JP2021020389A - Method for parting brittle material substrate - Google Patents

Abstract

To provide a method capable of suitably parting a brittle material substrate into pieces of different sizes.SOLUTION: A method comprises: a scribe step where, in either main face side of a substrate, scribe lines are formed along partition scheduled positions defined in the all circumferences of regions to form into small size pieces and regions to form into large size pieces after partition; and a break step where an operation in which break bars are pushed-in at a prescribed push-in amount at break bar abutting positions including at least the upper positions of the scribe lines from the other main face side of the substrate is performed to all the break bar abutting positions. In the break step, (a) an edge angle θ is controlled to 50 to 90°, (b) the curvature radius R of the edge tip is controlled to 100 to 300 μm, (c) a push-in amount is controlled to 60 to 100 μm and (d) a break bar drop speed is controlled to 10 to 100 mm/s.SELECTED DRAWING: Figure 2

Description

The present invention relates to individualization by dividing a brittle material substrate, and more particularly to a method of obtaining two types of individual pieces having different sizes by scribe treatment and break treatment.

As a method of individualization (chip formation) in which a brittle material substrate is divided at a plurality of points to obtain a large number of individual pieces (chips), a scribe line is formed in advance at each planned division position on one main surface of the substrate. After performing the scribe process, the break bar is brought into contact with the planned division position from the other main surface side, and the break bar is further pushed in to extend the crack from the scribe line in the substrate thickness direction. The method of doing so is already known (see, for example, Patent Document 1).

Such a method is, for example, a case where a glass wafer is used as a base substrate and a device mother substrate formed by forming a predetermined device structure on the base substrate using resin, metal or the like is divided to obtain a device chip (individual piece). Applies to. That is, a large number of device chips can be obtained by dividing the device mother substrate produced by repeatedly arranging the device structure pattern two-dimensionally on the glass wafer by the scribe processing and the break processing described above.

Japanese Unexamined Patent Publication No. 2016-30364

In the device mother substrate described above, a region (large size region) having a plane size larger than that for a device chip having a device structure (normal size region), such as TEG, is formed at one or a plurality of locations. May be done. Even in such a case, there is a need to obtain a device chip by suitably performing individualization by scribe processing and break processing.

However, in general, the length of the cutting edge (blade length) in the break bar used for the break process is larger than the size of the object to be divided so that the object can be divided between any two points on the outer circumference of the object to be divided. Therefore, for example, when trying to divide a device mother substrate in which a large size area and a normal size area coexist as described above, a break bar is applied to a large size area that does not need to be divided depending on the arrangement mode of both areas. It can happen that they come into contact with each other. In such a case, there is a possibility that a problem may occur in which the crack extends to a large size region, and further the crack extends to another normal size region and is divided at a place different from the original one.

It is possible to suppress the occurrence of such cracks by devising the division order, but the relative movement between the break bar and the device mother substrate becomes complicated, productivity deteriorates, and the position of the division points shifts. It is not preferable because it is more likely. In the first place, depending on the arrangement relationship between the large size area and the normal size area, the contact of the break bar with the large size area may be unavoidable.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a method capable of appropriately dividing a brittle material substrate into individual pieces having different sizes.

In order to solve the above problems, the invention of claim 1 divides the brittle material substrate into a small-sized piece and a large-sized piece having a size larger than the small-sized piece according to a predetermined planned division position. It is a method of dividing, and on one main surface side of the brittle material substrate, at the planned division position defined around the region which becomes the small size piece after the division and all the region which becomes the large size piece. The break bar is pushed by a predetermined amount at the break bar contact position including at least the position above the formation position of the scrib line from the other main surface side of the brittle material substrate and the scrib step of forming the scrib line along the screen. The break step includes a break step of dividing the brittle material substrate into the small-sized piece and the large-sized piece by pushing the brittle material substrate to all the break bar contact positions. , (A) The cutting edge angle θ of the break bar is 50 ° to 90 °, (b) the radius of curvature R of the cutting edge tip of the break bar is 100 μm to 300 μm, and (c) the pushing amount is 60 μm to 100 μm. (d) The lowering speed of the break bar when the break bar is pushed into the substrate is set to 10 mm / s to 100 mm / s.

The invention of claim 2 is the method for dividing a brittle material substrate according to claim 1, and in the break step, after the break operation with respect to one break bar contact position is completed, the next break bar hit. It is characterized in that the shift feed of the substrate for performing the break operation with respect to the contact position is performed only in one direction in which the break bar contact positions are arranged at a predetermined pitch.

