JP2021091042A - Polishing device and polishing method - Google Patents

Abstract

To provide a polishing device keeping a polishing rate stable to enable high quality polishing, and to provide a polishing method.SOLUTION: A polishing device continuously polishes a member on the film-like substrate surface of which an object to be polished is formed, and includes: a rotatable polishing tool for acting on the object to be polished; a slurry nozzle supplying polishing slurry; a polishing stage for pressing the polishing tool against the object to be polished; and a jetting nozzle jetting liquid to a space between the polishing stage and the object to be polished. An uneven shape is given to the surface of the polishing stage.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to a polishing apparatus and a polishing method for polishing and removing a metal film on the surface of a continuous object to be polished using a polishing slurry containing an abrasive.

Conventionally, in polishing metals, flat glass, etc., for example, a polishing slurry in which granular abrasives called abrasive grains and water are mixed has been used. Specifically, while supplying the polishing slurry to the surface to be polished (the surface to be polished), the surface to be polished is pressed and polished by a polishing means such as a polishing pad. When it is desired to remove the surface to be polished at a higher speed, polishing using a polishing slurry to which a component having etching performance is added is common, and is called CMP (Chemical Mechanical Polishing). A polishing slurry having such a chemical action has a problem that the removal rate of the material is significantly lowered when the reaction of the chemical components in the polishing slurry is completed, as compared with the polishing slurry having only a simple mechanical action. is there.

The base material constituting the object to be polished includes a wafer-like and single-wafer-like material such as silicon and GaN, and a film-like material such as PET. In the case of a wafer-shaped object to be polished, a polishing slurry is dropped on the surface of the pad using a larger polishing pad compared to the size of the object to be polished, the slurry is impregnated in the pad, and the object to be polished is pressed against the pad surface. Processing is done. The polishing debris generated at that time is discharged to the outer peripheral portion due to the groove shape formed on the pad surface (see, for example, Patent Document 1). On the other hand, particularly when polishing a film-shaped object to be polished, a method of continuously polishing the surface while carrying out web transfer by a roll-to-roll method is required.

Japanese Unexamined Patent Publication No. 2015-013325

When polishing the continuous film-shaped object to be polished, the pad is smaller than the object to be polished. In that case, the polishing pad acting on polishing continues to be in contact with the object to be polished, and the polishing slurry impregnated in the pad is less likely to be replaced with a new polishing slurry. In particular, in the case of the above-mentioned CMP slurry, the polishing rate may decrease due to a chemical reaction, the polishing may not be completed in a predetermined time, and the product quality may deteriorate due to a polishing defect. On the other hand, when continuously polishing a continuous film, it is necessary to continuously convey the film in a stable manner.

In view of the above-mentioned conventional problems, an object of the present disclosure is to provide a polishing apparatus and a polishing method capable of maintaining a stable polishing rate and performing high-quality polishing.

The polishing apparatus according to the present disclosure is a polishing apparatus that continuously polishes a member having an object to be polished formed on the surface of a film-like base material.
A rotatable polishing tool to act on the object to be polished,
A slurry nozzle that supplies polishing slurry and
A polishing stage for pressing the polishing tool against the object to be polished, and
An injection nozzle that injects a liquid between the polishing stage and the object to be polished,
With
The surface of the polishing stage is provided with an uneven shape.

With the polishing apparatus according to the present invention, continuous polishing with high quality and a high removal rate can be realized.

It is a schematic schematic diagram which shows the structure of the polishing apparatus which concerns on Embodiment 1. It is a graph which shows the change of the polishing removal rate when the hydrogen peroxide concentration in this Embodiment 1 is changed. It is a schematic cross-sectional view which shows the uneven shape of the surface of the polishing stage which faces the polishing unit in Embodiment 1. (A) to (d) are schematic schematic views showing various uneven shapes on the surface of the polishing stage according to the first embodiment. (A) is a schematic schematic diagram showing an example of an uneven shape of the entire surface of the polishing stage in the polishing apparatus according to the first embodiment, and (b) is a schematic schematic diagram showing another example of the uneven shape of the entire surface of the polishing stage. Is. It is a graph of the time change of the transport resistance due to the design difference of the entire surface of the polishing stage in the first embodiment.

