JP2021020823A - 多結晶シリコン製造装置 - Google Patents
多結晶シリコン製造装置 Download PDFInfo
- Publication number
- JP2021020823A JP2021020823A JP2019137105A JP2019137105A JP2021020823A JP 2021020823 A JP2021020823 A JP 2021020823A JP 2019137105 A JP2019137105 A JP 2019137105A JP 2019137105 A JP2019137105 A JP 2019137105A JP 2021020823 A JP2021020823 A JP 2021020823A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- polycrystalline silicon
- core wire
- adapter
- wire holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims abstract description 49
- 239000002184 metal Substances 0.000 claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 8
- 239000003575 carbonaceous material Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 17
- 239000003507 refrigerant Substances 0.000 description 16
- 239000007789 gas Substances 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000002994 raw material Substances 0.000 description 8
- 229910052799 carbon Inorganic materials 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 6
- 238000001556 precipitation Methods 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 2
- 239000005052 trichlorosilane Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 244000144985 peep Species 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
- C01B33/035—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B35/00—Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
- C30B35/007—Apparatus for preparing, pre-treating the source material to be used for crystal growth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Silicon Compounds (AREA)
Abstract
Description
2 のぞき窓
3 冷媒入口(ベルジャ)
4 冷媒出口(ベルジャ)
5 ベースプレート
6 冷媒入口(ベースプレート)
7 冷媒出口(ベースプレート)
8 反応排ガス出口
9 原料ガス供給ノズル
10、20 金属電極
11 冷媒入口(電極)
12 冷媒出口(電極)
13、23 電極アダプタ
14、24 芯線ホルダ
15 シリコン芯線
16 多結晶シリコン
17 固定機構部
100 反応炉
Claims (7)
- シーメンス法により多結晶シリコンを製造する装置であって、
芯線ホルダと金属電極を電気的に接続する電極アダプタを備えており、
前記電極アダプタは前記金属電極に設けられている螺合部との間では非導通とされている、多結晶シリコン製造装置。 - シーメンス法により多結晶シリコンを製造する装置であって、
芯線ホルダと金属電極を電気的に接続する電極アダプタを備えており、
前記電極アダプタは固定機構部によって前記金属電極に固定され、かつ、前記電極アダプタは前記固定機構部との間では非導通とされている、多結晶シリコン製造装置。 - 前記電極アダプタと前記芯線ホルダが同じ材料から成る、請求項1または2に記載の多結晶シリコン製造装置。
- 前記電極アダプタと前記芯線ホルダの少なくとも一方がカーボン材料から成る、請求項1〜3の何れか1項に記載の多結晶シリコン製造装置。
- 前記電極アダプタと前記金属電極の導通部に導電性部材が挿入されている、請求項1〜4の何れか1項に記載の多結晶シリコン製造装置。
- 前記電極アダプタが前記金属電極に絶縁性治具を介して固定されている、請求項1〜5の何れか1項に記載の多結晶シリコン製造装置。
- 前記固定機構部は、少なくともその表面が絶縁処理されている、請求項2〜6の何れか1項に記載の多結晶シリコン製造装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019137105A JP7263172B2 (ja) | 2019-07-25 | 2019-07-25 | 多結晶シリコン製造装置 |
CN202010673757.2A CN112299421A (zh) | 2019-07-25 | 2020-07-14 | 多晶硅制造装置 |
DE102020118634.7A DE102020118634A1 (de) | 2019-07-25 | 2020-07-15 | Vorrichtung zur herstellung von polykristallinem silizium |
KR1020200090477A KR102578546B1 (ko) | 2019-07-25 | 2020-07-21 | 다결정 실리콘 제조 장치 |
US16/936,346 US11519069B2 (en) | 2019-07-25 | 2020-07-22 | Polycrystalline silicon manufacturing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019137105A JP7263172B2 (ja) | 2019-07-25 | 2019-07-25 | 多結晶シリコン製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021020823A true JP2021020823A (ja) | 2021-02-18 |
JP7263172B2 JP7263172B2 (ja) | 2023-04-24 |
Family
ID=74098984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019137105A Active JP7263172B2 (ja) | 2019-07-25 | 2019-07-25 | 多結晶シリコン製造装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11519069B2 (ja) |
JP (1) | JP7263172B2 (ja) |
KR (1) | KR102578546B1 (ja) |
CN (1) | CN112299421A (ja) |
DE (1) | DE102020118634A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007146519A (ja) * | 2005-11-29 | 2007-06-14 | Geotop Corp | 杭の吊り治具 |
JP2011027182A (ja) * | 2009-07-24 | 2011-02-10 | Oki Kogei:Kk | 螺合用部材 |
JP2011111360A (ja) * | 2009-11-26 | 2011-06-09 | Shin-Etsu Chemical Co Ltd | 炭素電極および多結晶シリコン棒の製造装置 |
US20140242410A1 (en) * | 2011-10-19 | 2014-08-28 | Dae San Materials Co., Ltd. | Electrode for a deposition process, and method for manufacturing same |
JP2017067253A (ja) * | 2015-10-02 | 2017-04-06 | 濱中ナット株式会社 | ボルト・ナットの弛み止め構造 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4469428A (en) * | 1981-08-08 | 1984-09-04 | Mita Industrial Co., Ltd. | Corona discharging apparatus used in an electrostatic photographic copying machine |