The invention of claim 3 is the method for dividing a brittle material substrate according to claim 1 or 2, wherein a small size is provided on the brittle material substrate in a region which becomes the small size piece after the division. A pattern consisting of a size pattern and a large size pattern provided in the region of the large size piece is provided, and in the scribing step, the brittle material substrate exposed from between the patterns is provided. , The scribing line is formed.

According to the inventions of claims 1 to 3, the brittle material substrate can be suitably divided into small-sized pieces and large-sized pieces.

In particular, according to the invention of claim 2, the brittle material substrate can be divided into a small-sized piece and a large-sized piece with excellent versatility and productivity.

It is a schematic plan view of a mother board 10. It is a figure which shows the state of a certain partial region RE of a mother substrate 10. It is a figure which shows typically the state of the scribe processing with respect to the mother substrate 10. It is a figure which shows the state of the break process with respect to the mother board 10. FIG. 5 is a plan view of a partial region RE of the mother substrate 10 subjected to break processing as viewed from the side of the base substrate 1. It is a top view which shows the state of the partial region RE in the process of performing break processing with respect to a mother substrate 10. It is a top view which shows the partial region RE after the break process was performed well with respect to the mother substrate 10.

<Target for division>
FIG. 1 is a schematic plan view of a mother substrate 10 which is a target of division according to the present embodiment. FIG. 2 is a diagram showing a state of a certain partial region RE of the mother substrate 10 shown in FIG. In FIG. 1, in one main surface of the mother substrate 10, the direction along the orientation flat 10f and the direction perpendicular to the direction are defined as the x-axis direction and the y-axis direction, respectively, and the direction perpendicular to the main surface is defined as the z-axis direction. The xyz coordinates of the right-handed system are attached. In the following figures, the coordinate system shall be followed.

2 (a) is a plan view (xy plan view) of the partial region RE, and FIG. 2 (b) is a cross-sectional view (zx cross-sectional view) of AA ′ of FIG. 2 (a).

As shown in FIG. 2, the mother substrate 10 has a configuration in which a predetermined pattern 2 is two-dimensionally arranged on one main surface of the base substrate 1 by one or a plurality of layers made of resin, metal, or the like. In other words, the mother substrate 10 has a pattern 2 on one side of the main surface. Further, the other main surface of the base substrate 1 on which the pattern 2 is not provided is also the other main surface of the mother substrate 10.

The base substrate 1 is a brittle material substrate having a plane size (diameter) of about 20 cm to 30 cm and a thickness of about 0.1 mm to 1.0 mm, and a glass wafer is exemplified.

The pattern 2 uses a small size pattern 2a of a predetermined size as a basic pattern, but a part of the mother substrate 10 also includes a large size pattern 2b having a plane size larger than that of the small size pattern 2a. The large size pattern 2b is arranged in at least one position on the mother substrate 10 so as to be surrounded by the small size pattern 2a. The partial region RE illustrates this situation. For example, the small size pattern 2a is a pattern forming a predetermined device structure, and the large size pattern 2b is a TEG. In such a case, a solder ball may be formed on the upper surface of the pattern 2.

The adjacent individual patterns 2 are separated from each other, and the base substrate 1 is exposed in the street ST, which is a gap between the two. In the mother substrate 10, as street STs, the first street ST1 which is a gap between the small size patterns 2a, the second street ST2 which is the gap between the large size patterns 2b, the small size pattern 2a and the large size pattern 2b There is a third street ST3, which is a gap between the two.

In FIG. 2, for the sake of simplicity of illustration, both the small size pattern 2a and the large size pattern 2b have a rectangular shape in a plan view, but in reality, the shapes of both patterns are not limited to this, and in that case, the street. ST is conceived as a gap between rectangles circumscribing each pattern 2.

Assuming that both the small size pattern 2a and the large size pattern 2b are rectangular in a plan view, the size of the short side of the small size pattern 2a is about 0.5 mm to 2.0 mm, and the size of the long side is 0. It is about 5.5 mm to 2.0 mm. The size of the short side of the large size pattern 2b is about 1.0 mm to 4.0 mm, and the size of the long side is about 1.5 mm to 6.0 mm.

