as composite circuit components, they are positioned as monolithic ICs.

This full-wave rectifying chip RECT has two AC input terminals (AC +, AC-) and two pulsating output terminals (V +, V-), but is not provided with a power supply voltage terminal and is driven. The control circuit CTL should be supplied between the gate terminal G and the source terminal S of the N-type MOS transistors Q1 to Q4 based on the AC voltage (AC +, AC-) and the pulsating output (V +, V-), as appropriate. The driving voltage Vg is generated.

Since body diodes (parasitic diodes D1 to D4) are attached to each of the four MOS transistors Q1 to Q4, if all the MOS transistors are in the OFF state, the four body diodes D1 to D4 can be used. As a whole, an asynchronous rectifying type full-wave rectifying circuit (bridge rectifying circuit) is configured. Further, this full-wave rectifier chip RECT has a built-in drive control circuit CTL described above, and the drive control circuit CTL includes a terminal voltage Va between the AC + terminal and the V + terminal, and an AC + terminal and the V- terminal. The voltage Vb between the terminals is constantly monitored.

Then, when Va> 0, the drive control circuit CTL increases the drive voltage Vg of the MOS transistor Q1 and the MOS transistor Q3 to an appropriate H level before the body diode D1 starts conducting, so that the two transistors Turn on Q1 and Q3. Therefore, the body diodes D1 and D3 are bypassed, and the current flows in the path of the AC + terminal → the transistor Q1 → the downstream load → the transistor Q3 → the AC− terminal. In this case, the voltage drop between the drain terminal D and the source terminal S of each transistor Q1 and D3 is much larger than the voltage drop (forward voltage 0.6 to 1.0 V) when the body diodes D1 and D3 are conductive. Since it is low, wasteful power consumption is greatly reduced.

Further, in this embodiment, since the N-type MOS transistor is used, the on-resistance is reduced as compared with the case where the P-type MOS transistor is used, and in this sense, the power supply efficiency is improved. Incidentally, since the power supply efficiency of the full-wave rectifying chip RECT is 96% or more (about 99%) even in the operating state of AC24V input and pulsating current average current 10A output, it is not necessary to attach a heat sink. As described above, in this embodiment, four N-type MOS transistors are used, but if the power supply efficiency may be slightly lowered, a bridge rectifier circuit is configured by two N-type MOS transistors and two rectifier diodes. You may.

In any case, when Va <0 after Va> 0, the drive control circuit CTL controls the transistors Q1 and Q2 to operate OFF, and then when Vb> 0, the body diode D2 Before starting conduction, the drive voltage Vg of the MOS transistor Q2 and the MOS transistor Q4 is increased to an appropriate H level. In this case as well, the body diodes D2 and D4 are bypassed, and the current flows in the path of the AC-terminal → transistor Q2 → downstream load → transistor Q4 → AC + terminal, so that wasteful power consumption is significantly reduced.

As shown in FIG. 4A, a high frequency bypass capacitor C1 of about 2 to 3 μF and a choke coil L1 of about 40 μH are arranged on the downstream side of the full-wave rectifying chip RECT, and the high frequency bypass capacitor C1 has a high frequency. It absorbs noise and is charged with a pulsating voltage with a peak value of about 34V. The high-frequency bypass capacitor C1 has a square plate shape and is erected on the surface side of the power supply board 20.

By the way, although the internal power consumption of the full-wave rectifying chip RECT is significantly reduced based on the above configuration, a large current constantly flows through each connection terminal. Therefore, in this embodiment, the full-wave rectifying chip RECT is not directly soldered to the power supply board 20, but a composite first circuit component in which a plurality of circuit connection bars are connected to the terminals of the full-wave rectifying chip RECT. It is supposed to be.

That is, for the two AC input terminals (AC +, AC-) and the two pulsating output terminals (V +, V-) of the full-wave rectifying chip RECT, a plurality of circuit connection bars are connected to each terminal. Then, the whole is appropriately molded to complete a thin plate-shaped composite first circuit component. As described above, since the input / output currents to the full-wave rectifying chip RECT all pass through a plurality of circuit connection bars, the transmission loss in the transmission line to other circuit components can be effectively reduced. The circuit connection bar may be directly electrically connected to the full-wave rectifying chip RECT, or may be electrically connected after arranging the full-wave rectifying chip RECT on another substrate BR (preferably an insulating substrate). good.

In any case, the appearance of the composite first circuit component is that the main body is a thin plate of about 30 × 60 × 10 mm, and as shown in FIG. 6 (b), a total of 17 circuit connection bars are arranged in a row. Therefore, it protrudes from the main body of the component in a substantially orthogonal state. Here, the 17 circuit connection bars are connected to the four first groups electrically connected to the AC input terminal AC +, the four second groups electrically connected to the AC input terminal AC-, and the pulsating output terminal V +. It is divided into four electrically connected third groups and five electrically connected fourth groups V-.

The circuit connection bars of each group are all round bar-shaped or flat plate-shaped, and their diameter Φ and plate width WD are about 1 mm (Φ = WD = about 0.6 to 1.5 mm) when viewed from the front. .. Further, the circuit connection bars of each group are all aligned with a uniform pitch Pi of 2 mm or more (preferably about 2 to 3 mm), and the circuit connection bars of each group maintain a uniform pitch Pi. , It is inserted from the front surface side of the power supply board 20 in a substantially orthogonal state to the power supply board 20, and is soldered to the circuit pattern lands corresponding to each group on the front and back surfaces thereof.

The circuit pattern land is a conductor surface formed of copper foil or the like on a circuit board. In this embodiment, a material whose power consumption does not matter at all even if a current of 1 A is passed through the conductor surface having a pattern width of 1 mm is used. It is selected to form a predetermined film thickness. The circuit pattern land of each group is formed with a sufficient plane width that does not fall below the maximum separation distance of the circuit connection bars belonging to each group.

Specifically, the circuit pattern lands of the first group to the third group are formed in a plane width exceeding 4 × Pi, respectively, corresponding to each of the four circuit connection bars, and the circuit pattern lands of the fourth group are formed. Are formed to have a plane width of more than 5 × Pi, respectively, corresponding to the five circuit connection bars. Although not particularly limited, in each of the circuit pattern lands of this embodiment, the connection points with the circuit connection bar are set to the minimum width (4 × Pi, 5 × Pi), and other than that, the pattern width is formed to be substantially the minimum width or more. Has been done.

Therefore, if the circuit pattern lands of the first group to the third group are Pi = 2.5 mm, they are 4 × Pi (10 mm) or more, respectively, and a steady current of 10 A or more is allowed. Become. Corresponding to such a configuration, the full-wave rectifying chip RECT of this embodiment functions at a maximum output current of about 10 A.

The pulsating voltage V1 full-wave rectified by the full-wave rectifying chip RECT (composite first circuit component) having the above configuration is supplied to the boost-type power factor improving circuit. The power factor improvement circuit is composed of a power factor improvement component PFC and a circuit component related to the power factor improvement component. FIG. 6 (c) shows a resin-molded power factor improvement component PFC and a circuit component related to the power factor improvement operation. Is illustrated. As shown in the figure, the power factor improving component PFC includes a first input terminal Vin, a second input terminal Vin2, a negative voltage input terminal V-, a voltage output terminal Vout, a ground terminal GND, and a power supply voltage supply terminal Vcc. It is configured to have.

FIG. 6D illustrates the appearance of the power factor improving component PFC, which is a composite second circuit component. The illustrated composite second circuit component has a thin plate shape having a main body of about 30 × 60 × 10 mm, and is completed as an integrated circuit component by being housed in the electromagnetic shield box SH shown in FIG. 6 (e). .. The electromagnetic box SH is formed of a square conductor box having a size of about 31 mm × 65 mm × 12 mm, corresponding to the composite second circuit component. Then, the open surface BK formed in a gate shape, the flush closed surface FT, and the upper surface and the side surface having a plate width of about 12 mm connecting the open surface BK and the closed surface FT form a substantially rectangular shape without a bottom surface. It is formed and fixed to the power supply board 20.

The internal configuration of the power factor improving component PFC is as shown in FIG. 6 (c), but it may be a single element as a hybrid IC (PFC), or a circuit component required for a substrate (insulated substrate) BR may be used. It may be arranged and completed. In any case, as shown in FIG. 6D, the composite second circuit component PFC also has a total of 16 circuit connection bars arranged in a row and protrudes from the component body in a substantially orthogonal state. The 16 circuit connection bars include four first input terminals Vin group, four negative voltage input terminals V-group, three voltage output terminals Vout group, and three ground terminal GND groups. There is.

Even in the composite second circuit component, the circuit connection bar of each group is in the shape of a round bar or a flat plate, and its diameter Φ and plate width WD are about 1 mm (Φ = WD = 0.6) when viewed from the front. ~ 1.5 mm). Further, the circuit connection bars of each group are all aligned with a uniform pitch Pi of 2 mm or more (preferably about 2 to 3 mm), and the circuit connection bars of each group maintain a uniform pitch Pi. , It is inserted from the front surface side of the power supply board 20 in a substantially orthogonal state to the power supply board 20, and is soldered to the circuit pattern lands corresponding to each group on the front and back surfaces thereof.

Also in the composite second circuit component, the circuit pattern land is formed with a sufficient plane width that does not fall below the maximum separation distance of the circuit connection bars belonging to each group, and a current of 1 A is applied to the conductor surface having the pattern width of 1 mm. A material is selected in which power loss does not matter at all even when it is passed, and a predetermined film thickness is formed. The circuit pattern land is formed, for example, for the voltage output terminal Vout and the ground terminal GND in a plane width exceeding 3 × Pi, corresponding to each of the three circuit connection bars. Further, the circuit pattern land has a minimum width (3 × Pi) at the connection point with the circuit connection bar, and other than that, the circuit pattern land is formed to have a pattern width of substantially the minimum width or more.

Therefore, the circuit pattern land for the voltage output terminal Vout and the ground terminal GND is, for example, 3 × Pi (7.5 mm) or more when Pi = 2.5 mm, and a steady current of 7.5 A or more is allowed. Will be done. Corresponding to such a configuration, the power factor improving component PFC of this embodiment functions at a maximum output current of about 7 A.

Based on the above, the power factor improving component PFC will be further described including the related circuit configuration. As shown in FIG. 6C, the pulse flow output V1 which is the voltage across the pulse flow output terminals V + and V− of the full-wave rectifier circuit RECT is supplied to the smoothing capacitor C1 and the thermista TH. However, the thermistor TH is connected in parallel with a switch circuit SW that is open only when the power is turned on, and normally, the switch circuit SW is in the ON state, so that the thermistor TH does not function.

The voltage across the smoothing capacitor C1 (pulse flow output) V1 is directly supplied to the second input terminal Vin2 and is also supplied to the first input terminal Vin via the choke coil L1. Further, the pulsating output terminal V- of the full-wave rectifier circuit RECT is connected to the negative voltage input terminal V- of the power factor improving component PFC via the switch circuit SW in the ON state. Here, the electromagnetic shield box SH accommodating the power factor improving component PFC is arranged so that its closed surface FT faces the choke coil L1, and an eddy current corresponding to a high frequency magnetic field from the choke coil L1 flows. This ensures that the power factor improving component PFC is electromagnetically shielded from the high frequency magnetic field.

Further, a large-capacity smoothing capacitor C2 is connected between the output terminal Vout of the power factor improving component PFC and the ground terminal GND. Although not particularly limited, in this embodiment, a capacitance of 30,000 μF is realized by erection of three cylindrical electrolytic capacitors C2 of about 10,000 μF on the surface side of the power supply board 20. .. Then, the power factor improving circuit is functioning so that the voltage V2 across the smoothing capacitor C2 has an average value of about DC35V. A DC voltage of 12 V is supplied to the power supply voltage supply terminal Vcc to function the energization control circuit.

Further, integrated bypass diodes Db and Db (three-terminal composite diode element) are connected between the second input terminal Vin2 and the output terminal Vout. The bypass diodes Db and Db bypass the choke coil L1 and absorb the inrush current at power-on by the smoothing capacitor C2 to avoid reactor saturation of the choke coil L1 at power-on and provide a power factor improvement circuit. It prevents the constituent circuit parts from being destroyed.

Here, a Schottky barrier diode is preferably selected as the bypass diodes Db and Db from the conditions that a large current can be passed instantaneously and the forward voltage drop is low. The Schottky barrier diodes Db and Db of the embodiment have a forward voltage drop of about 0.79 V when the forward current is 10 A (instantaneous power consumption is 7.9 W). Since the power factor improving circuit of the embodiment is a step-up type and V1 <V2 during normal operation, it is desirable that the reverse current is small. In this embodiment, the reverse direction is achieved at a reverse voltage of 100 V. An element having a current of 30 μA or less is selected.

However, in order to continue normal operation, it is naturally necessary to maintain the bonding temperature below the upper limit. Therefore, in order to prevent element destruction under any operating conditions, the composite diode elements Db and Db of the embodiment are erected on the surface side of the power supply board 20 while holding the heat sink.

The power factor improving component PFC to which each of the above components is connected operates with N-type MOS transistors Q5 and Q6 that operate complementaryly on and off at high speed and when the power factor improving operation is stopped. It includes a P-type MOS transistor Q7 and an energization control circuit that controls the ON / OFF operation of the MOS transistors Q5, Q6, and Q7 to improve the power factor.

The energization control circuit compares the output voltage V2 (average value of about 35V) with the reference voltage Vr of a predetermined level, and while the output voltage V2 is maintained below the reference voltage Vr, the peak of the voltage waveform and the current waveform. The MOS transistors Q5 and Q6 are continuously ON / OFF controlled so that the positions of the above are the same and a current waveform similar to the voltage waveform is formed. During this normal operation, the switch circuit S1 is controlled to the ON state, and the switch circuits S2 and S3 are controlled to the OFF state. Therefore, the gate terminal G of the P-type MOS transistor Q7 has the same potential at the source terminal S, and in this operating state, the input voltage V1 <output voltage V2, so that the gate terminal G of the P-type MOS transistor Q7 has the same potential. The drain terminal D becomes higher and lower potential and maintains the OFF state.

By the way, in the gaming hall, AC voltage (24V) is distributed from one power supply system to many gaming machines, so the voltage level of the AC voltage temporarily changes according to the operating state of the surrounding gaming machines. It may increase. In such a case, if a voltage V1 higher than the output voltage V2 of the power factor improving circuit is applied to the power factor improving circuit (V1> V2), the normal power factor improving operation cannot be continued. Therefore, in the energization control circuit of this embodiment, when the output voltage V2 becomes higher than the predetermined reference voltage Vr, both the MOS transistors Q5 and Q6 are OFF-controlled to stop the power factor improving operation. Further, while the switch circuit S1 is turned off, the switch circuits S2 and S3 are controlled to be turned on.

Therefore, the gate terminal G of the MOS transistor Q7 has a lower potential than the drain terminal D, the P-type MOS transistor Q7 operates ON, bypasses the choke coil L1, and goes to the load side via the MOS transistor Q7. Power distribution is continued. During power distribution in this uncontrolled state, not only the choke coil L1 is bypassed, no current flows through the body diode of the transistor Q7 and the body diode of the transistor Q6, and the composite diode elements Db and Db Since no current flows through the diode, wasteful power consumption is surely suppressed. After that, when the output voltage V2 returns to the predetermined reference voltage Vr or less, the power factor improving operation is restarted.

As described above, in the present embodiment, first, wasteful power consumption is eliminated by reducing the reactive power to zero by the power factor improving operation. Further, in the power factor improving component PFC of the embodiment, the MOS transistor Q6 is arranged at the place where the diode should be used, and the switching operation is complementarily performed with the MOS transistor Q5 (synchronous rectification), which is useless. Power consumption is reduced.

Further, in this embodiment, when the input voltage V1> the output voltage V2, the uncontrolled power distribution operation is continued, and in this case, the MOS transistor Q7 is turned on, so that the extra body diode of the transistor Q6 or the like is used. Power consumption can be reduced to the utmost.

By the way, as described above, the power factor improving circuit of this embodiment functions at a maximum output current of about 7 A. Therefore, the power consumption of the choke coil L1 can be at a level that cannot be ignored. Therefore, in this embodiment, the choke coil L1 is a toroidal core type (see FIG. 6 (f)), and the winding is wound around the toroidal core as many times as necessary to secure a predetermined inductance value (40 μH in the embodiment). doing.

^{The inductance value of this type of choke coil is L = μSN 2} / L corresponding to the core magnetic permeability μ, core cross-sectional area S, core average circumference length L, and number of turns N, and the winding diameter (diameter). Φ has no effect on the inductance value. On the other hand, the resistance value of the winding is inversely proportional to the cross-sectional area (square of the winding diameter Φ), and the thinner the winding, the higher the resistance value. Therefore, in this embodiment, a required inductance value is secured by winding a winding having a diameter of 1 mm or more around the toroidal core.

Generally, in order to reduce the resistance value, the larger the winding diameter Φ is, the more preferable it is, but in order to avoid increasing the size and cost, a winding diameter of 1.0 to 1.5 mm is preferable. Incidentally, in this embodiment, the internal resistance of the choke coil L1 having an inductance value of 40 μH is suppressed to 15 mΩ by setting the winding diameter Φ = 1.2 mm. Therefore, the voltage drop of 7A when energized is suppressed to about 0.1V, and the wasteful power consumption is suppressed to about 0.7W.

Subsequently, the voltage monitoring circuit WTCH that monitors the power factor improvement output V2 (the average value of the pulsating current is about 35V) of the power factor improvement circuit will be described with reference to FIG. 7. The voltage monitoring circuit WTCH receives the voltage dividing resistors R1 and R2 that generate the monitoring voltage Vs by dividing the power factor improving output V2 to about 1/10, and the first non-inverting flow force terminal (+) that receives the monitoring voltage Vs. And the second comparators CM1 and CM2, the transistor TRm that operates ON when the voltage improvement output V2 drops to the first level, the transistor TRs that operates ON when the voltage improvement output V2 drops to the second level, and the transistor TRm. Transistors TR2 and TR3 that operate ON in response to the ON operation of the transistor TRs and output L-level monitoring signals Wm5 and Ws5, and L-level monitoring signals Wm12 and Ws12 that operate ON in response to the ON operation of the transistors TRs. It is configured to have transistors TR4 and TR5 to output.

As shown in FIG. 4A, the monitoring signals Wm12 and Ws12 are supplied to the soft start terminals SS of the DC / DC converters CV12m and CV12s that generate DC12V, and the monitoring signals Wm5 and Ws5 are DC / DCs that generate DC5V. It is supplied to the soft start terminal SS of the converters CV5m and CV5s. Here, each DC / DC converter CV12m, CV12s, CV5m, CV5s does not start the DC conversion operation until the voltage of each soft start terminal SS reaches a predetermined value (H level) from 0V (L level). It is configured as (soft start operation). Then, after the DC conversion operation is started, if the monitoring signals Wm12, Ws12, Wm5, and Ws5 drop from the H level to the L level, the DC conversion operation is stopped.

Returning to FIG. 7 and continuing the description, the first comparator CM1 receives the first reference voltage Vr1 generated by the shunt regulator (TL431AIPK) or the like at the inverting input terminal (-), and the second comparator CM2 receives the first reference voltage Vr1. The second reference voltage Vr2, which is a voltage divider of the first reference voltage Vr1, is received by the inverting input terminal (−). Although not particularly limited, in this embodiment, the first reference voltage Vr1 is 2.5V, and the second reference voltage Vr2 is set to 1.97V based on the voltage division ratios of the voltage dividing resistors R3 and R4. .. As described above, since the monitoring voltage Vs is about V2 / 10, the first reference voltage Vr1 is about V2 / 14 with respect to the power factor improvement output V2, and the second reference voltage Vr2 is V2 /. It will be about 17.7.

Since the first reference voltage Vr1 and the second reference voltage Vr2 are at the above levels, if the power factor improvement output V2 is at a normal level (about 35V), both comparators CM1 and CM2 have non-inverting input terminals (+). ) Voltage (= V2 / 10) becomes higher than the voltage (= V2 / 14, V2 / 17.7) of the inverting input terminal (-), and H level signals are output from each comparator CM1 and CM2. .. Therefore, the PNP transistors TRm and TRs all maintain the OFF state, and the NPN transistors TR2 to TR5 all maintain the OFF state correspondingly.

In this way, if the power factor improvement output V2 is at a normal level (about 35V), all the transistors TR2 to TR5 are in the OFF state, so that the DC / DC converters CV12m, CV12s, CV5m, and CV5s stop operating. However, the DC conversion operation is continued.

On the other hand, when an abnormality occurs in the power factor improvement circuit for some reason and the power factor improvement output V2 falls below the 25V level (first level), the monitoring voltage Vs (= V2 / 10) becomes 2.5V. Since it falls below the voltage, the output of the comparator CM1 changes from the H level to the L level, and the transistor TRm transitions to the ON state. Therefore, both the transistors TR2 and TR3 transition to the ON state, the monitoring signals Wm5 and Ws5 become the L level, and the DC / DC converters CV5m and CV5s stop operating. When the DC / DC converters CV5m and CV5s stop operating, the distribution of DC5V to the payout control board 25 and the effect interface board 22 is stopped.

However, before the monitoring voltage Vs (= V2 / 10) falls below 2.5V, the photocoupler PH of the power supply monitor unit MNT (FIG. 3B) is turned off, and the power supply abnormality signal ABN is already at an abnormality level. It has changed to (L). Therefore, when the DC5V power distribution is stopped when the DC / DC converters CV5m and CV5s stop operating, the backup process is completed on the payout control board 25 and the main control board 21. Since the voltage level of DC5V is maintained for a predetermined time by the electrolytic capacitors arranged on the control boards 21 and 25, even if the backup process is not completed when the power distribution of DC5V is stopped, there is no problem in backing up. The process can be terminated.

As described above, DC 5V is used as the power supply voltage of the one-chip microcomputer of the payout control board 25 and the main control board 21, and the power supply voltage of the logic element mounted on each control board. Further, the DC 5V is level-dropped by the DC / DC converter of the effect interface board 22, and then various levels of voltage lowered are used as the power supply voltage of various computer circuits.

Therefore, when the DC 5V power distribution is stopped, the logic elements mounted on each control board stop the operation, and the control operation such as the output operation of the control signal is stopped. Further, the reset circuits RST1 and RST2 mounted on the payout control board 25 and the main control board 21 function to change the reset signal to the L level, so that the payout control board 25 and the main control board 21 that have completed the backup process The one-chip microcomputer stops the control operation. This point also applies to the computer circuit (composite chip 50, voice processor 27, etc.) that has executed the game control operation, and immediately stops the game control operation.

As described above, in the present embodiment, when the power factor improvement output V2 falls below the 25V level, the DC / DC converters CV5m and CV5s stop the operation first, so that the above stop operation is quickly executed and unstable. At the power supply voltage level, the possibility that the game control operation will continue is avoided. It should be noted that such an operation is usually executed when the power supply is cut off, but in this embodiment, even when the AC voltage 24V is at a normal level and only the power factor improving circuit is in an abnormal state, the above operation is performed. There is an advantage that the operation is performed.

The timing at which the power factor improvement output V2 falls below 25V has been described above, but when the power is cut off or when the power factor improvement circuit is abnormal, the level of the power factor improvement output V2 continues to drop, and eventually 19.7V (19.7V). It reaches the timing below the second level). Then, since the monitoring voltage Vs (= V2 / 17.7) is lower than 1.97V, the output of the comparator CM2 changes from the H level to the L level, and the transistors TRs transition to the ON state. Therefore, the transistors TR4 and TR5 both transition to the ON state, the monitoring signals Wm12 and Ws12 become the L level, and the DC / DC converters CV12m and CV12s stop operating.

As explained above, DC 12V is used as the drive power supply for LED lamps and motors controlled from each control board, and the power supply voltage for digital amplifiers. However, when the DC / DC converters CV12m and CV12s stop operating, The DC 12V power distribution is stopped. However, at this timing, the control operations of the LED lamp, the effect motor, and the digital amplifier are already stopped, and the control signal is not transmitted from the logic element, so that the unnatural lamp effect and motor effect are not transmitted. Is not generated, and no abnormal noise is generated from the speaker.

As described above, in the present embodiment, the control source such as the one-chip microcomputer stops the control operation prior to the stop of the power distribution to the control target such as the effect motor, so that the smooth power cutoff operation can be realized. Further, even when only the power factor improving circuit operates abnormally, the same smooth operation ending operation is realized.

Next, FIG. 8A is a circuit diagram showing the internal configuration of the synchronous rectification type DC / DC converter CV5s that receives the pulsating output V2 (average value 35V) of the power factor improving circuit and generates a DC voltage of 5V. is there. Although not particularly limited, the DC / DC converter CV5s of this embodiment is configured by connecting a converter IC element (monolithic IC) CHP and related circuit components on the power supply board 20. The choke coil L5 and the smoothing capacitor C6 are arranged on the front surface side of the power supply board 20, while the other circuit components are all arranged on the back surface side of the power supply board 20 including the converter IC element CHP without the heat sink. doing.

This converter IC element CHP includes an oscillation unit OSC that oscillates the system clock signal CLK, a lamp generation unit RaGEN that generates a saw wave (ramp wave), and a start control unit SS that realizes an appropriate soft start operation when the power is turned on. , The error amplification unit EAP that outputs the difference voltage between the comparison reference voltage (0.7V) and the feedback voltage VFB, the PWM comparator PWMC that outputs the PWM wave based on the output of the error amplification unit EAP, and the power factor improvement output V2. The constant voltage unit RG that generates a reference voltage of 10V in response to the voltage, the comparator voltage generator RFG that generates various comparison voltages in response to the power factor improvement output V2, and the H driver HDRV that drives the upper external MOS transistor QH. It is configured to include an L driver LDRV for driving the lower external MOS transistor QL, and a driver control unit DrCTL for controlling the operation of the drivers HDRV and LDRV.

