JP2021019114A - Tape mounter - Google Patents

Abstract

To provide a tape mounter capable of confirming whether or not a center of tape is matched and bonded to a center of a ring frame.SOLUTION: A tape mounter 1 comprises: a ring frame holding table 20 that holds a ring frame F; a wafer holding table 21 that holds a wafer in an open of the ring frame F; means 22 for bonding circular tape T2 onto an upper surface of the ring frame F and the upper surface of a wafer W; a sensor 6 composed of a light emitting part 60 that emits measurement light to a measurement point in a region where the tape T2 should be bonded onto the upper surface of the ring frame, and a light reception part 61 that receives reflection light obtained by reflecting the light at the measurement point; a setting part 90 that sets a reference value of a light reception amount received by the light reception part 61; and a determination part 92 that determines that the tape T2 is bonded to the measurement point when the light reception amount received by the light reception part 61 is smaller than the reference value, and determines that the tape T2 is not bonded to the measurement point when the light reception amount received by the light reception part 61 is the reference value or more.SELECTED DRAWING: Figure 1

Description

The present invention relates to a tape mounter.

The tape mounter integrates a ring frame having an opening with a diameter larger than the diameter of the wafer and a wafer positioned at the opening of the ring frame by attaching a circular dicing tape to the ring frame, and the wafer can be handled via the ring frame. Put it in a state.

The ring frame holding means of the tape mounter sucks and holds the lower surface of the ring frame. Then, the wafer holding means of the tape mounter sucks and holds the lower surface of the wafer within the opening of the ring frame. Then, a sticking means such as a rolling roller sticks a circular dicing tape to the upper surface of the ring frame and the upper surface of the wafer.

Further, the ring frame is formed on the outer peripheral side surface with two first flat surfaces facing each other in parallel and two second flat surfaces facing parallel to the first flat surface in a direction orthogonal to the first flat surface. Then, as disclosed in Patent Document 1 or Patent Document 2, in order to align the center of the wafer with the center of the opening of the ring frame, the ring frame holding means is provided with a pair of first flat surfaces of the ring frame. The ring frame is positioned (centered) at the target position by sandwiching the pair of second flat surfaces from the outer peripheral side of the ring frame.

The diameter of the dicing tape attached to the wafer and the ring frame positioned as described above is larger than the inner diameter of the ring frame (diameter of the opening) and smaller than the outer diameter of the ring frame. Then, the dicing tape is attached to the ring frame so that the center of the dicing tape and the center of the opening of the ring frame are aligned, and the center of the dicing tape is also aligned with the center of the wafer in the opening of the ring frame. (See, for example, Patent Document 3).

Japanese Unexamined Patent Publication No. 2013-082045 Japanese Unexamined Patent Publication No. 2011-0369668 Japanese Unexamined Patent Publication No. 2016-008104

A dicing device for dicing a wafer with a cutting blade pulls down and holds the ring frame so that the upper surface of the ring frame is lower than the holding surface of the chuck table that holds the wafer so that the cutting blade does not come into contact with the ring frame. .. Here, if the dicing tapes are attached to the ring frame with their centers offset from each other, there is a problem that the dicing tape is peeled off from the ring frame when the ring frame is pulled down and held.
Therefore, the tape mounter has a problem that after the dicing tape is attached to the ring frame, it can be confirmed whether or not the center of the dicing tape is aligned with the center of the ring frame.

The present invention for solving the above problems includes a ring frame holding table that holds a ring frame, a wafer holding table that holds a wafer within an opening of the ring frame, and the ring frame held by the ring frame holding table. A tape mounter comprising a sticking means for sticking a circular tape to the upper surface of the wafer and the upper surface of the wafer held on the wafer holding table, and the tape is stuck on the upper surface of the ring frame. A sensor consisting of a light projecting unit that projects the measurement light to the measurement point in the area to be measured, a light receiving unit that receives the reflected light reflected at the measurement point, and a reference value for the amount of light received by the light receiving unit. If the set unit to be set and the amount of light received by the light receiving unit are smaller than the reference value, it is determined that the tape is attached to the measurement point, and the amount of light received by the light receiving unit is the reference. If it is equal to or more than the value, the tape mounter includes a determination unit for determining that the tape is not attached to the measurement point.

The setting unit includes a storage unit that stores the amount of light received when the light receiving unit receives the reflected light reflected by the upper surface of the ring frame, and the setting unit uses the value stored in the storage unit as the reference. It is preferable to set it as a value.

The sensor is arranged at a position symmetrical to the light projecting unit that projects the measurement light from an obliquely upward direction with respect to the upper surface of the ring frame toward the measurement point and the light projecting unit with respect to the measurement point. A regression reflector that retroreflects the measurement light reflected at the measurement point, and the light receiving portion that receives the reflected light that is further reflected at the measurement point by the reflected light reflected by the regression reflector in the vicinity of the projection unit. , Is preferable.

The sensor is arranged at a position symmetrical to the light projecting unit that projects the measurement light from an obliquely upward direction with respect to the upper surface of the ring frame toward the measurement point and the light projecting unit with respect to the measurement point. It is preferable that the light receiving portion comprises the light receiving portion that receives the reflected light reflected at the measurement point.

The tape mounter according to the present invention includes a light projecting unit that projects measurement light at a measurement point in an area on the upper surface of the ring frame to which the tape should be attached, and a light receiving unit that receives reflected light reflected at the measurement point. A sensor consisting of, a setting unit for setting a reference value for the amount of light received by the light receiving unit, and a judgment unit are provided, and when the judgment unit determines that the amount of light received by the light receiving unit is smaller than the reference value, It can be determined that a tape (for example, dicing tape) is attached to the measurement point, and if the amount of light received by the light receiving unit is equal to or greater than the reference value, it can be determined that the tape is not attached to the measurement point. It can be confirmed whether or not the center of the tape is aligned with the center of the ring frame. That is, in the past, it was possible to check the part where the tape of the ring frame was not attached with the transmissive sensor, but whether or not the center of the tape is attached so as to coincide with the center of the ring frame. In other words, it was not possible to confirm whether or not there was a part where the tape application area was narrowed around the opening of the ring frame. However, in the tape mounter according to the present invention, for example, the measurement point measured by the sensor is set in a region slightly outside the opening of the ring frame (the region where the tape should be attached), and the tape with respect to the ring frame If there is a place where the sticking area is narrow (the tape is not stuck at the measurement point), the amount of reflected light received from the ring frame received by the light receiving part will be equal to or more than the reference value, and the judgment part will It can be determined that there are places where the tape sticking area is partially narrowed, and there are places where the tape is easily peeled off from the ring frame.

The tape mounter according to the present invention includes a storage unit that stores the amount of light received when the light receiving unit receives the reflected light reflected by the upper surface of the ring frame, and the setting unit is a value stored in the storage unit. By setting as a reference value, a reference value for the determination unit to determine whether or not the center of the dicing tape is attached so as to coincide with the center of the ring frame can be appropriately set in the tape mounter.

