JP2020506508A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2020506508A5 JP2020506508A5 JP2019539275A JP2019539275A JP2020506508A5 JP 2020506508 A5 JP2020506508 A5 JP 2020506508A5 JP 2019539275 A JP2019539275 A JP 2019539275A JP 2019539275 A JP2019539275 A JP 2019539275A JP 2020506508 A5 JP2020506508 A5 JP 2020506508A5
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- heater
- welding
- heater assembly
- metal layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 description 25
- 239000002184 metal Substances 0.000 description 25
- 238000003466 welding Methods 0.000 description 10
- 238000010894 electron beam technology Methods 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/411,896 US20180213608A1 (en) | 2017-01-20 | 2017-01-20 | Electrostatic chuck with radio frequency isolated heaters |
| US15/411,896 | 2017-01-20 | ||
| PCT/US2018/013631 WO2018136335A1 (en) | 2017-01-20 | 2018-01-12 | Electrostatic chuck with radio frequency isolated heaters |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020506508A JP2020506508A (ja) | 2020-02-27 |
| JP2020506508A5 true JP2020506508A5 (enExample) | 2021-02-25 |
Family
ID=62906927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019539275A Pending JP2020506508A (ja) | 2017-01-20 | 2018-01-12 | 高周波隔離ヒータを有する静電チャック |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20180213608A1 (enExample) |
| JP (1) | JP2020506508A (enExample) |
| KR (1) | KR20190100976A (enExample) |
| CN (1) | CN110226222B (enExample) |
| TW (1) | TWI799403B (enExample) |
| WO (1) | WO2018136335A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020076441A1 (en) * | 2018-10-12 | 2020-04-16 | Applied Materials, Inc. | Chamber lid with integrated heater |
| KR102164132B1 (ko) * | 2018-11-28 | 2020-10-12 | 한국생산기술연구원 | 멀티 프로버용 척 조립체 및 채널 |
| WO2020126807A1 (en) | 2018-12-21 | 2020-06-25 | Asml Holding N.V. | Reticle sub-field thermal control |
| KR102850304B1 (ko) * | 2019-06-10 | 2025-08-25 | 램 리써치 코포레이션 | 광섬유를 통한 플라즈마 챔버들의 기판 지지부로 전력 및 데이터 송신 |
| CN112992635B (zh) * | 2019-12-13 | 2023-10-24 | 中微半导体设备(上海)股份有限公司 | 一种晶圆固定装置及其形成方法、等离子体处理设备 |
| JP7561867B2 (ja) * | 2020-03-31 | 2024-10-04 | アプライド マテリアルズ インコーポレイテッド | 高温マイクロゾーン静電チャック |
| KR102677038B1 (ko) * | 2020-05-22 | 2024-06-19 | 세메스 주식회사 | 정전 척과 그 제조 방법 및 기판 처리 장치 |
| CN211957596U (zh) * | 2020-05-28 | 2020-11-17 | 北京鲁汶半导体科技有限公司 | 一种等离子体刻蚀系统及其可用于加热的法拉第屏蔽装置 |
| US12581880B2 (en) | 2022-11-02 | 2026-03-17 | Applied Materials, Inc. | Faraday faceplate |
| WO2025205043A1 (ja) * | 2024-03-28 | 2025-10-02 | 東京エレクトロン株式会社 | プラズマ処理装置及び基板支持台 |
| CN119626881B (zh) * | 2024-11-22 | 2026-05-08 | 北京北方华创微电子装备有限公司 | 半导体工艺设备 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5192849A (en) * | 1990-08-10 | 1993-03-09 | Texas Instruments Incorporated | Multipurpose low-thermal-mass chuck for semiconductor processing equipment |
| US5962923A (en) * | 1995-08-07 | 1999-10-05 | Applied Materials, Inc. | Semiconductor device having a low thermal budget metal filling and planarization of contacts, vias and trenches |
| US6519835B1 (en) * | 2000-08-18 | 2003-02-18 | Watlow Polymer Technologies | Method of formable thermoplastic laminate heated element assembly |
| US7544251B2 (en) * | 2004-10-07 | 2009-06-09 | Applied Materials, Inc. | Method and apparatus for controlling temperature of a substrate |
| US20090152276A1 (en) * | 2004-10-07 | 2009-06-18 | All-Clad Metalcrafters Llc | Griddle Plate and Cookware Having a Vacuum Bonded, High Conductivity, Low Density Carbon Foam Core Plate |
| US20070181065A1 (en) * | 2006-02-09 | 2007-08-09 | General Electric Company | Etch resistant heater and assembly thereof |
| US20080066683A1 (en) * | 2006-09-19 | 2008-03-20 | General Electric Company | Assembly with Enhanced Thermal Uniformity and Method For Making Thereof |
| KR101554123B1 (ko) * | 2008-03-21 | 2015-09-18 | 어플라이드 머티어리얼스, 인코포레이티드 | 차폐식 리드 히터 조립체 |
| US8461674B2 (en) * | 2011-09-21 | 2013-06-11 | Lam Research Corporation | Thermal plate with planar thermal zones for semiconductor processing |