Here, as for the external MOS transistors QH and QL, not only the lower MOS transistor QL but also the upper MOS transistor QH is composed of N-type MOSFETs, so that wasteful power consumption is reduced. That is, in general, the N-type MOS transistor is cheaper than the P-type MOS transistor and has a low on-resistance. Therefore, according to the configuration of this embodiment, the power supply efficiency can be improved.

Further, this converter IC element CHP has not only the above-mentioned soft start function, but also an overcurrent protection function, a short circuit protection function, an overheat cutoff protection function, and a low voltage malfunction prevention function (UVLO: Under Voltage Lock Out). Moreover, the gradient of the ramp wave and the frequency Fsw of the system clock are configured to be configurable.

Specifically, by connecting a capacitor Cs having an appropriate capacitance to the SS terminal, the converter waits for the start of operation until the capacitor Cs is charged to a predetermined level, suppresses the inrush current, and overshoots. Avoiding shoots. Further, a monitoring signal Ws5, which becomes L level at the time of abnormality, is supplied to this SS terminal from the voltage monitoring circuit WTCH, and is configured to stop the DC conversion operation when the power factor improvement output V2 drops abnormally. There is.

In addition, the upper limit current can be set based on the resistance value of the resistor connected to the ILIM terminal, and the slope of the lamp wave can be set based on the resistance value of the resistor connected between the KFF terminal and the BP5 terminal. There is. In this embodiment, the frequency Fsw of the system clock signal CLK can be set by the resistance value of the resistor connected to the RT terminal. In this embodiment, the system clock CLK is set to Fsw = about 200 kHz.

Corresponding to the internal configuration of such a converter IC element CHP, the power factor improvement output V2 is supplied to the VIN terminal, and an appropriate capacitor is connected to the BP10 terminal to make the BP10 terminal an accurate DC10V. Maintained. Further, by connecting the bootstrap capacitor Cbt between the BOOST terminal and the WS terminal, the space between the BOOST terminal and the WS terminal is 10-Vf≈9V corresponding to the forward voltage Vf of the internal diode Din. Maintained to a degree. The bootstrap capacitor Cbt is a component of a charge pump type booster circuit for turning on the upper N-type MOS transistor QH.

Further, the HDRV terminal of the converter IC element CHP is connected to the gate terminal of the upper MOS transistor QH via an appropriate resistor, and the LDRV terminal is connected to the lower MOS transistor QL via an appropriate resistor. It is connected to the gate terminal. Then, the SW terminal is connected to the source terminal of the upper MOS transistor QH. The PGND terminal is connected to the source terminal of the lower MOS transistor QL. Further, the power factor improvement output V2 is supplied to the drain terminal of the upper MOS transistor QH, and the drain terminal of the lower MOS transistor QL is connected to the source terminal of the upper MOS transistor QH.

Corresponding to such a configuration, the drain terminal of the lower MOS transistor QL and the source terminal of the upper MOS transistor QH are both connected to the SW terminal and connected to one terminal of the choke coil L5. There is. Further, the other terminal of the choke coil L5 is connected to the ground potential PGND terminal via the capacitor C6.

Then, the voltage across the capacitor C6 is supplied to the VFB terminal of the converter IC element CHP as a feedback voltage VFB in a state where the voltage is appropriately divided by the voltage dividing resistors RV1 and RV2. Then, the MOS transistors QH and QL operate ON / OFF at a duty ratio such that the feedback voltage VFB matches the reference voltage 0.7V, so that a predetermined level DC voltage is generated. In this embodiment, the resistance ratio of the voltage dividing resistor is set so that 5 × Rv2 / (RV1 + RV2) = 0.7, so that the output voltage is DC5V.

In FIG. 8A, the charging current of the choke coil L5 in the operating state in which the MOS transistor QH is ON and the MOS transistor QL is OFF is indicated by a solid line arrow, and in the operating state in which the MOS transistor QH is OFF and the MOS transistor QL is ON. , The discharge current of the choke coil L5 is indicated by a broken line arrow. Further, FIG. 8C shows the charge current, the discharge current, and the average current Io of the choke coil L5. Since an RC snubber circuit is connected between the drain terminal and the source terminal of the lower MOS transistor QL, ringing at the time of ON / OFF operation transition is preferably absorbed.

As for the inductance value of the choke coil L5 described above, the larger the value, the smaller the ripple current, but on the other hand, the size becomes larger. On the other hand, if the inductance is small, the ripple current increases, so that a large capacitance is required as the capacitor C6, and the capacitor C6 has to be enlarged. Therefore, in this embodiment, the inductance value of the choke coil L5 is determined to be 30 μH and the capacitance of the electrolytic capacitor C6 is determined to be 700 μF based on the above conditions and the clock frequency Fsw. The electrolytic capacitor C6 has a cylindrical shape and is erected on the surface side of the power supply board 20.

By the way, the inductance value required for the choke coil L5 is uniquely determined based on the magnetic permeability μ of the core, the cross-sectional area S of the core, the number of coil turns N, and the like. ^{Specifically, when a toroidal core is used, the inductance value becomes N 2} μS / L corresponding to the average diameter L of the toroidal core, the cross-sectional area S of the toroidal core, and the number of turns N, while ^{When a cylindrical core is used, the inductorn value per unit length ignoring the leakage flux is μSN 2} corresponding to the cross-sectional area S of the cylindrical core and the number of coil turns N per unit length (FIG. 10). (A). That is, in each case, the inductance value is uniquely determined based on the core configuration (μ or S) and the number of turns N of the coil winding wound around the core.

Therefore, the required inductance value can be any value regardless of whether a toroidal core is used (see FIGS. 6 (f) and 8 (b)) or a cylindrical core is used (see FIG. 10 (a)). You will be able to get it. However, since a large direct current Io constantly flows through the choke coil L5, even if the number of turns N is the same, the power loss differs greatly based on the diameter of the winding. Therefore, in this embodiment, when a large current is not required, a winding having a diameter of Φ <0.5 mm is wound around the cylindrical core (small configuration 1) to reduce the size of the choke coil and the manufacturing cost. (See Fig. 10 (a)), but when a large current is required, a winding with a diameter of Φ ≧ 0.5 mm is used for the toroidal core (large configuration 2) to reduce power loss. The reduction is attempted (see FIGS. 6 (f) and 8 (b)).

When the small configuration 1 is adopted, the DC resistance of each choke coil is 30 mΩ or more (preferably 120 mΩ or less), and when the large configuration 2 is adopted, the DC resistance of each choke coil is less than 30 mΩ.

Based on the above design concept, in this embodiment, the DC / DC converters CV12m and CV5m that generate DC voltage (12V, 5V) distributed to the payout control board 25 via the first connector Main are used. The asynchronous rectification method is adopted with the highest priority given to suppressing the manufacturing cost, and the choke coil having the small configuration (1) shown in FIG. 10A is used. On the other hand, the DC / DC converters CV12s and CV5s that generate DC voltage (12V, 5V) distributed to the effect interface board 22 via the second connector Sub adopt a synchronous rectification method and consume power. The choke coil of the large configuration (2) shown in FIGS. 8 (b) and 9 (b) is used with the highest priority given to the reduction of the above. Regardless of which configuration is adopted, the choke coil is erected on the surface side of the power supply board 20. These points are the same for the choke coil L1 (FIG. 6 (f)) used in the power factor improving circuit, which is a choke coil having a large configuration (2) and is erected on the surface side of the power supply board 20. Has been done.

Continuing a specific description, the choke coil L5 shown in FIG. 8B is configured by winding a winding with a wire diameter of 0.90 mm around a toroidal core based on the large configuration (2). The winding resistance in this case is about 20 mΩ at an inductance value of 30 μH, and power consumption can be effectively suppressed. Further, since the synchronous rectification method is adopted and the MOS transistor QL is used, the power consumption can be significantly suppressed as compared with the case where the rectifier diode is used in this portion.

In this embodiment, the output of the DC / DC converter CV5s is not only the power supply voltage of the logic element mounted on the effect interface board 22 and the effect control board 23, but also the power supply voltage of the voice processor 27 and the composite chip 50. Since it also has a basic voltage of (3.3V / 1.5V / 1.05V), the average current Io of the choke coil L5 is about 4.3A. In addition, in order to enrich the effect control, it is necessary to design to allow an average current of about 5 A at the maximum, so it is significant to use the MOS transistor QL and suppress the winding resistance of the choke coil L5. Extremely large.

By the way, if the winding diameter is halved, the winding resistance will be quadrupled. Therefore, when the wasteful power consumption of the choke coil L5 is Io = 5A, 0.5 W (watt) in this embodiment. However, the amount will increase by 1.5W (= 5 * 5 * 20/1000 * 3). Further, if a rectifier diode is used instead of the MOS transistor QL, wasteful power consumption is generated corresponding to the forward voltage drop Vf (≈1V) and the average duty ratio of the PWM wave (τ≈5 / 35). 1 × 4.3 × (1-τ) ≈ 1 × 4.3 × 0.86 = 3.7 W.

Next, FIG. 9A is a circuit diagram showing an internal configuration of a synchronous rectification type DC / DC converter CV12s that generates a DC voltage of 12V to be distributed to the effect interface substrate 22. The basic configuration and operation contents are the same as those of the DC / DC converter CV5s shown in FIG. 8A, but a considerably large drive current is required to execute various powerful game operations. A special configuration is required in consideration.

First, to confirm, the DC12V generated by the DC / DC converter CV12s not only drives a large number of LED lamps and effect motors constituting the panel side member via the second connector Sub shown in FIG. 4, but also digitally. It also serves as the power supply voltage for the amplifier. Further, since the LED lamps and the effect motors arranged on the front door members such as the glass door 6 and the front plate 7 are also driven via the third connector Aux, a drive current of about 13 A is required as a whole.

Therefore, in this embodiment, considering that the current flowing through the MOS transistors QH, QL, etc. is large, the necessary circuit parts are not directly soldered to the power supply board 20, but are another board (circuit board or Is an insulating substrate), and after attaching the necessary circuit parts, the whole is resin-molded to complete a 12V DC / DC converter. That is, the DC / DC converter CV12s is configured as a composite third circuit component CV12s in which the converter IC element CHP shown in FIG. 8A is integrated with related external components.

As described above, in this embodiment, since the converter IC element CHP and the external components related thereto are arranged on different substrates and molded as a whole, it is not always necessary to connect the circuit components with a wiring pattern. It disappears. In the composite third circuit component CV12s, the components are connected in the shortest time with a wiring cable having an optimum thickness, and wasteful power consumption is effectively suppressed by reducing the wiring resistance. The composite third circuit component CV12s also has the same appearance as the composite first circuit component RECT and the composite second circuit component PFC, and is formed in a thin plate shape of, for example, about 40 mm × 30 mm × 8 mm.

Further, in order to realize electromagnetic shielding as well as heat dissipation effect of MOS transistors QH, QL, etc., the composite third circuit component CV12s is an integrated circuit component housed in the conductive electromagnetic shield box SH shown in FIG. 9D. As a result, the use of a heat sink is not required. The electromagnetic shield box SH shown in FIG. 9D has the same configuration as that described with respect to FIG. 6C, and is formed of a square conductor box having a size of about 31 mm × 65 mm × 12 mm. The closed surface FT of the electromagnetic shield box SH is erected facing the choke coil L3 in order to ensure perfect electromagnetic shielding. Further, in order to realize the electrostatic shielding effect together, the electromagnetic shield box SH is connected to the ground line of the power supply board 20.

As shown in FIG. 9C, the composite third circuit component (DC / DC converter CV12s) has a total of 13 circuit connection bars arranged in a row and protrudes from the component body in a substantially orthogonal state. The 13 circuit connection bars include three input terminal IN groups, four output terminals OUT groups, and three ground terminals GND groups. The FB terminal is connected to the VREF terminal of the converter IC element CHP via the voltage dividing resistor RV1, and the Rref terminal and the ON / OFF terminal are connected to the VFB terminal and the SS terminal of the converter IC element CHP, respectively. They are connected in a one-to-one relationship.

Even in the composite third circuit component, the circuit connection bar of each group is in the shape of a round bar or a flat plate, and its diameter Φ and plate width WD are about 1 mm (Φ = WD = 0.6) when viewed from the front. ~ 1.5 mm). Further, the circuit connection bars of each group are all aligned with a uniform pitch Pi of 2 mm or more (preferably about 2 to 3 mm), and the circuit connection bars of each group maintain a uniform pitch Pi. , It is inserted from the front surface side of the power supply board 20 in a substantially orthogonal state to the power supply board 20, and is soldered to the circuit pattern lands corresponding to each group on the front and back surfaces thereof.

Also in the composite third circuit component, the circuit pattern land is formed with a sufficient plane width that does not fall below the maximum separation distance of the circuit connection bars belonging to each group, and a current of 1 A is applied to the conductor surface having the pattern width of 1 mm. A material is selected so that the power loss does not matter at all even if it is passed, and a predetermined film thickness is formed. For example, the circuit pattern land corresponding to the output terminal OUT group is formed to have a plane width exceeding 4 × Pi corresponding to four circuit connection bars. Further, in this circuit pattern land, the connection portion with the circuit connection bar has a minimum width (4 × Pi), and other than that, the pattern width is formed to be substantially the minimum width or more.

Therefore, the circuit pattern land corresponding to the output terminal OUT group is, for example, 4 × Pi (10 mm) or more when Pi = 2.5 mm, and a steady current of 10 A or more is sufficiently allowed. .. The output current of the DC / DC converter CVs12 of this embodiment is, for example, about 13 A at the maximum, and in this case, it seems to be a little insufficient, but the time for this maximum current to flow is at most 10 seconds in terms of production. Therefore, there is virtually no problem.

The circuit operation is substantially the same as that of the DC / DC converter CV5s shown in FIG. 8A, and the DC / DC converter has an output voltage of 12 V by appropriately changing the duty ratio of the PWM wave. CV12s are working. The voltage dividing resistors RV1 and RV2 are specified to maintain the output voltage at 12V, and in the circuit shown in FIG. 9A, the voltage dividing resistor RV1 is such that 12 × Rv2 / (RV1 + RV2) = 0.7. , The resistance ratio of RV2 is set. Further, the inductance value of the choke coil L3 is set to 70 μH and the capacitance of the electrolytic capacitor C4 is set to 1400 μF based on the internal clock frequency Fsw of the converter IC element CHP. The capacitance of 1400 μF is realized by erection of two cylindrical electrolytic capacitors 700 μF on the surface side of the power supply board 20.

By the way, the output of the DC / DC converter (composite third circuit component) CV12s is driven by a large number of high-brightness LEDs via the second connector Sub and the third connector Aux, and is also used by a plurality of large production motors. It becomes the drive voltage. Then, when all the effect motors are operated at the same time, the current consumption increases to, for example, 14 A or more, but this causes the power consumption to be excessive and may exceed the capacity of the power distribution system of the game hall.

Therefore, in this embodiment, the effect contents of the movable effect and the lamp effect are designed so as not to exceed the _{limit current I max} (for example, 13 A) even at the maximum by appropriately allocating the effect timing of each effect motor. Further, a maximum value _{I m2} of the supply current _{I S2} of the second connector Sub, a maximum value _{I m3} of the supply current _{I A3} from the third connector Aux, respectively, for example, _I m2 = 8A and _I m3 = 6A defined while, even when any operation, the total current _I S2 _{+ I A3} supplied from the second connector Sub and DC12V terminal of the third connector Aux is, so as not to exceed the limit current _{I max,} we are designing effect contents. That is, the movable effect and the lamp so that _IS2 <I _m2 (= for example 8A) and I _A3 <I _m3 (= for example 6A) and _IS2 + _IA3 <I _{max (= for example 13A).} It stipulates the content of the production.

Even when the current distribution is suppressed as described above, the DC / DC converter CV12s needs to output 13A at the maximum, so that wasteful power consumption in the choke coil L3 becomes a problem. Therefore, as shown in FIG. 9B, a large-diameter winding having a diameter of about 1.0 mm is wound around the toroidal core a required number of times to realize an inductance value of about 70 μH (large configuration (2)). .. By using a large-diameter winding, the resistance value can be suppressed to about 25 mΩ _{, and the power loss during distribution of the limit current I max} (= 13 A) is suppressed to about 4 W. The DC / DC converter CV12s of the embodiment adopts a synchronous rectification method, but if an asynchronous rectification method is adopted, it corresponds to the average duty ratio of the PWM wave (τ≈12 / 35). The useless power consumption during distribution of the limit current I _max reaches 1 × 13 × (1-τ) ≈ 1 × 13 × 0.66 = 8.5 W, assuming Vf = 1.0 V.

Subsequently, an asynchronous rectifying type DC / DC converter will be described with reference to FIG. FIG. 10B shows a DC / DC converter CV12m that outputs DC12V by lowering the power factor improvement output V2 = 35V, and FIG. 10C shows a circuit configuration of a DC / DC converter CV5m that outputs DC5V. Shown. As shown in FIG. 4, the outputs (12V / 5V) of the DC / DC converter CV12m and the DC / DC converter CV5m are first distributed to the payout control unit 25 via the first connector Mian, and further, the payout control is performed. Power is distributed from the unit 25 to the main control board 21.

The DC5V is used as a power supply voltage for the logic elements of the control boards 25 and 21 and the one-chip microcomputer, but the total current of the DC5V line is about 0.5A. On the other hand, DC12V is used as a driving voltage for a payout motor, a solenoid for opening and closing a variable winning device, and the like, but since it does not drive so many, about 1A is sufficient.

Therefore, in this embodiment, in consideration of the above points, an asynchronous rectifying type DC / DC converter is adopted in order to suppress the manufacturing cost and reduce the size of the circuit board. Further, as shown in FIGS. 10B and 10C, both DC / DC converters CV12m and CV5m are configured by using the converter IC element SRG (step-down switching regulator) shown in FIG. 10D. Has been done. The converter IC element SRG is classified as a monolithic IC.

The voltage dividing ratio of the voltage dividing resistors RA1 and RA2 of the DC / DC converter CV12m that outputs DC12V and the voltage dividing ratio of the voltage dividing resistors RB1 and RB2 of the DC / DC converter CV12m that outputs DC5V are the respective output voltage levels ( It is appropriately specified according to 12V / 5V). Specifically, both 12 × RA2 / (RA1 + RA2) and 5 × RB2 / (RB1 + RB2) are set to match the comparison reference voltage ReV of the converter IC element SRG.

As shown in FIG. 10D, the converter IC element SRG has a power supply unit PREg that generates a voltage of each part based on the voltage received by the IN terminal, and a soft start operation or an emergency stop operation based on a control signal received by the SS terminal. The start control unit Soft & ON / OFF, the overcurrent protection unit Overcurrent Protection, the heating protection unit Thermal Protection, the oscillation unit OSC that oscillates a pulse wave of about 300 KHz, and the reset unit Rset that detects power-on. , The detection voltage received by the ADJ terminal is received from each unit, the error amplification unit ErAmp that outputs the error voltage in comparison with the comparison voltage ReV, and the PWM comparator COMP that outputs the PWM wave based on the output of the oscillator OSC and the error voltage. It is configured to include a drive control unit Latch & Driver that controls ON / OFF of the output transistor TRsw based on a control signal.

Both DC / DC converters CV12m and CV5m are asynchronous rectifier type, and a choke coil L2 / L4 and a smoothing capacitor C3 / C5 are connected in series and a rectifier diode Dcv is connected between the SW terminal and the GND terminal. ing. As shown by the solid line in FIG. 10B, when the output transistor TRsw is ON, the coil charging current flows in the path of the choke coil L2 → the smoothing capacitor C3 → the ground. Further, as shown by the broken line in FIG. 10B, when the output transistor TRsw is OFF-operated, the coil discharge current flows in the path of the choke coil L2 → the smoothing capacitor C3 → the rectifier diode Dcv.

In this way, the coil discharge current flows through the rectifier diode having a forward voltage Vf of about 0.7 to 1.0 V, so that the power consumption is corresponding to the coil average current Io and the average duty ratio τ of the PWM wave. It becomes Io × Vf × (1-τ). However, when the output current of the DC / DC converter CV12m is 2A and the output current of the DC / DC converter CV5m is 1A, Vf = 1V and the power consumption is 2 × 1 × (1-12 / 35, respectively). ) = 1.3W and 1 × 1 × (1-5 / 35) = 0.86W, which is not so much, and there is no particular problem in adopting the asynchronous rectification method.

However, there is a risk of thermal runaway of the output transistor TRsw due to heat generation based on the current (2A / 1A) flowing through the output transistor TRsw. In addition, the overcurrent protection unit Overcurrent Protection may function to cause an emergency stop of the DC conversion operation. Therefore, in this embodiment, the above problems are prevented by attaching necessary heat sinks to each converter IC element SRG. Further, the converter IC elements constituting the DC / DC converters CV12m and CV5m are erected on the surface side of the power supply board 20 while holding the heat sink, respectively.

As described above, in the case of the embodiment, the total current of the DC5V line is about 0.5A, and the total current of the DC12V line is about 1A. However, different models may have different numbers of variable winning openings and game ball guide devices arranged on the game board surface, and it is possible to cope with the increase in these numbers and to realize a flashy lamp effect as needed. As described above, it is considered that the DC / DC converter CV12m requires about 2A as its current upper limit value, and the DC / DC converter CV5m requires about 1A as its current upper limit value.

However, if the current upper limit is about this level, the power loss in the choke coils L2 / L4 does not pose a problem as described below. Therefore, a slightly smaller diameter winding is required for the cylindrical center core. The required inductance value is realized by winding (small configuration (1) in FIG. 10 (a)). In the compact configuration (1), the central core is surrounded by a cylindrical outer peripheral core in order to minimize the leakage flux. ^{In the case of adopting such a configuration, ignoring the leakage flux, the inductance value per unit length is N 2} μS corresponding to the cross-sectional area S of the central core, the magnetic permeability μ of the core, and the number of turns N per unit length. Become.

To specifically explain the compact configuration (1) of this embodiment, the choke coil L2 used in the DC / DC converter CV12m that generates DC12V realizes an inductance value of 45μH by using a winding having a diameter of about 0.3mm. However, the winding resistance was about 90 mΩ. In this embodiment, since the current upper limit value of the DC12V line is set to 2A, the power loss in the choke coil L2 is about 0.36W, and there is no particular problem. Specifically, the smoothing capacitor C3 is a cylindrical electrolytic capacitor 700 μF, and is erected on the surface side of the power supply board 20.

On the other hand, the choke coil L4 used for the DC / DC converter CV5m that generates DC5V realized an inductance value of 20μH by using a winding having a diameter of about 0.4mm, but the winding resistance was about 40mΩ. In this embodiment, since the current upper limit value of the DC5V line is set to 1A, the power loss in the choke coil L4 is about 0.04W, which does not cause any problem. Specifically, the smoothing capacitor C5 is a cylindrical electrolytic capacitor 700 μF, and is erected on the surface side of the power supply board 20.

The circuit configuration of the power supply board 20 has been described in detail above. In this embodiment, the insertion component is inserted and arranged on the surface side of the power supply board 20 composed of a single-layer board having through holes, while the power supply board 20 is inserted. A surface mount component is arranged on the back surface side for surface mounting. Here, the surface mount product includes a Zener diode and a rectifying diode. In this embodiment, all the Zener diodes and the rectifying diode (excluding the composite first circuit component RECT) are on the back side of the power supply board 20. It is surface mounted on the diode.

FIG. 11 shows the back surface side of the power supply board 20, and shows the circuits of each part configured around the surface mount components. First, a thermistor circuit composed of a thermistor TH and a switch circuit SW that bypasses the thermistor is arranged on the back surface of the power supply board 20. Further, the voltage monitoring circuit WTCH is composed of only mounting parts, and all the parts are surface-mounted on the back surface of the power supply board.

Next, the energization cutoff circuit CUT is composed of a surface mount product except for the film capacitor Cbr, the current limiting resistor R, and the electrolytic capacitor Crec, and is arranged on the back surface of the power supply board 20. On the other hand, the film capacitor Cbr, the current limiting resistor R, and the electrolytic capacitor Crec are inserted and mounted on the surface side of the power supply board 20 close to the arrangement position of the surface-mounted product constituting the energization cutoff circuit CUT.

Similarly, the synchronous rectification type DC / DC converter CV12s is composed of surface mount components except for the choke coil L5 and the electrolytic capacitor C6 which are inserted and mounted on the surface side of the power supply board 20, and all the surface mount components are. , It is surface-mounted on the back surface of the power supply board 20. Further, the asynchronous rectification type DC / DC converters CV12m and CV12m are also composed of surface mount components except for the choke coil L2 / L4 and the electrolytic capacitor C3 / C5 which are inserted and mounted on the surface side of the power supply board 20. All surface mount components are surface mounted on the back surface of the power supply board 20.

By the way, on the front surface side and the back surface side of the power supply board 20, pattern lands having a pattern width corresponding to the current value flowing therethrough are formed vertically and horizontally. As described above, in this embodiment, even if a current of 1 A is passed through a conductor surface having a pattern width of 1 mm, the power loss is not a problem at all. However, in order to reduce unnecessary power consumption, it is necessary to further reduce the contact resistance in the first connector Main, the second connector Sub, and the third connector Aux and the power loss in the power supply path.

Therefore, in this embodiment, the connector terminals, the connector terminals, and the wiring cables connected to the connector terminals have resistance values that do not cause a problem of power loss even if a current of about 3 A is passed therethrough. Further, when a large current exceeding 3A is supplied, the power is shared among a plurality of connector terminals, and specific connector terminals are connected in parallel to a common pattern land.

