JP2020193981A - Manufacturing method of holding member - Google Patents

Abstract

To provide a manufacturing method of a holding member capable of precisely detecting the edges of objects to be held which are sucked and held by a plurality of suction holes, respectively.SOLUTION: The manufacturing method of a holding member that holds a plurality of objects to be held and is used for optical inspection, includes: a resin filling step of filling, with a resin, the entire of grooves in a holding unit in which the grooves are arranged between a plurality of suction holes for sucking and holding the objects to be held; and a resin curing step of curing the resin.SELECTED DRAWING: Figure 5

Description

The present invention relates to a technique for manufacturing a holding member that holds an object to be held and is used for an optical inspection.

Patent Document 1 discloses an appearance inspection device for electronic components. This visual inspection device for electronic components detects an edge of an inspected portion of an electronic component, measures the dimensions of the inspected portion based on the position of the edge, and determines the quality thereof. This visual inspection device for electronic components includes an image input means for imaging the inspection component from a predetermined direction, a lighting means capable of separately irradiating the inspection component with light from at least two directions forming a sharp angle with the imaging direction, and a lighting means. It is provided with an image pickup control means for activating an image input means for each direction-specific light irradiation to perform imaging, and an edge position detection means for detecting the edge position of an electrode portion based on an image signal obtained for each light irradiation. It is characterized by that.

Japanese Unexamined Patent Publication No. 8-184410

In the visual inspection device for electronic components disclosed in Patent Document 1, illuminators are arranged symmetrically with the imaging center of the camera in between, and the inspection component is irradiated with light in one direction from the illuminator on the left side to illuminate the inspection component on the right side. The inspection component is irradiated with light from the vessel in the other direction. The brightness values of each image data obtained by illumination from two directions are compared, and the edge position of the inspection component is detected by searching for a portion where a difference in brightness appears depending on the presence or absence of a shadow and a coloring portion. However, Patent Document 1 does not describe that it is used for edge detection of a holding object held by suction in each of a plurality of suction holes of the holding member.

The present invention has been made in view of the above circumstances, and the problem to be solved is a holding member capable of accurately detecting the edge of a holding object held by suction in each of a plurality of suction holes. Is to provide a manufacturing method of.

The problem to be solved by the present invention is as described above, and in order to solve this problem, the method for manufacturing a holding member according to the present invention holds a plurality of holding objects and is used for optical inspection. A resin for manufacturing a member, in which a holding portion provided with grooves arranged between a plurality of suction holes for sucking the object to be held is filled with resin in the entire groove. It includes a filling step and a resin curing step of curing the resin.

According to the present invention, it is possible to accurately detect the edge of a holding object held by suction in each of a plurality of suction holes.

The plan view which showed the overall structure of the cutting apparatus which concerns on one Embodiment of this invention. (A) Schematic diagram of the holding member. (B) XX sectional view. FIG. 6 is a schematic cross-sectional view showing the shape of the surface of the resin reflective portion. The figure which showed the manufacturing method of the holding member which concerns on Example 1. FIG. 5 is a schematic cross-sectional view showing a state in which holding members are manufactured in order in Example 1. The figure which showed the manufacturing method of the holding member which concerns on Example 2. FIG. 2 is a schematic cross-sectional view showing a state in which holding members are manufactured in order in Example 2. FIG. 6 is a schematic cross-sectional view showing the continuation of FIG. 7.

First, the configuration of the cutting device 1 according to the present embodiment will be described with reference to FIG. In the present embodiment, for example, the configuration of the cutting device 1 in the case where the package substrate P in which the substrate on which the semiconductor chip is mounted is resin-sealed is used as the object to be cut by the cutting device 1 will be described.

As the package substrate P, for example, a BGA (Ball grid array) package substrate, a CSP (Chip size package) package substrate, an LED (Light emitting dimension) package substrate, or the like is used. Further, as the object to be cut, not only the package substrate P but also a sealed lead frame in which a lead frame on which a semiconductor chip is mounted is sealed with a resin may be used.

In the following, of both sides of the package substrate P, the surface on the resin-sealed side is referred to as a mold surface, and the surface opposite to the mold surface is referred to as a ball / lead surface.

The cutting device 1 includes a cutting module A and an inspection module B as components. Each component is removable and interchangeable with respect to other components.

The cutting module A is a component that mainly cuts the package substrate P. The cutting module A mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 5, a spindle 6, a transport unit 7, and a control unit 8.

The substrate supply unit 3 supplies the package substrate P. The substrate supply unit 3 pushes out the package substrates P one by one from the magazine M containing the plurality of package substrates P and supplies them to the positioning unit 4 described later. The package substrate P is arranged with the ball / lead surface facing up.

The positioning unit 4 positions the package substrate P supplied by the substrate supply unit 3. The positioning unit 4 arranges the package substrate P extruded from the substrate supply unit 3 on the rail unit 4a and performs positioning. After that, the positioning unit 4 conveys the positioned package substrate P to the cutting table 5 described later.

