JP2020511827A - 容量性結合による本質的に安全な離間 - Google Patents
容量性結合による本質的に安全な離間 Download PDFInfo
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- JP2020511827A JP2020511827A JP2019547452A JP2019547452A JP2020511827A JP 2020511827 A JP2020511827 A JP 2020511827A JP 2019547452 A JP2019547452 A JP 2019547452A JP 2019547452 A JP2019547452 A JP 2019547452A JP 2020511827 A JP2020511827 A JP 2020511827A
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- 230000008878 coupling Effects 0.000 title claims description 10
- 238000010168 coupling process Methods 0.000 title claims description 10
- 238000005859 coupling reaction Methods 0.000 title claims description 10
- 238000000926 separation method Methods 0.000 title claims description 3
- 239000003990 capacitor Substances 0.000 claims abstract description 67
- 230000006854 communication Effects 0.000 claims abstract description 59
- 238000004891 communication Methods 0.000 claims abstract description 59
- 239000003989 dielectric material Substances 0.000 claims abstract description 7
- 238000009413 insulation Methods 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 13
- 230000004888 barrier function Effects 0.000 claims description 9
- 238000002955 isolation Methods 0.000 claims description 7
- 230000010355 oscillation Effects 0.000 claims description 3
- 230000007175 bidirectional communication Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 230000003287 optical effect Effects 0.000 description 9
- 238000004886 process control Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 239000011810 insulating material Substances 0.000 description 5
- 230000007704 transition Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 231100001261 hazardous Toxicity 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- AWJGUZSYVIVZGP-YUMQZZPRSA-N Pro-Val Chemical compound CC(C)[C@@H](C(O)=O)NC(=O)[C@@H]1CCCN1 AWJGUZSYVIVZGP-YUMQZZPRSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000135 prohibitive effect Effects 0.000 description 1
- 108010053725 prolylvaline Proteins 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03C—MODULATION
- H03C3/00—Angle modulation
- H03C3/42—Angle modulation by means of electromechanical devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/78—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used using opto-electronic devices, i.e. light-emitting and photoelectric devices electrically- or optically-coupled
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/0175—Coupling arrangements; Interface arrangements
- H03K19/017509—Interface arrangements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
- H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
- H03K3/027—Generators characterised by the type of circuit or by the means used for producing pulses by the use of logic circuits, with internal or external positive feedback
- H03K3/038—Multistable circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
- Dc Digital Transmission (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Computer Networks & Wireless Communication (AREA)
- Business, Economics & Management (AREA)
- Emergency Management (AREA)
- General Physics & Mathematics (AREA)
- Emergency Protection Circuit Devices (AREA)
Abstract
Description
Claims (20)
- 装置であって、
本質的に安全な物理的離間仕様に準拠した厚さを有するプリント回路基板と、