Hereinafter, each connector will be described. The connector terminals of the first and second connectors Main and Sub have a two-row configuration shown in FIG. 12A, and the connector terminals of the third connector Aux have a single-row configuration. However, in any case, the arrangement pitch Pi of the connector terminals is set to about 2.0 mm in the left-right direction shown in the drawing.

Hereinafter, for convenience, the connector terminals will be described with serial numbers. Regarding the first connector Main and the second connector Sub, the odd-numbered and even-numbered connector terminals are separated from the adjacent numbered connector terminals by about 2.0 mm. In this state, they are inserted and mounted from the front side of the power supply board 20 in a state where they are arranged in a row with the same arrangement pitch Pi. Further, the six connector terminals of the third connector Aux are also inserted and mounted from the front surface side of the power supply board 20 in a state of being arranged in a row at the arrangement pitch Pi.

First, the first connector Main will be described. As described above, DC5V / DC12V / DC35V is distributed to the payout control board 25 via the first connector Main. In this embodiment, a maximum current of about 2 A flows through the DC5V line and a maximum of about 1A flows through the DC12V line based on the configurations of the DC / DC converters CV5m and CV12m and the number of LED lamps and solenoids. There is. Since the DC35V line is used by the firing solenoid and the ball feed solenoid, a maximum of about 1A flows.

Therefore, in consideration of the above amount of current, in order to distribute power with sufficient margin, each level of voltage is divided into two connector terminals selected from adjacent even terminals and two wiring cables corresponding to these. Power is distributed at. The voltage of each level may be one connector terminal each, but by selecting a pair of adjacent connector terminals (total width between terminals is about 3 mm), it corresponds to the pattern width of the corresponding circuit pattern land. be able to. Further, in the first place, the larger the number of used cables, the smaller the transmission loss. Therefore, the larger the number of connector terminals and wiring cables used, the more suitable it is.

Therefore, from this point of view, connector terminals equal to or greater than the total number of distribution lines at each voltage level (5/12/35) are used as ground lines. Specifically, as shown in FIG. 12B, eight connector terminals (ground terminals) having 2 × 3 = 6 or more are connected to the ground line (circuit putter land) of the power supply board 20. ing.

Next, the second connector Sub will be described. In this embodiment, a maximum current of 5A / 13A / 4A is planned for the distribution line having DC5V / DC12V / DC35V passing through the second connector Sub. Therefore, in order to distribute power with a sufficient margin, the voltage of each level is distributed by a plurality of connector terminals selected from adjacent even-numbered terminals or odd-numbered terminals and a plurality of wiring cables corresponding to these. The DC35V is distributed via the effect interface board 22 and serves as a driving power source for an electromagnetic solenoid that reciprocates a moving object.

Specifically, the DC5V distribution line consists of three connector terminals Nos. 3, 5, and 7, and the corresponding wiring cables, and the DC12V distribution line is Nos. 8 and 10. , 12 and 14 connector terminals and their corresponding wiring cables. The three connector terminals constituting the DC5V power distribution line are all odd numbers and are adjacent to each other (a state in which other connector terminals do not intervene). The total width of the three connector terminals is about 5 mm, and they are connected to one corresponding circuit putter land.

The same applies to the four connector terminals that make up the DC12V distribution line, all of which are even numbers and are adjacent to each other (no other connector terminals intervene). The total width of the four connector terminals is about 7 mm, and they are connected to one corresponding circuit putter land. The two connector terminals constituting the DC35V line are adjacent to each other as odd numbers (other connector terminals do not intervene), and are connected to one corresponding circuit putter land.

Corresponding to the above configuration, connector terminals equal to or greater than the total number of distribution lines at each voltage level (5/12/35) are used as ground lines. Specifically, as shown in FIG. 12 (c), the same 10 connector terminals (ground terminals) having 3 + 5 + 2 = 10 or more are connected to the ground line of the power supply board 20.

On the other hand, since the third connector Aux is not arranged in two rows, the three lines 1 to 3 are used as DC12V power distribution lines, and the three lines 4 to 6 are used as ground lines. As described above, in this embodiment, in order to distribute power with a sufficient margin, the distribution lines of DC5V and DC12V via the first connector Main are realized by using two or more connector terminals, respectively, and the second connector. The DC5V and DC12V distribution lines via the Sub are each realized by using three or more connector terminals. Further, the number of ground terminals is equal to or greater than the total number of connector terminals constituting the distribution line (including the same number), in other words, the number of ground terminals is equal to or more than half of the total number of connector terminals of each connector.

Since the power supply board 20 has been described in detail above, returning to FIG. 3A, other configurations of the gaming machine GM will be described. As shown in FIG. 3A, a voice circuit SND such as a voice processor 27 is mounted on the effect interface board 22, and a computer circuit such as a VDP circuit 52 and a built-in CPU circuit 51 is built in the effect control board 23. The composite chip 50 is mounted. Hereinafter, the built-in CPU circuit may be abbreviated as a CPU circuit.

The effect interface board 22 is equipped with reset circuits RST3 and RST4 that detect an increase in the power supply voltage and generate various reset signals RT3 and RT4 when the power is turned on. First, the reset circuit RST3 generates a reset signal RT3 based on the DC voltages 12V and 5V distributed from the power supply board 20. Then, the reset signal RT3 resets the power supply of only the voice memory 28 and is transmitted to the effect control board 23 as it is.

As shown in FIG. 13A, the reset signal RT3 transmitted to the effect control board 23 is AND-calculated with the output of the WDT (Watch Dog Timer) circuit 58 at the AND gate G1, and is used as the system reset signal SYS in the CPU circuit. The power supply of 51 and the VDP circuit 52 is reset (see FIGS. 13 (a) and 13 (d)).

The reset signal RT3 generated by the reset circuit RST3 rises to the H level after maintaining the L level as the power reset signal for a predetermined time after the power is turned on. However, after that, when any one or more of the DC voltage 12V or the DC voltage 5V drops (usually when the power is cut off), the system reset signal SYS also drops to the L level in response to the level drop of the reset signal RT3. Therefore, the CPU circuit 51 and the VDP circuit 52 of the effect control board 23 are stopped.

Since this system reset signal SYS also changes based on the output of the WDT circuit 58 (H level at normal times), the output of the WDT circuit 58 is output due to a program runaway or the like when the reset signal RT3 = H. Corresponding to the drop to the L level, the system reset signal SYS also changes to the L level, and the CPU circuit 51 and the VDP circuit 52 are abnormally reset (see FIG. 13D).

On the other hand, the reset circuit RST4 generates a reset signal RT4 based on 3.3V generated by dropping 5V distributed from the power supply board 20. This reset signal RT4 power-resets the voice processor 27 as a power-reset signal when the power is turned on.

As shown in the figure, the reset circuit RST4 is also supplied with the system reset signal SYSTEM returned from the effect control board 23, so that when the CPU circuit 51 or the VDP circuit 52 is abnormally reset, it is synchronized with the abnormal reset of these circuits. Then, the voice processor 27 is also abnormally reset. As a result, the audio effect returns to the initial state together with the image effect and the lamp effect, and there is no possibility that the unnatural audio effect will continue.

Next, the reset circuits RST1 and RST2 are mounted on the payout control board 25 which is the frame side member GM1 and the main control unit 21 which is the panel side member GM2, respectively, and a power reset signal is generated when the power is turned on. The computer circuit is configured to power reset.

As described above, in this embodiment, the reset circuits RST1 to RST4 are arranged on the main control unit 21, the payout control unit 25, and the effect interface board 22, respectively, and the system reset signal SYS is transmitted between the circuit boards. It will not be transmitted. That is, since there is no wiring cable for transmitting the system reset signal SYS, the possibility that the computer circuit is abnormally reset due to the noise superimposed on the wiring cable is eliminated.

However, the reset circuits RST1 and RST2 provided in the main control unit 21 and the payout control unit 25 each have a built-in watchdog timer, and do not receive a regular clear pulse from the CPUs of the control units 21 and 25. In that case, each CPU is forcibly reset.

Further, an initialization switch SW that can be operated by a staff member is arranged in the main control unit 21, and a RAM clear signal CLR indicating whether or not the initialization switch SW has been turned ON is output when the power is turned on. It is configured. This RAM clear signal CLR is transmitted to the one-chip microcomputers of the main control unit 21 and the payout control unit 25, and determines whether or not to initialize the entire area of the built-in RAM of the one-chip microcomputers of the control units 21 and 25. ing.

Further, as described above, the one-chip microcomputers of the main control unit 21 and the payout control unit 25 receive the power supply abnormality signal ABN from the power supply monitor MNT arranged in the payout control unit 25, thereby prior to a power failure or business termination. Then, the necessary termination processing is started.

As shown in FIG. 3A, the main control unit 21 outputs a prize ball counting signal indicating the payout operation of the game ball, a status signal CON related to an abnormality in the payout operation, and an operation start signal BGN from the payout control unit 25. I'm receiving. The status signal CON includes, for example, a supply shortage signal, a payout shortage error signal, and a lower plate full signal. The operation start signal BGN is a signal for notifying the main control unit 21 that the initial operation of the payout control unit 25 is completed after the power is turned on.

Further, the main control unit 21 receives the switch signal of the detection switch built in each of the winning openings 16 to 18 on the game board, while driving solenoids such as electric tulips. The solenoids and the detection switch are configured to operate at the power supply voltage VB (12V) distributed from the main control unit 21. Further, each switch signal indicating the winning state of the symbol start port 15 is converted into a TTL level or CMOS level switch signal by an interface IC operating at a power supply voltage VB (12V) and a power supply voltage Vcc (5V). After that, it is transmitted to the main control unit 21.

As described above, the effect interface board 22 receives each level of DC voltage (5V, 12V, 35V) from the power supply board 20 via the centralized connector C2 (FIGS. 3A and 3A). 13 (a)). The DC voltage of 12V is a power supply voltage for the digital amplifier 29 and is used as a driving voltage for LED lamps and the like. Further, the DC voltage 35V is used as a driving voltage of a solenoid that reciprocates a moving object by being distributed at an appropriate position in the game frame.

On the other hand, the DC voltage of 5V is supplied as the power supply voltage of the circuit elements of the effect interface board 22 and is supplied to the two DC / DC converters DC1 and DC2 to generate 3.3V and 1.0V (). See FIG. 13 (a)). The generated DC voltages of 3.3 V and 1.0 V are supplied to the voice processor 27 as power supply voltages for I / O (input / output) and chip core, respectively. Further, the DC voltage 3.3V becomes the basic voltage of the power supply reset signal RT4 generated by the reset circuit RST4.

The DC voltage of 5V distributed on the effect interface board 22 is distributed to the effect control board 23 together with 3.3V generated by the DC / DC converter DC1. Then, the DC voltage 3.3V distributed on the effect control board 23 is supplied to the composite chip 50, the PROM 53, and the CGROM 55 as a power supply voltage.

As shown in FIG. 13A, two DC / DC converters DC3 and DC4 are arranged on the effect control board 23, and 1.5V and 1.05V are based on the DC voltage 5V supplied to each. Is being generated. Here, the DC voltage of 1.05 V is the power supply voltage for the chip core of the composite chip 50, and the DC voltage of 1.5 V is the power supply voltage for I / O (input / output) with the DRAM 54. Therefore, the DC voltage of 1.5 V is also supplied to the DRAM 54 as a power supply voltage.

As shown in FIG. 3A, the effect interface board 22 receives the control command CMD and the strobe signal STB from the main control unit 21 and transfers them to the effect control board 23. More specifically, as shown in FIG. 13A, the control command CMD and the strobe signal STB are transferred to the composite chip 50 (CPU circuit 51) of the effect control board 23 via the input buffer 40. .. Here, the strobe signal STB is the reception interrupt signal IRQ_CMD, and the effect control CPU 63 acquires the control command CMD based on the interrupt processing program (interrupt handler) that is activated in response to the reception interrupt signal IRQ_CMD.

As shown in FIG. 13A, the input buffer 44 of the effect interface board 22 receives the switch signals of the chance button 11 and the volume switch VLSW from the frame relay board 36, and outputs each switch signal to the CPU circuit 51 of the effect control board 23. Is transmitting to. Specifically, a 3-bit length of the encoder output indicating the contact position (0 to 7) of the volume switch VLSW and a 1-bit length indicating the ON / OFF state of the chance button 11 are transmitted to the CPU circuit 51.

Further, the lamp drive board 30 and the motor / lamp drive board 31 are connected to the effect interface board 22, and are also connected to the motor / lamp drive board 37 via the frame relay board 36. As shown in the figure, the output buffer 42 is arranged corresponding to the lamp drive board 30, and the input buffer 43a and the output buffer 43b are arranged corresponding to the motor / lamp drive board 31. In FIG. 4A, for convenience, the input buffer 43a and the output buffer 43b are collectively referred to as an input / output buffer 43. The input buffer 43a receives the outputs SN0 to SNn of the origin sensor that grasps the current position (rotational position of the effect motors M1 to Mn) of the accessory that is the movable effect body, and transmits the output to the CPU circuit 51 of the effect control board 23. There is.

The same type of driver IC is mounted on the lamp drive board 30, the motor / lamp drive board 31, and the motor / lamp drive board 37, and the effect interface board 22 receives a serial signal received from the effect control board 23. It is transferred to each driver IC. Specifically, the serial signal is a lamp (motor) drive signal SDATA and a clock signal CK, and the drive signal SDATA is transmitted to each driver IC by a clock synchronization method, and a large number of LED lamps and illuminated lamps are used for lamp production. , The effect effect is executed by the effect motors M1 to Mn.

In the case of this embodiment, the lamp effect is executed by the three lamp groups CH0 to CH2, and the motor / lamp drive board 37 clocks the lamp drive signal SDATA0 of CH0 via the frame relay board 36. Received in synchronization with signal CK0. The lamp drive signal SDATA0 transmitted as a serial signal is output from the driver IC to the lamp group CH0 at the timing when the operation control signal ENABLE0 changes to the active level, so that the lighting state is updated all at once.

The above points are the same for the lamp drive board 30, and the driver IC of the lamp drive board 30 receives the lamp drive signal SDATA1 of the lamp group CH1 in synchronization with the clock signal CK1, and the operation control signal ENABLE1 is at the active level. At the timing of the change to, the lighting state of the lamp group CH1 is updated all at once.

On the other hand, the driver IC mounted on the motor / lamp drive board 31 receives the lamp drive signal transmitted in the clock synchronous manner to drive the lamp group CH2, and also receives the motor drive signal transmitted in the clock synchronous manner. , Drives effect motor groups M1 to Mn composed of a plurality of stepping motors. The lamp drive signal and the motor drive signal are a series of serial signals SDATA2, which are serially transmitted in synchronization with the clock signal CK1, and the driver IC that receives the serial signal is the timing at which the operation control signal ENABLE2 changes to the active level. Then, the drive states of the lamp group CH2 and the motor groups M1 to Mn are updated.

Subsequently, the voice circuit SND will be described. As shown in FIG. 13A, the effect interface board 22 includes a voice processor (speech synthesis circuit) 27 that reproduces a voice signal based on an instruction received from the CPU circuit 51 (effect control CPU 63) of the effect control board 23. , A voice memory 28 that stores compressed voice data that is the original data of the voice signal to be reproduced, and a digital amplifier 29 that receives a voice signal output from the voice processor 27 are mounted.

The voice processor 27 has a built-in WDT circuit that automatically resets the set value of the internal circuit to a default value (initial value) when the internal circuit operates abnormally, and a voice control register SRG. Then, the voice processor 27 accesses the voice memory 28 based on the operation parameter (set value by the voice command) received from the effect control CPU 63 to the voice control register SRG, and reproduces and outputs the necessary voice signal. ..

As shown in FIG. 13A, the voice processor 27 and the voice memory 28 are connected by a voice address bus having a length of 26 bits and a voice data bus having a length of 16 bits. Therefore, the speech memory 28, data of 1Gbit ⁽⁼ 2 26 * 16) is capable of storing.

The voice control register SRG is divided into register banks 1 to register bank 6, and each is specified by a register number of 00H to FFH. Therefore, the predetermined setting operation is realized by specifying the register bank and then writing the operation parameter of 1 byte length to the voice control register SRG of the predetermined register number (1 byte length) by the effect control CPU 63. To.

In the case of this embodiment, the register numbers (00H to FFH) of the voice control register SRG correspond to the address space CS3 of the effect control CPU 63. For example, the operation parameter YYH is set in the voice control register SRG of the register number XXH. In this case, the effect control CPU 63 writes XXH to the zero address of the address space CS3, and then writes YYH to the first address. That is, the effect control CPU 63 writes XXH and YYH to the data bus in this order. In the present specification, the subscript H and the prefix of 0X / 0x indicate that the numerical value is displayed in hexadecimal.

Further, in the present specification, the address spaces CS0 to CS7 refer to the external memory for the CPU circuit 51, which can specify the memory type including the presence or absence of volatility and the data bus width (8/16/32 bits), respectively. Means (excluding internal memory). The address spaces CS0 to CS7 are selected by different chip select signals CS0 to CS7, and are configured to be configurable so that the READ / WRITE control signal functioning at the time of READ / WRITE access can be optimized according to the memory type. This setting operation is executed for the bus state controller 66.

FIG. 13E illustrates the setting operation of the effect control CPU 63 in the audio register SRG, and shows the contents of the 2-bit length address bus A1-A0 and the 1-byte length data bus D7-D0. There is. In this embodiment, the chip select signal CS3 is set at power-on so that it is automatically activated when accessing the address space CS3. This point will be described later with reference to FIGS. 15 and 21.

In any case, in the case of this embodiment, the compressed audio data stored in the audio memory 28 is phrase compressed data specified by the phrase number NUM (000H to 1FFFH) having a length of 13 bits, and is a series of backgrounds. one piece of music (BGM) and of music, and directing sound of unity people (notice sound), the highest 8192 type ^{(= 2 13),} respectively, are stored in response to the phrase number NUM. The phrase number NUM is specified by a set value (operation parameter) of a voice command transmitted from the effect control CPU 63 to the voice control register SRG of the voice processor 27.

As described above, the voice memory 28 having the above configuration is power-reset by the reset signal RT3, and the voice processor 27 is power-reset by the reset signal RT4. As shown in FIG. 13C, the reset signal RT4 rises to the H level after a predetermined assert period ASRT (L level section) after the power is turned on. In this embodiment, after that, the internal circuit of the voice processor 27 rises. Is configured to work automatically to perform the initialization sequence processing. Note that this initialization sequence processing is an internal operation executed by a predetermined procedure, and the effect control CPU 63 cannot access the audio register SRG during the operation of the initialization sequence processing.

Then, when the initialization sequence processing, which is an internal operation, is completed, the interrupt signal IRQ_SND for the CPU circuit 51 changes to the L level, and the CPU circuit 51 (effect control CPU 63) executes the interrupt processing program based on the interrupt signal IRQ_SND. Then, the interrupt signal IRQ_SND is returned to the H level based on a predetermined instruction, and the details thereof will be described later with reference to FIG. 23 (c).

As shown in FIG. 13A, the data bus and address bus of the CPU circuit 51 of the effect control unit 23 extend to the clock circuit (real time clock) 38 and the effect data memory 39 mounted on the liquid crystal interface board 24. I'm sorry. The clock circuit 38 is connected to the lower 4 bits of the address bus of the CPU circuit 51 and the lower 4 bits of the data bus. In the state where the clock circuit 38 is selected by the chip select signal CS4, the CPU circuit 51 has a (4 bit length). It is configured to allow arbitrary access to internal registers (which have an address value).

Further, the effect data memory 39 is a high-speed accessible memory element SRAM (Static Random Access Memory), which is connected to 16 bits of the address bus of the CPU circuit 51 and 16 bits of the lower 16 bits of the data bus, and is connected to the chip select signal CS4. In the state where the chip is selected in, the game record information and the like stored in the SRAM (effect data memory) 39 are appropriately R / W accessed from the CPU circuit 51. In the address space CS4 selected by the chip select signal CS4, addresses 0 to 15 are numbered in the clock circuit 38, and are not used in SRAM 39.

The clock circuit 38 and the effect data memory 39 are driven by a secondary battery (not shown), and the secondary battery is appropriately charged by the power supply voltage from the power supply board 20 during the game operation. Therefore, even after the power is cut off, the timekeeping operation of the clock circuit 38 is continued, and the game performance information stored in the effect data memory 39 is permanently stored and retained (nonvolatileity is imparted). The clock circuit (RTC) 38 is configured to be able to output an interrupt signal IRQ_RTC to the CPU circuit 51 (RTC interrupt). This RTC interrupt includes an alarm interrupt that can specify the day, day of the week, hour, minute, and second, and a timer interrupt that is activated after a predetermined time has elapsed. It utilizes an alarm interrupt that updates game performance information.

As shown on the right side of FIG. 13A, the effect control board 23 includes a composite chip 50 incorporating a CPU circuit 51 and a VDP circuit 52, a control memory (PROM) 53 for storing a control program of the CPU circuit 51, and a control memory (PROM) 53. A DRAM (Dynamic Random Access Memory) 54 capable of accessing a large amount of data at high speed and a CGROM 55 for storing a large amount of CG data required for effect control are mounted.

As will be described later with respect to FIG. 16, the control memory (PROM) 53 is positioned in the address space CS0 selected by the chip select signal CS0 in this embodiment. Further, the DRAM (Dynamic Random Access Memory) 54 composed of DDR (Double-Data-Rate 3) is positioned in the address space CS5 selected by the chip select signal CS5.

FIG. 14A is a circuit block diagram showing the composite chip 50 constituting the effect control unit 23, including related circuit elements. As shown in the figure, the composite chip 50 of the embodiment is driven by a CPU circuit 51 that issues a display list DL at predetermined time intervals and display devices DS1 and DS2 that generate image data based on the issued display list DL. The VDP circuit 52 is built-in. The CPU circuit 51 and the VDP circuit 52 are connected to each other through a CPUIF circuit 56 that relays transmission / reception data to each other.

The VDP circuit 52 has a built-in voice circuit SND that exhibits the same function as the voice processor 27, but the voice circuit SND is not used in the examples described below. However, if the voice circuit SND built in the VDP circuit 52 is utilized, the arrangement of the voice memory 28 and the voice processor 27 becomes unnecessary.

First, the CPU circuit 51 receives the oscillation output (for example, 100/3 MHz) of the oscillator OSC1 at the HCLKI terminal and multiplies it by frequency (for example, 8 times) to obtain a CPU operating clock of about 266.7 MHz. Here, the oscillator OSC1 is configured to output a spectrum diffused wave to take EMI (Electromagnetic Interference) measures to prevent radio interference / electromagnetic interference.

On the other hand, the VDP circuit 52 receives the oscillation output (for example, 40 MHz) of the oscillator OSC2 at the PLL REF terminal, multiplies the frequency appropriately by the PLL (Phase Locked Loop) circuit, and then uses the system clock of the VDP circuit 52 and the display device. It is used as a display clock (dot clock, etc.) and a DDR clock of the external DRAM 54. That is, the output of the oscillator OSC2 functions as a reference clock for the entire VDP circuit 52. The frequency multiplication ratio of the PLL circuit is defined by a set value for a predetermined setting terminal.

Therefore, in consideration of the importance of this reference clock, in this embodiment, the oscillator OSC2 is operated at the same power supply voltage of 3.3V as the VDP circuit 52, and the output enable terminal OE is at the H level (= 3.3V). It is configured to oscillate and output the reference clock on condition that there is. Then, in the unlikely event that the power supply voltage 3.3V drops below a predetermined level, normal production operation cannot be expected thereafter, so that an unmaskable interrupt (NMI) is configured to occur.

Further, the composite chip 50 is provided with an HBTSL terminal, and is the boot program (initial setting program) executed after the power is turned on (CPU reset) stored in the CGROM 55 based on the logic level of the HBTSL terminal (HBTSL)? = H) or whether it is stored in other memory (HBTSL = L) is specified. As shown in the figure, in this embodiment, HBTSL = L level is set, and the zero address of the address space CS0 of the effect control CPU 63 is assigned to other than the CGROM. Specifically, the address space CS0 is the control memory 53. Is assigned to.

On the other hand, when the HBTSL terminal = H level is set (see the broken line), the zero address of the address space CS0 of the effect control CPU 63 is assigned to the CGROM 55. In this case, the memory type of the CGROM 55 and the bus width (64/32/16 bit) are specified based on the input values to the HBTBWD terminal having a 2-bit length and the HBTRMSL terminal having a 4-bit length.

Subsequently, the CPU IF circuit 56 that relays transmission / reception data between the CPU circuit 51 and the VDP circuit 52 will be described. As shown in FIG. 14A, the CPUIF circuit 56 includes a control memory (PROM) 53 that non-volatilely stores a control program and necessary control data, and a work memory (RAM) 57 having a storage capacity of about 2 Mbytes. Are connected to each other and are configured to be accessible from the CPU circuit 51. As described above, the control memory (PROM) 53 is positioned in the address space CS0 selected by the chip select signal CS0, and the work memory (RAM) 57 is positioned in the address space CS6 selected by the chip select signal CS6. Has been done.

In the work memory (RAM) 57, a DL buffer BUF that temporarily stores a display list DL in which a series of instruction commands for specifying each frame of the display devices DS1 and DS2 are described is secured. In the case of this embodiment, a series of instruction commands include a texture load command such as a TXLOAD command for reading an image material (texture) from the CGROM 55 and decoding (expanding) it, and a VRAM area (index) of the decoding (expanding) destination. Texture setting commands such as the SET INDEX command, which have functions such as specifying the space in advance, and primitive drawing commands such as the SPRITE command for arranging the decoded (expanded) image material at a predetermined position in the virtual drawing space. , Of the images drawn in the virtual drawing space by drawing commands, environment setting commands such as the SETDAVR command and SETDAVF command for specifying the drawing area actually drawn on the display device, and the index table IDXTBL that manages the index space. Contains index table control commands (WRIDXTBL) for.