JP3819252B2 (ja) | 2001-05-21 | 2006-09-06 | 住友チタニウム株式会社 | シード保持電極 |
JP4031782B2 (ja) * | 2004-07-01 | 2008-01-09 | 株式会社大阪チタニウムテクノロジーズ | 多結晶シリコン製造方法およびシード保持電極 |
US20080087641A1 (en) * | 2006-10-16 | 2008-04-17 | Lam Research Corporation | Components for a plasma processing apparatus |
GB0721556D0 (en) * | 2007-11-02 | 2007-12-12 | Siemens Magnet Technology Ltd | Current leadthrough for cryostat |
KR101620635B1 (ko) * | 2008-06-24 | 2016-05-12 | 미쓰비시 마테리알 가부시키가이샤 | 다결정 실리콘 제조 장치 |
US8840723B2 (en) | 2009-03-10 | 2014-09-23 | Mitsubishi Materials Corporation | Manufacturing apparatus of polycrystalline silicon |
KR101785749B1 (ko) * | 2010-02-22 | 2017-10-16 | 램 리써치 코포레이션 | 플라즈마 프로세싱 장치를 위한 동일 평면 장착 파스너 |
DE102013204926A1 (de) * | 2013-03-20 | 2014-09-25 | Wacker Chemie Ag | Vorrichtung zum Schutz einer Elektrodendichtung in einem Reaktor zur Abscheidung von polykristallinem Silicium |
JP6373724B2 (ja) * | 2014-11-04 | 2018-08-15 | 株式会社トクヤマ | 芯線ホルダ及びシリコンの製造方法 |
US9698578B1 (en) * | 2016-01-06 | 2017-07-04 | Ilsco Corporation | Slotted bus bar for electrical distribution |
KR102644667B1 (ko) | 2018-07-23 | 2024-03-07 | 가부시끼가이샤 도꾸야마 | 심선 홀더, 실리콘 제조 장치 및 실리콘 제조 방법 |
-
2019
- 2019-07-25 JP JP2019137105A patent/JP7263172B2/ja active Active
-
2020
- 2020-07-14 CN CN202010673757.2A patent/CN112299421A/zh active Pending
- 2020-07-15 DE DE102020118634.7A patent/DE102020118634A1/de active Pending
- 2020-07-21 KR KR1020200090477A patent/KR102578546B1/ko active IP Right Grant
- 2020-07-22 US US16/936,346 patent/US11519069B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007146519A (ja) * | 2005-11-29 | 2007-06-14 | Geotop Corp | 杭の吊り治具 |
JP2011027182A (ja) * | 2009-07-24 | 2011-02-10 | Oki Kogei:Kk | 螺合用部材 |
JP2011111360A (ja) * | 2009-11-26 | 2011-06-09 | Shin-Etsu Chemical Co Ltd | 炭素電極および多結晶シリコン棒の製造装置 |
US20140242410A1 (en) * | 2011-10-19 | 2014-08-28 | Dae San Materials Co., Ltd. | Electrode for a deposition process, and method for manufacturing same |
JP2017067253A (ja) * | 2015-10-02 | 2017-04-06 | 濱中ナット株式会社 | ボルト・ナットの弛み止め構造 |
Also Published As
Publication number | Publication date |
---|---|
KR20210012942A (ko) | 2021-02-03 |
US20210025077A1 (en) | 2021-01-28 |
JP7263172B2 (ja) | 2023-04-24 |
DE102020118634A1 (de) | 2021-01-28 |
KR102578546B1 (ko) | 2023-09-13 |
CN112299421A (zh) | 2021-02-02 |
US11519069B2 (en) | 2022-12-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9562289B2 (en) | Carbon electrode with slidable contact surfaces and apparatus for manufacturing polycrystalline silicon rod | |
KR101600651B1 (ko) | Cvd 반응기에서 전극 홀더를 위한 보호 장치 | |
JP5653830B2 (ja) | 多結晶シリコン製造装置および多結晶シリコン製造方法 | |
JP7263172B2 (ja) | 多結晶シリコン製造装置 | |
US20200263293A1 (en) | Apparatus for producing polycrystalline silicon and polycrystalline silicon | |
JP5820917B2 (ja) | 多結晶シリコンの製造方法 | |
WO2016002232A1 (ja) | 多結晶シリコン棒製造用のシリコン芯線および多結晶シリコン棒の製造装置 | |
JP6772753B2 (ja) | 多結晶シリコン反応炉 | |
JP5542031B2 (ja) | 多結晶シリコンの製造方法および多結晶シリコンの製造システム | |
JP2014101256A (ja) | 多結晶シリコン棒の製造装置および製造方法 | |
JP2013071856A (ja) | 多結晶シリコン製造装置および多結晶シリコンの製造方法 | |
JP5539292B2 (ja) | 多結晶シリコンの製造方法 | |
KR102589560B1 (ko) | 다결정 실리콘 제조 장치 | |
JP2014148464A (ja) | 多結晶シリコンの製造方法 | |
JP6513842B2 (ja) | 多結晶シリコン棒製造用のシリコン芯線および多結晶シリコン棒の製造装置 | |
KR20230007226A (ko) | 다결정 실리콘 로드의 제조 장치 및 제조 방법 | |
AU2013251286B2 (en) | Carbon electrode and apparatus for manufacturing polycrystalline silicon rod |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210624 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20220425 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220524 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20221108 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221226 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230314 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230412 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7263172 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |