JP2021093421A - Superconducting coil device - Google Patents

Abstract

To provide a superconducting coil device capable of preventing quench of a superconducting wire or a thermal runaway of a superconducting coil.SOLUTION: In a superconducting coil device 100, a superconducting coil 10 is formed by having: a winding member 11 comprising a pair of side surfaces 15 along a radial direction so as to be formed by overlapping a superconductive wire with winding; a bypass 12 electrically connecting both the superconducting wirings provided to one side surface 15 of the winding member and having a different turn to a radial direction of the winding member 11; and a heat exchanger plate 13 conducted and provided in a state of being electrically insulated to the bypass. A plurality of the superconducting coils is laminated in a winding axial direction.SELECTED DRAWING: Figure 1

Description

An embodiment of the present invention relates to a superconducting coil device in which a plurality of superconducting coils formed by winding a superconducting wire are laminated in the winding axis direction.

The superconducting wire has a range of current, temperature and magnetic field capable of maintaining the superconducting state, that is, a so-called critical current, a critical temperature and a critical magnetic field. Therefore, even if the electric resistance of the superconducting wire is almost zero, the current cannot flow infinitely, and when any of the critical values is exceeded, a transition phenomenon to the normal conducting state, that is, quenching occurs. Joule heat generation in the normal conduction transition region due to such quenching has a risk of causing thermal runaway of the superconducting coil in an instant and, in the worst case, burning, so protection technology against quenching is indispensable.

As a conventional technique for quench protection, for example, there is a method of connecting a protection resistor in parallel with a superconducting coil. In this method, an increase in the coil voltage or coil temperature generated by the transition to the normal conduction state is detected, and this is used as a trigger to shut off the exciting power supply. Since the circuit of the superconducting coil and the protection resistor is closed after the interruption, the stored energy of the superconducting coil is consumed by the Joule heat generation of the protection resistor arranged at room temperature, and the current flowing through the coil can be attenuated.

Examples of the superconducting wire used in such a superconducting coil include high-temperature superconducting wires such as Bi2Sr2Ca2Cu3O10 + x wire and RE1B2C3O7 wire. Since the superconducting coil using this high-temperature superconducting wire has a high critical current density even at a high temperature of 20K to 50K as compared with the conventional low-temperature superconducting wire such as NbTi, high-current density operation at a high temperature becomes possible.

However, when quenching occurs during high current density operation, the high-temperature superconducting wire has a larger specific heat than the operating temperature of the superconducting coil using the low-temperature superconducting wire in the temperature range of 20K to 50K, so that the normal conduction transition region expands. Is slow, and the heat generation density also increases when high current density operation is performed. Therefore, in the quench protection method of the prior art, thermal runaway occurs locally before detecting an increase in the coil voltage or the coil temperature, and the superconducting coil is burnt out.

By short-circuiting the superconducting wires of different turns inside the superconducting coil between turns, the current flowing through the portion of the superconducting transition can be diverted to the superconducting wires of different turns. By bypassing the normal conduction portion, the current can suppress local heat generation and thermal runaway in the normal conduction transition region. Specifically, by providing a detour that is electrically connected to the superconducting wire on the side surface of the winding member along the coil radial direction of the superconducting coil, the superconducting wires of different turns can be connected to each other through this detour. The technique of short-circuiting is disclosed.

JP-A-2017-103352

However, in the above disclosed technology, when a part of the current flowing through the superconducting coil is transferred to the detour, energy is consumed in the detour to generate heat, and the temperature of the superconducting coil is raised to quench the superconducting wire. May cause. The same applies to a superconducting coil device in which a plurality of superconducting coils are stacked, and it is necessary to quickly remove heat generated in a detour of each superconducting coil.

An embodiment of the present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide a superconducting coil device capable of preventing quenching of a superconducting wire or thermal runaway of a superconducting coil.