Note that FIG. 18C shows a virtual drawing space (horizontal X direction ± 8192: vertical Y direction ± 8192), a drawing area that can be arbitrarily set in the virtual drawing space, and outputs to the display devices DS1 and DS2. The relationship with the actual drawing area in the frame buffers FBa and FBb for primary storage of the image data to be performed is shown.

Next, the CPU circuit 51 is a circuit having the same performance as a general-purpose one-chip microcomputer, and when the effect control CPU 63 that comprehensively controls the image effect based on the control program of the control memory 53 and the program go into a runaway state. A watchdog timer (WDT) that forcibly resets the CPU, a built-in RAM 59 that has a storage capacity of about 16 kbytes and is used as a work area of the CPU, and a DMAC (Direct Memory Access) that realizes data transfer without going through the CPU 63. Controller) 60, a serial input / output port (SIO) 61 having a plurality of input ports Si and an output port So, a parallel input / output port (PIO) 62 having a plurality of input ports Pi and an output port Po, and each of the above parts. It is configured to have an operation control register REG or the like in which a set value is set to control the operation. However, in this embodiment provided with the external WDT circuit 58, the watchdog timer (WDT) built in the CPU circuit 51 is not utilized.

In this specification, the term “input / output port” is used for convenience, but in the effect control unit 23, the input / output port includes an input port and an output port that operate independently. This point is the same for the input / output circuit 64p and the input / output circuit 64s described below.

The parallel input / output port 62 is connected to an external device (effect interface board 22) through the input / output circuit 64p, and the production control CPU 63 has a chance with the encoder output 3 bits of the volume switch VLSW via the input circuit 64p. The switch signal of the button 11, the control command CMD, and the interrupt signal STB are received. The encoder output 3 bits and the switch signal 1 bit are supplied to the parallel input / output port (PIO) 62 via the input / output circuit 64p.

Similarly, the received control command CMD is supplied to the parallel input / output port (PIO) 62 via the input / output circuit 64p. Further, the strobe signal STB is supplied to the interrupt terminal of the effect control CPU 63 via the input / output circuit 64p to activate the reception interrupt processing. Therefore, the effect control CPU 63 that grasps the control command CMD based on the reception interrupt process uniformly controls the sound effect, the lamp effect, the motor effect, and the image effect corresponding to the control command CMD through the effect lottery and the like. Will be done.

Although not particularly limited, in this embodiment, the SMC unit (Serial Management Controller) 78 of the VDP circuit 52 is used for the lamp effect and the motor effect. The SMC unit 78 is a composite controller incorporating an LED controller and a Motor controller, and is configured to be able to output a serial signal by a clock synchronization method. Further, the Motor controller is configured to be able to output a latch pulse at an arbitrary timing based on a set value in a predetermined control register 70, and is configured to be able to input a serial signal by a clock synchronization method.

Therefore, in this embodiment, the motor drive signal and the LED drive signal are output from the SMC unit 78 in synchronization with the clock signal, while the latch pulse is output as the operation control signal ENABLE at an appropriate timing. .. Further, the origin sensor signals SN0 to SNn from the effect motor groups M1 to Mn are serially input by a clock synchronization method.

As described with respect to FIG. 13A, the clock signals CK0 to CK2, the drive signals SDATA0 to SDATA2, and the operation control signals ENABLE0 to ENABLE2 pass through the output buffers 41 to 43, and the predetermined drive boards 30, 31, It is transmitted to 37. Further, the origin sensor signals SN0 to SNn are serially input to the SMC unit 78 from the motor / lamp drive board 31 via the input / output buffer 43.

However, it is not essential to use the SMC unit 78 in this embodiment. That is, since the CPU circuit 51 has a built-in general-purpose serial input / output port SIO61, it is also possible to execute the lamp effect and the motor effect by using these.

Specifically, as shown by the broken line in FIG. 14A, in the configuration shown by the broken line, the clock signals CK0 to CK2, via the input / output circuit 64s internally connected to the serial input / output port SIO61, The drive signals SDATA0 to SDATA2 are output, and the operation control signals ENABLE0 to ENABLE2 are output via the input / output circuit 64p. For convenience, it is expressed as an input / output port or an input / output circuit, but what actually functions is an output port or an output circuit.

Here, the serial output port SO is configured to incorporate a 16-stage FIFO register. Then, the DMAC circuit 60 is activated in response to an operation start instruction (see ST18 in FIG. 26 (b)) from the effect control CPU 63, and the necessary drive data are ordered from the lamp / motor drive table (see FIG. 26 (b)). It is configured to read into the FIFO and transfer it to the FIFO register of the serial output port SO by DMA. The drive data stored in the FIFO register is serially output from the serial output port SO by the clock synchronization method. Although there are a plurality of (for example, 7) DMA channels in the DMAC circuit, the lamp drive data is DMA-transferred by the third DMA channel, which is inferior in priority, and the motor is driven by the first DMA channel, which has the highest priority. It is configured to transfer data by DMA.

The operation control register REG built in the CPU circuit 51 is an 8-bit, 16-bit, or 32-bit length register whose register number (address value) is numbered after 0xFF400000, and can be appropriately WRITE / READ accessible from the effect control CPU 63. (See FIG. 16). Therefore, there is a possibility that the operation control register REG is set to an unreasonable value due to the influence of noise or the like.

However, for example, the composite chip 50 can be abnormally reset by intentionally executing an infinite loop process to activate the external WDT circuit 58. In this case, the value of the operation control register REG is returned to the same default value (initial value) as after the power is turned on, and the value of the VDP register RGij is also returned to the default value (initial value) of the VDP circuit 52. This will eliminate the abnormal condition.

FIG. 13B is a drawing illustrating a circuit configuration related to this reset operation and a reset mechanism characteristic of the present embodiment. In this specification, the VDP register referred to as RGij is not the operation control register REG built in the CPU circuit 51, but any of the control register group 70 (see FIG. 16) that controls the internal operation of the VDP circuit 52. Means. Further, the system control circuit 520 shown in FIG. 13B means an internal control circuit of the VDP circuit 52 that functions based on a set value in the VDP register RGij (any of the control register group 70 in FIG. 16). (See FIG. 14 (a)). The VDP register RGij is positioned in the address space CS7 selected by the chip select signal CS7 in the address map of the effect control CPU 63.

Explaining the reset mechanism based on the above, as shown in FIG. 13B, the composite chip 50 has an internal circuit via three OR gates G2 to G4 that receive the logically inverted system reset signal SYS bar. Is configured to be resettable. However, in this embodiment, as shown by the broken line, the built-in WDT is not enabled, so that the input terminal and the output terminal of the OR gate G2 are directly connected.

In any case, a pattern check circuit CHK is provided between the CPU circuit 51 and the VDP circuit 52, and the pattern check circuit CHK is a predetermined keyword string (a code string for resetting) from the parallel input / output port (PIO) 62. ) Is received, and the reset signal RST is output.

The internal circuit of the composite chip 50 is divided into (1) a CPU circuit 51, (2) a display circuit 74 of the VDP circuit 52, and (3) a display circuit other than the display circuit of the VDP circuit 52. It is configured to receive the reset signals of the first reset path to the third reset path from the gates G2 to G4.

First, the OR gate G2 in which the input / output terminals are directly connected is related to the first reset path, and is configured to system reset the entire CPU circuit 51 based on the system reset signal SYS bar. Further, the OR gate G3 is related to the second reset path, and can reset the entire VDP circuit 52 based on the OR logic by receiving the system reset signal SYS bar and the reset signal RST from the pattern check circuit CHK. It is configured in.

This second reset path is used not only for the power reset operation when the power is turned on, but also for the effect control CPU 63 that has detected a predetermined abnormality to reset the entire VDP circuit 52 to the initial state. Specifically, when it is determined that a serious abnormality has occurred based on the predetermined status register RGij indicating the internal operation of the VDP circuit 52, a reset signal RST is generated from the pattern check circuit CHK. , The entire VDP circuit 52 is abnormally reset. The display circuit 74 is abnormally reset in the second reset path → the third reset path via the OR gate G4.

On the other hand, the internal circuit built in the VDP circuit 52 is configured to be individually reset when necessary in the fourth reset path. The internal circuits that can be reset individually include the index table IDXTBL shown in FIG. 14A, the data transfer circuit 72, the preloader 73, the display circuit 74, the drawing circuit 76, the SMC circuit 78, the audio circuit SND, and the drawings. The ICM circuit shown in 19 is included.

The method for realizing the individual reset operation is as described in the lower part of FIG. 13B. For example, the display circuit 74 writes the first reset value to a predetermined VDP register RGij (system command register). As a result, the system is reset via the fourth reset path 4A → the third reset path.

Further, each internal circuit (72, 73, 74, 76, SND, ...) Of the VDP circuit 52 sets (1) a set value for specifying the target circuit in the first VDP register RGij (reset RQ register). After writing, (2) the second reset value is written to the predetermined VDP register RGij (system command register), so that the reset values are individually reset (fourth reset path 4B). Although not used in this embodiment, the audio circuit SND can be reset not only by resetting by the fourth reset path 4B but also by writing a reset value to a predetermined VDP register (circuit setting command register) (No. 1). 4 Reset path 4C).

Since this embodiment has the above configuration, not only the entire VDP circuit 52 automatically returns to the initial state when the power is turned on or the program runs out of control, but also each part is returned to the initial state as necessary to cause an abnormal situation. Can be recovered. For example, when the drawing circuit 76 has no READ / WRITE access to the built-in VRAM 71 for a certain period of time, the drawing circuit 76 is individually initialized via the fourth reset path 4B (FIG. 26 (d)). See ST16a). The same applies to the preloader 73 and the data transfer circuit 72. In the event of a predetermined abnormality, the preloader 73 is initialized via the fourth reset path 4B (see ST27 in FIG. 25) and via the fourth reset path 4B. Then, the data transfer circuit 72 is initialized (see ST27 in FIGS. 20 and 25).

Further, regarding the display circuit 74, when the underrun abnormality in which the display data is not generated in time continues at the display timing every 1/60 second, the fourth reset path 4A or the fourth reset path 4B is used. Via this, the display circuit 74 is individually initialized (see ST10c in FIG. 26).

The reset mechanism characteristic of this embodiment has been described above. However, when any of the reset paths 1 to 4 functions and the internal circuit of the composite chip 50 is reset, the VDP register RGIj corresponding to the internal circuit is reset. The set value of is returned to the same default value as after the power was turned on.

Subsequently, the process returns to the internal configuration of the CPU circuit 51, and the description of the characteristic circuit configuration will be continued. FIG. 15 is a block diagram showing the internal configuration of the CPU circuit 51 in a little more detail. The CPU circuit 51 includes many characteristic circuits other than the built-in RAM 59, the DMAC circuit 60, the SIO61, the PIO62, and the WDT described above.

First, the CPU circuit 51 realizes a Harvard architecture by separately having a CPU fetch bus for instructions and a CPU memory access bus for data. Therefore, the fetch operation in which the CPU core (effect control CPU) 63 reads the instruction from the memory does not conflict with the memory access operation, and high-speed processing is realized by continuing the fetch operation.

Further, the CPU core 63 is configured to have a plurality of (for example, 15) register banks RB0 to RB14, and is configured to be able to select whether or not to use the register banks RB0 to RB14. Then, in the operating state in which the use of the register bank RBi is permitted, the register values (each 32 bit length) of the CPU's built-in registers (for example, 19) are automatically saved to the free register bank RBi at the start of interrupt processing. Will be done.

Further, when a predetermined return instruction is executed at the end of interrupt processing, for example, 19 saved data are automatically returned to the corresponding built-in registers. Therefore, unlike a normal configuration, it is not necessary to execute the PUSH instruction 19 times at the start of interrupt processing and the POP instruction 19 times at the end of interrupt processing, and high-speed processing is realized.

Further, the CPU circuit 51 of the embodiment realizes a Harvard cache operation by providing an instruction cache memory 67, an operand cache memory 89, and a cache controller 69, and has been cached when accessing the same address. We are trying to further speed up the program processing by utilizing the data of. By providing the bus bridge 65, a controller for the peripheral bus (1), a controller for the peripheral bus (2), and a controller for the peripheral bus (3), the internal bus and the peripheral bus (1) are provided. ), Peripheral bus (2), and peripheral bus (3) are connected as appropriate.

Next, in the circuit configuration of FIG. 15, the bus state controller 66 operates based on an appropriate set value in the operation control register REG, and performs a memory READ operation and a memory with various memory devices connected to the CPU circuit 51. This is the part that optimizes the WRITE operation. The memory READ operation and the memory WRITE operation are executed at the operation timing illustrated in FIG. 27, for example, but the address data output from the address bus (28Bit), the READ data read to the READ data bus (32Bit), and the READ data read to the READ data bus (32Bit) The operation timing of the WRITE data written to the WRITE data bus (32Bit) and the control signals such as the chip select signals CS0 to CS7 corresponds to the characteristics of each memory device based on the set value in the operation control register REG. It is specified as appropriate.

Since the READ data bus and the WRITE data bus are provided separately, high-speed operation by the Harvard architecture described above is realized. In this specification, the address bus (28Bit), the READ data bus (32Bit), and the WRITE data bus (32Bit) include the internal bus shown in FIG. 15, peripheral buses (1) to peripheral buses (3), and the like. In the sense of distinguishing from, it may be collectively referred to as an external bus.

FIG. 16 illustrates the address spaces CS0 to CS7 selected by the chip select signals CS0 to CS7, and illustrates an address map for the effect control CPU 63 accessed via the bus state controller 66. .. First, each of the address spaces CS0 to CS7 is defined to have a maximum of 64 Mbytes (= 0x4000000H = 67108864).

As described above, the address spaces CS0 to CS7 mean an external memory for the CPU circuit 51 that can specify the memory type including the presence or absence of volatile and the data bus width (8/16/32 bits), respectively. To do. Then, in this embodiment, as shown in FIGS. 15B and 16, the control memory (PROM) 53 is the address space CS0, the voice control register SRG of the voice processor 27 is the address space CS3, and the internal register of the clock circuit 38. The SRAM 39 is located in the address space CS4, the external DRAM (DDR) 54 is located in the address space CS5, the work memory 57 is located in the address space CS6, and the VDP register RGij is located in the address space CS7. The description of the address spaces CS1 and CS2 will be omitted.

By the way, as confirmed from FIG. 16, the address spaces CS0 to CS7 are secured not only in the address values 0x00000000 to 0x1FFFFFFFF (cache valid space) but also in the address values 0x20000000 to 0x3FFFFFFF (cache invalid space). When the address bit A29 = 1, the cache is invalidated based on the internal operation of the CPU circuit 51, while when the address bit A29 = 0, the cache is enabled, so that the utilization of the cache function can be arbitrarily selected. It is something like that.

Therefore, in this embodiment, among all 32 bits of address information (bits A31 to A0), regardless of whether the value of bit A29 is 1 or 0, the remaining 31 bits (bits A31 to A30 and bits A28 to A0) remain. If the values are the same, it indicates the same address in the same memory. For example, the same data is read from the zero address of the work memory 57 regardless of whether the address 0x18000000 is READ-accessed or the address 0x38000000 is READ-accessed. When address 0x18000000 is READ-accessed, the read data is saved in the cache, but FIG. 15B illustrates the cache valid / invalid access operation.

However, the cache operation of the instruction cache and / or the operand cache can be invalidated based on the value set in the predetermined operation control register REG. However, in this embodiment, after the power is turned on, the cache operation is invalidated by enabling the cache operation for the instruction cache and the operand cache and then accessing the cache invalid space as necessary.

Continuing the description of the memory map of FIG. 16, after address 0x40000000, the bus state controller 66 is an internal memory space in which the bus state controller 66 does not function, and addresses 0xF0000000 to 0xFF3FFFFF are allocated to the address array space of the cache. Further, addresses 0xFF400000 to 0xFFFF7FFFF and addresses 0xFFFC0000 to 0xFFFFFFFF are assigned to the built-in peripheral module, and specifically, are assigned to the operation control register REG of the CPU circuit. The address range of the built-in RAM 59 is 0xFFF80000 to 0xFFFBFFFF.

Continuing the description of the internal configuration of the CPU circuit 51, the compare match timer CMT and the multifunction timer unit MTU count the external signals supplied to the CPU circuit 51, or multiply or divide the internal clock. It is a circuit that counts clocks and generates an interrupt signal or the like when the count result reaches a predetermined value. Although not particularly limited, in this embodiment, the multifunction timer unit MTU is utilized to generate a 1 mS interrupt signal and a 20 μS interrupt signal.

Next, the interrupt controller INTC receives internal interrupts from the VDP circuit 52, DMAC circuit 60, multifunction timer unit MTU, etc., and external interrupts such as IRQ_CMD, IRQ_SND, and IRQ_RCT, and is based on a predetermined priority. This is a circuit that activates interrupt processing (interrupt handler). Here, IRQ_CMD is a command reception interrupt signal for receiving the control command CMD, IRQ_SND is an end interrupt signal indicating that the voice processor 27 has completed the initialization sequence, and IRQ_RCT is an alarm interrupt signal.

In this embodiment, the command reception interrupt IRQ_CMD has the highest interrupt priority. Hereinafter, 20 μS interrupt → 1 mS interrupt → interrupt from the VDP circuit (IRQ0, IRQ1, IRQ2, IRQ3) → DMAC interrupt → IRQ_SND → The order is IRQ_RCT (see Fig. 23 (d)). All of these are maskable interrupts, and the non-maskable interrupt NMI is output to the effect control CPU 63 when the reference clock is not output from the oscillator OSC2, as described above.

Then, in any interrupt processing, the register values (each 32-bit length) of the plurality of built-in registers of the CPU are automatically saved in any of the free register banks RBi. Then, when a predetermined return instruction is executed at the end of the interrupt processing, the saved data is automatically returned to the corresponding built-in register.

Subsequently, the DMAC circuit 60 will be described. The DMAC circuit 60 of the embodiment is set for each predetermined data transfer unit in a predetermined DMA transfer mode from the transfer source (Source) to the transfer destination (Destination) based on the set value in the predetermined operation control register REG. In addition, it is a circuit that repeats data transfer a predetermined number of times. A plurality of channels DMAC0 to DMACn having the same internal configuration are prepared and can be operated in parallel. However, the priority is fixed (channel 0 >> ...> channel n), and when the channel arbitration operation mode is operated in parallel, the operation of the DMACi having a high priority is prioritized by the channel arbitration at a predetermined timing.

As for the utilization of the DMAC circuit 60, for example, in the embodiment in which the serial output port SO functions (see the broken line portion in FIG. 16A), the operation control register REG of the CPU circuit 51 has the start address of the lamp / motor drive table. (Starting value of transfer source address), address of input register of serial output port SO (fixed value of transfer destination address), data transfer unit (8 bits), and number of transfers are specified. Then, the DMAC circuit 60, which has received the operation start instruction in the predetermined operation control register REG, transfers the drive data to the predetermined transfer destination address by DMA while updating the transfer source address. Then, when all the DMA transfers are completed, a DMAC interrupt (operation end interrupt) is configured to occur.

This point is almost the same in the case of the embodiment (FIGS. 21 and 25 (c)) in which the DMAC circuit 60 issues the display list DL. That is, the effect control CPU 63 sets the start address of the transfer source (DL buffer BUF), the address of the transfer destination (transfer port TR_PORT), the DMA transfer mode, and the data transfer unit in the predetermined operation control register REG of the CPU circuit 51. , The number of transfers and other conditions will be set. These points will be described later with reference to FIG.

By the way, in general, the DMA transfer mode includes a cycle steal transfer mode in which the DMA operation does not occupy the memory bus, such as releasing the bus control right in the middle of the unit operation (R operation / W operation) of the DMA transfer, and a plurality of Rs. Between the burst transfer (pipeline transfer) mode in which the bus control right is not released until the specified number of transfers is completed, such as continuous operation and W operation, and the DMA transfer request (demand) received from another device is active. A demand transfer mode that continues the DMA operation can be considered. However, the DMAC circuit 60 of this embodiment functions in the cycle stealing transfer mode in which a memory release period of at least one cycle is provided between the read access activation (R operation) and the write access activation (W operation) at the time of DMA transfer. By doing so, the operation of the effect control CPU 63 is not hindered.

FIG. 17 is a drawing illustrating a cycle steal transfer operation (a1) and a pipeline transfer (a2). As shown in FIG. 17 (a1), the DMAC circuit 60 functioning in the cycle stealing transfer mode operates with at least one cycle between the read access activation (R) and the write access activation (W) of one data transfer. In this vacant cycle, the bus of the effect control CPU 63 can be used. As is clear from the contrasting relationship between FIGS. 17 (a1) and 17 (a2), in pipeline transfer, the bus is not opened to the CPU until one cycle (one operand transfer) is completed, whereas cycle stealing is performed. In the transfer mode, the bus is opened to the CPU for each read access, so that the operation of the CPU is not significantly delayed.

Then, for example, in the embodiment in which the DMAC circuit 60 is used when the display list DL is issued to the VDP circuit 52, the data transfer unit (1 operand) for one cycle is set to 32 × 2 bits, and the display list DL is stored. While appropriately increasing the source address of the built-in RAM 59 (+8 for each operand transfer), the DMA transfer operation is performed for the transfer port register TR_PORT (see FIG. 19) of the data transfer circuit 72 specified by the fixed address. Is running.

As will be described later, in the embodiment, by adding the required number of NOP (no operation) commands to the display list DL, the total data size is set to a fixed value (for example, 4 × 64 = 256 bytes or an integer thereof). The display list DL is issued by repeating 32 bits × 2 times of one operand transfer 32 times (or an integral multiple thereof). Even if the drawing circuit 76 executes the NOP command, virtually no change occurs.

Further, when the operation modes are classified with respect to the DMA transfer conditions, generally, single operand transfer (see FIG. 17 (b1)), continuous operand transfer (see FIG. 17 (b2)), and non-stop transfer (see FIG. 17 (b3)). See).

Here, the single operand transfer means, as shown in FIG. 17 (b1), when the byte count for counting the number of transferred bytes becomes zero by repeating the transfer of one operand each time a DMA transfer request is given. This means an operation mode in which a DMA interrupt request is generated. Next, the continuous operand transfer means an operation mode in which the DMA transfer is repeated until the byte count becomes zero with one DMA request, as shown in FIG. 17 (b2).

In these continuous operand transfer (b2) and single operand transfer (b1), channel arbitration is performed every time one operand transfer is completed, and the current channel is provided on the condition that there is no DMA request for the channel with high priority. Transfer is continued (channel arbitration operation mode). Therefore, in this embodiment, a single operand transfer method is adopted for issuing the display list DL to the VDP circuit and for DMA transfer of lamp drive data and motor drive data. Then, during parallel operation, for example, DMACi of the optimum channel is used so that the channel arbitration of the priority of motor data> display list DL> lamp data.

On the other hand, non-stop transfer is an operation mode in which channel arbitration is not executed, and as shown in FIG. 17 (b3), DMA transfer is continuously repeated until the byte count becomes zero with one DMA request. Is done. In this embodiment, in the memory section initialization process (SP8 in FIG. 21) when the power is turned on, the program or data is DMA-transferred by non-stop transfer.

Since the CPU circuit 51 has been described above, the VDP circuit 52 will be described next. The VDP circuit 52 includes a CGROM 55 that stores compressed data that is a component of a still image or a moving image that constitutes an image effect, and about 4 Gbit. An external DRAM (Dynamic Random Access Memory) 54 having a storage capacity of the above, a main display device DS1 and a sub display device DS2 are connected to each other. The DRAM 54 is preferably composed of DDR3 (Double-Data-Rate3 SDRAM).

Although not particularly limited, in this embodiment, the CGROM 55 is composed of a flash SSD (solid state drive) composed of a NAND flash memory having a storage capacity of about 62 Gbit, and is compressed data required for serial transmission. Is configured to get. Therefore, the problem of skew (difference in transmission speed for each bit data) that inevitably occurs in parallel transmission is solved, and extremely high-speed transmission operation becomes possible. Although not particularly limited, in this embodiment, the CGROM 55 is accessed at high speed by the HSS (High Speed Serial) method conforming to Serial ATA.

Regardless of whether or not the HSS method conforming to SerialATA is adopted, the NAND type flash memory is mechanically more stable than the hard disk and can be accessed at high speed, but is a sequential access memory. Compared to DRAM and SRAM (Static Random Access Memory), there is a problem with random accessibility. Therefore, in this embodiment, by executing a preload operation in which a group of compressed data (CG data) is read out to the DRAM 54 prior to the drawing operation, smooth random access of the CG data during the drawing operation is realized. ing. By the way, the access speed becomes slower in the order of internal VRAM> external DRAM> CGROM.

