JP2020516900A5 - - Google Patents

Download PDF

Info

Publication number
JP2020516900A5
JP2020516900A5 JP2019555964A JP2019555964A JP2020516900A5 JP 2020516900 A5 JP2020516900 A5 JP 2020516900A5 JP 2019555964 A JP2019555964 A JP 2019555964A JP 2019555964 A JP2019555964 A JP 2019555964A JP 2020516900 A5 JP2020516900 A5 JP 2020516900A5
Authority
JP
Japan
Prior art keywords
detector
ray
measurement target
weighing system
pixel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019555964A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020516900A (ja
Filing date
Publication date
Priority claimed from US15/950,823 external-priority patent/US10767978B2/en
Application filed filed Critical
Publication of JP2020516900A publication Critical patent/JP2020516900A/ja
Publication of JP2020516900A5 publication Critical patent/JP2020516900A5/ja
Priority to JP2022171658A priority Critical patent/JP7376666B2/ja
Priority to JP2022171657A priority patent/JP7376665B2/ja
Priority to JP2023164224A priority patent/JP7557590B2/ja
Priority to JP2024159139A priority patent/JP2024175033A/ja
Pending legal-status Critical Current

Links

JP2019555964A 2017-04-14 2018-04-13 透過型小角ｘ線散乱計量システム Pending JP2020516900A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2022171658A JP7376666B2 (ja) 2017-04-14 2022-10-26 透過型小角ｘ線散乱計量システム
JP2022171657A JP7376665B2 (ja) 2017-04-14 2022-10-26 透過型小角ｘ線散乱計量システム
JP2023164224A JP7557590B2 (ja) 2017-04-14 2023-09-27 透過型小角ｘ線散乱計量システム及び方法
JP2024159139A JP2024175033A (ja) 2017-04-14 2024-09-13 透過型小角ｘ線散乱計量システム及び方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762485497P 2017-04-14 2017-04-14
US62/485,497 2017-04-14
US15/950,823 US10767978B2 (en) 2017-04-14 2018-04-11 Transmission small-angle X-ray scattering metrology system
US15/950,823 2018-04-11
PCT/US2018/027648 WO2018191714A1 (en) 2017-04-14 2018-04-13 Transmission small-angle x-ray scattering metrology system

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2022171658A Division JP7376666B2 (ja) 2017-04-14 2022-10-26 透過型小角ｘ線散乱計量システム
JP2022171657A Division JP7376665B2 (ja) 2017-04-14 2022-10-26 透過型小角ｘ線散乱計量システム

Publications (2)

Publication Number Publication Date
JP2020516900A JP2020516900A (ja) 2020-06-11
JP2020516900A5 true JP2020516900A5 (enExample) 2021-05-27

Family

ID=63791810

Family Applications (5)

Application Number Title Priority Date Filing Date
JP2019555964A Pending JP2020516900A (ja) 2017-04-14 2018-04-13 透過型小角ｘ線散乱計量システム
JP2022171658A Active JP7376666B2 (ja) 2017-04-14 2022-10-26 透過型小角ｘ線散乱計量システム
JP2022171657A Active JP7376665B2 (ja) 2017-04-14 2022-10-26 透過型小角ｘ線散乱計量システム
JP2023164224A Active JP7557590B2 (ja) 2017-04-14 2023-09-27 透過型小角ｘ線散乱計量システム及び方法
JP2024159139A Pending JP2024175033A (ja) 2017-04-14 2024-09-13 透過型小角ｘ線散乱計量システム及び方法

Family Applications After (4)

Application Number Title Priority Date Filing Date
JP2022171658A Active JP7376666B2 (ja) 2017-04-14 2022-10-26 透過型小角ｘ線散乱計量システム
JP2022171657A Active JP7376665B2 (ja) 2017-04-14 2022-10-26 透過型小角ｘ線散乱計量システム
JP2023164224A Active JP7557590B2 (ja) 2017-04-14 2023-09-27 透過型小角ｘ線散乱計量システム及び方法
JP2024159139A Pending JP2024175033A (ja) 2017-04-14 2024-09-13 透過型小角ｘ線散乱計量システム及び方法

Country Status (7)