In the tape mounter according to the present invention, the sensor is arranged at a position symmetrical with the light projecting unit that projects the measurement light from the diagonally upward direction with respect to the upper surface of the ring frame toward the measurement point and the light projecting unit with respect to the measurement point. It consists of a return reflector that retroreflects the measurement light reflected at the measurement point, and a light receiving section that receives the reflected light reflected by the retrospective reflector in the vicinity of the light projecting section. , Even if the dicing tape is a transparent tape or an opaque tape, if the light receiving amount received by the light receiving part is smaller than the reference value, the tape is attached to the measurement point. If the amount of light received by the light receiving part is equal to or greater than the reference value, it can be judged that the tape is not attached to the measurement point, and the center of the dicing tape is attached so as to coincide with the center of the ring frame. You can judge whether it is worn or not.

In the tape according to the present invention, the sensor is arranged at a position symmetrical to the light projecting unit that projects the measurement light from the diagonally upward direction with respect to the upper surface of the ring frame toward the measurement point and the light projecting unit for measurement. Since it consists of a light receiving part that receives the reflected light reflected at the point, even if the dicing tape is an opaque tape, if the judgment part determines that the amount of light received by the light receiving part is smaller than the reference value, the measurement point If it is determined that the tape is attached to the measuring point and the amount of light received by the light receiving part is equal to or greater than the reference value, it can be determined that the tape is not attached to the measurement point, and the center of the dicing tape is the ring. It can be determined whether or not it is attached so as to coincide with the center of the frame.

It is a perspective view which shows an example of a tape mounter. It is a perspective view which shows an example of a ring frame holding table and a wafer holding table. It is a side view explaining the state which the tape starts to stick to a ring frame and a wafer in a tape mounter. It is a side view explaining the state which the tape has started to stick to a ring frame and a wafer in a tape mounter. It is a side view explaining the state in which the tape is attached to the ring frame and the wafer in the tape mounter, and the wafer set is manufactured. FIG. 5 is a plan view illustrating a case where the center of the tape coincides with the center of the ring frame and the tape is attached to the ring frame in the ring frame holding table located below the sensor of the first embodiment. FIG. 5 is a plan view illustrating a case where the center of the tape is deviated from the center of the ring frame and the tape is attached to the ring frame in the ring frame holding table located below the sensor of the first embodiment. A description of a state in which the light projecting unit irradiates the first measurement point with the measurement light and the light receiving unit receives the reflected light in the sensor of the first embodiment when the center of the tape coincides with the center of the ring frame. It is a figure. It is a graph which shows the light receiving amount of the light receiving part of the sensor of Embodiment 1. Explanatory drawing explaining a state in which the light emitting part irradiates the first measurement point with the measurement light, and the light receiving part receives the reflected light in the sensor of Embodiment 1 when the center of a tape is deviated from the center of a ring frame. Is. Explanatory drawing explaining a state in which the light emitting part irradiates the second measurement point with the measurement light, and the light receiving part receives the reflected light in the sensor of Embodiment 1 when the center of a tape is deviated from the center of a ring frame. Is. FIG. 5 is a plan view illustrating a case where the center of the tape coincides with the center of the ring frame and the tape is attached to the ring frame in the ring frame holding table located below the sensor of the second embodiment. When the center of the tape coincides with the center of the ring frame, the sensor of the second embodiment shows that the light projecting unit irradiates the first measurement point with the measurement light and the light receiving unit receives almost no reflected light. It is explanatory drawing to explain. It is a graph which shows the light receiving amount of the light receiving part of the sensor of Embodiment 2. FIG. 5 is a plan view illustrating a case where the center of the tape is deviated from the center of the ring frame and the tape is attached to the ring frame in the ring frame holding table located below the sensor of the second embodiment. A state in which the light projecting unit irradiates the first measurement point with the measurement light and the light receiving unit receives the reflected light in the sensor of the second embodiment when the center of the tape is deviated from the center of the ring frame will be described. It is explanatory drawing. Explain a state in which the light projecting unit irradiates the second measurement point with the measurement light and the light receiving unit receives almost no reflected light in the sensor of the second embodiment when the center of the tape is deviated from the center of the ring frame. It is explanatory drawing to be done.

The tape mounter 1 according to the present invention shown in FIG. 1 includes a base 10 in which each component of the invention described later is arranged and the longitudinal direction is the X-axis direction, and the upper surface of the base 10 is a horizontal plane. .. A tape roll TR is arranged above the rear side (+ X direction side) of the base 10.

The tape roll TR has a structure in which a strip-shaped adhesive tape and a strip-shaped sheet T1 are bonded together. The adhesive tape is composed of a base material made of, for example, a polyolefin resin and a pressure-sensitive adhesive layer of the base material, and a sheet T1 is attached to the pressure-sensitive adhesive layer side. The adhesive tape is pre-cut in a circular shape according to the diameter of the ring frame F to be attached in advance, and a plurality of tapes T2 (dicing tape T2) formed by pre-cutting the adhesive tape on the sheet T1 are formed. It is in a state of being attached at equal intervals in the longitudinal direction of T1. The materials of the tape T2 and the sheet T1 are not particularly limited. For example, in the present embodiment, the tape T2 is a tape that is transparent to visible light, but may be a colored tape that is opaque to visible light.
As shown in FIG. 1, the tape roll TR is wound around a winding cylinder 19 in a roll shape with the tape T2 inside. The tape T2 has a diameter larger than the inner diameter of the circular opening Fc (see FIG. 2) of the ring frame F and a diameter smaller than the outer diameter of the ring frame F.

As shown in FIG. 2, the ring frame F is made of a predetermined metal (for example, SUS or the like) and has an annular flat plate shape, and includes a circular opening Fc having an inner diameter larger than the outer diameter of the wafer W. ing. Further, the ring frame F faces, for example, two first flat surfaces Fd facing in parallel and parallel to each other in a direction orthogonal to the first flat surface Fd by notching a part of the outer periphery thereof flatly. Two second flat surfaces Fe are formed. The first flat surface Fd and the second flat surface Fe are used for positioning the ring frame F.

The wafer W is, for example, a circular semiconductor wafer made of a silicon base material or the like, and the surface Wa (lower surface Wa) of the wafer W facing downward in FIG. 1 has a plurality of devices in a region partitioned in a grid pattern. It is formed and is protected by a protective tape (not shown). The back surface Wb (upper surface Wb) of the wafer W is the surface on which the tape T2 is attached. The wafer W may be made of gallium arsenide, sapphire, gallium nitride, ceramics, resin, silicon carbide or the like in addition to silicon, or may be a rectangular package substrate or the like.

A peel plate 15 for bending the pulled out sheet T1 and peeling the tape T2 from the sheet T1 is arranged at a position diagonally below the tape roll TR shown in FIG. The peel plate 15 is, for example, a swash plate having a triangular shape when viewed from the Y-axis direction, and extends in the Y-axis direction with a length equal to or longer than the width (Y-axis direction length) of the sheet T1. There is. As shown in FIGS. 3 to 4, the peel plate 15 can peel the tape T2 from the sheet T1 by pressing the sheet T1 on its tip side and bending it at an acute angle.