The width of the first street ST1 is about 30 μm to 100 μm, the width of the second street ST2 is about 20 μm to 200 μm, and the width of the third street ST3 is about 30 μm to 200 μm.

The mother substrate 10 is divided into individual pieces including the individual patterns 2 along a predetermined division scheduled position at the street ST. In other words, the planned division position is provided around all the areas that become individual pieces after division.

Of the mother substrate 10, the region that becomes an individual piece including the small size pattern 2a due to the division is referred to as a small size individualized region 10a, and the region that becomes an individual piece including the large size pattern 2b is a large size. It is referred to as an individualized region 10b. In other words, the division of the mother substrate 10 performed in the method according to the present embodiment is a process of dividing the mother substrate 10 into a plurality of small-sized individualized regions 10a and a plurality of large-sized individualized regions 10b. ..

More specifically, in the present embodiment, since the pattern 2 is repeatedly arranged in each of the x-axis direction and the y-axis direction orthogonal to each other, the mother substrate 10 is scheduled to be x-divided along the x-axis direction. It is divided at the position Px and the planned y division position Py along the y-axis direction. The x scheduled division position Px and the y planned division position Py are defined in the center of each street ST in the first street ST1 and the second street ST2.

Further, among the x scheduled division positions Px, the one in which the large size pattern 2b does not exist in the extending direction is referred to as the first x scheduled division position Px1, and the one in which the large size pattern 2b exists is referred to as the second x scheduled division position Px2. I will do it. Similarly, among the y-division scheduled positions Py, the one in which the large size pattern 2b does not exist in the extending direction is referred to as the first y-division scheduled position Py1, and the one in which the large-size pattern 2b exists is referred to as the second y-division scheduled position Py2. It will be referred to.

<Overview of division processing>
Next, the outline of the division process performed in the present embodiment will be described. The division process is realized by performing a scribe process and a break process that follows the scribe process.

FIG. 3 is a diagram schematically showing a state of scribe processing on the mother substrate 10. The scribe processing can be performed using a known scribe device 100.

The scribe device 100 mainly includes a stage 101 capable of downwardly supporting a scribe object in a horizontal posture, and a scribing wheel (cutter wheel) 102 which is a disk-shaped member having a cutting edge 102e at an outer edge portion. The scribing wheel 102 is held by the scribing device 100 in a rotatable manner in a vertical plane.

More specifically, the scribing wheel 102 is a disk-shaped member (scribing tool) having a diameter of 2 mm to 3 mm, and has an isosceles right triangle-shaped cutting edge 102e on the outer peripheral surface. Further, at least the cutting edge 102e is made of diamond. Further, the angle (edge angle) α of the cutting edge 102e is preferably 100 ° to 135 °.

When the mother substrate 10 is to be divided, the mother substrate 10 is provided with the pattern 2 and has one main surface side as the upper surface (scribe target surface) and the other main surface side as the mounting surface with respect to the stage 101. It is placed and fixed on the stage 101 and positioned.

More specifically, the mother substrate 10 is in a state in which the other main surfaces are attached to a holding tape (for example, dicing tape) DT stretched on a substantially annular ring (for example, dicing ring) RG in advance prior to the scribing process. It is said that. Then, in such an embodiment, the ring RG in which the mother substrate 10 is attached to the holding tape DT is placed and fixed on the stage 101, so that the mother substrate 10 is placed and fixed on the stage 101.

Further, FIG. 3 shows a state when a certain y division scheduled position Py is targeted for scribe.

When the scribe operation is performed along the y-division scheduled position Py, the mother substrate 10 is placed and fixed on the stage 101 so that the individual y-division scheduled positions Py and the rotating surface of the scribing wheel 102 are parallel to each other. Then, for each y-division scheduled position Py, the y-division scheduled position Py and the rotating surface of the scribing wheel 102 are positioned so as to be located in the same vertical plane (plane perpendicular to the drawing). While applying a predetermined load (referred to as a scribing load), the scribing wheel 102 is pressure-welded on the mother substrate 10 (strictly speaking, on the base substrate 1 exposed in the street ST) along the y-division scheduled position Py. Be rolled. Such pressure contact rolling is realized, for example, by moving the stage 101 horizontally with respect to the scribing wheel 102 by a drive mechanism (not shown). Then, in the base substrate 1 exposed in the street ST, a scribe line is formed along the y-division scheduled position Py. The scribe line is preferably formed so that vertical cracks reach from the surface of the base substrate 1 to a depth of about 20 to 50% with respect to the thickness of the substrate. When the scribe line is formed in such an embodiment, the scribe speed (the speed at which the scribing wheel 102 is moved relative to the stage 101) is preferably 100 mm / s to 300 mm / s.

