JP2021034611A - Transport device and substrate processing apparatus - Google Patents

Abstract

To provide a transport device and a substrate processing apparatus that can stably exhaust particles.SOLUTION: A cleaning part transport device 32a comprises: a housing exhaust port; an arm transport mechanism 62 that linearly moves a gripping mechanism 600 for gripping a wafer; a base housing 400 that accommodates the arm transport mechanism 62; a cable protection member 410 that includes a fixed end part 412 fixed to the base housing 400, a movement end part 414 connected to the gripping mechanism 600, and a flexible body part 416 connecting the fixed end part 412 and the movement end part 414, and is arranged between the housing exhaust port and the arm transport mechanism 62; and a support member 430 that has a contact surface in contact with a bottom face of the cable protection member 410, and includes a girder member 434 in which a support plate member 432 extending in a moving direction of the gripping mechanism 600 and a communication passage 436 supporting the support plate member 432 and communicating the arm transfer mechanism 62 and the housing exhaust port are formed.SELECTED DRAWING: Figure 11

Description

The present invention relates to a transfer device and a substrate processing device.

In an apparatus for processing a substrate such as a semiconductor wafer, it is known that particles generated due to contact between parts in the apparatus are exhausted.

For example, as described in Patent Document 1, one end of a cable protection member for laying a cable and a hose inside is connected to a movable portion, and the reciprocating linear movement follows the reciprocating linear movement of the movable portion. To do. The device described in Patent Document 1 exhausts particles generated when the bottom surface of the cable protection member comes into contact with the fixed surface during this reciprocating linear movement through a suction port formed in the cable protection member. Further, in the device described in Patent Document 1, the contact area of the bottom surface of the cable protection member is reduced by providing the support protrusion on the fixed surface to reduce the generation of particles.

Further, as described in Patent Document 2, it is also known that in a semiconductor wafer polishing apparatus, the spray of grinding water generated in the polishing region and the polishing debris of the polishing pad are removed through separate exhaust paths. Has been done. This polishing apparatus faces the first duct provided in the atmosphere of the first grinding region where the spray of grinding water is generated and the atmosphere of the second grinding region where the polishing debris is generated. Includes a second duct provided above and a connecting duct connecting the first duct and the second duct. In this polishing apparatus, the spray of grinding water is exhausted through the first duct, and the grinding debris is exhausted through the second duct, so that the spray of grinding water and the grinding debris are integrated and thickened. It suppresses becoming a sticky object.

Japanese Unexamined Patent Publication No. 2006-28015 Japanese Patent No. 5149090

The apparatus described in Patent Documents 1 and 2 does not consider that particles are stably exhausted regardless of the arrangement of parts inside the apparatus. That is, if a component exists between the exhaust port of the device and the source of particles, the flow path resistance between the exhaust port and the source of particles increases, and as a result, particles may not be sufficiently exhausted. ..

In particular, when there are moving parts between the exhaust port and the particle source, the flow path resistance between the exhaust port and the particle source changes according to the movement of the moving parts, so the particles are stable. There is a risk that it cannot be exhausted.

Therefore, one object of the present application is to provide a transport device and a substrate processing device capable of stably exhausting particles.

In one embodiment, the present application is fixed to an exhaust portion connected to an exhaust device, a transport mechanism for linearly moving a gripping mechanism for gripping an object, a housing for accommodating the transport mechanism, and a housing. It has a fixed end portion, a moving end portion connected to a gripping mechanism, and a flexible main body portion connecting the fixed end portion and the moving end portion. A cable protection member arranged between the transfer mechanism and a support member for supporting the cable protection member, which has a contact surface in contact with the bottom surface of the cable protection member and is along the moving direction of the gripping mechanism. Conveyance including a support member including a first support member to be stretched and a second support member having a communication path for supporting the first support member and communicating the transport mechanism and the exhaust portion. Disclose the device.

FIG. 1 is a plan view showing the overall configuration of the substrate processing apparatus according to the embodiment of the present invention. FIG. 2 is a side view of the substrate processing apparatus shown in FIG. 1 as viewed from the cleaning unit side. FIG. 3 is a side view showing a cleaning unit transport device of the first cleaning unit of the cleaning unit shown in FIG. FIG. 4 is a perspective view showing a state in which the second wafer gripping mechanism of the cleaning unit transport device shown in FIG. 3 grips the substrate with the upper chuck top. FIG. 5 is a perspective view showing a state in which the second wafer gripping mechanism of the cleaning unit transport device shown in FIG. 3 grips the substrate with the lower chuck top. FIG. 6 is a schematic view for explaining the operation of the second wafer gripping mechanism of the cleaning unit transfer device shown in FIG. FIG. 7 is a schematic view for explaining the operation of the second wafer gripping mechanism of the cleaning unit transfer device shown in FIG. FIG. 8 is a schematic view for explaining the operation of the second wafer gripping mechanism of the cleaning unit transfer device shown in FIG. FIG. 9 is a schematic view for explaining the operation of the second wafer gripping mechanism of the cleaning unit transfer device shown in FIG. FIG. 10 is a schematic view for explaining the operation of the second wafer gripping mechanism of the cleaning unit transfer device shown in FIG. FIG. 11 is a perspective view showing a cleaning unit transport device of the first cleaning unit of the cleaning unit shown in FIG. FIG. 12 is an enlarged view showing a part of the cleaning unit transport device shown in FIG. 11 in an enlarged manner. FIG. 13 is an enlarged view showing a part of the cleaning unit transport device shown in FIG. 11 in an enlarged manner. FIG. 14 is a side view showing a cleaning unit transport device of the first cleaning unit of the cleaning unit shown in FIG. FIG. 15 is an enlarged view showing a part of the cleaning unit transport device shown in FIG. 14 in an enlarged manner. FIG. 16 is a plan view showing a cleaning unit transport device of the first cleaning unit of the cleaning unit shown in FIG. FIG. 17 is a side view showing a gripping mechanism of the cleaning unit transport device of the first cleaning unit of the cleaning unit shown in FIG. FIG. 18 is a perspective view showing a gripping mechanism of the cleaning unit transport device of the first cleaning unit of the cleaning unit shown in FIG. FIG. 19 is a schematic view showing the piping connection of the vacuum generator.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. However, the drawings used are schematic views. Therefore, the size, position, shape, etc. of the illustrated parts may differ from the size, position, shape, etc. in the actual device. Further, in the following description and the drawings used in the following description, the same reference numerals are used for parts that can be configured in the same manner, and duplicate description is omitted.

FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 is a side view of the polishing apparatus shown in FIG. 1 as viewed from the cleaning unit side. As shown in FIGS. 1 and 2, the substrate processing apparatus 10 in the present embodiment includes a housing having a substantially rectangular shape in a plan view, and the inside of the housing is cleaned with a load / unload portion 11 and a polishing portion 12 by a partition wall. It is divided into a unit 13 and a transport unit 14. The load / unload section 11, the polishing section 12, the cleaning section 13, and the transport section 14 are assembled independently and exhausted independently. Further, the substrate processing apparatus 10 is provided with a control unit 15 (also referred to as a control panel) that controls the operations of the load / unload unit 11, the polishing unit 12, the cleaning unit 13, and the transport unit 14.

<Load / Unload section>
The load / unload unit 11 includes a plurality of (four in the illustrated example) front load units 113 on which a wafer cassette for stocking a large number of wafers (boards) W is placed. These front load portions 113 are arranged adjacent to each other in the width direction (direction perpendicular to the longitudinal direction) of the substrate processing apparatus 10. An open cassette, a SMIF (Standard Manufacturing Interface) pod, or a FOUP (Front Opening Applied Pod) can be mounted on the front load unit 113. Here, SMIF and FOUP are closed containers that can maintain an environment independent of the external space by storing the wafer cassette inside and covering it with a partition wall.

Further, a traveling mechanism 112 is laid in the load / unloading portion 11 along the arrangement direction of the front loading portion 113, and the traveling mechanism 112 can be moved along the arrangement direction of the front loading portion 113 on the traveling mechanism 112. The robot 111 is installed. The transfer robot 111 can access the wafer cassette mounted on the front load portion 113 by moving on the traveling mechanism 112. The transfer robot 111 includes two upper and lower hands. For example, the upper hand is used when returning the wafer W to the wafer cassette, and the lower hand is used when transferring the wafer W before polishing. Therefore, the upper and lower hands can be used properly. Instead of this, the wafer W may be conveyed with only a single hand.

Since the load / unload section 11 is the area that needs to be kept in the cleanest state, the inside of the load / unload section 11 is larger than the outside of the apparatus, the polishing section 12, the cleaning section 13, and the transport section 14. It is always maintained at high pressure. Further, a filter fan unit (not shown) having a clean air filter such as a HEPA filter or a ULPA filter is provided above the traveling mechanism 112 of the transfer robot 111, and particles, toxic steam, and particles are generated by this filter fan unit. Clean air from which the gas has been removed is constantly blowing downward.

<Transport section>
The transport section 14 is a region for transporting the wafer before polishing from the load / unload section 11 to the polishing section 12, and is provided so as to extend along the longitudinal direction of the substrate processing device 10. As shown in FIG. 1, the transport section 14 is arranged adjacent to both the load / unload section 11 which is the cleanest area and the polishing section 12 which is the dirtiest area. Therefore, the particles in the polishing section 12 flow from the load / unload section 11 side to the polishing section 12 side inside the transport section 14 so as not to diffuse into the load / unload section 11 through the transport section 14. An air flow is formed.

<Polishing part>
As shown in FIG. 1, the polishing unit 12 is a region where the wafer W is polished, and is a first polishing unit 20a having a first polishing device 21a and a second polishing device 21b, and a third polishing device 21.
A second polishing unit 20b having c and a fourth polishing device 21d, and a polishing unit transport mechanism 22 arranged so as to be adjacent to each of the transport unit 14, the first polishing unit 20a, and the second polishing unit 20b. Have. The polishing unit transfer mechanism 22 is arranged between the cleaning unit 13 and the first polishing unit 20a and the second polishing unit 20b in the width direction of the substrate processing device 10.

The first polishing device 21a, the second polishing device 21b, the third polishing device 21c, and the fourth polishing device 21d are arranged along the longitudinal direction of the substrate processing device 10.

<Washing section>
As shown in FIGS. 1 and 2, the cleaning unit 13 is a region for cleaning the polished wafer, and has a first cleaning unit 30a and a second cleaning unit 30b arranged in two upper and lower stages. The above-mentioned transport unit 14 is arranged between the first cleaning unit 30a and the second cleaning unit 30b. Since the first cleaning unit 30a, the transport unit 14, and the second cleaning unit 30b are arranged so as to overlap each other in the vertical direction, an advantage that the footprint is small can be obtained.

As shown in FIGS. 1 and 2, the first cleaning unit 30a includes a plurality of cleaning modules 311a, 312a, 313a, 314a, a wafer station 33a, and cleaning modules 311a to 314a, respectively (four in the illustrated example). It has a cleaning unit transfer device 32a that transfers the wafer W between the wafer station 33a and the wafer station 33a. The plurality of cleaning modules 311a to 314a and the wafer station 33a are arranged in series along the longitudinal direction of the substrate processing apparatus 10. A filter fan unit (not shown) having a clean air filter is provided above each of the cleaning modules 311a to 314a, and clean air from which particles have been removed by the filter fan unit is constantly blown downward. There is. Further, the inside of the first cleaning unit 30a is always maintained at a pressure higher than that of the polishing unit 12 in order to prevent the inflow of particles from the polishing unit 12.

Similarly, the second cleaning unit 30b is located between a plurality of (four in the illustrated example) cleaning modules 311b, 312b, 313b, 314b, the wafer station 33b, and between the cleaning modules 311b to 314b and the wafer station 33b. It has a cleaning unit transfer device 32b that conveys the wafer W at the above. The plurality of cleaning modules 311b to 314b and the wafer station 33b are arranged in series along the longitudinal direction of the substrate processing apparatus 10. A filter fan unit (not shown) having a clean air filter is provided above each of the cleaning modules 311b to 314b, and clean air from which particles have been removed by the filter fan unit is constantly blown downward. There is. Further, the inside of the second cleaning unit 30b is always maintained at a pressure higher than that of the polishing unit 12 in order to prevent the inflow of particles from the polishing unit 12.

Preliminary cleaning modules 39a and 39b may be added to the cleaning modules 311a to 314a and 311b to 314b, respectively.

FIG. 3 is a side view showing the cleaning unit transport device 32a of the first cleaning unit 30a. As shown in FIG. 3, the cleaning unit transfer device 32a includes a plurality of first wafer gripping mechanism 601 and second wafer gripping mechanism 602 for gripping the wafer W, and a plurality of first wafer gripping mechanism 601 and second wafer gripping mechanism 602. It has an arm transfer mechanism 62 that linearly moves along the arrangement direction of the cleaning modules 311a to 314a. That is, in the present embodiment, the number of wafer gripping mechanisms 601 and 602 is smaller than the number of cleaning modules 311a to 314a.

In the present embodiment, for example, the first wafer gripping mechanism 601 and the second wafer gripping mechanism 602 can be used properly according to the cleanliness of the wafer W. For example, among the primary to quaternary cleaning modules 311a to 314a, the primary cleaning module 311a and the secondary cleaning module 312a in the first half of the cleaning process use the first wafer gripping mechanism 601 and the tertiary cleaning module 313a and the secondary cleaning module 313a in the latter half of the cleaning process By using the second wafer gripping mechanism 602 in the fourth cleaning module 314a, it is possible to prevent the wafer W in the latter half of the cleaning process from coming into contact with the first wafer gripping mechanism 601 and being contaminated.

More specifically, the first wafer gripping mechanism 601 includes a pair of openable and closable first arms 611 for gripping the wafer, a first vertical movement mechanism 641 for vertically moving the pair of first arms 611, and a pair of first arms. A first rotation mechanism 631 that rotates the 611 around a rotation shaft 631A parallel to the opening / closing direction, and a first opening / closing mechanism 661 that opens and closes the pair of first arms 611 in a direction close to each other or away from each other. Have.

Similarly, the second wafer gripping mechanism 602 includes a pair of openable and closable second arms 612 that grip the wafer, a second vertical movement mechanism 642 that moves the pair of second arms 612 up and down, and a pair of second arms 612. It has a second rotation mechanism 632 that rotates around a rotation shaft 632A parallel to the opening / closing direction, and a second opening / closing mechanism 662 that opens and closes a pair of second arms 612 in a direction close to each other or away from each other. doing.

As the arm transfer mechanism 62, for example, a motor drive mechanism using a ball screw is used. As shown in FIG. 3, the ball screw of the arm transport mechanism 62 is provided above the cleaning modules 311a to 314a so as to extend in the arrangement direction of the cleaning modules 311a to 314a.

A gripping mechanism 600 for gripping the wafer W is attached to the ball screw of the arm transport mechanism 62. Specifically, the gripping mechanism 600 includes a main frame 68 attached to the ball screw of the arm transport mechanism 62, and various parts provided on the main frame 68. The main frame 68 is attached so as to hang downward from the ball screw of the arm transport mechanism 62, and faces the side surfaces of the cleaning modules 311a to 314a. By driving the motor connected to the ball screw of the arm transfer mechanism 62, the main frame 68 is linearly moved along the arrangement direction of the cleaning modules 311a to 314a while facing the side surfaces of the cleaning modules 311a to 314a.

In the illustrated example, the mainframe 68 has a depth direction moving mechanism 67 for adjusting the position in the depth direction (direction perpendicular to both the arrangement direction and the vertical direction of the cleaning modules 311a to 314a). There is. As the depth direction moving mechanism 67, for example, a motor drive mechanism using a rack and pinion is used. The position of the main frame 68 in the depth direction is adjusted by driving the depth direction movement mechanism 67.

