TWI606549B - Suction cup table - Google Patents
Suction cup table Download PDFInfo
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- TWI606549B TWI606549B TW103100369A TW103100369A TWI606549B TW I606549 B TWI606549 B TW I606549B TW 103100369 A TW103100369 A TW 103100369A TW 103100369 A TW103100369 A TW 103100369A TW I606549 B TWI606549 B TW I606549B
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Description
本發明是有關於一種吸盤工作台，其用於固持裝備於雷射加工裝置等的加工裝置之被加工物，該雷射加工裝置是將半導體晶圓等的被加工物加工。 The present invention relates to a suction cup table for holding a workpiece to be processed by a processing apparatus such as a laser processing apparatus that processes a workpiece such as a semiconductor wafer.
在半導體設備製造步驟中，在略圓板形狀之半導體晶圓的表面，藉由配列成格子狀之被稱為切割道的分割預定線劃分為複數的區域，並於該經劃分之區域內形成IC、LSI等設備。接著，將半導體晶圓沿切割道切斷藉以分割形成有設備之區域來製造各個半導體晶片。又，在藍寶石基板的表面積層有氮化鎵系化合物半導體等之光設備晶圓，亦藉由沿切割道切斷分割成各個發光二極體、雷射二極體等之光設備，而被廣泛利用於電力機器。 In the semiconductor device manufacturing step, the surface of the semiconductor wafer having a substantially circular plate shape is divided into a plurality of regions by a divisional line called a scribe line arranged in a lattice shape, and is formed in the divided region. IC, LSI and other equipment. Next, each semiconductor wafer is fabricated by cutting the semiconductor wafer along the scribe line to divide the region where the device is formed. In addition, an optical device wafer such as a gallium nitride-based compound semiconductor is formed on the surface layer of the sapphire substrate, and the optical device such as each of the light-emitting diodes and the laser diodes is cut along the scribe line. Widely used in electric machines.
經分割為個體之半導體設備，在其背面配設有以聚醯亞胺系樹脂、環氧系樹脂、丙烯醯系樹脂脂等所形成之厚度20~40μm、被稱為晶粒黏著薄膜之晶粒結著用的接著薄膜，對透過該接著薄膜來支持半導體設備的晶粒結著 支架加熱，藉以使其結著。作為在半導體背面配設晶粒結著用的接著薄膜之方法，是在半導體晶圓的背面貼著接著薄膜，透過該接著薄膜將半導體晶圓貼著於切割膠帶後，沿形成於半導體晶圓表面之切割道，利用切削刀片與接著薄膜一起切斷，藉以形成背面配設有接著薄膜之半導體設備。(例如參照專利文獻1。) A semiconductor device that is divided into individual crystals, and a crystal having a thickness of 20 to 40 μm formed of a polyimide film, an epoxy resin, or an acrylic resin resin, which is called a die-adhesive film, is disposed on the back surface of the semiconductor device. a bonding film for grain bonding, supporting the crystal grain of the semiconductor device through the bonding film The bracket is heated to make it stand. As a method of disposing a film for bonding a crystal on the back surface of a semiconductor, a film is attached to the back surface of the semiconductor wafer, and the semiconductor wafer is pasted on the dicing tape through the bonding film, and is formed on the semiconductor wafer. The cutting path of the surface is cut by the cutting blade together with the film, thereby forming a semiconductor device having a film on the back side. (For example, refer to Patent Document 1.)
然而，依據上述專利文獻1所揭示之方法，利用切削刀片將半導體晶圓與接著薄膜一起切斷而分隔成各個半導體設備時，可能會有下述問題：在半導體設備的背面產生缺陷，或是在接著薄膜上產生髭狀的毛刺而形成導線接合時斷線的原因。 However, according to the method disclosed in the above Patent Document 1, when the semiconductor wafer is cut together with the film by the cutting blade to be separated into individual semiconductor devices, there may be a problem that defects are generated on the back surface of the semiconductor device, or A burr-like burr is generated on the film to form a cause of disconnection at the time of wire bonding.
近年，欲謀求行動電話或電腦等電力機器較輕量化、小型化，需要較薄的半導體設備。就較薄地分割半導體設備之技術而言，所謂稱為先切割法之分割技術已經實用化。該先切割法是自半導體晶圓的表面沿著切割道，利用厚度為20~40μm之切削刀片形成預定深度(相當於半導體設備之加工厚度的深度)的分割溝，其後，將表面形成有分割溝之半導體晶圓的背面研削，在背面使切削溝露出表面而分割成各個半導體設備之技術，可將半導體設備之厚度加工成50μm以下。 In recent years, in order to reduce the weight and size of power equipment such as mobile phones or computers, thin semiconductor devices are required. In terms of technology for thinning semiconductor devices, a so-called segmentation technique called a pre-cut method has been put into practical use. The first cutting method is a dividing groove formed from a surface of a semiconductor wafer along a dicing street by a cutting blade having a thickness of 20 to 40 μm to a predetermined depth (corresponding to a depth of a processing thickness of the semiconductor device), and thereafter, the surface is formed with The thickness of the semiconductor device can be processed to 50 μm or less by the technique of dividing the back surface of the semiconductor wafer in the trench and dividing the surface of the trench into the semiconductor device on the back surface.
然而，在藉由先切割法將半導體晶圓分割為各個半導體設備時，因在自半導體晶圓的表面沿切割道形成預定深度之分割溝後，研削半導體晶圓背面而在該背面使分割溝露出表面，故無法預先將晶粒結著用之接著薄膜配設 於半導體晶圓的背面。因此，依據先切割法，在要結著至支持半導體設備之晶粒結著支架時，必須在半導體設備與晶粒結著支架之間插入結著劑，而有無法圓滑地實施結著作業等問題。 However, when the semiconductor wafer is divided into individual semiconductor devices by the dicing method, the back surface of the semiconductor wafer is ground and the dividing groove is formed on the back surface by forming a dividing groove of a predetermined depth along the dicing street from the surface of the semiconductor wafer. The surface is exposed, so the film can not be used in advance and the film is disposed. On the back side of the semiconductor wafer. Therefore, according to the first-cut method, when a crystal-supporting support for supporting a semiconductor device is to be attached, it is necessary to insert a bonding agent between the semiconductor device and the die-clamping bracket, and it is impossible to smoothly perform the writing work, etc. problem.
為了解決這樣的問題，提案有下述半導體設備的製造方法：在利用先切割法分割成各個半導體設備之晶圓的背面配設晶粒結著用之接著薄膜，透過該接著薄膜將半導體設備貼著於切割膠帶後，在露出於各半導體設備間之間隙的接著薄膜之部分，從半導體設備之表面側通過上述間隙照射雷射光線，將露出於接著薄膜之上述間隙的部分溶斷。(例如，參照專利文獻2。) In order to solve such a problem, there is proposed a method of manufacturing a semiconductor device in which a film for die-bonding is disposed on a back surface of a wafer which is divided into semiconductor devices by a dicing method, and a semiconductor device is pasted through the bonding film. After the dicing tape is applied, the portion of the adhesive film exposed in the gap between the semiconductor devices is irradiated with laser light from the surface side of the semiconductor device through the gap, and the portion exposed to the gap of the film is melted. (For example, refer to Patent Document 2.)
【專利文獻1】日本專利特開2000-182995號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-182995
【專利文獻2】日本專利特開2002-118081號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2002-118081
在依據如上所述之先切割法分割為各個半導體設備之晶圓的背面，配設晶粒結著用之接著薄膜，透過該接著薄膜將半導體設備貼著於切割膠帶後，在對露出於各半導體設備間之間隙的接著薄膜之部分，在從半導體設備之表面側通過上述間隙照射雷射光線時，檢出利用分割溝所形成之半導體設備間的間隙來實施雷射光線照射位置的 對齊校正。 In the back surface of the wafer which is divided into the respective semiconductor devices by the dicing method as described above, a bonding film for die bonding is disposed, and the semiconductor device is pasted on the dicing tape through the bonding film, and is exposed to each other When a portion of the film between the semiconductor devices is irradiated with the above-described gap from the surface side of the semiconductor device, the gap between the semiconductor devices formed by the dividing grooves is detected to perform the laser beam irradiation position. Alignment correction.
然而，由於形成於半導體設備之切削溝寬為20~40μm之故，便難以利用攝像裝置來辨識形成於雷射加工裝置之吸盤工作台所固持之晶圓上的分割溝，有時會有雷射光線照射超出分割溝(半導體設備間的間隙)的情形。 However, since the width of the cutting groove formed in the semiconductor device is 20 to 40 μm, it is difficult to identify the dividing groove formed on the wafer held by the chucking table of the laser processing apparatus by the image pickup device, and sometimes there is a laser. The case where the light is irradiated beyond the dividing groove (the gap between the semiconductor devices).
因此，會有下述問題：接著薄膜之溶斷不充分，而無法從切割膠帶提取帶有接著薄膜之設備，又會使設備之背面損傷。 Therefore, there is a problem in that the film is not sufficiently melted, and the device with the film attached thereto cannot be extracted from the dicing tape, and the back surface of the device is damaged.
本發明是有鑑於上述事實而完成，其主要的技術性課題是提供一種吸盤工作台，其裝備有可確實地辨識形成於被加工物之分割溝之加工裝置。 The present invention has been made in view of the above circumstances, and a main technical object thereof is to provide a suction cup table equipped with a processing apparatus capable of reliably recognizing a dividing groove formed in a workpiece.