As shown in FIGS. 1 and 3, the sheet T1 from which the tape T2 has been peeled off by the peel plate 15 is sent to the rear side (+ X direction) of the peel plate 15. Then, the sheet T1 is wound in a roll shape by the sheet winding roller 16 that rotates about the rotation axis in the Y-axis direction by a rotation drive source such as a motor. The rotation drive source of the sheet take-up roller 16 controls, for example, the pull-out speed of the sheet T1 from the tape roll TR by torque control.

A sheet support roller 160 is disposed between the sheet take-up roller 16 and the peel plate 15, and the sheet support roller 160 prevents the sheet T1 from which the tape T2 has been peeled off from loosening.

The tape mounter 1 includes a ring frame holding table 20 that holds the ring frame F, a wafer holding table 21 that holds the wafer W in the opening Fc of the ring frame F, and a ring frame F held by the ring frame holding table 20. A sticking means 22 for sticking a circular tape T2 to the upper surface Fa and the upper surface Wb of the wafer W held on the wafer holding table 21 is provided.

The ring frame holding table 20 shown in FIG. 2 is formed, for example, in a square shape in a plan view, and the wafer holding table 21 is housed in a recess 200 formed in the center thereof. The upper surface 20a of the ring frame holding table 20 is a flat surface for holding the ring frame. The upper surface 20a of the ring frame holding table 20 is provided with, for example, four suction cup accommodating portions 201 having an opening and a concave shape. Each of these four suction cup accommodating portions 201 is provided with a suction cup 25 capable of sucking the ring frame F. The suction cup 25 is formed of, for example, a deformable elastic material such as rubber formed into a circular shape in a plan view. Each suction cup 25 communicates with a suction source (not shown) such as a vacuum generator.
The outer shape and structure of the ring frame holding table 20 are not limited to this embodiment.

On the upper surface 20a of the ring frame holding table 20, a first fixed positioning portion 23 for positioning (centering) the ring frame F on the upper surface 20a, and a first movable facing the first fixed positioning portion 23. The positioning unit 24 is arranged. Further, on the upper surface 20a, a second fixed positioning portion 26 and a second movable positioning portion 27 facing the second fixed positioning portion 26 are arranged.
For example, the direction in which the first fixed positioning unit 23 and the first movable positioning unit 24 face each other and the direction in which the second fixed positioning unit 26 and the second movable positioning unit 27 face each other are substantially orthogonal to each other. There is.

The first fixed positioning portion 23 is composed of, for example, two columnar first fixing pins 23a and 23b, and the first fixing pin 23a and the first fixing pin 23b are plan views of the ring frame holding table 20. The center lines parallel to the X-axis direction of the above are arranged symmetrically with each other as the axis of symmetry.

The first movable positioning unit 24 is not shown, for example, to move the cylindrical first movable pin 24a, the first movable block 24b supporting the first movable pin 24a, and the first movable block 24b in the X-axis direction. It has a cylinder.

The second fixed positioning portion 26 includes, for example, two columnar second fixing pins 26a and 26b, and the second fixing pin 26a and the second fixing pin 26b are the ring frame holding table 20 in a plan view. The center lines parallel to the Y-axis direction of the above are arranged symmetrically with each other as the axis of symmetry.
The second movable positioning unit 27 is not shown, for example, to move the cylindrical second movable pin 27a, the second movable block 27b supporting the second movable pin 27a, and the second movable block 27b in the Y-axis direction. It has a cylinder.

In the present embodiment, at least one of the first fixed positioning unit 23 and the first movable positioning unit 24 and the second fixed positioning unit 26 and the second movable positioning unit 27 is in the ring frame F. The ring frame F is positioned (centered) at a target position on the upper surface 20a of the ring frame holding table 20 by sandwiching at least one of the two first flat surfaces Fd and the two second flat surfaces Fe. The center of the opening Fc of the ring frame F centered on the ring frame holding table 20 and the center of the holding surface 210a of the wafer holding table 21 substantially coincide with each other. After that, the ring frame F is sucked and held by each suction cup 25.

The wafer holding table 21 has, for example, a suction portion 210 having a circular outer shape and made of a porous member or the like and sucking the wafer W, and a frame body 211 having a concave vertical cross section and supporting the suction portion 210. To be equipped. The suction portion 210 in a state of being fitted in the recess of the frame body 211 communicates with a suction source (not shown). The wafer holding table 21 sucks and holds the wafer W on the holding surface 210a by transmitting the suction force generated by the suction source to the holding surface 210a which is the upper surface and the flat surface of the suction portion 210.

For example, the height of the upper surface 20a of the ring frame holding table 20 is such that when the wafer W is held by the holding surface 210a of the wafer holding table 21 and the ring frame F is held by the upper surface 20a of the ring frame holding table 20, the ring frame is held. The upper surface Fa of the F and the upper surface Wb of the wafer W are set to have substantially the same height.

As shown in FIG. 1, a table moving means 13 for reciprocating the wafer holding table 21 and the ring frame holding table 20 in the X-axis direction is arranged on the base 10. The table moving means 13 includes a ball screw 130 having an axial center in the X-axis direction, a guide rail 131 arranged in parallel with the ball screw 130, and a motor 132 connected to the ball screw 130 to rotate the ball screw 130. A nut (not shown) provided on the lower surface side of the ring frame holding table 20 is screwed onto the ball screw 130. Then, when the motor 132 rotates the ball screw 130, the wafer holding table 21 and the ring frame holding table 20 are guided by the guide rail 131 and reciprocate in the X-axis direction.

The sticking means 22 is arranged at a position above the movement path of the ring frame holding table 20 and near the tip of the peel plate 15. The sticking means 22 is, for example, a rotatable sticking roller having a length equal to or larger than the width of the ring frame holding table 20 in the Y-axis direction. The sticking means 22 is arranged so as to cross the ring frame holding table 20 in the Y-axis direction, for example, and can be moved in the vertical direction by a moving means (not shown). The sticking means 22 does not have to be movable in the vertical direction.

The ring frame F is suction-held on the ring frame holding table 20 in a centered state, and the wafer W is suction-held on the wafer holding table 21 in a state where the center thereof substantially coincides with the center of the holding surface 210a. Then, as shown in FIGS. 4 and 5, the ring frame holding table 20 is moved in the −X direction by the table moving means 13 and passed below the sticking means 22. As a result, the tape T2 peeled off from the sheet T1 by the peel plate 15 is held on the ring frame holding table 20 from the upper side on the base material surface side by the sticking means 22, and the upper surface Fa of the ring frame F and the wafer. By being pressed against the upper surface Wb of the wafer W held on the holding table 21, the tape T2 is attached to the ring frame F and the wafer W positioned in the opening Fc of the ring frame F. Then, the wafer set shown in FIG. 5 including the wafer W, the tape T2, and the ring frame F, which can handle the wafer W via the ring frame F, is manufactured.