| WO2013078434A1 (en) * | 2011-11-24 | 2013-05-30 | Lam Research Corporation | Plasma processing chamber with flexible symmetric rf return strap |
| US8937800B2 (en) * | 2012-04-24 | 2015-01-20 | Applied Materials, Inc. | Electrostatic chuck with advanced RF and temperature uniformity |
| US9404176B2 (en) * | 2012-06-05 | 2016-08-02 | Applied Materials, Inc. | Substrate support with radio frequency (RF) return path |
| US9984866B2 (en) * | 2012-06-12 | 2018-05-29 | Component Re-Engineering Company, Inc. | Multiple zone heater |
| KR101584042B1 (ko) * | 2012-06-14 | 2016-01-08 | 스카이워크스 솔루션즈, 인코포레이티드 | 관련된 시스템, 장치, 및 방법을 포함하는 전력 증폭기 모듈 |
| US9685356B2 (en) * | 2012-12-11 | 2017-06-20 | Applied Materials, Inc. | Substrate support assembly having metal bonded protective layer |
| US10177014B2 (en) * | 2012-12-14 | 2019-01-08 | Applied Materials, Inc. | Thermal radiation barrier for substrate processing chamber components |
| US8941969B2 (en) * | 2012-12-21 | 2015-01-27 | Applied Materials, Inc. | Single-body electrostatic chuck |
| TW201448108A (zh) * | 2013-03-12 | 2014-12-16 | 應用材料股份有限公司 | 用於電漿處理腔室的多重區域加熱及冷卻靜電夾盤 |
| CN104332378B (zh) * | 2013-07-22 | 2016-09-07 | 中微半导体设备(上海)有限公司 | 等离子体处理装置及其温度测试装置 |
| KR20160058917A (ko) * | 2013-09-20 | 2016-05-25 | 어플라이드 머티어리얼스, 인코포레이티드 | 통합된 정전 척을 갖는 기판 캐리어 |
| US9853579B2 (en) * | 2013-12-18 | 2017-12-26 | Applied Materials, Inc. | Rotatable heated electrostatic chuck |
| JP6527524B2 (ja) * | 2014-02-07 | 2019-06-05 | インテグリス・インコーポレーテッド | 静電チャックおよびその作製方法 |
| US11158526B2 (en) * | 2014-02-07 | 2021-10-26 | Applied Materials, Inc. | Temperature controlled substrate support assembly |
| JP6335341B2 (ja) * | 2014-07-23 | 2018-05-30 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 可変型温度制御式基板支持アセンブリ |
-
2017
- 2017-01-20 US US15/411,896 patent/US20180213608A1/en not_active Abandoned
-
2018
- 2018-01-12 CN CN201880007192.5A patent/CN110226222B/zh active Active
- 2018-01-12 KR KR1020197024206A patent/KR20190100976A/ko not_active Ceased
- 2018-01-12 JP JP2019539275A patent/JP2020506508A/ja active Pending
- 2018-01-12 WO PCT/US2018/013631 patent/WO2018136335A1/en not_active Ceased
- 2018-01-16 TW TW107101531A patent/TWI799403B/zh active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10052710B2 (en) | Resistance spot welding steel and aluminum workpieces using electrode weld face cover | |
| JP6833733B2 (ja) | 互いに直接溶接することが不可能な金属系材料をスペーサーを使って溶接する方法 | |
| JPWO2016159169A1 (ja) | めっき鋼板のスポット溶接方法 | |
| RU2018106439A (ru) | Титановый материал для горячей прокатки | |
| US20090129551A1 (en) | Electrode for X-ray apparatus | |
| WO2019102794A1 (ja) | 発熱部材 | |
| Brumm et al. | Gas metal arc pulse welding with alternating current for lightweight materials | |
| JP6525793B2 (ja) | 試料保持具 | |
| Devakumaran et al. | Variation of chemical composition of high strength low alloy steels with different groove sizes in multi-pass conventional and pulsed current gas metal arc weld depositions | |
| US2345758A (en) | Arc welding | |
| CN103857492B (zh) | 产生少量金属粉尘的波纹管焊接用冷却环 | |
| Patil et al. | Al2O3 and TiO2 flux enabling activated tungsten inert gas welding of 304 austenitic stainless steel plates | |
| JP6053977B2 (ja) | 円筒型スパッタリングターゲット | |
| JP6298247B2 (ja) | 抵抗溶接用電極 | |
| Singla et al. | Mechanical properties study of copper/stainless steel dissimilar weld joints | |
| CN105316628B (zh) | 成膜装置 | |
| JP2017045980A (ja) | 電子部品パッケージ | |
| JPWO2023085410A5 (enExample) | ||
| Yılmaz et al. | Improving the surface properties of Cp-Ti by pulsed electro-spark deposition | |
| JP2012204805A (ja) | ボンディングワイヤ | |
| Park et al. | Effect of welding condition on microstructures of weld metal and mechanical properties in Plasma-MIG hybrid welding for Al 5083 alloy | |
| JP2011016200A5 (enExample) | ||
| Akunuru et al. | Experimental investigations on welding characteristics of aluminum alloy (6082) weldments, using pulsed and non-pulsed current GTAW | |
| CN109382568A (zh) | 部件的制造方法 | |
| Badwal et al. | Mathematical Modeling to Predict Angular Distortion in Duplex Stainless |