JP2021016892A5 - - Google Patents
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- Publication number
- JP2021016892A5 JP2021016892A5 JP2019134937A JP2019134937A JP2021016892A5 JP 2021016892 A5 JP2021016892 A5 JP 2021016892A5 JP 2019134937 A JP2019134937 A JP 2019134937A JP 2019134937 A JP2019134937 A JP 2019134937A JP 2021016892 A5 JP2021016892 A5 JP 2021016892A5
- Authority
- JP
- Japan
- Prior art keywords
- solvent
- flux
- solder paste
- less
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002904 solvent Substances 0.000 claims 7
- 230000004907 flux Effects 0.000 claims 5
- 229910000679 solder Inorganic materials 0.000 claims 4
- BWVZAZPLUTUBKD-UHFFFAOYSA-N 3-(5,6,6-Trimethylbicyclo[2.2.1]hept-1-yl)cyclohexanol Chemical compound CC1(C)C(C)C2CC1CC2C1CCCC(O)C1 BWVZAZPLUTUBKD-UHFFFAOYSA-N 0.000 claims 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019134937A JP7355542B2 (ja) | 2019-07-22 | 2019-07-22 | ソルダペースト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019134937A JP7355542B2 (ja) | 2019-07-22 | 2019-07-22 | ソルダペースト |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021016892A JP2021016892A (ja) | 2021-02-15 |
| JP2021016892A5 true JP2021016892A5 (enExample) | 2022-05-18 |
| JP7355542B2 JP7355542B2 (ja) | 2023-10-03 |
Family
ID=74566288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019134937A Active JP7355542B2 (ja) | 2019-07-22 | 2019-07-22 | ソルダペースト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7355542B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7750499B2 (ja) * | 2021-02-25 | 2025-10-07 | 株式会社弘輝 | フラックス、ソルダペースト、及び、接合構造体の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4079026B2 (ja) | 2002-04-16 | 2008-04-23 | 唯知 須賀 | 無残渣ソルダペースト |
| JP6191896B2 (ja) | 2015-08-10 | 2017-09-06 | 荒川化学工業株式会社 | 鉛フリーはんだペースト用フラックス及び鉛フリーはんだペースト |
| JP6433527B2 (ja) | 2017-03-16 | 2018-12-05 | ショット日本株式会社 | 消散性フラックスおよびそれを用いた保護素子の製造方法 |
| JP6540788B1 (ja) | 2017-12-29 | 2019-07-10 | 千住金属工業株式会社 | フラックス及びソルダペースト |
| JP6824208B2 (ja) | 2018-02-26 | 2021-02-03 | 株式会社タムラ製作所 | フラックス及びソルダペースト |
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2019
- 2019-07-22 JP JP2019134937A patent/JP7355542B2/ja active Active