JP2020102510A - Removal method of sealing member, removal method of light emitting element, and removal jig - Google Patents

Removal method of sealing member, removal method of light emitting element, and removal jig Download PDF

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JP2020102510A
JP2020102510A JP2018239301A JP2018239301A JP2020102510A JP 2020102510 A JP2020102510 A JP 2020102510A JP 2018239301 A JP2018239301 A JP 2018239301A JP 2018239301 A JP2018239301 A JP 2018239301A JP 2020102510 A JP2020102510 A JP 2020102510A
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substrate
sealing member
light emitting
emitting element
jig
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JP7052708B2 (en
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真史 纐纈
Masashi Koketsu
真史 纐纈
重郎 武田
Shigeo Takeda
重郎 武田
下西　正太
Shota Shimonishi
正太 下西
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Toyoda Gosei Co Ltd
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Toyoda Gosei Co Ltd
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Priority to JP2018239301A priority Critical patent/JP7052708B2/en
Priority to PCT/JP2019/044674 priority patent/WO2020129486A1/en
Priority to CN201980074462.9A priority patent/CN112997327A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

To provide a removal method of a sealing member, a removal method of a light emitting element to which the method is applied, and a removal jig used in these methods, capable of efficiently removing a sealing member that seals a defective light emitting element so as not to adversely affect the reliability of the sealing member that seals the light emitting element which is a good product.SOLUTION: A removal method of a sealing member 26 according to an embodiment of the present invention includes a removal step of inserting a tip 12a of a claw 12 provided in a jig 10 for element removal between a substrate 20 and the sealing member 26, and removing the sealing member 26 from the substrate 20, and in the removal step, when the jig 10 is moved to the substrate 20 side with the claw 12 facing the substrate 20 side, the tip 12a of the claw 12 pressed against the substrate 20 slides on a surface of the substrate 20 as the jig 10 moves to the substrate 20 side, and is inserted between the substrate 20 and the sealing member 26.SELECTED DRAWING: Figure 3

Description

本発明は、封止部材の取り外し方法、発光素子の取り外し方法、及び取り外し用治具に関する。 The present invention relates to a method for removing a sealing member, a method for removing a light emitting element, and a removal jig.

従来、直下型バックライトなどの多数の発光素子を実装した発光装置の製造工程において、実装後に不良が判明した発光素子を取り外し、良品と交換する処置（リワーク）が取られている（例えば、特許文献１参照）。これは、不良の発光素子が１個でも存在すると、発光装置全体が不良となるためである。 Conventionally, in a manufacturing process of a light emitting device in which a large number of light emitting elements such as a direct type backlight are mounted, a light emitting element which has been found to be defective after mounting is removed and replaced with a non-defective product (rework). Reference 1). This is because if there is even one defective light emitting element, the entire light emitting device becomes defective.

また、製造する発光装置において発光素子が封止部材に封止されている場合は、不良の発光素子を取り外す際に封止部材も取り外す必要があるが、通常、基板と接着された封止部材の取り外しは容易ではない。 In addition, when the light emitting element in the light emitting device to be manufactured is sealed by the sealing member, the sealing member must be removed when the defective light emitting element is removed. Is not easy to remove.

特許文献１には、予め基板と封止部材の間に剥離層又は空気層を設けておくことにより、発光素子の不良が判明したときの封止部材の取り外しを容易にする方法が記載されている。 Patent Document 1 describes a method of facilitating the removal of the sealing member when a defect of the light emitting element is found by previously providing a peeling layer or an air layer between the substrate and the sealing member. There is.

特許第６１８２９１６号公報Patent No. 6182916

しかしながら、特許文献１に記載の方法によれば、交換の必要のない良品である発光素子と基板の間にも剥離層又は空気層が存在し、封止部材の取り外しが容易な状態にある。このため、封止部材が発光装置の動作時の熱などにより膨張した際に、基板から剥離するおそれがある。 However, according to the method described in Patent Document 1, the peeling layer or the air layer exists between the light emitting element and the substrate which are non-defective and does not need to be replaced, and the sealing member is easily removed. Therefore, when the sealing member expands due to heat or the like during the operation of the light emitting device, it may peel off from the substrate.

本発明の目的は、良品である発光素子を封止する封止部材の信頼性に悪影響を及ぼさないように、不良の発光素子を封止する封止部材を効率的に取り外すことができる、封止部材の取り外し方法、その方法を応用した発光素子の取り外し方法、及びそれらの方法に用いる取り外し用治具を提供することにある。 An object of the present invention is to efficiently remove a sealing member that seals a defective light emitting element so as not to adversely affect the reliability of the sealing member that seals a good light emitting element. (EN) It is an object to provide a method of removing a stop member, a method of removing a light emitting element to which the method is applied, and a jig for removal used in those methods.

本発明の一態様は、上記目的を達成するために、下記［１］〜［８］の封止部材の取り外し方法、下記［９］の発光素子の取り外し方法、及び下記［１０］の取り外し用治具を提供する。 In order to achieve the above object, one embodiment of the present invention is for removing the sealing member of the following [1] to [8], removing the light emitting element of the following [9], and removing the following [10]. Provide jig.