為了解決上述主要的技術課題，依據本發明，提供一種吸盤工作台，是被裝備於加工裝置且用於固持被加工物；其特徵在於：具備固持台，固持被加工物；及台基座，支持該固持台；該固持台是由複合玻璃板與環狀支持台所構成。其中該複合玻璃板是由多孔質板與收容板所構成，該多孔質板是由可容許自表面至背面之空氣流動的多孔質玻璃所形成，該收容板具有收容該多孔質板之收容凹部並具備將吸引力傳達至該多孔質板之吸引孔，且由玻璃所形成；該環狀支持台具備複合玻璃板支持部與環狀支持部，該複合玻璃板支持部是支持該複合玻璃板之外周部且具備連通至該 吸引孔之連通孔；該環狀支持部是圍繞該複合玻璃板所形成；該台基座是由環狀的固定部、發光體收容部與發光體所構成，並設有將吸引力傳達至形成於該環狀支持台之連通孔的吸引力傳達孔；該環狀的固定部是固定構成該固持台之該環狀支持台；該發光體收容部是形成於該環狀之固定部的內側；該發光體是配設於該發光體收容部。 In order to solve the above-mentioned main technical problems, according to the present invention, a suction cup table is provided which is equipped in a processing device and is used for holding a workpiece; and is characterized in that: a holding table is provided to hold the workpiece; and a base is provided. The holding table is supported; the holding table is composed of a composite glass plate and an annular support table. The composite glass plate is composed of a porous plate and a receiving plate formed of porous glass that allows air flowing from the surface to the back surface, and the receiving plate has a receiving recess for receiving the porous plate. And a suction hole for conveying the attraction force to the porous plate, and is formed of glass; the annular support base is provided with a composite glass plate support portion and an annular support portion, and the composite glass plate support portion supports the composite glass plate Outside the perimeter and have connectivity to the a communication hole for the suction hole; the annular support portion is formed around the composite glass plate; the base is formed by an annular fixing portion, an illuminant receiving portion, and an illuminator, and is configured to transmit the attraction force to An attractive force transmitting hole formed in the communication hole of the annular support base; the annular fixing portion is an annular support base that fixes the holding base; the illuminant receiving portion is formed in the annular fixed portion The inner side; the illuminant is disposed in the illuminant accommodating portion.
在上述環狀支持台的複合玻璃板支持部形成有吸引固持溝，藉由將負壓作用於該吸引固持溝，可將複合玻璃板可裝卸地吸引支持於玻璃板支持部。 The composite glass plate supporting portion of the annular support base is formed with a suction holding groove, and by applying a negative pressure to the suction holding groove, the composite glass plate can be detachably attracted and supported by the glass plate supporting portion.
又，在上述台基座之該固定部形成有吸引固持溝，藉由將負壓作用於該吸引固持溝，可將構成固持台之環狀支持台可裝卸地吸引固定於台基座的固定部。 Further, the fixing portion of the base base is formed with a suction holding groove, and by applying a negative pressure to the suction holding groove, the annular support table constituting the holding table can be detachably fixed to the base of the table. unit.
進一步，在設置於構成上述複合玻璃板的收容板之收容凹部的底面設有形成為同心圓狀之複數的圓形吸引溝，該複數的圓形吸引溝是透過連通溝連通於吸引孔。 Further, a plurality of circular suction grooves formed in a concentric shape are provided on a bottom surface of the housing recess provided in the housing plate constituting the composite glass plate, and the plurality of circular suction grooves communicate with the suction holes through the communication grooves.
又，上述複合玻璃板是透過在設於收容板之收容凹部的底面之複數的圓形吸引溝之間所配設之結著劑來接合。 Further, the composite glass sheet is joined by a bonding agent disposed between a plurality of circular suction grooves provided on a bottom surface of the housing recess of the housing plate.
又，在上述台基座，最好設有用於冷卻發光體收容部之冷卻元件。 Further, it is preferable that the stage base is provided with a cooling element for cooling the illuminant accommodating portion.
依據本發明之吸盤工作台是具備固持被加工物之固持台與支持固持台之台基座；其中固持台是由複合玻璃板與環狀支持台所構成。其中該複合玻璃板是由多孔質 板與收容板所構成，該多孔質板是由可容許自表面至背面之空氣流動的多孔質玻璃所形成，該收容板具有收容該多孔質板之收容凹部並具備將吸引力傳達至該多孔質板之吸引孔，且由玻璃所形成；該環狀支持台具備複合玻璃板支持部與環狀支持部，該複合玻璃板支持部是支持該複合玻璃板之外周部且具備連通至該吸引孔之連通孔；該環狀支持部是圍繞該複合玻璃板所形成；該台基座是由環狀的固定部、發光體收容部與發光體所構成；並設有對形成於該環狀支持台之連通孔傳達吸引力之吸引力傳達孔；該環狀的固定部是固定構成固持台之環狀支持台；該發光體收容部是形成於該環狀之固定部的內側；該發光體是配設於該發光體收容部；因此例如在檢出固持台所固持之晶圓上所形成之分割溝來實施雷射光線照射位置之對齊校正時，可將上述發光體點亮。此結果，由於發光體產生的光將透過形成於晶圓上的分割溝，故能利用攝像元件確實地檢出分割溝。因此，可將雷射光線通過分割溝而確實地照射於晶圓背面所配設之接著薄膜，而能沿著分割成個體之設備的外周緣將接著薄膜確實地切斷。 The suction cup table according to the present invention is a base having a holding table for holding a workpiece and a supporting holding table; wherein the holding table is composed of a composite glass plate and an annular support table. Where the composite glass plate is made of porous The plate and the accommodating plate are formed of porous glass that allows air flowing from the surface to the back surface, and the accommodating plate has a housing recess for accommodating the porous plate and transmits the attraction force to the porous a suction hole formed by the glass plate; the annular support base is provided with a composite glass plate support portion and an annular support portion, and the composite glass plate support portion supports the outer peripheral portion of the composite glass plate and is connected to the attraction a connecting hole of the hole; the annular support portion is formed around the composite glass plate; the base is formed by an annular fixing portion, an illuminant receiving portion and an illuminator; and the pair is formed in the ring shape The communication hole of the support table transmits an attractive attraction transmission hole; the annular fixing portion is an annular support table that fixes the holding table; the illuminant receiving portion is formed inside the annular fixing portion; the illuminating The body is disposed in the illuminant accommodating portion; therefore, for example, when the aligning groove formed on the wafer held by the holding table is detected to perform alignment correction of the laser beam irradiation position, the illuminator can be illuminatedAs a result, since the light generated by the illuminator passes through the division groove formed on the wafer, the division groove can be reliably detected by the imaging element. Therefore, the laser beam can be surely irradiated to the adhesive film disposed on the back surface of the wafer by the dividing groove, and the film can be surely cut along the outer peripheral edge of the device divided into individual.
10‧‧‧半導體晶圓 10‧‧‧Semiconductor wafer
10a‧‧‧表面 10a‧‧‧ surface
10b‧‧‧背面 10b‧‧‧back
101‧‧‧設備 101‧‧‧ Equipment
102‧‧‧分割溝 102‧‧‧dividing trench
11‧‧‧接著薄膜 11‧‧‧Next film
12‧‧‧環狀支架 12‧‧‧Ring bracket
13‧‧‧切割膠帶 13‧‧‧Cut Tape
2‧‧‧靜止基座 2‧‧‧Standing base
3‧‧‧吸盤工作台機構 3‧‧‧Sucker table mechanism
31‧‧‧引導軌 31‧‧‧ Guide track
32‧‧‧第1滑動塊 32‧‧‧1st sliding block
321‧‧‧被引導溝 321‧‧‧Guided ditch
322‧‧‧引導軌 322‧‧‧Guidance track
33‧‧‧第2滑動塊 33‧‧‧2nd sliding block
331‧‧‧被引導溝 331‧‧‧Guided ditch
34‧‧‧支持筒體 34‧‧‧Support cylinder
37‧‧‧加工輸送元件 37‧‧‧Processing conveyor components
371‧‧‧雄螺桿 371‧‧‧ male screw
372‧‧‧脈動馬達 372‧‧‧pulsating motor
373‧‧‧軸承塊 373‧‧‧ bearing block
374‧‧‧加工輸送位置偵測元件 374‧‧‧Processing and conveying position detecting element
374a‧‧‧線性標度尺 374a‧‧‧linear scale
374b‧‧‧讀取頭 374b‧‧‧Reading head
38‧‧‧第1索引輸送元件 38‧‧‧1st index conveying element
381‧‧‧雄螺桿 381‧‧‧ male screw
382‧‧‧脈動馬達 382‧‧‧pulsating motor
383‧‧‧軸承塊 383‧‧‧ bearing block
384‧‧‧索引輸送位置偵測元件 384‧‧‧ Index conveying position detecting element
384a‧‧‧線性標度尺 384a‧‧‧linear scale
384b‧‧‧讀取頭 384b‧‧‧Read head
4‧‧‧吸盤工作台 4‧‧‧Sucker Workbench
5‧‧‧固持台 5‧‧‧Guide
50‧‧‧複合玻璃板 50‧‧‧Composite glass plate
51‧‧‧多孔質板 51‧‧‧Porous board
52‧‧‧收容板 52‧‧‧ containment board
521‧‧‧收容凹部 521‧‧‧ containment recess
521a‧‧‧底面 521a‧‧‧ bottom
521b‧‧‧圓形吸引溝 521b‧‧‧round attracting ditch
521c‧‧‧連通溝 521c‧‧‧Connected trench
521d‧‧‧吸引孔 521d‧‧‧ attracting holes
521e‧‧‧定位孔 521e‧‧‧Positioning holes
53‧‧‧環狀支持台 53‧‧‧Ring support desk
531‧‧‧複合玻璃板支持部 531‧‧‧Composite glass plate support