The first vertical movement mechanism 641 and the second vertical movement mechanism 642 are provided on the main frame 68. As the first vertical movement mechanism 641 and the second vertical movement mechanism 642, for example, a motor drive mechanism using a ball screw is used. As shown in FIG. 3, the ball screw of the first vertical movement mechanism 641 is attached so as to extend in the vertical direction at the left end portion of the main frame 68, and the ball screw of the second vertical movement mechanism 642 is attached to the main frame 68. It is attached so as to extend in the vertical direction at the right end of the.

The gripping mechanism 600 further includes various parts provided on the first subframe 691 and the first subframe 691. The first subframe 691 is attached to the ball screw of the first vertical movement mechanism 641 and supports a pair of first arms 611. The first subframe 691 is provided on the left side of the main frame 68 so as to be adjacent to the main frame 68, and faces the side surfaces of the cleaning modules 311a to 314a. The first subframe 691 is linearly moved along the vertical direction by driving a motor connected to the ball screw of the first vertical movement mechanism 641.

The gripping mechanism 600 further includes a second subframe 692 and various components provided on the second subframe 692. The second subframe 692 is attached to the ball screw of the second vertical movement mechanism 642 and supports a pair of second arms 612. The second subframe 692 is provided on the right side of the main frame 68 so as to be adjacent to the main frame 68 so as to face the side surfaces of the cleaning modules 311a to 314a. The second subframe 692 is linearly moved along the vertical direction by driving the motor connected to the ball screw of the second vertical movement mechanism 642.

Since the first subframe 691 and the second subframe 692 have substantially the same structure except that they are symmetrical with respect to the main frame 68, the second subframe 692 will be described below.

As shown in FIG. 3, the pair of second arms 612 are arranged parallel to each other, and the base end portion of the second arm 612 is attached to a rotating shaft 632A rotatably provided on the second subframe 692. Has been done. Further, a second rotation mechanism 632 for rotating the pair of second arms 612 around the rotation shaft 632A is provided on the second subframe 692. As the second rotation mechanism 632, for example, a motor drive mechanism is used. The rotation shaft of the second rotation mechanism 632 is connected to the rotation shaft 632A via a link member 632L. The rotational force of the second rotation mechanism 632 is transmitted to the rotation shaft 632A via the link member 632L, and the pair of second arms 612 are rotated around the rotation shaft 632A.

Further, on the second subframe 692, a second opening / closing mechanism 662 that opens / closes the pair of second arms 612 in a direction close to each other or in a direction away from each other is provided. As the second opening / closing mechanism 662, for example, an air cylinder is used. By closing the pair of second arms 612 by the second opening / closing mechanism 662, the pair of second arms 612 sandwiches and holds the peripheral edge portion of the wafer W.

FIG. 4 is a perspective view showing a state in which the second wafer gripping mechanism of the cleaning unit transport device shown in FIG. 3 grips the substrate with the upper chuck top. FIG. 5 is a perspective view showing a state in which the second wafer gripping mechanism of the cleaning unit transport device shown in FIG. 3 grips the substrate with the lower chuck top. As shown in FIGS. 4 and 5, the pair of second arms 612 are provided with chuck pieces 612a and 612b that can come into contact with the outer peripheral portion of the wafer W in two upper and lower stages. For example, the wafer W having a relatively high cleanliness is held by the upper chuck piece 612a, and the wafer having a relatively low cleanliness is held by the lower chuck piece 612b, so that the lower chuck piece 612b is cleaned. It is possible to prevent the wafer W from being contaminated by contacting the wafer W with a high degree of contact.

Next, an example of the operation of the pair of second arms 612 will be described with reference to FIGS. 6 to 10. Each cleaning module is partitioned by a housing 91 so that the fluid used does not scatter to the outside during cleaning of the wafer W, and an arm passage opening 94 is formed on the side surface of the housing 91. The arm passage opening 94 is provided with a shutter 97 that can be opened and closed.

When the washed wafer W is taken out from the housing 91, as shown in FIG. 6, the pair of second arms 612 whose tips are directed upward are adjacent to the housing 91 by driving the arm transport mechanism 62. Moved to the standby position. In the present embodiment, even if the shutter 97 of the housing 91 is closed, by pointing the tips of the pair of second arms 612 upward, the pair of second arms 612 can be placed in a standby position adjacent to the housing 91. Can be moved to. Therefore, the start timing of the wafer take-out operation can be accelerated, and the throughput of the entire process can be improved.

Next, as shown in FIGS. 7 and 8, the pair of second arms 612 are rotated about the rotation shaft 632A by driving the second rotation mechanism 632. In the illustrated example, the pair of second arms 612 are rotated 90 ° clockwise about the rotation axis 632A in a side view, and the tips of the pair of second arms 612 are oriented sideways.

Next, as shown in FIG. 9, by driving the second vertical drive mechanism 642, the pair of second arms 612 are raised to the same height position as the arm passage opening 94. At this time, the shutter 97 is retracted and the arm passage opening 94 is opened.

Next, as shown in FIG. 10, by driving the second opening / closing mechanism 662, the pair of second arms 612 are closed in a direction close to each other and inserted into the housing 91 through the arm passage opening 94. , The wafer W in the housing 91 is gripped. Then, the pair of second arms 612 gripping the wafer W is moved to the next cleaning module by driving the arm transfer mechanism 62.