The polishing apparatus according to the first aspect is a polishing apparatus that continuously polishes a member having an object to be polished formed on the surface of a film-like base material.
A rotatable polishing tool to act on the object to be polished,
A slurry nozzle that supplies polishing slurry and
A polishing stage for pressing the polishing tool against the object to be polished, and
An injection nozzle that injects a liquid between the polishing stage and the object to be polished,
With
The surface of the polishing stage is characterized by having an uneven shape.

In the first aspect of the polishing apparatus according to the second aspect, the injection nozzle may be arranged so that the nozzle is aligned with the concave-convex concave portion.

In the polishing apparatus according to the third aspect, in the first or second aspect, the uneven shape is formed in a stripe shape in a direction perpendicular to the traveling direction of the object to be polished in a plan view of the polishing stage. May be.

In the third aspect, the polishing apparatus according to the fourth aspect has the concave-convex shape with respect to the direction in which the long side of the concave-convex shape is perpendicular to the traveling direction of the object to be polished in the plan view of the polishing stage. It may have an angle greater than 0 ° and less than 90 °.

In the polishing apparatus according to the fifth aspect, in any one of the first to fourth aspects, the concave-convex shape has a long side of the concave-convex shape with respect to a direction perpendicular to the traveling direction of the object to be polished. The size of the acute angle formed in the direction perpendicular to the traveling direction may be smaller than the size of the acute angle formed by the short side of the uneven shape in the direction perpendicular to the traveling direction.

In the polishing apparatus according to the sixth aspect, in any one of the first to fifth aspects, the uneven shape has a long side and a short side with respect to a direction perpendicular to the traveling direction of the object to be polished. The distance between the sides having a small angle may be larger than the distance between the other sides.

In any one of the first to sixth aspects, the polishing apparatus according to the seventh aspect has the uneven shape of the uneven shape on the central portion side of the polishing stage as compared with the end side of the polishing stage. The long side of the shape may have a small angle with respect to the direction perpendicular to the traveling direction of the object to be polished.

In the polishing method according to the eighth aspect, the object to be polished is polished by using the polishing apparatus according to any one of the first to seventh aspects.

Hereinafter, the polishing apparatus and the polishing method according to the embodiment will be described with reference to the attached drawings. In the drawings, substantially the same members are designated by the same reference numerals.

(Embodiment 1)
FIG. 1 is a schematic schematic view showing a configuration of a roll-to-roll polishing apparatus 10 according to the first embodiment. For convenience, the traveling direction (conveying direction) of the member 1 to be polished with the object to be polished formed on the surface of the film-shaped base material was set to the x direction, the width direction was set to the y direction, and the vertically upper direction was set to the z direction.
The roll-to-roll polishing device 10 according to the first embodiment is a polishing device that continuously polishes a member 1 to be polished on which an object to be polished is formed on the surface of a film-like base material. The polishing device 10 presses a rotatable polishing tool (polishing unit) 31 for acting on the member 1 to be polished, a slurry nozzle 21 for supplying a polishing slurry, and a polishing tool 31 against the member 1 to be polished. It includes a polishing stage 4. Further, the surface of the polishing stage 4 is provided with an uneven shape. A back surface injection nozzle 6 for injecting a liquid is installed on the member 1 to be polished and the polishing stage 4.
Therefore, according to this polishing apparatus 10, continuous polishing with high quality and a high removal rate can be realized.

The film-shaped member to be polished 1 having the material to be polished formed on the surface is supplied from the unwinding roll 11 and collected by the winding roll 12. A polishing stage 4 is arranged between the unwinding roll 11 and the take-up roll 12, and the member 1 to be polished is conveyed while sliding on the polishing stage 4.