［１］基板に実装された発光素子を封止する封止部材の取り外し方法であって、素子取り外し用の治具に備わる爪の先端を前記基板と前記封止部材の間に差し入れ、前記封止部材を前記基板から取り外す、取り外し工程を含み、前記取り外し工程において、前記爪を前記基板側に向けた状態で前記治具を前記基板側へ移動させると、前記基板に押し当てられた前記爪の先端が、前記治具が前記基板側へ移動するのに伴って前記基板の表面上を摺動し、前記基板と前記封止部材の間に差し入れられる、封止部材の取り外し方法。
［２］前記取り外し工程において、前記爪の先端が、前記基板と前記発光素子の間に差し入れられ、前記発光素子が前記封止部材とともに取り外される、上記［１］に記載の封止部材の取り外し方法。
［３］前記取り外し工程において、前記封止部材を加熱しながら取り外す、上記［１］又は［２］に記載の封止部材の取り外し方法。
［４］前記爪が板バネ材からなる、上記［１］〜［３］のいずれか１項に記載の封止部材の取り外し方法。
［５］前記発光素子が、前記基板にフリップチップ実装され、前記基板と前記発光素子の間に前記封止部材の一部が入り込んでいる、上記［１］〜［４］のいずれか１項に記載の封止部材の取り外し方法。
［６］前記基板が、板状の基材と、前記基材上の配線と、前記基板の最表面に設けられた、前記基材及び配線よりも摩擦係数が小さい滑り層を有し、前記取り外し工程において、前記滑り層の表面上を前記爪の先端が摺動する、上記［１］〜［５］のいずれか１項に記載の封止部材の取り外し方法。
［７］前記滑り層が白色レジストである、上記［６］に記載の封止部材の取り外し方法。
［８］前記取り外し工程において、前記基板における前記発光素子が接続される配線が存在しない領域上を前記爪の先端が摺動する、上記［１］〜［７］のいずれか１項に記載の封止部材の取り外し方法。
［９］基板に実装された発光素子の取り外し方法であって、素子取り外し用の治具に備わる爪の先端を、前記基板と前記発光素子の間に差し入れ、前記発光素子を前記基板から取り外す、取り外し工程を含み、前記取り外し工程において、前記爪を前記基板側に向けた状態で前記治具を前記基板側へ移動させると、前記基板に押し当てられた前記爪の先端が、前記治具が前記基板側へ移動するのに伴って前記基板の表面上を摺動し、前記基板と前記発光素子の間に差し入れられる、発光素子の取り外し方法。
［１０］基板に実装された不良の発光素子、前記不良の発光素子を封止する封止部材、又は前記不良の発光素子及び前記封止部材を取り外すための取り外し用治具であって、基材と、前記基材に固定された爪と、を備え、前記爪を前記基板側に向けた状態で前記取り外し用治具を前記基板側へ移動させると、前記基板に押し当てられた前記爪の先端が、前記取り外し用治具が前記基板側へ移動するのに伴って前記基板の表面上を摺動する、取り外し用治具。 [1] A method for removing a sealing member for sealing a light emitting element mounted on a substrate, wherein a tip of a claw provided in a jig for element removal is inserted between the substrate and the sealing member, and the sealing is performed. A step of removing the stop member from the substrate is included, and in the removing step, when the jig is moved to the substrate side with the claw facing the substrate side, the claw pressed against the substrate The method of removing a sealing member, wherein the tip of the sliding member slides on the surface of the substrate as the jig moves to the substrate side, and is inserted between the substrate and the sealing member.
[2] Removal of the sealing member according to [1], wherein in the removing step, the tip of the claw is inserted between the substrate and the light emitting element, and the light emitting element is removed together with the sealing member. Method.
[3] The method for removing a sealing member according to the above [1] or [2], wherein in the removing step, the sealing member is removed while heating.
[4] The method for removing the sealing member according to any one of [1] to [3], wherein the claw is made of a leaf spring material.
[5] Any one of the above [1] to [4], wherein the light emitting element is flip-chip mounted on the substrate, and a part of the sealing member is inserted between the substrate and the light emitting element. The method for removing the sealing member according to.
[6] The substrate has a plate-shaped base material, wiring on the base material, and a sliding layer provided on the outermost surface of the substrate and having a friction coefficient smaller than those of the base material and the wiring, The method for removing the sealing member according to any one of [1] to [5], wherein the tip of the claw slides on the surface of the sliding layer in the removing step.
[7] The method for removing the sealing member according to the above [6], wherein the sliding layer is a white resist.
[8] The detachment step, according to any one of the above [1] to [7], wherein the tip of the nail slides on a region of the substrate where the wiring to which the light emitting element is connected does not exist. How to remove the sealing member.
[9] A method for removing a light emitting element mounted on a board, wherein a tip of a claw provided in a jig for removing the element is inserted between the board and the light emitting element, and the light emitting element is removed from the board. In the removal step, when the jig is moved to the substrate side in the removal step, the tip of the nail pressed against the substrate is A method for removing a light emitting element, which slides on the surface of the substrate as it moves to the substrate side and is inserted between the substrate and the light emitting element.
[10] A defective light emitting element mounted on a substrate, a sealing member for sealing the defective light emitting element, or a removal jig for removing the defective light emitting element and the sealing member, And a claw fixed to the base material, and when the removal jig is moved to the substrate side with the claw facing the substrate side, the claw pressed against the substrate The removal jig in which the tip of the slides on the surface of the substrate as the removal jig moves to the substrate side.

本発明によれば、良品である発光素子を封止する封止部材の信頼性に悪影響を及ぼさないように、不良の発光素子を封止する封止部材を効率的に取り外すことができる、封止部材の取り外し方法、その方法を応用した発光素子の取り外し方法、及びそれらの方法に用いる取り外し用治具を提供することができる。 According to the present invention, a sealing member for sealing a defective light emitting element can be efficiently removed so as not to adversely affect the reliability of the sealing member for sealing a light emitting element which is a good product. It is possible to provide a method of removing a stop member, a method of removing a light emitting element to which the method is applied, and a jig for removal used in those methods.

図１は、本発明の第１の実施の形態に係るリワーク装置の構成を概略的に示す模式図である。FIG. 1 is a schematic diagram schematically showing the configuration of a rework device according to a first embodiment of the present invention. 図２（ａ）は、第１の実施の形態に係る治具の構成の例を示す垂直断面図である。図２（ｂ）は、治具の動作を模式的に示す垂直断面図である。FIG. 2A is a vertical sectional view showing an example of the configuration of the jig according to the first embodiment. FIG. 2B is a vertical sectional view schematically showing the operation of the jig. 図３（ａ）〜（ｄ）は、第１の実施の形態に係るリワークの流れの一例を示す垂直断面図である。3A to 3D are vertical cross-sectional views showing an example of the flow of rework according to the first embodiment. 図４（ａ）〜（ｄ）は、第１の実施の形態に係るリワークの流れの一例を示す垂直断面図である。4A to 4D are vertical cross-sectional views showing an example of the rework flow according to the first embodiment. 図５（ａ）は、配線が発光素子から直線状に延びている場合の、２つの爪の先端の好ましい摺動方向を模式的に示す上面図である。図５（ｂ）は、図５（ａ）に示される発光素子と配線、及びその周辺部材の、配線の長さ方向に直交する垂直断面図である。FIG. 5A is a top view schematically showing a preferable sliding direction of the tips of the two claws when the wiring linearly extends from the light emitting element. FIG. 5B is a vertical sectional view of the light emitting element and the wiring shown in FIG. 5A and the peripheral members thereof, which is orthogonal to the length direction of the wiring. 図６は、残渣の状態を示す平面図である。FIG. 6 is a plan view showing the state of the residue. 図７（ａ）〜（ｃ）は、第２の実施の形態に係るリワークの流れの一例を示す垂直断面図である。7A to 7C are vertical cross-sectional views showing an example of the rework flow according to the second embodiment. 図８（ａ）、（ｂ）は、本発明の変形例に係る発光装置の垂直断面図である。8A and 8B are vertical sectional views of a light emitting device according to a modified example of the invention.

〔第１の実施の形態〕
図１は、本発明の第１の実施の形態に係るリワーク装置３０の構成を概略的に示す模式図である。 [First Embodiment]
FIG. 1 is a schematic diagram schematically showing the configuration of a rework device 30 according to the first embodiment of the present invention.

リワーク装置３０は、ベース３１と、ベース３１上の前面側に設けられた基板移動機構３２と、基板移動機構３２に鉛直方向（上下方向）及び水平方向（前後左右方向）に移動可能に支持される基板ホルダー３３と、ベース３１上の背面側に設けられた筐体３４と、筐体３４に鉛直方向に移動可能に支持されるヘッド部３５と、を備える。 The rework device 30 is supported by a base 31, a substrate moving mechanism 32 provided on the front side of the base 31, and a substrate moving mechanism 32 so as to be movable in a vertical direction (vertical direction) and a horizontal direction (front-rear left-right direction). A substrate holder 33, a housing 34 provided on the back side of the base 31, and a head portion 35 movably supported in the housing 34 in the vertical direction.