Country Link
US (2) US10767978B2 (enExample)
EP (1) EP3593124B1 (enExample)
JP (5) JP2020516900A (enExample)
KR (2) KR102515242B1 (enExample)
CN (2) CN110546489B (enExample)
TW (1) TWI783988B (enExample)
WO (1) WO2018191714A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10767978B2 (en) * 2017-04-14 2020-09-08 Kla-Tencor Corporation Transmission small-angle X-ray scattering metrology system
KR102442490B1 (ko) * 2017-09-27 2022-09-13 삼성전자 주식회사 무선 통신 시스템에서 분산 처리에 기반한 망 설계를 위한 분석 방법 및 장치
KR20210028276A (ko) * 2018-07-31 2021-03-11 램 리써치 코포레이션 고 종횡비 구조체들의 패터닝된 어레이들 내의 틸팅 각도 결정
DE102018132542A1 (de) * 2018-12-17 2020-06-18 Osram Opto Semiconductors Gmbh Optoelektronische leuchtvorrichtung und herstellungsverfahren
US11843069B2 (en) * 2018-12-31 2023-12-12 Asml Netherlands B.V. Semiconductor detector and method of fabricating same
US11867595B2 (en) * 2019-10-14 2024-01-09 Industrial Technology Research Institute X-ray reflectometry apparatus and method thereof for measuring three dimensional nanostructures on flat substrate
US11698251B2 (en) * 2020-01-07 2023-07-11 Kla Corporation Methods and systems for overlay measurement based on soft X-ray Scatterometry
CN111473749B (zh) * 2020-04-22 2021-09-03 中国科学院上海应用物理研究所 一种单毛细管内面形在线表征方法
US11761913B2 (en) * 2020-05-04 2023-09-19 Bruker Technologies Ltd. Transmission X-ray critical dimension (T-XCD) characterization of shift and tilt of stacks of high-aspect-ratio (HAR) structures
CN111912865A (zh) * 2020-06-23 2020-11-10 成都飞机工业（集团）有限责任公司 一种基于微焦点的数字放大射线检测方法及系统
US12013355B2 (en) * 2020-12-17 2024-06-18 Kla Corporation Methods and systems for compact, small spot size soft x-ray scatterometry
CN113433142B (zh) * 2021-06-22 2022-08-26 中国工程物理研究院激光聚变研究中心 适用于x射线诊断的高时空分辨光学系统
JP7600046B2 (ja) 2021-07-13 2024-12-16 キオクシア株式会社 形状計測方法、形状計測装置、及びプログラム
CN113686904B (zh) * 2021-07-28 2023-08-29 河北工业大学 一种描述外载作用下岩体微细观破裂与微裂隙形成的方法
KR20240115307A (ko) * 2021-12-07 2024-07-25 에이에스엠엘 네델란즈 비.브이. 리소그래피 시스템 내의 기판 정렬에 대한 타겟 비대칭 측정
TWI814579B (zh) 2022-09-13 2023-09-01 財團法人工業技術研究院 用以量測平整基板上之三維奈米結構的x射線反射儀設備及方法
US12493004B2 (en) 2022-09-28 2025-12-09 Industrial Technology Research Institute Method for determining parameters of three dimensional nanostructure and apparatus applying the same
CN118294484B (zh) * 2023-11-21 2025-04-25 张江国家实验室 一种掠入射小角度x射线散射布拉格峰定位方法
US20250277763A1 (en) * 2024-03-01 2025-09-04 Gatan Inc. Devices and systems for experimental forward model indexing of electron backscatter diffraction patterns
CN117990052B (zh) * 2024-04-03 2024-08-06 浙江求是半导体设备有限公司 载台倾斜角度检测方法和载台调平方法
CN119958472B (zh) * 2024-12-31 2025-11-21 深圳中科飞测科技股份有限公司 一种x射线散射量测设备、监控方法及介质

