JP2021095514A - ヒドロキシ化合物、組成物、硬化物及び積層体 - Google Patents

ヒドロキシ化合物、組成物、硬化物及び積層体 Download PDF

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Publication number
JP2021095514A
JP2021095514A JP2019228228A JP2019228228A JP2021095514A JP 2021095514 A JP2021095514 A JP 2021095514A JP 2019228228 A JP2019228228 A JP 2019228228A JP 2019228228 A JP2019228228 A JP 2019228228A JP 2021095514 A JP2021095514 A JP 2021095514A
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group
compound
hydroxy compound
base material
resin
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JP2021095514A5 (enrdf_load_stackoverflow
Inventor
和郎 有田
Kazuo Arita
和郎 有田
悦子 鈴木
Etsuko Suzuki
悦子 鈴木
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DIC Corp
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DIC Corp
Dainippon Ink and Chemicals Co Ltd
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Priority to JP2019228228A priority Critical patent/JP2021095514A/ja
Publication of JP2021095514A publication Critical patent/JP2021095514A/ja
Publication of JP2021095514A5 publication Critical patent/JP2021095514A5/ja
Pending legal-status Critical Current

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JP2019228228A 2019-12-18 2019-12-18 ヒドロキシ化合物、組成物、硬化物及び積層体 Pending JP2021095514A (ja)

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JP2019228228A JP2021095514A (ja) 2019-12-18 2019-12-18 ヒドロキシ化合物、組成物、硬化物及び積層体

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JP2019228228A JP2021095514A (ja) 2019-12-18 2019-12-18 ヒドロキシ化合物、組成物、硬化物及び積層体

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JP2021095514A true JP2021095514A (ja) 2021-06-24
JP2021095514A5 JP2021095514A5 (enrdf_load_stackoverflow) 2022-10-28

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114907291A (zh) * 2022-05-16 2022-08-16 厦门市宜帆达新材料有限公司 一种改性活性稀释剂及其制备方法和碳纤维用环氧树脂及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016098321A (ja) * 2014-11-21 2016-05-30 Dic株式会社 エポキシ樹脂組成物、硬化性樹脂組成物、活性エステル、硬化物、半導体封止材料、半導体装置、プレプリグ、フレキシルブル配線基板、回路基板、ビルドアップフィルム、ビルドアップ基板、繊維強化複合材料、成形品
WO2019123941A1 (ja) * 2017-12-18 2019-06-27 Dic株式会社 エポキシ化合物、組成物、硬化物及び積層体
WO2019123943A1 (ja) * 2017-12-18 2019-06-27 Dic株式会社 ヒドロキシ化合物、組成物、硬化物及び積層体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016098321A (ja) * 2014-11-21 2016-05-30 Dic株式会社 エポキシ樹脂組成物、硬化性樹脂組成物、活性エステル、硬化物、半導体封止材料、半導体装置、プレプリグ、フレキシルブル配線基板、回路基板、ビルドアップフィルム、ビルドアップ基板、繊維強化複合材料、成形品
WO2019123941A1 (ja) * 2017-12-18 2019-06-27 Dic株式会社 エポキシ化合物、組成物、硬化物及び積層体
WO2019123943A1 (ja) * 2017-12-18 2019-06-27 Dic株式会社 ヒドロキシ化合物、組成物、硬化物及び積層体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114907291A (zh) * 2022-05-16 2022-08-16 厦门市宜帆达新材料有限公司 一种改性活性稀释剂及其制备方法和碳纤维用环氧树脂及其制备方法
CN114907291B (zh) * 2022-05-16 2024-01-12 厦门市宜帆达新材料有限公司 一种改性活性稀释剂及其制备方法和碳纤维用环氧树脂及其制备方法

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