The back surface injection nozzle 6 injects the polishing slurry between the member 1 to be polished and the polishing stage 4 when the member 1 to be polished is conveyed. The back surface injection nozzle 6 is arranged so that the nozzle is along the surface of the polishing stage 4 so that the polishing slurry is efficiently supplied between the member 1 to be polished and the polishing stage 4. More preferably, the back surface injection nozzle 6 is arranged so that the nozzle is aligned with the concave-convex concave portion provided on the surface of the polishing stage 4. As a result, the polishing slurry ejected from the back surface injection nozzle 6 spreads in the width direction (y direction) of the member 1 to be polished along the concave-convex concave portion provided on the surface of the polishing stage 4. That is, the back surface injection nozzle 6 can efficiently supply the polishing slurry to the vicinity of the center in the width direction even in the member 1 to be polished which is long in the width direction (y direction), which is particularly seen in the roll-to-roll method. Therefore, the transport resistance of the member 1 to be polished is reduced.

In the present embodiment, the back surface injection nozzle 6 is assumed to be installed outside the polishing stage 4, but may be installed inside the polishing stage 4, for example. In this case, for example, the polishing stage 4 has a hole portion, and the polishing slurry injected from the back surface injection nozzle 6 installed inside the polishing stage 4 passes through the hole portion between the member 1 to be polished and the polishing stage 4. Supplied.
It is preferable that the back surface injection nozzle 6 continuously injects the polishing slurry during the transportation of the member 1 to be polished. Further, it is preferable that the back surface injection nozzle 6 injects a polishing slurry that is unused or collected and reused downstream of transportation. As a result, it is possible to reduce the decrease in the concentration of the polishing slurry due to the extra component entering the processed interface to be polished of the member 1 to be polished, and to prevent the removal rate from decreasing.

A polishing unit 31 including a polishing pad 311 and a polishing head 312 with a nozzle is fixedly arranged on the polishing stage 4. The polishing head 312 is provided with a hole in the center so that the polishing slurry supplied from the upper part can be poured downward. A plurality of sets of polishing units 31 are arranged at positions parallel to the traveling direction (conveying direction) (x direction) and the width direction (y direction) of the film-shaped member 1 to be polished.

FIG. 2 is a graph showing a change in the polishing removal rate when the hydrogen peroxide concentration in the first embodiment is changed. The polishing slurry prepared for polishing is prepared in the slurry supply tank 2 through, for example, a hydrogen peroxide solution having a concentration of 0.75 wt% or more and 3.0 wt% or less, and then passed through the slurry nozzle 21. It is supplied to each polishing unit 31. As shown in the concentration range A of FIG. 2, it is desirable that the concentration range A is in the process of imparting an etching action because the polishing removal rate is high. The concentration range A is a concentration range of 0.75 wt% or more and 3.0 wt% or less.

The polishing slurry supplied through the pores of the polishing head 312 is dropped on the surface of the film-shaped member 1 to be polished. At the same time, the polishing unit 31 contacts and pressurizes the surface of the film-shaped member 1 to be polished, and rotates on the surface. In this operation, the material to be polished on the surface is removed by the polishing action of the polishing pad 311. The polishing slurry used for polishing flows down from the side surface of the polishing stage 4, drops onto the recovery pan 5, and is then collected in a recovery tank (not shown).

Hereinafter, each member constituting the polishing apparatus 10 will be described.

<polishing unit (polishing tool)>
The polishing unit 31 includes a polishing pad 311 and a polishing head 312 with a nozzle. The polishing unit 31 can rotate about the z-axis as a rotation axis, and acts on the film-shaped member 1 to be polished. A slurry nozzle 21 is provided above the polishing head 312. The polishing slurry supplied via the slurry nozzle 21 is dropped onto the surface of the film-shaped member 1 to be polished on the lower surface of the polishing pad 311 through the holes of the polishing head 312. That is, the slurry nozzle 21 supplies the polishing slurry between the polishing pad 311 and the film-shaped member 1 to be polished.

