JP2020522126A - ブラシの調整のための排出液モニタリング方法および装置 - Google Patents
ブラシの調整のための排出液モニタリング方法および装置 Download PDFInfo
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- JP2020522126A JP2020522126A JP2019563834A JP2019563834A JP2020522126A JP 2020522126 A JP2020522126 A JP 2020522126A JP 2019563834 A JP2019563834 A JP 2019563834A JP 2019563834 A JP2019563834 A JP 2019563834A JP 2020522126 A JP2020522126 A JP 2020522126A
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- brush
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/005—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents using brushes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
- B24B53/14—Dressing tools equipped with rotary rollers or cutters; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
- B24D13/145—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face having a brush-like working surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Abstract
Description
本国際出願は、2017年5月19日出願の米国特許出願第15/600,021号「Methods and Apparatuses for Effluent Monitoring for Brush Conditioning」の優先権を主張する。本明細書の一部をなすものとして米国特許出願第15/600,021号の全体を引用する。
101 流体供給システム
103 流体排出システム
110 ブラシステーション
120 ユーザーインターフェース
130 ステータスライト
140 流体流入システム
150 流体流出システム
160 制御システム
170 I/Oインターフェース
180 モーターシステム
200 グラフ
310 コンディショニングプレート(コンディショニング面)
312 表面
314 脚
320 ブラシ
322 軸方向開口部
330 ブラシ支持体
332 スリーブ
410 流体
412 排出液
420 導管
430 リザーバーシステム
430a リザーバー
430b リザーバー
430c リザーバー
430d リザーバー
432 排液システム
432a 排液管
432b 排液管
432c 排液管
432d 排液管
442 液中パーティクルカウンター(LPC)
444 pH測定ユニット
446 抵抗率測定ユニット
450 ポンプ
460 データ記憶デバイス
500 フロー図
Claims (20)
- オフライン式ブラシ調整システムの排出液の汚染レベルをモニタリングするシステムにおいて、
前記オフライン式ブラシ調整システム内に配置されたブラシの第1の部分からの第1の排出液を収集する第1のリザーバーと、
前記第1の部分とは異なる前記ブラシの第2の部分から第2の排出液を収集する第2のリザーバーであって、前記第1と第2の排出液は、半導体ウェハーの表面を洗浄するブラシを調整するために用いた流体からのものである第2のリザーバーと、
前記第1の排出液の第1の汚染レベルと、前記第2の排出液の第2の汚染レベルとをそれぞれモニタリングする排出液汚染モニターとを具備するシステム。 - 前記第1と第2の汚染レベルに基づいて前記ブラシの調整を制御する制御システムを更に備える請求項1に記載のシステム。
- 前記第1と第2のリザーバーの少なくとも一方のための材料は、石英、ペルフルオロアルコキシアルカン(PFA)、ポリフッ化ビニリデン(PVDF)またはポリエチレンテレフタレート(PET)の少なくとも1つを含む請求項1に記載のシステム。
- 測定された前記第1と第2の汚染レベルの各々は、液中粒子計数、pHレベルまたは抵抗率のうちの少なくとも1つを含む請求項1に記載のシステム。
- 前記排出液汚染モニターは、前記液中粒子計数を測定する液中パーティクルカウンター(LPC)を含む請求項4に記載のシステム。
- 前記LPCは、レーザー光散乱測定システムを使用するように構成されている請求項5に記載のシステム。
- 前記第1と第2の汚染レベルの少なくとも一部はリアルタイムに記録される請求項4に記載のシステム。
- 前記第1と第2のリザーバーの下流に配置され前記第1と第2の排出液を送り出すポンプシステムを更に備える請求項1に記載のシステム。
- 前記ブラシに前記流体を提供する供給システムを更に備える請求項1に記載のシステム。
- 前記第1と第2の汚染レベルがモニタリングされていない、前記オフライン式ブラシ調整システムのアイドルモード中、前記流体は超純水である請求項1に記載のシステム。
- 前記第1と第2の汚染レベルの少なくとも一方を時間と相関させることを更に含む請求項1に記載のシステム。
- 前記第1の排出液の第1の流量と前記第2の排出液の第2の流量とが、前記ブラシの流量変動を推定するために用いられる請求項1に記載のシステム。
- オフライン式ブラシ調整システムの排出液の汚染レベルをモニタリングする方法において、
前記オフライン式ブラシ調整システムに配置されたブラシの第1の部分からの第1の排出液を第1のリザーバーに収集することと、
前記第1の部分とは異なる前記ブラシの第2の部分からの第2の排出液を第2のリザーバーに収集することであって、前記第1と第2の排出液は、半導体ウェハーの表面を洗浄するブラシを調整するために用いられた流体からのものであることと、
排出液汚染モニターを用いて、前記第1の排出液の第1の汚染レベル及び前記第2の排出液の第2の汚染レベルをそれぞれ特定することとを含む方法。 - 前記第1と第2の汚染レベルに基づいて前記ブラシの調整を制御することを更に含む請求項13に記載の方法。
- 前記第1と第2のリザーバーの少なくとも一方のための材料は、石英、ペルフルオロアルコキシアルカン(PFA)、ポリフッ化ビニリデン(PVDF)またはポリエチレンテレフタレート(PET)の少なくとも1つを含む請求項13に記載の方法。
- 前記第1と第2の汚染レベルの各々は、液中粒子計数、pHレベルまたは抵抗率の少なくとも1つを含む請求項13に記載の方法。
- 前記排出液汚染モニターは、前記第1と第2の排出液の各々の液中粒子計数を測定する液中パーティクルカウンター(LPC)を含む請求項13に記載の方法。
- 前記第1と第2の汚染レベルの少なくとも一部をリアルタイムに記録することを含む請求項13に記載の方法。