In the present embodiment, the scribe operation, which is a combination of such positioning and pressure welding rolling of the scribing wheel 102, is performed on the x-axis with respect to all y-division scheduled positions Py separated at a predetermined pitch in the x-axis direction. Perform sequentially from one end side of the direction. That is, after the completion of the scribe operation for one y-division scheduled position Py, the shift feed of the mother substrate 10 for performing the scribe operation for the next y-division scheduled position Py (from the y-division scheduled position Py after the completion of the scribing process) The relative movement of the scribing wheel 102 to the scribed scheduled position Py, which is the target of the scribe processing), is performed only in one direction in the x-axis direction.

The scribe operation along the x-division scheduled position Px is also performed in the same manner.

When the second x scheduled division position Px2 and the second y planned division position Py2 shown in FIG. 2 are scribe targets, a large size individualized region 10b (large size pattern 2b) intervenes in the extending direction thereof. Therefore, during the scribe operation, the 2x scheduled division position Px2 or the second y planned division position Py2 defined in the first street ST1 so that the scribe line is not formed in the large-sized individualized region 10b. The scribing wheel 102, which has been pressure-welded and rolled along, immediately before or at the time of reaching the 1st scheduled division position Py1 or the 1x scheduled division Px1 defined on the 3rd street ST3 orthogonal to them. Once raised, it is moved in the x-axis or y-axis above the large-sized individualized region 10b. Then, it is lowered again at a position where the 2x scheduled division position Px2 or the 2y planned division position Py2 is provided in front of the 2x planned division position Px2 or the second y planned division position Py2. Be rolled.

The mother substrate 10 for which the scribe processing for all the planned division positions has been completed is subsequently subjected to the break processing. FIG. 4 is a diagram schematically showing a state of break processing on the mother substrate 10. The break process can be performed using a known break device 200.

The break device 200 is a plate-like member having at least a surface portion made of an elastic body, a support 201 capable of downwardly supporting a break object in a horizontal posture, and a cutting edge 202e having a triangular cross section in the vertical direction. 202 is mainly provided.

As the support 201, for example, a configuration in which a plate-shaped elastic body is placed and fixed on the upper surface of a metal member having a flat upper surface can be adopted.

The break bar 202 is a plate-shaped metal (for example, cemented carbide) member provided with an isosceles right triangle-shaped cutting edge 202e extending in the blade crossing direction. In FIG. 4, the break bar 202 is shown so that the blade crossing direction is perpendicular to the drawing. Further, the blade length of the break bar 202 is larger than the plane size of the mother substrate 10 so that a break can be performed in the entire blade length direction by one break operation.

FIG. 4 shows a state in which a certain y division scheduled position Py, in which a scribe line SL is formed by scribe processing, is targeted for break processing.

The mother substrate 10 after the scribe treatment is subjected to the break treatment in a state of being attached to the holding tape DT stretched on the ring RG. However, as shown in FIG. 4, during the break process, the main surface side, which was exposed during the scribe process, is covered with the protective film PF. The protective film covers the pattern 2 in such a manner that the edge portion thereof is attached to the ring RG. The mother substrate 10 after the scribe treatment is placed on the support 201 together with the ring RG, the holding tape DT, and the protective film PF in a posture in which the other main surface side is upward and the one main surface side is downward. It is fixed. That is, the protective film PF is placed and fixed in such a manner that it comes into contact with the support 201.

Then, when the break operation is performed along the y-division scheduled position Py, the mother substrate 10 is placed and fixed on the support 201 so that the individual y-division scheduled positions Py and the blade crossing direction of the break bar 202 are parallel to each other. Will be done. Then, for each y-division scheduled position Py, the break bar 202 is positioned so that the y-division scheduled position Py and the break bar 202 are located in the same vertical plane (plane perpendicular to the drawing). , As shown by the arrow AR1, the y is lowered toward the planned y-division position Py. The break bar 202 is further pushed by a predetermined distance (referred to as a pushing amount) z even after the cutting edge 202e comes into contact with the holding tape DT.

