JP2007096188A - Device and method for press bonding - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for preventing a lift of an electrical member at the time of raising a press bonding head after the thermocompression at the time of connecting the electrical member, by pressing the heated press bonding head to two electriclal members laminated through an anisotropic conductive material. <P>SOLUTION: The press bonding device electrically and mechanically connects each electrical member by pressing the press bonding head to the laminated body of two electrical members 11, 30 laminated through the anisotropic conductive material 20. The press bonding head comprises a first press bonding head 110 and a second press bonding head 120 heated in different temperatures each other, differently driven by the predetermined driving means, and press contacting and moving away from the laminated body. After the thermocompression bonding of the laminated body by each press bonding head 110, 120, the press bonding head 110 of the higher temperature side is detached from the laminated body with the laminated body held down by the press bonding head 120 of the lower temperature side. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a crimping apparatus and a crimping method for electrically and mechanically connecting two electrical members via an anisotropic conductive material, and more particularly to a technique for improving the connection reliability.

  A liquid crystal display panel will be described as an example. A flexible terminal such as COF (Chip on film) or TCP (tape carrier package) is connected to the panel terminal portion, and in the case of a COG (Chip on glass) model, A liquid crystal driving chip component (in many cases, an IC or LSI bare chip) is mounted on the terminal portion.

  In general, an anisotropic conductive material capable of connecting many electrodes at once is used for this board connection and component mounting. The anisotropic conductive material includes an anisotropic conductive film (ACF) and an anisotropic conductive resin (ACA), which include, for example, conductive particles in a thermosetting resin. It has the property of showing conductivity in a single direction by thermocompression bonding.

  For the connection by the anisotropic conductive material, for example, as described in Patent Document 1, a heated crimp head called a heater bar is used. A conventional example in which the chip component 30 is connected (mounted) to the terminal portion 11 of the liquid crystal display panel 10 via the anisotropic conductive film 20 will be described with reference to FIGS.

  First, in the component mounting process of FIG. 4A, the chip component 30 is placed on the panel terminal portion 11 of the liquid crystal display panel 10 via the anisotropic conductive film 20. As shown in FIG. 5A, a plurality of bumps 31 are provided on the bottom of the chip component 30, and a plurality of electrode pads 11 a are formed on the panel terminal portion 11 correspondingly. A large number of conductive particles 22 are mixed in the thermosetting resin 21 of the anisotropic conductive film 20. In this component mounting process, the chip component 30 is positioned so that the bump 31 and the electrode pad 11a face each other.

  Next, in the crimping process of FIG. 4B, the electrical / mechanical connection of the chip component 30 to the panel terminal portion 11 is performed. In this crimping process, a crimping head 40 that is moved up and down by a driving means such as an air cylinder (not shown) is used. The crimping head 40 incorporates an electric heater, and the crimping head 40 is usually heated to about 250 to 300 ° C. In the pressure bonding, the liquid crystal display panel 10 is fixed on a work table (not shown) by, for example, vacuum suction.

  As shown in FIG. 5B, by pressing the heated pressure bonding head 40 from above the chip component 30 with a predetermined pressure, the thermosetting resin 21 of the anisotropic conductive film 20 becomes a molten state, and the bump 31 And the electrode pad 11a are made conductive by the conductive particles 22 sandwiched between them.

  Usually, the crimping time is about 10 to 20 seconds, and thereafter, as shown in FIG. 5C, the crimping head 40 is raised and the thermosetting resin 21 is awaited to be cured. In this manner, the anisotropic conductive film 20 can collectively connect the electrode pads 11 a of the panel terminal portion 11 and the bumps of the chip component 30.

JP 2003-15149 A

  However, in the above-described conventional example, when the pressure-bonding head 40 is raised, the chip component 30 is slightly lifted, which may cause conduction failure.