The superconducting coil device according to the embodiment of the present invention has a winding member formed by laminating superconducting wire members by winding and having a pair of side surfaces along the radial direction, and one side surface of the winding member. A detour that is provided and electrically connects the superconducting wires of different turns in the radial direction of the winding member, and a heat transfer plate that is provided in contact with the detour in an electrically insulated state. It is characterized in that a plurality of superconducting coils having the above are laminated in the winding axis direction of the superconducting coil.

According to the embodiment of the present invention, quenching of the superconducting wire or thermal runaway of the superconducting coil can be prevented.

FIG. 3 is a partial cross-sectional view showing a superconducting coil device according to the first embodiment. FIG. 3 is a partial cross-sectional view showing a superconducting coil constituting the superconducting coil device of FIG. The schematic perspective view which shows the superconducting coil of FIG. The plan view of the superconducting coil of FIG. FIG. 3 is a cross-sectional view taken along the line VV of FIG. 2 is a perspective view showing a configuration of a high-temperature superconducting wire (thin film wire) forming a winding member of the superconducting coil of FIGS. 2 to 5. FIG. 2 is an enlarged cross-sectional view showing a part of FIG. 2. FIG. 2 is a cross-sectional view showing a conductive resin constituting the detour of FIGS. 2 and 7. FIG. 3 is a partial cross-sectional view showing a superconducting coil device according to a first modification according to the first embodiment of FIG. FIG. 3 is a partial cross-sectional view showing a superconducting coil device of a second modified form according to the first embodiment of FIG. FIG. 3 is a partial cross-sectional view showing a superconducting coil device according to a third modification according to the first embodiment of FIG. FIG. 3 is a partial cross-sectional view showing a superconducting coil device according to a fourth modification according to the first embodiment of FIG. FIG. 2 is a partial cross-sectional view showing a superconducting coil device of another example in the fourth modified form of FIG. FIG. 3 is a partial cross-sectional view showing a superconducting coil device according to a second embodiment. FIG. 6 is a partial cross-sectional view showing a superconducting coil constituting the superconducting coil device of FIG.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
[A] First Embodiment (FIGS. 1 to 13)
FIG. 1 is a partial cross-sectional view showing a superconducting coil device according to the first embodiment. The superconducting coil device 100 shown in FIG. 1 is configured by stacking a plurality of superconducting coils 10 shown in FIGS. 2 to 5 in the direction of the winding shaft O (FIGS. 3 and 5) of the superconducting coil 10. It is a laminated superconducting coil. As shown in FIGS. 2 and 5, the superconducting coil 10 includes a winding member 11, a detour circuit 12, and a heat transfer plate 13.

Of these, the winding member 11 is formed of the thin film wire rod 20 which is the high-temperature superconducting wire rod shown in FIG. Here, the high-temperature superconducting wire generally constitutes a tape-shaped thin film wire 20 in which thin film-like layers are laminated. The thin film wire rod 20 is, for example, a wire rod such as a REBCO wire rod including a superconducting layer 25 described later, which is made of a rare metal oxide (RE oxide).

That is, in the thin film wire rod 20, for example, a substrate 22 which is a high-strength metal material such as a nickel-based alloy, stainless steel, or copper, an intermediate layer 24 formed on the substrate 22, and the intermediate layer 24 are formed on the substrate 22. An alignment layer 23 made of magnesium or the like, a superconducting layer 25 made of a rare metal oxide formed on the intermediate layer 24, a protective layer 26 made of silver, gold, platinum, etc., and copper or copper or It is composed of a stabilizing layer 21 which is a good conductive metal such as aluminum.

The intermediate layer 24 prevents thermal strain caused by thermal shrinkage between the substrate 22 and the superconducting layer 25. The protective layer 26 protects the superconducting layer 25 by preventing oxygen contained in the superconducting layer 25 from diffusing from the superconducting layer 25. The stabilizing layer 21 serves as a bypass path for an excessive energizing current to the superconducting layer 25 to prevent thermal runaway. However, the type and number of each layer constituting the thin film wire rod 20 is not limited to this, and may be increased or decreased as necessary.

The superconducting coil 10 shown in FIGS. 2 and 5 is a pancake-shaped winding member 11 having a space penetrating the winding shaft O of the superconducting coil 10 by winding the thin film wire 20 around the winding frame 14. Obtained by forming. A coil formed in a pancake shape by winding the thin film wire 20 concentrically is called a pancake coil.