When the wafer W before cleaning is carried into the housing 91, the above-described operations shown in FIGS. 6 to 10 are performed in the reverse order. That is, as shown in FIG. 10, the pair of second arms 612 gripping the wafer W is moved to the inside of the housing 91 through the arm passage opening 94 by the drive of the arm transfer mechanism 62.

Next, as shown in FIG. 9, by driving the second opening / closing mechanism 662, the pair of second arms 612 are opened in a direction away from each other, and are brought out of the housing 91 through the arm passage opening 94. Is done.

Next, as shown in FIG. 8, by driving the second vertical drive mechanism 642, the pair of second arms 612 are lowered to a height position lower than the arm passage opening 94. At this time, the arm passage opening 94 is closed by the shutter 97, and the wafer W cleaning process is started inside the housing 91.

Next, as shown in FIGS. 7 and 6, the pair of second arms 612 are rotated about the rotation shaft 632A by driving the second rotation mechanism 632. In the illustrated example, the pair of second arms 612 are rotated 90 ° counterclockwise about the rotation axis 632A in a side view, and the tips of the pair of second arms 612 are directed upwards. Then, the pair of second arms 612 whose tips are directed upward are moved to the next cleaning module by driving the arm transport mechanism 62. In the present embodiment, when the second rotation mechanism 632 rotates the pair of second arms 612 so that the tips face upward, the second vertical movement mechanism 642 lowers the pair of second arms 612. The space required above the pair of second arms 612 can be reduced.

FIG. 11 is a perspective view showing a cleaning unit transport device 32a of the first cleaning unit 30a. 12 and 13 are enlarged views showing a part of the cleaning unit transport device shown in FIG. 11 in an enlarged manner. FIG. 14 is a side view showing a cleaning unit transport device of the first cleaning unit of the cleaning unit shown in FIG. FIG. 15 is an enlarged view showing a part of the cleaning unit transport device shown in FIG. 14 in an enlarged manner. FIG. 16 is a plan view showing a cleaning unit transport device of the first cleaning unit of the cleaning unit shown in FIG.

In the present embodiment, the cleaning unit transport device 32a functions as a transport device for gripping and transporting the wafer W. However, the object to be transported is not limited to the wafer W, and may be, for example, food or a pharmaceutical product. In this case, the food transport device or the drug transport device can incorporate various configurations for particle exhaust described below. Since the cleaning unit transfer device 32b has the same configuration as the cleaning unit transfer device 32a, the description thereof will be omitted.

The cleaning unit transfer device 32a includes a base housing (base housing) 400 that houses the above-mentioned arm transfer mechanism 62 for linearly moving the gripping mechanism 600 along the arrangement direction of the plurality of cleaning modules 311a to 314a.

The base housing 400 further includes a cable protection member 410 that houses various cables, pipes, or hoses used in the cleaning unit transfer device 32a. The cable protection member 410 includes a fixed end portion 412 fixed to the base housing 400, a moving end portion 414 connected to the gripping mechanism 600, and a main body portion 416 connecting the fixed end portion 412 and the moving end portion 414. Has. The main body 416 is a flexible or flexible member. The main body 416 may be a member that organizes, protects, and guides tubes, hoses, or wirings that move with the movement of the gripping mechanism 600. The main body 416 may be a resin or metal member such as a bellows, a coil, a clamp, or an SF tube, and may be a commercially available product. The cable protection member 410 may be, for example, a cable bear (registered trademark) manufactured by Tsubakimoto Chain Co., Ltd. The cable protection member 410 accommodates the cable, the pipe, or the hose in the main body 416, and supports and guides the cable, the pipe, or the hose without applying an excessive force to the cable, the pipe, or the hose.

As shown in FIG. 13, a housing exhaust port 420 is formed on the side wall of the base housing 400 as an exhaust portion connected to, for example, an exhaust device (not shown) for factory exhaust. The housing exhaust port 420 serves as an exhaust port for discharging particles generated in the base housing 400, the main frame 68, the first subframe 691, and the second subframe 692 to the outside.

Inside the base housing 400, the arm transport mechanism 62 is mentioned as one of the sources of particles. Since the arm transfer mechanism 62 is, for example, a motor drive mechanism using a ball screw, droplets of grease applied to the ball screw may be generated as particles during the operation of the arm transfer mechanism 62.

Here, since the cable protection member 410 is arranged between the housing exhaust port 420 and the arm transfer mechanism 62, it becomes a flow path resistance when the particles generated by the arm transfer mechanism 62 are exhausted from the housing exhaust port 420. obtain. Further, since the cable protection member 410 moves with the linear movement of the gripping mechanism 600, it becomes a factor of varying the flow path resistance between the arm transport mechanism 62 and the housing exhaust port 420.

Therefore, in the present embodiment, a support member 430 for supporting the cable protection member 410 is included. The support member 430 includes a first support member that has an abutting surface that comes into contact with the bottom surface of the cable protection member and extends along the moving direction of the gripping mechanism 600. Specifically, the first support member includes a plurality of support plate members 432 extending along the moving direction of the gripping mechanism 600 and arranged at intervals from each other. A low friction member 433 (for example, Teflon (registered trademark) tape) is provided on the contact surface of the first support member (plurality of support plate members 432) with the bottom surface of the cable protection member 410.