In detail, the VDP circuit 52 includes a control register group 70 in which various operation parameters defining the operation of the VDP (Video Display Processor) can be set by the effect control CPU 63, and image data to be displayed on the display devices DS1 and DS2. Regarding the built-in VRAM (video RAM) 71 of about 48 Mbytes used at the time of generation, the data transfer circuit 72 that executes data transmission / reception between each part inside the chip and data transmission / reception with the outside of the chip, and the built-in VRAM 71, the Source and Destination An index table IDXTBL that can specify address information, a preloader 73 that can execute a preload operation that READ-accesses the CGROM 55 prior to the drawing operation, and a graphics decoder that decodes (decodes / decompresses / expands) the compressed data read from the CGROM 55. (GDEC) 75, the drawing circuit 76 that generates image data for each frame of the display devices DS1 and DS2 by appropriately combining the still image data and the moving image data after decoding (decompression), and the operation of the drawing circuit 76. As a part, three systems that can read the image data of the frame buffers FBa and FBb generated by the geometry engine 77 that generates a stereoscopic image by appropriate coordinate conversion and the drawing circuit 76 and execute appropriate image processing in parallel. (A / B / C) display circuits 74A to 74C, an output selection unit 79 that appropriately selects and outputs the outputs of the three systems (A / B / C) display circuits 74, and an image output by the output selection unit 79. The LVDS unit 80 that converts data into an LVDS signal, the SMC unit 78 that can transmit and receive serial data, the CPUIF unit 81 that relays data transmission and reception between the CPUIF circuit 56, and the CG bus IF unit 82 that relays data reception from the CGROM 55. A DRAMIF unit 83 that relays data transmission / reception with the external DRAM 54, and a VRAMIF unit 84 that relays data transmission / reception with the built-in VRAM 71. The audio circuit SND is also built-in.

FIG. 14B shows the relationship between the CPU IF unit 81, the CG bus IF unit 82, the DRAM IF unit 83, and the VRAM IF unit 84, and the control register group 70, the CGROM 55, the DRAM 54, and the built-in VRAM 71. As shown in the figure, the CG data acquired from the CGROM 55 is transferred as preload data to the preload area of the external DRAM 54 via the data transfer circuit 72 and the DRAMIF unit 83, for example.

However, the above-mentioned preload operation is not an essential operation, and the data transfer destination is not limited to the external DRAM 54 and may be the built-in VRAM 71. Therefore, for example, in the embodiment in which the preload operation is not executed, the CG data is transferred to the built-in VRAM 71 via the data transfer circuit 72 and the VRAM IF unit 84 (FIG. 14 (b)).

By the way, in this embodiment, the built-in VRAM 71 stores image data for specifying the expansion area of the compressed data read from the CGROM 55 and each ARGB information (32 bits = 8 × 4) of W × H display pixels of the display device. A frame buffer area to be used, a Z buffer area for storing depth information of each display pixel, and the like are required. In the ARGB information, A means 8-bit α-plane data, and RGB means 8-bit data of the three primary colors.

Here, each of the above-mentioned areas of the built-in VRAM 71 is indirectly accessed by the effect control CPU 63 based on various instruction commands (such as the above-mentioned texture and SPRITE) described in the display list DL, and the READ / WRITE access thereof. In, it is complicated to specify the destination address and the source address of the built-in VRAM 71 one by one. Therefore, in this embodiment, in the initial processing after the CPU reset, a one-dimensional or two-dimensional logical address space (hereinafter referred to as an index space) required for the drawing operation is secured, and an index number is assigned to each index space. By doing so, access based on the index number is possible.

Specifically, after the CPU is reset, the built-in VRAM 71 is roughly divided into three types of memory areas, and a required number of index spaces are secured in each memory area. Then, by constructing the index table IDXTBL (see FIG. 18A) that stores the index space and the index number in association with each other, the subsequent operation based on the index number is realized.

This index space needs to be (1) added after the initial processing, and conversely (2) opened. Therefore, a flag capable of determining whether or not the addition / release processing is possible, and whether or not the addition / release processing is actually completed during the operation of the addition / release effect control CPU 63, etc. The area FG is provided in the index table IDXTBL. The built-in VRAM 71 is roughly divided into three types of memory areas, two AAC areas (a1 and a2), a page area (b), and an arbitrary area (c), which will be described below, and these three types of memory areas. The index table IDXTBL is divided into three categories according to (a1, a2), (b), and (c) (FIG. 18 (a)). As shown in the figure, in this embodiment, the first AAC region (a1) and the second AAC region (a2) are secured as the AAC region (a), but the region is not particularly limited and only one of them is used. But it's okay. In the following description, when the first and second AAC regions (a1, a2) are collectively referred to, they may be referred to as the AAC region (a).

In the case of this embodiment, the built-in VRAM 71 has (a) an AAC area in which an index space and its index number are automatically assigned by internal processing and has a memory cache function, and (b) a two-dimensional space of, for example, 4096 bits × 128 lines. The unit space can be divided into a page area in which an index space can be secured in the range of an integral multiple of the page area, and (c) an arbitrary area in which the start address (space start address) STx and the horizontal size Hx can be arbitrarily set. (See FIG. 18 (b)). However, in order to facilitate the internal operation of the VDP circuit 52, the space start address STx of the index space arbitrarily set in the arbitrary area (c) has a lower 11 bits of 0 and a predetermined bit (2048 bits = 256 bytes). Must be a unit.

Then, after the CPU is reset, the maximum value of the address space required for each and the area start address (lower 11 bits = 0) are defined, and the AAC area (a1), the second AAC area (a2), and the page area ( b) is secured, and the remaining memory area becomes an arbitrary area (c). In order to facilitate the internal operation of the VDP circuit 52, the maximum value of the address space in the AAC area is defined in units of 2048 bits, and the maximum value of the address space in the page area is an integral multiple of the unit space of the above-mentioned 4096 bits × 128 lines. It is said that.

Next, the required number of index spaces are set in each of the areas (a1, a2) (b) (c) secured in this way. When the arbitrary area (c) is used, the horizontal size Hx of the index space for handling two-dimensional data can be arbitrarily set as a multiple of 256 bits in order to facilitate the internal operation of the VDP circuit 52. Its vertical size is a fixed value (eg, 2048 lines).

In any case, the index space and index number are automatically assigned to the first and second AAC regions (a1, a2) by the VDP circuit 52. Therefore, for example, the SETINDEX command of the texture setting command can be used. If the decoding destination is specified in the AAC area (a), the TXLOAD (texture load) command that reads CG data from the CGROM55 only needs to specify the Source address of the CGROM55 and the horizontal / vertical size after expansion (decoding). It will be. Therefore, in this embodiment, the decoding destination of the still image (texture) such as a character that temporarily appears at the time of the advance notice production or the I-stream moving image is set to the AAC area (a).

Since the memory cache function is added to each of the AAC areas (a), for example, when the same texture of the CGROM 55 is read into the AAC area (a) multiple times, the second and subsequent times are performed. The decoded data cached in the AAC area (a) can be utilized, and extra READ access and decoding processing can be suppressed. However, when the AAC area (a) is used up, old data is automatically destroyed. Therefore, in this embodiment, when the AAC area (a) is used, in principle, the first AAC area (a1) is used. It is decided to use it, and only a specific texture to be used repeatedly is acquired in the second AAC region (a2).

As the texture to be used repeatedly, for example, a character that repeatedly appears at the time of a predetermined advance notice effect, a background image when the background screen is constructed with a still image, and the like can be exemplified. In such a case, the SETINDEX command, which is a texture setting command, sets the decoding destination to the second AAC area (a2), and the TXLOAD command decodes the textures such as characters and background images to the second AAC area (a2). After that, the decoding result is protected by not using the second AAC region (a2).

Then, after that, if the decoding destination is specified in the second AAC area (a2) by the SETINDEX command and the same TXLOAD command for reacquiring the acquired texture is executed, the acquired texture will be cache hit. , READ access to CGROM55 and the time required for decoding processing can be deleted. As will be described later, such a cache hit function is also exhibited in the preload data read ahead in the preload area, but the cache hit preload data in the preload area is compressed data before decoding, whereas AAC. It is significant that the cache hit in the area is the expanded data after decoding.

By the way, texture is a concept that generally refers to the texture and texture of the surface of an object, but in the present specification, sprite image data that constitutes a still image, image data that constitutes one frame of a moving image, and the like. , It is used as a concept that includes not only image data to be pasted on drawing primitives such as triangles and squares, but also image data after decoding. Then, when copying the image data inside the built-in VRAM71 (hereinafter referred to as "move" for convenience), the move source image data is set as a texture by the SETINDEX command of the texture setting command, and then the SPRITE command. Will be executed.

By executing the SPRITE command, the source image data of the movement source is formally drawn in the virtual drawing space shown in FIG. 18C, but the drawing in the virtual drawing space actually drawn on the display device is performed. If the correspondence between the area and the index space that serves as the frame buffer is set in advance using environment setting commands (SETDAVR, SETDAVF) and texture setting commands (SETINDEX), for example, the SPRITE command can be used to create a virtual drawing space. By drawing, the source image data of the movement source is drawn in the predetermined index space (frame buffer) (see FIG. 18C).

In any case, in this embodiment, the built-in VRAM 71 is roughly divided into an AAC area (a1, a2), a page area (b), and an arbitrary area (c), and an appropriate number of index spaces are secured for each. Each index space is specified by an independent index number for each region (a) (b) (c). The index number is, for example, 1 byte long, and the page area (b) and the arbitrary area (c) (excluding the AAC area (a) automatically assigned by the internal circuit) are produced in the range of 0 to 255. The control CPU 63 can freely assign an index number.

Therefore, in this embodiment, as shown in FIG. 18A, a pair of frame buffers FBa are secured in the arbitrary area (c) for the display device DS1, and the index numbers 255 and 25 are used in both of the double buffer structures. 254 is given. That is, as the frame buffer FBa for the main display device DS1, the index space 255 and the index space 254 that are toggled and used are secured. Although not particularly limited, the index spaces 255 and 254 have a horizontal size of 1280 corresponding to the number of pixels in the horizontal direction of the display device DS1. Since each pixel is specified by ARGB information 32 bits, the horizontal size 1280 means 32 × 1280 = 40960 bits (a multiple of 256 bits).

Further, for the display device DS2, another pair of frame buffers FBb is secured in the arbitrary area (c), and index numbers 252 and 251 are assigned to both of the double buffer structures. That is, the index space 252 and the index space 251 are secured as the frame buffer FBb for the sub display device DS2. The index spaces 252 and 251 have a horizontal size of 480 corresponding to the number of pixels in the horizontal direction of the display device DS2. Also in this case, since each pixel is specified by the ARGB information 32 bits, the horizontal size 480 means 32 × 480 = 15360 bits (a multiple of 256 bits).

The frame buffers FBa and FBb are secured in the arbitrary area (c) by setting the arbitrary area (c) to an arbitrary horizontal size as a multiple of 32 bytes (= 256 bits = 8 pixels). This is because, as described above, if the number of horizontal pixels of the display devices DS1 and DS2 is matched, the reserved area is not wasted. On the other hand, in the page area (b), only the horizontal / vertical size that is an integral multiple of the unit space of 128 pixels × 128 lines can be set.

However, the vertical size of the two-dimensional index space secured in the arbitrary region (c) is a fixed value (for example, 2048 lines). Therefore, in the frame buffer FBa, only the area of horizontal size 1280 × vertical size 1024 becomes an effective data area for the main display device DS1. This point is the same for the sub-display device DS2, and in the frame buffer FBb, only the area of the horizontal size 480 × the hanging size 800 is the effective data area for the sub-display device DS2 (FIG. 18 (c), FIG. 26 (e)).

The above points will be further described later, but in any case, the frame buffers FBa and FBb alternately use double buffers (255/254 and 252/251) as drawing areas for the drawing circuit 76, and also. The double buffers (255/254, 252/251) are alternately used as the display area for the display circuits 74A and 74B. In this embodiment, since the Z buffer that stores the depth information of the display pixels is not used, a missing number (253) occurs. However, when the Z buffer is used, the index number 253,250 in the arbitrary area (c) The index space 253,250 serves as a Z buffer for the display device DS1 and the display device DS2.

Further, in this embodiment, when an additional index space (memory area) is secured in the arbitrary area (c) in which the frame buffers FBa and FBb are secured, an index number starting from 0 is assigned. .. Although not limited in any way, in the present embodiment, as a work area for a notice effect, an effect image composed of a character or other still images is made to appear on a part of the display screen in an appropriate rotation posture as needed. The index space (0) is secured in the arbitrary area (c).

However, the use of the work area is not essential, and instead of the arbitrary area (c), an index space as a work area may be secured in the page area (b). If the page area (b) is used, an index space having an index space that is a multiple of a square unit space having a horizontal size of 128 (= 4096 bits) and a vertical size of 128 can be secured, which is suitable for handling a small effect image.

By the way, in this embodiment, the image is composed of a moving image including a background image, and the image production is realized only by the moving image. In particular, a large number (usually 10 or more) of moving images are drawn at the same time during the variable effect. All of these videos are stored in the CGROM 55 in a compressed state as a series of video frames, but an I-stream video composed of only I-frames and an IP-stream video composed of I-frames and P-frames. It is divided into. Here, the I frame (Intra coded frame) means a frame that compresses the input image as it is, independently of other screens. On the other hand, the P frame (Predictive coded frame) means a frame for performing forward predictive coding, and an I frame or P frame located in the past in time is required.

Therefore, in this embodiment, the IP stream moving image is developed in the page area (b) instead of the AAC area (a) where there is a concern that the old data may be destroyed. _{That is, a large number of index spaces (IDX 0 to IDX N} ) are secured in the page area (b) in which an index space having a multiple dimension of horizontal size 128 × vertical size 128 can be secured, and a series of video frames are formed for each video. The same index space IDXi corresponding to MVi is always used for decoding. That is, the moving image MV1 is expanded in the index space IDX1, the moving image MV2 is expanded in the index space IDX2, and similarly, the moving image MVi is expanded in the index space IDXi.

More specifically, the moving image MVi will be described in more detail. The SETINDEX command specifies in advance that the decoding destination of the IP stream moving image MVi is the index space (i) of the index number i in the page area (b). The TXLOAD command for acquiring one frame of the IP stream video MVi video is executed.

Then, one video frame (any of a series of video frames) on the CGROM 55 specified by the TXLOAD command is first acquired in the AAC area (a), and then automatically activated by the GDEC (graphics decoder) 75. , One frame of the acquired video is decoded and expanded in the index space (i) of the page area (b).

On the other hand, in this embodiment, the I-stream moving image is treated in the same way as the still image, and the SETINDEX command is used to specify that "the decoding destination of the I-stream moving image MVj is the first AAC area (a1)". Execute the TXLOAD command. As a result, the moving image frame is acquired in the first AAC area (a1), and then the automatically activated GDEC75 develops the decoded data in the first ACC area (a1). As described above, the index space of the AAC area (a) is automatically generated, so it is not necessary to specify the index number. The expansion volume required for the index space, that is, the horizontal size and vertical size of the decoded texture (video frame), is TXLOAD regardless of whether the expansion destination is the AAC area (a) or the page area (b). Specified by the command.

By the way, the IP stream moving image MVi and the I stream moving image MVj are generally composed of N moving image frames (I frame and P frame). Therefore, in the TXLOAD command, for example, the Source address of the CGROM 55 in which the kth (1 ≦ k ≦ N) moving image frame is stored, the horizontal / vertical size after expansion, and the like are specified. Although not limited in any way, in the embodiment in which the still image is scarcely used, most of the address space of the built-in VRAM 71 (about 30 Mbytes) is allocated to the page area (b). Then, in the embodiment in which the still image is hardly used, only the first AAC region (a1) is secured as the AAC region, the second AAC region (a2) is not secured, and the cache hit function of the above-mentioned AAC region is secured. Do not utilize.

In addition, in order to speed up the decoding process of the compressed moving image data, it is conceivable to provide a dedicated GDEC (graphics decoder) circuit. Then, if a dedicated GDEC circuit is built in the VDP circuit 52, it is sufficient to indicate the start address of the video compressed data to the GDEC circuit in the decoding process of the compressed video data composed of N compressed video frames. It is not necessary to specify the start address for each of N compressed video frames.

However, if a plurality of such dedicated GDEC circuits are built in for each compression algorithm, the internal configuration of the VDP circuit 52 becomes more complicated. Therefore, in this embodiment, software GDEC is used, and decoding processing is realized for data such as IP stream moving image, I stream moving image, still image, and other α values by software processing corresponding to each compression algorithm. The processing time difference between the hardware processing and the software processing does not matter so much, and the processing time becomes a problem mainly in the access (READ) time from the CGROM 55.

Subsequently, returning to FIG. 14A and continuing the description, the data transfer circuit 72 uses a resource (storage medium) inside the VDP circuit and an external storage medium as a transfer source port or a transfer destination port between them. It is a circuit that executes a data transfer operation like DMA (Direct Memory Access). FIG. 19 is a block diagram showing the internal configuration of the data transfer circuit 72 together with the related circuit configurations.

As shown in FIG. 19, the data transfer circuit 72 is configured to transmit / receive data to / from the CGROM 55, the DRAM 54, and the built-in VRAM 71 via the integrated connection bus ICM having a router function. The CGROM 55 and the DRAM 54 are accessed via the CG bus IF unit 82 and the DMAMIF unit 83.

On the other hand, the CPU circuit 51 issues a display list DL to the drawing circuit 76 and the preloader 73 via the transfer port register TR_PORT built in the data transfer circuit 72. The CPU circuit 51 and the data transfer circuit 72 are connected in both directions, but when the display list DL is issued, the transfer port register TR_PORT serves as a data write port that accepts one unit of data constituting the display list DL. Function. The write unit (one unit data length) of the transfer port register TR_PORT is 32 bits corresponding to the FIFO structure of the CPU bus control unit 72d.

As shown in the figure, the effect control CPU 63 can access the transfer port register TR_PORT by WRITE via the CPUIF unit 81, while when the DMAC circuit 60 is utilized, the DMAC circuit 60 directly accesses the transfer port register TR_PORT. WRITE access will be made. A series of instruction commands (that is, instruction command sequences constituting the display list DL) written in the transfer port register TR_PORT is a CPU bus containing a FIFO buffer having a FIFO structure (32 bits x 130 stages) in units of 32 bits. It is configured to be automatically stored in the control unit 72d.

Further, the data transfer circuit 72 executes a data transmission / reception operation on a transmission path of 3 channels ChA to ChC, and has a FIFO buffer having a FIFO structure (64 bits × N stages) ChA control circuit 72a (N = 130). Stage), a ChB control circuit 72b (N = 1026 stages), and a ChC control circuit 72c (N = 130 stages).

Then, the instruction command sequence (display list DL) accumulated in the CPU bus control unit 72d is the drawing circuit 76 or the drawing circuit 76 based on the set value in the data transfer register RGij (a kind of various control registers 70) by the effect control CPU 63. It is transferred to the preloader 73. As shown by the arrows, the display list DL is transferred from the CPU bus control unit 72d to the drawing circuit 76 via the FIFO buffer of the ChB control circuit 72b, and transferred to the preloader 73 via the FIFO buffer of the ChC control circuit 72c. It is configured to be.

In this embodiment, the ChB control circuit 72b and the ChC control circuit 72b are specialized in the transfer operation of the display list DL, and the data stored in the FIFO buffer of the CPU bus control unit 72d is the ChB control circuit. It is transferred to the drawing circuit 76 or the display list analyzer (Display List Analyzer) of the preloader 73 as a part of the display list DL, respectively, via the 72b or the FIFO buffer of the ChC control circuit 72c.

Then, the drawing circuit 76 starts a drawing operation based on the transferred display list DL. On the other hand, the preloader 73 executes a necessary preload operation based on the transferred display list DL. The CG data of the CGROM 55 is pre-read in the preload area reserved in the DRAM 54 by the preload operation, and the display list DL (hereinafter referred to as the rewrite list DL') in which the source address of the texture is changed is secured in the DRAM 54 with respect to the TXLOAD command or the like. It is saved in the DL buffer area BUF'.

On the other hand, the ChA control circuit 72a and the connection bus access arbitration circuit 72e function for data transfer between storage media such as the CGROM 55, the DRAM 54, and the built-in VRAM 71. Further, the IDXTBL access arbitration circuit 72f functions when the built-in VRAM 71, which requires the address information of the index table IDXTBL, is accessed. Specifically, the ChA control circuit 72a may, for example, (a) transfer the compressed data of the CGROM 55 to the built-in VRAM 71, or (b) preload (pre-read) the compressed data of the CGROM 55 and transfer the compressed data to the external DRAM 54. In some cases, or (c) it functions when transferring the look-ahead data in the preload area to the built-in VRAM 71.

Here, the ChA control circuit 72a is configured to be operable in parallel with the ChB control circuit 72b and the ChC control circuit 72c, and the above-mentioned operations (a) to (c) are the display list DL issuance operations ( It can be executed in parallel with ST8 in FIG. 26, PT11 in FIG. 23) and the transfer operation of the rewrite list DL'(PT10 in FIG. 23). Further, the ChB control circuit 72b and the ChC control circuit 72c can also be executed at the same time. For example, the processing of step PT10 in FIG. 23 in which the ChB control circuit 72b functions and the processing in step PT11 in which the ChC control circuit 72c functions are parallel. It is feasible. However, since the transfer port register TR_PORT is single, when one of them (72b / 72c) is using the transfer port register TR_PORT, the other (72c / 72b) must access the transfer port register TR_PORT. Can't.

When the ChA control circuit 72a is operating, the connection bus access arbitration circuit 72e arbitrates data transmission with each storage element (CGROM55, DRAM54) via the integrated connection bus ICM. On the other hand, the IDXTBL access arbitration circuit 72f arbitrates data communication with the built-in VRAM 71 by controlling the ChA control circuit 72a based on the index table IDXTBL. In the case of the embodiment in which the preloader 73 functions, the rewrite list DL'stored in the DL buffer area BUF' of the DRAM 54 is transferred to the drawing circuit 76 via the connection bus access arbitration circuit 72e and the ChB control circuit 72b. (See FIG. 24 (b)).

As described above, the data transfer circuit 72 of the present embodiment has a data transfer source arbitrarily selected from various storage resources (Resource) and a data transfer destination arbitrarily selected from various storage resources (Resource). High-speed data transfer is realized between them. As confirmed from FIG. 19, the storage resource in which the data transfer circuit 72 functions includes not only the built-in VRAM 71 but also an external device via the CPU IF unit 56, the CG bus IF unit 82, and the DRAM IF unit 83.

Then, the amount of data transferred from the CGROM 55 to an external device on which the ChA control circuit 72a functions, such as the amount of data to be acquired at one time (memory sequential READ), is the display on which the ChB control circuit 72b and the ChC control circuit 72c function. It is enormous as compared with the case of the list DL, and the amount of data transfer differs greatly from each other.

Here, for these various types of data transfer, it is conceivable that the unit data amount and the total transfer data amount can be set in detail, but this complicates the control operation inside the VDP and enables smooth transfer operation. Be hindered. Therefore, in this embodiment, the minimum data amount Dmin for data transfer is uniquely defined, and the total transfer data amount is limited to an integral multiple of the minimum data amount DTmin, so that high-speed and smooth data transfer operation can be performed. It has been realized. Although not particularly limited, in the data transfer circuit 72 of the embodiment, the minimum data amount Dmin (unit data amount) is set to 256 bytes, and the total transfer data amount is limited to an integral multiple of this.

Therefore, the instruction command sequence of the display list DL stored in the FIFO buffer of the CPU bus control unit 72d every 32 bits is transferred to the ChB control circuit 72b or the ChC control circuit 72b at the timing when the total amount reaches the minimum data amount Dmin. Will be stored in each FIFO buffer.

The display list DL is composed of a series of instruction commands. In this embodiment, the command length of the display list DL is an integer N times of 32 bits, corresponding to the write unit (32 bits) of the transfer port register TR_PORT. It consists only of the instruction command (N> 0). Therefore, the drawing circuit 76 and the preloader 73 that receive the instruction command of the display list DL via the data transfer circuit 72 can start the command analysis process (DL analyze) quickly and smoothly. The command length of 32 bits, which is an integer N times, does not mean that all of them are significant bits, and includes a don't care bit, which means that the command length is an integer N times of 32 bits.

Next, the preloader 73 will be described. As outlined above, the preloader 73 interprets the display list DL transferred from the data transfer circuit 72 (ChC control circuit 72b) and preliminarily converts the CG data on the CGROM 55 referenced by the TXLOAD command into the DRAM 54. It is a circuit to transfer to the preload area of. Further, regarding this TXLOAD command, the preloader 73 stores the rewrite list DL'in which the reference destination of the CG data is rewritten to the address after the transfer in the DL buffer BUF' of the DRAM 54. The DL buffer BUF'and the preload area are reserved in advance at the time of initial processing after the CPU reset (ST3 in FIG. 26).

Then, the rewrite list DL'is set in the display list analyzer (DL Analyzer) of the drawing circuit 76 via the connection bus access arbitration circuit 72e of the data transfer circuit 72 and the ChB control circuit 72b at the start of the drawing operation of the drawing circuit 76. ) Is transferred to. Then, the drawing circuit 76 executes the drawing operation based on the rewrite list DL'. Therefore, based on the TXLOAD command or the like, the CG data that should be originally acquired from the CGROM 55 is acquired from the preload area of the DRAM 54 as the preload data that is pre-read in the preload area. In this case, the preload data can be used repeatedly unless it is overwritten and erased, and the preload data cache-hit in the preload area is repeatedly reused.

In this embodiment, since the preload area is set in the external DRAM 54 having a sufficient storage capacity, the above cache hit function functions effectively. Further, since the storage capacity of the external DRAM 54 is large, for example, multiple preloads that preload CG data for a plurality of frames at once are possible. That is, with respect to the operation period of the preloader 73, the operation period of a series of preload operations including the look-ahead operation of CG data is appropriately set within a range of an integral multiple of the operation cycle δ during the intermittent operation of the VDP circuit 52. Multiple preloads are realized with.

However, in the following description, for convenience, an embodiment without multiple preloads will be described. Therefore, the preloader 73 of the embodiment will complete the preload operation for one frame during one operation cycle (δ). As will be described later with reference to FIG. 26, in this embodiment, the operation cycle δ during the intermittent operation of the VDP circuit 52 is 1/30 second, which is twice the cycle of the vertical synchronization signal of the display device DS1.

