JP2020532125A5 - - Google Patents

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Publication number
JP2020532125A5
JP2020532125A5 JP2020511165A JP2020511165A JP2020532125A5 JP 2020532125 A5 JP2020532125 A5 JP 2020532125A5 JP 2020511165 A JP2020511165 A JP 2020511165A JP 2020511165 A JP2020511165 A JP 2020511165A JP 2020532125 A5 JP2020532125 A5 JP 2020532125A5
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JP
Japan
Prior art keywords
substrate
optionally
motomeko
structure according
devices
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Application number
JP2020511165A
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English (en)
Japanese (ja)
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JP2020532125A (ja
JP7340516B2 (ja
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Priority claimed from US15/687,157 external-priority patent/US10561019B2/en
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Publication of JP2020532125A publication Critical patent/JP2020532125A/ja
Publication of JP2020532125A5 publication Critical patent/JP2020532125A5/ja
Application granted granted Critical
Publication of JP7340516B2 publication Critical patent/JP7340516B2/ja
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JP2020511165A 2017-08-25 2018-08-23 電子機器を収納するためのエコロジカルな多層構造および関連する製造方法 Active JP7340516B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/687,157 2017-08-25
US15/687,157 US10561019B2 (en) 2017-08-25 2017-08-25 Ecological multilayer structure for hosting electronics and related method of manufacture
PCT/FI2018/050600 WO2019038480A1 (en) 2017-08-25 2018-08-23 ECOLOGICAL MULTILAYER STRUCTURE FOR ACCOMMODATING ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING THE SAME

Publications (3)

Publication Number Publication Date
JP2020532125A JP2020532125A (ja) 2020-11-05
JP2020532125A5 true JP2020532125A5 (enExample) 2021-08-12
JP7340516B2 JP7340516B2 (ja) 2023-09-07

Family

ID=63524310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020511165A Active JP7340516B2 (ja) 2017-08-25 2018-08-23 電子機器を収納するためのエコロジカルな多層構造および関連する製造方法

Country Status (8)

Country Link
US (3) US10561019B2 (enExample)
EP (1) EP3673718A1 (enExample)
JP (1) JP7340516B2 (enExample)
KR (1) KR102572055B1 (enExample)
CN (1) CN111066377B (enExample)
MX (1) MX2020002096A (enExample)
TW (1) TWI785104B (enExample)
WO (1) WO2019038480A1 (enExample)