ヘッド部３５は、基板ホルダー３３の上方に、基板ホルダー３３に保持される基板２０に対して各種処理を実施するための治具１０などの治具を接続するための接続部３５ａを有する。 The head portion 35 has, above the substrate holder 33, a connection portion 35 a for connecting a jig such as the jig 10 for performing various processes to the substrate 20 held by the substrate holder 33.

ヒーター３６は、発光素子の実装などの際に基板２０を加熱するためのヒーターであり、例えば、ホットエアー方式のヒーター、遠赤外線方式のヒーター、又はこれらの組み合わせから構成される非接触加熱式のエリアヒーターである。また、ホットエアー方式のヒーターなどの非接触加熱式のヒーター、又は接触加熱式のヒーターが接続部３５ａに含まれていてもよい。接続部３５ａのヒーターは、基板２０を上方から加熱するトップヒーターである。また、リワーク装置３０は、基板ホルダー３３の下の治具１０の直下に位置する接触加熱式のボトムヒーターを備えていてもよい。 The heater 36 is a heater for heating the substrate 20 at the time of mounting a light emitting element, and is, for example, a hot air heater, a far infrared heater, or a non-contact heating type heater composed of a combination thereof. It is an area heater. Further, a non-contact heating type heater such as a hot air type heater or a contact heating type heater may be included in the connection portion 35a. The heater of the connecting portion 35a is a top heater that heats the substrate 20 from above. Further, the rework device 30 may include a contact heating type bottom heater located directly below the jig 10 under the substrate holder 33.

リワーク装置３０としては、例えば、デンオン機器株式会社製のＲＤ−５００ＳＶを用いることができる。 As the rework device 30, for example, RD-500SV manufactured by Denon Equipment Co., Ltd. can be used.

ヘッド部３５の接続部３５ａに接続される治具１０は、基板ホルダー３３に保持される基板２０に実装された、不良の発光素子及びそれを封止する封止部材を取り外すための治具である。 The jig 10 connected to the connecting portion 35a of the head portion 35 is a jig for removing a defective light emitting element mounted on the substrate 20 held by the substrate holder 33 and a sealing member for sealing the defective light emitting element. is there.

図２（ａ）は、第１の実施の形態に係る治具１０の構成の例を示す垂直断面図である。治具１０は、基材１１と、固定部１３により基材１１に固定された、不良の発光素子及びそれを封止する封止部材を基板２０から取り外すための２つの爪１２を有する。 FIG. 2A is a vertical sectional view showing an example of the configuration of the jig 10 according to the first exemplary embodiment. The jig 10 has a base material 11 and two claws 12 fixed to the base material 11 by the fixing portion 13 for removing a defective light emitting element and a sealing member for sealing the defective light emitting element from the substrate 20.

図２（ｂ）は、治具１０の動作を模式的に示す垂直断面図である。リワーク装置３０のヘッド部３５を下降させて、２つの爪１２を基板２０側に向けた状態で治具１０を基板２０側へ移動させると、基板２０に押し当てられた２つの爪１２の先端１２ａが、治具１０が基板２０側へ移動するのに伴って閉じるように基板２０の表面上を摺動する。 FIG. 2B is a vertical sectional view schematically showing the operation of the jig 10. When the head portion 35 of the rework device 30 is lowered and the jig 10 is moved to the substrate 20 side with the two claws 12 facing the substrate 20 side, the tips of the two claws 12 pressed against the substrate 20. 12 a slides on the surface of the substrate 20 so as to close as the jig 10 moves to the substrate 20 side.

このとき、２つの爪１２の先端１２ａの間に発光素子があれば、２つの爪１２の先端１２ａが基板２０と発光素子の間に発光素子の両側から差し入れられ、発光素子及び発光素子を覆う封止部材を基板２０から取り外すことができる。 At this time, if there is a light emitting element between the tips 12a of the two claws 12, the tips 12a of the two claws 12 are inserted between the substrate 20 and the light emitting element from both sides of the light emitting element to cover the light emitting element and the light emitting element. The sealing member can be removed from the substrate 20.

基材１１の材料や形状は、特に限定されない。爪１２の材料や形状は、図２（ｂ）に示される動作が可能なものであれば、特に限定されない。図２（ａ）に示される例では、爪１２は板バネ材から構成される。固定部１３の構成は特に限定されない。図２（ａ）に示される例では、固定部１３はネジ、ナット、ワッシャーで構成される。 The material and shape of the base material 11 are not particularly limited. The material and shape of the claw 12 are not particularly limited as long as the operation shown in FIG. 2B is possible. In the example shown in FIG. 2A, the claw 12 is made of a leaf spring material. The configuration of the fixed portion 13 is not particularly limited. In the example shown in FIG. 2A, the fixing portion 13 is composed of screws, nuts and washers.

なお、治具１０に備わる爪１２は１つでもよい。その場合、１つの爪１２が基板２０の表面上を摺動し、基板２０と発光素子の間に差し入れられ、発光素子と封止部材を取り外す。しかしながら、発光素子及び封止部材を爪１２で両側から挟み込むことにより、より取り外し易くなるため、治具１０は２つの爪１２を備えることが好ましい。以下、治具１０が２つの爪１２を備える場合について説明する。 Note that the jig 10 may be provided with only one claw 12. In that case, one claw 12 slides on the surface of the substrate 20, is inserted between the substrate 20 and the light emitting element, and the light emitting element and the sealing member are removed. However, by sandwiching the light emitting element and the sealing member from both sides with the claws 12, it becomes easier to remove, and therefore the jig 10 preferably includes two claws 12. Hereinafter, a case where the jig 10 includes two claws 12 will be described.

また、基板２０と発光素子との接合強度が高くなく、比較的取り外しが容易な場合は、爪１２の先端１２ａを基板２０と封止部材との間に差し入れ、持ち上げることにより、封止部材に密着する発光素子を封止部材とともに取り外すことができる。すなわち、爪１２の先端１２ａを基板２０と発光素子の間にまで差し入れなくても、基板２０と封止部材との間に差し入れれば、発光素子を基板２０から取り外すことができる。より確実に発光素子を封止部材とともに取り外したい場合は、爪１２の先端１２ａを基板２０と発光素子の間にまで差し入れることが好ましい。 Further, when the bonding strength between the substrate 20 and the light emitting element is not high and it is relatively easy to remove, the tip 12a of the claw 12 is inserted between the substrate 20 and the sealing member and lifted to form the sealing member. The light emitting element that is in close contact can be removed together with the sealing member. That is, even if the tip 12 a of the claw 12 is not inserted between the substrate 20 and the light emitting element, the light emitting element can be removed from the substrate 20 by inserting it between the substrate 20 and the sealing member. In order to remove the light emitting element together with the sealing member more reliably, it is preferable to insert the tip 12a of the claw 12 up to between the substrate 20 and the light emitting element.

爪１２の先端１２ａを基板２０と封止部材との間に差し入れ、封止部材を取り外す場合、基板２０と発光素子との接合強度などによっては、発光素子が封止部材とともに取り外されない場合がある。治具１０は、このような場合に、基板２０上に残された封止されていない発光素子を取り外すこともできる。また、発光素子の実装位置がずれた場合など、発光素子の問題が封止前に判明した場合に、封止されていない発光素子を治具１０により取り外すこともできる。 When inserting the tip 12a of the claw 12 between the substrate 20 and the sealing member and removing the sealing member, the light emitting element may not be removed together with the sealing member depending on the bonding strength between the substrate 20 and the light emitting element. is there. In such a case, the jig 10 can also remove the unsealed light emitting element left on the substrate 20. In addition, when the mounting position of the light emitting element is displaced or the problem of the light emitting element is found before the sealing, the unsealed light emitting element can be removed by the jig 10.

ヘッド部３５の接続部３５ａに接続できる治具としては、治具１０の他に、例えば、半田供給、半田除去、チップ実装用のものがある。これらの治具は、ヘッド部３５の接続部３５ａに適宜付け替えることができる。 As jigs that can be connected to the connecting portion 35a of the head portion 35, there are, for example, those for solder supply, solder removal, and chip mounting other than the jig 10. These jigs can be appropriately replaced with the connecting portion 35a of the head portion 35.

以下、基板２０に実装された発光素子及びそれを封止する封止部材を基板２０から取り外し、新たな発光素子及び封止部材を実装する（以下、リワークと呼ぶ）方法について説明する。 Hereinafter, a method of removing the light emitting element mounted on the substrate 20 and the sealing member for sealing the light emitting element from the substrate 20 and mounting a new light emitting element and a sealing member (hereinafter, referred to as rework) will be described.

図３（ａ）〜（ｄ）、図４（ａ）〜（ｄ）は、第１の実施の形態に係るリワークの流れの一例を示す垂直断面図である。 3A to 3D and FIGS. 4A to 4D are vertical cross-sectional views showing an example of the rework flow according to the first embodiment.

まず、図３（ａ）に示される様に、治具１０の２つの爪１２の先端１２ａで、基板２０に実装された発光素子２４を封止する封止部材２６を両側から挟み込む。 First, as shown in FIG. 3A, the sealing members 26 for sealing the light emitting element 24 mounted on the substrate 20 are sandwiched from both sides by the tips 12a of the two claws 12 of the jig 10.

具体的には、リワーク装置３０のヘッド部３５を下降させて、治具１０の２つの爪１２の先端１２ａを基板２０の表面に押し当てて、基板２０の表面上を閉じるように摺動させ、封止部材２６を両側から挟み込む。 Specifically, the head portion 35 of the rework device 30 is lowered, the tips 12a of the two claws 12 of the jig 10 are pressed against the surface of the substrate 20, and the surface of the substrate 20 is slid so as to be closed. , The sealing member 26 is sandwiched from both sides.

ここで、基板２０は、板状の基材２１と、基材２１の表面上に形成された配線２２とを有する。発光素子２４は、半田２５により配線２２に接続されている。 Here, the substrate 20 has a plate-shaped base material 21 and wirings 22 formed on the surface of the base material 21. The light emitting element 24 is connected to the wiring 22 by solder 25.

また、基板２０は、図３（ａ）に示される様に、基板２０の最表面に設けられた、基材２１及び配線２２よりも摩擦係数が小さい滑り層２３を有することが好ましい。この場合、爪１２の先端１２ａに基板２０の滑り層２３の表面を摺動させることにより、先端１２ａの摺動がスムーズになり、発光素子２４及び封止部材２６の取り外しが容易になる、基板２０の損傷が抑えられるなどの効果が得られる。 Further, as shown in FIG. 3A, the substrate 20 preferably has a sliding layer 23 provided on the outermost surface of the substrate 20 and having a friction coefficient smaller than that of the base material 21 and the wiring 22. In this case, by sliding the surface of the sliding layer 23 of the substrate 20 on the tip 12a of the claw 12, the tip 12a slides smoothly, and the light emitting element 24 and the sealing member 26 are easily removed. It is possible to obtain an effect such that damage of 20 is suppressed.

滑り層２３は、白色レジストであることが好ましい。この場合、上述の滑り層の効果に加えて、基板２０の表面の反射率を向上させて発光装置の発光強度を向上させるなどの効果を得ることができる。 The sliding layer 23 is preferably a white resist. In this case, in addition to the effect of the above-mentioned sliding layer, it is possible to obtain the effect of improving the reflectance of the surface of the substrate 20 and improving the light emission intensity of the light emitting device.

発光素子２４は、例えば、チップ基板と、発光層及びそれを挟むＰ層とＮ層を含む結晶層とを有するＬＥＤチップである。図３（ａ）に示される例では、発光素子２４は基板２０にフリップチップ実装されている。フリップチップ実装の場合、フェイスアップ実装の場合と比較して、発光素子２４と基板２０との間隔が大きいため、治具１０の２つの爪１２の先端１２ａを基板２０と発光素子２４の間に差し入れやすい。すなわち、本実施の形態に方法により、発光素子２４及び封止部材２６を取り外しやすい。さらに、基板２０と発光素子２４の間（基板２０と発光素子２４を接合するバンプや半田の間）に封止部材２６の一部が入り込んでいることが好ましい。この場合、発光素子２４を封止部材２６とともに持ち上げ、取り外すことが容易になる。なお、発光素子２４は、レーザーダイオード等のＬＥＤチップ以外の発光素子であってもよい。 The light emitting element 24 is, for example, an LED chip having a chip substrate, a light emitting layer and a crystal layer including a P layer and an N layer sandwiching the light emitting layer. In the example shown in FIG. 3A, the light emitting element 24 is flip-chip mounted on the substrate 20. In the case of flip-chip mounting, the distance between the light emitting element 24 and the substrate 20 is larger than in the case of face-up mounting. Easy to insert. That is, the light emitting element 24 and the sealing member 26 can be easily removed by the method according to the present embodiment. Further, it is preferable that a part of the sealing member 26 is inserted between the substrate 20 and the light emitting element 24 (between the bumps or solder for joining the substrate 20 and the light emitting element 24). In this case, it becomes easy to lift and remove the light emitting element 24 together with the sealing member 26. The light emitting element 24 may be a light emitting element other than the LED chip such as a laser diode.

本実施の形態において基板２０から取り外される発光素子２４は、直下型バックライトなどの発光装置に実装された多数の発光素子のうちの、実装後に不良が判明した発光素子である。 In the present embodiment, the light emitting element 24 removed from the substrate 20 is a light emitting element which has been found to be defective after mounting, out of a large number of light emitting elements mounted on a light emitting device such as a direct type backlight.

封止部材２６は、シリコーンやエポキシなどの透明樹脂からなる。また、封止部材２６は、典型的には、ダムを用いずに滴下した樹脂を硬化させることにより形成され、表面が凸状の曲面であるレンズ形状を有し、発光素子２４のレンズとして機能する。 The sealing member 26 is made of a transparent resin such as silicone or epoxy. The sealing member 26 is typically formed by curing a dropped resin without using a dam, has a lens shape with a convex curved surface, and functions as a lens of the light emitting element 24. To do.

次に、図３（ｂ）に示される様に、治具１０をさらに基板２０へ近づけて、２つの爪１２の先端１２ａを基板２０の表面上をさらに摺動させる。これによって、封止部材２６を基板から剥離させつつ、２つの爪１２の先端１２ａを発光素子２４の両側から基板２０と発光素子２４の間に差し入れる。 Next, as shown in FIG. 3B, the jig 10 is brought closer to the substrate 20, and the tips 12 a of the two claws 12 are further slid on the surface of the substrate 20. As a result, the tip ends 12a of the two claws 12 are inserted from both sides of the light emitting element 24 between the substrate 20 and the light emitting element 24 while peeling the sealing member 26 from the substrate.

そして、２つの爪１２の先端１２ａを基板２０の表面上をさらに摺動させることにより、発光素子２４を封止部材２６とともに基板２０から剥離させ、発光素子２４及び封止部材２６を同時に基板２０から取り除く。 Then, by further sliding the tips 12a of the two claws 12 on the surface of the substrate 20, the light emitting element 24 is separated from the substrate 20 together with the sealing member 26, and the light emitting element 24 and the sealing member 26 are simultaneously removed from the substrate 20. Remove from.

爪１２の先端１２ａが基板２０と発光素子の間に容易に差し入れられるようにするため、先端１２ａの厚さは、基板２０と発光素子の間隔よりも小さいことが好ましい。 The thickness of the tip 12a is preferably smaller than the distance between the substrate 20 and the light emitting element so that the tip 12a of the claw 12 can be easily inserted between the substrate 20 and the light emitting element.

上述の発光素子２４及び封止部材２６を基板２０から剥離させる工程は、ヒーター３６などの各種ヒーターを用いて封止部材２６を加熱した状態で実施することが好ましい。この場合、封止部材２６の取り切れずに残る部分の量を減らすことができる。 The above-described step of peeling the light emitting element 24 and the sealing member 26 from the substrate 20 is preferably performed in a state where the sealing member 26 is heated by using various heaters such as the heater 36. In this case, the amount of the portion of the sealing member 26 that remains without being cut off can be reduced.

図３（ｃ）に示される様に、発光素子２４及び封止部材２６を取り除いた後、完全に取り切れなかった封止部材２６の一部が基板２０上に残る。 As shown in FIG. 3C, after removing the light emitting element 24 and the sealing member 26, a part of the sealing member 26 that is not completely removed remains on the substrate 20.

図３（ｃ）に示される様に、封止部材２６の発光素子２４の下に位置していた部分や、封止部材２６の外縁（封止部材２６の底面の輪郭）部分が除去されずに残渣として残ることが多い。ここで、封止部材２６の外縁に残った残渣を残渣２６ａ、発光素子２４の下にあった部分に残った残渣を２６ｂとする。 As shown in FIG. 3C, the portion of the sealing member 26 located under the light emitting element 24 and the outer edge of the sealing member 26 (the contour of the bottom surface of the sealing member 26) are not removed. Often remains as a residue. Here, the residue remaining on the outer edge of the sealing member 26 is referred to as a residue 26a, and the residue remaining below the light emitting element 24 is referred to as 26b.

次に、図３（ｄ）に示される様に、基板２０上から半田２５を除去する。具体的には、例えば、吸引機能付きの治具を用いて、半田２５を溶融させながら吸引して除去する。半田２５の除去は、このような吸引機能付きの治具を用いて、リワーク装置３０において実施することができる。 Next, as shown in FIG. 3D, the solder 25 is removed from the substrate 20. Specifically, for example, a jig having a suction function is used to suck and remove the solder 25 while melting it. The removal of the solder 25 can be performed in the rework apparatus 30 using such a jig with a suction function.

次に、図４（ａ）に示される様に、基板２０の表面にバフ研磨などの封止部材２６の残渣を除去するための処理を施す。これによって、基板２０の表面上に突出して残った残渣２６ａなどが除去される。 Next, as shown in FIG. 4A, the surface of the substrate 20 is subjected to a treatment such as buffing to remove the residue of the sealing member 26. As a result, the residue 26a and the like left on the surface of the substrate 20 protruding from the surface are removed.

次に、図４（ｂ）に示される様に、基板２０上の半田２５が除去された部分に新たに半田１２５を供給する。半田１２５の供給は、二股のスタンプツールなどの半田供給用の治具を用いて、リワーク装置３０において実施することができる。 Next, as shown in FIG. 4B, the solder 125 is newly supplied to the portion of the substrate 20 where the solder 25 has been removed. The solder 125 can be supplied in the rework apparatus 30 by using a solder supplying jig such as a forked stamp tool.

次に、図４（ｃ）に示される様に、基板２０上に新たに発光素子１２４を実装する。このとき、発光素子１２４の電極が半田１２５の上に乗るように、発光素子１２４を実装する。すなわち、発光素子２４の実装位置に発光素子１２４を実装する。発光素子１２４の実装は、素子実装用の治具を用いて、リワーク装置３０において実施することができる。 Next, as shown in FIG. 4C, the light emitting element 124 is newly mounted on the substrate 20. At this time, the light emitting element 124 is mounted so that the electrodes of the light emitting element 124 are placed on the solder 125. That is, the light emitting element 124 is mounted at the mounting position of the light emitting element 24. The light emitting element 124 can be mounted in the rework apparatus 30 by using a jig for mounting the element.

そして、基板２０を加熱して、半田１２５により基板２０の配線２２と発光素子１２４をリフロー半田付けする。基板２０の加熱は、ヒーター３６や基板２０を上方から加熱するヒーターを用いて、リワーク装置３０において実施することができる。 Then, the substrate 20 is heated and the wiring 22 of the substrate 20 and the light emitting element 124 are reflow-soldered by the solder 125. The substrate 20 can be heated in the rework apparatus 30 by using the heater 36 or a heater that heats the substrate 20 from above.

次に、図４（ｄ）に示される様に、基板２０上の封止部材２６が除去された部分に新たに封止部材１２６を形成する。封止部材１２６は、滴下法などにより形成される。 Next, as shown in FIG. 4D, a sealing member 126 is newly formed on the portion of the substrate 20 where the sealing member 26 has been removed. The sealing member 126 is formed by a dropping method or the like.

上述のリワーク工程を、不良であることが判明した全ての発光素子２４及びそれを封止する封止部材２６に対して実施することにより、直下型バックライトなどの複数の発光素子を実装した発光装置であって、不良の発光素子２４が発光素子１２４に交換された発光装置１が得られる。 By performing the above-described rework process on all the light emitting elements 24 which are found to be defective and the sealing member 26 that seals the light emitting elements 24, light emission in which a plurality of light emitting elements such as a direct type backlight is mounted is performed. A light emitting device 1 is obtained in which the defective light emitting element 24 is replaced with the light emitting element 124.