Next, the drawing circuit 76 sequentially analyzes the instruction command sequences of the display list DL and the rewriting list DL'transferred via the data transfer circuit 72, and cooperates with the graphics decoder 75, the geometry engine 77, and the like. Then, the circuit draws an image for one frame of each display device DS1 and DS2 in the frame buffer formed in the VRAM 71.

As described above, in the embodiment in which the preloader 73 functions, the reference destination of the CG data in the rewrite list DL'is not the CGROM 55 but the preload area set in the DRAM 54. Therefore, the sequential access to the CG data generated during the execution of drawing by the drawing circuit 76 can be quickly executed, and even a high-resolution moving image with intense movement can be drawn without any problem. That is, according to this embodiment, as the CGROM 55, it is possible to perform complicated and advanced image production while utilizing an inexpensive SATA module.

By the way, regardless of whether or not the preloader 73 is made to function, even if data garbled occurs during transfer of the display list DL or the rewrite list DL', the drawing circuit 76 cannot detect this. In addition, the drawing circuit 76 may freeze due to the influence of noise or the like, and the READ / WRITE access of the built-in VRAM 71 may stop abnormally. Therefore, in this embodiment, if the drawing circuit 76 detects an irrational instruction command (bit sequence that cannot be analyzed), or if there is no READ / WRITE access to the built-in VRAM 71 for a certain period of time, a drawing abnormality interrupt is interrupted. Is configured to generate (drawing error interrupt is enabled). This point will be described later with reference to FIG. 26 (d).

Next, as described with reference to FIG. 18, the frame buffer FB secured in the arbitrary area (c) of the VRAM 71 is a double buffer divided into a drawing area and a reading area, and the two areas are alternately used. To use. Further, in this embodiment, since the two display devices DS1 and DS2 are connected, the frame buffers FBa / FBb of two sections are secured as shown in FIG. Therefore, the drawing circuit 76 draws one frame of image data in the drawing area (writing area) of the frame buffer FBa for the display device DS1 and draws the image data of the frame buffer FBa for the display device DS2 (writing area). In addition, one frame of image data will be drawn. When the image data is written in the drawing area, the display circuit 74 reads the image data in the other read area (display area) and outputs the image data to the display devices DS1 and DS2.

The display circuit 74 is a circuit that reads out the image data of the frame buffers FBa and FBb, performs final image processing, and outputs the image data (see FIG. 20). The final image processing includes, for example, a scaler scaling process for enlarging / reducing the image, a subtle color correction process, and a dithering process for minimizing the quantization error of the entire image. Then, the digital RGB signals (24 bits in total) that have undergone these image processing are output together with the horizontal synchronization signal and the vertical synchronization signal. As shown in FIG. 20, in this embodiment, three display circuits A / B / C for executing the above operations in parallel are provided, and each display circuits 74A to 74C have frame buffers corresponding to the respective display circuits 74A to 74C. The image data of FBa / FBb / FBc is read out, and the above final image processing is executed. However, in this embodiment, since there are two display devices, the frame buffer FBc is not secured and the display circuit 74C does not function.

In connection with this operation, the output selection unit 79 of this embodiment transmits the output signal of the display circuit 74A to the LVDS unit 80a, and transmits the output signal of the display circuit 74B to the LVDS unit 80b (FIG. FIG. 20). Then, the LVDS unit 80a converts the image data (a total of 24 bits of digital RGB signals) into an LVDS signal, adds a pair for transmitting the clock signal, and outputs a total of five pairs of differential signals to the main display device DS1. ing. The main display device DS1 has a built-in LVDS signal conversion receiving unit RV, which restores an RGB signal from the LVDS signal and displays an image corresponding to the output of the display circuit 74A.

This point is the same for the LVDS unit 80b, and for a total of 24 bits of each 8 bits of digital RGB signals, a pair for transmitting a clock signal is added and output to the conversion receiving unit RV as a total of 5 pairs of differential signals, and a sub. The display device DS2 realizes image display by a total of 24 bits of RGB signals received from the conversion receiving unit RV. Therefore, the sub-display device DS2, the main display device DS1 ^will have two ^{8 *} 2 8 * ^{2 8} resolution.

It is not always necessary to use an LVDS signal. For example, when the transmission distance is short, the digital RGB signal is transmitted to the display device as it is via the digital RGB unit 80c, or when the transmission distance is long. Converts a digital RGB signal into a V-By-one (registered trademark) signal in the conversion transmitting unit TR'and transmits it to the conversion receiving unit RV', and then returns it to the digital RGB signal in the conversion receiving unit RV'. Is also suitable. Although the broken line in FIG. 20 shows this operation mode, the above operation can be performed with any output signal of the display circuits 74A to 74C by appropriately setting the operation of the output selection unit 79. It becomes.

By the way, in the case of this embodiment, the display circuits 74A to 74B are provided with underrun counters URCNTa to URCNTc for counting the Underrun abnormality in which the display data is not generated in time for the display timing (FIG. 20). reference). The counter values of the underrun counters URCNTa to URCNTc are configured to be automatically added for each VBLANK when an underrun abnormality occurs.

Next, the SMC unit 78 (Serial Management Controller) is a composite controller incorporating an LED controller and a Motor controller. Then, while outputting the LED drive signal and the motor drive signal in synchronization with the clock signal to the LED / Motor driver (driver IC with a built-in shift register) mounted on the external board, the latch pulse is output at an appropriate timing. It is configured to be outputable.

Regarding the internal circuit of the VDP circuit 52 and its operation described above, the operation content to be executed by the internal circuit is defined by the operation parameters (set values) set by the effect control CPU 63 in the control register group 70, and the execution of the VDP circuit 52. The state can be specified by reading the operation status value of the control register group 70. The control register group 70 means a large number of VDP registers RGij mapped in an address space (0 to FFFFFH) of about 1 Mbyte on the memory map of the effect control CPU 63, and the effect control CPU 63 passes through the CPU IF unit 81. The operation parameter WRITE (setting) operation and the operation status value READ operation are executed (see FIG. 14B).

In the control register group 70 (VDP register RGij), the "system control register" in which initial setting values related to system operations such as interrupt operation are written, and the AAC area (a) and page area (b) are determined in the built-in VRAM. , "Index table register" related to construction or modification of index table IDXTBL, and "data transfer" in which setting values related to data transfer processing by the data transfer circuit 72 between the effect control CPU 63 and the internal circuit of the VDP circuit 52 are written. The "register", the "GDEC register" that specifies the execution status of the graphics decoder 75, the "drawing register" in which the setting values related to the instruction command and the drawing circuit 76 are written, and the setting values related to the operation of the preloader 73 are written. A "preloader register", a "display register" in which setting values related to the operation of the display circuit 74 are written, an "LED control register" in which setting values related to the LED controller (SMC unit 78) are written, and a Motor controller (SMC). A "motor control register" in which the setting values related to the part 78) are written and a "voice control register SRG" in which the setting values related to the voice circuit SND are written are included. However, in this embodiment, the voice circuit SND is not utilized.

In any case, in the following description, one or more registers RGij included in the control register group 70 may be referred to by the above-mentioned individual names or collectively referred to as VDP register RGij. The effect control CPU 63 controls the internal operation of the VDP circuit 52 by writing an appropriate set value to the predetermined VDP register RGij. Specifically, the effect control CPU 63 realizes a predetermined image effect based on the display list DL that is updated at an appropriate time interval and the set value in the predetermined VDP register RGij. In this embodiment, since the effect control CPU 63 is in charge of including the lamp effect and the motor effect, the VDP register RGij also includes the LED control register and the motor control register.

Next, a unified effect control operation of image effect, sound effect, motor effect, and lamp effect realized by the composite chip 50 incorporating the CPU circuit 51 and the VDP circuit 52 described above will be described.

In the case of this embodiment, the operation of the composite chip 50 is started by a power-on reset operation (see FIG. 21 (a)) due to power-on or abnormal reset, and initial setting processing (SP1 to 1) by the initial setting program (boot program) Pinit. After SP9), it is configured to shift to the main control processing (SP10) by the effect control program Main and the interrupt processing program (vector handler) Reset. Regarding the main control process, the processing content of the introduction unit is shown in FIG. 23A, and the processing content of the main body unit is shown in FIG. 26A. The process of step SP27 in FIG. 23 includes the processes of steps ST1 to ST3 in FIG. 26 (a).

Based on the above, the power-on reset operation will be described with reference to FIG. 21 (a). When the system reset signal SYSTEM maintains the L level for a predetermined period (assert period), such as when the power is turned on, all the operation control registers REG and all VDP registers RGij are automatically set to predetermined default values. After that, when the system reset signal SYS changes to the H level (negate level), in this embodiment, first, the 32-bit data from the start address of the address space CS0 is set in the program counter PC of the effect control CPU 63. Subsequent 32-bit data is configured to be set in the stack pointer SP. In FIGS. 16 and 22 (c), the head area of the memory for storing the initial values of the program counter PC and the stack pointer SP is referred to as a vector table VECT.

As shown in FIG. 21B, the vector table VECT stores the vector number for specifying the priority, the interrupt factor, and the like, and the address information in correspondence with each other. The smaller the vector number, the higher the priority. For example, the vector number 11 is an non-maskable interrupt (NMI), and the start address of the interrupt processing program executed at the time of NMI interrupt is stored as address information. Has been done. Further, vector number 64 is an internal interrupt (VDP_IRQ0) from VDP, and the start address of the interrupt processing program executed at the time of VDP_IRQ0 interrupt is stored as address information.

Since the interrupt priority is as shown in FIG. 23 (d), in the column of the vector number smaller than the vector number 64, the control command reception interrupt IRQ_CMD, the 20 μS timer interrupt, and the 1 mS timer interrupt of the interrupt processing program Each start address is stored. On the other hand, the start addresses of interrupt processing programs (IRQ_SND, IRQ_RTC, etc.) having a lower priority than VDP_IRQ1 are stored in the vector number column higher than the vector number 64.

Further, in the vector table VECT, vector number 0 and vector number 1 are defined as setting values that should be automatically set in the program counter of the CPU and the stack pointer at the time of power-on reset. As shown in FIG. 21B, in this embodiment, 4-byte data "*****" is set in the program counter PC as an internal operation at the time of power-on reset (reset assert period), and the 4-byte data "*****" is set. "++++" is set in the stack pointer SP. Note that "*****" is the start address value of the initial setting program Pinit (SP1 to SP9 in FIG. 21) that is non-volatilely stored in the address space CS0, and "++++" is secured in the built-in RAM 59. It is also the address value of the tip or end of the stack area that functions in the LIFO (Last-In First-Out) method.

In this embodiment, since the register bank RBi is effectively used, the stack area is not consumed at the time of interrupt processing, and a large amount of memory capacity is not required. That is, in this embodiment, the stack area is exclusively used in function processing and subroutine processing.

As a result of the above operation, after that, the effect control CPU 63 executes the initial setting program Pinit described after the address value "*****". However, the memory READ operation of the address space CS0 is executed based on the default value (initial value) of the operation control register REG that defines the operation of the bus state controller 66 (FIG. 15). The initial value of the operation control register REG is a value automatically set during the reset assert period (the period shown in FIG. 4D in which the system reset signal SYS maintains the L level), and any address space CS0 can be set. It is set to the slowest READ access operation (default access operation) so that READ access can be performed without problems even if it is configured with a memory device.

Therefore, in order to change this default access operation to the optimum access operation, first, an optimum value is set in a predetermined operation control register REG that defines the operation of the bus state controller 66 (FIG. 15) with respect to the address space CS0 ( SP1). That is, in order to optimize the memory READ operation when accessing the initial setting program Pinit (SP1 to SP9), the effect control program MainB (SP10), the PROM 53 storing constant data, etc., the bus width and In addition to setting the presence / absence of page access, the chip selection signal CS0, the READ control signal, the WRITE control signal, and other operation timings are optimally set (see FIG. 27).

As a result of the above settings, the processes after step SP2 are executed by optimally READing the program stored in the address space CS0 in memory. Therefore, next, in order to optimize the READ / WRITE access operation when the effect control CPU 63 accesses the VDP register RGij, a predetermined operation control that defines the operation of the bus state controller 66 (FIG. 15) with respect to the VDP register RGij. The optimum value is set in the register REG (SP2).

As described above, in the present embodiment, since the VDP register RGij is positioned in the address space CS7 of the effect control CPU 63, it is predetermined to optimally set the operation timing of the chip selection signal CS7 and other control signals. A predetermined value is written in the operation control register REG.

Subsequently, the register value of the specific VDP register RGij is read out, and it is determined whether or not the value is a predetermined value (device code) (SP3). This is a confirmation determination that the system clock of the VDP circuit 52 has been stabilized. That is, the VDP circuit 52 operates based on the oscillation output of the oscillator OSC2 supplied to the PLLREF terminal, and the VDP circuit 52 normally sends a command from the CPU circuit 51 (that is, a setting to the VDP register RGij, etc.). It is a judgment as to whether or not it can be accepted.

Then, if it can be confirmed that the system clock is stabilized by the device code reading process (SP3), then the normal operation of the VDP circuit 52 can be expected, so that the setting process for the predetermined VDP register RGij is executed (SP4). ~ SP6). Specifically, first, the endian setting (big / little) when accessing the VDP register RGij from the effect control CPU 63 and the data bus width are set (SP4).

In this embodiment, the most significant bit of the set value is set to the big endian stored in the most significant bit of the VDP register RGij, and the data 32 bus width is set to 32 bits. If the value is the same as the default value, these setting processes can be omitted (the same applies to the following processes).

Next, for the internal interrupts (VDP_IRQ0, VDP_IRQ1, VDP_IRQ2, VDP_IRQ3) from the VDP circuit to the CPU circuit, set the interrupt significance level (H / L) and set the clock signal to the PLLREF terminal (see FIG. 14A) (see FIG. 14A). It is set to operate the DDR (DRAM54) based on the reference clock (SP4). It should be noted that the reference clock of the oscillator OSC2 is supplied to the PLL REF terminal as described with reference to FIG. 14 (a).

Subsequently, the address spaces CS1 to CS6 are defined (SP5) in order to realize the memory map shown in FIG. As described above, the address space CS3 is assigned to the internal register of the voice processor 27, the address space CS4 is assigned to the internal register of the RTC 38 and the address space of the SRAM 39, and the address space CS5 is assigned to the external DRAM (DDR). The address space CS6 is assigned to 54, and the address space CS6 is assigned to the work memory 57 of the built-in CPU.

Since it is fixedly defined that the VDP register RGij is assigned to the address space CS7, the definition process of the address space CS7 is unnecessary. Further, it is fixedly defined in advance that the address space CS0 is after the memory map address 0x000000000000 of the CPU circuit 51, and on the premise of this specification, the address space CS0 is secured in the CGROM 55 or other memory. Whether it is given to the device is specified by the H / L level of the HBTSL terminal.

As described above, in this embodiment, the HBTSL terminal = L, and it is shown that the address space CS0 is defined in addition to the CGROM55. Since the specific bus width of the control memory 53 other than the CGROM 55 and the optimum access operation have already been set in step SP1, the processing of step SP5 is not required for the address space CS0.

Subsequently, for the address spaces CS1 to CS6 defined in the process of step SP5, a predetermined value is written in a predetermined operation control register REG regarding the bus width and the presence / absence of page access when accessing each address space CSi (SP6). ). Further, in order to optimally set the chip selection signal CSi and others, a predetermined value is written in a predetermined operation control register REG (SP6). These processes are the same as the processes of steps SP1 and SP2, and the chip select signal CSi, READ control signal, and WRITE are performed by writing to the operation control register that defines the operation of the bus state controller 66 (FIG. 15). The control signal and other operation timings are optimally set.

Subsequently, by outputting a clear signal to the WDT circuit 58, an abnormal reset is avoided (SP7). This is in consideration of the fact that the WDT circuit 58 automatically starts operation after the power is turned on, and the same process is repeatedly executed after that. The process of step SP9 is stored in the control memory 53 as the subroutine SP7, but the subroutine SP7 of the control memory 53 is called until the end of step SP9, and after the end of step SP9, the external DRAM 54 stores the process. Another transferred subroutine SP7'is called and executed.

Next, among the programs and data stored in the address space CS0, the vector handler Vopt (interrupt processing program) shown in FIGS. 21 (b) and 22 (c), the error recovery processing program Piram, the effect control program MainB, The variable D with the initial value and the constant data C are transferred to the external DRAM 54 or the internal RAM 59 (SP8). The variable D with an initial value means the initial value data stored in a predetermined variable area. The memory section initialization process (SP8) is a process for transferring programs and data in order to speed up the effect control process, and is a process for avoiding access to the ROM, which is inferior in access speed.

Then, the register bank RBi is set to be used (SP9). Therefore, after that, the register banks RB0 to RB14 function at the time of interrupt processing, the interrupt processing is speeded up, and the consumption of the stack area is alleviated.

The above processing is realized by executing the "initial setting program Pinit" stored in the control memory 53 which is the address space CS0 (see FIG. 22C). Then, when the execution of the initial setting program Pinit is completed, the main control process by the effect control program Main is subsequently executed (SP10). Here, the execution of the main control process means the execution of the “effect control program Main” transferred from the control memory 53 to the external DRAM 54 by the transfer process in step SP8 (see FIG. 21 (b)).

The specific contents of the main control process (effect control program Main) will be described with reference to FIGS. 23 (a) and 26 (a), but prior to that, the memory section initialization process (SP8) Will be described. As shown in FIG. 22A, in the memory section initialization process (SP8), the DMACs of a plurality of channels are first initialized to the stopped operation state. Note that this process is just a formal process just in case.

When the above processing is completed, the DMACi of the predetermined channel is activated, and the vector handler Vopt (interrupt processing program) stored in the control memory 53 is transferred to the built-in RAM 59 by a non-stop transfer method (see FIG. 17 (b3)). DMA transfer with. In this embodiment, since the interrupt processing program Vopt is transferred to the built-in RAM 59, even when an abnormality occurs in the external DRAM 54, appropriate abnormality handling processing can be performed.

Subsequent processing is also the same, and is executed by a non-stop transfer method using DMACi of a predetermined channel, and the error recovery processing program Pilam is DMA-transferred to the built-in RAM 59 (SP62). In this embodiment, since the error recovery processing program Piram is transferred to the built-in RAM 59, the peripheral circuits can be reliably reset in the error recovery processing. For example, if the error recovery processing program Pilam is transferred to, for example, an external DRAM 54 other than the built-in RAM 59, the external DRAM 54 cannot be reset during the error recovery processing.

Next, the effect control program Main is DMA-transferred to the external DRAM 54 (SP63), and the constant data C is DMA-transferred to the external DRAM 54 (SP64). The constant data includes lottery data used for the effect lottery, lamp drive data, and motor drive data in various drive data tables shown in FIG. 26B. Further, the variable D having an initial value is DMA-transferred to the external DRAM 54 (SP65), and all of these are executed by a non-stop transfer method using DMACi of a predetermined channel.

Finally, the clear data is written at the beginning of the variable area B of the external DRAM (SP66). Assuming that this start address is ADb, in the subsequent DMA transfer processing, the transfer source address is set to ADb, the transfer destination address is initially set to ADb + 1, and then the clear data is incremented while each address value ADb, ADb + 1 is incremented. By spreading the above, the clearing process of the variable area B is executed (SP67).

The processes of steps SP61 to SP66 and steps SP67 described above are all similar operations and are as shown in FIG. 22 (b). That is, first, regarding DMACi of a predetermined channel, as DMA transfer conditions, (1) cycle steal transfer mode, (2) non-stop transfer method is adopted, and (3) source and destination address values are incremented and set (3). SP68).

Next, the initial values of the transfer source source address and the transfer destination destination address are set (SP69), the transfer size is set, interrupts are disabled (SP70), and then the DMA transfer operation is started (SP71). ). The settings of steps SP68 to SP71 are all realized by the setting operation in the predetermined operation control register REG.

In the initialization process of this memory section, the interrupt for the end of DMA transfer is prohibited (SP70). Therefore, after starting the operation of DMA transfer, the status flag of the predetermined operation control register REG is repeatedly READ-accessed. Then, it waits for the end of DMA transfer (SP72). However, in consideration of the processing time until the end of the operation, the clear signal is repeatedly output to the WDT circuit 58 (SP73). Then, at the end of the DMA transfer, the DMACi is stopped and set based on the setting operation in the predetermined operation control register REG.

Subsequently, the operation contents of the main control process will be described with reference to FIGS. 23 to 26. As described above, with respect to the main control process, the processing contents of the introduction unit (SP20 to SP27) are described in FIG. 23A, and the processing content of the main body unit (ST4 to ST14) is shown in FIG. 26 (ST4 to ST14). It is described in a). The process of step SP27 in FIG. 23 includes the processes of steps ST1 to ST3 in FIG. 26 (a).

As shown in FIG. 23 (a), in the main control process (introduction unit), first, the bus width and the type of the ROM device of the CGROM 55 are specified (SP20). Specifically, as shown in FIG. 24A, READ access is made to a predetermined VDP register RGij (for example, CG bus Status register) that specifies the operating state of the CG bus that controls the interface with the CGROM 55 (SP80). ), It is determined whether or not the operation can be set for the CG bus (SP81).

Here, if the value of the CG bus Status register is 1, it means that the internal circuit of the CG bus is in the reset operation, and it means that the set value in the VDP register RGij cannot be accepted. Therefore, after confirming that the value of the CG bus Status register has changed from 1 to 0 (SP81), each device section (SPA0 to SPAn) that can be specified corresponding to the memory device constituting the CGROM (SP81) 1) Enable / disable of each device section SPAi, (2) ROM device type, (3) Data bus width and other operating parameters are set in the predetermined VDP register RGij (SP82).

As shown in FIG. 23A, in this embodiment, the CGROM 55 can be divided into a plurality of areas (device sections). For example, each device section (SPA0 to SPAn) has a memory device and a data bus width. Is configured to be selectable. As the memory device, for example, (1) a SATA module (AHSI / F) adopted in this embodiment, (2) a memory element adopting a parallel I / F (Interface) format, and (3) a sequential I / F format are adopted. It is roughly classified into memory elements and the like, but the memory device can be specifically selected for each of the roughly classified memory devices, and the data bus width and the like can be arbitrarily specified.

Next, in order to optimize the memory READ operation with the memory device selected for each device section (SPA0 to SPAn), a predetermined operation parameter is set in a predetermined VDP register RGij (SP83). The operation parameters include set values that define the operation timing of the chip select signal and other control signals (READ control signal, etc.). When a memory element that adopts the sequential I / F format is selected, the output timing of the address latch, the number of read clocks, and the like are also specified in order to realize the operation shown in FIG. 24 (b).

Therefore, the CGROM 55 can be configured by combining different types of memory devices. However, in this embodiment, the CGROM 55 is configured using only the SATA module, only the device section (SPA0) is enabled, and the other device sections (SPA1 to SPAn) are disabled.

In any case, when the setting processing of steps SP82 to SP83 is completed, a predetermined value is written in the predetermined VDP register RGij in order to make the setting processing effective (SP84). This is in consideration of the fact that it takes a predetermined time for the internal circuit of the CG bus to operate in response to the setting processing of steps SP82 to SP83, and during the operation of the internal circuit, the CG bus Status register described above is used. The value of (see SP80) becomes 0.

Therefore, after that, the CG bus Status register is repeatedly READ-accessed (SP85), and the process is completed after confirming that the value of the Status register returns from 1 to 0 (SP86). The process of step SP66 may be completed when the value of the Status register does not return from 1 to 0 regardless of the determination of a predetermined number of times. However, in that case, since the game process starts in a state where the CGROM cannot be normally accessed, the WDT circuit 58 is activated at any timing thereafter, and the composite chip 50 is in an abnormal reset state. Then, in this case, the power-on reset operation is executed again.

On the other hand, after the processing of step SP20 in FIG. 23 is normally executed, the built-in circuits of the CPU circuit 51 such as the interrupt controller INTC, the DMAC circuit 60, and the multifunction timer unit MTU are individually initialized by software processing. (SP21).

Next, for the multifunction timer unit MTU, after starting a predetermined timer measurement operation (SP22), for the internal interrupt and the internal interrupt, the permission setting value is written in the predetermined operation control register REG to set the interrupt enabled state. (SP23).

As a result, after that, various interrupts shown in FIG. 23 (d) can occur. Normally, at this timing, the voice processor 27 has completed its initialization sequence, so that the end interrupt signal IRQ_SND should have dropped to the L level, as shown in FIG. 4 (c). Therefore, the interrupt processing shown in FIG. 23 (c) is activated, the effect control CPU 63 initially sets the error flag ERR to 1, and READ-accesses the address space CS3 (SP30) to obtain a predetermined voice of the voice processor 27. The value of the register SRG is acquired, and it is determined whether or not the initialization sequence is normally completed (SP31).

Then, in the unlikely event that the initialization sequence is not completed normally, the effect control CPU 63 writes a reset command to a predetermined voice register SRG of the voice processor 27 (SP32) and is initially set to 1. Set the error flag ERR to 2 (SP33). This error flag ERR defines whether or not to execute the voice processor initialization process (SP26), and the error flag ERR = 1 is the execution condition of step SP26.

On the other hand, the voice processor 27 starts the initialization sequence again in the state of the end interrupt signal IRQ_SND = H level in response to receiving the reset command, and when the initialization sequence is completed, the end interrupt signal IRQ_SND becomes. Lower to L level. As a result, the process of FIG. 23 (c) will be re-executed.

Although the exceptional case where the initialization sequence is not normally completed has been described above, normally, the process of step SP32 is executed following step SP31, and the effect control CPU 63 is set to the predetermined audio register SRG. By writing a predetermined value, the end interrupt signal IRQ_SND is returned from the L level to the H level (SP34).

