JP2020194897A - Imaging unit and processing device - Google Patents

Abstract

To image an object to be imaged at the time of imaging.SOLUTION: A cutting device 1 includes a holding table that holds a workpiece, a cutting unit that processes the workpiece held on the holding table, and an imaging unit 30 that images the workpiece held on the holding table. The imaging unit 30 includes a housing 34 that accommodates an objective lens 31 facing the workpiece and has an opening 33 formed in the bottom 32 facing the workpiece, a protective plate 35 made of a transparent material covering the opening 33, and cleaning fluid supply means 70 that supplies cleaning fluid to the lower surface 37 of the protective plate 35.SELECTED DRAWING: Figure 3

Description

The present invention relates to an imaging unit and a processing apparatus.

As a processing device for dividing a work piece into individual devices, a cutting device for cutting a work piece with a cutting blade along a planned division line is used (see, for example, Patent Document 1). The cutting device includes an imaging unit that performs alignment for aligning the cutting blade and the scheduled division line, and images an image of the workpiece in order to confirm the machining result.

Japanese Unexamined Patent Publication No. 2007-88361

The image pickup unit of the cutting apparatus described in Patent Document 1 and the like includes a housing containing an objective lens facing the work piece and a shielding mechanism for opening and closing an opening below the case, and images the work piece. When this is done, the shielding member of the shielding mechanism opens the opening of the housing, the shielding member closes the opening of the housing except during imaging, and the objective lens is shielded so that the cutting water containing cutting debris becomes the objective lens. Prevents sticking.

However, in the image pickup unit of the cutting apparatus described in Patent Document 1 and the like, when the opening is opened by the shielding mechanism, mist-like cutting water containing cutting chips enters the housing of the image pickup unit through the opening and adheres to the objective lens. There is a risk of

Further, in the image pickup unit of the cutting device described in Patent Document 1 and the like, there is a possibility that the shielding member may open and close poorly due to a failure of the cylinder which is a driving source of the shielding mechanism or the accumulation of foreign matter on the piston rod or the like. In particular, if opening / closing failure occurs during imaging, there is a risk that the workpiece to be imaged cannot be imaged.

The present invention has been made in view of such a problem, and an object of the present invention is to provide an imaging unit and a processing device capable of imaging an image-imaging object at the time of imaging.

In order to solve the above-mentioned problems and achieve the object, the imaging unit of the present invention is an imaging unit including a housing including an objective lens facing the imaging target, and the housing is used as an imaging target. An opening is formed in the facing bottom portion, and a protective plate made of a transparent body covering the opening and a cleaning fluid supply means for supplying the cleaning fluid to the protective plate are provided.

The processing apparatus of the present invention includes a holding table for holding a work piece, a processing means for processing the work piece held by the holding table, and an imaging unit for imaging a work piece held by the holding table. The imaging unit includes an objective lens facing an imaging object and has an opening formed at the bottom facing the imaging object, and a transparent body covering the opening. The protective plate is provided with a cleaning fluid supply means for supplying the cleaning fluid to the protective plate.

In the processing apparatus, the processing means has a cutting blade, and the cleaning fluid supply means includes a cleaning water supply nozzle for supplying cleaning water to the protective plate and an air supply nozzle for supplying dry air to the protective plate. , May have.

The processing apparatus includes a laser oscillator and a concentrator that collects a laser beam oscillated by the laser oscillator on a work piece held by the holding table, and the cleaning device has the cleaning device. The fluid supply means may have an air supply nozzle that supplies dry air to the protective plate.

The invention of the present application has an effect that an object to be imaged can be imaged at the time of imaging.

