JP2020515019A5 - - Google Patents

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Publication number
JP2020515019A5
JP2020515019A5 JP2019554476A JP2019554476A JP2020515019A5 JP 2020515019 A5 JP2020515019 A5 JP 2020515019A5 JP 2019554476 A JP2019554476 A JP 2019554476A JP 2019554476 A JP2019554476 A JP 2019554476A JP 2020515019 A5 JP2020515019 A5 JP 2020515019A5
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JP
Japan
Prior art keywords
cap layer
protective cap
silicon emitter
less
diameter
Prior art date
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Application number
JP2019554476A
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English (en)
Japanese (ja)
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JP2020515019A (ja
JP6860691B2 (ja
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Priority claimed from US15/588,006 external-priority patent/US10141155B2/en
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Publication of JP2020515019A publication Critical patent/JP2020515019A/ja
Publication of JP2020515019A5 publication Critical patent/JP2020515019A5/ja
Application granted granted Critical
Publication of JP6860691B2 publication Critical patent/JP6860691B2/ja
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JP2019554476A 2016-12-20 2017-12-18 ルテニウム被覆を有する電子ビーム放出器 Active JP6860691B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662436925P 2016-12-20 2016-12-20
US62/436,925 2016-12-20
US15/588,006 US10141155B2 (en) 2016-12-20 2017-05-05 Electron beam emitters with ruthenium coating
US15/588,006 2017-05-05
PCT/US2017/066969 WO2018118757A1 (en) 2016-12-20 2017-12-18 Electron beam emitters with ruthenium coating

Publications (3)

Publication Number Publication Date
JP2020515019A JP2020515019A (ja) 2020-05-21
JP2020515019A5 true JP2020515019A5 (https=) 2021-02-04
JP6860691B2 JP6860691B2 (ja) 2021-04-21

Family

ID=62562596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019554476A Active JP6860691B2 (ja) 2016-12-20 2017-12-18 ルテニウム被覆を有する電子ビーム放出器

Country Status (7)

Country Link
US (1) US10141155B2 (https=)
JP (1) JP6860691B2 (https=)
KR (1) KR102301555B1 (https=)
CN (1) CN110291609B (https=)
IL (1) IL267375B (https=)
TW (1) TWI731202B (https=)
WO (1) WO2018118757A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10607806B2 (en) 2017-10-10 2020-03-31 Kla-Tencor Corporation Silicon electron emitter designs
US10395884B2 (en) * 2017-10-10 2019-08-27 Kla-Tencor Corporation Ruthenium encapsulated photocathode electron emitter
US10714294B2 (en) 2018-05-25 2020-07-14 Kla-Tencor Corporation Metal protective layer for electron emitters with a diffusion barrier
US10714295B2 (en) 2018-09-18 2020-07-14 Kla-Tencor Corporation Metal encapsulated photocathode electron emitter
US11495428B2 (en) * 2019-02-17 2022-11-08 Kla Corporation Plasmonic photocathode emitters at ultraviolet and visible wavelengths
US11217416B2 (en) * 2019-09-27 2022-01-04 Kla Corporation Plasmonic photocathode emitters
US11719652B2 (en) * 2020-02-04 2023-08-08 Kla Corporation Semiconductor metrology and inspection based on an x-ray source with an electron emitter array
US11335529B2 (en) * 2020-06-19 2022-05-17 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Thermally enhanced compound field emitter
US11699564B2 (en) * 2020-10-23 2023-07-11 Nuflare Technology, Inc. Schottky thermal field emitter with integrated beam splitter

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5363021A (en) 1993-07-12 1994-11-08 Cornell Research Foundation, Inc. Massively parallel array cathode
DE69422234T2 (de) * 1993-07-16 2000-06-15 Matsushita Electric Industrial Co., Ltd. Verfahren zur Herstellung einer Feldemissionsanordnung
JP3239038B2 (ja) * 1995-04-03 2001-12-17 シャープ株式会社 電界放出型電子源の製造方法
EP0831512A4 (en) * 1995-06-09 1999-02-10 Toshiba Kk STORAGE CATHODE STRUCTURE, CATHODE SUBSTRATE FOR THIS STRUCTURE, ELECTRONIC CANNON STRUCTURE USING THIS STRUCTURE AND ELECTRON TUBE
JP3627836B2 (ja) * 1997-06-20 2005-03-09 ソニー株式会社 冷陰極の製造方法
JP3084272B2 (ja) * 1998-12-22 2000-09-04 松下電工株式会社 電界放射型電子源
US6911768B2 (en) * 2001-04-30 2005-06-28 Hewlett-Packard Development Company, L.P. Tunneling emitter with nanohole openings
JP2003288834A (ja) * 2002-03-27 2003-10-10 National Institute Of Advanced Industrial & Technology 電界放出型冷陰極
US7279686B2 (en) 2003-07-08 2007-10-09 Biomed Solutions, Llc Integrated sub-nanometer-scale electron beam systems
US7074719B2 (en) * 2003-11-28 2006-07-11 International Business Machines Corporation ALD deposition of ruthenium
US7465210B2 (en) 2004-02-25 2008-12-16 The Regents Of The University Of California Method of fabricating carbide and nitride nano electron emitters
US7735147B2 (en) 2005-10-13 2010-06-08 The Regents Of The University Of California Probe system comprising an electric-field-aligned probe tip and method for fabricating the same
KR101159074B1 (ko) * 2006-01-14 2012-06-25 삼성전자주식회사 도전성 탄소나노튜브 팁, 이를 구비한 스캐닝 프로브마이크로스코프의 탐침 및 상기 도전성 탄소나노튜브 팁의제조 방법
CN101105488B (zh) * 2006-07-14 2011-01-26 鸿富锦精密工业(深圳)有限公司 逸出功的测量方法
GB0722120D0 (en) * 2007-11-10 2007-12-19 Quantum Filament Technologies Improved field emission backplate
EP2680294B1 (en) 2011-02-25 2015-09-09 Param Corporation Electron gun and electron beam device
CN103367134B (zh) * 2013-08-08 2015-11-11 电子科技大学 一种基于金属钌修饰的多孔硅表面金属电极制备方法
KR101674972B1 (ko) * 2013-12-26 2016-11-10 한국과학기술원 나노 스케일 패터닝 방법 및 이로부터 제조된 전자기기용 집적소자
US9984846B2 (en) 2016-06-30 2018-05-29 Kla-Tencor Corporation High brightness boron-containing electron beam emitters for use in a vacuum environment

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