531a‧‧‧連通孔 531a‧‧‧Connected holes
531b‧‧‧定位梢釘 531b‧‧‧Locating spikes
531c‧‧‧吸引固持溝 531c‧‧‧Attraction holding groove
531d‧‧‧吸引固持孔 531d‧‧‧Attraction holding hole
532‧‧‧環狀支持部 532‧‧‧Ring Support
532a‧‧‧凹部 532a‧‧‧ recess
532b‧‧‧定位孔 532b‧‧‧Positioning holes
532c‧‧‧圓形凹部 532c‧‧‧Circular recess
532d‧‧‧吸附墊用連通孔 532d‧‧‧Connecting hole for adsorption pad
54‧‧‧吸附元件 54‧‧‧Adsorption elements
541‧‧‧吸附墊 541‧‧‧Adsorption pad
541a‧‧‧支持部 541a‧‧‧Support Department
6‧‧‧台基座 6‧‧‧ base
61‧‧‧環狀固定部 61‧‧‧Ring fixed part
611‧‧‧吸引力傳達孔 611‧‧‧Attraction communication hole
612‧‧‧吸附墊用吸引孔 612‧‧‧ suction hole with suction hole
613‧‧‧吸引固持溝 613‧‧‧Attraction holding groove
614‧‧‧吸引固定孔 614‧‧‧Attracting fixing holes
615‧‧‧定位梢釘 615‧‧‧Locating spikes
62‧‧‧發光體收容部 62‧‧‧Lighting body accommodating department
63‧‧‧發光體 63‧‧‧Lights
65‧‧‧冷卻元件 65‧‧‧ Cooling element
650‧‧‧冷卻室 650‧‧‧cooling room
651‧‧‧底壁 651‧‧‧ bottom wall
651a‧‧‧冷卻風導口 651a‧‧‧Cooling air guide
652‧‧‧外周壁 652‧‧‧ peripheral wall
652a‧‧‧冷卻風排出口 652a‧‧‧Cooling air outlet
7‧‧‧雷射光線照射單元支持機構 7‧‧‧Laser light irradiation unit support mechanism
71‧‧‧引導軌 71‧‧‧ Guide rail
72‧‧‧可動支持基座 72‧‧‧ movable support base
721‧‧‧移動支持部 721‧‧‧Mobile Support Department
722‧‧‧配設部 722‧‧‧Arbitration Department
723‧‧‧引導軌 723‧‧‧ Guide track
73‧‧‧第2索引輸送元件 73‧‧‧2nd index conveying element
731‧‧‧雄螺桿 731‧‧‧ male screw
732‧‧‧脈動馬達 732‧‧‧pulse motor
8‧‧‧雷射光線照射單元 8‧‧‧Laser light irradiation unit
80‧‧‧攝像元件 80‧‧‧Photographic components
81‧‧‧單元支持器 81‧‧‧Unit Supporter
811‧‧‧被引導溝 811‧‧‧guided ditch
82‧‧‧雷射光線照射元件 82‧‧‧Laser light illuminating element
821‧‧‧殼套 821‧‧‧shell
822‧‧‧集光器 822‧‧‧ concentrator
83‧‧‧移動元件 83‧‧‧Mobile components
832‧‧‧脈動馬達 832‧‧‧pulsating motor
9‧‧‧控制元件 9‧‧‧Control elements
90‧‧‧顯示元件 90‧‧‧ display elements
91‧‧‧中央處理裝置(CPU) 91‧‧‧Central Processing Unit (CPU)
92‧‧‧唯讀記憶體(ROM) 92‧‧‧Reading Memory (ROM)
93‧‧‧隨機存取記憶體(RAM) 93‧‧‧ Random Access Memory (RAM)
94‧‧‧計數器 94‧‧‧ counter
95‧‧‧輸入介面 95‧‧‧Input interface
96‧‧‧輸出介面 96‧‧‧Output interface
10‧‧‧半導體晶圓 10‧‧‧Semiconductor wafer
11‧‧‧接著薄膜 11‧‧‧Next film
12‧‧‧環狀支架 12‧‧‧Ring bracket
13‧‧‧切割膠帶 13‧‧‧Cut Tape
【圖1】依據本發明所構成之雷射加工裝置的側視圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side elevational view of a laser processing apparatus constructed in accordance with the present invention.
【圖2】將圖1所示之雷射加工裝置所裝備之吸盤工作台的構成構件分解表示的側視圖。 Fig. 2 is a side view showing the components of the chuck table provided in the laser processing apparatus shown in Fig. 1 in an exploded manner.
【圖3】圖1所示之吸盤工作台的截面圖。 Fig. 3 is a cross-sectional view of the chuck table shown in Fig. 1.
【圖4】圖2所示之吸盤工作台的要部截面圖。 Fig. 4 is a cross-sectional view of an essential part of the chuck table shown in Fig. 2.
【圖5】表示作為被加工物之半導體晶圓透過環狀切割膠帶受到環狀支架支持之狀態的側視圖。 Fig. 5 is a side view showing a state in which a semiconductor wafer as a workpiece is supported by a ring-shaped dicing tape through a ring-shaped dicing tape.
【圖6(a)~(c)】利用圖1所示之雷射加工裝置來實施之雷射光線照射步驟的說明圖。 6(a) to 6(c) are explanatory views of a laser beam irradiation step performed by the laser processing apparatus shown in Fig. 1.
以下關於依照本發明而構成之吸盤工作台之適宜的實施形態，參照附加圖示來詳細地進行說明。 Hereinafter, a preferred embodiment of the chuck table constructed in accordance with the present invention will be described in detail with reference to the accompanying drawings.
在圖1中，是表示依據本發明所構成的吸盤工作台所裝備之雷射加工裝置的側視圖。圖1所示之雷射加工裝置具備靜止基座2；吸盤工作台機構3，是以可在箭頭X所示加工輸送方向上移動的方式配設於靜止基座2，並固持被加工物；雷射光線照射單元支持機構7，是以可在與上述箭頭X所示方向呈直角之以箭頭Y所示之索引輸送方向上移動的方式配置於靜止基座2；與雷射光線照射單元8，是以可在箭頭Z所示方向上移動的方式配設於該雷射光線照射單元支持機構7。 In Fig. 1, a side view of a laser processing apparatus equipped with a chuck table constructed in accordance with the present invention is shown. The laser processing apparatus shown in Fig. 1 includes a stationary base 2; the suction cup table mechanism 3 is disposed on the stationary base 2 so as to be movable in the processing conveyance direction indicated by the arrow X, and holds the workpiece; The laser beam irradiation unit support mechanism 7 is disposed on the stationary base 2 so as to be movable in an index transport direction indicated by an arrow Y at a right angle to the direction indicated by the arrow X; and the laser beam irradiation unit 8 The laser beam irradiation unit support mechanism 7 is disposed so as to be movable in the direction indicated by the arrow Z.
上述吸盤工作台機構3具備：一對的引導軌31、31，在靜止基座2上沿以箭頭X所示之加工輸送方向平行地配設；第一滑動塊32，是在該引導軌31、31上以可在箭頭X所示加工輸送方向上移動的方式配設；第2滑動塊33，是在該第1滑動塊32上以可在箭頭Y所示索引輸送方向上移動的方式配設；作為被加工物固持元件之吸盤工作台4，是 在該第2滑動塊33上利用圓筒狀的支持筒體34以可旋轉的方式支持。 The chuck table mechanism 3 includes a pair of guide rails 31 and 31 which are disposed in parallel on the stationary base 2 in the processing conveyance direction indicated by an arrow X. The first slider 32 is on the guide rail 31. 31 is disposed so as to be movable in the processing conveyance direction indicated by the arrow X. The second sliding block 33 is arranged to move in the index transport direction indicated by the arrow Y on the first slider 32. a suction cup table 4 as a workpiece holding member The second sliding block 33 is rotatably supported by a cylindrical support cylinder 34.
關於吸盤工作台4，參照圖2及圖3來說明。 The chuck table 4 will be described with reference to Figs. 2 and 3 .
圖2及圖3所示之吸盤工作台4是透過圖未示之軸承以可旋轉的方式受到配設於第2滑動塊33的上面之圓筒狀的支持筒體34所支持。吸盤工作台4具備固持台5，是固持被加工物；與台基座6，是支持該固持台5。固持台5是由複合玻璃板50與環狀支持台53所構成，其中該複合玻璃板50是由圓盤狀的多孔質板51與將該多孔質板51配設於上面之收容板52所構成；而該環狀支持台53是支持該複合玻璃板50。 The chuck table 4 shown in Figs. 2 and 3 is rotatably supported by a cylindrical support cylinder 34 disposed on the upper surface of the second slider 33 via a bearing (not shown). The chuck table 4 includes a holding table 5 for holding the workpiece, and the table base 6 supports the holding table 5. The holding table 5 is composed of a composite glass plate 50 and a ring-shaped support plate 53 which is a disk-shaped porous plate 51 and a receiving plate 52 on which the porous plate 51 is disposed. The annular support table 53 supports the composite glass plate 50.
構成固持台5之複合玻璃板50的多孔質板51是以容許自表面至背面之空氣流動的多孔質玻璃所構成。又，構成複合玻璃板50的收容板52是利用玻璃材形成為圓盤狀，且在上面設有上述多孔質板51嵌合之收容凹部521。該收容凹部521，深度是形成為與上述多孔質板51之厚度相同尺寸；在底面521a是設有形成為同心圓狀之複數之圓形吸引溝521b及連通於該複數之圓形吸引溝521b的連通溝521c。又，在收容板52，如圖3所示，設有與上述連通溝521c連通之吸引孔521d，且在下面設有定位孔521e。藉由在如此所構成之收容板52的收容凹部521嵌合多孔質板51可構成複合玻璃板50。再者，構成複合玻璃板50之收容板52與多孔質板51，最好是透過上述形成為同心圓狀之複數的圓形吸引溝521b之間所配設之結著劑被接合。 The porous plate 51 constituting the composite glass plate 50 of the holding table 5 is made of porous glass that allows air flowing from the surface to the back surface. Further, the accommodation plate 52 constituting the composite glass plate 50 is formed in a disk shape by a glass material, and the accommodation recessed portion 521 in which the porous plate 51 is fitted is provided on the upper surface. The receiving recess 521 has a depth equal to the thickness of the porous plate 51. The bottom surface 521a is provided with a plurality of circular suction grooves 521b formed in a concentric shape and connected to the plurality of circular suction grooves 521b. The groove 521c is connected. Further, as shown in FIG. 3, the receiving plate 52 is provided with a suction hole 521d that communicates with the communication groove 521c, and a positioning hole 521e is provided on the lower surface. The composite glass plate 50 can be configured by fitting the porous plate 51 to the housing recess 521 of the housing plate 52 thus configured. Further, it is preferable that the accommodation plate 52 and the porous plate 51 constituting the composite glass plate 50 are joined by a bonding agent disposed between the plurality of circular suction grooves 521b formed in a concentric shape.