After the wafer set is formed as described above, in order to confirm whether or not the center of the tape T2 is attached so as to coincide with the center of the ring frame F (the center of the opening Fc), FIGS. And, as shown in FIG. 6, the tape mounter 1 is a light projecting unit 60 (only FIG. 6 is shown) that projects the measurement light onto the measurement point in the region where the tape T2 should be attached on the upper surface Fa of the ring frame F. ), A light receiving unit 61 (shown only in FIG. 6) that receives the reflected light reflected at the measurement point, a sensor 6, and a setting unit 90 that sets a reference value for the amount of light received by the light receiving unit 61. A determination unit 92 for determining whether or not the center of the tape T2 coincides with the center of the ring frame F (the center of the opening Fc) and is attached is provided.
The sensor 6 will be referred to as the sensor 6 of the first embodiment below.

FIG. 6 shows a case where the center of the tape T2 is attached so as to coincide with the center of the ring frame F (the center of the opening Fc). Then, FIG. 7 shows a case where the center of the tape T2 coincides with the center of the ring frame F and is not attached, that is, in the illustrated example, the center of the tape T2 is in the + X direction with respect to the center of the ring frame F. It shows the case where it is shifted to the side.

As shown in FIG. 6, the measurement point set on the upper surface Fa of the ring frame F and the sensor 6 emits the measurement light is set in, for example, the area around the opening Fc where the tape T2 should be attached. The first measurement point P1 and the second measurement point P2 to be measured. The area to which the tape T2 should be attached is experimentally, empirically, or theoretically determined, and the center of the tape T2 is attached so as to coincide with the center of the ring frame F (the center of the opening Fc). In this case, it is an annular region attached to the ring frame F of the tape T2. For example, it is preferable that the first measurement point P1 and the second measurement point P2 are set at positions that are the midpoints of the width of the annular region attached to the ring frame F of the tape T2.

The measurement points are at least 2 of the first measurement point P1 and the second measurement point P2 set symmetrically about the center of the opening Fc of the ring frame F in the X-axis direction which is the feed direction of the sheet T1 shown in FIG. It is one.
The measurement point is the center of the opening Fc in the Y-axis direction orthogonal to the X-axis direction, which is the feed direction of the sheet T1 shown in FIG. 6, in the horizontal plane, in addition to the first measurement point P1 and the second measurement point P2. The third measurement point P3 and the fourth measurement point P4 shown in FIG. 6 may be further set symmetrically with respect to the center. In the Y-axis direction orthogonal to the feeding direction of the sheet T1, the attachment deviation of the tape T2 to the ring frame F does not occur so much, so that the third measurement point P3 and the fourth measurement point P4 do not have to be set. ..

The sensors 6 shown in FIGS. 1, 5 and 6 have the upper surfaces 20a and Z of the ring frame holding table 20 above the ring frame holding table 20 in a state of being moved in the −X direction to a position where they have passed through the sticking means 22. They are arranged so as to face each other in the axial direction.
The sensor 6 of the first embodiment is, for example, a retroreflective photoelectric sensor, which is a light projecting unit 60 that emits measurement light from an obliquely upward direction with respect to the upper surface Fa of the ring frame F toward a measurement point, and a measurement point. On the other hand, a regression reflector 62 that is arranged at a symmetrical position with the light projecting unit 60 and reflects the measurement light reflected at the measurement point, and a reflected light that is further reflected by the reflected light reflected by the regression reflector 62 at the measurement point are projected. It is composed of a light receiving unit 61 that receives light in the vicinity of the light unit 60.
If a spot-type laser beam is used as the measurement light, the measurement point is irradiated with the fine line-shaped measurement light, and it becomes easy to determine whether or not the tape T2 is attached to the measurement point.

As shown in FIGS. 6 and 8, the sensor 6 includes, for example, a housing 63 provided with an opening 630 that can block external light and allow measurement light to pass through on the lower side. Extends in the Y-axis direction orthogonal to the X-axis direction, which is the movement direction of the ring frame holding table 20 by the table moving means 13.

The light projecting unit 60 and the light receiving unit 61 are arranged side by side in the + Y direction side of the housing 63 in FIGS. 6 and 8, for example. For example, the light projecting unit 60 can irradiate a low-power thin linear laser beam in a straight line diagonally downward. The laser beam emitted by the light projecting unit 60 is incident on the ring frame F located below the sensor 6 at a predetermined angle of incidence. For example, the incident angle of the laser beam and the height position of the focusing point of the laser beam may be adjustable by an adjusting means (not shown). The light receiving unit 61 is composed of, for example, a light receiving element such as a CCD.

For example, the first measurement point P1 and the second measurement point P2 set in the ring frame F in the centered state on the upper surface 20a of the ring frame holding table 20 are parallel to the X-axis direction of the ring frame holding table 20. It is positioned on the center line. A retrospective reflector 62 such as a mirror surface mirror is arranged at a portion of the housing 63 on the −Y direction side, for example, with the center line parallel to the X-axis direction of the ring frame holding table 20 as the axis of symmetry. When the ring frame holding table 20 is moved in the −X direction by the table moving means 13 shown in FIG. 1 and the first measurement point P1 is located on the optical axis of the light projecting unit 60, the light is projected to the first measurement point P1. It is in a state of being arranged symmetrically with the portion 60 in the Y-axis direction.

For example, as shown in FIG. 1, the tape mounter 1 controls the entire device, that is, the table moving means 13, the first movable positioning unit 24, the second movable positioning unit 27, and the sheet winding described above. A control means 9 including a CPU or the like that controls the operation of each component such as the roller 16 and the sensor 6 is provided. Then, in the present embodiment, the control unit 90 sets a reference value for the amount of light received by the light receiving unit 61, and the determination unit 92 determines whether or not the tape is attached to the measurement point. It is included in 9.

The tape mounter 1 in the present embodiment is the reflected light reflected by the upper surface Fa of the ring frame F, that is, the reflected light reflected by the upper surface Fa of the ring frame F in a state where the tape T2 is not attached, for example. A storage unit 95 is provided to store the amount of light received when the light receiving unit 61 receives the light. The storage unit 95 is included in the control means 9, for example, and includes a ROM for storing a control program, preset processing information, and the like, and a RAM and the like for storing measurement results of the sensor 6.

Below, in the tape mounter 1, whether or not the center of the tape T2 of the wafer set including the wafer W, the ring frame F, and the tape T2 is attached so as to coincide with the center of the ring frame F (the center of the opening Fc). The case where the judgment is made will be described.

The control means 9 shown in FIG. 1 constantly grasps the X-axis coordinate position of the ring frame holding table 20 on the tape mounter 1 by controlling the table moving means 13. Then, after the ring frame holding table 20 sent in the −X direction by the table moving means 13 shown in FIG. 1 passes through the attaching means 22, the tape T2 is attached to the ring frame F as shown in FIG. Further, the ring frame holding table 20 moves in the −X direction to a predetermined coordinate position in the X-axis direction.