In this way, when the break bar 202 is lowered toward the planned y-division position Py of the mother substrate 10 in the posture in which the scribing line SL is positioned downward and further pushed in by a predetermined pushing amount, y is pushed from the scribing line SL. Cracks extend in the thickness direction (perpendicular to the peripheral surface of the mother substrate 10) along the planned division position, and hold the base substrate 1 to the other main surface of the mother substrate 10 which is the upper surface. It reaches the surface to be attached to the tape DT.

However, since the blade length of the break bar 202 is larger than the size of the mother substrate 10, the break bar 202 does not have a scribe line formed below and does not need to be divided during the break operation. May also come into contact with. In other words, the contact position of the break bar 202 may include at least above the formation position of the scribe line, and may also include the range of the large-sized individualized region 10b in which the scribe line is not formed. In the present embodiment, in such a case, the break operation is performed so that unnecessary division does not occur in the large-sized individualized region 10b. The details will be described later.

In the present embodiment, all breaks that separate the break operation targeting the y-division scheduled position Py, which is a combination of such positioning and lowering of the break bar 202, at a predetermined pitch in the x-axis direction. This is performed sequentially from the one end side in the x-axis direction with respect to the bar contact position. That is, after the break operation for the break bar contact position including one y-division scheduled position Py is completed, the shift of the mother substrate 10 for performing the break operation for the break bar contact position including the next y-division scheduled position Py. The feed (relative movement of the break bar 202 from the break bar contact position after the break processing is completed to the break bar contact position to be the next break process) is performed only in one direction in the x-axis direction.

The break process along the x-division scheduled position Px is also performed in the same manner.

After the break treatment is preferably performed, the mother substrate 10 is in a state where each of the small-sized individualized regions 10a and the large-sized individualized regions 10b are separated from each other and are in contact with each other. It is held by the holding tape DT. The mother substrate 10 in such a state is subjected to an expanding process in which adjacent regions are separated by stretching the holding tape DT. As a result, the small-sized individualized regions 10a and the large-sized individualized regions 10b are separated from each other, and each is obtained as an individual piece. As described above, the mother substrate 10 is divided into individual pieces having a desired size.

<Details of break processing>
FIG. 5 is a plan view of the partial region RE of the mother substrate 10 to be subjected to the break processing after the completion of the scribe processing, as viewed from the other main surface side (from the side opposite to the one main surface provided with the pattern 2). .. That is, FIG. 5 shows a state in which the mother substrate 10 mounted on the support 201 of the break device 200 is viewed from vertically above in the posture shown in FIG.

However, in FIG. 5, for convenience, the pattern 2 (small size pattern 2a and large size pattern 2b) provided on the main surface side is shown by a broken line.

Further, FIG. 5 shows two points, an x scribe line SLx formed along the x scheduled scribe position Px on the surface side and a y scribe line SLy formed along the y scheduled scribe position Py. It is shown by a chain line. More specifically, among the former, the one formed along the first scheduled division position Px1 is referred to as the first x scribe line SLx1, and the one formed along the second x scheduled division position Px2 is the second x scribe line SLx2. It is supposed to be. Further, among the latter, the one formed along the first scheduled division position Py1 is referred to as the first scribe line SLy1, and the latter formed along the second scheduled division position Py2 is referred to as the second scribe line SLy2.

The first x scribe line SLx1 and the first y scribe line SLy1 are formed over the entire x-axis direction and y-axis direction, respectively. On the other hand, the second x scribe line SLx2 and the second y scribe line SLy2 are at the intersection of the first y scribe line SLy1 and the first x scribe line SLx1 orthogonal to them, or immediately before intersecting the first y scribe line SLy1 and the first x scribe line SLx1, respectively. The position of is the end part. In the partial region RE shown in FIG. 5, intersections I1 to I6 between the first x scribe line SLx1 and the second y scribe line SLy2 and intersections I7 to I12 between the first y scribe line SLy1 and the second x scribe line SLx2 are shown. There is.

As described above, during the break operation, the break bar 202 also comes into contact with the large-sized individualized region 10b in which no scribe line is formed below and division is unnecessary. In FIG. 5, the contact position of the break bar 202 having no scribe line below is shown by the dotted line Lx in the x-axis direction and by the dotted line Ly in the y-axis direction. For example, if the formation position of the second x scribe line SLx2 is the target of break processing, not only above the formation position of the pair of second x scribe lines SLx2 located on the left and right in the drawing, but also a dotted line between the two. The position of Lx is also the break bar contact position.