構成固持台5之環狀支持台53，具備複合玻璃板支持部531，是內周部上面具環狀的階差來形成，而支持上述複合玻璃板之外周部；與環狀支持部532，是圍繞該複合玻璃板支持部531所形成。在複合玻璃板支持部531，是設有與構成上述複合玻璃板50之收容板52所設置之吸引孔521d連通的連通孔531a，且設有在上述收容板52的下面所設置之定位孔521e嵌合之定位梢釘531b。又，在複合玻璃板支持部531，設有圓弧狀之吸引固持溝531c，且設有與該圓弧狀的吸引固持溝531c連通之吸引固持孔531d。該吸引固持孔531d是設為透過後述之台基座6所設置之吸引固定孔，連通於圖未示之吸引元件。再者，在圖2中，圓弧狀的吸引固持溝531c及吸引固持孔531d各標示出1個，但在複合玻璃板支持部531上設有以上述連通孔531a與定位梢釘531b之連接線作為對稱線之一對的圓弧狀的吸引固持溝及吸引固持孔。 The annular support base 53 constituting the holding table 5 is provided with a composite glass plate supporting portion 531, and is formed by a stepped annular portion on the inner peripheral portion, and supports the outer peripheral portion of the composite glass plate; and the annular support portion 532. It is formed around the composite glass plate supporting portion 531. The composite glass plate supporting portion 531 is provided with a communication hole 531a that communicates with the suction hole 521d provided in the housing plate 52 constituting the composite glass plate 50, and is provided with a positioning hole 521e provided on the lower surface of the housing plate 52. The fitting positioning pin 531b. Further, the composite glass plate supporting portion 531 is provided with an arc-shaped suction holding groove 531c, and is provided with a suction holding hole 531d that communicates with the arc-shaped suction holding groove 531c. The suction holding hole 531d is a suction fixing hole provided through the base 6 to be described later, and is connected to a suction element (not shown). In FIG. 2, one of the arc-shaped suction holding groove 531c and the suction holding hole 531d is labeled. However, the composite glass plate supporting portion 531 is provided with the connection hole 531b and the positioning pin 531b. The line serves as an arc-shaped attraction holding groove and a suction holding hole which are one pair of the symmetry lines.
在圍繞構成固持台5之環狀支持台53之上述複合玻璃板支持部531所形成之環狀支持部532的內周部，設有在互為對向之位置上所設置之半圓弧狀的凹部532a、532a。該半圓弧狀的凹部532a、532a是以在取出嵌合於複合玻璃板支持部531之固持台5時可插入指頭的方式構成。又，在環狀支持部532的下面，如圖3所示，設有與後述之台基座6定位用的定位孔532b。進一步，在環狀支持部532，配設有用於吸引固持後述之環狀支架的4個吸附元件54。關於該吸附元件54，參照圖4來說明。圖4所示之吸附 元件54，如圖2所示，具備設於環狀支持部532之圓形凹部532c所配設的吸附墊541。該吸附墊541具備蛇腹狀的支持部541a，且以上端較環狀支持部532的上面微微突出的方式構成。如此所構成之吸附墊541連通於環狀支持部532所設置之吸附墊用連通孔532d。 The inner peripheral portion of the annular support portion 532 formed by the composite glass plate supporting portion 531 surrounding the annular support base 53 constituting the holding table 5 is provided with a semi-arc shape provided at positions opposite to each other. The recesses 532a, 532a. The semicircular arc-shaped recesses 532a and 532a are configured to be insertable into the finger when the holder 5 is fitted to the composite glass plate support portion 531. Further, on the lower surface of the annular support portion 532, as shown in FIG. 3, a positioning hole 532b for positioning the base base 6 to be described later is provided. Further, the annular support portion 532 is provided with four adsorption elements 54 for sucking and holding a ring-shaped holder to be described later. This adsorption element 54 will be described with reference to Fig. 4 . Figure 4 shows the adsorption As shown in FIG. 2, the element 54 includes a suction pad 541 disposed in a circular recess 532c provided in the annular support portion 532. The suction pad 541 has a bellows-shaped support portion 541a, and the upper end is configured to protrude slightly from the upper surface of the annular support portion 532. The adsorption pad 541 configured as described above is in communication with the adsorption pad communication hole 532d provided in the annular support portion 532.
構成固持台5之複合玻璃板50及環狀支持台53是如上述來構成，在環狀支持台53之複合玻璃板支持部531嵌合構成複合玻璃板50之收容板52。再者，環狀支持台53的複合玻璃板支持部531之階差是形成為較複合玻璃板50的厚度稍淺的尺寸，因此複合玻璃板50的上面(被加工物固持面)是被構成為較環狀支持部532微微突出。此結果，可將複合玻璃板50的上面(被加工物固持面)所載置之被加工物藉由複合玻璃板50的上面(被加工物固持面)來確實地支持。再者，構成固持台5之複合玻璃板50宜對應屬被加工物之晶圓的大小準備複數個，構成固持台5之環狀支持台53宜將環狀支持部532對應於複合玻璃板50的大小及後述之環狀支架的大小準備複數個。 The composite glass plate 50 and the annular support base 53 constituting the holding table 5 are configured as described above, and the accommodating plate 52 constituting the composite glass plate 50 is fitted to the composite glass plate supporting portion 531 of the annular support base 53. Further, since the step of the composite glass plate supporting portion 531 of the annular support base 53 is formed to be slightly shallower than the thickness of the composite glass plate 50, the upper surface of the composite glass plate 50 (the workpiece holding surface) is configured. It is slightly protruded from the annular support portion 532. As a result, the workpiece placed on the upper surface (the workpiece holding surface) of the composite glass sheet 50 can be reliably supported by the upper surface (the workpiece holding surface) of the composite glass sheet 50. Further, the composite glass plate 50 constituting the holding table 5 is preferably prepared in plural numbers corresponding to the size of the wafer to be processed, and the annular support table 53 constituting the holding table 5 preferably corresponds to the composite glass plate 50. A plurality of sizes are prepared and the size of the annular stent described later.
上述台基座6是由下述所構成：環狀固定部61，是用於固定構成固持台5之環狀支持台53的外周部；發光體收容部62，是於該環狀固定部61之內側設有階差而形成之凹狀的發光體收容部62；與發光體63，是配設於該發光體收容部62。在環狀固定部61，是設有與設於構成上述固持台5之環狀支持台53之連通孔531a連通之吸引力傳達孔611，及與上述吸附墊用連通孔532d連通之吸附墊用吸引 孔612。在環狀固定部61的上面，設有圓弧狀的吸引固持溝613、613，且設有與該圓弧狀的吸引固持溝613、613連通之吸引固定孔614、614。又，在環狀固定部61的上面，設有與構成上述固持台5之環狀支持台53定位用之定位梢釘615。該定位梢釘615是形成為如圖3所示與在環狀支持台53之環狀支持部532的下面所形成之定位孔532b嵌合的樣子。再者，上述吸引力傳達孔611與上述吸附墊用吸引孔612及吸引固定孔614、614，是被構成為連通於圖未示之吸引元件。 The base base 6 is configured such that an annular fixing portion 61 is an outer peripheral portion for fixing the annular support base 53 constituting the holding base 5, and an illuminant receiving portion 62 is formed in the annular fixing portion 61. The inner side of the inner side is provided with a concave illuminant accommodating portion 62 formed by a step, and the illuminator 63 is disposed in the illuminant accommodating portion 62. The ring-shaped fixing portion 61 is provided with an attraction force transmitting hole 611 that communicates with a communication hole 531a provided in the annular support base 53 that constitutes the holding table 5, and an adsorption pad that communicates with the adsorption pad communication hole 532d. attract Hole 612. On the upper surface of the annular fixing portion 61, arc-shaped suction holding grooves 613 and 613 are provided, and suction fixing holes 614 and 614 that communicate with the arc-shaped suction holding grooves 613 and 613 are provided. Further, on the upper surface of the annular fixing portion 61, positioning pin 615 for positioning the annular support base 53 constituting the holding table 5 is provided. The positioning spike 615 is formed to be fitted to the positioning hole 532b formed on the lower surface of the annular support portion 532 of the annular support base 53 as shown in FIG. Further, the suction force transmitting hole 611, the suction pad suction hole 612, and the suction fixing holes 614 and 614 are configured to communicate with a suction element (not shown).
形成於上述環狀固定部61之內側的凹狀的發光體收容部62所配設之發光體63，是由LED等所構成。為了防止因該發光體63發光而發出的熱所造成的影響，在上述台基座6設有用於冷卻發光體收容部62之冷卻元件65。冷卻元件65是在發光體收容部62的下側形成有冷卻室650，在形成該冷卻室650之底壁651設有冷卻風導口651a，且在外周壁652設有冷卻風排出口652a。 The illuminator 63 disposed in the concave illuminator accommodating portion 62 formed inside the annular fixing portion 61 is formed of an LED or the like. In order to prevent the influence of heat generated by the light emission of the illuminator 63, the stage base 6 is provided with a cooling element 65 for cooling the illuminant accommodating portion 62. The cooling element 65 has a cooling chamber 650 formed on the lower side of the illuminant accommodating portion 62, a cooling air guiding port 651a in the bottom wall 651 forming the cooling chamber 650, and a cooling air discharge port 652a in the outer peripheral wall 652.
台基座6是構成為如以上所述，在台基座6的上面載置構成固持台5之環狀支持台53，兩者藉由在台基座6之上面所設置之定位梢釘615嵌合形成於環狀支持台53之環狀支持部532的下面之定位孔532b來定位；構成吸盤工作台4。如此，藉由在台基座6配設構成固持台5之環狀支持台53，可使設於台基座6之上述吸引力傳達孔611與上述吸附墊用吸引孔612，分別連通於設置在構成固持台5之環狀支持台53的連通孔531a與吸附墊用連通孔532d。 The stage base 6 is configured such that the annular support base 53 constituting the holding base 5 is placed on the upper surface of the base base 6 as described above, and the positioning pins 615 are provided on the upper surface of the base base 6. The positioning hole 532b formed in the lower surface of the annular support portion 532 of the annular support base 53 is fitted and positioned; and the suction cup table 4 is formed. By arranging the annular support base 53 constituting the holding base 5 on the base base 6, the attraction transmission hole 611 provided in the base base 6 and the suction pad suction hole 612 can be connected to each other. The communication hole 531a constituting the annular support base 53 of the holding table 5 and the communication pad communication hole 532d.
如以上所述，若在台基座6配設了構成固持台5之環狀支持台53，則在操作圖未示之吸引元件時，因會透過設於台基座6之吸引固定孔614、614對圓弧狀的吸引固持溝613、613產生負壓作用，構成固持台5之環狀支持台53將可裝卸地被吸引固定。又，在操作圖未示之吸引元件時，因會透過吸引固定孔614、614及吸引固持孔531d，對構成固持台5之環狀支持台53的複合玻璃板支持部531所設置之圓弧狀的吸引固持溝531c產生負壓作用之故，複合玻璃板50將可裝卸地被吸引支持於複合玻璃板支持部531。進一步，在操作圖未示之吸引元件時，設置於台基座6之吸引力傳達孔611，將透過與設置於構成固持台5之環狀支持台53的連通孔531a及形成於構成複合玻璃板50之收容板52的收容凹部521之底面521a的連通溝521c，對形成為同心圓狀之複數的圓形吸引溝521b產生負壓作用。此結果，使負壓從嵌合於收容板52之收容凹部521的多孔質板51的下面對上面產生作用，而可將載置於複合玻璃板50之上面(被加工物固持面)的被加工物吸引固持。又，在操作圖未示之吸引元件時，會使負壓透過台基座6所設置之吸附墊用吸引孔612及構成固持台5之環狀支持台53所設置之吸附墊用連通孔532d，作用於吸附墊541，而可吸引固持載置於環狀支持台53之環狀支持部532，並透過切割膠帶來支持後述被加工物之晶圓的環狀支架。 As described above, when the ring-shaped support base 53 constituting the holding base 5 is disposed on the base base 6, when the attraction member (not shown) is operated, the suction fixing hole 614 provided in the base base 6 is transmitted. 614 exerts a negative pressure on the arc-shaped suction holding grooves 613 and 613, and the annular support base 53 constituting the holding table 5 is detachably attracted and fixed. Further, when the attraction member (not shown) is operated, the arc of the composite glass plate supporting portion 531 constituting the annular support base 53 of the holding table 5 is transmitted through the suction fixing holes 614 and 614 and the suction holding hole 531d. The suction holding groove 531c of the shape generates a negative pressure, and the composite glass plate 50 is detachably attracted to the composite glass plate supporting portion 531. Further, when an attraction member (not shown) is operated, the attraction transmission hole 611 provided in the stage base 6 is transmitted through the communication hole 531a provided in the annular support base 53 constituting the holding base 5, and is formed in the composite glass. The communication groove 521c of the bottom surface 521a of the housing recess 521 of the housing plate 52 of the plate 50 generates a negative pressure action on a plurality of circular suction grooves 521b formed in a concentric shape. As a result, the negative pressure acts on the upper surface of the porous plate 51 fitted to the housing recess 521 of the housing plate 52, and can be placed on the upper surface of the composite glass plate 50 (the workpiece holding surface). The workpiece is attracted and held. Further, when the suction member (not shown) is operated, the suction hole for the negative pressure is transmitted through the suction hole 612 and the communication hole 532d for the adsorption pad provided in the annular support base 53 constituting the holding table 5. The adsorption pad 541 is applied to the annular support portion 532 which is placed on the annular support base 53 and is supported by the dicing tape to support the wafer holder of the wafer to be described later.
在如上述所構成之吸盤工作台4，當將形成於台基座6之環狀固定部61內側之凹狀的發光體收容部62所配 設的發光體63點亮時，從發光體63所發出的光是通過由構成複合玻璃板50之玻璃材所形成之收容板52及由多孔質玻璃所形成之多孔質板51，照射於複合玻璃板50的上面(被加工物固持面)所載置之被加工物。 The chuck table 4 configured as described above is provided with a concave illuminator accommodating portion 62 formed inside the annular fixing portion 61 of the pedestal base 6 When the illuminator 63 is turned on, the light emitted from the illuminator 63 is irradiated to the composite by the accommodating plate 52 formed of the glass material constituting the composite glass plate 50 and the porous plate 51 formed of the porous glass. The workpiece is placed on the upper surface of the glass sheet 50 (the workpiece holding surface).
若回到圖1繼續進行說明，上述第1滑動塊32在其下面設有與上述一對的引導軌31、31嵌合之一對的被引導溝321、321，且在其上面設有沿箭頭Y所示索引輸送方向平行地形成之一對的引導軌322、322。如此所構成之第1滑動塊32是藉由被引導溝321、321嵌合於一對的引導軌31、31，而以可沿一對的引導軌31、31在箭頭X所示加工輸送方向上移動的方式構成。在圖示的實施形態之吸盤工作台機構3，具備加工輸送元件37，是用於使第1滑動塊32沿一對的引導軌31、31在箭頭X所示加工輸送方向上移動。加工輸送元件37含有：雄螺桿371，是被平行地設置於上述一對的引導軌31與31之間；與用於將該雄螺桿371旋轉驅動的脈動馬達372等的驅動源。雄螺桿371其一端受到被固定於上述靜止基座2之軸承塊373以可旋轉的方式支持，其另一端傳動連結於上述脈動馬達372的輸出軸。再者，雄螺桿371螺合於在第1滑動塊32之中央部的下面突出設置之圖未示的雌螺塊所形成之貫通雌螺孔。因此，利用脈動馬達372將雄螺桿371正轉及逆轉驅動，藉此可使第一滑動塊32沿引導軌31、31在箭頭X所示之加工輸送方向上移動。 1 and continuing to explain, the first slider 32 is provided with a pair of guided grooves 321 and 321 which are fitted to the pair of guide rails 31 and 31 on the lower surface thereof, and are provided along the upper surface thereof. The index transport directions indicated by the arrow Y form a pair of guide rails 322, 322 in parallel. The first slider 32 configured as described above is fitted to the pair of guide rails 31 and 31 by the guide grooves 321 and 321, so that the conveyance direction can be processed along the pair of guide rails 31 and 31 as indicated by the arrow X. The way of moving up. The chuck table mechanism 3 of the illustrated embodiment is provided with a processing conveyance unit 37 for moving the first slider 32 along the pair of guide rails 31 and 31 in the processing conveyance direction indicated by the arrow X. The processing conveyance member 37 includes a male screw 371 which is disposed in parallel between the pair of guide rails 31 and 31, and a drive source for a pulsating motor 372 or the like for rotationally driving the male screw 371. The male screw 371 is rotatably supported at one end by a bearing block 373 fixed to the stationary base 2, and the other end thereof is coupled to an output shaft of the pulsating motor 372. Further, the male screw 371 is screwed to a female screw hole formed by a female screw (not shown) which is protruded from the lower surface of the central portion of the first slider 32. Therefore, the male screw 371 is rotated forward and reversely by the pulsating motor 372, whereby the first slider 32 can be moved along the guide rails 31, 31 in the processing conveyance direction indicated by the arrow X.
圖示之實施形態的雷射加工裝置具備加工輸送 位置偵測元件374，是用於偵測上述吸盤工作台4之加工輸送量。加工輸送位置偵測元件374是由下述構成：沿引導軌31所配設之線性標度尺374a；與配設於第1滑動塊32且與第1滑動塊32一起沿線性標度尺374a移動之讀取頭374b。該加工輸送位置偵測元件374的讀取頭374b在圖示實施形態中將每1μm 1脈波的脈波信號送往後述之控制元件。接著後述的控制元件藉由計數輸入的脈波信號，來偵測吸盤工作台4的加工輸送位置。再者，使用脈動馬達372作為上述加工輸送元件37的驅動源時，藉由計數輸出驅動信號至脈動馬達372之後述控制元件的驅動脈波，亦可偵測吸盤工作台4的加工輸送位置。又，使用伺服馬達作為上述加工輸送元件37之驅動源時，將偵測伺服馬達之旋轉數的旋轉編碼器輸出的脈波信號傳送給後述的控制元件，藉由計數控制元件所輸入之脈波信號，亦可偵測吸盤工作台4的加工輸送位置。 The laser processing apparatus of the embodiment shown in the drawings has processing and conveying The position detecting element 374 is for detecting the processing conveyance amount of the suction cup table 4. The processing conveyance position detecting element 374 is configured by a linear scale 374a disposed along the guide rail 31; and is disposed on the first slider 32 and along with the first slider 32 along the linear scale 374a The read head 374b is moved. In the illustrated embodiment, the pickup head 374b of the processing conveyance position detecting element 374 sends a pulse wave signal per 1 μm pulse wave to a control element to be described later. Next, the control element described later detects the processing conveyance position of the chuck table 4 by counting the input pulse wave signal. Further, when the pulsating motor 372 is used as the drive source of the machining conveyance element 37, the machining conveyance position of the suction chuck table 4 can be detected by counting the output drive signal to the pulsation motor 372 and the drive pulse of the control element. Further, when a servo motor is used as the drive source of the machining conveyance element 37, a pulse wave signal output from a rotary encoder that detects the number of rotations of the servo motor is transmitted to a control element to be described later, and the pulse wave input by the control element is counted. The signal can also detect the processing and conveying position of the suction cup table 4.
上述第2滑動塊33，在其下面設有與設於上述第1滑動塊32之上面的一對的引導軌322、322嵌合之一對的被引導溝331、331，藉由將該被引導溝331、331嵌合於一對的引導軌322、322，構成為可在以箭頭Y所示之索引輸送方向上移動的樣子。圖示之實施形態之吸盤工作台機構3具備第1索引輸送元件38，是用於使第2滑動塊33沿設於第1滑動塊32之一對的引導軌322、322在箭頭Y所示之索引輸送方向移動。第1索引輸送元件38包含雄螺桿381，是平行地配設於上述一對的引導軌322與322之間；與驅動源， 是用於將該雄螺桿381旋轉驅動之脈動馬達382等的驅動源。雄螺桿381，其一端以可旋轉的方式受到固定於上述第1滑動塊32之上面的軸承塊383所支持，其另一端傳動連結於上述脈動馬達382的輸出軸。再者，雄螺桿381螺合於第2滑動塊33之中央部下面突出設置之圖未示之的螺塊所形成之貫通雌螺孔。因此，藉由利用脈動馬達382將雄螺桿381正轉及逆轉驅動，可使第2滑動塊33沿引導軌322、322在箭頭Y所示索引輸送方向上移動。 The second sliding block 33 is provided on the lower surface thereof with a pair of guided grooves 331 and 331 which are fitted to a pair of guide rails 322 and 322 provided on the upper surface of the first sliding block 32. The guide grooves 331, 331 are fitted to the pair of guide rails 322 and 322, and are configured to be movable in the index transport direction indicated by the arrow Y. The chuck table mechanism 3 of the embodiment shown in the drawings includes a first index conveying member 38, and the guide rails 322 and 322 for arranging the second slider 33 along one of the first sliders 32 are indicated by an arrow Y. The index transport direction moves. The first index conveying member 38 includes a male screw 381 which is disposed in parallel between the pair of guide rails 322 and 322; and a driving source, It is a drive source of the pulsation motor 382 or the like for rotationally driving the male screw 381. The male screw 381 is rotatably supported by a bearing block 383 fixed to the upper surface of the first slider 32, and the other end of the male screw 381 is coupled to an output shaft of the pulsating motor 382. Further, the male screw 381 is screwed to the through female screw hole formed by the screw block (not shown) which is protruded from the lower surface of the central portion of the second sliding block 33. Therefore, by rotating the male screw 381 forward and reverse by the pulsation motor 382, the second slider 33 can be moved along the guide rails 322 and 322 in the index conveying direction indicated by the arrow Y.
圖示之實施形態中的雷射加工裝置，具備索引輸送位置偵測元件384，是用於偵測上述第2滑動塊33之索引加工輸送量。索引輸送位置偵測元件384是由下述構成：沿引導軌322所設置之線性標度尺384a，與讀取頭384b，是配設於第2滑動塊33，且與第2滑動塊33一起沿線性標度尺384a移動。該索引輸送位置偵測元件384的讀取頭384b，在圖示中實施形態中將每1μm 1脈波的脈波信號傳送至後述的控制元件。接著，後述之控制元件是藉由計數已輸入之脈波信號，來偵測吸盤工作台4的索引輸送位置。再者，在使用脈動馬達382作為上述第1索引輸送元件38的驅動源時，藉由計數對脈動馬達382輸出驅動信號之後述控制元件的驅動脈波，亦可偵測吸盤工作台4的索引輸送位置。又，在使用伺服馬達作為上述加工輸送元件37的驅動源時，將偵測伺服馬達之旋轉數的旋轉編碼器所輸出之脈波信號傳送至後述的控制元件，藉由計數已輸入至控制元件之脈波信號，亦可偵測吸盤工作台4的索引輸送 位置。 The laser processing apparatus according to the illustrated embodiment includes an index transport position detecting element 384 for detecting the index processing transport amount of the second slider 33. The index conveyance position detecting element 384 is configured by a linear scale 384a provided along the guide rail 322, and the read head 384b is disposed on the second slide block 33 together with the second slide block 33. Move along the linear scale 384a. The read head 384b of the index conveyance position detecting element 384 transmits a pulse wave signal per 1 μm pulse wave to a control element to be described later in the embodiment of the drawing. Next, the control element described later detects the index transfer position of the chuck table 4 by counting the pulse signal that has been input. Further, when the pulsation motor 382 is used as the drive source of the first index transfer element 38, the index of the chuck table 4 can be detected by counting the drive pulse of the control element after the drive signal is output to the pulsation motor 382. Delivery position. Further, when a servo motor is used as the drive source of the machining conveyance element 37, the pulse wave signal output from the rotary encoder that detects the number of rotations of the servo motor is transmitted to a control element to be described later, and the count is input to the control element. The pulse wave signal can also detect the index conveying of the suction cup table 4 position.
上述雷射光線照射單元支持機構7具備一對的引導軌71、71，是在靜止基座2上沿箭頭Y所示索引輸送方向平行地配設；與可動支持基座72，是以可在該引導軌71、71上沿箭頭Y所示方向移動的方式被配設。該可動支持基座72是由下述構成：移動支持部721，是以可在引導軌71、71上移動的方式被配設；配設部722，是安裝於該移動支持部721。配設部722是在一側面上平行地設置有沿箭頭Z所示方向延伸之一對的引導軌723、723。圖示之實施形態之雷射光線照射單元支持機構7具備第2索引輸送元件73，是用於使可動支持基座72沿一對的引導軌71、71在箭頭Y所示索引輸送方向上移動。第2索引輸送元件73含有雄螺桿731，是平行配設於上述一對的引導軌71、71之間；與驅動源，是用於將該雄螺桿731旋轉驅動之脈動馬達732等的驅動源。雄螺桿731是其一端以可旋轉的方式被支持於經固定在上述靜止基座2之圖未示的軸承塊，其另一端傳動連結於上述脈動馬達732之輸出軸。再者，雄螺桿731螺合於構成可動支持基座72之移動支持部721之中央部下面突出設置之圖未示的雌螺塊所形成之雌螺孔。為此，藉由利用脈動馬達732將雄螺桿731正轉及逆轉驅動，可使可動支持基座72沿引導軌71、71在箭頭Y所示索引輸送方向上移動。 The laser beam irradiation unit support mechanism 7 includes a pair of guide rails 71 and 71 which are disposed in parallel with the index transport direction indicated by an arrow Y on the stationary base 2, and the movable support base 72 is The guide rails 71, 71 are arranged to move in the direction indicated by the arrow Y. The movable support base 72 is configured such that the movement support portion 721 is disposed so as to be movable on the guide rails 71 and 71, and the arrangement portion 722 is attached to the movement support portion 721. The arranging portion 722 is provided with guide rails 723 and 723 extending in parallel in the direction indicated by the arrow Z on one side surface. The laser beam irradiation unit support mechanism 7 of the illustrated embodiment includes a second index transporting element 73 for moving the movable support base 72 along the pair of guide rails 71 and 71 in the index transport direction indicated by the arrow Y. . The second index transporting element 73 includes a male screw 731 which is disposed in parallel between the pair of guide rails 71 and 71, and a driving source which is a driving source of the pulsating motor 732 or the like for rotationally driving the male screw 731. . The male screw 731 is rotatably supported at one end by a bearing block (not shown) fixed to the stationary base 2, and the other end of the male screw 731 is coupled to the output shaft of the pulsating motor 732. Further, the male screw 731 is screwed into a female screw hole formed by a female screw (not shown) which is formed to protrude from the lower surface of the central portion of the movable support portion 721 of the movable support base 72. For this reason, by rotating the male screw 731 forward and reverse by the pulsation motor 732, the movable support base 72 can be moved along the guide rails 71, 71 in the index conveying direction indicated by the arrow Y.
圖示之實施形態中的雷射光線照射單元8具備單元支持器81，與安裝於該單元支持器81之雷射光線照射元 件82。單元支持器81設有一對的被引導溝811、811，是以可滑動的方式嵌合於上述配設部722之一對的引導軌723、723；藉由將該被引導溝811、811嵌合於上述引導軌723、723，而以可在箭頭Z所示方向上移動的方式受到支持。 The laser beam irradiation unit 8 in the illustrated embodiment includes a unit holder 81 and a laser beam illuminating element attached to the unit holder 81. Item 82. The unit holder 81 is provided with a pair of guided grooves 811 and 811 which are slidably fitted to one of the pair of guide rails 723 and 723; by embedding the guided grooves 811 and 811 The guide rails 723, 723 are combined to be supported in such a manner as to be movable in the direction indicated by the arrow Z.