The winding member 11 is formed by superimposing the thin film wire rods 20 by winding, and has a pair of side surfaces 15 along the radial direction. Further, the gap between the superconducting coil 10 and the thin film wire rod 20 of another adjacent turn is referred to as a coil turn gap. As shown in FIG. 7, an insulating member 16 is inserted into the coil turn gap of the thin film wire 20 in order to insulate between the turns of the adjacent thin film wire 20. As the insulating member 16, for example, an insulating tape formed of polyimide or the like is preferably used. The tape-shaped insulating member 16 is inserted into the coil turn gap by co-winding with the thin film wire rod 20.

Further, the superconducting coil 10 may be impregnated with an adhesive insulating material such as an epoxy resin. By impregnating with this adhesive insulating material, the adjacent thin film wire 20 in the superconducting coil 10 and the insulating member 16 are fixed to each other, and the thermal conductivity and mechanical strength of the superconducting coil 10 can be improved. It will be possible. An adhesive material such as epoxy resin can also function as an insulating member 16 by being inserted into the coil turn gap, but tape-shaped insulating material is required for reliable insulation of the coil turn gap. It is preferable to use the member 16 to reliably insulate the coil turn gap.

As shown in FIGS. 2, 5 and 7, the superconducting coil 10 electrically connects the thin film wires 20 of different turns in the superconducting coil 10 to one side surface 15 of the winding member 11 in the radial direction. A detour 12 is provided. As the material of the detour circuit 12, a material having a resistance larger than the resistance of the superconducting coil 10 during normal operation and smaller than the resistance of the superconducting coil 10 at the time of normal conduction transition is selected. For example, the material of the detour 12 is an ordinary conductive metal such as copper, stainless steel, aluminum or indium, a semiconductor, a conductive plastic, a ceramic material, a conductive resin or a superconducting material. Further, a carbon material such as graphite, carbon fiber or a carbon fiber composite material is also preferably used as a material for the detour 12.

The material of these detours 12 is made into a plate material, foil, or the like, and is electrically connected to the winding member 11 by crimping or soldering. Further, the material of the detour circuit 12 may be plated or applied to one side surface 15 of the winding member 11 to form the detour circuit 12. In particular, when the detour circuit 12 is formed by plating, the detour circuit 12 can be made thin and does not hinder the free deformation of the superconducting coil 10.

Further, the detour circuit 12 may be formed by applying a conductive resin 17 as shown in FIG. As the conductive resin 17, for example, a resin 28 having no conductivity mixed with a conductive powder 18 may be used. In this case, the volume resistivity of the conductive resin 17 can be easily adjusted by changing the ratio and the type of the conductive powder 18 blended in the conductive resin 17.

As the conductive powder 18, a carbon-based powder such as carbon black, carbon fiber, or graphite is used. As the conductive powder 18, a metal-based powder such as metal fine particles, metal oxides, metal fibers or whiskers may be used. Further, the conductive powder 18 may be obtained by metal-coating fine particles or synthetic fibers. Further, the detour circuit 12 may be formed by applying a conductive resin 17 having a different composition depending on the position of the side surface 15 of the winding member 11 in the radial direction or the circumferential direction.

As shown in FIGS. 2 and 5, in the superconducting coil 10, an insulating plate 19 is provided on a detour circuit 12 and a side surface 15 of a winding member 11 on which the detour circuit 12 is not provided. The insulating plate 19 insulates the winding member 11 and the detour circuit 12 of each superconducting coil 10 in the superconducting coil device 100 from other superconducting coils 10 which are laminated and adjacent to each other. Epoxy resin, fiber reinforced plastic, or the like is preferably used as the insulating plate 19.