<Slurry supply tank>
The polishing slurry is held in the slurry supply tank 2. In the slurry supply tank 2, the polishing slurry is prepared, for example, with a hydrogen peroxide solution having a concentration of 0.75 wt% or more and 3.0 wt% or less.

<Polishing stage>
FIG. 3 is a schematic cross-sectional view showing the uneven shape of the surface of the polishing stage 4 facing the polishing unit 31. On the surface of the polishing stage 4, an uneven shape 41 having a height difference of 100 μm to 300 μm formed by etching or blasting is formed. The height difference is the difference between the height of the concave portion in the z direction and the height of the convex portion in the z direction.

FIG. 4 is a schematic schematic view showing various uneven shapes on the surface of the polishing stage 4 according to the first embodiment. In FIG. 4, the convex portion of the concave-convex shape is drawn.

As shown in FIG. 4A, in the modified example 1, the concave-convex shape 41 is striped in a direction (y direction) perpendicular to the traveling direction of the film-shaped member 1 to be polished in a plan view from the z direction. It is formed. That is, the angle θ1 formed by the long side of the concave-convex shape and the y direction is 0 °. This is even better because the entire surface to be polished is uniformly polished.

Alternatively, as shown in FIG. 4B, the concave-convex shape 41 has a long side of the concave-convex shape in a plan view from the z direction in a direction perpendicular to the traveling direction of the film-shaped member 1 to be polished, as shown in FIG. 4 (b). The angle θ2 formed with respect to the y direction) is larger than 0 ° and smaller than 90 °, and is formed in a striped shape. That is, the concave-convex shape 41 has an angle θ2 in which the long side is larger than 0 ° and smaller than 90 ° with respect to the direction (y direction) perpendicular to the traveling direction of the member 1 to be polished. This is even better because the direction in which the polishing slurry supplied for lubrication sprayed on the back surface is discharged when the polishing slurry on the back surface is discharged can be controlled by pressurization from above accompanying polishing. .. Preferably, the concave-convex shape 41 has an angle of 30 ° to 60 ° with respect to the direction (y direction) perpendicular to the traveling direction of the member 1 to be polished. More preferably, the concave-convex shape 41 has an angle of 45 ° with respect to the direction (y direction) perpendicular to the traveling direction of the member 1 to be polished.

Alternatively, as shown in FIG. 4C, the concave-convex shape 41 has a striped shape intermittently formed in the plan view from the z direction in the modified example 3. That is, it is desirable that the angle θ31 formed by the long side and the y direction is smaller than the angle θ32 formed by the short side and the y direction for the quadrangular shape of each convex portion in the concave-convex shape 41. That is, the relationship of θ31 <θ32 may be satisfied. Alternatively, it is desirable that the distance between the sides having a small angle with respect to the y direction is larger than the distance between the other sides of the convex portions in the concave-convex shape 41. Alternatively, it may be arranged so as to satisfy both of them. As a result, the polishing slurry is not discharged and easily stays on the back surface of the film-shaped member 1 to be polished, and the transport resistance of the film is reduced, which is even more preferable.

Alternatively, as shown in FIG. 4D, the concave-convex shape 41 has the concave-convex shape 41 in the direction (y direction) perpendicular to the traveling direction of the film-shaped member 1 to be polished in a plan view from the z direction in the modified example 4. , Formed in stripes with angles θ41 and θ42 that vary within an angle greater than 0 ° and less than 90 °. At this time, the concave-convex shape 41 has a long side of the concave-convex shape on the central portion side of the polishing stage 4 and the y-direction, as compared with an angle θ42 formed by the long side of the concave-convex shape on the end side of the polishing stage 4 and the y direction. It is preferable that the formed angle θ41 is smaller. That is, the relationship of θ41 <θ42 may be satisfied. This is even more preferable because the polishing slurry is not discharged and easily stays on the back surface of the film-shaped member 1 to be polished, and the transport resistance of the film is reduced. In FIG. 4D, it is assumed that the lower part of the drawing (-y direction) is close to the end portion of the polishing stage 4.