Since the ring frame F is centered on the ring frame holding table 20, the ring frame holding table 20 moves to a predetermined coordinate position in the X-axis direction, so that the control means 9 sets the first measurement point P1. It is determined that the coordinate position is grasped in advance in the X-axis direction, that is, it is positioned on the optical axis of the light projecting unit 60 of the sensor 6, as shown in FIGS. Then, an operation signal is sent from the control means 9 to the sensor 6 electrically connected to the control means 9, and the light projecting unit 60 of the sensor 6 is the third from an obliquely upper direction with respect to the upper surface Fa of the ring frame F. 1 A thin line of measurement light is projected toward the measurement point P1.

As shown in FIG. 6, when the center of the tape T2 is attached so as to coincide with the center of the ring frame F, the measurement light passes through the tape T2 and is attached to the ring frame F as shown in FIG. Reflects at the first measurement point P1 on the upper surface Fa of the above. The measurement light reflected at the first measurement point P1 on the upper surface Fa of the ring frame F is retroreflected by the retroreflector 62 arranged at a position symmetrical with the light projecting unit 60 in the Y-axis direction with respect to the first measurement point P1. It is reflected again at the first measurement point P1 and is received by the light receiving unit 61 in the vicinity of the light projecting unit 60. The light receiving amount V2 shown in FIG. 9 received by the light receiving unit 61 due to the light projected on the first measurement point P1 is stored in, for example, a RAM of the storage unit 95 of the control means 9 shown in FIG.

By further moving the ring frame holding table 20 shown in FIGS. 6 and 8 in the −X direction, the control means 9 has the coordinate position where the second measurement point P2 is grasped in advance in the X-axis direction, that is, the sensor 6. It is determined that the light projecting unit 60 is positioned on the optical axis. Then, the light projecting unit 60 of the sensor 6 projects a thin line of measurement light from diagonally upward toward the second measurement point P2 with respect to the upper surface Fa of the ring frame F.

As shown in FIG. 6, when the center of the tape T2 is attached so as to coincide with the center of the ring frame F, the measurement light passes through the tape T2 and the second measurement of the upper surface Fa of the ring frame F is performed. Reflects at point P2. The measurement light reflected by the upper surface Fa of the ring frame F is retroreflected by the retroreflector 62 arranged at a position symmetrical with the light projecting unit 60 in the Y-axis direction with respect to the second measurement point P2, and is retroreflected at the second measurement point P2. It is reflected again and is received by the light receiving unit 61 in the vicinity of the light projecting unit 60. The amount of light received by the light receiving unit 61 due to the light projected on the second measurement point P2 is the amount of light V2 shown in FIG.

The amount of received light when the light receiving unit 61 receives the reflected light reflected by the upper surface Fa of the ring frame F, which is obtained by past experiments and stored in the ROM of the storage unit 95, that is, in the present embodiment, it is cast. The measurement light projected from the light unit 60 onto the upper surface Fa of the ring frame F and reflected by the upper surface Fa of the ring frame F is reflected by the regression reflector 62, and the reflected light retroreflected by the regression reflector 62 is reflected by the light receiving unit 61. The light receiving amount when receiving light is, for example, the light receiving amount V1 shown in FIG.
Then, in the setting unit 90 shown in FIG. 8 in the present embodiment, the light receiving amount V1 stored in the storage unit 95 is attached to the determination unit 92 so that the center of the tape T2 coincides with the center of the ring frame F. The determination unit 92 is set as a reference value V1 for the amount of light received by the light receiving unit 61, which is used to determine whether or not the light is received.

In the determination unit 92, the light receiving amount V2 received by the light receiving unit 61 by the light projection to the first measurement point P1 obtained earlier and stored in the RAM of the storage unit 95, and the light receiving unit 61 due to the light projection to the second measurement point P2. The received light receiving amount V2 is compared with the light receiving amount V1 (reference value V1) stored in the storage unit 95, respectively. Here, the light receiving amount V2 is a value smaller than the light receiving amount V1 because it is the amount of reflected light received by the light receiving unit 61 after being attenuated by the transmission of the tape T2 of the measurement light irradiated by the light projecting unit 60. ..
Therefore, in the determination unit 92, the light receiving amount V2 received by the light receiving unit 61 due to the light projected on the first measurement point P1 shown in FIG. 6 and the light receiving amount V2 received by the light receiving unit 61 due to the light projected on the second measurement point P2. , It is determined that the light receiving amount V1 is smaller than the reference value, and it is determined that the tape T2 is attached to the first measurement point P1 and the second measurement point P2 on the upper surface Fa of the ring frame F, and the tape T2 It is determined that the center coincides with the center of the ring frame F and is attached.
In the present embodiment, the above determination is made by irradiating the first measurement point P1 and the second measurement point P2 with the measurement light, but further, the third measurement point P3 and the fourth measurement point P4 by the sensor 6. The determination unit 92 may make the above determination in consideration of the data obtained by irradiating the measurement light.

In the present embodiment, the tape T2 is a transparent tape, but when the tape T2 is an opaque tape (colored tape), the light receiving portion is projected onto the first measurement point P1 shown in FIG. The light receiving amount received by the 61 is the light receiving amount V3 shown in FIG. Further, the light receiving amount received by the light receiving unit 61 due to the light projected on the second measurement point P2 is the light receiving amount V3 shown in FIG. The light receiving amount V3 is a value smaller than the light receiving amount V1 and the light receiving amount V2 because the measured light emitted by the light projecting unit 60 is the amount of reflected light received by the light receiving unit 61 after being absorbed or scattered by the opaque tape. Is. Therefore, the determination unit 92 uses the light receiving amount V3 received by the light receiving unit 61 due to the light projected on the first measurement point P1 and the light receiving amount V3 received by the light receiving unit 61 due to the light projected on the second measurement point P2 as reference values. It is determined that the tape T2 is attached to the first measurement point P1 and the second measurement point P2 by judging that they are smaller than the light receiving amount V1, and the center of the tape T2 is attached so as to coincide with the center of the ring frame F. It can be judged that it is worn.

For example, after the determination by the determination unit 92 shown in FIG. 8 is performed, the wafer set is housed in the wafer cassette by a transfer means (not shown). The wafer cassette includes a plurality of shelves, and the wafer sets are housed one by one in the shelves.

For example, as shown in FIG. 7, the determination of the determination unit 92 when the center of the tape T2 of the wafer set coincides with the center of the ring frame F (the center of the opening Fc) and is not attached will be described.
As shown in FIG. 7, when the ring frame holding table 20 moves to a predetermined coordinate position in the X-axis direction, the control means 9 moves the first measurement point P1 to the coordinate position previously grasped in the X-axis direction. It is determined that it is positioned, that is, it is positioned on the optical axis of the light projecting unit 60 of the sensor 6, as shown in FIGS. 7 and 10. Then, an operation signal is sent from the control means 9 to the sensor 6, and the light projecting unit 60 emits a thin line of measurement light from diagonally upward toward the first measurement point P1 with respect to the upper surface Fa of the ring frame F. It glows.