The effect of suppressing the occurrence of thermal runaway or the like in the superconducting coil 10 by providing the detour circuit 12 will be described. As the thin film wire 20 approaches the critical current, which is the limit of the energizing current that can be maintained in the superconducting state, an external magnetic field gradually invades, and the portion where the superconducting state is locally destroyed undergoes a normal conduction transition. The portion where the normal conduction is transferred is referred to as a normal conduction portion 30. The flux flow resistance associated with this local normal conduction transition generates heat due to Joule loss. Therefore, when the flux flow resistance increases due to a temperature rise of the superconducting coil 10, thermal runaway is induced in the superconducting coil 10 or a thin film is formed. Attract quench to the wire rod 20.

Therefore, by providing the detour circuit 12, when a local flux flow resistance is generated in a part of the thin film wire rod 20 due to the normal conduction transition, a part Ia of the energizing current I flowing in the circumferential direction through the winding member 11 Detours along the radial direction to the thin film wire rod 20 of another adjacent turn via the detour circuit 12. At this time, the energizing current flowing in the winding member 11 in the circumferential direction decreases from I to I-Ia. Assuming that the resistance of the detour circuit 12 is Ra and the flux flow resistance is R, the current Ia that detours in the radial direction of the winding member 11 is proportional to R / (R + Ra). Therefore, as the flux flow resistance increases, more energizing current will be bypassed to the bypass circuit 12. By bypassing this current, it is possible to prevent a large amount of current I from flowing to the normal conduction portion 30 that has locally transitioned to the normal conduction state, and thermal runaway of the superconducting coil 10 or quenching of the thin film wire 20 occurs. It is suppressed.

When the thin film wires 20 of different turns of the winding member 11 are electrically connected by the detour circuit 12, not only when the flux flow resistance is generated, but also the superconducting coil 10 is excited from the non-energized state to the rated current value. At that time, a part of the energizing current I'supplied from the power source is diverted to the thin film wire 20 of another turn through the detour circuit 12 due to the induced voltage. Since the induced voltage is not generated after the excitation is completed, the current I'flowing through the detour 12 gradually flows in the circumferential direction of the winding member 11, but the superconducting coil 10 reaches the designed magnetic field value. Will take time. The lower the resistance of the detour circuit 12, the more current will be diverted during excitation, and the excitation time will be unnecessarily long.

Therefore, the resistor Ra of the detour circuit 12 is a resistor small enough to allow a sufficient amount of current to flow to the detour circuit 12 when a flux flow resistance is generated, and excites the superconducting coil 10 from the non-energized state to the rated current value. It is preferable that the resistance is set so that the excitation time does not become unnecessarily long.

By the way, when the flux flow resistance over the entire length of the superconducting coil 10 is R and the resistance Ra of the detour circuit 12 is, for example, Ra = R / 10, when the thin film wire 20 undergoes a normal conduction transition over the entire length, the resistivity ratio R / ( Since R + Ra) becomes R / (R + Ra) = 10/11 = 0.9, the current flowing through the detour 12 proportional to this R / (R + Ra) is about 90% of the energizing current. The heat generated by the flux flow resistor R at this time is R × {I × (1/11)} ² = (1/121) RI ² , where I is the energizing current, and the heat generated by the detour 12 is (R /). 10) × {I × (10/11)} ² = (10/121) RI ² . That is, the heat generated by the detour circuit 12 is 10 times larger than the heat generated by the winding member 11.

In order to remove the heat generated by the detour circuit 12, the heat transfer plate 13 is provided in the superconducting coil 10 so as to be in contact with the detour circuit 12 in an electrically insulated state, as shown in FIGS. 2 and 5. There is. Preferably, the detour 12 and the heat transfer plate 13 are electrically insulated by the insulating plate 19. The heat transfer plate 13 is thermally directly connected to a refrigerator (not shown) or indirectly via another heat transfer member, and the heat generated in the superconducting coil 10 (generated in the detour 12) due to conduction cooling. Remove heat).

As the material of the heat transfer plate 13, a material having high thermal conductivity is preferable, and any metal of aluminum (for example, high-purity aluminum) and copper (for example, oxygen-free copper) is preferably used. These materials are bonded to the detour 12 or the insulating plate 19 in the form of a plate or foil. As shown in FIGS. 3 and 4, the heat transfer plates 13 may be divided in the circumferential direction of the superconducting coil 10 or may be divided in the radial direction of the superconducting coil 10 and arranged in plurality.