5 (a) and 5 (b) are schematic schematic views showing the uneven shape of the entire surface of the polishing stage 4 in the first embodiment and another example. FIG. 6 is a graph of the time change of the transport resistance due to the difference in the design of the entire surface of the polishing stage 4 in the first embodiment.

As shown in FIG. 5A, as an example, the entire surface of the polishing stage 4 may have an uneven shape having the same design. That is, the angle θ5 formed by the long side of the concave-convex shape 41e and the y direction may be the same on the entire surface. Further, as shown in FIG. 5B, as another example, the uneven shape 41f may adopt a different style depending on the location in the polishing stage 4. More preferably, the angles θ61 and θ63 formed by the direction (y direction) perpendicular to the traveling direction of the member 1 to be polished on the film and the long sides of the concave-convex shapes 41f and 41h are 0 ° only on the end side of the polishing stage 4. It is arranged to be larger and smaller than 90 °. As a result, as compared with the case where the entire surface of the polishing stage 4 shown in FIG. 5A has the same design, the liquid for lubrication is not discharged and it becomes easier to stay on the back surface of the film-shaped member 1 to be polished. Therefore, in the case of the uneven shape of the front surface shown in FIG. 5 (b), as shown in FIG. 6, the transport resistance of the film does not increase when polishing is continued for a long time, which is even better. In the central portion of the polishing stage 4, the angle θ62 formed by the long side of the uneven shape 41 g and the y direction may be 0 °.

It should be noted that the present disclosure includes appropriately combining any of the various embodiments and / or examples described above, and the respective embodiments and / or embodiments. The effects of the examples can be achieved.

According to the polishing apparatus according to the present invention, continuous polishing with high quality and a high removal rate can be realized.

1 Member to be polished 11 Unwinding roll 12 Winding roll 2 Slurry supply tank 21 Slurry nozzle 22 Slurry supply pipe 31 Polishing unit (polishing tool)
311 Polishing pad 312 Polishing head 4 Polishing stages 41, 41a, 41b, 41c, 41d, 41e, 41f, 41g, 41h Concavo-convex shape 5 Recovery pan 6 Backside injection nozzle 10 Roll-to-roll polishing device (polishing device)

Claims (8)

A polishing device that continuously polishes a member on which an object to be polished is formed on the surface of a film-like base material.
A rotatable polishing tool to act on the object to be polished,
A slurry nozzle that supplies polishing slurry and
A polishing stage for pressing the polishing tool against the object to be polished, and
An injection nozzle that injects a liquid between the polishing stage and the object to be polished,
With
The surface of the polishing stage is characterized by having an uneven shape.
Polishing equipment. The injection nozzle is arranged so that the nozzle is aligned with the concave-convex concave portion.
The polishing apparatus according to claim 1. The uneven shape is formed in a stripe shape in a direction perpendicular to the traveling direction of the object to be polished in a plan view of the polishing stage.
The polishing apparatus according to claim 1 or 2. The uneven shape has an angle in which the long side of the uneven shape is greater than 0 ° and smaller than 90 ° with respect to the direction perpendicular to the traveling direction of the object to be polished in the plan view of the polishing stage.
The polishing apparatus according to claim 3. The concave-convex shape has an acute angle that the long side of the concave-convex shape is perpendicular to the traveling direction with respect to the direction perpendicular to the traveling direction of the object to be polished. Smaller than the size of the acute angle formed by the direction perpendicular to the direction of travel,
The polishing apparatus according to any one of claims 1 to 4. In the uneven shape, the distance between the long side and the short side having a small angle with respect to the direction perpendicular to the traveling direction of the object to be polished is larger than the distance between the other sides.
The polishing apparatus according to any one of claims 1 to 5. The concave-convex shape has a smaller angle on the central portion side of the polishing stage with respect to the direction in which the long side of the concave-convex shape is perpendicular to the traveling direction of the object to be polished, as compared with the end side of the polishing stage.
The polishing apparatus according to any one of claims 1 to 6. A polishing method for polishing an object to be polished using the polishing apparatus according to any one of claims 1 to 7.

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