Further, FIG. 6 is a plan view showing the state of the partial region RE during the break processing of the mother substrate 10 shown in FIG. Further, FIG. 7 is a plan view showing a partial region RE after the mother substrate 10 shown in FIG. 5 has been satisfactorily broken.

Specifically, FIG. 6 shows that the break process targeting the break bar contact position including the formation position of the y scribe line SLy (that is, targeting the y division scheduled position Py) is located on the left side in the drawing. It shows the state in the middle when the execution is performed in order from the break bar contact position including the scribe line SLy. In FIG. 6, the dividing line DL formed on the mother substrate 10 as a result of the crack extending from the y scribe line SLy extending to the other main surface is shown by a thick solid line.

First, when the break operation is performed for the break bar contact position including the formation position of the first scribe line SLy1 in order to divide the mother substrate 10 at the first y division scheduled position Py1, it goes without saying that the entire y-axis direction is covered. The dividing line DL may be formed. In FIG. 6, the dividing line DL formed at the first y dividing line planned position Py1 in such an embodiment is shown as the (first) dividing line DL1.

On the other hand, when a break operation is performed for the break bar contact position including the formation position of the second scribe line SLy2 in order to divide the mother substrate 10 at the secondy scheduled division position Py2, the scribe line is formed below. The break bar 202 abuts not only at the position where it is formed but also at the position where the dotted line Ly is not formed, and is pushed in with a predetermined pushing amount z in the entire blade crossing direction.

Therefore, originally, as shown as the (second) dividing line DL2 in FIG. 6, the dividing line DL should be formed only at the forming position of the second scribe line SLy2, but the forming position of the second scribe line SLy2. Crack extension from the above occurs beyond the positions of intersections I1 to I6 with the first x scribe line SLx1 to the large size individualized region 10b, and not only the formation position of the second y scribe line SLy2 but also the large size. A dividing line DL up to the individualized region 10b may be formed. In FIG. 6, such a dividing line DL is illustrated as a dividing line DL2α.

The scribe line DL2α is formed at the formation position of the second scribe line SLy2, even if it is formed along the scribe line, that is, along the second y scribe line planned position Py2 which is also the blade crossing direction. In the large-sized individualized region 10b that has not been formed, it is not always formed along the blade crossing direction.

In the present embodiment, by preferably defining the conditions for break processing, the break along the formation position of each y scribe line SLy is performed while the shift feed of the break bar 202 is set to only one direction in the x-axis direction. In the case of continuous execution, a break in which the formation position of the first y scribe line SLy1 is set as the break contact position is preferably realized, and a break in the break contact position including the formation position of the second scribe line SLy2 is targeted. Also at this time, the dividing line is formed without exceeding the intersections I1 to I6 with the first x scribe line SLx1 that divides the large-sized individualized region 10b. Similarly, when the break along the formation position of the x scribe line SLx is continuously performed while the shift feed of the break bar 202 is only one direction in the y-axis direction, the formation position of the first x scribe line SLx1 is similarly performed. The large-sized individualized region 10b is partitioned even when a break is preferably realized with the break contact position set to the break contact position including the formation position of the second x scribe line SLx2. The dividing line is formed so as not to exceed the intersections I7 to I12 with the first scribe line SLy1.

Specifically, break processing should be performed under the following conditions:
(a) Angle of cutting edge 202e (cutting edge angle) θ: 50 ° to 90 °;
(b) Radius of curvature R at the tip of the cutting edge 202e: 100 μm to 300 μm;
(c) Pushing amount z: 60 μm to 100 μm;
(d) Descent speed of break bar 202: 10 mm / s to 100 mm / s.

By satisfying these conditions (a) to (d), in the mother substrate 10, as shown in FIG. 7, in the 1x scheduled division position Px1 and the 1st scheduled division position Py1, the first minute is formed along them. A disconnection DL1 is formed, and at the second x scheduled division position Px2 and the second y planned division position Py2, a second disconnection line DL2 that follows them but does not extend to the large-sized individualized region 10b is formed. Will be done. This is because the radius of curvature R at the tip of the cutting edge 202e is relatively large with respect to the thickness of the substrate, so that the force for laterally expanding the substrate becomes larger, and the large-sized individualized region 10b due to excessive pushing of the break bar 202 It is considered that this is because the deformation of the can be suppressed.