As shown in FIG. 10, when the light projecting unit 60 projects a thin line-shaped measurement light toward the first measurement point P1 from diagonally upward with respect to the upper surface Fa of the ring frame F, a tape is taped on the first measurement point P1. Since T2 does not exist, the measurement light is directly reflected at the first measurement point P1 on the upper surface Fa of the ring frame F. The measurement light reflected by the upper surface Fa of the ring frame F is retroreflected by the retroreflector 62, reflected again at the first measurement point P1, and received by the light receiving unit 61 in the vicinity of the light projecting unit 60. The light receiving amount received by the light receiving unit 61 is, for example, the light receiving amount V1 shown in FIG. This is because the measurement light is not attenuated due to the transmission of the tape T2. The received light amount V1 is stored in the RAM of the storage unit 95 of the control means 9.

The ring frame holding table 20 shown in FIG. 7 is further moved in the −X direction and moved to a predetermined coordinate position in the X-axis direction, so that the control means 9 moves the light projecting unit of the sensor 6 as shown in FIG. It is determined that the second measurement point P2 is positioned on the optical axis of 60. Then, the light projecting unit 60 of the sensor 6 projects a thin line of measurement light from diagonally upward toward the second measurement point P2 with respect to the upper surface Fa of the ring frame F.

As shown in FIG. 7, since the center of the tape T2 is displaced in the + X direction with respect to the center of the ring frame F, as shown in FIG. 11, the measurement light passes through the tape T2 and the ring frame. It is reflected at the second measurement point P2 on the upper surface Fa of F. The measurement light reflected by the upper surface Fa of the ring frame F is retroreflected by the retroreflector 62, reflected again at the second measurement point P2, and received by the light receiving unit 61 in the vicinity of the light projecting unit 60. The amount of light received by the light receiving unit 61 due to the light projected on the second measurement point P2 is the amount of reflected light received by the light receiving unit 61 after being attenuated by the transmission of the measurement light irradiated by the light projecting unit 60 by the tape T2. Therefore, it is the light receiving amount V2 shown in FIG.

The determination unit 92 receives the light received by the light receiving unit 61 due to the light projected on the first measurement point P1 stored in the RAM of the storage unit 95, and the light received by the light receiving unit 61 due to the light projected on the second measurement point P2. The amount V2 is compared with the light receiving amount V1 which is a reference value stored in the ROM of the storage unit 95, respectively. Then, the determination unit 92 determines that the light receiving amount V1 received by the light receiving unit 61 by the light projected on the first measurement point P1 is equal to or more than the light receiving amount V1 which is the reference value (that is, the same), and the first measurement point It is determined that the tape T2 is not attached to P1, and it is determined that the center of the tape T2 coincides with the center of the ring frame F and is not attached.
In the present embodiment, the above determination is made by irradiating the first measurement point P1 and the second measurement point P2 with the measurement light, but further, the measurement light for the third measurement point P3 and the fourth measurement point P4. The determination unit 92 may make the above determination in consideration of the data obtained by the irradiation of.

When the determination unit 92 determines that the center of the tape T2 coincides with the center of the ring frame F and is not attached, the determination unit 92 makes the determination to the operator by sounding an alarm sound or displaying an error. Notice. After the determination by the determination unit 92 is performed, the determined defective wafer set is housed in the wafer cassette by a transfer means (not shown), but the operator can use the wafer cassette in which the defective wafer set is housed. Since the position of the shelf can be grasped, the defective wafer set can be then removed from the wafer cassette.
For example, the control means 9 may store the number of shelves in the wafer cassette containing the defective wafer set.
Further, a sampling table on which a defective wafer set is placed may be provided, and the defective wafer set may be transported to the sampling table by a transport means (not shown).

As described above, the tape mounter 1 according to the present invention has a light projecting unit 60 that projects measurement light at a measurement point in a region where the tape T2 should be attached on the upper surface Fa of the ring frame F, and a light projecting unit 60 that reflects the measurement light at the measurement point. A sensor 6 including a light receiving unit 61 for receiving the reflected light, a setting unit 90 for setting a reference value for the amount of light received by the light receiving unit 61, and a determination unit 92 are provided, and the determination unit 92 includes a determination unit 92. If the amount of light received by the light receiving unit 61 is smaller than the reference value, it is determined that the tape T2 is attached to the measurement point, and if the amount of light received by the light receiving unit 61 is greater than or equal to the reference value, the measurement point is set. It can be determined that the tape T2 is not attached, and it can be confirmed whether or not the center of the tape T2 is attached so as to coincide with the center of the ring frame F. That is, conventionally, it was possible to confirm the portion of the ring frame F where the tape T2 was not attached by using the transmissive sensor, but the center of the tape T2 was attached so as to coincide with the center of the ring frame F. In other words, it could not be confirmed whether or not there was a place where the sticking area of the tape T2 was partially narrowed around the opening Fc of the ring frame F. However, in the tape mounter 1 according to the present invention, for example, the measurement point measured by the sensor 6 is set in a region slightly outside the opening Fc of the ring frame F (the region where the tape T2 should be attached). If the area where the tape T2 is attached to the ring frame F is narrow (the area where the tape T2 is not attached on the measurement point), the light receiving portion 61 receives the reflected light from the ring frame F. It can be determined that the amount is equal to or greater than the reference value, the determination unit 92 has a portion where the sticking area of the tape T2 is partially narrowed, and the tape T2 has a portion where the tape T2 is easily peeled off from the ring frame F.

The tape mounter 1 according to the present invention includes a storage unit 95 that stores the amount of light received when the light receiving unit 61 receives the reflected light reflected by the upper surface Fa of the ring frame F, and the setting unit 90 stores the light. By setting the value stored in the unit 95 as the reference value, the determination unit 92 determines whether or not the center of the tape T2 coincides with the center of the ring frame F and is attached. Can be set appropriately.

In the tape mounter 1 according to the present invention, like the sensor 6 of the first embodiment, the sensor 6 projects the measurement light from the diagonally upward direction with respect to the upper surface Fa of the ring frame F toward the measurement point. A retrospective reflector 62 that is arranged at a position symmetrical to the light projecting unit 60 with respect to the measurement point and retroreflects the measurement light reflected at the measurement point, and a reflection that the reflected light reflected by the retrospective reflector 62 is further reflected at the measurement point. By including a light receiving unit 61 that receives light in the vicinity of the light projecting unit 60, the determination unit 92 determines whether the tape T2 is a transparent tape or an opaque tape. If the amount of light received is smaller than the reference value, it is determined that the tape T2 is attached to the measurement point, and if the amount of light received by the light receiving unit 61 is greater than or equal to the reference value, the tape T2 is attached to the measurement point. It can be determined that the tape T2 is not worn, and it can be determined whether or not the center of the tape T2 is aligned with the center of the ring frame F and is attached.

The tape mounter 1 shown in FIG. 1 is, for example, when the tape attached to the ring frame F is not a transparent tape T2 but a colored tape T3 (see FIG. 12) that is not transparent to visible light. Instead of the sensor 6 of the first embodiment, the sensor 6A of the second embodiment shown in FIGS. 12 and 13 described below may be provided.