Finally, by writing a predetermined value to the predetermined voice register SRG, READ / WRITE access to all the voice registers SRG is permitted (SP35). As a result of this processing, in the subsequent voice processor initialization processing (SP26), necessary setting processing can be executed.

Although an example of the Maskable Interrupt corresponding to the interrupt enable setting in step SP23 has been described above, the non-maskable interrupt based on the oscillation stop of the oscillator OSC2 can be started at an arbitrary timing. As described above, the operating clocks of the circuits other than the built-in CPU (effect control CPU 63) are generated by multiplying the output clock of the oscillator OSC2 by the frequency by PLL (Phase Locked Loop), and the oscillation of the oscillator OSC2 is stopped. If so, the subsequent normal operation of the VDP circuit 52 is impossible.

On the other hand, the operation clock of the effect control CPU 63 is generated by multiplying the output clock of the oscillator OSC1 by the PLL, and the program processing can be continued. Moreover, the interrupt processing program is stored in the built-in RAM 59. Therefore, the effect control CPU 63 notifies the occurrence of an abnormal situation by voice or a lamp (SP28), and continues to output a clear signal to the WDT circuit 58 (SP29). The abnormality notification is, for example, a voice notification such as "An abnormal situation has occurred. Please contact the staff immediately." The reason why the clear signal is continuously output to the WDT circuit 58 is to avoid the abnormal reset operation. That is, in the case of a serious abnormality in which the oscillator OSC1 stops operating, it is considered that the normal return of the device cannot be expected even if the abnormality reset process is repeated.

Since FIG. 23 (b) and FIG. 23 (c) have been described above, the description will be continued by returning to FIG. 23 (a). In step SP24, the required area is set to write-protected in order to protect the program area of the external DRAM. Next, with respect to the clock circuit 38 driven by the battery when the power is cut off, the normal operation when the power is cut off is confirmed, and the alarm interrupt is reset just in case (SP25).

Then, on condition that the error flag ERR = 1, a necessary setting value is written to the built-in register (voice register SRG) of the voice processor 27, and the initialization process is executed (SP26). When the error flag ERR = 0, the process waits for a predetermined time until the error flag ERR = 1, but when the time limit is exceeded, the process shifts to the infinite loop process in order to activate the WDT circuit 58.

Next, the initialization process of the VDP circuit 52 is executed by writing the necessary set value to the VDP register RGij (SP27). The process of step SP27 includes the processes of ST1 to ST3 of FIG. 26.

Although the embodiment of receiving the end interrupt signal IRQ_SND from the voice processor has been described above, it is also preferable to omit the interrupt processing shown in FIG. 23 (c). FIG. 25 shows a modified embodiment, in which the 1 ms timer interrupt signal generated by the multifunction timer unit MTU is used instead of the end interrupt signal IRQ_SND.

FIG. 25 illustrates a part of the 1 ms timer interrupt process, and realizes four-step operation based on the value (0/1/2/3) of the operation management flag FLG whose initial state is zero. doing. The IRQ_SND output terminal of the audio processor 27 is open, and the IRQ_SND input terminal of the CPU circuit 51 is fixed at the H level.

In the 1 mS timer interrupt process, first, when the operation management flag FLG = 0 is determined in the process of step SP42, it is confirmed that the initialization sequence of the voice processor 27 is normally completed (SP43). Then, when the process ends normally, the interrupt signal (IRQ_SND) is cleared (SP46) by writing a predetermined value to the predetermined voice register SRG, and the operation management flag FLG is set to 1 (SP47). The processing of steps SP43 and SP46 is the same as the processing of steps SP31 and SP34 in FIG. 23 (c).

On the other hand, when the initialization sequence is not completed normally, the reset command is written in the predetermined voice register SRG to activate the initialization sequence in the voice processor 27 (SP44), and the operation management flag FLG is set to zero. Return (SP45). The process of step SP44 corresponds to the process of step SP32 of FIG. 23 (c).

Normally, the operation management flag FLG = 1 is set after the processing of step SP47. Therefore, in the next 1 ms timer interrupt, access to all voice registers is permitted by writing a predetermined value to a predetermined voice register (SP48). ), Set the operation management flag FLG = 2 (SP49). The process of step SP48 corresponds to the process of step SP35 of FIG. 23 (c).

Next, in the 1 ms timer interrupt with the operation management flag FLG = 2, the necessary setting value is written in the built-in register (voice register SRG) of the voice processor 27 as in the case of step SP26 in FIG. 23 (a). The initialization process is executed (SP50), and the operation management flag FLG = 3 is set.

The operation management flag FLG = 3 means a normal voice control state, and voice control is advanced by setting necessary operation parameters in the necessary voice register SRG (SP52).

As described above, the method of confirming the normal end of the initialization sequence of the voice processor 27 by the interrupt processing caused by the interrupt signal (IRQ_SND) (SP31 in FIG. 23 (c)) and the method of confirming by the 1 mS timer interrupt processing (FIG. 25). SP43) has been described, but the method is not limited to these methods. For example, it is also preferable to determine whether or not the initialization sequence of the voice processor 27 has been normally completed as part of the process of step SP26 in FIG.

Since the introduction unit of the main control process (SP20 to SP27 in FIG. 23) has been described above, the operation of the main body unit of the main control process will be described below with reference to FIG. 26. As shown in FIG. 26, the operation of the effect control CPU 63 includes a main control process (a), a timer interrupt process (b) that is activated every 1 mS, and a reception interrupt process (not shown) that is activated in response to the control command CMD. , VBLANK interrupt processing (c) that is activated by receiving the VBLANK signal that occurs at the start timing of the V blank (vertical blanking interval) of the display device DS1, and drawing abnormality interrupt processing that occurs when the operation freezes or an unreasonable instruction command is detected ( d) and are included in the configuration. The description of 20 μS interrupt processing will be omitted.

In the reception interrupt processing, the control command CMD received from the main control unit 21 is stored in a predetermined reception buffer so that it can be referred to in the main control processing (ST13), and the processing is completed. Further, in the VBLANK interrupt process (FIG. 26 (b)), the interrupt counter VCNT is incremented for each VBLANK interrupt (ST15), and the start timing of the main control process is 1/30 second based on the value of the interrupt counter VCNT. After grasping the operation start timing of, the interrupt counter VCNT is cleared to zero (ST4).

On the other hand, as shown in FIG. 26B, the timer interrupt processing includes the progress processing (ST18) of the lamp effect and the motor effect, and the sensor signal acquisition process for acquiring the origin sensor signals SN0 to SNn signals, the chance button signal, and the like. (ST19) and are included. The lamp effect and the motor effect are controlled based on the effect scenario that centrally manages all the effect operations, and when the effect start time managed by the effect counter EN is reached, the motor drive table or the motor drive table is used in the effect scenario update process (ST11). The lamp drive table is specified.

After that, the motor effect proceeds based on the specified motor drive table, and the lamp effect proceeds based on the specified motor drive table. As described above, there is also an embodiment in which the DMAC circuit (first and second DMA channels) 60 functions during the operation of step ST18. The motor effect progresses every 1 mS, but the lamp effect progresses at an appropriate timing longer than 1 mS.

On the other hand, as shown in FIG. 26D, in the drawing abnormality interrupt processing, the status register RGij indicating the operating state of the drawing circuit 76 is READ-accessed to identify the interrupt cause. Specifically, it is specified whether it is (1) a drawing abnormality interrupt due to detection (bit garbled) of an abnormal instruction command or (2) a drawing abnormality interrupt due to an operation abnormality (freeze) of the drawing circuit 76 (ST16a). Then, in the case of a drawing abnormality interrupt based on the detection of an abnormal instruction command, the drawing circuit 76 is initialized by writing a predetermined value to the predetermined system control register RGij (ST16b). This operation is nothing but the individual reset operation of the reset path 4B shown in FIG. 13 (b).

Next, after confirming the normal end of the individual reset operation with the predetermined status register RGij, a group of operation parameters defining the operation of the drawing circuit 76 is reset to the predetermined drawing register RGij to end the process (ST16c). .. Then, after adjusting the stack area for storing the return destination address (opening process for erasing the return destination address after the interrupt process), the process proceeds to step ST13 (ST16c).

On the other hand, in the case of a drawing abnormality interrupt based on an operation abnormality of the drawing circuit 76, the WDT circuit 58 is activated by shifting to the infinite loop processing (ST16d), and the entire composite chip 50 is reset. If the CPU circuit 51 is not desired to be reset, a predetermined keyword string may be output to the pattern check circuit CHK and only the VDP circuit 52 may be reset by the reset signal RST (see FIG. 13B). .. In this case, after confirming the normal end of the reset operation of the VDP circuit 52, the process proceeds to steps ST4 and ST13. In order to avoid over-reading the control command CMD as much as possible, it is better to shift to step ST13 rather than step ST4, including other cases.

When the entire composite chip 50 is reset, the effect up to that point disappears and the effect control completely returns to the initial state (power-on state), but when resetting only the VDP circuit 52, the reset operation of the VDP circuit 52 A series of effect control can be continued, although a predetermined waiting time is generated until the above is completed. Since the effect control CPU 63 uniformly controls the image effect, the lamp effect, and the sound effect, there is no unnatural deviation in each effect.

Subsequently, the main control process (a) will be described with respect to an embodiment in which the preloader does not function. As shown in FIG. 26 (a), the main control processes include the initial introduction process (ST1 to ST3) executed after the CPU reset, and the regular process (ST4 to ST14) repeatedly executed every 1/30 second thereafter. It is divided into. The initial processing (ST1 to ST3) is a part of the introduction part of the main control processing, and the steady processing means the main part of the main control processing.

Then, since the steady processing is started at the timing when the interrupt counter VCNT becomes VCNT ≧ 2 (ST4), the operation cycle δ of the steady processing is 1/30 second. This operation cycle δ is nothing but a substantial operation cycle δ of the VDP circuit 52 that operates intermittently based on the control of the effect control CPU 63. The determination condition is set to VCNT ≥ 2 in consideration of the possibility that the steady processing (ST4 to ST14) is abnormally prolonged and the timing of VCNT = 2 is overlooked, but the situation where VCNT = 3 is set. Is designed not to occur.

Continuing the description of the main control process (FIG. 26 (a)) based on the above, in the present embodiment, in the initial process, the built-in VRAM 71 having a storage capacity of 48 Mbytes is referred to as an ACC area (a) having an appropriate storage capacity. , The page area (b) and the arbitrary area (c) are appropriately divided (ST1). Specifically, for the ACC area (a1, a2) and the page area (b), the area start address and the required total data size are set in the predetermined index table register RGij (ST1). Then, the reserved ACC area (a1, a2) and the residual area not included in the page area (b) become an arbitrary area (c).

Here, the lower 11 bits of the first and second ACC areas (a1, a2) and the page area (b) must be 0, but they can be arbitrarily selected in units of 2048 bits. There is (1 address = 1 byte, selection for each 256 addresses). The total data size is also arbitrarily selected in the range of an integral multiple of the unit size. Although not particularly limited, the unit size of the ACC area (a) is 2048 bits, and the unit size of the page area (b) is 512 kbit.

As described above, in this embodiment, certain conditions are set for the area settings of the ACC area (a1, a2) and the page area (b), but this is as wasteful as possible for the built-in VRAM 71 having a limited memory capacity. This is to facilitate the internal operation of the VDP circuit 52 while eliminating the region. That is, if the storage capacity of the built-in VRAM 71 is increased indiscriminately, there is a concern that the manufacturing cost will rise and the chip area will increase, but if a free area setting that completely eliminates the wasted area is allowed, the internal processing will be performed. This is because it becomes complicated and the processing time for VRAM access cannot be shortened. For the same reason, certain restrictions are placed on securing the index space described below.

Continuing the description based on the above, following the process of step ST1, the necessary index space IDXi is secured for the page area (b) and the arbitrary area (c) (ST2). Specifically, the index space IDXi of each area (b) (c) is secured by setting necessary information in the predetermined index table register RGij.

For example, when the index space IDXi is provided in the page area (b), multiple information of an arbitrary horizontal size Hx and an arbitrary vertical size Wx corresponding to an arbitrary index number i (multiple information in the vertical and horizontal directions with respect to the unit space). ) Is set in the predetermined index table register RGij (ST2).

As described above, the index space IDXi of the page area (b) has a unit space of 128 horizontal size × 128 vertical size lines, and one pixel is specified by 32 bit information, so that it is perpendicular to the horizontal size Hx. Based on the setting of the size Wx, the index space IDXi of the data size (bit length) = 32 × 128 × Hx × 128 × Wx is secured. The start address (space start address) of the index space IDXi in the page area (b) is automatically assigned internally.

Further, when the index space IDXi is provided in the arbitrary area (c), the arbitrary start address (space start address) STx and the multiple information of the arbitrary horizontal size Hx are predetermined corresponding to the arbitrary index number i. It is set in the index table register RGij of (ST2). Here, "arbitrary" is premised on a predetermined condition, and the horizontal size Hx is arbitrarily determined in units of 256 bits, the lower 11 bits of the start address STx is 0, and is arbitrarily determined in units of 2048 bits. As explained above, the vertical size of the arbitrary area is fixed to the 2048 line, so based on the setting of the horizontal size Hx, the index of the data size (bit length) = 2048 x Hx after the start address STx. Space has been secured.

Specifically, as the frame buffer FBa of the main display device DS1, a pair of index spaces of horizontal size 1280 × vertical line 2048 are set in one or a plurality of predetermined index table registers RGIj by specifying each index number. As the frame buffer FBb of the sub-display device DS2, a pair of index spaces of horizontal size 480 × vertical line 2048 are set in one or a plurality of predetermined index table registers RGij, each specifying an index number. If the number of horizontal pixels of the display device does not match an integral multiple of 256 bits / 32 bits, the horizontal size of each index space is larger than the number of horizontal pixels of the display device, and 256/32 = 8. Set to a value that is an integral multiple of, to minimize the occurrence of wasted memory area.

As described above, the required number of index spaces IDXi is generated by setting the required size information and address information for the page area (b) and the arbitrary area (c) in the predetermined index table register RGIj, respectively. (ST2). Then, in response to this setting process (ST2), an index table IDXTBL that specifies the address information and size information of each index space IDXi is automatically constructed. As shown in FIG. 18A, the start address of each index space IDXi is stored in the index table IDXTBL together with other necessary information, and is stored at the time of data transfer inside the VDP circuit 52 or as an external storage resource (Resource). ) Is referred to when the data is acquired (see FIG. 19). Since the index space IDXi in the AAC area (a) is automatically generated and automatically disappears when necessary, the setting process in step ST2 is unnecessary.

As shown in FIGS. 18A and 18B, each pair of frame buffers FBa and FBb are secured in the arbitrary area (c), and each is assigned an index number. In the embodiment in which the Z buffer is not used, a pair of index spaces 255 and 254 with index numbers 255 and 254 are secured as the frame buffer FBa. Further, as the frame buffer FBb, a pair of index spaces 252 and 251 to which index numbers 252 and 251 are assigned are secured. In this embodiment, a work area (index space 0) having an index number of 0 is also secured in the arbitrary area (c).

Further, in this embodiment, the required number of index spaces IDXi, which are the decoding areas of the IP stream moving image, are secured in the page area (a), and the index number i is assigned. _{However, initially, only the index space IDX 0} for the background moving image (IP stream moving image) is secured. Then, the index space IDXj in the page area (a) is increased based on the setting process in the index table register RGij and the instruction command of the display list DL according to the necessity in the image effect (variation effect or notice effect). After that, when it becomes unnecessary, the index space IDXj is released. That is, FIG. 18A shows the index table IDXTBL during steady operation.

The index space of the ACC area (a) is automatically generated when necessary based on the instruction command described in the display list DL, and the index table IDXTBL contains the start address of the automatically generated index space IDXj. And other necessary information are set automatically. In this embodiment, this AAC region (a) is used as a decoding region for still images and other textures.

The above operation of securing the index space is realized exclusively by the setting operation of the index table register RGij included in the control register group 70, but following the processing of steps ST1 to ST2, the other VDP registers RGij are subjected to the operation. By executing the necessary setting operation, the steady operation (intermittent operation) of the VDP circuit 52 is enabled.

For example, the number of display lines and the number of horizontal pixels are set for each display device DS1 and SD2 by writing predetermined operation parameters (number of lines and number of pixels) to a predetermined display register RGij that defines the operation of the display circuit 74. (SS30). As a result, in each of the frame buffers FBa and FBb, the vertical and horizontal dimensions of the effective data area (broken line portion in FIG. 26E) to be READ-accessed by the display circuit 74 are specified.

Next, a predetermined operation parameter (address value) is written in the predetermined display register RGij to specify the vertical display start position and the horizontal display start position for each frame buffer FBa and FBb (SS31). As a result, the effective data area whose vertical and horizontal dimensions are specified in the process of step SS30 is determined on the frame buffers FBa and FBb. Here, the vertical display start position and the horizontal display start position are relative address values in each index space, and in the embodiment shown in FIG. 26 (e), the display start position is (0,0).

Subsequently, the display register RGij (DSPAINDEX) relating to the display circuit 74A driving the main display device DS1 and the display register RGij (DSPBINDEX) relating to the display circuit 74B driving the sub display device DS2 have "display areas (0)", respectively. And "Display area (1)" are set to define each display area (SS32).

Here, the "display area" means an index space (frame buffer FBa, FBb) in which image data should be read in order for the display circuits 74A and 74B to drive the display devices DS1 and DS2, and each has a double buffer structure. It means one of the double buffers in the frame buffers FBa and FBb. However, the display circuits 74A and 74B actually read the image data only in the "effective data area" specified in steps SS30 to SS31 in the display area (0) or the display area (1).

Although not limited in any way, in this embodiment, for the frame buffer FBa, the index space 254 of the index number 254 in the VRAM arbitrary area (c) is defined as the “display area (0)”, and the index number in the VRAM arbitrary area (c) is defined. The index space 255 of 255 is defined as the "display area (1)" (SS32).

Further, regarding the frame buffer FBb, the index space 251 of the index number 251 in the VRAM arbitrary area (c) is set as the “display area (0)), and the index space 252 of the index number 252 in the VRAM arbitrary area (c) is set as the “display area (display area (0)). 1) ”(SS32). The definition of the "display area" in the initial processing (SS3) is not particularly limited, and the index space (display area) in which the display circuit 74 should READ access the image data is toggled for each operation cycle δ. It may be switched.

In this embodiment, once the above initial processing (SS30 to SS32) is completed, the first type of prohibition setting is made so that the set value in the predetermined system control register RGij is not changed due to the influence of noise or the like. A predetermined prohibition value is set in the register RGij (first prohibition setting SS33).

Here, the setting values for which future writing is prohibited include (1) setting values related to the display clocks of the display devices DS1 and DS2, (2) setting values related to the sampling clock of the LVDS, and (3) selection of the output selection circuit 79. It includes set values related to operation, (4) synchronization relations of a plurality of display circuits DS1 and DS2 (the display circuit 74B is dependent on the operation cycle of the display circuit 74A), and the like. Although there is a software process for canceling the first prohibition setting, it is not used in this embodiment. However, it is also preferable to use it as needed.

Next, by setting a predetermined prohibition value in the second type prohibition setting register RGij, the write prohibition setting is set for the VDP register RGij of the initial setting system (second prohibition setting SS34). Here, the prohibited register includes the VDP register RGij according to steps SS30 to SS32.

On the other hand, by setting a predetermined prohibition value in the third type prohibition setting register RGij, it is possible to set the prohibition to a large number of VDP registers including the VDP registers related to the setting processing of steps ST1 to ST3 (the first). Prohibition setting of 3). However, in principle, it is not used in this embodiment. In any case, the second prohibition setting and the third prohibition setting can be arbitrarily canceled by writing the release value in the predetermined release register RGij, and the set value is changed during steady operation. Is also possible.

The initial setting process of steps ST1 to ST3 described above is executed based on the initial value setting table SETTABLE (see FIG. 31) in which the register address value of the VDP register RGij and the set value of the register RGij are associated with each other. Will be done. Since the initial setting processing has been described above, next, before the steady processing (ST4 to ST14) is described, the steady operation (intermittent operation) of the VDP circuit 52 controlled by the effect control CPU 63 is shown in FIG. 26A and FIG. It will be schematically described with reference to FIG. 26 (b).

The intermittent operation of the VDP circuit 52 is as shown in FIGS. 26 and 26. In the embodiment in which the preloader 73 is not used, as shown in FIG. 26A, the display list DLi completed by the effect control CPU 63 is In the operation cycle (T1), the drawing circuit 76 is issued to the drawing circuit 76, and the drawing circuit 76 completes the image data in the frame buffers FBa and FBb by the drawing operation based on the display list DLi. Then, the image data completed in the frame buffers FBa and FBb is output to the display devices DS1 and DS2 by the display circuit 74 in the next operation cycle T1 + δ, and based on the subsequent drawing operation of the display devices DS1 and DS2. , The display screen is detected by the player.

On the other hand, in the embodiment using the preloader 73, as shown in FIG. 26A, the display list DLi completed by the effect control CPU 63 is issued to the preloader 73 in the operation cycle (T1), and the preloader 73 , Interpret the display list DLi, perform the necessary look-ahead operation, and rewrite a part of the display list DLi to complete the rewrite list DL'. The pre-read CG data and the rewrite list DL'are stored in appropriate places on the DRAM 54.

Next, the drawing circuit 76 acquires the rewrite list DL'from the DRAM 54 in the next operation cycle (T1 + δ), and completes the image data in the frame buffers FBa and FBb by the drawing operation based on the rewrite list DL'. .. Then, the image data completed in the frame buffers FBa and FBb is output to the display devices DS1 and DS2 by the display circuit 74 in the next operation cycle (T1 + 2δ), so that the subsequent display devices DS1 and DS2 are drawn. Based on the movement, the display screen is detected by the player.

The intermittent operation of the VDP circuit 52 has been schematically described above, but in order to realize the above-mentioned intermittent operation, the effect control CPU 63 repeatedly refers to the value of the interrupt counter VCNT after the initial processing (ST1 to ST3). , Waits for the operation start timing to be reached, and when the operation start timing (one-step V blank start timing) is reached, the interrupt counter VCNT is cleared to zero (ST4).

After that, the steady operation is started. In this embodiment, it is first determined whether or not the operation start condition for starting the steady operation is satisfied (ST5). The determination timing is the start timing of the vertical blanking interval (VBLANK) of the display device DS1. The display timing of the display device DS2 is set at the time of the initial setting (ST3) so as to depend on the display timing of the display device DS1.

Since the operation start condition determined at the start timing of the vertical blanking interval (VBLANK) differs depending on whether or not the preloader 73 is used, an embodiment (FIG. 26) in which the preloader 73 is not used will be described first. In this case, the circuit configuration and the program are originally designed so that the internal operation of the VDP proceeds as shown in the time chart of FIG. 26 (a). That is, based on the display list DL1 completed in the operation cycle (T1), the drawing circuit 76 should finish the drawing operation during the operation cycle (T1 to T1 + δ). However, for example, as in the display list DL3 completed in the operation cycle (T1 + 2δ) of FIG. 26A, it cannot be said that the drawing operation may not be completed during the operation cycle (T1 + 2δ to T1 + 3δ). Further, with respect to the display circuit 74, there is a possibility that an Underrun abnormality has occurred in which the display data is not generated in time with respect to the display timing.

The determination process in step ST5 takes such a situation into consideration, and the effect control CPU 63 accesses the status register RGij (a type of control register group 70) indicating the operating state of the drawing circuit 76, and at the timing of step ST5, The drawing circuit 76 determines whether or not the necessary operation has been completed and whether or not there is an Underrun abnormality. The presence or absence of the Underrun abnormality is determined based on the underrun counters URCNTa to URCNTc. Further, in the embodiment in which the preloader 73 is not used, for example, at the timing T1 + δ in FIG. 26A, the status information of the drawing register related to the drawing circuit 76 is READ-accessed, and the drawing operation based on the display list DL1 is completed. To confirm.

Then, when the operation start condition is not satisfied (abnormality / nonconformity), the abnormality flag ER for counting the number of abnormalities is incremented, and the steps ST6 to ST8 processing are skipped. The abnormality flag ER is determined by the processing of steps ST9 and ST10 together with the other serious abnormality flag ABN, and if the number of continuous abnormalities is not large (ER ≦ 2) on the assumption that the serious abnormality flag ABN is in the reset state, The effect command analysis process is executed in the same manner as in the normal state (ST13).

Similarly, when the Underrun is abnormal, the steps ST6 to ST8 are skipped. Then, the display clock (frequency) and the display circuit 74 are initialized by writing a predetermined clear value to the predetermined system control register RGij (ST10c). After confirming the normal completion of this initialization process, the frequency of the display clock and the value of the group of system control registers RGij that regulate the operation of the display circuit 74 are reset to the specified values (ST10c). The effect command analysis process is executed (ST13).

In the effect command analysis process (ST13), it is determined whether or not the control command CMD is received from the main control board 21, and if the control command CMD is received, the control command CMD is analyzed and necessary processing is executed. (ST13). Here, the necessary processing includes a process for preparing to start a new variation effect based on the control command CMD instructing the start of the variation effect, and a process for starting error notification based on the control command CMD indicating the occurrence of an error. Subsequently, a clear pulse is output to the WDT circuit (ST14), and the process returns to the process of step ST4.

The case where the error flag ER is ER ≦ 2 has been described above when there is a slight Underrun abnormality or when the operation start condition is incompatible. In such a case, the display circuit 74 is used in the operation cycle. The process of toggle switching the display area read by (ST6) and the process of creating a display list (ST7) are skipped, and the production scenario does not proceed (see ST8 to ST12). This is because the image data of the frame buffers FBa and FBb in an incomplete state is not output. Therefore, the image production does not proceed, and the original screen (screen based on DL2) is redisplayed, resulting in frame dropping.