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US20250315159A1 (en) * 2015-12-07 2025-10-09 Sas Woodoo Touch detection device with touch interface made of composite material
KR102409393B1 (ko) * 2017-08-14 2022-06-15 삼성전자주식회사 도광판, 백라이트 유닛 및 이를 포함한 홀로그래픽 디스플레이 장치
WO2019082399A1 (ja) * 2017-10-28 2019-05-02 mui Lab株式会社 操作表示パネル組込物品
US12210707B2 (en) 2018-01-08 2025-01-28 Kids Ii Hape Joint Venture Limited Toys with connected play
CN112675555B (zh) 2018-01-08 2022-09-27 克兹二世怡人合资有限公司 具有电容式触摸交互性的儿童玩具
USD945535S1 (en) 2019-01-07 2022-03-08 Kids Ii Hape Joint Venture Limited Children's play table
CA3083463C (en) 2019-06-14 2026-04-21 Hutchinson Aeronautique & Industrie Ltee Composite panel comprising an integrated electrical circuit and manufacturing method thereof
IT201900016313A1 (it) * 2019-09-13 2021-03-13 Martur Italy Srl Pannello multistrato conduttivo per l’abitacolo di veicoli, in particolare autoveicoli
US11437526B2 (en) 2019-12-09 2022-09-06 Amkor Technology Singapore Holding Pte. Ltd. Electronic devices having a sensor and a translucent mold compound and methods of manufacturing electronic devices
US20210188193A1 (en) * 2019-12-24 2021-06-24 Inteva Products, Llc Vehicle interior trim part formed with intergrated electronics and method of making
CN115362097A (zh) * 2020-04-15 2022-11-18 上海延锋金桥汽车饰件系统有限公司 车辆内部部件
US20230311804A1 (en) * 2020-04-15 2023-10-05 Shanghai Yanfeng Jinqiao Automotive Trim Systems Co. Ltd. Component for vehicle interior
CN111897454A (zh) * 2020-07-24 2020-11-06 业成科技(成都)有限公司 发光组件及其制作方法、电子装置
EP4042329B1 (en) * 2020-08-05 2023-06-07 Smartflex Technology Pte Ltd Smart cards having led and methods for fabrication thereof
USD979656S1 (en) 2020-12-11 2023-02-28 Kids Ii Hape Joint Venture Limited Toy drum
US12471333B2 (en) * 2021-01-06 2025-11-11 Innolux Corporation Electronic device
USD985676S1 (en) 2021-01-11 2023-05-09 Kids Ii Hape Joint Venture Limited Toy drum
USD985677S1 (en) 2021-01-11 2023-05-09 Kids Ii Hape Joint Venture Limited Toy guitar
US11719898B2 (en) * 2021-03-03 2023-08-08 Marvell Asia Pte Ltd. Methods for co-packaging optical modules on switch package substrate
EP4081005A1 (en) * 2021-04-23 2022-10-26 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier
DE102021112435A1 (de) * 2021-05-12 2022-11-17 Homag Gmbh Verfahren zum Herstellen eines Möbel- oder Bauelements
KR102394587B1 (ko) * 2021-07-19 2022-05-06 인탑스 주식회사 다중 ime 구조 및 그 제조 방법
US11598911B1 (en) * 2021-08-31 2023-03-07 Arista Networks, Inc. Transporting light within circuit board profile
DE102021124300B3 (de) 2021-09-20 2022-10-27 Ofs - Beteiligungs - Gmbh Holding Elektronisches Bauelement aus pflanzlichem Material
CZ2022431A3 (cs) * 2022-10-12 2023-06-21 Západočeská Univerzita V Plzni Způsob elektrického kontaktování a zapouzdření elektronické komponenty na textilním substrátu chytré textilie, pouzdro pro provádění způsobu, a sestava pouzdra a textilního substrátu
CN120548264A (zh) 2022-11-30 2025-08-26 延锋国际汽车技术有限公司 用于车辆内部的部件
US20240349424A1 (en) * 2023-02-16 2024-10-17 John Simonetti Method and system for providing illuminating objects within substrate
WO2024180525A1 (en) * 2023-03-02 2024-09-06 Centitvc - Centro De Nanotecnologia E Materiais Tecnicos Funcionais E Inteligentes Sensoring wood base product, method for production and uses thereof
JP2025007333A (ja) * 2023-06-30 2025-01-17 新東工業株式会社 呼び出しシステム
WO2025029187A1 (en) * 2023-08-02 2025-02-06 Razer (Asia-Pacific) Pte. Ltd. Touch control module
FI20236158A1 (en) * 2023-10-18 2025-04-19 Teknologian Tutkimuskeskus Vtt Oy Laminate and its manufacturing method
FR3163524A1 (fr) * 2024-06-14 2025-12-19 Neophoria Materiau fonctionalisé comportant un circuit électronique imprimé sur cuir et encapsulé, son procédé de fabrication et article comportant un tel matériau

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US5746500A (en) * 1996-10-28 1998-05-05 Chien; Tseng-Lu Illuminated laces for footwear
US7394663B2 (en) 2003-02-18 2008-07-01 Matsushita Electric Industrial Co., Ltd. Electronic component built-in module and method of manufacturing the same
US7504159B1 (en) * 2005-11-04 2009-03-17 3Form, Inc. Resin-based panels having thin or brittle veneer layers and methods of making same
US8092735B2 (en) * 2006-08-17 2012-01-10 3M Innovative Properties Company Method of making a light emitting device having a molded encapsulant
WO2009118985A2 (en) * 2008-03-25 2009-10-01 Kabushiki Kaisha Toshiba Light emitting device, and method and apparatus for manufacturing same
JP6209874B2 (ja) * 2012-08-31 2017-10-11 日亜化学工業株式会社 発光装置及びその製造方法
US20150241288A1 (en) * 2014-02-24 2015-08-27 Mc10. Inc. Conformal electronics with deformation indicators
EP3357310B1 (en) 2015-09-28 2021-06-23 Tactotek Oy Multilayer structure and related method of manufacture for electronics
EP3370938B1 (en) 2015-11-06 2020-05-27 Tactotek Oy Multilayer structure and related method of manufacturing

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