The sensor 6A of the second embodiment is, for example, a limited reflection type photoelectric sensor, and has a light projecting unit 66 that emits measurement light from an obliquely upward direction toward a measurement point with respect to the upper surface Fa of the ring frame F, and a measurement point. The light receiving unit 67 is arranged at a position symmetrical to the light projecting unit 66 and receives the reflected light reflected at the measurement point.

For example, the sensor 6A faces the upper surface 20a of the ring frame holding table 20 in the Z-axis direction above the ring frame holding table 20 in a state of being moved in the −X direction to the position where it has passed through the sticking means 22 shown in FIG. It is arranged so as to. As shown in FIG. 12, the light projecting unit 66 is arranged at a portion of the housing 63 on the + Y direction side, for example. For example, the light projecting unit 66 passes the light emitted from the built-in light source through a rectangular slit, converts the transmitted light of this slit into parallel light (measurement light) through a collimator lens, and keeps the measurement light at a predetermined width. At the same time, it can be irradiated diagonally downward. For example, the incident angle of the measurement light having a predetermined width may be adjusted by an adjusting means (not shown). Further, the measurement light may form a columnar shape having a predetermined width as a diameter.

For example, the first measurement point P1 and the second measurement point P2 set in the ring frame F in the centered state on the upper surface 20a of the ring frame holding table 20 are parallel to the X-axis direction of the ring frame holding table 20. It is positioned on the center line. The light receiving unit 67 is arranged at a portion of the housing 63 on the −Y direction side with the center line parallel to the X-axis direction of the ring frame holding table 20 as the axis of symmetry, and the table shown in FIG. When the ring frame holding table 20 is moved in the −X direction by the moving means 13 and the first measurement point P1 is located on the optical axis of the light projecting unit 66, the light projecting unit 66 and the Y axis with respect to the first measurement point P1. It will be in a state of being arranged symmetrically in the direction.

Below, in the tape mounter 1 provided with the sensor 6A of the second embodiment, it is determined whether or not the center of the tape T3 shown in FIG. 12 is attached so as to coincide with the center of the ring frame F (the center of the opening Fc). , The case where it is performed by the determination unit 92 will be described.

Under the control of the control means 9 shown in FIG. 1, the ring frame holding table 20 sent in the −X direction by the table moving means 13 passes through the attaching means 22, and the tape T3 shown in FIG. 12 is attached to the ring frame F. After being worn, the ring frame holding table 20 further moves in the −X direction to a predetermined coordinate position in the X-axis direction.

Since the ring frame F is centered on the ring frame holding table 20, the ring frame holding table 20 moves to a predetermined coordinate position in the X-axis direction, so that the control means 9 sets the first measurement point P1. It is determined that the coordinate position is grasped in advance in the X-axis direction, that is, as shown in FIGS. 12 and 13, the position is on the optical axis of the light projecting unit 66 of the sensor 6A. Then, an operation signal is sent from the control means 9 to the sensor 6A electrically connected to the control means 9, and the light projecting unit 66 makes a first measurement point from diagonally upward with respect to the upper surface Fa of the ring frame F. A measurement light having a predetermined width is projected toward P1.

In the limited reflection type sensor 6A, the light emitting unit 66 and the light receiving unit 67 intersect at the same inclination angle, and the specular reflected light in a limited area where the respective optical axes intersect, that is, a certain limited distance. The light receiving unit 67 receives only light. The height position and the like of the light emitting unit 66 and the light receiving unit 67 are set in advance so that the light receiving unit 67 receives the reflected light directly reflected by the upper surface Fa of the ring frame F, for example. ..
Therefore, as shown in FIG. 12, when the center of the tape T3 is attached so as to coincide with the center of the ring frame F (the center of the opening Fc), the measurement light is the first as shown in FIG. Since the light is reflected by the upper surface of the tape T3 attached to the upper surface Fa of the ring frame F at the measurement point P1, the light receiving unit 67 hardly receives the reflected light of the measurement light. Therefore, the amount of light received by the light receiving unit 67 due to the light projected on the first measurement point P1 is, for example, the small amount of light V4 shown in FIG. The measured light receiving amount V4 is stored in the RAM of the storage unit 95 of the control means 9.

The ring frame holding table 20 shown in FIG. 12 is further moved in the −X direction and moved to a predetermined coordinate position in the X-axis direction, so that the control means 9 has the second measurement point P2 as the light projecting unit 66 of the sensor 6A. It is judged that it is positioned on the optical axis of. Then, the light projecting unit 66 of the sensor 6A projects a measurement light having a predetermined width toward the second measurement point P2 from diagonally upward with respect to the upper surface Fa of the ring frame F.

As shown in FIG. 12, when the center of the tape T3 is attached so as to coincide with the center of the ring frame F, the measurement light is attached to the upper surface Fa of the ring frame F at the second measurement point P2. Since the light is reflected on the upper surface of the tape T3, the light receiving unit 67 hardly receives the reflected light of the measurement light. Therefore, the amount of light received by the light receiving unit 67 due to the light projected on the second measurement point P2 is, for example, the amount of light V4 shown in FIG.

The amount of received light when the light receiving unit 67 receives the reflected light obtained by past experiments and stored in the ROM of the storage unit 95 and reflected by the light projecting unit 66 and reflected by the upper surface Fa of the ring frame F is For example, the light receiving amount V5 shown in FIG.
Then, in the setting unit 90 shown in FIG. 13 in the present embodiment, the light receiving amount V5 stored in the storage unit 95 is attached to the determination unit 92 so that the center of the tape T3 coincides with the center of the ring frame F. The determination unit 92 is set as a reference value V5 for the amount of light received by the light receiving unit 67, which is used to determine whether or not the light is received.

In the determination unit 92, the light receiving amount V4 received by the light receiving unit 67 by the light projection to the first measurement point P1 obtained earlier and stored in the RAM of the storage unit 95, and the light receiving unit 67 due to the light projection to the second measurement point P2. The received light receiving amount V4 is compared with the light receiving amount V5 (reference value V5) stored in the storage unit 95, respectively. Then, the determination unit 92 receives the light receiving amount V4 received by the light receiving unit 67 by the light projected on the first measurement point P1 shown in FIGS. 12 and 13, and the light receiving amount received by the light receiving unit 67 by the light projected on the second measurement point P2. It is determined that V4 is smaller than the light receiving amount V5, which is the reference value, and it is determined that the tape T3 is attached to the first measurement point P1 and the second measurement point P2 on the upper surface Fa of the ring frame F, and the tape is taped. It is determined that the center of T3 coincides with the center of the ring frame F and is attached.
In the present embodiment, the above determination is made by irradiating the first measurement point P1 and the second measurement point P2 with the measurement light, but further, the third measurement point P3 and the fourth measurement point P4 by the sensor 6A. The determination unit 92 may make the above determination in consideration of the data obtained by irradiating the measurement light.

For example, after the determination by the determination unit 92 shown in FIG. 13 is performed, the wafer set is housed in the wafer cassette by a transfer means (not shown). The wafer cassette includes a plurality of shelves, and the wafer sets are housed one by one in the shelves.