The cutting table 5 holds the package substrate P to be cut. In this embodiment, a cutting device 1 having a twin cut table configuration having two cutting tables 5 is illustrated. The cutting table 5 is provided with a holding member 5a that attracts and holds the package substrate P conveyed by the positioning unit 4 from below. Further, the cutting table 5 is provided with a rotation mechanism 5b capable of rotating the holding member 5a in the θ direction in the drawing and a moving mechanism 5c capable of moving the holding member 5a in the Y direction in the drawing. Be done.

The spindle 6 cuts the package substrate P and separates it into a plurality of semiconductor packages S (see FIG. 2). In this embodiment, a cutting device 1 having a twin spindle configuration having two spindles 6 is illustrated. The spindle 6 can move in the X and Z directions in the figure. A rotary blade 6a for cutting the package substrate P is mounted on the spindle 6.

The spindle 6 has a cutting water nozzle that injects cutting water toward a rotary blade 6a that rotates at high speed, a cooling water nozzle that injects cooling water, and a cleaning water nozzle that injects cleaning water for cleaning cutting debris. Neither is shown) and the like are provided.

After the cutting table 5 attracts the package substrate P, the position of the package substrate P is confirmed by the first position confirmation camera 5d. After that, the cutting table 5 moves so as to approach the spindle 6 along the Y direction in the figure. After the cutting table 5 moves below the spindle 6, the package substrate P is cut by relatively moving the cutting table 5 and the spindle 6. Every time the package substrate P is cut by the spindle 6, the position of the package substrate P and the like are confirmed by the second position confirmation camera 6b.
Here, in the confirmation by the first position confirmation camera 5d, for example, the position of the mark indicating the cutting position provided on the package substrate P can be confirmed. The confirmation by the second position confirmation camera 6b can confirm, for example, the cut position, the cut width, and the like of the package substrate P.
The confirmation by the confirmation camera may be performed only by the second position confirmation camera 6b without using the first position confirmation camera 5d.

After the cutting of the package substrate P is completed, the cutting table 5 moves away from the spindle 6 along the Y direction in the drawing while adsorbing the plurality of fragmented semiconductor packages S. At this time, the upper surface (ball / lead surface) of the semiconductor package S is cleaned and dried by the first cleaner 5e.

The transport unit 7 transports the semiconductor package S to the inspection table 11 of the inspection module B. The transport unit 7 sucks the semiconductor package S held on the cutting table 5 from above and transports it to the inspection module B. At this time, the lower surface (mold surface) of the semiconductor package S is cleaned and dried by the second cleaner 7a.

The control unit 8 controls the operation of each part of the cutting module A. The control unit 8 controls the operations of the substrate supply unit 3, the positioning unit 4, the cutting table 5, the spindle 6, the transport unit 7, and the like. Further, the operation of each part of the cutting module A can be arbitrarily changed (adjusted) by using the control unit 8.

The inspection module B is a component that mainly inspects the semiconductor package S. The inspection module B mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, an arrangement unit 14, an extraction unit 15, and a control unit 16.

The inspection table 11 holds the semiconductor package S for optically inspecting it. The inspection table 11 can be moved along the X direction in the figure. The inspection table 11 can be turned upside down. The inspection table 11 is provided with a holding member 100 that attracts and holds the semiconductor package S.

The first optical inspection camera 12 and the second optical inspection camera 13 optically inspect the surfaces (ball / lead surface and mold surface) of the semiconductor package S. The first optical inspection camera 12 and the second optical inspection camera 13 are arranged in the vicinity of the inspection table 11 so as to face upward. The first optical inspection camera 12 and the second optical inspection camera 13 are each provided with a lighting device (not shown) capable of irradiating light during inspection.

The first optical inspection camera 12 inspects the molded surface of the semiconductor package S transported to the inspection table 11 by the transport unit 7. After that, the transport unit 7 places the semiconductor package S on the holding member 100 of the inspection table 11. After the holding member 100 sucks and holds the semiconductor package S, the inspection table 11 is turned upside down. The inspection table 11 moves above the second optical inspection camera 13, and the ball / lead surface of the semiconductor package S is inspected by the second optical inspection camera 13.
For example, the first optical inspection camera 12 can inspect a chip in the semiconductor package S, characters marked on the semiconductor package S, and the like. Further, for example, the second optical inspection camera 13 can inspect the size and shape of the semiconductor package S, the position of the ball / lead, and the like.

The arranging unit 14 is for arranging the semiconductor package S for which the inspection has been completed. The arrangement unit 14 can be moved along the Y direction in the figure. In the inspection table 11, the semiconductor package S that has been inspected by the first optical inspection camera 12 and the second optical inspection camera 13 is arranged in the arrangement unit 14.

The extraction unit 15 transfers the semiconductor package S arranged in the arrangement unit 14 to a tray and stores it. The semiconductor package S, which is classified into a non-defective product and a defective product based on the inspection results by the first optical inspection camera 12 and the second optical inspection camera 13, is stored in the tray by the extraction unit 15. At this time, the extraction unit 15 stores the non-defective product in the non-defective product tray 15a and the defective product in the defective product tray 15b in the semiconductor package S, respectively. When the tray is filled with the semiconductor package S, another empty tray is appropriately supplied.

The control unit 16 controls the operation of each part of the inspection module B. The control unit 16 controls the operations of the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the arrangement unit 14, the extraction unit 15, and the like. Further, the operation of each part of the inspection module B can be arbitrarily changed (adjusted) by using the control unit 16.

As described above, the cutting device 1 according to the present embodiment can cut the package substrate P and separate it into a plurality of semiconductor packages S.

Next, the configuration of the holding member 100 provided on the inspection table 11 will be described with reference to FIG. In the following, the directions indicated by the arrows U, D, L, R, F and B in the figure are upward, downward, left, right, forward and backward, respectively. It is defined as and explained. Further, the holding member 100 shown in the figure is shown in an appropriately simplified manner for convenience of explanation. The actual configuration of the holding member 100 (for example, the number and arrangement of the suction holes 111 and the suction surfaces 113 described later) is not limited to those shown in the figure.

As described above, the holding member 100 holds the plurality of semiconductor packages S when optically inspecting them. The holding member 100 mainly includes a resin sheet 110 which is a holding portion and a resin reflecting portion 120 which is a reflecting portion. In FIG. 2A, the resin reflecting portion 120 is shaded in order to distinguish the resin sheet 110 from the resin reflecting portion 120.

The resin sheet 110 is a member formed in the shape of a rectangular plate. As the material of the resin sheet 110, for example, a silicone-based resin, a fluorine-based resin, or the like is used. In the present embodiment, in order to diffuse the static electricity of the semiconductor package S to be held, the resin sheet 110 contains carbon to improve the conductivity (static electricity diffusivity). As a result, the resin sheet 110 is formed so as to have a blackish color. The resin sheet 110 is mainly formed with suction holes 111 and grooves 112.

The suction hole 111 is a hole for sucking the semiconductor package S. The suction hole 111 is formed so as to penetrate the resin sheet 110 in the vertical direction (thickness direction). A plurality of suction holes 111 are formed at regular intervals in the front-rear and left-right directions.

The groove 112 is a portion formed so as to dent the surface (upper surface) of the resin sheet 110. The grooves 112 are formed in a grid pattern so as to partition adjacent suction holes 111 from each other in the front-rear and left-right directions. By forming the groove 112 in this way, a rectangular (square) suction surface 113 is formed on the upper surface of the resin sheet 110 around each suction hole 111. The suction surface 113 is formed so as to have substantially the same shape as the outer shape (rectangular shape) of the semiconductor package S to be sucked.

The resin reflecting portion 120 is provided so as to fill the groove 112 of the resin sheet 110. As the material of the resin reflective portion 120, for example, a silicone-based resin, a fluorine-based resin, or the like is used. In the present embodiment, the resin reflective portion 120 contains titanium oxide. As a result, the resin reflective portion 120 is formed so as to have a whitish color. Further, as a result, the resin reflecting portion 120 has a higher reflectance (ratio of the rebounding luminous flux to the incident luminous flux) than that of the resin sheet 110.

The material for coloring the resin reflective portion 120 is not limited to the titanium oxide, as long as the resin reflective portion 120 can have a higher reflectance than the resin sheet 110. For example, metallic pigments (various metal flakes other than lead, plating alloys, aluminum, tin, zinc, chromium, gold, silver, platinum, etc.), flake-like alumina, white pigments (titanium oxide, zinc oxide, etc.), pearl pigments (titanium oxide, zinc oxide, etc.) Mica, silica, glass, etc.), retroreflecting material (glass beads, etc.), and diluents and bulking agents (calcium carbonate, aluminum hydroxide, barium sulfate, etc.) and the like can be used.

The resin reflecting portion 120 is provided so as to fill the entire groove 112 of the resin sheet 110. The resin reflective portion 120 is formed so as to have a flat surface (that is, an upper side surface exposed from the groove 112). By forming the surface of the resin reflecting portion 120 flat in this way, diffused reflection of light can be suppressed.

The flat surface of the resin reflective portion 120 will be specifically described with reference to FIG. As shown in FIG. 3, in a cross-sectional view in which the holding member 100 is cut in parallel with the depth direction (vertical direction) of the groove 112, the height difference L of the surface of the resin reflecting portion 120 is set to a predetermined value or less. Is formed in. Here, the height difference L on the surface of the resin reflecting portion 120 is the most of the surface of the resin reflecting portion 120 in the direction perpendicular to the surface (adsorption surface 113) of the resin sheet 110 (vertical direction in the figure). It means the difference between the highest position and the lowest position. Note that FIG. 3 shows an example in which the position of the upper surface of the resin sheet 110 and the highest position of the resin reflecting portion 120 coincide with each other.

Here, a specific measurement method will be described. First, two points are designated on the upper surface of the resin sheet 110, and a straight line a passing through these two points is drawn. Since the position of the upper surface of the resin sheet 110 and the highest position of the resin reflecting portion 120 coincide with each other, the straight line a indicates the highest position of the resin reflecting portion 120. Next, a straight line b parallel to the straight line a is created, and the straight line b is moved to the lowest portion of the surface of the resin reflecting portion 120. The height difference L on the surface of the resin reflecting portion 120 is measured based on the distance between the straight line a and the straight line b. When the highest position of the resin reflecting portion 120 does not match the position of the upper surface of the resin sheet 110, it is based on the distance between the highest position and the lowest position (straight line b) of the resin reflecting portion 120. The height difference L is measured.
A digital microscope (model: VHX-5000) manufactured by KEYENCE Corporation was used to measure the surface of the resin reflective portion 120.

In the present embodiment, the surface of the resin reflecting portion 120 is formed so that the height difference L is 50 μm or less. As described above, when the height difference L is 50 μm or less, the surface of the resin reflecting portion 120 is assumed to be flat. The smaller the height difference L on the surface of the resin reflecting portion 120, the easier it is to suppress diffused reflection of light. Therefore, it is more preferable that the surface of the resin reflective portion 120 is formed so that the height difference L is 45 μm or less, 40 μm or less, 35 μm or less, 30 μm or less, 25 μm or less, or 20 μm or less.

The semiconductor package S to be inspected is held by using the holding member 100 configured in this way. Specifically, as shown in FIG. 2, air is sucked from below the holding member 100 through the suction holes 111 in a state where one semiconductor package S is placed on each suction surface 113. , The semiconductor package S is sucked and held on the suction surface 113. The semiconductor package S held by the holding member 100 is photographed by the second optical inspection camera 13 (see FIG. 1), and the size and the like of the outer shape portion are inspected.

Here, when the holding member 100 is viewed from above, the resin reflective portion 120 having a relatively high reflectance is arranged around the semiconductor package S. By arranging the resin reflecting portion 120 in this way, the contrast of the edge portion (the boundary portion between the semiconductor package S and the resin reflecting portion 120) of the semiconductor package S when photographed by the second optical inspection camera 13 can be obtained. Can be clarified. As a result, the edge of the semiconductor package S can be detected easily and accurately by the second optical inspection camera 13. Along with this, the time for detecting the edge of the semiconductor package S can be shortened.

Further, in the present embodiment, the surface of the resin reflecting portion 120 is formed to be flat (so that the height difference L is 50 μm or less). By forming the surface of the resin reflecting portion 120 flat, diffused reflection of light can be suppressed. Thereby, the contrast of the edge portion of the semiconductor package S when photographed by the second optical inspection camera 13 can be clarified.

<Example 1>
Next, a method of manufacturing the holding member 100 using the dispenser D will be described with reference to FIGS. 4 and 5.

As shown in FIG. 4, the method for manufacturing the holding member 100 according to the first embodiment mainly includes a plasma irradiation step S11, a resin filling step S12, and a resin curing step S13.

The plasma irradiation step S11 is a step of irradiating the resin sheet 110 with plasma. In the plasma irradiation step S11, first, the resin sheet 110 on which the suction holes 111 and the grooves 112 are formed is prepared. Next, the resin sheet 110 (particularly, the groove 112) is irradiated with plasma (see FIG. 5A). By irradiating the groove 112 of the resin sheet with plasma (plasma treatment), the surface tension of the resin sheet 110 is controlled (wetting property of the resin sheet 110 is improved), and the surface of the resin reflecting portion 120 described later is flattened. Can be formed into. For example, argon can be used for plasma irradiation.

After the plasma irradiation step S11, the resin filling step S12 is performed. The resin filling step S21 is a step of filling the groove 112 of the resin sheet 110 with the resin R as the material of the resin reflecting portion 120. In the resin filling step S21, the resin R is discharged by the dispenser D, and the resin R is supplied to the groove 112 of the resin sheet 110 (see FIG. 5B). The dispenser D fills the groove 112 in the longitudinal direction with the resin R, and then fills the groove 112 in the lateral direction with the resin R. At this time, a sufficient amount of resin R is supplied so that the groove 112 is filled with the resin R. The filling of the resin R is not limited to the above-mentioned order, and the groove 112 in the lateral direction may be filled with the resin R, and then the groove 112 in the longitudinal direction may be filled with the resin R.

As the dispenser D, for example, it is preferable to use a jet dispenser, and a piezo jet dispenser can be used. The piezo jet dispenser is a dispenser that uses a piezo element that deforms minutely when a voltage is applied. Due to the minute displacement caused by the piezo element, the connected rods repeatedly reciprocate and open and close the valve at high speed, which is appropriate. A large amount of resin R can be discharged. Further, even when the high-viscosity resin R is used, the piezo jet dispenser can reduce the occurrence of stringing of the resin R after discharge.

After the resin filling step S12, the resin curing step S13 is performed. The resin curing step S13 is a step of curing the resin R. For example, the resin sheet 110 and the like are heated in an oven at 60 ° C. for 1 hour. The heating method is not limited to heating using an oven, and for example, heating may be performed using a hot plate. As a result, the resin R filled in the groove 112 is cured, and the resin reflecting portion 120 is formed (see FIG. 5C).

<Example 2>
Next, a method of manufacturing the other holding member 100 will be described with reference to FIGS. 6 to 8.

As shown in FIG. 6, the manufacturing method of the holding member 100 according to the second embodiment is mainly a resin filling step S21, a resin defoaming step S22, a flat member arranging step S23, a resin curing step S24, a flat member removing step S25, and a resin. The removal step S26 and the secondary curing step S27 are included.

The resin filling step S21 is a step of filling the groove 112 of the resin sheet 110 with the resin R as the material of the resin reflecting portion 120. In the resin filling step S21, first, the resin sheet 110 on which the suction holes 111 and the grooves 112 are formed is prepared (see FIG. 7A). Next, the resin R is supplied to the upper side surface (the surface on which the groove 112 is formed) of the resin sheet 110 (see FIG. 7B). At this time, a sufficient amount of resin R is supplied so that the groove 112 is filled with the resin R. By supplying the resin R to the upper side surface of the resin sheet 110, the resin R penetrates not only inside the groove 112 but also inside the suction hole 111, and the resin R adheres to the surface of the resin sheet 110. Will be done.

After the resin filling step S21, the resin defoaming step S22 is performed. The resin defoaming step S22 is a step of defoaming the resin R. Specifically, the resin sheet 110 to which the resin R is supplied is placed in a predetermined container, and the container is evacuated by using a vacuum pump. As a result, the air (air bubbles) contained in the resin R is removed.

After the resin defoaming step S22, the flat member arranging step S23 is performed. The flat member arranging step S23 is a step of arranging the flat member F on the upper side surface of the resin sheet 110. In the flat member arranging step S23, the flat member F is first placed on the resin R supplied to the upper side surface of the resin sheet 110 (see FIG. 7C).

Here, as the flat member F, a member having a flat surface is used. In the present embodiment, as the flat member F, a film-like member (mirror surface film) having a mirror surface (a surface finished so that an object is reflected by reflection of light) is used.

Next, the flat member F is pressed against the resin sheet 110 (resin R) (see FIG. 7D). For example, the flat member F is pressed against the resin sheet 110 by applying a force in order from the center side to the outside of the flat member F using a tool such as a spatula. As a result, air (air bubbles) between the flat member F and the resin R is removed. Further, when the flat member F is pressed against the resin R, the surface shape (mirror surface) of the flat member F is transferred to the surface of the resin R, and the surface of the resin R becomes flat.

By pressing the flat member F against the resin sheet 110, the resin R between the flat member F and the resin sheet 110 is pushed out. However, the resin R between the flat member F and the resin sheet 110 is not completely discharged, and the thickness of the resin R deposited on the upper side surface of the resin sheet 110 becomes smaller, so that the resin R is on the resin sheet 110. A thin film of resin R remains on the side surface (adsorption surface 113).

After the flat member arranging step S23, the resin curing step S24 is performed. The resin curing step S24 is a step of curing the resin R (primary curing). In the resin curing step S24, the resin sheet 110 on which the flat member F is arranged is turned upside down (see FIG. 8A). Next, a force is applied (pressed) so as to sandwich the resin sheet 110 and the flat member F from above and below using a predetermined molding die. Next, the resin sheet 110 or the like is appropriately heated while being pressed. For example, the resin sheet 110 and the like are heated in an oven at 60 ° C. for 1 hour. As a result, the resin R is cured to some extent (primary curing). In this way, the resin sheet 110 or the like is pressed and cured while maintaining the state in which pressure is applied to the resin R of the resin sheet 110 by the flat member F, thereby suppressing deformation of the surface of the resin R due to heating. However, the surface of the resin R can be kept flat.

In the resin curing step S24, the resin sheet 110 is turned upside down to perform primary curing, but it is not always necessary to turn the resin sheet 110 upside down.

After the resin curing step S24, the flat member removing step S25 is performed. The flat member removing step S25 is a step of removing the flat member F from the resin sheet 110. In the flat member removing step S25, the resin sheet 110 is turned upside down again. Next, the flat member F is removed from the resin sheet 110 (more specifically, the primary cured resin R) (see FIG. 8B).

