JP2020508568A5 - - Google Patents
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- JP2020508568A5 JP2020508568A5 JP2019544642A JP2019544642A JP2020508568A5 JP 2020508568 A5 JP2020508568 A5 JP 2020508568A5 JP 2019544642 A JP2019544642 A JP 2019544642A JP 2019544642 A JP2019544642 A JP 2019544642A JP 2020508568 A5 JP2020508568 A5 JP 2020508568A5
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- JP
- Japan
- Prior art keywords
- light
- illumination
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- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005286 illumination Methods 0.000 claims 97
- 238000005259 measurement Methods 0.000 claims 34
- 238000005303 weighing Methods 0.000 claims 21
- 238000000034 method Methods 0.000 claims 20
- 239000002131 composite material Substances 0.000 claims 13
- 238000012423 maintenance Methods 0.000 claims 10
- 230000003287 optical effect Effects 0.000 claims 8
- 206010034960 Photophobia Diseases 0.000 claims 4
- 239000006185 dispersion Substances 0.000 claims 4
- 230000001747 exhibiting effect Effects 0.000 claims 3
- 230000010365 information processing Effects 0.000 claims 3
- 230000003595 spectral effect Effects 0.000 claims 3
- 230000005540 biological transmission Effects 0.000 claims 2
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims 2
- 229910001634 calcium fluoride Inorganic materials 0.000 claims 2
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 claims 2
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 claims 2
- 229910001635 magnesium fluoride Inorganic materials 0.000 claims 2
- 238000001228 spectrum Methods 0.000 claims 2
- 238000001514 detection method Methods 0.000 claims 1
- 208000013469 light sensitivity Diseases 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762460668P | 2017-02-17 | 2017-02-17 | |
| US62/460,668 | 2017-02-17 | ||
| US15/896,978 US10690602B2 (en) | 2017-02-17 | 2018-02-14 | Methods and systems for measurement of thick films and high aspect ratio structures |
| US15/896,978 | 2018-02-14 | ||
| PCT/US2018/018457 WO2018152382A1 (en) | 2017-02-17 | 2018-02-16 | Methods and systems for measurement of thick films and high aspect ratio structures |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020508568A JP2020508568A (ja) | 2020-03-19 |
| JP2020508568A5 true JP2020508568A5 (cg-RX-API-DMAC10.html) | 2021-05-06 |
| JP7181211B2 JP7181211B2 (ja) | 2022-11-30 |
Family
ID=63167040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019544642A Active JP7181211B2 (ja) | 2017-02-17 | 2018-02-16 | 厚膜及び高アスペクト比構造の計測方法及びシステム |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10690602B2 (cg-RX-API-DMAC10.html) |
| EP (1) | EP3563408B1 (cg-RX-API-DMAC10.html) |
| JP (1) | JP7181211B2 (cg-RX-API-DMAC10.html) |
| KR (1) | KR102629264B1 (cg-RX-API-DMAC10.html) |
| CN (1) | CN110313059B (cg-RX-API-DMAC10.html) |
| WO (1) | WO2018152382A1 (cg-RX-API-DMAC10.html) |
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| CN105091788B (zh) * | 2014-05-06 | 2017-11-07 | 北京智朗芯光科技有限公司 | 自动实时快速检测晶片基底二维形貌的装置 |
| US11327012B2 (en) * | 2018-05-07 | 2022-05-10 | Unm Rainforest Innovations | Method and system for in-line optical scatterometry |
| US11231362B1 (en) * | 2018-12-20 | 2022-01-25 | Kla Corporation | Multi-environment polarized infrared reflectometer for semiconductor metrology |
| US11581264B2 (en) | 2019-08-21 | 2023-02-14 | Micron Technology, Inc. | Electronic devices comprising overlay marks, memory devices comprising overlay marks, and related methods |
| WO2021083581A1 (en) * | 2019-10-31 | 2021-05-06 | Carl Zeiss Smt Gmbh | Fib-sem 3d tomography for measuring shape deviations of high aspect ratio structures |
| US11099002B2 (en) * | 2019-12-09 | 2021-08-24 | General Electric Company | Systems and methods of assessing a coating microstructure |