As a method of electrically insulating the winding member 11 including the detour circuit 12 and the heat transfer plate 13, heat is transferred to the detour circuit 12 by using an adhesive having high electrical insulation such as epoxy resin. The plate 13 is glued. Further, as the insulating plate 19 inserted between the detour circuit 12 and the heat transfer plate 13 as described above, fiber reinforced plastic or the like is preferably used. When the insulating plate 19 is inserted between the detour circuit 12 and the heat transfer plate 13 in this way, the detour circuit 12, the insulating plate 19, and the heat transfer plate 13 are bonded to each other with a highly insulating adhesive such as epoxy resin. By doing so, it becomes possible to improve the electrical insulation while thermally connecting the detour circuit 12 and the heat transfer plate 13.

A plurality of superconducting coils 10 configured as described above are laminated in the winding axis O direction of the superconducting coil 10, and the superconducting coil device 100 shown in FIG. 1 is configured. In the superconducting coil device 100, the superconducting coil 10 has a heat transfer plate 13 on the side surface 15 side of the winding member 11 on which the detour 12 is provided, and the superconducting coil 10 is not provided with the detour 12 on the winding member 11. It is laminated so as to face the insulating plate 19 on the side surface 15 side of the above.

Since it is configured as described above, according to the first embodiment, the following effects (1) and (2) are obtained.
(1) As shown in FIGS. 1, 2 and 7, the superconducting coil 10 constituting the superconducting coil device 100 is mounted on one side surface 15 of a winding member 11 formed by laminating thin film wires 20 by winding. A detour circuit 12 is provided, and the heat transfer plate 13 is in contact with the detour circuit 12. Therefore, even if a part of the energizing current Ia flowing through the thin film wire 20 during the normal conduction transition of the superconducting coil 10 flows through the detour circuit 12 and the detour circuit 12 generates heat, the detour circuit 12 stays in the detour circuit 12. It is conducted and cooled by a refrigerator (not shown) through a heat transfer plate 13 provided in contact with the heat transfer plate 13, and is directly cooled. As a result, the temperature rise of the detour circuit 12 can be suppressed, so that the occurrence of quenching of the thin film wire rod 20 or the occurrence of thermal runaway of the superconducting coil 10 can be prevented.

(2) In the superconducting coil device 100 shown in FIG. 1, in the superconducting coil 10, the heat transfer plate 13 on the side surface 15 side of the winding member 11 where the detour 12 is provided is the winding of the superconducting coil 10 adjacent to each other. The members 11 are laminated so as to face the insulating plate 19 on the side surface 15 side on which the detour 12 is not provided. Therefore, in the superconducting coil device 100, the heat transfer plates 13 of each superconducting coil 10 are arranged at equal intervals along the stacking direction of the superconducting coil device 100 (the same direction as the winding shaft O of the superconducting coil 10). Therefore, the temperature of the superconducting coil device 10 can be uniformly maintained in the stacking direction.

Next, a modified form of the first embodiment will be described below with reference to FIGS. 9 to 13.
FIG. 9 shows the superconducting coil device 101 according to the first modification of the first embodiment. In the superconducting coil device 101, the adjacent superconducting coils 10 face each other with the heat transfer plates 13 on the side surface 15 side of the winding member 11 on which the detour 12 is provided, and the detour 12 in the winding member 11 is opposed to each other. The insulating plates 19 on the side surface 15 side on the side where is not provided are laminated so as to face each other. The heat transfer plates 13 facing each other can be shared into a single heat transfer plate 13.

Therefore, the superconducting coil device 101 of the first embodiment also has the same effect as the effect (1) of the superconducting coil device 100 of the first embodiment, and also has the following effect (3).

(3) In the adjacent superconducting coils 10 in the superconducting coil device 101, the heat transfer plates 13 on the side surface 15 side of the winding member 11 where the detour 12 is provided are laminated so as to face each other. In the adjacent superconducting coils 10 in which the heat plates 13 face each other, the number of required heat transfer plates 13 can be reduced by sharing the heat transfer plates 13 into one heat transfer plate.