なお、上述のリワーク工程は、発光素子２４が封止部材２６に封止されていない場合にも適用することができる。すなわち、発光素子２４と封止部材２６を取り外す上記の方法を応用して、封止されていない発光素子２４を取り外すことができる。 The above rework process can be applied even when the light emitting element 24 is not sealed by the sealing member 26. That is, the unsealed light emitting element 24 can be removed by applying the above method for removing the light emitting element 24 and the sealing member 26.

なお、発光素子２４及び封止部材２６を基板２０から取り外す工程においては、基板２０における配線２２が存在しない領域上を爪１２の先端１２ａが摺動することが好ましい。基板２０の配線２２が存在しない領域上では、配線２２が存在する領域上と比較して、配線２２の厚さ分だけ爪１２の先端１２ａの位置が低くなるため、先端１２ａを基板２０と発光素子２４の間に差し入れることが容易になる。すなわち、基板２０からの発光素子２４及び封止部材２６の取り外しが容易になる。 In the step of removing the light emitting element 24 and the sealing member 26 from the substrate 20, the tip 12a of the claw 12 preferably slides on a region of the substrate 20 where the wiring 22 does not exist. On the region of the substrate 20 where the wiring 22 does not exist, the position of the tip 12a of the claw 12 becomes lower than that on the region where the wiring 22 exists by the thickness of the wiring 22, so that the tip 12a emits light to the substrate 20. It becomes easy to insert it between the elements 24. That is, the light emitting element 24 and the sealing member 26 can be easily removed from the substrate 20.

図５（ａ）は、配線２２が発光素子２４から直線状に延びている場合の、２つの爪１２の先端１２ａの好ましい摺動方向を模式的に示す上面図である。なお、図５（ａ）においては、配線２２と発光素子２４以外の部材の図示を省略している。 FIG. 5A is a top view schematically showing a preferable sliding direction of the tips 12 a of the two claws 12 when the wiring 22 extends linearly from the light emitting element 24. 5A, members other than the wiring 22 and the light emitting element 24 are omitted.

図５（ｂ）は、図５（ａ）に示される発光素子２４と配線２２、及びその周辺部材の、配線２２の長さ方向に直交する垂直断面図である。 FIG. 5B is a vertical cross-sectional view of the light emitting element 24 and the wiring 22 shown in FIG. 5A, and the peripheral members thereof, which are orthogonal to the length direction of the wiring 22.

図５（ａ）、（ｂ）に示されるように、配線２２が発光素子２４から直線状に延びている場合、２つの爪１２の先端１２ａの摺動方向を、配線２２の長さ方向に直交させることにより、先端１２ａを基板２０と発光素子２４の間に容易に差し入れることができる。 As shown in FIGS. 5A and 5B, when the wiring 22 extends linearly from the light emitting element 24, the sliding direction of the tips 12 a of the two claws 12 is changed to the length direction of the wiring 22. By making them orthogonal to each other, the tip 12 a can be easily inserted between the substrate 20 and the light emitting element 24.

また、封止部材２６を基板から取り外す方法として、先端が金属製の吸引装置に熱を加え、封止部材２６に押し当て、封止部材２６を崩しながら吸引して除去する方法を用いてもよい。この方法は、加熱可能な吸引用の治具を用いて、リワーク装置３０において実施することができる。 Further, as a method of removing the sealing member 26 from the substrate, a method of applying heat to a suction device having a metal tip, pressing it against the sealing member 26, and sucking and removing the sealing member 26 while destroying the sealing member 26 may be used. Good. This method can be performed in the rework apparatus 30 using a heatable suction jig.

また、封止部材２６を基板から取り外す方法として、日本精密機械工作株式会社製のリューターなどのグラインダーを用いて封止部材２６を削り取る方法を用いてもよい。この方法によれば、グラインダーにより綿棒などの繊維素材を回転させながら封止部材２６に押し当て、削り取ることができる。 Further, as a method of removing the sealing member 26 from the substrate, a method of scraping off the sealing member 26 using a grinder such as a router manufactured by Japan Precision Machinery Co., Ltd. may be used. According to this method, a fiber material such as a cotton swab can be pressed against the sealing member 26 while being rotated by a grinder and scraped off.

また、封止部材２６を基板から取り外す方法として、加熱した半田ごてを封止部材２６に接触させ、熱により変質して浮いた封止部材２６を半田ごてで擦り切って取り外す方法を用いてもよい。 As a method for removing the sealing member 26 from the substrate, a method is used in which a heated soldering iron is brought into contact with the sealing member 26, and the floating sealing member 26 that has been deteriorated due to heat is scraped off with the soldering iron and removed. May be.

〔第２の実施の形態〕
本発明の第２の実施の形態は、封止部材２６の残渣２６ａを封止部材１２６の製造に利用する点において、第１の実施の形態と異なる。なお、第１の実施の形態と同様の点（物の構成や処理工程など）については、その説明を省略又は簡略化する。 [Second Embodiment]
The second embodiment of the present invention is different from the first embodiment in that the residue 26a of the sealing member 26 is used for manufacturing the sealing member 126. It should be noted that the description of the same points as the first embodiment (the structure of the object, the processing steps, etc.) will be omitted or simplified.

以下、第２の実施の形態に係るリワーク方法について説明する。 The rework method according to the second embodiment will be described below.

まず、図３（ａ）〜（ｄ）に示される、半田２５を除去するまでの工程を、第１の実施の形態と同様に実施する。 First, the steps shown in FIGS. 3A to 3D until the solder 25 is removed are carried out in the same manner as in the first embodiment.

第２の実施の形態では、封止部材２６の外縁の残渣２６ａを残したままで、封止部材１２６の形成を行う。このため、半田２５を除去した後、残渣２６ａを残すため、例えば、封止部材２６の残渣の総量などに応じて、図４（ａ）に示される残渣の除去処理を省いたり、残渣２６ａが残る程度に残渣の除去処理を実施したりする。 In the second embodiment, the sealing member 126 is formed while leaving the residue 26a on the outer edge of the sealing member 26. Therefore, since the residue 26a is left after the solder 25 is removed, the residue removal process shown in FIG. 4A may be omitted or the residue 26a may be removed depending on the total amount of the residue of the sealing member 26, for example. The residue is removed to the extent that it remains.

ここで、残渣２６ａは、基板２０上の封止部材２６の外縁の少なくとも一部に残されるが、後述するダムとしての機能を優れたものにするため、封止部材２６の外縁の全周に渡って残されることが好ましい。例えば、封止部材２６の平面視での形状が円形である場合は、残渣２６ａが不連続な円形に残されてもよいが、完全に連続した円形に残されることが好ましい。 Here, the residue 26a is left on at least a part of the outer edge of the sealing member 26 on the substrate 20, but in order to improve the function as a dam described later, the residue 26a is formed on the entire circumference of the outer edge of the sealing member 26. It is preferably left over. For example, when the shape of the sealing member 26 in a plan view is circular, the residue 26a may be left in a discontinuous circle, but it is preferably left in a completely continuous circle.