| LU101529B1 (de) * | 2019-12-12 | 2021-06-15 | Aim Systems Gmbh | Vorrichtung und Verfahren zur Bestimmung einer Materialeigenschaft eines Prüfkörpers in einem oberflächennahen Prüfkörperbereich |
| CN114902142B (zh) * | 2019-12-30 | 2025-05-02 | Asml荷兰有限公司 | 光刻设备、量测系统、照射源及其方法 |
| KR102801221B1 (ko) * | 2020-04-29 | 2025-04-30 | 삼성전자주식회사 | 웨이퍼 검사 장치 및 방법 |
| WO2021259618A1 (en) * | 2020-06-23 | 2021-12-30 | Asml Holding N.V. | Lithographic apparatus, metrology systems, illumination switches and methods thereof |
| US12205040B2 (en) * | 2020-10-16 | 2025-01-21 | Samsung Electronics Co., Ltd. | Method of training deep learning model for predicting pattern characteristics and method of manufacturing semiconductor device |
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| EP4016186A1 (en) | 2020-12-18 | 2022-06-22 | ASML Netherlands B.V. | Metrology method for measuring an etched trench and associated metrology apparatus |
| CN112786603B (zh) * | 2021-02-03 | 2021-12-03 | 长江存储科技有限责任公司 | 3d存储器件及其量测方法、薄膜量测装置 |
| TWI801149B (zh) * | 2021-02-25 | 2023-05-01 | 國立臺灣大學 | 線形掃描彩色共焦量測系統 |
| US12111580B2 (en) * | 2021-03-11 | 2024-10-08 | Kla Corporation | Optical metrology utilizing short-wave infrared wavelengths |
| CN114460002A (zh) * | 2022-01-25 | 2022-05-10 | 北京量拓科技有限公司 | 一种小入射角的多波段反射系统及其使用方法 |
| US12461041B2 (en) | 2022-04-20 | 2025-11-04 | Kla Corporation | Measurement of thick films and high aspect ratio structures |
| CN115560953B (zh) * | 2022-09-06 | 2026-08-04 | 深圳瑞波光电子有限公司 | 一种半导体激光器的测试系统和测试方法 |
| US12532710B2 (en) | 2022-12-02 | 2026-01-20 | KLA Coporation | Measurements of semiconductor structures based on spectral differences at different process steps |
| CN116518851A (zh) * | 2023-03-31 | 2023-08-01 | 江苏匠岭半导体有限公司 | 光学测量组件、半导体光学膜厚和线宽测量装置与方法 |
| US12449352B2 (en) | 2023-06-15 | 2025-10-21 | Kla Corporation | Optics for measurement of thick films and high aspect ratio structures |
| US20250076185A1 (en) * | 2023-08-31 | 2025-03-06 | Kla Corporation | Angle Of Incidence And Azimuth Angle Resolved Spectroscopic Ellipsometry For Semiconductor Metrology |
| US12693228B2 (en) * | 2024-03-12 | 2026-07-28 | General Electric Company | Electromagnetic inspection systems and methods |
| US12704407B2 (en) | 2024-04-30 | 2026-08-11 | Applied Materials, Inc. | Substrate measurement systems having substrate holders |
| US12707939B2 (en) | 2024-04-30 | 2026-08-11 | Applied Materials, Inc. | Substrate holder systems |
| CN118464843B (zh) * | 2024-07-10 | 2024-11-15 | 杭州积海半导体有限公司 | 散射测量方法及散射测量装置 |
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| US5808738A (en) | 1995-06-13 | 1998-09-15 | University Of South Florida | Multiangle, multiwavelength particle characterization system and method |
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| US10887974B2 (en) | 2015-06-22 | 2021-01-05 | Kla Corporation | High efficiency laser-sustained plasma light source |
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| US9921152B2 (en) * | 2016-01-15 | 2018-03-20 | Kla-Tencor Corporation | Systems and methods for extended infrared spectroscopic ellipsometry |
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-
2018
- 2018-02-14 US US15/896,978 patent/US10690602B2/en active Active
- 2018-02-16 KR KR1020197026984A patent/KR102629264B1/ko active Active
- 2018-02-16 CN CN201880012604.4A patent/CN110313059B/zh active Active
- 2018-02-16 JP JP2019544642A patent/JP7181211B2/ja active Active
- 2018-02-16 EP EP18754674.2A patent/EP3563408B1/en active Active
- 2018-02-16 WO PCT/US2018/018457 patent/WO2018152382A1/en not_active Ceased
-
2020
- 2020-05-20 US US16/879,531 patent/US11119050B2/en active Active
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