FIG. 10 shows the superconducting coil device 102 in the second modified form of the first embodiment. In this superconducting coil device 102, an even number of superconducting coils 10 are laminated, and the superconducting coils 10 adjacent to each other at the center position in the stacking direction (the same direction as the winding axis O of the superconducting coil 10) are detours 12 in the winding member 11. The heat transfer plates 13 on the side surface 15 side on which the is provided are arranged so as to face each other, and the superconducting coil 10 at other positions is the side surface 15 on the winding member 11 where the detour 12 is provided. The heat transfer plate 13 on the side is arranged so as to face the insulating plate 19 on the side surface 15 side on which the detour 12 is not provided in the winding member 11 of the adjacent superconducting coils 10.

FIG. 11 shows the superconducting coil device 103 in the third modified form of the first embodiment. In this superconducting coil device 103, an even number of superconducting coils 10 are laminated, and the superconducting coils 10 adjacent to each other at the center position in the stacking direction (the same direction as the winding axis O of the superconducting coil 10) are detours 12 in the winding member 11. The insulating plates 19 on the side surface 15 side on which the is not provided are arranged so as to face each other, and the superconducting coil 10 at other positions is the side surface 15 on the winding member 11 on which the detour 12 is provided. The heat transfer plate 13 on the side is arranged so as to face the insulating plate 19 on the side surface 15 side on which the detour 12 is not provided in the winding member 11 of the adjacent superconducting coils 10.

Therefore, according to the superconducting coil device 102 of the second modified form described above, the effects similar to the effects (1) and (3) of the first embodiment and the first modified form are obtained, and the superconducting coil device of the third modified form is obtained. According to 103, the superconducting coil devices 102 and 103 have the same effect as the effect (1) of the first embodiment and the first modified form, and the superconducting coil devices 102 and 103 have the following effect (4).

(4) In the superconducting coil devices 102 and 103, the superconducting coils 10 are arranged symmetrically in the stacking direction of the superconducting coil devices 102 and 103 with a plane passing through the central position in the stacking direction and perpendicular to the stacking direction as a boundary. .. Therefore, as compared with the case where the superconducting coil 10 is asymmetrically arranged with the plane as a boundary as in the superconducting coil device 100 (FIG. 1), the generated magnetic field is symmetrical in the stacking direction of the superconducting coil devices 102 and 103. Can be formed into.

FIG. 12 shows the superconducting coil device 104 in the fourth modified form of the first embodiment, and FIG. 13 shows the superconducting coil device 105 of another example in the fourth modified form. In the superconducting coil device 104 shown in FIG. 12, the adjacent superconducting coils 10 have the heat transfer plates 13 on the side surface 15 side of the winding member 11 on which the detour 12 is provided facing each other, and the winding member 11 has a heat transfer plate 13 facing each other. Insulating plates 19 on the side surface 15 side on which the detour circuit 12 is not provided are laminated and arranged so as to face each other, and the heat transfer plate 13 is provided in the gap between the adjacent superconducting coils 10. A heat soaking plate 31 is interposed in a gap where the insulating plates 19 on the non-existing side face each other in a state of being electrically insulated.

Further, in the superconducting coil device 105 shown in FIG. 13, in the superconducting coil 10, the heat transfer plate 13 on the side surface 15 side of the winding member 11 where the detour 12 is provided is adjacent to the winding member of the superconducting coil 10. In the superconducting coil 10 which is arranged so as to face the insulating plate 19 on the side surface 15 side on the side where the detour 12 is not provided, and which is arranged at the end of the superconducting coil device 105 in the stacking direction. , The soaking plate 31 is provided in a state of being electrically insulated.