Family Cites Families (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5608526A (en) 1995-01-19 1997-03-04 Tencor Instruments Focused beam spectroscopic ellipsometry method and system
US6023338A (en) 1996-07-12 2000-02-08 Bareket; Noah Overlay alignment measurement of wafers
US5859424A (en) 1997-04-08 1999-01-12 Kla-Tencor Corporation Apodizing filter system useful for reducing spot size in optical measurements and other applications
US5998790A (en) * 1997-06-18 1999-12-07 The Regents Of The University Of California Transmission electron microscope CCD camera
US6269144B1 (en) 1998-03-04 2001-07-31 William P. Dube Method and apparatus for diffraction measurement using a scanning x-ray source
EP1121584A4 (en) * 1998-09-17 2002-10-16 Noran Instr Inc USE OF X-RAY OPTICS FOR DISPENSIVE SPECTROSCOPY
JP3944330B2 (ja) * 1999-04-12 2007-07-11 株式会社リガク Ｘ線回折装置及びｘ線ロッキングカーブの測定方法
US6429943B1 (en) 2000-03-29 2002-08-06 Therma-Wave, Inc. Critical dimension analysis with simultaneous multiple angle of incidence measurements
US6787773B1 (en) 2000-06-07 2004-09-07 Kla-Tencor Corporation Film thickness measurement using electron-beam induced x-ray microanalysis
US7068833B1 (en) 2000-08-30 2006-06-27 Kla-Tencor Corporation Overlay marks, methods of overlay mark design and methods of overlay measurements
US7541201B2 (en) 2000-08-30 2009-06-02 Kla-Tencor Technologies Corporation Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
US7317531B2 (en) 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US20030002043A1 (en) 2001-04-10 2003-01-02 Kla-Tencor Corporation Periodic patterns and technique to control misalignment
US6716646B1 (en) 2001-07-16 2004-04-06 Advanced Micro Devices, Inc. Method and apparatus for performing overlay measurements using scatterometry
WO2003054475A2 (en) 2001-12-19 2003-07-03 Kla-Tencor Technologies Corporation Parametric profiling using optical spectroscopic systems
US6778275B2 (en) 2002-02-20 2004-08-17 Micron Technology, Inc. Aberration mark and method for estimating overlay error and optical aberrations
US6992764B1 (en) 2002-09-30 2006-01-31 Nanometrics Incorporated Measuring an alignment target with a single polarization state
US7842933B2 (en) 2003-10-22 2010-11-30 Applied Materials Israel, Ltd. System and method for measuring overlay errors
US6937337B2 (en) 2003-11-19 2005-08-30 International Business Machines Corporation Overlay target and measurement method using reference and sub-grids
US8094288B2 (en) * 2004-05-11 2012-01-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7321426B1 (en) 2004-06-02 2008-01-22 Kla-Tencor Technologies Corporation Optical metrology on patterned samples
US7412026B2 (en) * 2004-07-02 2008-08-12 The Board Of Regents Of The University Of Oklahoma Phase-contrast x-ray imaging systems and methods
US7478019B2 (en) 2005-01-26 2009-01-13 Kla-Tencor Corporation Multiple tool and structure analysis
JP4585926B2 (ja) 2005-06-17 2010-11-24 株式会社日立ハイテクノロジーズ パターンレイヤーデータ生成装置、それを用いたパターンレイヤーデータ生成システム、半導体パターン表示装置、パターンレイヤーデータ生成方法、及びコンピュータプログラム
US7567351B2 (en) 2006-02-02 2009-07-28 Kla-Tencor Corporation High resolution monitoring of CD variations
JP4887062B2 (ja) 2006-03-14 2012-02-29 株式会社日立ハイテクノロジーズ 試料寸法測定方法、及び試料寸法測定装置
US7406153B2 (en) 2006-08-15 2008-07-29 Jordan Valley Semiconductors Ltd. Control of X-ray beam spot size
JP5247702B2 (ja) * 2006-09-15 2013-07-24 デジタルオプティクス・コーポレイション・ヨーロッパ・リミテッド 改良された画像品質を伴う画像システム及び関連する方法
US7920676B2 (en) 2007-05-04 2011-04-05 Xradia, Inc. CD-GISAXS system and method
US20100223016A1 (en) * 2007-08-17 2010-09-02 Gary Gibson Method and apparatus for identification and detection of liquids
US7873585B2 (en) 2007-08-31 2011-01-18 Kla-Tencor Technologies Corporation Apparatus and methods for predicting a semiconductor parameter across an area of a wafer
US7929667B1 (en) 2008-10-02 2011-04-19 Kla-Tencor Corporation High brightness X-ray metrology
US8497977B2 (en) * 2009-03-12 2013-07-30 Nikon Corporation Optical integrator, illumination optical system, exposure apparatus, and device manufacturing method
US8068662B2 (en) 2009-03-30 2011-11-29 Hermes Microvision, Inc. Method and system for determining a defect during charged particle beam inspection of a sample
US9122178B2 (en) * 2009-08-04 2015-09-01 Asml Netherlands B.V. Object inspection systems and methods
FR2955391B1 (fr) * 2010-01-18 2012-03-16 Xenocs Systeme compact d'analyse par rayons-x
JP5764380B2 (ja) 2010-04-29 2015-08-19 エフ イー アイ カンパニＦｅｉ Ｃｏｍｐａｎｙ Ｓｅｍ画像化法
US9046475B2 (en) 2011-05-19 2015-06-02 Applied Materials Israel, Ltd. High electron energy based overlay error measurement methods and systems
US10107621B2 (en) 2012-02-15 2018-10-23 Nanometrics Incorporated Image based overlay measurement with finite gratings
US10801975B2 (en) 2012-05-08 2020-10-13 Kla-Tencor Corporation Metrology tool with combined X-ray and optical scatterometers
US9243886B1 (en) 2012-06-26 2016-01-26 Kla-Tencor Corporation Optical metrology of periodic targets in presence of multiple diffraction orders
US10013518B2 (en) 2012-07-10 2018-07-03 Kla-Tencor Corporation Model building and analysis engine for combined X-ray and optical metrology
WO2014062972A1 (en) 2012-10-18 2014-04-24 Kla-Tencor Corporation Symmetric target design in scatterometry overlay metrology
US9581430B2 (en) 2012-10-19 2017-02-28 Kla-Tencor Corporation Phase characterization of targets
DE102012222571A1 (de) * 2012-12-07 2014-06-12 Scanlab Ag Optischer Winkeldetektor
US10769320B2 (en) 2012-12-18 2020-09-08 Kla-Tencor Corporation Integrated use of model-based metrology and a process model
US9291554B2 (en) 2013-02-05 2016-03-22 Kla-Tencor Corporation Method of electromagnetic modeling of finite structures and finite illumination for metrology and inspection
US10101670B2 (en) 2013-03-27 2018-10-16 Kla-Tencor Corporation Statistical model-based metrology
US9581550B2 (en) * 2013-05-31 2017-02-28 Pacific Biosciences Of California Analytical devices having compact lens train arrays
US9535018B2 (en) * 2013-07-08 2017-01-03 Kla-Tencor Corporation Combined x-ray and optical metrology
JP5842242B2 (ja) * 2013-10-17 2016-01-13 国立大学法人金沢大学 回折環分析方法および回折環分析装置
US9846132B2 (en) 2013-10-21 2017-12-19 Kla-Tencor Corporation Small-angle scattering X-ray metrology systems and methods
US9885962B2 (en) * 2013-10-28 2018-02-06 Kla-Tencor Corporation Methods and apparatus for measuring semiconductor device overlay using X-ray metrology
US9588066B2 (en) 2014-01-23 2017-03-07 Revera, Incorporated Methods and systems for measuring periodic structures using multi-angle X-ray reflectance scatterometry (XRS)
JP2015184092A (ja) * 2014-03-24 2015-10-22 桑原　章二 Ｘ線分析装置
US9494535B2 (en) 2014-04-21 2016-11-15 Kla-Tencor Corporation Scatterometry-based imaging and critical dimension metrology
US9606073B2 (en) 2014-06-22 2017-03-28 Bruker Jv Israel Ltd. X-ray scatterometry apparatus
US10324050B2 (en) 2015-01-14 2019-06-18 Kla-Tencor Corporation Measurement system optimization for X-ray based metrology
DE112016001982T5 (de) * 2015-04-28 2018-02-15 Kla-Tencor Corporation Recheneffiziente auf röntgenstrahlgestützte messung des overlays
US10197496B2 (en) * 2015-06-23 2019-02-05 Empire Technology Development Llc Real-time monitoring of material composition for quality control
TWI656409B (zh) * 2015-09-09 2019-04-11 美商克萊譚克公司 基於輔助電磁場之引入之一階散射測量疊加之新方法
US10352695B2 (en) 2015-12-11 2019-07-16 Kla-Tencor Corporation X-ray scatterometry metrology for high aspect ratio structures
US10767978B2 (en) * 2017-04-14 2020-09-08 Kla-Tencor Corporation Transmission small-angle X-ray scattering metrology system