  This is because the pressure-bonding head 40 is in close contact with the chip component 30 and when the pressure-bonding head 40 is raised, the thermosetting resin 21 of the anisotropic conductive film 20 is still in a soft state at a high temperature. This is because the chip component 30 is lifted with the rise.

  In order to prevent this floating phenomenon, the temperature of the pressure-bonding head 40 is lowered in a pressurized state after pressure bonding, and the pressure-bonding head 40 is lifted after the thermosetting resin 21 of the anisotropic conductive film 20 is completely cured. You can do it.

  However, the temperature of the pressure bonding head 40 at the time of pressure bonding is usually about 250 to 300 ° C., and it takes a considerable time to lower the temperature to the glass transition point of the thermosetting resin 21 (about 150 ° C.). It is not a realistic solution because it requires it.

  Accordingly, an object of the present invention is to press the heated crimping head against the laminated body of the first electric member and the second electric member that are overlapped via the anisotropic conductive material so that the electric members are electrically and mechanically connected to each other. When connecting to, even if the pressure-bonding head is separated from the laminate in a state where the resin of the anisotropic conductive material is not cured after thermocompression bonding, a highly reliable conductive state is obtained.

  In order to solve the above-mentioned problem, the invention according to claim 1 includes a first electric member and a second electric member, each of which includes a pressure-bonding head having heating means and is movable in a predetermined direction, and is overlapped via an anisotropic conductive material. In the crimping apparatus for electrically and mechanically connecting the electrical members by heating and pressing the crimping head against the laminate of members, the crimping head is heated to different temperatures and is driven in a predetermined manner. It is characterized by comprising a first pressure-bonding head and a second pressure-bonding head that are driven separately by the means and abut against and separate from the laminate.

  A second aspect of the present invention provides the first pressure bonding head according to the first aspect, wherein the first pressure-bonding head has one or a plurality of evenly arranged protrusions that partially abut against the laminate. The second pressure-bonding head is provided with an insertion hole through which the protruding portion is inserted with almost no gap.

  A third aspect of the present invention is characterized in that, in the first or second aspect, the protruding portion is formed in a comb shape.

  According to a fourth aspect of the present invention, the laminate of the first electric member and the second electric member provided with a pressure-bonding head having a heating means and movable in a predetermined direction is overlapped via an anisotropic conductive material. In the crimping apparatus that electrically and mechanically connects the electrical members by heating and pressing the crimping head, the crimping head is heated to different temperatures and driven separately by a predetermined driving means. A first pressure-bonding head and a second pressure-bonding head, wherein the second pressure-bonding head can be brought into contact with and separated from the laminated body; The heating temperature of the second pressure-bonding head is set to a temperature lower than the heating temperature of the first pressure-bonding head, and this also solves the above problem.

  According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the pressure-bonding head having the lower heating temperature is provided with a cooling means in the first pressure-bonding head and the second pressure-bonding head. It is characterized by being.

  A sixth aspect of the present invention is the method according to any one of the first to fifth aspects, wherein one of the first pressure-bonding head and the second pressure-bonding head has a heating temperature of 250 to 300 ° C. The heating temperature is 90 to 110 ° C.

  According to a seventh aspect of the present invention, in the pressure bonding method using the pressure bonding apparatus according to the first aspect, the anisotropic conductive material is softened by pressing both the first pressure bonding head and the second pressure bonding head against the laminate. After making the state, the one having the higher heating temperature of the first pressure-bonding head and the second pressure-bonding head is first separated from the laminated body, and the pressure-bonding head having the lower temperature is then removed from the laminated body. It is characterized by separation.

  According to an eighth aspect of the present invention, in the pressure bonding method using the pressure bonding apparatus according to the fourth aspect, after the second pressure bonding head is pressed against the laminated body, the first pressure bonding head is moved to the second pressure bonding head. Or with the first crimping head in contact with the second crimping head and pressing the second crimping head against the laminate to soften the anisotropic conductive material. The first pressure-bonding head is separated from the second head, and then the second head is separated from the laminate.