圖示之實施形態之雷射光線照射單元8具備移動元件83，是用於使單元支持器81沿一對的引導軌723、723，在箭頭Z所示方向(Z軸方向)上移動。移動元件83含有雄螺桿(圖未示)，是配設於一對的引導軌723、723之間；與驅動源，是用於將該雄螺桿旋轉驅動之脈動馬達832等的驅動源；藉由利用脈動馬達832將圖未示之雄螺桿正轉及逆轉驅動，使單元支持器81及雷射光線照射元件82沿引導軌723、723在箭頭Z所示方向(Z軸方向)上移動。再者，圖示之實施形態中，是藉由將脈動馬達832正轉驅動來將雷射光線照射元件82往上方移動，或藉由將脈動馬達832逆轉驅動來將雷射光線照射元件82往下方移動。 The laser beam irradiation unit 8 of the embodiment shown in the figure includes a moving element 83 for moving the unit holder 81 along a pair of guide rails 723 and 723 in the direction indicated by the arrow Z (Z-axis direction). The moving member 83 includes a male screw (not shown) disposed between the pair of guide rails 723 and 723, and a driving source is a driving source for the pulsating motor 832 or the like for rotationally driving the male screw; When the male screw (not shown) is rotated forward and reverse by the pulsation motor 832, the unit holder 81 and the laser beam illuminating element 82 are moved along the guide rails 723 and 723 in the direction indicated by the arrow Z (Z-axis direction). Furthermore, in the illustrated embodiment, the laser beam illuminating element 82 is moved upward by driving the pulsating motor 832 forward, or the laser ray illuminating element 82 is driven by reversing the pulsating motor 832. Move below.
圖示之雷射光線照射元件82包含實質上水平地配置之圓筒形狀的殼套821。在殼套821內配設有具備圖未示之脈波雷射光線振盪器或脈波重複頻率設定元件之脈波雷射光線振盪元件。在上述殼套821的前端部，配設有用於收集自脈波雷射光線振盪元件所發振之脈波雷射光線的集光器822。 The illustrated laser beam illumination element 82 includes a cylindrical casing 821 that is disposed substantially horizontally. A pulse wave laser ray oscillating element having a pulse wave laser ray oscillator or a pulse wave repetition frequency setting element, not shown, is disposed in the casing 821. A concentrator 822 for collecting pulsed laser light emitted from the pulse laser ray oscillating element is disposed at a front end portion of the casing 821.
回到圖1繼續進行說明，在構成上述雷射光線照射元件82之殼套821的前端部，配設有攝像元件80，將要利用雷射光線照射元件82來進行雷射加工的加工區域及經 雷射加工的區域攝像。該攝像元件80是由攝像素子(CCD)等所構成，並將所攝得之像之影像信號傳送至控制元件9。 Referring back to Fig. 1, the image pickup device 80 is disposed at the front end portion of the casing 821 constituting the above-described laser beam illuminating member 82, and the processing region and the laser processing region to be subjected to laser processing using the laser beam illuminating device 82 are described. Laser imaging of the area. The imaging element 80 is constituted by a camera element (CCD) or the like, and transmits an image signal of the captured image to the control element 9.
控制元件9是由電腦所構成，其具備：中央處理裝置(CPU)91，是依照控制程式進行演算處理；唯讀記憶體(ROM)92，是儲存控制程式等；隨機存取記憶體(RAM)93，是儲存並可讀寫9演算結果等；計數器94；與輸入介面95及輸出介面96。在控制元件9的輸入介面95，會自上述加工輸送位置偵測元件374、索引輸送位置偵測元件384及攝像元件80等輸入偵測信號。接著，從控制元件9的輸出介面96，將對上述脈動馬達372、脈動馬達382、脈動馬達732、脈動馬達832、雷射光線照射元件82及顯示元件90等輸出控制信號。 The control element 9 is composed of a computer, and includes a central processing unit (CPU) 91 that performs arithmetic processing in accordance with a control program, a read only memory (ROM) 92, a storage control program, and the like; and a random access memory (RAM). 93 is a storage and readable and writable 9 calculation result, etc.; counter 94; and input interface 95 and output interface 96. In the input interface 95 of the control element 9, a detection signal is input from the processing conveyance position detecting element 374, the index conveyance position detecting element 384, and the image pickup element 80. Next, a control signal is outputted from the output interface 96 of the control element 9 to the pulsation motor 372, the pulsation motor 382, the pulsation motor 732, the pulsation motor 832, the laser beam illuminating element 82, the display element 90, and the like.
裝備依照本發明所構成之吸盤工作台4，雷射加工裝置是如上所述地被構成，以下針對其作用進行說明。 The suction pad table 4 constructed in accordance with the present invention is equipped with the laser processing apparatus as described above, and the operation thereof will be described below.
在圖5中，表示有利用上述雷射加工裝置來加工之作為被加工物的半導體晶圓。圖5所示之半導體晶圓10，是由例如厚度為50μm之矽晶圓所構成，在其表面10a有複數之設備101形成為矩陣狀。如此所構成之半導體晶圓10是沿將設備101劃分而形成為格子狀之切割道，藉分割溝102分割為各個設備101。接著，在半導體晶圓10的背面配設有晶粒結著用之接著薄膜11，該接著薄膜11側是貼著於配設在環狀支架12之切割膠帶13的表面。再者，接著薄膜11是由以環氧系樹脂所形成之半透明的薄膜材構成。 又，切割膠帶13是由聚氯乙烯(PVC)等的半透明樹脂薄片所構成。 Fig. 5 shows a semiconductor wafer as a workpiece processed by the above laser processing apparatus. The semiconductor wafer 10 shown in FIG. 5 is composed of, for example, a silicon wafer having a thickness of 50 μm, and a plurality of devices 101 having a plurality of surfaces 10a are formed in a matrix. The semiconductor wafer 10 thus constituted is a dicing street formed in a lattice shape along the device 101, and is divided into individual devices 101 by the dividing grooves 102. Next, a film 11 for film formation is disposed on the back surface of the semiconductor wafer 10, and the film 11 side is adhered to the surface of the dicing tape 13 disposed on the annular holder 12. Further, the film 11 is formed of a translucent film material formed of an epoxy resin. Further, the dicing tape 13 is made of a translucent resin sheet such as polyvinyl chloride (PVC).
接著，使用上述雷射加工裝置來實施接著薄膜切斷步驟，通過半導體晶圓10之設備間的分割溝102，對接著薄膜11照射雷射光線，並將接著薄膜11沿分割溝102切斷之步驟。 Next, the film-cutting step is performed by using the above-described laser processing apparatus, and the film 11 is irradiated with the laser beam by the dividing groove 102 between the devices of the semiconductor wafer 10, and the film 11 is cut along the dividing groove 102. step.
要使用上述雷射加工裝置來實施接著薄膜切斷步驟時，是將透過切割膠帶13來支持半導體晶圓10(沿切割道形成有分割溝102)的環狀支架12，載置於構成上述吸盤工作台4之固持台5的環狀支持台53之環狀支持部532所配設之吸附墊541上，且將切割膠帶13之半導體晶圓10的貼著區域載置於固持台5的複合玻璃板50的上面(被加工物固持面)。接著，藉由操作圖未示之吸引元件，如上所述地利用吸附墊541來吸引固持環狀支架12，並在複合玻璃板50之上透過切割膠帶13及接著薄膜11來吸引固持半導體晶圓10(晶圓吸引固持步驟)。 When the film-cutting step is carried out using the above-described laser processing apparatus, the annular wafer 12 supporting the semiconductor wafer 10 (the dividing groove 102 is formed along the dicing street) through the dicing tape 13 is placed on the suction cup. The adsorption pad 541 disposed on the annular support portion 532 of the annular support base 53 of the holding table 5 of the table 4, and the adhesive region of the semiconductor wafer 10 of the dicing tape 13 is placed on the composite table 5 The upper surface of the glass plate 50 (the workpiece holding surface). Next, by operating the suction element not shown, the adsorption pad 541 is used to attract and hold the annular support 12 as described above, and the dicing tape 13 and the adhesive film 11 are used to attract and hold the semiconductor wafer on the composite glass plate 50. 10 (wafer attraction holding step).
接下來，實行對齊校正步驟，是偵測被分割為各個設備101之半導體晶圓10之背面10b所配設之接著薄膜11之要進行雷射加工的加工區域。亦即，控制元件9是操作加工輸送元件37來使吸盤工作台4位於攝像元件80之正下方的位置。當吸盤工作台4就定位於攝像元件80之正下方的位置，將點亮構成吸盤工作台4之發光體63。此結果，如上所述，從發光體63所發出的光將通過由構成複合玻璃板50之玻璃材所形成之收容板52及由多孔質玻璃所形 成之多孔質板51，照射在載置於複合玻璃板50之上面(被加工物固持面)的半導體晶圓10。照射於半導體晶圓10的光，因透過分割溝102，故可利用攝像元件80來確實地進行偵測。如此，藉由偵測形成於半導體晶圓10之預定方向上的分割溝102，來實行集光器822與要進行雷射加工之加工區域的對齊校正步驟。又，對在半導體晶圓10上所形成之沿與上述預定方向正交的方向延伸之分割溝102，同樣地來實行偵測要進行雷射加工之加工區域的對齊校正步驟。 Next, an alignment correction step is performed to detect a processing region to be subjected to laser processing of the adhesive film 11 disposed on the back surface 10b of the semiconductor wafer 10 divided into the respective devices 101. That is, the control element 9 is a processing conveyance element 37 to position the suction cup table 4 directly below the image pickup element 80. When the chuck table 4 is positioned directly below the image pickup element 80, the illuminator 63 constituting the chuck table 4 is lit. As a result, as described above, the light emitted from the illuminator 63 will pass through the accommodating plate 52 formed of the glass material constituting the composite glass plate 50 and be formed of porous glass. The porous plate 51 is irradiated onto the semiconductor wafer 10 placed on the upper surface of the composite glass plate 50 (the workpiece holding surface). Since the light that has been applied to the semiconductor wafer 10 passes through the dividing groove 102, the image sensor 80 can be used for accurate detection. Thus, the alignment correcting step of the concentrator 822 and the processing region to be subjected to laser processing is performed by detecting the dividing groove 102 formed in the predetermined direction of the semiconductor wafer 10. Further, in the same manner as the dividing groove 102 formed on the semiconductor wafer 10 extending in the direction orthogonal to the predetermined direction, the alignment correcting step of detecting the processing region to be subjected to the laser processing is performed.