- 前記第1と第2の汚染レベルの少なくとも一方を時間と相関させることを含む請求項13に記載の方法。
- 前記第1の排出液の第1の流量と前記第2の排出液の第2の流量とが、前記ブラシの流量変動を推定するために用いられる請求項13に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/600,021 US10410936B2 (en) | 2017-05-19 | 2017-05-19 | Methods and apparatuses for effluent monitoring for brush conditioning |
US15/600,021 | 2017-05-19 | ||
PCT/US2018/030092 WO2018212970A1 (en) | 2017-05-19 | 2018-04-30 | Methods and apparatuses for effluent monitoring for brush conditioning |
Publications (2)
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JP2020522126A true JP2020522126A (ja) | 2020-07-27 |
JP7104725B2 JP7104725B2 (ja) | 2022-07-21 |
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JP2019563834A Active JP7104725B2 (ja) | 2017-05-19 | 2018-04-30 | ブラシの調整のための排出液モニタリング方法および装置 |
Country Status (7)
Country | Link |
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US (2) | US10410936B2 (ja) |
EP (1) | EP3625820B1 (ja) |
JP (1) | JP7104725B2 (ja) |
KR (1) | KR102421566B1 (ja) |
CN (2) | CN117637535A (ja) |
TW (1) | TWI746847B (ja) |
WO (1) | WO2018212970A1 (ja) |
Cited By (1)
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KR20220168166A (ko) | 2021-06-15 | 2022-12-22 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판 세정 장치, 기판 처리 장치, 브레이크 인 장치, 기판에 부착되는 미립자 수의 추정 방법, 기판 세정 부재의 오염 정도 판정 방법 및 브레이크 인 처리의 판정 방법 |
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2017
- 2017-05-19 US US15/600,021 patent/US10410936B2/en active Active
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2018
- 2018-04-30 WO PCT/US2018/030092 patent/WO2018212970A1/en active Application Filing
- 2018-04-30 CN CN202311401721.9A patent/CN117637535A/zh active Pending
- 2018-04-30 EP EP18726875.0A patent/EP3625820B1/en active Active
- 2018-04-30 KR KR1020197036642A patent/KR102421566B1/ko active IP Right Grant
- 2018-04-30 CN CN201880046914.8A patent/CN110914968B/zh active Active
- 2018-04-30 JP JP2019563834A patent/JP7104725B2/ja active Active
- 2018-05-15 TW TW107116369A patent/TWI746847B/zh active
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2019
- 2019-09-09 US US16/564,175 patent/US11205582B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10163143A (ja) * | 1996-11-27 | 1998-06-19 | Sony Corp | 半導体製造装置 |
JP2003243350A (ja) * | 2002-02-14 | 2003-08-29 | Tokyo Electron Ltd | スクラブ洗浄装置におけるブラシクリーニング方法及び処理システム |
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KR20220168166A (ko) | 2021-06-15 | 2022-12-22 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판 세정 장치, 기판 처리 장치, 브레이크 인 장치, 기판에 부착되는 미립자 수의 추정 방법, 기판 세정 부재의 오염 정도 판정 방법 및 브레이크 인 처리의 판정 방법 |
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CN117637535A (zh) | 2024-03-01 |
US10410936B2 (en) | 2019-09-10 |
US11205582B2 (en) | 2021-12-21 |
WO2018212970A1 (en) | 2018-11-22 |
EP3625820B1 (en) | 2021-06-02 |
US20180337102A1 (en) | 2018-11-22 |
CN110914968B (zh) | 2023-11-17 |
KR20200009033A (ko) | 2020-01-29 |
CN110914968A (zh) | 2020-03-24 |
KR102421566B1 (ko) | 2022-07-14 |
TW201901328A (zh) | 2019-01-01 |
US20200006162A1 (en) | 2020-01-02 |
TWI746847B (zh) | 2021-11-21 |
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JP7104725B2 (ja) | 2022-07-21 |
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