After the flat member removing step S25, the resin removing step S26 is performed. The resin removing step S26 is a step of removing unnecessary resin R from the resin sheet 110. In the resin removing step S26, the resin R other than the resin R filled in the groove 112 of the resin sheet 110 is removed (see FIG. 8C). Specifically, the thin film of resin R remaining on the upper side surface (adsorption surface 113) of the resin sheet 110 is removed. Further, the resin R that has penetrated into the suction hole 111 of the resin sheet 110 is removed. Further, if there is resin R adhering to other parts (for example, the outer surface or the like) of the resin sheet 110, the resin R is also removed.

The method for removing the resin R is not particularly limited. The resin R may be removed by hand by an operator, or may be removed by using an appropriate tool or device. For example, it is possible to remove the resin R using a grinding device such as a grinder, or to remove the resin R using a laser or the like.

After the resin removing step S26, a secondary curing step S27 is performed. The secondary curing step S27 is a step of further curing (secondary curing) the resin R filled in the groove 112 of the resin sheet 110. In the secondary curing step S27, the resin sheet 110 and the like are appropriately heated. For example, the resin sheet 110 or the like is heated in an oven at 60 ° C. for 4 hours or in an oven at 150 ° C. for 1 hour. As a result, the resin R filled in the groove 112 is further cured (secondary curing) to form the resin reflecting portion 120.

As described above, the holding member 100 according to the present embodiment is
A holding member 100 that holds a plurality of semiconductor packages S (holding objects) and is used for optical inspection.
A resin sheet 110 (holding portion) provided with a plurality of suction holes 111 for sucking the semiconductor package S so as to hold the semiconductor package S, and a groove 112 arranged between the plurality of suction holes 111.
A resin reflecting portion 120 (reflecting portion) provided in the groove 112 and having a higher reflectance than the resin sheet 110 is provided.
The resin reflective portion 120 has a flat surface.

With this configuration, it is possible to accurately detect the edge of the semiconductor package S which is suction-held in each of the plurality of suction holes 111. That is, by providing the resin reflecting portion 120 having a relatively high reflectance, the contrast between the resin reflecting portion 120 and the semiconductor package S adsorbed on the suction hole 111 can be clarified. Further, since the surface of the resin reflecting portion 120 is formed to be flat, diffused reflection of light can be suppressed and the contrast can be made clearer.

Further, the surface of the resin reflecting portion 120 has a height difference of 50 μm or less in a cross-sectional view cut in parallel with the depth direction of the groove 112.

With this configuration, edge detection of the semiconductor package S can be performed more accurately. That is, by suppressing the height difference of the surface of the resin reflecting portion 120 to a predetermined value or less, diffused reflection of light can be effectively suppressed.

Further, the inspection module B (inspection mechanism) according to the present embodiment inspects the semiconductor package S held by the holding member 100.

With such a configuration, the edge detection of the semiconductor package S can be performed accurately with a simple configuration.

Further, the cutting device 1 according to the present embodiment is
A cutting module A (cutting mechanism) that cuts a package substrate P (object to be cut) to obtain a plurality of the semiconductor packages S,
With inspection module B,
The inspection module B inspects the semiconductor package S obtained by the cutting module A.

With such a configuration, the edge detection of the semiconductor package S can be performed accurately with a simple configuration.

Further, the method for manufacturing the semiconductor package S according to the present embodiment is to manufacture the semiconductor package S by using the cutting device 1.

With such a configuration, the edge detection of the semiconductor package S can be performed accurately with a simple configuration. As a result, the productivity of the semiconductor package S can be improved.

Further, the method for manufacturing the holding member 100 according to the present embodiment is as follows.
A method for manufacturing a holding member 100 that holds a plurality of semiconductor packages S (holding objects) and is used for optical inspection.
A resin sheet 110 (holding portion) provided with grooves 112 arranged between a plurality of suction holes 111 for sucking the semiconductor package S is filled with resin R to fill the grooves 112. Step S12 (resin filling step S21) and
It includes a resin curing step S13 (resin curing step S24) for curing the resin R.

With such a configuration, the holding member 100 can be easily manufactured. Further, by using the holding member 100 obtained by the method for manufacturing the holding member 100 according to the present embodiment, the edge detection of the semiconductor package S can be performed accurately with a simple configuration.

Further, in the resin filling step S12, the resin R is discharged by the dispenser D, and the groove 112 is filled with the resin R.

With such a configuration, the holding member 100 can be easily manufactured. That is, by filling the groove 112 with the resin R by the dispenser D having a relatively high discharge accuracy of the resin R, the groove 112 can be filled with the resin R easily and accurately.

Further, the method for manufacturing the holding member 100 according to the present embodiment is as follows.
Prior to the resin filling step S12, a plasma irradiation step S11 for irradiating the resin sheet 110 with plasma is further included.

With this configuration, the surface of the resin reflective portion 120 can be easily formed flat. That is, by improving the wettability of the resin sheet 110 (particularly the groove 112), the surface of the resin R filled in the groove 112 can be flattened, and by extension, the resin reflection formed by curing the resin R. The surface of the portion 120 can be flattened.