如上所述，當實施了對校正步驟，偵測半導體晶圓10的背面10b所配設之接著薄膜11之要進行雷射加工的加工區域，上述控制元件9將要進行雷射加工的加工區域之X,Y座標值儲存於隨機存取記憶體(RAM)93。再者，要進行雷射加工之加工區域的X,Y座標值可根據來自上述加工輸送位置偵測元件374及索引輸送位置偵測元件384之偵測信號來求得。 As described above, when the correcting step is performed, the processing area of the film 11 to be subjected to laser processing disposed on the back surface 10b of the semiconductor wafer 10 is detected, and the control element 9 is to be subjected to laser processing. The X, Y coordinate values are stored in random access memory (RAM) 93. Furthermore, the X, Y coordinate values of the processing area to be subjected to the laser processing can be obtained based on the detection signals from the processing conveyance position detecting element 374 and the index conveyance position detecting element 384.
接下來，將吸盤工作台4移動到集光器822所定位之雷射光線照射區域，使沿預定的切割道所形成之分割溝102位於集光器822的正下方之位置。此時，半導體晶圓10是以令分割溝102之一端(圖6(a)之左端)位於集光器822之正下方的位置之方式來定位。接下來，控制元件9一邊對脈波雷射光線照射元件82輸出控制信號，並從集光器822對接著薄膜照射具有吸收性之波長的脈波雷射光線，一邊以使吸盤工作台4往圖6(a)中箭頭X1所示方向以預定 的加工輸送速度移動的方式來控制加工輸送元件37。接著，當分割溝102之另一端如圖6(b)所示到達集光器822之正下方位置時，停止脈波雷射光線的照射並停止吸盤工作台4之移動。此結果，脈波雷射光線通過沿預定的切割道所形成之分割溝102照射於接著薄膜11，在接著薄膜11上如圖6(c)所示沿設備101間形成有切斷溝110(接著薄膜切斷步驟)。在該接著薄膜切斷步驟中，由於在上述之對齊校正步驟中分割溝102被確實地辨識，且要進行雷射加工之區域被明確地偵測，故能沿設備101之外周緣確實地切斷接著薄膜11。 Next, the chuck table 4 is moved to the laser beam irradiation area where the concentrator 822 is positioned, so that the dividing groove 102 formed along the predetermined scribe line is located directly below the concentrator 822. At this time, the semiconductor wafer 10 is positioned such that one end of the dividing groove 102 (the left end of FIG. 6(a)) is located directly below the concentrator 822. Next, the control element 9 outputs a control signal to the pulsed laser beam illuminating element 82, and irradiates the film with the absorbing wavelength of the laser beam from the concentrator 822, so that the chuck table 4 is moved toward The direction indicated by the arrow X1 in Fig. 6(a) is predetermined The machining conveyance element 37 is controlled in such a manner that the machining conveyance speed is moved. Next, when the other end of the dividing groove 102 reaches the position directly below the concentrator 822 as shown in Fig. 6(b), the irradiation of the pulsed laser light is stopped and the movement of the chuck table 4 is stopped. As a result, the pulsed laser light is irradiated onto the adhesive film 11 through the dividing groove 102 formed along the predetermined scribe line, and the cutting groove 110 is formed along the film 101 as shown in Fig. 6(c). The film is then cut off). In the subsequent film cutting step, since the dividing groove 102 is surely recognized in the alignment correction step described above, and the region to be subjected to the laser processing is clearly detected, it can be surely cut along the outer periphery of the device 101. The film 11 is broken.
上述接著薄膜切斷步驟之加工條件是例如以下所述地來進行設定。 The processing conditions of the subsequent film cutting step are set as described below, for example.
光源：LD激發Q開關Nd：YVO4脈波雷射 Light source: LD excitation Q switch Nd: YVO4 pulse laser
波長：355nm的脈波雷射 Wavelength: 355nm pulse laser
脈波重複頻率：50kHz Pulse wave repetition frequency: 50kHz
平均輸出：1W Average output: 1W
集光點徑：φ5μm Spot spot diameter: φ5μm
加工輸送速度：100mm/秒 Processing conveying speed: 100mm / sec
若如上所述實施了將脈波雷射光線通過沿預定的切割道所形成之分割溝102照射於接著薄膜11，在接著薄膜11沿設備101間形成切斷溝110之接著薄膜切斷步驟，控制元件9是操作第1索引輸送元件38，僅將吸盤工作台4索引輸送分割溝102之間隔，來實施上述接著薄膜切斷步 驟。若實施了通過依此在預定方向上所形成之分割溝102對接著薄膜11照射脈波雷射光線之接著薄膜切斷步驟後，使吸盤工作台4旋動90度，通過與上述預定方向正交之方向上所形成之分割溝102，實施對接著薄膜11照射脈波雷射光線之接著薄膜切斷步驟。此結果，在接著薄膜11上，沿所有設備101之間形成有切斷溝110。 If the pulsed laser beam is irradiated onto the adhesive film 11 through the dividing groove 102 formed along the predetermined scribe line as described above, the film cutting step of forming the cutting groove 110 between the devices 101 is performed next to the film 11, The control element 9 operates the first index transporting element 38, and performs the above-described film cutting step by merely indexing the gap between the chucking table 4 and the dividing groove 102. Step. If the film-cutting step of irradiating the film 11 with the pulsed laser light by the dividing groove 102 formed in the predetermined direction is performed, the chuck table 4 is rotated by 90 degrees to pass the predetermined direction. The dividing groove 102 formed in the direction of intersection is subjected to a subsequent film cutting step of irradiating the film 11 with pulsed laser light. As a result, on the subsequent film 11, a cutting groove 110 is formed along all the devices 101.
以上，基於圖示之實施形態說明了本發明，但本發明並非僅受實施形態所限定，而是在本發明之旨趣的範圍內可有各種的變化。例如，在上述之實施形態中雖表示有將構成固持台5之環狀支持台53吸引固定於台基座6的例子，但亦可將環狀支持台53藉由緊固螺栓緊固於台基座6。 The present invention has been described above based on the embodiments shown in the drawings, but the present invention is not limited to the embodiments, and various modifications are possible within the scope of the invention. For example, in the above-described embodiment, the example in which the annular support base 53 constituting the holding base 5 is suction-fixed to the base base 6 is shown. However, the annular support base 53 may be fastened to the base by a fastening bolt. Base 6.
又，在上述之實施形態中，雖例示有台基座6的發光體收容部62構成為較構成固持台之複合玻璃板50大之例子，但這是由於對應作為被加工物之晶圓的尺寸之故。亦即，由於具備對應於晶圓尺寸之具有複合玻璃板50的固持台5是可被選擇的，故台基座6之發光體收容部62是被設定為可對應固持台5之尺寸，該固持台5是具備對應於晶圓之最大徑的複合玻璃板50。 Further, in the above-described embodiment, the illuminant accommodating portion 62 of the pedestal 6 is exemplified as being larger than the composite glass plate 50 constituting the holding table, but this corresponds to the wafer as the workpiece. The reason for the size. That is, since the holding table 5 having the composite glass plate 50 corresponding to the wafer size is selectable, the illuminant receiving portion 62 of the stage base 6 is set to correspond to the size of the holding table 5, which The holding stage 5 is a composite glass plate 50 having a maximum diameter corresponding to the wafer.
53‧‧‧環狀支持台 53‧‧‧Ring support desk
532‧‧‧環狀支持部 532‧‧‧Ring Support
532c‧‧‧圓形凹部 532c‧‧‧Circular recess
532d‧‧‧吸附墊用連通孔 532d‧‧‧Connecting hole for adsorption pad
54‧‧‧吸附元件 54‧‧‧Adsorption elements
541‧‧‧吸附墊 541‧‧‧Adsorption pad
541a‧‧‧支持部 541a‧‧‧Support Department
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| JP2013019400A JP6138503B2 (en) | 2013-02-04 | 2013-02-04 | Chuck table |
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| TWI559433B (en) * | 2015-01-09 | 2016-11-21 | 旭東機械工業股份有限公司 | Desiccant adhering apparatus |
| EP3478869A1 (en) * | 2016-07-01 | 2019-05-08 | Applied Materials, Inc. | Processing system and method for processing a flexible substrate |
| JP2018126830A (en) * | 2017-02-09 | 2018-08-16 | 株式会社ディスコ | Processing system |
| JP6994852B2 (en) * | 2017-06-30 | 2022-01-14 | 株式会社ディスコ | Laser processing equipment and laser processing method |
| KR102089584B1 (en) * | 2018-02-06 | 2020-03-17 | 주식회사 비에스피 | Laser welding apparatus for glass substrate |
| CN109822476B (en) * | 2019-02-12 | 2020-09-01 | 永康市杰地希机器人科技有限公司 | Clamping mechanism for processing and assembling door frame of anti-theft door and clamping method thereof |
| JP7465670B2 (en) | 2020-02-18 | 2024-04-11 | 株式会社ディスコ | Holding table mechanism and processing device |
| JP2022095412A (en) * | 2020-12-16 | 2022-06-28 | 株式会社ディスコ | Manufacturing method for holding table |
| US11955363B2 (en) * | 2021-05-12 | 2024-04-09 | Rockley Photonics Limited | Bonding fixture |
| WO2023162616A1 (en) * | 2022-02-24 | 2023-08-31 | 三菱電機株式会社 | Optical component and laser machining apparatus |
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| JP2014150219A (en) | 2014-08-21 |
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