前記プリント回路基板の両側面に配置され且つ第1のコンデンサを形成するように配設された第1の容量性プレート対と、ここで、前記第1のコンデンサは、前記第1のコンデンサのための誘電材料を形成する前記プリント回路基板の絶縁層を有する、
前記プリント回路基板の両側面に配置され且つ第2のコンデンサを形成するように配置された第2の容量性プレート対と、ここで、前記第2のコンデンサは、前記第2のコンデンサのための誘電材料を形成する前記プリント回路基板の絶縁層を有する、
前記第1及び第2のコンデンサに結合された変調器と、ここで、前記変調器は、入力信号周波数を有する入力信号を受信し、前記入力信号よりも高い周波数を有する変調信号を提供するように構成されている、
前記第1及び第2のコンデンサに結合された復調器と、ここで、前記復調器は、前記変調信号を検出し、前記入力信号周波数を有する復調信号を提供するように構成されている、
を備えている、
上記装置。 - 前記変調器は、前記入力信号よりも少なくとも10倍大きい周波数を有する前記変調信号を提供するように構成されている、請求項1に記載の装置。
- 前記第1の容量性プレート対の各々は、約0.20インチ×0.20インチのサイズを有する、請求項1に記載の装置。
- 前記第1の容量性プレート対の各々は、0.04平方インチの面積を有する、請求項1に記載の装置。
- 前記プリント回路基板は、少なくとも0.2mmの厚さを有する、請求項1に記載の装置。
- 前記プリント回路基板は、0.5mmの厚さを有する、請求項1に記載の装置。
- 前記第1のコンデンサは、約2.0pFの静電容量を有する、請求項6に記載の装置。
- 前記プリント回路基板は、FR−4プリント回路基板材料で形成される、請求項1に記載の装置。
- 前記変調器は、発振回路を含む、請求項1に記載の装置。
- 前記発振回路は、マルチバイブレータである、請求項9に記載の装置。
- 前記発振回路は、前記入力信号が低位状態にあるときに発振するように構成される、請求項10に記載の装置。
- 前記入力信号は、約28kHzの周波数を有する、請求項1に記載の装置。
- 前記復調器は、シュミットトリガバッファを駆動するトランジスタを含む、請求項1に記載の装置。
- 前記復調器は、1.0pF未満のエミッタ容量を有するトランジスタを有する、請求項13に記載の装置。
- 前記プリント回路基板の両側面に配置され且つ第3のコンデンサを形成するように配設された第3の容量性プレート対をさらに備え、前記第3のコンデンサは、前記第3のコンデンサの誘電材料を形成する前記プリント回路基板の絶縁層を有する、請求項1に記載の装置。
- 絶縁障壁を横断して通信信号を伝達する方法であって、
入力信号周波数を有する入力信号を提供すること、
入力信号を、前記入力信号の周波数よりも高い変調周波数を有する変調信号に変調すること、
前記絶縁障壁を提供するプリント回路基板の絶縁層を介して前記変調信号を容量性結合すること、及び
前記信号が前記プリント回路基板の前記絶縁層を通過した後に、前記変調信号を復調すること、
を包含している、
上記方法。 - 前記入力信号周波数は、約28kHzである、請求項16に記載の方法。
- 前記絶縁障壁を横断する通信は、双方向通信である、請求項16に記載の方法。
- 前記変調信号は、前記入力信号が一つの状態にある場合にのみ、前記変調信号周波数での振動を含む、請求項16に記載の方法。
- 前記状態は低位状態である、請求項19に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/446,459 | 2017-03-01 | ||
US15/446,459 US9990837B1 (en) | 2017-03-01 | 2017-03-01 | Intrinsic safety isolation with capacitive coupling |
PCT/US2018/018324 WO2018160363A1 (en) | 2017-03-01 | 2018-02-15 | Intrinsic safety isolation with capacitive coupling |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020511827A true JP2020511827A (ja) | 2020-04-16 |
JP7035071B2 JP7035071B2 (ja) | 2022-03-14 |
Family
ID=62235445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019547452A Active JP7035071B2 (ja) | 2017-03-01 | 2018-02-15 | 容量性結合による本質的に安全な離間 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9990837B1 (ja) |
EP (1) | EP3590240A4 (ja) |
JP (1) | JP7035071B2 (ja) |
CN (2) | CN207505204U (ja) |
WO (1) | WO2018160363A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9990837B1 (en) * | 2017-03-01 | 2018-06-05 | Rosemount Inc. | Intrinsic safety isolation with capacitive coupling |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57173329U (ja) * | 1981-04-28 | 1982-11-01 | ||
JPH098427A (ja) * | 1995-06-19 | 1997-01-10 | Canon Inc | コンデンサ内蔵プリント基板 |
WO1998044687A1 (fr) * | 1997-03-31 | 1998-10-08 | Hitachi, Ltd. | Modem utilisant une barriere isolante capacitive et un coupleur insolant, et circuit integre utilise par ce modem |
JP2000163551A (ja) * | 1998-11-30 | 2000-06-16 | Lintec Corp | カード用基板およびその製造方法 |
JP2003523699A (ja) * | 2000-02-18 | 2003-08-05 | サイパック アクチボラゲット | 電気信号の二方向無線伝送システム |
US20130301690A1 (en) * | 2012-05-09 | 2013-11-14 | Rameswor Shrestha | Capacitive isolated voltage domains |
JP2016072810A (ja) * | 2014-09-30 | 2016-05-09 | 株式会社東芝 | 信号伝送装置、受信装置、および無線通信装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