For example, as shown in FIG. 15, a case where the center of the tape T3 of the wafer set coincides with the center of the ring frame F and is not attached will be described.
As shown in FIGS. 15 and 16, when the ring frame holding table 20 moves to a predetermined coordinate position in the X-axis direction, the control means 9 has the first measurement point P1 as the light of the light projecting unit 66 of the sensor 6A. It is judged that it is positioned on the axis. Then, as shown in FIG. 16, an operation signal is sent from the control means 9 to the sensor 6A, and the light projecting unit 66 of the sensor 6A receives the first measurement point P1 from diagonally upward with respect to the upper surface Fa of the ring frame F. A measurement light having a predetermined width is projected toward.

As shown in FIG. 16, when the light projecting unit 66 projects a measurement light having a predetermined width toward the first measurement point P1 from diagonally upward with respect to the upper surface Fa of the ring frame F, a tape is taped on the first measurement point P1. Since T3 does not exist, the measurement light is reflected at the first measurement point P1 on the upper surface Fa of the ring frame F. The measurement light reflected by the upper surface Fa of the ring frame F is received by the light receiving unit 67. The light receiving amount received by the light receiving unit 61 is, for example, the light receiving amount V5 shown in FIG. The received light amount V5 is stored in the RAM of the storage unit 95 of the control means 9.

The ring frame holding table 20 shown in FIG. 15 is further moved in the −X direction and moved to a predetermined coordinate position in the X-axis direction, so that the control means 9 moves the light projecting unit of the sensor 6A as shown in FIG. It is determined that the second measurement point P2 is positioned on the optical axis of 66. Then, the light projecting unit 66 of the sensor 6A projects a measurement light having a predetermined width toward the second measurement point P2 from diagonally upward with respect to the upper surface Fa of the ring frame F.

As shown in FIG. 17, since the measurement light is reflected by the upper surface of the tape T3 attached to the upper surface Fa of the ring frame F at the second measurement point P2, the light receiving unit 67 hardly receives the reflected light of the measurement light. Therefore, the amount of light received by the light receiving unit 67 due to the light projected on the second measurement point P2 is, for example, the small amount of light V4 shown in FIG.

The determination unit 92 shown in FIG. 15 has a light receiving amount V5 received by the light receiving unit 67 by the light projected on the first measurement point P1 stored in the RAM of the storage unit 95, and the light receiving unit 67 by the light projected on the second measurement point P2. The light receiving amount V4 received by the user is compared with the light receiving amount V5, which is a reference value stored in the ROM of the storage unit 95, respectively. Then, the determination unit 92 determines that the light receiving amount V5 received by the light receiving unit 67 by the light projected on the first measurement point P1 is equal to or more than the light receiving amount V5 which is the reference value (that is, the same), and determines that the first measurement point It is determined that the tape T3 is not attached to P1, and it is determined that the center of the tape T3 coincides with the center of the ring frame F and is not attached.
In the present embodiment, the above determination is made by irradiating the first measurement point P1 and the second measurement point P2 with the measurement light, but further, the measurement light for the third measurement point P3 and the fourth measurement point P4. The determination unit 92 may make the above determination in consideration of the data obtained by the irradiation of.

When the determination unit 92 determines that the center of the tape T3 coincides with the center of the ring frame F and is not attached, the determination unit 92 makes the determination to the operator by sounding an alarm sound or displaying an error. Notice. After the determination by the determination unit 92 is performed, the determined defective wafer set is housed in the wafer cassette by a transfer means (not shown), but the operator can use the wafer cassette in which the defective wafer set is housed. Since the position of the shelf can be grasped, the defective wafer set can be then removed from the wafer cassette.
For example, the control means 9 may store the number of shelves in the wafer cassette containing the defective wafer set.
Further, a sampling table on which a defective wafer set is placed may be provided, and the defective wafer set may be transported to the sampling table by a transport means (not shown).

The tape mounter 1 according to the present invention is not limited to the above embodiment, and the configurations and the like shown in the attached drawings are not limited to this, and the effect of the present invention can be exhibited. It can be changed as appropriate within.

1: Tape mounter 10: Base TR: Tape roll T1: Sheet T2: Tape 19: Winding cylinder F: Ring frame Fc: Ring frame opening Fd: First flat surface Fe: Second flat surface W: Wafer Wa: Wafer Lower surface Wb: Upper surface of wafer 15: Peel plate 16: Winding roller 160: Sheet support roller 20: Ring frame holding table 20a: Upper surface 200: Recessed 201: Sucker accommodating part 25: Sucker
21: Wafer holding table 210: Suction part 210a: Holding surface 211: Frame body 22: Attaching means 23: First fixed positioning part 24: First movable positioning part 26: Second fixed positioning part 27: Second Movable positioning unit 13: Table moving means 130: Ball screw 131: Guide rail 132: Motor 6: Sensor of the first embodiment 60: Light emitting unit 61: Light receiving unit 62: Retroreflector 9: Control means 90: Setting unit 92: Judgment unit 95: Storage unit 6A: Sensor of embodiment 2 66: Light emitting unit 67: Light receiving unit

Claims (4)

A ring frame holding table that holds the ring frame, a wafer holding table that holds the wafer within the opening of the ring frame, an upper surface of the ring frame held by the ring frame holding table, and a wafer holding table held by the wafer holding table. A tape mounter comprising a sticking means for sticking a circular tape to the upper surface of a wafer.
A sensor including a light projecting unit that projects measurement light onto a measurement point in an area on the upper surface of the ring frame to which the tape should be attached, and a light receiving unit that receives reflected light reflected at the measurement point. ,
A setting unit that sets a reference value for the amount of light received by the light receiving unit, and
If the amount of light received by the light receiving unit is smaller than the reference value, it is determined that the tape is attached to the measurement point, and if the amount of light received by the light receiving unit is greater than or equal to the reference value, it is determined that the tape is attached. A tape mounter including a determination unit for determining that no tape is attached to the measurement point. A storage unit for storing the amount of light received when the light receiving unit receives the reflected light obtained by reflecting the measurement light on the upper surface of the ring frame is provided.
The tape mounter according to claim 1, wherein the setting unit sets a value stored in the storage unit as the reference value. The sensor is
The light projecting unit that projects the measurement light from an obliquely upward direction with respect to the upper surface of the ring frame toward the measurement point.
A retroreflector arranged at a position symmetrical to the light projecting portion with respect to the measurement point and retroreflecting the measurement light reflected at the measurement point.
The tape mounter according to claim 1 or 2, comprising the light receiving portion in which the reflected light reflected by the retrospective reflector receives the reflected light further reflected at the measurement point in the vicinity of the light projecting portion. The sensor is
The light projecting unit that projects the measurement light from an obliquely upward direction with respect to the upper surface of the ring frame toward the measurement point.
The tape mounter according to claim 1 or 2, wherein the light receiving portion is arranged at a position symmetrical to the light emitting portion with respect to the measuring point and receives the reflected light reflected at the measuring point.

Images