Further, the method for manufacturing the holding member 100 according to the present embodiment is as follows.
After the resin filling step S21, a resin defoaming step S22 for defoaming the resin R is further included.

With this configuration, the surface of the resin R (resin reflecting portion 120) can be easily formed more flat. That is, by removing the air (bubbles) contained in the resin R, it is possible to suppress the unevenness and deformation of the surface of the resin R caused by the bubbles.

Further, the method for manufacturing the holding member 100 according to the present embodiment is as follows.
After the resin filling step S21, a flat member arranging step S23 for arranging the flat member F on the surface of the resin sheet 110 is further included.

With this configuration, the surface of the resin R (resin reflecting portion 120) can be easily formed more flat. That is, by arranging the flat member F on the surface of the resin sheet 110, the surface of the resin R filled in the groove 112 can be formed flat.

Further, the method for manufacturing the holding member 100 according to the present embodiment is as follows.
In the resin curing step S24, the resin R is cured in a state where pressure is applied to the resin R filled in the groove 112 by the flat member F.

With this configuration, the surface of the resin R (resin reflecting portion 120) can be easily formed more flat. That is, the deformation of the surface of the resin R due to curing can be suppressed.

Further, in the resin filling step 21, the resin R is also filled in the plurality of suction holes 111.
After the resin curing step S24, a flat member removing step S25 for removing the flat member F from the surface of the resin sheet 110,
After the flat member removing step S25, a resin removing step S26 for removing the resin R adhering to other than the groove 112 of the resin sheet 110 is further included.

With this configuration, the holding member 100 from which unnecessary resin R has been removed can be obtained. That is, since the resin R other than the resin R (resin reflecting portion 120) arranged in the groove 112 is not necessary for improving the accuracy of edge detection of the semiconductor package S, the resin R can be removed by removing the resin R. It is possible to suppress the occurrence of inconvenience (for example, inhibiting the adsorption of the semiconductor package S) due to the remaining unnecessary resin R.

Further, the method for manufacturing the holding member 100 according to the present embodiment is as follows.
After the resin curing step S24, a secondary curing step S27 for further curing the resin R is further included.

With this configuration, deformation of the holding member 100 can be suppressed. That is, by curing the resin R in a plurality of times, deformation (warpage, etc.) of the holding member 100 can be suppressed.

Further, in the resin filling step 21, the resin R is also filled in the plurality of suction holes 111.
After the resin curing step S24, a flat member removing step S25 for removing the flat member F from the surface of the resin sheet 110,
After the flat member removing step S25, a resin removing step S26 for removing the resin R adhering to other than the groove 112 of the resin sheet 110,
After the resin removing step S26, a secondary curing step S27 for further curing the resin R is further included.

With such a configuration, unnecessary resin R can be easily removed. That is, since the resin R can be removed during the curing of the resin R (after the resin curing step S24 and before the secondary curing step S27), the resin R can be easily removed.

The semiconductor package S according to the present embodiment is an embodiment of the object to be retained according to the present invention.
Further, the resin sheet 110 according to the present embodiment is an embodiment of the holding portion according to the present invention.
Further, the resin reflective portion 120 according to the present embodiment is an embodiment of the reflective portion according to the present invention.
Further, the cutting module A according to the present embodiment is an embodiment of the cutting mechanism according to the present invention.
Further, the inspection module B according to the present embodiment is an embodiment of the inspection mechanism according to the present invention.
Further, the package substrate P according to the present embodiment is an embodiment of the object to be cut according to the present invention.

Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and appropriate modifications can be made within the scope of the technical idea of the invention described in the claims. is there.

For example, the configuration of the cutting device 1 illustrated in this embodiment is an example, and the specific configuration can be changed as appropriate.

For example, in the present embodiment, each of the cutting module A and the inspection module B is provided with a control unit (control unit 8 and control unit 16), but the present invention is not limited to this, and each control unit is provided. It is also possible to combine them into one control unit or divide them into three or more control units. Further, the cutting device 1 of the present embodiment has a twin cut table configuration having two cutting tables 5, but the present invention is not limited to this, and the cutting device 1 has only one cutting table 5. There may be. Further, the cutting device 1 of the present embodiment has a twin spindle configuration having two spindles 6, but the present invention is not limited to this, and even if the cutting device 1 has only one spindle 6. Good.

Further, in the present embodiment, the holding member 100 is provided on the inspection table 11, but the present invention is not limited to this, and the holding member 100 may be provided on the transport unit 7, and the inspection table 11 and the transport unit are provided. The holding member 100 may be provided on both of the 7. The cutting device 1 includes only one of the first optical inspection camera 12 corresponding to the transport unit 7 provided with the holding member 100 and the second optical inspection camera 13 corresponding to the inspection table 11 provided with the holding member 100. It may be configured as an optical device.