Further, the support member 430 includes a second support member in which a communication passage 436 for supporting the first support member and communicating the arm transport mechanism 62 and the housing exhaust port 420 is formed. Specifically, the second support member includes a plurality of girder members 434 that are stretched in a direction orthogonal to the stretching direction of the plurality of support plate members 432 and arranged at intervals from each other. The communication passage 436 is formed between adjacent girder members 434. In the present embodiment, the support member 430 is formed in a slatted shape by the plurality of support plate members 432 and the plurality of girder members 434.

In the present embodiment, the first support member includes five support plate members 432, but the present invention is not limited to this, and the number of support plate members 432, the width direction dimension of the support plate member 432, and the like. The distance between the support plate members 432 can be arbitrarily selected so as to be suitable for exhausting particles. Further, the distance between the bottom surface of the base housing 400 and the support plate member 432 can be arbitrarily selected so as to form a flow path resistance capable of stably exhausting particles. Further, as shown in FIG. 12, five support plate members 432 sequentially arranged from the arm transport mechanism 62 toward the housing exhaust port 420 are provided with the support plate members 432-1,432-2,432-3, respectively. , 432-4,432-5, the distance α between the support plate members 432-1,432-5 at both ends in the width direction and the adjacent support plate members 432-2,432-4 is in the width direction. A plurality of support plate members 432 can be arranged so as to be larger than the interval β between the support plate members 432-2, 432-3, 432-4 excluding the support plate members 432-1, 432-5 at both ends. .. By arranging the support plate member 432 according to the width and spacing of the main body portion 416 in this way, the sliding surface of the main body portion 416 comes into uniform contact with the support plate member 432, so that uneven wear is unlikely to occur. Play.

Further, in the present embodiment, the second support member includes, but is not limited to, a plurality of girder members 434. For example, the second support member may be a columnar boss member provided at intervals in the stretching direction of each of the plurality of support plate members 432. In this case, the communication passage 436 is formed between the columnar boss members adjacent to each other in the extending direction of the support plate member 432.

According to the present embodiment, the cable protection member 410 is supported by the support member 430 instead of directly contacting the bottom surface of the base housing 400, and the support member 430 includes the arm transfer mechanism 62 and the housing exhaust port 420. A communication passage 436 is formed. Therefore, the flow path resistance between the arm transport mechanism 62 and the housing exhaust port 420 can be reduced. Further, even if the cable protection member 410 moves linearly with the linear movement of the gripping mechanism 600, as shown in FIG. 13, the exhaust path of the particles from the arm transport mechanism 62 to the housing exhaust port 420 is always secured. As a result, according to the present embodiment, the particles can be stably exhausted.

Further, according to the present embodiment, since the low friction member 433 (for example, Teflon tape) is provided on the contact surface of the plurality of support plate members 432 that come into contact with the bottom surface of the cable protection member 410, the cable protection member 410 and the plurality of support plate members 410. It is possible to suppress the generation of particles due to sliding with the support plate member 432.

Further, according to the present embodiment, since the plurality of support plate members 432 are arranged at intervals from each other, particles are tentatively generated due to the sliding of the cable protection member 410 and the plurality of support plate members 432. Even if it occurs, as shown in FIG. 13, the particles can be exhausted between the plurality of support plate members 432 and through the communication passage 436.

Further, the cleaning unit transport device 32a of the present embodiment includes an exhaust assisting member 440 for assisting the exhaust of particles. The exhaust auxiliary member 440 includes a plate member 442 that faces the housing exhaust port 420 at a predetermined distance and extends along the side wall of the base housing 400. The plate member 442 is arranged so that the lower portion of the plate member 442 is spaced from the bottom surface of the base housing 400 at a predetermined distance. As a result, a communication port 446 communicating with the communication passage 436 is formed in the lower part of the plate member 442.

Further, the exhaust auxiliary member 440 includes a connecting member 444 that connects the upper portion of the plate member 442 and the side wall of the base housing 400 and covers the gap between the upper portion of the plate member 442 and the side wall of the base housing 400. According to the present embodiment, by providing the exhaust auxiliary member 440, the suction force generated at the housing exhaust port 420 spreads over the entire communication port 446 at the lower part of the plate member 442, so that only the local area near the housing exhaust port 420 is provided. Instead, the particles can be exhausted evenly and stably over a wide range.

Next, the gripping mechanism 600 of the cleaning unit transport device 32a will be described. FIG. 17 is a side view showing a gripping mechanism of the cleaning unit transport device of the first cleaning unit of the cleaning unit shown in FIG. FIG. 18 is a perspective view showing a gripping mechanism of the cleaning unit transport device of the first cleaning unit of the cleaning unit shown in FIG. Since the first subframe 691 and the second subframe 692 have substantially the same structure except that they are symmetrical with respect to the main frame 68, the first subframe 691 will be referred to below. The related description is omitted.

As shown in FIGS. 17 and 18, the gripping mechanism 600 includes a pair of second arms 612 for gripping the wafer W. Further, the gripping mechanism 600 includes a second opening / closing mechanism 662 (arm drive mechanism) for driving the second arm 612. Here, inside the second subframe 692 of the gripping mechanism 600, the second opening / closing mechanism 662 is mentioned as one of the sources of particles. Since the second opening / closing mechanism 662 is, for example, a motor drive mechanism using a ball screw, droplets of grease applied to the ball screw may be generated as particles during the operation of the second opening / closing mechanism 662.