  According to the present invention, as described in claim 1, the heated crimping head is pressed against the laminated body of the first electric member and the second electric member that are superimposed via the anisotropic conductive material, and the electric member When electrically and mechanically connecting each other, a first pressure-bonding head and a second pressure-bonding head that are heated to different temperatures and that are separately driven by predetermined driving means to contact and separate from the laminate And pressing the first pressure-bonding head and the second pressure-bonding head against the laminated body to soften the anisotropic conductive material, and then the first pressure-bonding head and the second pressure-bonding head. Among these, the anisotropic conductive material after thermocompression bonding is still in a softened state by separating the pressure-bonding head having the higher heating temperature from the laminated body first and then separating the pressure-bonding head having the lower temperature from the laminated body. Sometimes, the crimping head with the higher heating temperature Even away de a laminate, since the laminate at temperatures lower crimping head is pressed, it is possible to prevent the above-described lifting phenomenon of electrical members. Moreover, since the temperature of the pressure-bonding head pressing the laminate is low, the anisotropic conductive material is cured in a short time. Therefore, productivity is improved.

  In this case, as described in claim 2, the first pressure-bonding head is formed with one or a plurality of evenly arranged protrusions that partially abut against the laminated body, and the second pressure-bonding head protrudes. By forming the insertion hole through which the portion is inserted with almost no gap, the laminate can be heated more uniformly, and the heat radiation of the second pressure-bonding head can be improved, and the anisotropic conductive material can be shortened for a short time. Can contribute to curing.

  Further, as described in claim 3, by forming the protrusions in a comb-teeth shape, the first pressure-bonding head can be easily and inexpensively manufactured without using an expensive machine tool. can get.

  Further, according to the present invention, as described in claim 4, the heated crimping head is pressed against the laminated body of the first electric member and the second electric member that are superimposed via the anisotropic conductive material. When electrically and mechanically connecting the electric members, the first pressure bonding head and the second pressure bonding head that are heated to different temperatures and driven separately by a predetermined driving means are provided. The first crimping head can be brought into contact with and separated from the second crimping head, and the heating temperature of the second crimping head is set higher than the heating temperature of the first crimping head. After setting to a low temperature, as described in claim 8, after pressing the second crimping head against the laminate, the first crimping head is brought into contact with the second crimping head, or the first crimping head is 2 In contact with the crimping head Then, by pressing the second crimping head against the laminated body to soften the anisotropic conductive material, firstly separating the first crimping head from the second crimping head and then separating the second head from the laminate, As in the first aspect, the above-described lifting phenomenon of the electric member can be prevented, and the anisotropic conductive material can be cured in a short time because the temperature of the second pressure-bonding head pressing the laminate is low. In addition to the fact that the entire surface of the second pressure-bonding head is in close contact with the laminated body, the laminated body can be heated more uniformly than in the case of the first aspect.

  In the present invention, as described in claim 5, by providing a cooling means to the pressure-bonding head having the lower heating temperature out of the first pressure-bonding head and the second pressure-bonding head, anisotropic conduction after the pressure-bonding operation is performed. The curing time of the material can be made shorter.

  In addition, as described in claim 6, the heating temperature of one of the first pressure-bonding head and the second pressure-bonding head is set to 250 to 300 ° C., and the other heating temperature is set to 90 to 110 ° C. As in item 5, the curing time of the anisotropic conductive material after the crimping operation can be shortened.

  Next, an embodiment of the present invention will be described with reference to FIGS. 1 to 3, but the present invention is not limited to this. FIG. 1A is a front view schematically showing the crimping apparatus according to the first embodiment of the present invention as a partial cross section, FIG. 1B is a bottom view thereof, and FIGS. 2A to 2D are first views. FIG. 3 is a front view schematically showing the crimping apparatus according to the second embodiment of the present invention. In the description of this embodiment, the two electric members connected by the anisotropic conductive material are the panel terminal portion and the chip component as in the conventional example described above.

  As shown in FIG. 1, the crimping apparatus 100 according to the first embodiment of the present invention includes two crimping heads, a first crimping head 110 and a second crimping head 120. The first pressure-bonding head 110 and the second pressure-bonding head 120 individually include electric heaters 113 and 123, with the first pressure-bonding head 110 on the high temperature side and the second pressure-bonding head 120 on the low-temperature side.

  As shown in FIG. 2A, when the chip component 30 is connected to the panel terminal portion 11 via the anisotropic conductive film 20, the glass transition temperature of the resin material included in the anisotropic conductive film 20. Is, for example, 150 ° C., the first pressure-bonding head 110 is preferably heated to 250 to 300 ° C., and the second pressure-bonding head 120 is preferably heated to 90 to 110 ° C. below the glass transition temperature.

  According to the first embodiment, the first pressure-bonding head 110 includes a head body 111 having a protrusion 112 formed in a comb-like shape downward, and an electric heater 113 is provided on the upper surface of the head body 111. Yes. The lower ends of the projecting portions 112 are aligned on the same plane so that all of them are in contact with the chip component 30.

  On the other hand, the second pressure-bonding head 120 includes a head body 121 having a flat bottom surface that contacts the chip component 30, and the protrusion 112 of the first pressure-bonding head 110 is inserted into the head body 121. An insertion hole 122 is formed. The electric heater 123 is disposed on both sides of the head body 121.

  The head bodies 111 and 121 may be made of metal, but are preferably made of ceramic having a low coefficient of thermal expansion. Further, in order to suppress a loss of heat applied from the first pressure-bonding head 110 to the chip component 30, it is preferable that the protruding portion 112 is inserted into the insertion hole 122 with almost no gap.

  The first pressure-bonding head 110 and the second pressure-bonding head 120 are individually driven in the vertical direction by dedicated driving means 115 and 125, respectively. An air cylinder or a hydraulic cylinder is preferably used for the driving means 115 and 125.

  Here, operation | movement of the crimping | compression-bonding apparatus 100 which concerns on 1st Embodiment is demonstrated using Fig.2 (a)-(d). First, as shown in FIG. 2A, the second pressure bonding head 120 on the low temperature side is lowered and pressed onto the chip component 30 with a predetermined pressure.

  Next, as shown in FIG. 2B, the first pressure bonding head 110 on the high temperature side is lowered, and the protruding portion 112 is pressed onto the chip component 30 through the insertion hole 122 of the second pressure bonding head 120. At this time, the pressure of the first pressure bonding head 110 may be the same as that of the second pressure bonding head 120.

  After pressing the first pressure bonding head 110 for a predetermined time (for example, 10 to 15 seconds), as shown in FIG. 2C, only the first pressure bonding head 110 is raised. And after cooling to the predetermined temperature in the state which pressed the 2nd crimping | compression-bonding head 120 and the resin material of the anisotropic conductive film 20 hardened | cured, as shown in FIG. By pulling up, the crimping process of the panel terminal portion 11 and the chip component 30 is completed.

  As described above, since the first pressure-bonding head 110 is thermocompression bonded at a high temperature and then the second pressure-bonding head 120 is cooled to a predetermined temperature, the chip component is prevented from being lifted when the second pressure-bonding head 120 is raised. And a highly reliable electrical connection is obtained.

  In addition, since the second pressure-bonding head 120 is heated in advance to a predetermined temperature (preferably 90 to 110 ° C.), the thermocompression bonding time at a high temperature by the first pressure-bonding head 110 can be made substantially the same as the conventional one.

  In the above operation example, as shown in FIGS. 2A and 2B, the second pressure-bonding head 120 and the first pressure-bonding head 110 are lowered in this order, but the first pressure-bonding head 110 and the second pressure-bonding head 110 are lowered. You may make it descend | fall in the state combined with the head 120 integrally.