Here, in order to avoid dropping frames, a configuration that waits until the operation start condition is satisfied is also conceivable. However, since there are many control processes (ST6 to ST12) to be executed by the effect control CPU 63 and it is necessary to secure each processing time, in this embodiment, a frame drop occurs when the operation start condition is not satisfied. There is.

However, even if a frame is dropped, the progress of the image effect is only delayed by about 1/30 to 2/30 seconds as compared with the lamp effect and the motor effect that are progressed by the interrupt processing (FIG. 26 (b)). Yes, the player does not notice this. Moreover, when the frame is dropped, the production scenario processing (ST11) including the update processing of the production counter EN and the audio progress processing (ST12) are also skipped, so that the reach production, the advance notice production, and the accessory to be started after that are also skipped. In the production, there is no possibility that the start timings of the image production, the audio production, the lamp production, the motor production, and the like are shifted.

That is, in the production scenario, the start timing of the image production, the audio production, the lamp production, and the motor production and the production content to be executed after that are centrally managed, and the production counter EN, which is updated only when normal, starts. Since the timing is controlled, the synchronization of various productions will not be out of sync. For example, if there is an effect operation that combines the explosion sound, the explosion image, the movement of the accessory, and the lamp flash operation, each of the above effect operations is started in correct synchronization even after the frame is dropped. To.

Although the relatively minor abnormality has been described above, when the serious abnormality flag ABN is in the set state, the number of continuous abnormalities is large (ER> 2), or when the Underrun abnormality occurs repeatedly, step ST10 is performed. After the determination, the state is in an infinite loop (ST10b). As a result, the timekeeping operation of the WDT circuit 58 progresses, the composite chip 50 including the effect control CPU 63 is abnormally reset, and then the initial processing (ST1 to ST3) is re-executed, so that an abnormal situation occurs. It is expected that the root cause will be eliminated.

Since the WDT circuit 58 is activated and executed in this reset operation, the entire composite chip 50 including the CPU circuit 51 is in the reset state (FIG. 13 (b)). Therefore, in order to avoid resetting the CPU circuit 51, the effect control CPU 63 outputs a predetermined keyword string (for example, three 1-byte data) to the pattern check circuit CHK and outputs the reset signal RST to the VDP circuit 52. Is also suitable. Also in this case, after confirming the normal end of the reset operation of the VDP circuit 52 (ST101), the process proceeds to the processes of steps ST4 and ST13.

In any case, at the time of this abnormality, the audio circuit SND is also abnormally reset, so that the image effect, the sound effect, the lamp effect, and the motor effect all return to the initial state. However, since these reset operations have no effect on the main control unit 21 and the payout control unit 25, there is no possibility that a situation such as the disappearance of the jackpot state or the disappearance of the prize ball will occur.

Although the abnormal situation has been described above, in reality, the above-mentioned abnormality rarely occurs even in a minor case, and after the processing of step ST5, the setting to the predetermined display register RGij (DSPACTL / DSPBCTL) is performed. Based on this, the "display area" of the frame buffers FBa and FBb for storing the image data to be read by the display circuit 74A and the display circuit 74B is toggled (ST6). As described above, since the "display area (0)" and the "display area (1)" are defined in advance in the initial processing (ST3), in the processing of step ST6, the frame buffers FBa and FBb are described this time. It is specified whether the "display area" of the above is the display area (0) or the display area (1).

By executing this step ST6, the display circuit 74A alternately outputs image data from the index space 254 (display area (0)) and the index space 255 (display area (1)) for each operation cycle δ. It reads out and drives the display device DS1. Similarly, the display circuit 74B alternately reads image data from the index space 251 (display area (0)) and the index space 252 (display area (1)) at each operation cycle δ to display the sub-display device DS2. It will be driven. As described above, the display circuit 74 actually performs READ access only to the effective data area in the display area (0) / display area (1).

In any case, in the present embodiment, since the "display area" is switched for each operation cycle, the display circuits 74A and 74B use the display devices DS1 and DS2 for the image data completed by the drawing circuit 76 in the immediately preceding operation cycle. Output processing to is started. However, since the process of step ST5 is started from the start of the vertical blanking interval (V blank) of the main display device DS1, the image data output process is actually started after the vertical blanking interval is completed. Will be done. In FIG. 26A, the arrow shown in the column of the display circuit indicates the operation cycle of this output processing.

When the processing of step ST6 having the above significance is completed, the effect control CPU 63 subsequently completes the display list DL that specifies the image data to be output to the display device by the display circuit 74 in the next operation cycle. (ST7). Although not particularly limited, in this embodiment, the list buffer area (DL buffer BUF) of the RAM 59 is secured, and the display list DL is completed there (see FIG. 19).

The display list DL is configured by arranging a series of instruction commands in an appropriate order, and is configured to end by writing an EODL (End Of DL) command. Then, in this embodiment, in order to realize smooth operation of the data transfer circuit 72, the drawing circuit 76, and the preloader 73, all the instruction commands including the EODL command are given an integer N times (N> 0) with a command length of 32 bits. It is limited to the instruction command of. As described above, the instruction command composed of a 32-bit integer N times may include a don't care bit.

As described above, since the display list DL of the embodiment is composed of only instruction commands having a command length of 32 bits and an integer N times (N> 0), the data volume value (total amount of data) of the entire display list DL is determined. It is always an integral multiple of the minimum unit of command length (32 bits = 4 bytes). Further, in this embodiment, in consideration of the minimum data amount Dmin of the data transfer circuit 72, the data volume value of the display list DL is an integral multiple (1 or more) of the minimum data amount Dmin, and the instruction command is used. It is adjusted to be an integral multiple of the minimum unit (4 bytes). For example, if Dmin = 256 bytes, the data volume value of the display list DL is adjusted to any value of 256 bytes, 512 bytes, and so on.

Here, it is also preferable to appropriately adjust to 256 bytes or 512 bytes according to the complexity of the effect content, but in this embodiment, there are two display devices, and the sub display device DS2 is The data volume value of the display list DL is always adjusted to 256 bytes in consideration of not performing such a complicated image effect.

However, this method is not limited in any way, and is adjusted to 512 bytes or 768 bytes in the case of three or more display devices or in the case of a gaming machine that executes complicated image production including the sub display device DS2. Will be done. Further, during a normal effect, the data volume value of the display list DL is adjusted to 256 bytes, and the data volume value of the display list DL is adjusted to 512 bytes or 768 bytes only when a special effect is executed. Is also suitable.

However, in the case of this embodiment, the data volume value of the display list DL is adjusted to a predetermined byte length (256 bytes) defined in advance in each operation cycle δ. The adjustment method is a simple method (A) in which a 32-bit length NOP (No Operation) command is filled after the 32-bit length EODL command, or a 32-bit length NOP command is used to fill the shortage area. Finally, a standard method (B) in which a 32-bit length EODL command is described can be considered. The data volume value (total data amount) of the display list DL is terminated by the EODL command without any adjustment, and dummy data is additionally transferred during the operation of the data transfer circuit 72, which is an integral multiple of the minimum data amount Dmin. An unadjusted method (C) for securing the transfer amount of the data is also conceivable.

Here, when the standard method (B) is adopted, first, the command counter CNT is initially set to a specified value (64-1 corresponding to 256 bytes), and every time a significant instruction command is written to the DL buffer area BUF. A method is conceivable in which the command counter CNT is appropriately subtracted, and when the writing of a series of significant instruction commands is completed, the NOP command is described until the command counter CNT becomes zero, and finally the EODL command is described. In the case of this embodiment, since the instruction command is limited to those whose command length is an integer N times (N> 0) of 32 bits, the above processing is easy, and the subtraction processing of the command counter CNT is an integer. The subtraction process corresponds to N.

On the other hand, when adopting the simple method (A), when creating the display list DL, it is sufficient to first fill the entire list buffer area (DL buffer BUF) with the NOP command, so at first glance, it is better than the standard method (B). Seems to be excellent. Further, from the viewpoint of simplicity, the non-adjustment method (C) seems to be excellent. However, in this embodiment, the standard method (B) is basically adopted, and the actual amount of data from the beginning of the display list DL to the EODL command, that is, the amount of data up to the EODL command is always the data transfer circuit 72. The minimum data amount of Dmin is adjusted to be an integral multiple of Dmin.

This is in consideration of an embodiment in which the preloader 73 is used. If the simple method (A) or the non-adjustment method (C) is adopted, the actual data amount of the display list DL up to the EODL command is random. This is because the value becomes a value, and problems occur when transferring the rewrite list DL'rewritten by the preloader 73 to the DRAM 54 or when transferring the rewrite list DL'from the DRAM 54 to the drawing circuit 76. The ChA control circuit 72a of the data transfer circuit 72 functions when the rewrite list DL'is transferred to the DRAM 54, and the ChB control circuit 72b functions when the rewrite list DL'is transferred to the drawing circuit 76 (FIG. 24). (See), in either case, only the rewrite list DL'up to the EODL command will be transferred.

The advantages of the standard method (B) for adjusting the data volume value of the display list DL have been described above, but in the embodiment in which the preloader 73 is not used, the issued display list DL is only processed by the drawing circuit 76. Therefore, the use of the simple method (A) and the non-adjustment method (C) is not prohibited at all.

However, in the following description, the details of the display list DL will be described based on FIG. 28 on the premise that the standard method (B) is adopted in principle regardless of whether or not the preloader 73 is used.

Although not particularly limited, in this embodiment, first, the instruction command sequence (L11 to L16) relating to the main display device DS1 is described in the display list DL, and then the instruction command sequence (L17 to L20) relating to the sub display device DS2 is described. I am trying to describe it. Further, the standard method (B) is adopted to adjust the data volume value of the display list DL to a fixed length (256 bytes). Note that FIG. 28 also shows, in fact, the procedure in which the effect control CPU 63 writes an instruction command to the list buffer area of the RAM 59, and the operation of the drawing circuit 76 based on the display list DL.

As shown in FIG. 28, at the beginning of the display list DL, an instruction command (SETDAVR) of the environment setting system is described, and the upper left base point address (X, Y) on the index space IDX is set for the frame buffer FBa of the display device DS1. Specify (L11). As described with respect to FIG. 18A, in this embodiment, a pair of frame buffers FBa are secured in the arbitrary area (c) for the display device DS1. Then, normally, by setting the base point address (X, Y) = (0,0) corresponding to the effective data area for the display circuit 74, the drawing circuit 76 is utilized from the start position of the frame buffer FBa. ..

In FIG. 18C, the actual drawing area on the lower left side is designated as L11, which means that the actual drawing area on the frame buffer FBa is set to the base point address (0,) of the frame buffer FBa by the instruction command L11. 0) It means that it was specified to start from the position. However, the vertical and horizontal dimensions of the actual drawing area and the index number that specifically specifies the actual drawing area are still undecided, and are determined by the instruction command (SETINDEX) L13 described later. The instruction command L11 also specifies whether or not to use the Z buffer.

Next, the upper left base point coordinates (Xs, Ys) and the lower right diagonal point coordinates (Xe, Ye) are set in the virtual drawing space by the instruction command (SETDAVF) of the environment setting system, and the W × H dimension is set. The drawing area of is defined (L12). Here, the virtual drawing space is a virtual two-dimensional space in the X direction ± 8192 and the Y direction ± 8192 that can be drawn by a drawing instruction command (SPRITE command or the like) (see FIG. 18C). ..

By this instruction command L12 (SETDAVF), the virtual drawing space is divided into a drawing area in which the drawing contents are actually reflected on the display device DS1 and other non-drawing areas. Further, the instruction command L12 (SETDAVF) associates the actual drawing area whose start position (base point address) is defined by the instruction command L11 with the drawing area on the virtual drawing space.

In other words, the instruction command L12 defines a W × H actual drawing area starting from the base point address, which corresponds to the drawing area on the virtual drawing space, in the frame buffer FBa (index space is undecided). It will be. Therefore, the drawing area specified by the instruction command L12 needs to be the same as or smaller than the horizontal size of the frame buffer FBa. Usually, the drawing area and the actual drawing area are defined so as to have the same dimensions as the effective data area (FIG. 26 (e)) for the display circuit 74.

Then, after the drawing circuit 76 executes the instruction commands L11 and L12, only the drawing contents drawn in the virtual drawing space included in the drawing area are reflected in the actual drawing area of the frame buffer FBa. become. Therefore, the drawing contents of the portion protruding from the drawing area and the portion described as the work area in FIG. 18C are not reflected in the frame buffer as they are. When securing a work area in the virtual drawing space, a non-drawing area in the virtual drawing space is used.

Next, in this operation cycle, the drawing circuit 76 defines where to draw the drawing contents to be drawn based on the display list DL to be completed (L13). Specifically, for the frame buffer FBa of the display device DS1 having a double buffer configuration, the index space IDX which is the "write area" of the drawing contents based on the display list DL this time is specified (L13). Specifically, by the SETINDEX command, which is a texture setting command, (1) the frame buffer FBa is secured in an arbitrary area, and (2) the index space IDX _N that becomes the "write area" is arbitrary. The index number N on the area is specified.

When, for example, N = 255 is specified by this instruction command L13, the actual drawing area corresponding to the drawing area defined on the virtual drawing space is specifically in the frame buffer FBa having a double buffer structure. It is defined as the index space IDX _255.

In the case of this embodiment, the index number of the frame buffer FBa is 255 or 254 (FIG. 18 (a)), and either toggled switch is specified (L13). Note that this index number is an index number that is not the display area (0) / (1) specified in step ST6 of the main control process. For example, in the process of step ST6, when the display area (0) is designated for the display circuit 74, the display area (1) becomes the “write area” for the drawing circuit 76.

As described above, after the correspondence between the actual drawing area (W × H logical space) and the drawing area (W × H virtual space) is generally defined by the instruction command L11 and the instruction command L12, By the instruction command L13 (SETINDEX) that specifically specifies the index space IDX, the virtual space of W × H is associated with the logical space of W × H in the specific index space IDX.

In other words, in the future, based on a series of instruction commands, the content virtually drawn in the W × H virtual space will be inside the VDP that defines the correspondence between the virtual space and the real address of the built-in VRAM 71. Based on the conversion table, it becomes the image data of the built-in VRAM 71 (frame buffer). Subsequently, as a "write area", an instruction command for executing a frame buffer clear process for filling the specified index space IDX with black, for example, is described (L14, L15). This is nothing but the erasing process of the image data written in the frame buffer FBa before the two operation periods.

Specifically, the SETFCOLOR command, which is a type of environment setting command, selects black, for example, and the RECTANGLE command, which is a primitive drawing command, specifies that the rectangular area should be filled. In the RECTANGLE command, the XY coordinates of the upper left end point and the lower right end point of the drawing area (virtual space corresponding to the frame buffer FBa) set in the virtual drawing space are specified (see FIG. 18C). ..

Since the drawing preparation process is completed by the above processing, next, instruction commands for drawing an appropriate texture such as a still image or a moving image frame in the virtual drawing space are listed. Typically, first, the index space IDX to which the texture is expanded is specified by the SETINDEX command of the texture setting system, and then the TXLOAD command, which is the instruction command of the texture load system, is described to read from the CGROM 55. The texture is described in the display list DL so as to expand into a predetermined index space IDX.

As described above, in this embodiment, the background moving image is composed of the IP stream moving image. _{Therefore, for example, for the background video, the index space IDX to be expanded is specified as the index space IDX 0} in the page area (b) by the SETINDEX command of the texture setting system, and then the TXLOAD command of the texture load system is described. To do. In the TXLOAD command, it is necessary to specify the start address (texture source address) of the CGROM 55 and the expanded data size (horizontal x vertical) for the video frame to be loaded this time.

When the above TXLOAD command is executed in the VDP circuit 52, one moving image frame (texture) of the background moving image is first acquired in the AAC area (a), and then the page area (the page area (texture) is automatically activated by the GDEC75. It is expanded to the index space IDX _{0 of b).} Next, this one moving image frame is drawn in the virtual drawing space. In this case, the SETINDEX command (texture setting system) may be used to set "the index space IDX _{0 in} the page area (b) is the texture to be processed thereafter", but the TXLOAD command is continuously processed. In this case, the description of this SET INDEX command can be omitted.

In any case, in the state where "the index space IDX _{0 in} the page area (b) is the texture to be processed after that" is specified, then the parameters for the α blend processing are set, and so on. Describe the instruction command of the appropriate inter-drawing calculation system. The α-blending process is related to the transparency / translucency processing of the image already described in the drawing area (frame buffer FBa) and the image to be overwritten. Therefore, it is not necessary to use the instruction command of the inter-drawing calculation system in the drawing operation of the first sheet as in the moving image frame of the background moving image.

Then, by using the SPRITE command, which is an instruction command for the primitive drawing system, " _{texture of index space IDX 0} in page area (b) (one video frame of background video)" is set in place in the virtual drawing space (rectangular destination area). Describe the SPRITE command to draw in. For the SPRITE command, it is necessary to specify the upper left end point and the right lower end point of the Destination area of the virtual drawing space.

This Destination area is the whole or a part of the drawing area (virtual space defined on the virtual drawing space) associated with the actual drawing area (FBa) in advance by the instruction commands L11 and L12. However, since the background moving image is usually drawn on the entire display screen, the Destination area in such a case is the entire drawing area or more. The case where the Destination area is larger than the entire drawing area is, for example, the case where the background moving image is zoomed up.

Since the drawing of the video frame of the background video is completed by the above processing, the instruction commands such as the texture load system, the texture setting system, the inter-drawing calculation system, and the primitive drawing system commands are listed in an appropriate order. The display list DL is configured to draw various textures on the background moving image. As described above, a large number of moving images are required at the time of variable production. In that case, the index table control system is instructed to increase the index space IDX for the page area (b) of the built-in VRAM 71. The command (NEWPIX) will be described.

For example, for the second IP stream video, the NEWPIX command allocates an additional index space IDX ₁ in the page area (b), then specifies this index space IDX ₁ (SETINDEX), and then the second IP stream video. Instruct the expansion of one frame of the video (TXLOAD), and place the expanded texture in the appropriate place in the drawing area (SPRITE). Normally, the Destination area in this case becomes a part of the drawing area.

The same applies hereinafter. If the index space IDX _k is secured one after another by the NEWPIX command and then a plurality of IP streams are drawn in the drawing area while executing appropriate α-blending processing, the drawing contents in the drawing area will be the same. , The image data is sequentially accumulated in the frame buffer FBa, which is the actual drawing area. When a plurality of N IP stream moving images are drawn, a plurality of N index spaces are functioning in the page area (b).

Then, when a series of fluctuation effects are completed, the DELPIX command is used to release the index space IDX that is considered unnecessary among _{the large number of index spaces IDX 1 to IDX k secured in the page area (b).} The unnecessary index space IDX may be deleted.

When drawing a still image or I-stream movie, use the SETINDEX command to specify that the decoding destination of these textures is the AAC area (a), and then execute the TXLOAD command to execute the AAC area. The texture acquired in (a) is then expanded into the ACC area (a) by the automatically activated GDEC75. Then, the expanded texture may be drawn at an appropriate position in the drawing area by the SPRITE command. The first AAC region (a1) or the second AAC region (a2) is used depending on whether or not the cache hit function is utilized.

In the description so far, each texture is drawn directly in the drawing area of the DS1 for the main display device, but the operation is not necessarily limited to such an operation. For example, if an appropriate drawing area is provided (FIG. 18 (c)) without overlapping the drawing area already reserved for the display device DS1, and this drawing area is associated with the work area of the built-in VRAM 71, it is intermediate. It is possible to construct an appropriate drawing area and complete an appropriate effect image. Here, the reason why the drawing area does not overlap with the drawing area for the display device DS1 is that the later association setting is prioritized for the overlapping area and the drawing contents in the area are not reflected in the frame buffer FBa.

As shown in FIG. 18 (c), the work area of this embodiment is the index space IDX ₀ in the arbitrary area (c). Then, in the effect timing using this work area, an instruction command for associating the drawing area for the effect image (see FIG. 18C) with the work area ( _{actual drawing area of index space IDX 0) is preceded.} Describe the columns (SETDAVR, SETDAVF, SETINDEX). As shown in FIG. 18C, the drawing area for the effect image is secured in an area not included in the drawing area for the main display device DS1.

Then, after that, the same instruction commands as the instruction command sequence L16 regarding the frame buffer FBa may be listed, and an appropriate effect image may be completed in _{the index space IDX 0.} In the case of this embodiment, since the effect image is composed of a still image, an instruction command (SETINDEX) is described so that the decoded data is expanded in the first AAC region (a1), and then the index space IDX ₀ The primitive drawing system instruction command (SPRITE) with the destination in the drawing area will be used. It should be noted that such an operation is repeated once or a plurality of times depending on the content of the effect.

_{Then, after positioning the index space IDX 0} that completed the effect image as a texture (SETINDEX), the effect image (texture) of the _{index space IDX 0} is drawn at an appropriate position in the drawing area of the DS1 for the main display device by the SPRITE command. Just do it. In such a case, _{it is conceivable to decompose the effect image of the index space IDX 0} into triangular drawing primitives, rotate them at an appropriate angle, and then draw them in the drawing area. The rotation angle of the texture is associated with, for example, the reliability of the advance notice effect.

The instruction command sequence (L11 to L16) for completing one frame of the main display device DS1 has been described above, but the instruction command sequence (L17 to L12) for completing one frame of the sub display device DS2 has also been described. The same is true. That is, the start XY coordinates of the frame buffer FBb are specified (L17), defined (usually X = 0, Y = 0), and on the virtual drawing space shown in FIG. 18 (c), for the sub-display device DS2. A drawing area is defined (L18).

By the way, in this embodiment, after the generation of the image data for the main display device DS1 is completed, the process shifts to the generation process for the sub display device DS2, so that the drawing area for the sub display device DS2 is for the main display device DS1. There is no problem even if it overlaps with the drawing area of, and the drawing area can be set freely. Therefore, when developing a display list DL generation program, for example, when pasting an appropriate texture to a newly set drawing area with the SPRITE command, set the operation parameters (Destination area) of the SPRITE command and so on. It can be stylized to some extent.

After the definition of such an arbitrary drawing area is completed (L18), next, for the frame buffer FBb of the display device DS2 having a double buffer configuration, an index space that becomes a "write area" of the drawing contents based on the display list DL this time. Identify the IDX (L19). The index number of the index space IDX is the index number of the frame buffer FBb that does not correspond to the display area (0) / (1) specified in step ST6 of the main control process.

After that, the instruction command sequences L20 to L22 for the sub display device DS2 are listed in the same manner as the instruction command sequences L14 to L16 for the main display device DS1. It is also possible to use the effect image completed in the index space IDX _0.

As described above, all the instruction commands of L11 to L22 constituting the display list DL are limited to those having a command length that is an integral multiple of 32 bits in this embodiment. Then, as described above, the data volume value (total amount of data) of the display list DL of this embodiment is adjusted to a fixed length (256 bytes), and the required number of NOP commands (L23) as dummy commands are added. After that, it is terminated by the EODL command (L24). That is, in the embodiment of FIG. 28, the above-mentioned standard method (B) is adopted.

However, even when the standard method (B) is adopted, it is not always essential to fix the total amount of data in the display list DL to 256 bytes in all operation cycles. That is, in another embodiment, when the total amount of data in the display list DL excluding the NOP command exceeds 256 bytes (for example, during a special production period), the total amount of data in the display list DL is added with the NOP command. Is adjusted to 512 bytes or more N × 256 bytes. As described above, when the standard method (B) is adopted, the end of N × 256 bytes is terminated by the EODL command.

Although the embodiments of the present invention have been described in detail above, each configuration can be suitably applied not only to the ball game machine but also to, for example, a spinning machine. The power factor improving circuit can be omitted. Further, the game balls do not necessarily have to be paid out to the player, and it goes without saying that the present invention can be applied to a so-called managed game machine in which the number of prize balls is stored in an electronic card.

GM game machine 20 power supply board CV12s converter circuit

Claims (9)

A gaming machine that executes various control operations based on a lottery result caused by a predetermined switch signal.
In the power supply board that forms various levels of DC voltage based on the AC voltage received from the outside, necessary circuit components are arranged on a predetermined board to form the main part of the converter circuit, and the same part of the main part is formed. A composite circuit component covering the main part is provided in a state where a group of circuit connection bars including a plurality of electrically connected circuits are arranged in a row and projected.
Each of the group of circuit connection bars is inserted into the power supply board in a state substantially orthogonal to the composite circuit component.
A game characterized in that a plurality of circuit connection bars electrically connected to the same location are each connected to one circuit pattern land having a mounting width corresponding to the maximum separation distance of the plurality of circuit connection bars. Machine. The gaming machine according to claim 1, wherein the group of circuit connection bars are aligned at a pitch of 2 mm to 3 mm. The gaming machine according to claim 1 or 2, wherein the circuit connection bar has a width of 0.6 to 1.5 mm in a front view. The gaming machine according to any one of claims 1 to 3, wherein the composite circuit component is covered with a substantially rectangular parallelepiped metal box. A choke coil is arranged on the downstream side of the composite circuit component.
The gaming machine according to claim 4, wherein the first plate surface of the metal box is arranged in a surface shape without a gap between the choke coil and the composite circuit component. The gaming machine according to claim 5, wherein the second plate surface substantially parallel to the first plate surface is formed in a gate shape with an opening at the center. The gaming machine according to claim 5 or 6, wherein the choke coil is configured by winding a winding around a toroidal core. The gaming machine according to any one of claims 5 to 7, wherein the diameter of the winding of the choke coil is 0.5 mm or more. The gaming machine according to any one of claims 5 to 8, wherein the choke coil is inserted and mounted from the surface side of the power supply board.

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