また、封止部材１２６の形成後の光学特性への影響を抑えるため、残渣２６ａの高さは、５０μｍ以下であることが好ましい。 Further, in order to suppress the influence on the optical characteristics after forming the sealing member 126, the height of the residue 26a is preferably 50 μm or less.

図６は、残渣２６ａの状態を示す平面図である。図６に示されるように、残渣２６ａは、その内周面２６０に凹凸を有する。この内周面２６０の凹凸は、封止部材２６を取り外す際に形成されるものである。この内周面２６０の凹凸の存在により、後述する封止部材１２６と残渣２６ａの密着性が高まり、封止部材１２６の剥離が抑制される。 FIG. 6 is a plan view showing a state of the residue 26a. As shown in FIG. 6, the residue 26a has irregularities on its inner peripheral surface 260. The unevenness of the inner peripheral surface 260 is formed when the sealing member 26 is removed. Due to the presence of the irregularities on the inner peripheral surface 260, the adhesion between the sealing member 126 and the residue 26a, which will be described later, is increased, and the peeling of the sealing member 126 is suppressed.

図７（ａ）〜（ｃ）は、半田２５を除去した後の第２の実施の形態に係るリワークの流れの一例を示す垂直断面図である。 7A to 7C are vertical cross-sectional views showing an example of the rework flow according to the second embodiment after the solder 25 is removed.

まず、図７（ａ）に示される様に、封止部材２６の外縁の残渣２６ａを残したままで、半田１２５を供給する。 First, as shown in FIG. 7A, the solder 125 is supplied while leaving the residue 26a on the outer edge of the sealing member 26.

次に、図７（ｂ）に示される様に、基板２０上の発光素子２４の実装位置に発光素子１２４を実装する。そして、基板２０を加熱して、半田１２５により基板２０の配線２２と発光素子１２４をリフロー半田付けする。 Next, as shown in FIG. 7B, the light emitting element 124 is mounted at the mounting position of the light emitting element 24 on the substrate 20. Then, the substrate 20 is heated and the wiring 22 of the substrate 20 and the light emitting element 124 are reflow-soldered by the solder 125.

次に、図７（ｃ）に示される様に、基板２０上の残渣２６ａの内側に滴下法などにより樹脂を供給し、封止部材１２６を形成する。このとき、封止部材２６の外縁の残渣２６ａがダムとして機能するため、封止部材１２６の形状やサイズの制御が容易であり、除去された封止部材２６と近い形状やサイズで封止部材１２６を形成することができる。このため、封止部材２６を封止部材１２６へ交換することによる発光特性への悪影響を抑えることができる。 Next, as shown in FIG. 7C, a resin is supplied to the inside of the residue 26a on the substrate 20 by a dropping method or the like to form the sealing member 126. At this time, since the residue 26a on the outer edge of the sealing member 26 functions as a dam, it is easy to control the shape and size of the sealing member 126, and the sealing member 26 has a shape and size close to that of the removed sealing member 26. 126 can be formed. For this reason, it is possible to suppress the adverse effect on the light emission characteristics due to the replacement of the sealing member 26 with the sealing member 126.

また、残渣２６ａをダムとして用いることにより、発光素子２４及び封止部材２６を基板２０から取り外す工程において、爪１２の先端１２ａの摺動などにより基板２０の表面にキズが付いている場合であっても、封止部材１２６の形状やサイズを制御することができる。 Further, when the residue 26a is used as a dam, the surface of the substrate 20 may be scratched due to sliding of the tip 12a of the claw 12 in the process of removing the light emitting element 24 and the sealing member 26 from the substrate 20. However, the shape and size of the sealing member 126 can be controlled.

封止部材１２６の材料として、封止部材２６と同様の材料（樹脂組成物）を用いることができる。また、封止部材１２６の材料は、封止部材２６の材料、すなわち残渣２６ａの材料と同一であることが好ましい。この場合、封止部材１２６と残渣２６ａの密着性が高まり、封止部材１２６の剥離が抑制される。 As the material of the sealing member 126, the same material (resin composition) as that of the sealing member 26 can be used. The material of the sealing member 126 is preferably the same as the material of the sealing member 26, that is, the material of the residue 26a. In this case, the adhesion between the sealing member 126 and the residue 26a is enhanced, and the peeling of the sealing member 126 is suppressed.

上述のリワーク工程を、不良であることが判明した全ての発光素子２４及びそれを封止する封止部材２６に対して実施することにより、直下型バックライトなどの複数の発光素子を実装した発光装置であって、不良の発光素子２４が発光素子１２４に交換された発光装置２が得られる。 By performing the above-described rework process on all the light emitting elements 24 which are found to be defective and the sealing member 26 that seals the light emitting elements 24, light emission in which a plurality of light emitting elements such as a direct type backlight is mounted is performed. The light emitting device 2 is obtained in which the defective light emitting element 24 is replaced with the light emitting element 124.

発光装置２において、残渣２６ａは、発光素子１２４を囲むように位置している。そして、新たに形成された封止部材１２６は残渣２６ａをダムとして利用して形成されているため、封止部材１２６の外縁（底面の輪郭）が残渣２６ａに接している。残渣２６ａが封止部材２６の外縁の一部に残されている場合は、封止部材１２６の外縁の一部が残渣２６ａに接し、残渣２６ａが封止部材２６の外縁の全周に渡って残されている場合は、封止部材１２６の外縁がその全周に渡って残渣２６ａに接する。 In the light emitting device 2, the residue 26 a is located so as to surround the light emitting element 124. Since the newly formed sealing member 126 is formed by using the residue 26a as a dam, the outer edge (outline of the bottom surface) of the sealing member 126 is in contact with the residue 26a. When the residue 26a is left on a part of the outer edge of the sealing member 26, a part of the outer edge of the sealing member 126 contacts the residue 26a, and the residue 26a extends over the entire circumference of the outer edge of the sealing member 26. If left, the outer edge of the sealing member 126 contacts the residue 26a over the entire circumference.

（実施の形態の効果）
上記第１及び第２の実施の形態によれば、不良の発光素子を封止部材とともに効率的に取り外すことができる。また、この方法によれば、剥離層や空気層を用いる上記特許文献１に記載の方法と異なり、良品である発光素子を封止する封止部材の信頼性に悪影響を及ぼすことがない。 (Effects of the embodiment)
According to the first and second embodiments, the defective light emitting element can be efficiently removed together with the sealing member. Also, according to this method, unlike the method described in Patent Document 1 that uses a release layer or an air layer, there is no adverse effect on the reliability of the sealing member that seals the light emitting element that is a good product.

以上、本発明の実施の形態を説明したが、本発明は、上記の実施の形態に限定されず、発明の主旨を逸脱しない範囲内において種々変形実施が可能である。 Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the invention.