As the material of the heat soaking plate 31, a metal having a high thermal conductivity such as aluminum or copper is preferably used as in the heat transfer plate 13. Normally, the heat equalizing plate 31 is not electrically connected to an external device of the superconducting coil 10 such as a refrigerator, and fulfills a function of keeping the temperature inside the superconducting coil 10 uniform. By connecting to an external device such as the above, a function of removing heat generated by the superconducting coil 10 may be provided as in the heat transfer plate 13. Further, the heat equalizing plate 31 may be divided and installed in the circumferential direction or the radial direction of the superconducting coil 10. Further, by adjusting the thickness of the heat equalizing plate 31, it is possible to adjust the spacing in the stacking direction in the superconducting coil 10.

Since it is configured as described above, according to the superconducting coil device 104 of the fourth embodiment, the effects (1) and (3) of the first embodiment and the first modified form are exhibited, and the fourth embodiment has the same effect. According to the superconducting coil device 105 of another example of the embodiment, the effects similar to the effects (1) and (2) of the first embodiment are obtained, and these superconducting coil devices 104 and 105 have the following effects ( Play 5).

(5) In the superconducting coil device 104, the heat equalizing plate 31 is provided in the gap between the adjacent superconducting coils 10 where the insulating plate 19 on which the heat transfer plate 13 is not provided faces, and thus the superconducting plate 31 is provided. The temperature of the superconducting coil 10 arranged inside other than the end portion in the stacking direction of the coil device 104 can be made uniform. Further, in the superconducting coil device 105, since the heat equalizing plate 31 is provided on the superconducting coil 10 located at the end of the superconducting coil device 105 in the stacking direction, the superconducting coil 10 at the end of the superconducting coil device 105 in the stacking direction. The temperature can be made uniform.

The superconducting coil devices 100 to 105 are formed by stacking a plurality of superconducting coils 10 having a detour circuit 12, but may include a superconducting coil having no detour circuit 12. That is, when the superconducting coil devices 100 to 105 are excited from the non-energized state to the rated current value by using the superconducting coil having no detour 12 in the portion where the critical current is high among the superconducting coil devices 100 to 105. , The induced voltage can reduce the amount of electricity that a part of the energizing current I supplied from the power supply detours to the thin film wire 20 of another turn through the detour circuit 12 until it reaches the designed magnetic field value. The time can be shortened.

[B] Second embodiment (FIGS. 14 and 15)
FIG. 14 is a partial cross-sectional view showing the superconducting coil device according to the second embodiment. Further, FIG. 15 is a partial cross-sectional view showing a superconducting coil constituting the superconducting coil device of FIG. In this second embodiment, the same parts as those in the first embodiment are designated by the same reference numerals as those in the first embodiment to simplify or omit the description.

The difference between the superconducting coil device 200 of the second embodiment and the first embodiment is that a plurality of superconducting coils 40 are laminated in the winding axis O direction to form the superconducting coil device 200, and the superconducting coil 40 is formed. Then, detours 12 are provided on both side surfaces 15 of the pair of side surfaces 15 of the winding member 11, and the heat transfer plate 13 is provided in contact with these detours 12 in a state of being electrically insulated. It is a point.

Here, the superconducting coil device 200 is not limited to the case where the superconducting coil device 200 is composed of only the superconducting coil 40 in which the detour circuit 12 is provided on both side surfaces 15 of the winding member 11, and the superconducting coil device 200 is detoured to one side surface 15 of the winding member 11. It may include a superconducting coil 10 (FIG. 2) provided with a path 12 and a superconducting coil in which a detour 12 does not exist.

Since it is configured as described above, according to the second embodiment, the following effects (6) and (7) are obtained.
(6) In the superconducting coil 40 constituting the superconducting coil device 200, since the detour circuit 12 is provided on both side surfaces 15 of the pair of side surfaces of the winding member 11, when the superconducting coil 40 undergoes a normal conduction transition, A part of the energizing current I'flowing through the thin film wire rod 20 forming the winding member 11 can be reliably passed through the detour circuit 12. Further, in the superconducting coil 40, since the heat transfer plate 13 is provided in contact with each detour circuit 12, the heat of the detour circuit 12 that generates heat at the time of the normal conduction transition of the superconducting coil 40 is frozen through the heat transfer plate 13. It can be cooled directly by the machine, so that the temperature rise of the detour 12 can be surely suppressed. From these facts, it is possible to prevent the occurrence of thermal runaway of the superconducting coil 40 or the occurrence of quenching of the thin film wire rod 20.