In order to exhaust the particles generated by the second opening / closing mechanism 662 from the housing exhaust port 420, it is conceivable to provide a pipe connecting the vicinity of the second opening / closing mechanism 662 and the vicinity of the housing exhaust port 420. However, in this case, since the second opening / closing mechanism 662 is arranged at a position far from the housing exhaust port 420, the pipe length becomes long and the pipe resistance becomes large, so that the particles may not be sufficiently exhausted. ..

Therefore, in the present embodiment, the gripping mechanism 600 includes a vacuum generator 710 for exhausting the particles in the gripping mechanism 600 in the main frame 68.

FIG. 19 is a schematic view showing the piping connection of the vacuum generator. The vacuum generator 710 is a device that generates a vacuum by feeding compressed air. Specifically, the vacuum generator 710 is sucked from the supply port 712 for supplying compressed air, the suction port 714 communicating with the vacuum generated by the compressed air supplied to the supply port 712, and the suction port 714. It has an exhaust port 716 for exhausting the gas. The vacuum generated by the vacuum generator 710 is a negative pressure larger than the negative pressure in the exhaust portion (housing exhaust port 420).

The gripping mechanism 600 includes a supply pipe 746 for supplying compressed air to the supply port 712. The supply pipe 746 includes a connecting end portion 742 connected to the supply port 712 and a supply end portion 744 connected to the compressed air supply unit 750 provided in the cleaning unit transport device 32a.

Further, the gripping mechanism 600 includes a suction pipe 726 for exhausting the particles generated by the second opening / closing mechanism 662 by using the vacuum generated by the vacuum generator 710. The suction pipe 726 has a connecting end portion 722 connected to the suction port 714 and a suction end portion 724 that opens in the vicinity of the second opening / closing mechanism 662.

Further, the gripping mechanism 600 includes an exhaust pipe 736 for guiding the particles sucked by using the vacuum generated by the vacuum generator 710 to the vicinity of the housing exhaust port 420. The exhaust pipe 736 has a connecting end portion 732 connected to the exhaust port 716 and an exhaust end portion 734 that opens in the vicinity of the housing exhaust port 420. The supply pipe 746 and the exhaust pipe 736 are
A part of the cable protection member 410 is housed in the main body 416 and guided into the main frame 68. As a result, the supply pipe 746 and the exhaust pipe 736 can be guided into the main frame 68 without applying an excessive force to the supply pipe 746 and the exhaust pipe 736.

According to the present embodiment, by providing the vacuum generator 710 in the gripping mechanism 600, the gripping mechanism 600 can generate a negative pressure larger than the negative pressure of the housing exhaust port 420 due to, for example, factory exhaust. As a result, even in a place far from the housing exhaust port 420 such as the second opening / closing mechanism 662, the particles generated by the second opening / closing mechanism 662 are sucked by the vacuum generator 710 and passed through the exhaust pipe 736. It can be exhausted from the housing exhaust port 420.

Although some embodiments of the present invention have been described above, the above-described embodiments of the present invention are for facilitating the understanding of the present invention and do not limit the present invention. The present invention can be modified and improved without departing from the spirit thereof, and it goes without saying that the present invention includes an equivalent thereof. In addition, any combination or omission of the claims and the components described in the specification is possible within the range in which at least a part of the above-mentioned problems can be solved, or in the range in which at least a part of the effect is exhibited. Is.

In one embodiment, the present application is fixed to an exhaust portion connected to an exhaust device, a transport mechanism for linearly moving a gripping mechanism for gripping an object, a housing for accommodating the transport mechanism, and a housing. It has a fixed end portion, a moving end portion connected to a gripping mechanism, and a flexible main body portion connecting the fixed end portion and the moving end portion. A cable protection member arranged between the transfer mechanism and a support member for supporting the cable protection member, which has a contact surface in contact with the bottom surface of the cable protection member and is along the moving direction of the gripping mechanism. Conveyance including a support member including a first support member to be stretched and a second support member having a communication path for supporting the first support member and communicating the transport mechanism and the exhaust portion. Disclose the device.

In this transport device, since the support member is formed with a communication path for communicating the transport mechanism and the exhaust section, even if the cable protection member moves linearly, the exhaust path of particles from the transport mechanism to the exhaust section is always secured. As an example, the flow path resistance between the transport mechanism and the exhaust portion can be reduced, so that the effect that the particles can be stably exhausted is achieved as an example.

Further, the present application discloses, as an embodiment, a transport device in which the first support member further includes a low friction member provided on the contact surface.

As an example, this transport device has an effect that it is possible to suppress the generation of particles due to the sliding of the cable protection member and the first support member.

Further, in the present application, as one embodiment, the first support member includes a plurality of support plate members extending along the moving direction of the gripping mechanism and arranged at intervals from each other, and the second support member includes a plurality of support plate members. Disclosed is a transport device including a plurality of girder members that are stretched in a direction orthogonal to the stretching direction of the plurality of support plate members and arranged at intervals from each other.

In this transport device, since a plurality of support plate members are arranged at intervals from each other, even if particles are generated due to sliding between the cable protection member and the plurality of support plate members, a plurality of support plate members are generated. As an example, the effect that particles can be exhausted between the support plate members and through the communication passage is achieved.