After that, by performing the above-mentioned expanding treatment on the mother substrate 10 on which the first dividing line DL1 and the second dividing line DL2 are formed, an individual piece containing the small size pattern 2a and an individual piece containing the large size pattern 2b are performed. And are obtained.

When the cutting edge angle θ and the radius of curvature R are smaller than the above range, and when the pushing amount z and the descending speed of the break bar 202 are larger than the above range, the large-sized individualized region 10b due to the pushing of the break bar 202 The deformation is large, and the second dividing line DL2 is formed up to the large-sized individualized region 10b, which is not preferable.

On the other hand, when the cutting edge angle θ and the radius of curvature R are larger than the above range, and when the pushing amount z and the descending speed of the break bar 202 are smaller than the above range, the crack extending from the scribe line reaches the opposite surface. This is not preferable because it will not be divided.

As described above, according to the present embodiment, the mother substrate, which is a mixture of a plurality of small size patterns and a plurality of large size patterns, has a small size piece including the former and a large size including the latter. The process of dividing into individual pieces can be suitably realized by a scribe process along the planned division position and a break process that satisfies the following conditions (a) to (d).

In particular, in the break process, it is preferably suppressed that the break bar is brought into contact with the position where the break bar is not required, but the large-sized piece is not broken.

Depending on the thickness and type of the substrate, after the scribe processing, the break processing is performed in advance only around the individual pieces of the large-sized individualized area to obtain the large-sized individualized area as described above. It is also possible to take measures to suppress the division. However, the relative movement operation of the break bar with respect to the mother substrate becomes complicated, and the positioning accuracy may deteriorate, which is inferior to the method according to the present embodiment in terms of productivity. Further, in the first place, depending on the arrangement mode of the large-sized individualized region on the mother substrate, another large-sized individualized region exists on the extension line of the planned division position set around a certain large-sized individualized region. In such a case, the preceding break as described above cannot be performed.

On the other hand, the method according to the present embodiment is suitable for all planned division positions while shifting the planned division position in only one direction regardless of the arrangement mode of the large size region on the mother substrate. Since it can be divided, it can be said that it is excellent in terms of versatility and productivity.

1 Base board 2 Pattern 2a Small size pattern 2b Large size pattern 10 Mother board 10a Small size individualized area 10b Large size individualized area 100 Scribing device 101 Stage 102 Scribing wheel 102e (of scribing wheel) Cutting edge 200 Breaking device 201 Support Body 202 Break bar 202e (Break bar) Cutting edge DL Dividing line DT Retaining tape PF Protective film Px x Expected division position Py y Expected division position RG ring SL scribe line ST street

Claims (3)

A method of dividing a brittle material substrate into a small-sized piece and a large-sized piece having a size larger than the small-sized piece according to a predetermined planned division position.
On one main surface side of the brittle material substrate, a scribe line is formed along the planned division position defined around the region to be the small-sized piece and the entire region to be the large-sized piece after division. , The scribe process and
Pushing the break bar with a predetermined pushing amount at the break bar contact position including at least the position above the formation position of the scribe line from the other main surface side of the brittle material substrate is all the break bar contact positions. A break step of dividing the brittle material substrate into the small-sized pieces and the large-sized pieces.
With
In the break step,
(a) The cutting edge angle θ of the break bar is set to 50 ° to 90 °.
(b) The radius of curvature R at the tip of the cutting edge of the break bar is set to 100 μm to 300 μm.
(c) The pushing amount is set to 60 μm to 100 μm.
(d) The descending speed of the break bar when the break bar is pushed into the substrate is set to 10 mm / s to 100 mm / s.
A method for dividing a brittle material substrate, which comprises the above. The method for dividing a brittle material substrate according to claim 1.
In the break step, after the break operation with respect to the break bar contact position is completed, the shift feed of the substrate for performing the next break operation with respect to the break bar contact position is performed by the break bar contact position. Perform only in one direction in the direction of arranging at a predetermined pitch,
A method for dividing a brittle material substrate, which comprises the above. The method for dividing a brittle material substrate according to claim 1 or 2.
On the brittle material substrate, a pattern consisting of a small size pattern provided in the region to be the small size piece after division and a large size pattern provided in the region to be the large size piece after division is provided. Become,
In the scribe step, the scribe line is formed on the brittle material substrate exposed from between the patterns.
A method for dividing a brittle material substrate, which comprises the above.

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