(7) In the superconducting coil 40, since the detour 12 is provided on both side surfaces 15 of the winding member 11, the superconducting coil device 200 in which a plurality of the superconducting coils 40 are laminated passes through the central position in the stacking direction. Moreover, the configuration is symmetric with respect to the plane perpendicular to the stacking direction. Therefore, the magnetic field generated by the superconducting coil device 200 can be formed symmetrically in the stacking direction of the superconducting coil device 200.

Although some embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the gist of the invention, and their replacements and changes can be made. Is included in the scope and gist of the invention, and is also included in the invention described in the claims and the equivalent scope thereof.

For example, in the first and second embodiments, the thin film wire 20 forming the winding member 11 of the superconducting coils 10 and 40 has been described in the case of a high-temperature superconducting wire, but it may be a low-temperature superconducting wire. Further, the superconducting coils 10 and 40 have been described in the case where the winding member 11 has a so-called pancake shape, but the winding member 11 is formed into a racetrack type, a saddle type, and an elliptical shape having a non-circular shape, respectively. It may be.

10 ... Superconducting coil, 11 ... Winding member, 12 ... Detour, 13 ... Heat transfer plate, 15 ... Side, 17 ... Conductive resin, 20 ... Thin film wire (high temperature superconducting wire), 31 ... Soaking plate, 40 ... Superconducting coil, 100 ... Superconducting coil device, 101, 102, 103, 104, 105 ... Superconducting coil device, 200 ... Superconducting coil device, O ... Winding shaft

Claims (9)

A winding member formed by overlapping superconducting wires by winding and having a pair of side surfaces along the radial direction, and the superconducting wires provided on one side of the winding member and having different turns. The superconducting coil comprising a detour that is electrically connected in the radial direction of the winding member and a heat transfer plate that is provided in contact with the detour in an electrically insulated state is the superconducting coil. A superconducting coil device characterized in that a plurality of coils are stacked in the winding axis direction. The first aspect of the superconducting coil is characterized in that the side surface of the superconducting coil provided with the detour is laminated so as to face the side surface of the adjacent superconducting coil not provided with the detour. The superconducting coil device described. The first aspect of claim 1, wherein the superconducting coils are laminated so that the side surfaces on which the detour is provided face each other and the side surfaces on which the detour is not provided face each other. Superconducting coil device. An even number of the superconducting coils are stacked, and the two superconducting coils adjacent to each other at the center position in the stacking direction are provided on the side surfaces where the detour is provided or on the side surfaces where the detour is not provided. Are arranged so that they face each other,
The superconducting coil at other positions is arranged so that the side surface on which the detour is provided faces the side surface of the adjacent superconducting coil on which the detour is not provided. The superconducting coil device according to claim 1. The soaking plate was electrically insulated in the gap between the adjacent superconducting coils on the side where the heat transfer plate was not provided, or in the superconducting coil arranged at the end in the stacking direction. The superconducting coil device according to any one of claims 1 to 4, wherein the superconducting coil device is provided in a state. A winding member formed by superimposing superconducting wires by winding and having a pair of side surfaces along the radial direction, and the superconducting wires provided on both side surfaces of the winding member and having different turns. The superconducting coil comprising a detour that is electrically connected in the radial direction of the winding member and a heat transfer plate that is provided in contact with the detour in an electrically insulated state is the superconducting coil. A superconducting coil device characterized in that a plurality of coils are stacked in the winding axis direction. The superconducting coil device according to any one of claims 1 to 6, wherein the heat transfer plates facing each other are shared in the adjacent superconducting coils. The superconducting coil device according to any one of claims 1 to 7, wherein the detour is made of a conductive resin. The superconducting coil device according to any one of claims 1 to 8, wherein the heat transfer plate is made of either oxygen-free copper or high-purity aluminum.

Images