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US7016490B2 (en) * | 2001-05-21 | 2006-03-21 | Conexant Systems, Inc. | Circuit board capacitor structure for forming a high voltage isolation barrier |
US7031458B2 (en) * | 2001-10-30 | 2006-04-18 | Integration Associates Inc. | Method and apparatus for isolation in a data access arrangement using analog encoded pulse signaling |
WO2009154748A2 (en) | 2008-06-17 | 2009-12-23 | Rosemount Inc. | Rf adapter for field device with low voltage intrinsic safety clamping |
US8966749B2 (en) * | 2008-10-28 | 2015-03-03 | Samsung Sdi Co., Ltd. | Manufacturing method for protection circuit module of secondary battery |
US20120049834A1 (en) * | 2009-05-07 | 2012-03-01 | The Curators Of The University Of Missouri | Circuit and method to suppress the parasitic resonance from a dc/dc converter |
US8660489B2 (en) * | 2010-01-29 | 2014-02-25 | Infineon Technologies Austria Ag | System and method for receiving data across an isolation barrier |
KR101676003B1 (ko) * | 2010-06-09 | 2016-11-14 | 삼성전자주식회사 | 무선주파수인식 태그 및 그것의 신호 수신 방법 |
US8848390B2 (en) * | 2011-02-16 | 2014-09-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Capacitive proximity communication using tuned-inductor |
US8610358B2 (en) * | 2011-08-17 | 2013-12-17 | Express Imaging Systems, Llc | Electrostatic discharge protection for luminaire |
US9106270B2 (en) * | 2012-10-02 | 2015-08-11 | Covidien Lp | Transmitting data across a patient isolation barrier using an electric-field capacitive coupler module |
US10075246B2 (en) | 2013-09-26 | 2018-09-11 | Micro Motion, Inc. | Optical isolator mounted in printed circuit board recess |
JP6395433B2 (ja) * | 2014-05-07 | 2018-09-26 | ローム株式会社 | モータ駆動回路およびそれを用いた冷却装置、電子機器 |
US9990837B1 (en) * | 2017-03-01 | 2018-06-05 | Rosemount Inc. | Intrinsic safety isolation with capacitive coupling |
-
2017
- 2017-03-01 US US15/446,459 patent/US9990837B1/en active Active
- 2017-04-20 CN CN201720423600.8U patent/CN207505204U/zh not_active Expired - Fee Related
- 2017-04-20 CN CN201710263263.5A patent/CN108541126B/zh active Active
-
2018
- 2018-02-15 JP JP2019547452A patent/JP7035071B2/ja active Active
- 2018-02-15 WO PCT/US2018/018324 patent/WO2018160363A1/en unknown
- 2018-02-15 EP EP18761943.2A patent/EP3590240A4/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57173329U (ja) * | 1981-04-28 | 1982-11-01 | ||
JPH098427A (ja) * | 1995-06-19 | 1997-01-10 | Canon Inc | コンデンサ内蔵プリント基板 |
WO1998044687A1 (fr) * | 1997-03-31 | 1998-10-08 | Hitachi, Ltd. | Modem utilisant une barriere isolante capacitive et un coupleur insolant, et circuit integre utilise par ce modem |
JP2000163551A (ja) * | 1998-11-30 | 2000-06-16 | Lintec Corp | カード用基板およびその製造方法 |
JP2003523699A (ja) * | 2000-02-18 | 2003-08-05 | サイパック アクチボラゲット | 電気信号の二方向無線伝送システム |
US20130301690A1 (en) * | 2012-05-09 | 2013-11-14 | Rameswor Shrestha | Capacitive isolated voltage domains |
JP2016072810A (ja) * | 2014-09-30 | 2016-05-09 | 株式会社東芝 | 信号伝送装置、受信装置、および無線通信装置 |
Also Published As
Publication number | Publication date |
---|---|
EP3590240A1 (en) | 2020-01-08 |
CN207505204U (zh) | 2018-06-15 |
CN108541126A (zh) | 2018-09-14 |
CN108541126B (zh) | 2021-10-29 |
JP7035071B2 (ja) | 2022-03-14 |
WO2018160363A1 (en) | 2018-09-07 |
US9990837B1 (en) | 2018-06-05 |
EP3590240A4 (en) | 2020-12-09 |
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