FIG. 1 is a perspective view showing a configuration example of a cutting device which is a processing device according to the first embodiment. FIG. 2 is a perspective view showing a work piece to be machined by the cutting apparatus shown in FIG. FIG. 3 is a side view showing a partial cross section of the image pickup unit of the cutting apparatus shown in FIG. FIG. 4 is a plan view of the imaging unit shown in FIG. 3 as viewed from below. FIG. 5 is a cross-sectional view of a main part of the imaging unit during cutting of the cutting apparatus shown in FIG. FIG. 6 is a side view showing a partial cross section showing the positional relationship between the cutting unit of the cutting apparatus shown in FIG. 1 and the imaging unit. FIG. 7 is a side view showing a partial cross-sectional view of the positional relationship between the cutting unit and the imaging unit of the cutting device which is the processing device according to the modified example of the first embodiment. FIG. 8 is a perspective view showing a configuration example of a laser processing apparatus, which is a processing apparatus according to the second embodiment. FIG. 9 is a side view showing a partial cross section of the imaging unit of the laser processing apparatus shown in FIG.

An embodiment (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Further, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions or changes of the configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
The imaging unit and the processing apparatus according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of a cutting device which is a processing device according to the first embodiment. FIG. 2 is a perspective view showing a work piece to be machined by the cutting apparatus shown in FIG. FIG. 3 is a side view showing a partial cross section of the image pickup unit of the cutting apparatus shown in FIG. FIG. 4 is a plan view of the imaging unit shown in FIG. 3 as viewed from below. FIG. 5 is a cross-sectional view of a main part of the imaging unit during cutting of the cutting apparatus shown in FIG. FIG. 6 is a side view showing a partial cross section showing the positional relationship between the cutting unit of the cutting apparatus shown in FIG. 1 and the imaging unit.

(Workpiece)
The cutting device 1 which is the processing device shown in FIG. 1 according to the first embodiment is a device which cuts the work piece 200, which is the object to be imaged shown in FIG. 2, with a cutting blade 21 and divides it into individual devices 204. is there. In the first embodiment, the workpiece 200 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer whose substrate 201 is silicon, sapphire, gallium, or the like. In the workpiece 200, the device 204 is formed in a region partitioned in a grid pattern by a plurality of scheduled division lines 203 formed in a grid pattern on the surface 202 of the substrate 201.

Further, the workpiece 200 of the present invention may be a so-called TAIKO (registered trademark) wafer in which a central portion is thinned and a thick portion is formed on an outer peripheral portion. In addition to the wafer, a device sealed with a resin is used. A rectangular package substrate having a plurality of wafers, a ceramics substrate on which the device 204 and the planned division line 203 are not set, a ferrite substrate, a glass plate, or a substrate containing at least one of nickel and iron may be used. In the first embodiment, the workpiece 200 is supported by the annular frame 210 by attaching an adhesive tape 211 to which the annular frame 210 is attached to the outer peripheral edge of the back surface 205.

(Cutting equipment)
As shown in FIG. 1, the cutting apparatus 1 which is the processing apparatus according to the first embodiment holds a holding table 10 for sucking and holding the workpiece 200 on the holding surface 11 and a workpiece 200 held by the holding table 10. A cutting unit 20 which is a processing means for cutting (corresponding to processing) with a cutting blade 21 mounted on a spindle 22, an imaging unit 30 for imaging a workpiece 200 held by a holding table 10, a holding table 10 and cutting. It has at least a moving unit 40 which is a moving means for relatively moving the unit 20 and a control unit 100 which is a controlling means for controlling each component.

The moving unit 40 has a rotation drive source 41 that rotates the holding table 10 around the axis parallel to the Z-axis direction parallel to the vertical direction, and an X-axis that processes and feeds the holding table 10 in the X-axis direction parallel to the horizontal direction. The moving unit 42, the Y-axis moving unit 43 that indexed and feeds the cutting unit 20 in the Y-axis direction parallel to the horizontal direction and orthogonal to the X-axis direction, and the Z-axis moving unit that cuts and feeds the cutting unit 20 in the Z-axis direction. At least with 44.

The holding table 10 has a disk shape in which the holding surface 11 for holding the workpiece 200 is formed of porous ceramic or the like. Further, the holding table 10 is rotatably provided in the X-axis direction by the X-axis moving unit 42 and rotatably around the axis parallel to the Z-axis direction by the rotation drive source 41. In the holding table 10, a holding surface 11 formed of porous ceramic or the like is connected to a vacuum suction source (not shown). In the holding table 10, the workpiece 200 integrated with the annular frame 210 is placed on the holding surface 11 via the adhesive tape 211, and the holding surface 11 is sucked by the vacuum suction source, whereby the ring frame 210 is placed. The integrated workpiece 200 is sucked and held. Further, although the holding table 10 is omitted in FIG. 1, the holding table 10 includes a clamp portion 12 that clamps the annular frame 210 around the holding surface 11.

The cutting unit 20 is a unit in which a cutting blade 21 for cutting the workpiece 200 held on the holding table 10 is rotatably mounted. The cutting unit 20 is provided with the cutting blade 21, the spindle 22 on which the cutting blade 21 is mounted, and the spindle 22 rotatably supported and movably provided in the Y-axis direction by the Y-axis moving unit 43, and the Z-axis moving unit 44. The spindle housing 23 is provided so as to be movable in the Z-axis direction, and the cutting water nozzle 24 for supplying cutting water to the cutting blade 21 is provided. Each of the cutting units 20 is provided so as to be movable in the Y-axis direction by the Y-axis moving unit 43 with respect to the workpiece 200 held by the holding table 10, and is provided in the Z-axis direction by the Z-axis moving unit 44. It is provided so that it can be moved.

The cutting unit 20 can position the cutting blade 21 at an arbitrary position on the holding surface 11 of the holding table 10 by the Y-axis moving unit 43 and the Z-axis moving unit 44. The cutting blade 21 is an ultra-thin cutting grindstone having a substantially ring shape. The spindle 22 cuts the workpiece 200 by rotating the cutting blade 21. The spindle housing 23 rotatably accommodates the spindle 22 around the axis. The cutting unit 20 rotatably holds the cutting blade 21 by mounting the cutting blade 21 on the spindle 22. The axes of the spindle 22 and the cutting blade 21 of the cutting unit 20 are set parallel to the Y-axis direction.

The imaging unit 30 is fixed to the cutting unit 20 so as to move integrally with the cutting unit 20. In the first embodiment, the imaging unit 30 is arranged at a position aligned with the cutting unit 20 in the X-axis direction. As shown in FIG. 3, the imaging unit 30 accommodates an objective lens 31 held on the holding table 10 and faces the workpiece 200, and a casing having an opening 33 formed in the bottom 32 facing the workpiece 200. The body 34, the flat plate-shaped protective plate 35 made of a transparent transparent body covering the opening 33, the image pickup device 36, and the cleaning water 300 which is the cleaning fluid 300 on the lower surface 37 of the protective plate 35 facing the workpiece 200 (FIG. A cleaning fluid supply means 70 for supplying the dry air 400 and (shown in 4) are provided.

The housing 34 accommodates the objective lens 31 in the lower end portion. In the first embodiment, the housing 34 is formed in a square cylinder shape and is attached to the spindle housing 23 or the like of the cutting unit 20. The opening 33 penetrates the bottom portion 32 of the housing 34, and in the first embodiment, as shown in FIG. 4, the opening 33 is formed in a circular shape and is provided at the center of the bottom portion 32.

The planar shape of the protective plate 35 is formed in a quadrangle having the same shape as the bottom 32 of the housing 34. The protective plate 35 is fixed to the lower surface 37 of the bottom 32 of the housing 34. In the first embodiment, the protective plate 35 is fixed to the lower surface 37 of the bottom 32 by the adhesive 80, the opening 33 is sealed, and a mist composed of cutting debris and cutting water from the opening 33 into the housing 34. Invades. Further, in the present invention, the protective plate 35 may be fixed to the lower surface 37 of the bottom portion 32 with double-sided tape. Further, the protective plate 35 may be waterproofed with packing or the like and then screwed to the lower surface 37 of the bottom portion 32. The transparent body constituting the protective plate 35 is, for example, a synthetic resin such as glass or acrylic resin. Further, it is desirable that the lower surface 37 of the protective plate 35 is coated with a water-repellent coating or a stain coating.

The image pickup apparatus 36 is attached to the upper end portion of the housing 34, and photographs the region to be divided of the workpiece 200 before cutting held on the holding table 10 through the objective lens 31, the opening 33, and the protective plate 35. is there. The image pickup device 36 includes, for example, a CCD (Charge-Coupled Device) image pickup device or a CMOS (Complementary MOS) image pickup device. The image pickup apparatus 36 photographs the workpiece 200 held on the holding table 10 to obtain an image for performing alignment for aligning the workpiece 200 and the cutting blade 21, and obtains the obtained image. Output to the control unit 100.

Further, the housing 34 has a light source 38 that emits light for illuminating the workpiece 200 held on the holding table 10 through the objective lens 31, the opening 33, and the protective plate 35, and the objective lens 38 that emits the light emitted by the light source 38. It houses a half mirror 39 that reflects toward 31 and allows the image pickup unit 30 to image the workpiece 200 on the holding table 10 through the objective lens 31 and the like. In the first embodiment, the light source 38 is a light emitting element such as an LED (Light Emitting Diode), but in the present invention, an optical fiber that propagates the light emitted by the light emitting element such as an LED may be used.

As shown in FIG. 4, the cleaning fluid supply means 70 supplies the cleaning water 300 and the drying air 400 to the lower surface 37 of the protective plate 35. The cleaning fluid supply means 70 supplies the cleaning water supply nozzle 71, the air supply nozzle 73, the cleaning water supply source 72 that supplies the cleaning water 300 to the cleaning water supply nozzle 71, and the drying air 400 to the air supply nozzle 73. It includes an air supply source 74. Further, the cleaning fluid supply means 70 includes a cleaning water pipe 75 that connects the cleaning water supply nozzle 71 and the cleaning water supply source 72, and an air pipe 76 that connects the air supply nozzle 73 and the air supply source 74. An on-off valve 77 provided in the washing water pipe 75 and an on-off valve 78 provided in the air pipe 76 are provided.

As shown in FIG. 5, the cleaning water supply nozzle 71 supplies the cleaning water 300 to the lower surface 37 of the protective plate 35. In the present invention, the washing water supply nozzle 71 constitutes a water film 301 made of washing water 300 in a portion of the lower surface 37 of the protective plate 35 that closes at least the opening 33 (the portion between the pair of broken lines in FIG. 4). It is desirable to supply the washing water 300 by adjusting the injection direction, the amount of water to be supplied, the water pressure, and the like. As shown in FIG. 6, the cleaning water supply nozzle 71 supplies the cleaning water 300 to the lower surface 37 of the protective plate 35 in the direction away from the cutting blade 21 along the Y-axis direction during cutting of the cutting unit 20. For this purpose, the cleaning water supply nozzle 71 protects the cleaning water 300 along a direction orthogonal to the direction of the cutting water flow 500 from the lower end of the cutting blade of the cutting blade 21 due to the rotation of the cutting blade 21. It is supplied to the lower surface 37 of 35.

As shown in FIG. 5, the air supply nozzle 73 supplies the dry air 400 to the lower surface 37 of the protective plate 35. In the present invention, the air supply nozzle 73 supplies the dry air 400 to at least the portion of the lower surface 37 of the protective plate 35 that closes the opening 33 (the portion between the pair of alternate long and short dash lines in FIG. 4). The air supply nozzle 73 supplies the dry air 400 to the lower surface 37 of the protective plate 35 during the imaging of the workpiece 200 of the imaging unit 30. In the first embodiment, as shown in FIG. 4, the injection direction of the cleaning water 300 of the cleaning water supply nozzle 71 and the injection direction of the dry air 400 of the air supply nozzle 73 intersect each other.

The X-axis moving unit 42 moves the holding table 10 in the X-axis direction, so that the holding table 10 and the cutting unit 20 are relatively machined and fed along the X-axis direction. The Y-axis moving unit 43 moves the cutting unit 20 in the Y-axis direction, which is the indexing feed direction, so that the holding table 10 and the cutting unit 20 are indexed and fed relatively along the Y-axis direction. The Z-axis moving unit 44 moves the cutting unit 20 in the Z-axis direction, which is the cutting feed direction, so that the holding table 10 and the cutting unit 20 are cut and fed relatively along the Z-axis direction.

The X-axis moving unit 42, the Y-axis moving unit 43, and the Z-axis moving unit 44 include a well-known ball screw rotatably provided around the axis, a well-known motor for rotating the ball screw around the axis, and a holding table 10. Alternatively, a well-known guide rail that movably supports the cutting unit 20 in the X-axis direction, the Y-axis direction, or the Z-axis direction is provided.

Further, the cutting device 1 has an X-axis direction position detection unit (not shown) for detecting the position of the holding table 10 in the X-axis direction, and a Y-axis direction position (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction. It includes a detection unit and a Z-axis direction position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction. The X-axis direction position detection unit and the Y-axis direction position detection unit can be composed of a linear scale parallel to the X-axis direction or the Y-axis direction and a reading head. The Z-axis direction position detection unit detects the position of the cutting unit 20 in the Z-axis direction by the pulse of the motor. The X-axis direction position detection unit, the Y-axis direction position detection unit, and the Z-axis direction position detection unit output the position of the holding table 10 in the X-axis direction, the cutting unit 20 in the Y-axis direction, or the Z-axis direction to the control unit 100. ..

Further, the cutting device 1 includes a cassette elevator 50 on which a cassette 51 accommodating a workpiece 200 before and after cutting is placed and moves the cassette 51 in the Z-axis direction, and a cleaning unit for cleaning the workpiece 200 after cutting. 60, and a transport unit (not shown) that transports the workpiece 200 between the cassette 51, the holding table 10, and the cleaning unit 60 are provided.

The control unit 100 controls each of the above-mentioned components of the cutting device 1 to cause the cutting device 1 to perform a machining operation on the workpiece 200. The control unit 100 is a computer. The control unit 100 includes an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as ROM (read only memory) or RAM (random access memory), and an input / output interface device. And have. The arithmetic processing unit of the control unit 100 executes arithmetic processing according to a computer program stored in the storage device, and sends a control signal for controlling the cutting apparatus 1 to the cutting apparatus 1 via the input / output interface apparatus. Output to the specified components.

Further, the control unit 100 is connected to a display unit (not shown) composed of a liquid crystal display device for displaying the state of machining operation, an image, etc., and an input unit (not shown) used by the operator when registering machining content information and the like. There is. The input unit is composed of at least one of a touch panel provided on the display unit and an external input device such as a keyboard.

In the cutting device 1 having the above-described configuration, when the operator registers the machining conditions in the control unit 100, installs the cassette 51 containing the workpiece 200 in the cassette elevator 50, and the operator gives an instruction to start the machining operation. , Start the machining operation. In the machining operation, the cutting device 1 causes the transport unit to take out one piece of the workpiece 200 before cutting from the cassette 51 and place it on the holding table 10, and adheres the workpiece 200 to the holding surface 11 of the holding table 10. The annular frame 210 is clamped by the clamp portion 12 while being sucked and held via the tape 211. In the machining operation, the cutting device 1 moves the holding table 10 to the lower side of the imaging unit 30 along the X-axis direction, causes the imaging unit 30 to image the workpiece 200, and performs alignment. When the imaging unit 30 images the workpiece 200, the cutting device 1 closes the on-off valve 77 to stop the supply of the washing water 300 from the washing water supply nozzle 71, opens the on-off valve 78, and opens the on-off valve 78 to dry air 400. Is supplied from the air supply nozzle 73 to the lower surface 37 of the protective plate 35.

In the machining operation, the cutting device 1 cuts the cutting blade 21 into each scheduled split line 203 until the cutting blade 21 reaches the adhesive tape 211 while relatively moving the workpiece 200 and the cutting blade 21 along the scheduled split line 203. It is inserted and each planned division line 203 is cut. When all the scheduled division lines 203 are cut, the cutting device 1 retracts the holding table 10 from below the cutting unit 20 and then releases the suction holding of the holding table 10 and the clamp of the annular frame 210.

The control unit 100 conveys the work piece 200 after cutting to the cleaning unit 60, cleans it with the cleaning unit 60, and then stores it in the cassette 51. The control unit 100 sequentially cuts all the workpieces 200 housed in the cassette 51. The control unit 100 ends the machining operation when all the workpieces 200 housed in the cassette 51 are machined. The cutting device 1 closes the on-off valve 78 and stops the supply of the dry air 400 from the air supply nozzle 73 when the workpiece 200 of the imaging unit 30 is not imaged, especially during the cutting of the workpiece 200. Then, the on-off valve 77 is opened to supply the cleaning water 300 from the air supply nozzle 73 to the lower surface 37 of the protective plate 35.

As described above, in the imaging unit 30 according to the first embodiment, since the opening 33 of the bottom 32 of the housing 34 accommodating the objective lens 31 is covered with the protective plate 35 made of a transparent body, cutting chips are removed. Even if the contained cutting water becomes mist, it is possible to prevent the cutting water from entering the housing 34 through the opening 33, and it is possible to prevent the cutting water from adhering to the objective lens 31.

Further, since the imaging unit 30 includes a cleaning fluid supply means 70 that supplies cleaning water 300 and drying air 400 to the lower surface 37 of the protective plate 35, the cleaning water 300 is supplied during the cutting process to supply the protective plate 35. Adhesion of mist to the lower surface 37 can be suppressed, and when the workpiece 200 is imaged, dry air 400 can be supplied to remove the washing water 300 and cutting water from the lower surface 37 of the protective plate 35, and the workpiece 200 can be imaged. Can be done.

Further, since the imaging unit 30 supplies the cleaning water 300 to the lower surface 37 of the protective plate 35 when the workpiece 200 is not imaged, it is possible to prevent the cutting water containing cutting chips from adhering to the lower surface 37 of the protective plate 35. ..

Further, since the image pickup unit 30 does not have a drive source such as an air cylinder for moving a shielding member that opens and closes the opening 33 of the housing 34, opening and closing defects can be suppressed.

As a result, the imaging unit 30 can image the workpiece 200 at the time of imaging while suppressing the adhesion of the cutting water to the objective lens 31.

Further, since the cutting device 1 includes the above-mentioned imaging unit 30, it is possible to image the workpiece 200 at the time of imaging while suppressing the adhesion of the cutting water to the objective lens 31.

[Modification example]
An imaging unit and a processing apparatus according to a modified example of the first embodiment of the present invention will be described with reference to the drawings. FIG. 7 is a side view showing a partial cross-sectional view of the positional relationship between the cutting unit and the imaging unit of the cutting device which is the processing device according to the modified example of the first embodiment. In FIG. 7, the same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

In the imaging unit 30 and the cutting device 1 according to the modified example of the first embodiment, as shown in FIG. 7, the washing water supply nozzle 71 has the cutting water from the lower end of the cutting blade of the cutting blade 21 due to the rotation of the cutting blade 21. It is the same as the first embodiment except that the washing water 300 is supplied to the lower surface 37 of the protective plate 35 along the X-axis direction during cutting of the cutting unit 20 in parallel with the direction of the flow 500. Further, in the image pickup unit 30 and the cutting device 1 according to the modified example, the washing water supply nozzle 71 has the cutting water flow from the lower end of the cutting blade 21 due to the rotation of the cutting blade 21 from the upstream side to the downstream side in the direction of the cutting water 500. The washing water 300 is supplied to the lower surface 37 of the protective plate 35 toward the side.

In the imaging unit 30 according to the modified example, the opening 33 of the bottom 32 of the housing 34 accommodating the objective lens 31 is covered with a protective plate 35 made of a transparent body, and the cleaning fluid supplies the cleaning fluid to the lower surface 37 of the protective plate 35. Since the supply means 70 is provided, the workpiece 200 can be imaged at the time of imaging while suppressing the adhesion of the cutting water to the objective lens 31.

Further, in the imaging unit 30 according to the modified example, the washing water supply nozzle 71 is directed from the upstream side to the downstream side in the direction of the flow 500 of the cutting water from the lower end of the cutting blade of the cutting blade 21 due to the rotation of the cutting blade 21. Since the washing water 300 is supplied to the lower surface 37 of the protective plate 35, it is possible to prevent the cutting water containing cutting chips from adhering to the lower surface 37 of the protective plate 35.

[Embodiment 2]
The imaging unit and the processing apparatus according to the second embodiment of the present invention will be described with reference to the drawings. FIG. 8 is a perspective view showing a configuration example of a laser processing apparatus, which is a processing apparatus according to the second embodiment. FIG. 9 is a side view showing a partial cross section of the imaging unit of the laser processing apparatus shown in FIG. In FIGS. 8 and 9, the same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

The laser machining apparatus 1-2, which is the machining apparatus according to the second embodiment, irradiates the planned division line 203 of the workpiece 200 with a pulsed laser beam 25, and laser-machins the workpiece 200 (corresponding to machining). ) Is a device.

As shown in FIG. 1, the laser processing apparatus 1-2 includes a holding table 10, a laser beam irradiation unit 20-2 which is a processing means for laser processing the workpiece 200 held by the holding table 10, and an imaging unit. It includes 30-2, a moving unit 40, and a control unit 100.

The laser beam irradiation unit 20-2 is a unit that irradiates the workpiece 200 held on the holding table 10 with the pulsed laser beam 25. The laser beam irradiation unit 20-2 holds the laser oscillator 26 that oscillates the laser beam 25 for processing the workpiece 200 and the laser beam 25 oscillated by the laser oscillator 26 on the holding surface 11 of the holding table 10. It includes a mirror 27 that reflects toward the workpiece 200, and a condenser lens 28 that is a condenser that focuses the laser beam 25 reflected by the mirror 27 on the workpiece 200. The laser beam 25 irradiated by the laser beam irradiation unit 20-2 may have a wavelength that is transparent to the workpiece 200 or may be a wavelength that is absorbent to the workpiece 200.

The rotation drive source 41 of the moving unit 40 of the laser processing apparatus 1-2 according to the second embodiment is arranged on the moving plate 14, and the X-axis moving unit 42 moves the holding table 10 in the X-axis direction and Y-axis. The moving unit 43 moves the holding table 10 in the Y-axis direction, and the Z-axis moving unit 44 moves the laser beam irradiation unit 20-2 in the Z-axis direction.

In the second embodiment, the X-axis moving unit 42 and the Y-axis moving unit 43 are installed on the device main body 2 of the laser processing device 1-2, and support the moving plate 14 so as to be movable in the X-axis direction. It is movably supported in the Y-axis direction. The Z-axis moving unit 44 is installed on a pillar 3 erected from the device main body 2, and supports the laser beam irradiation unit 20-2 so as to be movable in the Z-axis direction.

Further, the Y-axis direction position detection unit of the laser processing apparatus 1-2 detects the position of the holding table 10 in the Y-axis direction, and the Z-axis direction position detection unit is the Z-axis direction of the laser beam irradiation unit 20-2. Detect the position.

The imaging unit 30-2 of the laser processing apparatus 1-2 according to the second embodiment is attached to the laser beam irradiation unit 20-2. In the imaging unit 30-2, the cleaning fluid supply means 70-2 does not include the cleaning water supply nozzle 71, the cleaning water supply source 72, the cleaning water pipe 75, and the on-off valve 77, but the air supply nozzle 73 and the air supply source. It is the same as the imaging unit 30 according to the first embodiment except that it includes 74, an air pipe 76, and an on-off valve 78. The air supply nozzle 73 supplies the drying air 400, which is a cleaning fluid, to the lower surface 37 of the protective plate 35 when the workpiece 200 of the imaging unit 30 is imaged.