  In order to shorten the cooling time by the second pressure-bonding head 120, a cooling means such as an air cooling fan may be used in combination. The insertion hole 121 of the second crimping head 120 also functions as a heat radiating means. As a modification, an embodiment in which the second pressure-bonding head 120 is used without being heated is also included in the present invention.

  Alternatively, the first pressure bonding head 110 may be on the low temperature side and the second pressure bonding head 120 may be on the high temperature side. Further, the protruding portion 112 of the first pressure-bonding head 110 may be a columnar shape or a prismatic shape. Furthermore, the second pressure-bonding head 120 may have a frame shape that holds the periphery of the chip component 30, and the first pressure-bonding head 110 may be raised and lowered within the frame.

  Next, the crimping apparatus 101 according to the second embodiment of the present invention will be described with reference to FIG. The crimping apparatus 101 also includes a high-temperature-side first crimping head 130 having an electric heater 133 and a low-temperature-side second crimping head 140 having an electric heater 141. In this case, the first crimping head 130 is a second one. The chip component 30 side is heated via the pressure bonding head 140.

  That is, the first pressure-bonding head 130 and the second pressure-bonding head 140 are respectively driven by the dedicated driving means 115 and 125 shown in FIG. As a result, the first pressure-bonding head 130 contacts and separates from the second pressure-bonding head 140.

  The second pressure-bonding head 140 has an abutting surface that comes into close contact with the chip component 30. In this example, the bottom surface of the housing of the electric heater 141 is used as a flat abutting surface for the chip component 30. It is done. On the upper surface of the electric heater 141, a heat sink 142 as a heat radiating means is provided. A preferable heating temperature of the second pressure-bonding head 140 is 90 to 110 ° C. as in the first embodiment.

  The first pressure-bonding head 130 is preferably provided with a head body 131 made of ceramic, like the second pressure-bonding head 120 in the first embodiment, and ribs (or fins) of the heat sink 142 are inserted into the head body 131. An insertion hole 132 is formed. Electric heaters 133 are attached to both sides of the head main body 131. A preferable heating temperature of the first pressure-bonding head 130 is 250 to 300 ° C. as in the first embodiment.

  The operation of the crimping apparatus 101 according to the second embodiment will be described. First, after the second crimping head 140 is lowered and pressed against the chip component 30 with a predetermined pressure, the first crimping head 130 is lowered and the second crimping head 130 is lowered. Contact with the crimping head 140. Note that the second pressure-bonding head 140 may be lowered while the first pressure-bonding head 130 is in contact with the second pressure-bonding head 140.

  Thereby, the heat of the first pressure-bonding head 130 is applied to the chip component 30 side via the second pressure-bonding head 140. In this case, since the second pressure-bonding head 140 is in contact with the entire surface of the chip component 30, the chip component 30 side can be heated uniformly. The thermocompression bonding time by the first pressure-bonding head 130 may be, for example, 10 to 15 seconds as in the first embodiment.

  After thermocompression bonding, only the first pressure-bonding head 130 is raised, and the second pressure-bonding head 140 is cooled down to a predetermined temperature while being pressed, and the resin material of the anisotropic conductive film 20 is cured, and then the second pressure-bonding head. By pulling up 140, the crimping process of the panel terminal portion 11 and the chip component 30 is completed.

  Also in the second embodiment, since the second pressure-bonding head 140 cools down to a predetermined temperature after thermocompression bonding at a high temperature by the first pressure-bonding head 130, as in the first embodiment. When the crimping head 120 is raised, the chip component is prevented from being lifted, and a highly reliable electrical connection is obtained. In addition, in the second embodiment, the chip component 30 can be heated uniformly.

  As described in the first embodiment, the cooling time can be further shortened by applying a cooling means such as an air cooling fan to the second pressure-bonding head 140. In addition, an embodiment in which the second pressure-bonding head 140 is used without being heated is also included in the present invention.

