JP2020536988A5 - - Google Patents

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Publication number
JP2020536988A5
JP2020536988A5 JP2020519077A JP2020519077A JP2020536988A5 JP 2020536988 A5 JP2020536988 A5 JP 2020536988A5 JP 2020519077 A JP2020519077 A JP 2020519077A JP 2020519077 A JP2020519077 A JP 2020519077A JP 2020536988 A5 JP2020536988 A5 JP 2020536988A5
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JP
Japan
Prior art keywords
curable composition
polyamide
composition according
diamine
amine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2020519077A
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English (en)
Japanese (ja)
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JP2020536988A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2018/054117 external-priority patent/WO2019070819A1/en
Publication of JP2020536988A publication Critical patent/JP2020536988A/ja
Publication of JP2020536988A5 publication Critical patent/JP2020536988A5/ja
Withdrawn legal-status Critical Current

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JP2020519077A 2017-10-06 2018-10-03 硬化性組成物、それから製造された物品、並びにその製造方法及び使用 Withdrawn JP2020536988A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762569100P 2017-10-06 2017-10-06
US62/569,100 2017-10-06
PCT/US2018/054117 WO2019070819A1 (en) 2017-10-06 2018-10-03 CURABLE COMPOSITIONS, ARTICLES MADE THEREFROM, AND METHODS OF PREPARATION AND USE

Publications (2)

Publication Number Publication Date
JP2020536988A JP2020536988A (ja) 2020-12-17
JP2020536988A5 true JP2020536988A5 (enExample) 2021-11-11

Family

ID=65995318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020519077A Withdrawn JP2020536988A (ja) 2017-10-06 2018-10-03 硬化性組成物、それから製造された物品、並びにその製造方法及び使用

Country Status (5)

Country Link
US (1) US20200259137A1 (enExample)
JP (1) JP2020536988A (enExample)
CN (1) CN111315819A (enExample)
DE (1) DE112018005226T5 (enExample)
WO (1) WO2019070819A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11773254B2 (en) 2017-12-27 2023-10-03 3M Innovative Properties Company Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods
US11193016B2 (en) 2018-05-09 2021-12-07 3M Innovative Properties Company Curable and cured compositions
EP3985045A4 (en) * 2019-06-14 2023-06-14 DIC Corporation Epoxy resin composition, cured product, fiber-reinforced composite material, prepreg, and tow prepreg
KR20210000551A (ko) * 2019-06-25 2021-01-05 주식회사 엘지화학 전지 팩 및 이를 포함하는 디바이스
US20220380628A1 (en) * 2019-10-14 2022-12-01 3M Innovative Properties Company Methods, Articles and Adhesive Composition Comprising Unpolymerized Cyclic Olefin, Catalyst, and Adhesion Promoter Polymer
EP4045560A1 (en) 2019-10-14 2022-08-24 3M Innovative Properties Company Compositions comprising cyclic olefins and thermally conductive filler
US11453744B2 (en) * 2019-10-15 2022-09-27 Evonik Operations Gmbh Compositions consisting of BrØnsted acids and monoamines
KR102391491B1 (ko) * 2019-11-20 2022-04-27 주식회사 엘지화학 경화성 조성물
JP7665617B2 (ja) * 2019-11-26 2025-04-21 ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス,エルエルシー エポキシ系熱界面材料
WO2021124033A1 (en) 2019-12-19 2021-06-24 3M Innovative Properties Company Two-part compositions including a uretdione-containing material and inorganic filler, products, and methods
KR20220120600A (ko) 2019-12-20 2022-08-30 쓰리엠 이노베이티브 프로퍼티즈 캄파니 중합체 및 중합성 환형 올레핀을 포함하는 접착제 물품, 접착제 조성물 및 방법
CA3168342A1 (en) * 2020-02-26 2021-09-02 Ppg Industries Ohio, Inc. Thermally conductive and electrically insulating powder coating compositions
CN115135710A (zh) * 2020-03-26 2022-09-30 Ddp特种电子材料美国有限责任公司 包含多模态分布的球形填料的热界面材料
KR20220078765A (ko) * 2020-12-03 2022-06-13 주식회사 엘지에너지솔루션 전지 팩 및 이를 포함하는 디바이스
KR20220082297A (ko) * 2020-12-10 2022-06-17 주식회사 엘지에너지솔루션 전지 모듈 및 이를 포함하는 전지팩
WO2022219427A1 (en) 2021-04-14 2022-10-20 3M Innovative Properties Company Compositions comprising cyclic olefins and thermally conductive filler and adhesion promoter
DE102021115790A1 (de) 2021-06-18 2022-12-22 Audi Aktiengesellschaft Thermisches Interface-Material, Batterieanordnung, Kraftfahrzeug und Verfahren zum Betreiben einer Batterieanordnung
DE102021130417A1 (de) 2021-11-22 2023-05-25 Bayerische Motoren Werke Aktiengesellschaft Energiespeicherzelle mit Beschichtung, elektrischer Energiespeicher sowie Kraftfahrzeug
JP7788300B2 (ja) * 2022-02-09 2025-12-18 サンスター技研株式会社 エポキシ樹脂用の硬化剤及び接着剤

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2705222A (en) 1948-11-06 1955-03-29 Union Carbide & Carbon Corp Reactive silica powder
BE518342A (enExample) 1952-03-11 1900-01-01
US3409646A (en) * 1965-08-10 1968-11-05 Rohm & Haas Aminoamides
US3377303A (en) 1966-05-03 1968-04-09 Gen Mills Inc Polyamide composition
US3496250A (en) 1967-02-21 1970-02-17 Borg Warner Blends of epoxy resins and acrylonitrile butadiene-styrene graft copolymers
US3595887A (en) 1968-08-12 1971-07-27 Gen Mills Inc Hydrogenation of polymeric fat acids
US3639928A (en) 1970-11-27 1972-02-08 Jefferson Chem Co Inc Accelerator combination for epoxy curing
DE3901279A1 (de) * 1989-01-18 1990-07-19 Hoechst Ag Verwendung von polyamidoaminen als haerter fuer epoxidharze und diese enthaltende haertbare mischungen
US6008313A (en) 1997-11-19 1999-12-28 Air Products And Chemicals, Inc. Polyamide curing agents based on mixtures of polyethyleneamines and piperazine derivatives
US6350791B1 (en) * 1998-06-22 2002-02-26 3M Innovative Properties Company Thermosettable adhesive
US6500912B1 (en) * 2000-09-12 2002-12-31 Resolution Performance Products Llc Epoxy resin system
CN100447196C (zh) 2003-06-09 2008-12-31 株式会社钟化 改性环氧树脂的制造方法
EP2365011A1 (de) 2010-03-02 2011-09-14 Sika Technology AG Aminogruppen - terminierter Schlagzähigkeitsmodifikator und dessen Verwendungen in Epoxidharzzusammensetzungen
EP2495271B1 (en) * 2011-03-04 2014-04-23 3M Innovative Properties Co. Polyether hybrid epoxy curatives
WO2014066386A1 (en) * 2012-10-24 2014-05-01 Dow Global Technologies Llc Polyamide hardeners for epoxy resins
GB2543756B (en) * 2015-10-22 2017-10-18 Henkel IP & Holding GmbH Anaerobically curable compositions

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