Further, the laser machining apparatus 1-2 according to the second embodiment does not include the cassette elevator 50, the cleaning unit 60, and the transport unit.

In the laser machining apparatus 1-2 having the above-described configuration, the operator registers the machining conditions in the control unit 100, places the workpiece 200 on the holding surface 11 of the holding table 10 via the adhesive tape 211, and machining from the operator. When there is an instruction to start the operation, the machining operation is started. In the machining operation, the laser machining apparatus 1-2 sucks and holds the workpiece 200 on the holding surface 11 of the holding table 10 via the adhesive tape 211, and clamps the annular frame 210 with the clamp portion 12. In the machining operation, the laser machining device 1-2 moves the holding table 10 to the lower side of the image pickup unit 30-2 along the X-axis direction, causes the image pickup unit 30-2 to image the workpiece 200, and aligns the work piece 200. To carry out. The laser machining apparatus 1-2 opens the on-off valve 78 to supply the dry air 400 from the air supply nozzle 73 to the lower surface 37 of the protective plate 35 when the imaging unit 30-2 images the workpiece 200.

In the processing operation, the laser processing apparatus 1-2 moves the laser beam irradiation unit 20-2 to the laser beam 25 while relatively moving the workpiece 200 and the laser beam irradiation unit 20-2 along the scheduled division line 203. Is irradiated to each scheduled division line 203, and each scheduled division line 203 is laser-processed. When all the scheduled division lines 203 are laser-machined, the laser machining apparatus 1-2 retracts the holding table 10 from below the laser beam irradiation unit 20-2, releases the suction holding of the holding table 10, and clamps the holding table 10. The clamp of the annular frame 210 of 12 is released, and the machining operation is completed.

In the laser processing apparatus 1-2 according to the second embodiment, the opening 33 of the bottom 32 of the housing 34 accommodating the objective lens 31 is covered with a protective plate 35 made of a transparent material, and the lower surface 37 of the protective plate 35 is covered with dry air 400. Since the cleaning fluid supply means 70 for supplying the image is provided, the workpiece 200 can be imaged at the time of imaging.

The present invention is not limited to the above embodiment. That is, it can be modified in various ways without departing from the gist of the present invention.

1 Cutting equipment (processing equipment)
1-2 Laser Machining Equipment (Processing Equipment)
10 Holding table 20 Cutting unit (machining means)
20-2 Laser beam irradiation unit (processing means)
21 Cutting blade 25 Laser beam 26 Laser oscillator 28 Condensing lens (condenser)
30 Imaging unit 31 Objective lens 32 Bottom 33 Aperture 34 Housing 35 Protective plate 70 Cleaning fluid supply means 71 Cleaning water supply nozzle 73 Air supply nozzle 200 Work piece (object to be imaged)
300 Washing water (washing fluid)
400 Dry air (cleaning fluid)

Claims (4)

An imaging unit including a housing that houses an objective lens facing an imaging object.
The housing has an opening formed at the bottom facing the object to be imaged.
A protective plate made of a transparent body covering the opening,
An imaging unit including a cleaning fluid supply means for supplying a cleaning fluid to the protective plate. A processing device including a holding table for holding a work piece, a processing means for processing the work piece held by the holding table, and an imaging unit for imaging the work piece held by the holding table. There,
The imaging unit is
A housing that accommodates an objective lens facing the imaging object and has an opening at the bottom facing the imaging object.
A protective plate made of a transparent body covering the opening,
A processing apparatus including a cleaning fluid supply means for supplying a cleaning fluid to the protective plate. The processing means has a cutting blade and
The cleaning fluid supply means includes a cleaning water supply nozzle that supplies cleaning water to the protective plate, and
The processing apparatus according to claim 2, further comprising an air supply nozzle for supplying dry air to the protective plate. The processing means includes a laser oscillator and a concentrator that focuses the laser beam oscillated by the laser oscillator on the workpiece held by the holding table.
The processing apparatus according to claim 2, wherein the cleaning fluid supply means has an air supply nozzle for supplying dry air to the protective plate.

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