SG10202006249TA - Tape mounter - Google Patents

Tape mounter

Info

Publication number
SG10202006249TA
SG10202006249TA SG10202006249TA SG10202006249TA SG10202006249TA SG 10202006249T A SG10202006249T A SG 10202006249TA SG 10202006249T A SG10202006249T A SG 10202006249TA SG 10202006249T A SG10202006249T A SG 10202006249TA SG 10202006249T A SG10202006249T A SG 10202006249TA
Authority
SG
Singapore
Prior art keywords
tape mounter
mounter
tape
Prior art date
Application number
SG10202006249TA
Inventor
Wada Masahiro
Watanabe Naohisa
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10202006249TA publication Critical patent/SG10202006249TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
SG10202006249TA 2019-07-22 2020-06-29 Tape mounter SG10202006249TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019134431A JP7368131B2 (en) 2019-07-22 2019-07-22 tape mounter

Publications (1)

Publication Number Publication Date
SG10202006249TA true SG10202006249TA (en) 2021-02-25

Family

ID=74420093

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202006249TA SG10202006249TA (en) 2019-07-22 2020-06-29 Tape mounter

Country Status (4)

Country Link
JP (1) JP7368131B2 (en)
KR (1) KR20210011324A (en)
CN (1) CN112289730A (en)
SG (1) SG10202006249TA (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117297623B (en) * 2023-11-24 2024-02-06 四川大学华西医院 Cardiac patch sensing device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3358099B2 (en) * 1994-03-25 2002-12-16 オムロン株式会社 Optical sensor device
JPH10221905A (en) * 1997-02-06 1998-08-21 Canon Inc Transfer material discriminating device and image forming device provided with the same
JP2011036968A (en) 2009-08-17 2011-02-24 Disco Abrasive Syst Ltd Positioning mechanism and grinding device
JP5443102B2 (en) * 2009-09-01 2014-03-19 株式会社ディスコ Laser processing equipment
JP5866658B2 (en) 2011-10-12 2016-02-17 株式会社ディスコ Positioning mechanism
JP6335633B2 (en) * 2014-05-19 2018-05-30 株式会社ディスコ Tape sticking device
JP6316673B2 (en) * 2014-06-24 2018-04-25 株式会社ディスコ Tape sticking device
JP2017204615A (en) * 2016-05-13 2017-11-16 株式会社ディスコ Tape sticking device
JP6721473B2 (en) * 2016-09-21 2020-07-15 株式会社ディスコ Wafer processing method
JP3220069U (en) * 2018-10-23 2019-02-14 リンテック株式会社 Sheet pasting device

Also Published As

Publication number Publication date
CN112289730A (en) 2021-01-29
TW202104051A (en) 2021-02-01
KR20210011324A (en) 2021-02-01
JP7368131B2 (en) 2023-10-24
JP2021019114A (en) 2021-02-15

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