例えば、図８（ａ）、（ｂ）に示されるように、発光装置１又は発光装置２の封止部材１２６の上に、封止部材１２６の中心かつ発光素子１２４の直上の領域を覆う遮光部２７を設けてもよい。この場合、発光素子１２４の直上の明るさを抑えることができるため、発光装置１又は発光装置２をバックライトなどに好適に用いることができる。遮光部２７は、例えば、封止部材１２６の上面に印刷された印刷層である。遮光部２７が黒色材料などの発光素子１２４の光を吸収する材料からなる場合は、乱光を防止することができる。 For example, as shown in FIGS. 8A and 8B, light shielding is performed on the sealing member 126 of the light emitting device 1 or the light emitting device 2 so as to cover the center of the sealing member 126 and a region immediately above the light emitting element 124. The part 27 may be provided. In this case, since the brightness directly above the light emitting element 124 can be suppressed, the light emitting device 1 or the light emitting device 2 can be suitably used for a backlight or the like. The light shielding portion 27 is, for example, a printed layer printed on the upper surface of the sealing member 126. When the light shielding portion 27 is made of a material such as a black material that absorbs the light of the light emitting element 124, it is possible to prevent turbulent light.

また、上記の実施の形態は特許請求の範囲に係る発明を限定するものではない。また、実施の形態の中で説明した特徴の組合せの全てが発明の課題を解決するための手段に必須であるとは限らない点に留意すべきである。 Further, the above embodiment does not limit the invention according to the claims. It should be noted that not all combinations of the features described in the embodiments are essential to the means for solving the problems of the invention.

１０ 治具
１２ 爪
１２ａ 先端
２０ 基板
２１ 基材
２２ 配線
２３ 滑り層
２４、１２４ 発光素子
２５、１２５ 半田
２６、１２６ 封止部材
２６ａ 残渣 10 jig 12 claw 12a tip 20 substrate 21 base material 22 wiring 23 sliding layer 24, 124 light emitting element 25, 125 solder 26, 126 sealing member 26a residue

Claims (10)

基板に実装された発光素子を封止する封止部材の取り外し方法であって、
素子取り外し用の治具に備わる爪の先端を前記基板と前記封止部材の間に差し入れ、前記封止部材を前記基板から取り外す、取り外し工程を含み、
前記取り外し工程において、前記爪を前記基板側に向けた状態で前記治具を前記基板側へ移動させると、前記基板に押し当てられた前記爪の先端が、前記治具が前記基板側へ移動するのに伴って前記基板の表面上を摺動し、前記基板と前記封止部材の間に差し入れられる、
封止部材の取り外し方法。 A method for removing a sealing member for sealing a light emitting element mounted on a substrate, comprising:
A step of inserting a tip of a claw provided in a jig for element removal between the substrate and the sealing member, and removing the sealing member from the substrate;
In the removal step, when the jig is moved to the substrate side with the claw facing the substrate side, the tip of the claw pressed against the substrate moves the jig to the substrate side. Sliding on the surface of the substrate in accordance with, to be inserted between the substrate and the sealing member,
How to remove the sealing member. 前記取り外し工程において、前記爪の先端が、前記基板と前記発光素子の間に差し入れられ、前記発光素子が前記封止部材とともに取り外される、
請求項１に記載の封止部材の取り外し方法。 In the removing step, the tip of the nail is inserted between the substrate and the light emitting element, and the light emitting element is removed together with the sealing member.
The method for removing the sealing member according to claim 1. 前記取り外し工程において、前記封止部材を加熱しながら取り外す、
請求項１又は２に記載の封止部材の取り外し方法。 In the removing step, the sealing member is removed while heating,
The method for removing the sealing member according to claim 1 or 2. 前記爪が板バネ材からなる、
請求項１〜３のいずれか１項に記載の封止部材の取り外し方法。 The claw is made of a leaf spring material,
The method for removing the sealing member according to claim 1. 前記発光素子が、前記基板にフリップチップ実装され、前記基板と前記発光素子の間に前記封止部材の一部が入り込んでいる、
請求項１〜４のいずれか１項に記載の封止部材の取り外し方法。 The light emitting element is flip-chip mounted on the substrate, and a part of the sealing member is inserted between the substrate and the light emitting element.
The method for removing the sealing member according to any one of claims 1 to 4. 前記基板が、板状の基材と、前記基材上の配線と、前記基板の最表面に設けられた、前記基材及び配線よりも摩擦係数が小さい滑り層を有し、
前記取り外し工程において、前記滑り層の表面上を前記爪の先端が摺動する、
請求項１〜５のいずれか１項に記載の封止部材の取り外し方法。 The substrate has a plate-shaped base material, wiring on the base material, and a sliding layer having a smaller friction coefficient than the base material and the wiring provided on the outermost surface of the substrate,
In the removing step, the tip of the nail slides on the surface of the sliding layer,
The method for removing the sealing member according to claim 1. 前記滑り層が白色レジストである、
請求項６に記載の封止部材の取り外し方法。 The sliding layer is a white resist,
The method for removing the sealing member according to claim 6. 前記取り外し工程において、前記基板における前記発光素子が接続される配線が存在しない領域上を前記爪の先端が摺動する、
請求項１〜７のいずれか１項に記載の封止部材の取り外し方法。 In the removing step, the tip of the nail slides on a region of the substrate where the wiring to which the light emitting element is connected does not exist,
The method for removing the sealing member according to claim 1. 基板に実装された発光素子の取り外し方法であって、
素子取り外し用の治具に備わる爪の先端を、前記基板と前記発光素子の間に差し入れ、前記発光素子を前記基板から取り外す、取り外し工程を含み、
前記取り外し工程において、前記爪を前記基板側に向けた状態で前記治具を前記基板側へ移動させると、前記基板に押し当てられた前記爪の先端が、前記治具が前記基板側へ移動するのに伴って前記基板の表面上を摺動し、前記基板と前記発光素子の間に差し入れられる、
発光素子の取り外し方法。 A method for removing a light emitting element mounted on a board, comprising:
A tip of a claw provided in a jig for element removal is inserted between the substrate and the light emitting element, and the light emitting element is removed from the substrate, including a removal step,
In the removal step, when the jig is moved to the substrate side with the claw facing the substrate side, the tip of the claw pressed against the substrate moves the jig to the substrate side. Sliding on the surface of the substrate, and is inserted between the substrate and the light emitting element,
How to remove the light emitting element. 基板に実装された不良の発光素子、前記不良の発光素子を封止する封止部材、又は前記不良の発光素子及び前記封止部材を取り外すための取り外し用治具であって、
基材と、
前記基材に固定された爪と、
を備え、
前記爪を前記基板側に向けた状態で前記取り外し用治具を前記基板側へ移動させると、前記基板に押し当てられた前記爪の先端が、前記取り外し用治具が前記基板側へ移動するのに伴って前記基板の表面上を摺動する、
取り外し用治具。 A defective light emitting element mounted on a substrate, a sealing member for sealing the defective light emitting element, or a removal jig for removing the defective light emitting element and the sealing member,
Base material,
A nail fixed to the base material,
Equipped with
When the removal jig is moved to the substrate side with the claw facing the substrate side, the tip of the claw pressed against the substrate moves the removal jig to the substrate side. Sliding on the surface of the substrate with
Removal jig.
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