Further, in the present embodiment, the resin reflecting portion 120 has a higher reflectance than the resin sheet 110, but the reflectance of light of all wavelengths does not necessarily have to be high. That is, since the holding member 100 is used for optical inspection by a camera (second optical inspection camera 13 in this embodiment), at least a wavelength corresponding to the characteristics (acquirable wavelength information) of this camera. It suffices that the resin reflecting portion 120 has a higher reflectance than the resin sheet 110.

Further, the reflectance is the reflectance with respect to the light source used for the inspection, and the emitted light may be a single light source or a plurality of light sources having the same wavelength range of the emitted light (illumination light). A plurality of light sources having different wavelength regions of (illumination light) may be used. Further, the reflectance is based on the detection by the camera, but the detection by the camera is the detection in the wavelength region of some of the multiple light sources even if the detection is in the entire wavelength region of a single light source or a plurality of light sources. It may be detection or detection of a part of a wavelength region of a single light source.

Further, the manufacturing method of the holding member 100 of the present embodiment is an example, and the order and specific contents of the steps can be arbitrarily changed.

For example, in the present embodiment, the flat member removing step S25 and the resin removing step S26 are performed before the secondary curing step S27, but the flat member removing step S25 and the resin removing are performed after the secondary curing step S27. It is also possible to carry out step S26. Specifically, the resin curing step S24, the flat member removing step S25, the resin removing step S26, the secondary curing step S27, the resin curing step S24, the flat member removing step S25, the secondary curing step S27, and the resin removing step S26. Or the resin curing step S24, the secondary curing step S27, the flat member removing step S25, and the resin removing step S26.

Further, in Example 1 (see FIG. 4), as in Example 2 (see FIG. 6), the resin defoaming step S22, the flat member arranging step S23, the flat member removing step S25, the resin removing step S26, and the secondary curing It is also possible to carry out step S27. In this case as well, the order of the processes and the specific contents can be arbitrarily changed.

Further, in the present embodiment, when the holding member 100 is manufactured, the resin R is cured by dividing it into two steps (resin curing step S24 and secondary curing step S27), but the present invention is not limited to this. Absent. For example, it is possible to finally cure the resin R only in the resin curing step S24 (that is, only in one step). This makes it possible to simplify the process of manufacturing the holding member 100. In this case, the heating temperature and the heating time are appropriately adjusted, such as heating in an oven at 60 ° C. for 5 hours so that the resin R can be sufficiently cured in the resin curing step S24. Further, in this case, since the secondary curing step S27 becomes unnecessary, the manufacturing of the holding member 100 is completed by performing the flat member removing step S25 and the resin removing step S26 after the resin curing step S24.

Further, in the present embodiment, the mirror surface sheet is used as the flat member F pressed against the resin R, but the present invention is not limited to this. That is, the flat member F is not limited as long as the resin reflective portion 120 having a flat surface can be obtained after the resin R is cured (when the production of the holding member 100 is completed). For example, the flat member F does not have to have a mirror surface. Further, the flat member F is not limited to a sheet shape.

1 Cutting device P Package substrate S Semiconductor package 100 Holding member 110 Resin sheet 111 Adsorption hole 112 Groove 120 Resin reflector A Cutting module B Inspection module

Claims (9)

A method for manufacturing a holding member that holds a plurality of holding objects and is used for optical inspection.
A resin filling step of filling the entire groove with a resin for a holding portion provided with a groove arranged between a plurality of suction holes for sucking the object to be held.
A method for manufacturing a holding member, which comprises a resin curing step of curing the resin. In the resin filling step, the resin is discharged by a dispenser, and the groove is filled with the resin.
The method for manufacturing a holding member according to claim 1. Prior to the resin filling step, a plasma irradiation step of irradiating the holding portion with plasma is further included.
The method for manufacturing a holding member according to claim 2. After the resin filling step, a resin defoaming step of defoaming the resin is further included.
The method for manufacturing a holding member according to claim 1 or 2. After the resin filling step, a flat member arranging step of arranging the flat member on the surface of the holding portion is further included.
The method for manufacturing a holding member according to claim 1 or 4. In the resin curing step, the resin is cured in a state where pressure is applied to the resin filled in the groove by the flat member.
The method for manufacturing a holding member according to claim 5. In the resin filling step, the resin is also filled in the plurality of suction holes.
After the resin curing step, a flat member removing step of removing the flat member from the surface of the holding portion,
After the flat member removing step, a resin removing step of removing the resin adhering to other than the groove of the holding portion is further included.
The method for manufacturing a holding member according to claim 5 or 6. After the resin curing step, a secondary curing step of further curing the resin is further included.
The method for manufacturing a holding member according to any one of claims 1 to 7. In the resin filling step, the resin is also filled in the plurality of suction holes.
After the resin curing step, a flat member removing step of removing the flat member from the surface of the holding portion,
After the flat member removing step, a resin removing step of removing the resin adhering to other than the groove of the holding portion, and a resin removing step.
After the resin removing step, a secondary curing step of further curing the resin is further included.
The method for manufacturing a holding member according to claim 5 or 6.

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