Further, in the present application, as one embodiment, the exhaust portion is a housing exhaust port formed on a side wall of the housing, a plate member facing the housing exhaust port at a predetermined interval, and an upper portion of the plate member and a housing. Disclosed is a transport device further comprising an exhaust assisting member, including a connecting member that connects to a side wall of the body.

In this transport device, the suction force generated at the housing exhaust port spreads over the entire communication port at the bottom of the plate member, so particles are evenly and stably exhausted not only locally near the housing exhaust port but also over a wide range. The effect of being able to do is played as an example.

Further, in the present application, as an embodiment, the gripping mechanism includes an arm for gripping an object, an arm drive mechanism for driving the arm, a supply port for supplying compressed air, and compression supplied to the supply port. A vacuum generator having a suction port that communicates with a negative pressure larger than the exhaust part generated by air and an exhaust port for exhausting the gas sucked from the suction port, and a connecting end portion connected to the suction port. And an exhaust pipe having a suction end that opens in the vicinity of the arm drive mechanism, a connecting end that is connected to the exhaust port, and an exhaust end that opens in the vicinity of the exhaust. , Disclose the transport device.

In this transfer device, even if the arm drive mechanism is arranged at a position far from the exhaust part, particles generated by the arm drive mechanism are sucked by the vacuum generator and exhausted from the exhaust part through the exhaust pipe. The effect of being able to do is played as an example.

Further, the present application discloses, as an embodiment, a transport device in which at least a part of the exhaust pipe is housed in the main body.

As an example, this transfer device has an effect that the exhaust pipe can be guided to the vicinity of the exhaust portion without applying an excessive force to the exhaust pipe.

Further, in the present application, as one embodiment, a polishing section for polishing the substrate, a cleaning section for cleaning the substrate polished by the polishing section, and a cleaning section for passing the substrate to the polishing section are used. A substrate processing apparatus including a load / unload unit for receiving a cleaned substrate and the above-mentioned transport device for transporting a substrate in the cleaning unit is disclosed.

As an example, this substrate processing device has an effect that particles can be stably exhausted because a communication path for communicating the transport mechanism and the exhaust portion is formed in the support member of the transport device.

10 Substrate processing device 11 Load / unload section 12 Polishing section 13 Cleaning section 32a Cleaning section transport device 62 Arm transport mechanism 68 Main frame 400 Base housing 410 Cable protection member 412 Fixed end 414 Moving end 416 Main body 420 Housing exhaust port 430 Support member 432 Support plate member 433 Low friction member 434 Girder member 436 Linkage passage 440 Exhaust auxiliary member 442 Plate member 444 Connecting member 446 Communication port 600 Gripping mechanism 710 Vacuum generator 712 Supply port 714 Suction port 716 Exhaust port 722 Connection end 724 Suction end 726 Suction pipe 732 Connection end 734 Exhaust end 736 Exhaust pipe 742 Connection end 744 Supply end 746 Supply pipe 750 Compressed air supply W Wafer (board)

Claims (7)

The exhaust part connected to the exhaust device and
A transport mechanism for linearly moving the gripping mechanism for gripping an object,
A housing for accommodating the transport mechanism and
The main body has a fixed end portion fixed to the housing, a moving end portion connected to the gripping mechanism, and a flexible main body portion connecting the fixed end portion and the moving end portion. A cable protection member that houses the cable in the unit and is arranged between the exhaust unit and the transport mechanism.
A first support member for supporting the cable protection member, which has a contact surface in contact with the bottom surface of the cable protection member and extends along the moving direction of the gripping mechanism, and the first support member. A support member including a second support member which supports the support member 1 and is formed with a communication passage for communicating the transport mechanism and the exhaust portion.
Including the transport device. The first support member further includes a low friction member provided on the contact surface.
The transport device according to claim 1. The first support member includes a plurality of support plate members extending along the moving direction of the gripping mechanism and arranged at intervals from each other.
The second support member includes a plurality of girder members that are stretched in a direction orthogonal to the stretching direction of the plurality of support plate members and arranged at intervals from each other.
The transport device according to claim 1 or 2. The exhaust portion is a housing exhaust port formed on the side wall of the housing.
Further includes an exhaust auxiliary member including a plate member facing the housing exhaust port at a predetermined distance and a connecting member connecting an upper portion of the plate member and a side wall of the housing.
The transport device according to any one of claims 1 to 3. The gripping mechanism
An arm for gripping the object and
An arm drive mechanism for driving the arm and
A supply port for supplying compressed air, a suction port that communicates with a negative pressure larger than the exhaust portion generated by the compressed air supplied to the supply port, and a suction port for exhausting gas sucked from the suction port. With a vacuum generator, which has an exhaust port,
A suction pipe having a connecting end connected to the suction port and a suction end opening in the vicinity of the arm drive mechanism.
An exhaust pipe having a connecting end portion connected to the exhaust port and an exhaust end portion opened in the vicinity of the exhaust portion.
Including,
The transport device according to any one of claims 1 to 4. At least a part of the exhaust pipe is housed in the main body.
The transport device according to claim 5. A polishing part for polishing the substrate and
A cleaning unit for cleaning the substrate polished by the polishing unit, and a cleaning unit.
A load / unload unit that delivers the substrate to the polishing unit and receives the substrate that has been cleaned by the cleaning unit.
The transport device according to any one of claims 1 to 6, for transporting the substrate in the cleaning unit.
Including substrate processing equipment.

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