Similar Documents

Publication Publication Date Title
JP2020516900A5 (enExample)
TWI783988B (zh) 傳輸小角度x射線散射度量系統
JP2019536057A5 (enExample)
JP2019536057A (ja) Ｘ線スキャトロメトリシステムのフルビーム計測
JP2017512382A5 (enExample)
CN106644105B (zh) 基于双螺旋点扩散函数的波前传感器、探测方法及系统
TW201602568A (zh) Ｘ射線散射儀裝置
US11988495B2 (en) Through-focus image-based metrology device, operation method thereof, and computing device for executing the operation
US9568437B2 (en) Inspection device
KR20200088909A (ko) 계측 타깃 정보 내용 향상
JP2017504175A (ja) 電子ビームシステムを使用した関心領域の検査
CN114746991A (zh) 使用简化模型的基于断层摄影术的半导体测量
KR102090843B1 (ko) 웨이퍼 검사에 대한 확대된 결함 크기 범위
CN105241383A (zh) 一种光斑形状检测装置及方法
US10837919B2 (en) Single cell scatterometry overlay targets
KR102214370B1 (ko) 조리개 및 타겟의 회전된 경계선
US20120140245A1 (en) Image correlation displacement sensor
NL2018110A (en) A beam measurement system, a lithographic system, and a method
CN114674433B (zh) 太阳辐照度辐射计衍射效应修正系数的检测装置、方法
KR102373715B1 (ko) 방사선원 방향탐지장치 및 방법
JP6278457B2 (ja) 非破壊検査方法およびその装置
US11340179B2 (en) Nanofabricated structures for sub-beam resolution and spectral enhancement in tomographic imaging
JP3249639U (ja) 高信号分解能を有するｘ線計測システム
KR101607106B1 (ko) 나노구조체들 사이의 평균 간격 측정 시스템
JP2015194347A (ja) 距離測定装置および方法