  In each of the above embodiments, one electrical member connected by the anisotropic conductive film is a panel terminal portion, and the other electrical member is a chip component. However, one electrical member is a hard circuit board, and the other electrical member. May be a flexible substrate, and the present invention can be applied even if both electrical members are both flexible substrates. An anisotropic conductive resin may be used instead of the anisotropic conductive film.

(A) is the front view which shows typically the crimping | bonding apparatus which concerns on 1st Embodiment of this invention as a partial cross section, (b) is the bottom view. (A)-(d) Operation | movement explanatory drawing of the crimping | bonding apparatus which concerns on the said 1st Embodiment. The front view which shows typically the crimping | compression-bonding apparatus which concerns on 2nd Embodiment of this invention. (A) The perspective view which shows the state which mounts chip components in a liquid crystal display panel, (b) The perspective view which shows the state which carries out thermocompression bonding of chip components with the conventional crimping | compression-bonding head. (A)-(c) Explanatory drawing which shows the operation example of the thermocompression bonding by the said conventional crimping | compression-bonding head.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100,101 Crimping apparatus 110,130 1st crimping head 120,140 2nd crimping head 111,121,131 Head main body 112 Protruding part 113,123,133,141 Electric heater 122,132 Insertion hole 142 Heat sink 10 Liquid crystal display panel 11 Panel terminal part 20 Anisotropic conductive film 30 Chip component

Claims (8)

A pressure bonding head having a heating means and movable in a predetermined direction is provided, and the pressure bonding head is heated and pressed against a laminated body of the first electric member and the second electric member that are overlapped via an anisotropic conductive material. In the crimping apparatus for electrically and mechanically connecting the electric members,
The pressure-bonding head includes a first pressure-bonding head and a second pressure-bonding head that are heated to different temperatures and that are separately driven by predetermined driving means to come into contact with and separate from the laminated body. A characteristic crimping device.   The first pressure-bonding head has one or a plurality of evenly arranged protrusions that partially abut against the laminated body, and the protrusions are inserted through the second pressure-bonding head with almost no gap. The crimping device according to claim 1, wherein an insertion hole is provided.   The crimping device according to claim 1, wherein the protruding portion is formed in a comb shape. A pressure bonding head having a heating means and movable in a predetermined direction is provided, and the pressure bonding head is heated and pressed against a laminated body of the first electric member and the second electric member that are overlapped via an anisotropic conductive material. In the crimping apparatus for electrically and mechanically connecting the electric members,
The crimping head includes a first crimping head and a second crimping head that are heated to different temperatures and driven separately by a predetermined driving means.
The second pressure-bonding head can be contacted / separated from the laminated body, the first pressure-bonding head can be contacted / separated from the second pressure-bonding head, and the heating temperature of the second pressure-bonding head Is set at a temperature lower than the heating temperature of the first pressure-bonding head.   The pressure bonding head according to any one of claims 1 to 4, wherein a cooling means is provided in a pressure bonding head having a lower heating temperature of the first pressure bonding head and the second pressure bonding head. apparatus.   The heating temperature of one of the first pressure-bonding head and the second pressure-bonding head is 250 to 300 ° C, and the other heating temperature is 90 to 110 ° C. The crimping apparatus according to item 1. In the crimping method by the crimping apparatus according to claim 1,
After the first pressure-bonding head and the second pressure-bonding head are both pressed against the laminate to soften the anisotropic conductive material, the heating temperature of the first pressure-bonding head and the second pressure-bonding head is high. A pressure bonding method, wherein the pressure bonding head is first separated from the laminate, and then the pressure bonding head having a lower temperature is separated from the laminate. In the crimping method by the crimping apparatus according to claim 4,
After pressing the second crimping head against the laminate, the first crimping head is brought into contact with the second crimping head, or the first crimping head is brought into contact with the second crimping head. After the second pressure bonding head is pressed against the laminated body to soften the anisotropic conductive material, the first pressure bonding head is first separated from the second head, and then the second head is separated from the laminated body. A crimping method characterized by separating.

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