JP2020191382A - Manufacturing method of multilayer electronic component - Google Patents

Abstract

To provide a manufacturing method of a multilayer electronic component capable of obtaining desired device characteristics.SOLUTION: A manufacturing method of a multilayer electronic component 1 includes a first step of forming an insulator resin layer with an insulating paste containing a resin component, a second step of forming a conductor pattern on the insulator resin layer with a conductor paste that is sintered at a temperature of 500°C or less, and a third step of firing a laminate formed by repeating the first step and the second step at a temperature of 500°C or lower.SELECTED DRAWING: Figure 7

Description

The present invention relates to a method for manufacturing a laminated electronic component.

As one of the laminated electronic components, a laminated inductor having a plurality of conductor patterns inside a plurality of laminated insulator layers is known. For example, in the method for manufacturing a laminated inductor described in Reference 1, a laminated body formed by alternately coating an insulator paste as an insulating material layer and a conductor paste as a conductor pattern is fired to manufacture a laminated inductor. doing.

JP-A-2007-266219

In the above-mentioned multilayer inductor, in order to obtain the element characteristics as designed, it is necessary to arrange the conductor pattern at a predetermined position inside the element body made of the insulating material layer. Here, in the method for manufacturing a laminated electronic component, the conductor paste forming the conductor pattern is generally sintered at a temperature of 800 ° C. to 900 ° C. Therefore, when manufacturing a laminated electronic component, it is necessary to fire the laminated body at a temperature of 800 ° C. or higher. In this way, when the conductor paste is fired at a high temperature of 800 ° C. or higher, heat shrinkage occurs in the conductor pattern to be sintered, and as a result, the position of the conductor pattern (position related to the stacking direction or position related to the surface direction) shifts. Can occur. Therefore, there is a possibility that the element characteristics as designed cannot be obtained. In particular, since the laminated electronic components mounted on electronic devices such as smartphones are small in size, the element characteristics may be significantly deteriorated due to the displacement of the conductor pattern.

One aspect of the present invention is to provide a method for manufacturing a laminated electronic component capable of obtaining desired device characteristics.

The method for manufacturing a laminated electronic component according to one aspect of the present invention includes a first step of forming an insulator resin layer with an insulating paste containing a resin component, and sintering on the insulator resin layer at a temperature of 500 ° C. or lower. It includes a second step of forming a conductor pattern by a conductor paste, and a third step of firing a laminate formed by repeating the first step and the second step at a temperature of 500 ° C. or lower.

In the method for manufacturing a laminated electronic component according to one aspect of the present invention, a conductor paste that is sintered at a temperature of 500 ° C. or lower is applied to form a conductor pattern, and the laminated body is fired at a temperature of 500 ° C. or lower. As a result, in the method for manufacturing laminated electronic components, it is possible to suppress the occurrence of heat shrinkage in the conductor pattern as compared with the case of firing at 800 ° C. or higher. Therefore, in the method for manufacturing laminated electronic components, it is possible to prevent the conductor pattern from being displaced due to heat shrinkage. As a result, the desired element characteristics can be obtained in the method for manufacturing laminated electronic components.

In one embodiment, in the second step, the conductor paste may be applied on the insulator resin layer to form the conductor layer, and the conductor pattern may be formed by performing a photolithography process on the conductor layer. In this method, the conductor pattern can be accurately formed at a predetermined position. Therefore, in the method for manufacturing laminated electronic components, desired element characteristics can be obtained.

In one embodiment, a step of forming a through hole in the insulator resin layer and filling the through hole with a conductor paste to form a through hole conductor connecting one conductor pattern and another conductor pattern is included. You may. In this method, a through-hole conductor is formed of the above-mentioned conductor paste in a configuration in which one conductor pattern and another conductor pattern are connected by a through-hole conductor. As a result, in the method for manufacturing laminated electronic components, it is possible to suppress the occurrence of heat shrinkage in the through-hole conductor. Therefore, in the method for manufacturing a laminated electronic component, it is possible to suppress the displacement of the position of the through-hole conductor due to heat shrinkage, so that desired device characteristics can be obtained.

According to one aspect of the present invention, desired device characteristics can be obtained in a laminated electronic component.

FIG. 1 is a perspective view of a laminated coil component according to an embodiment. FIG. 2 is a diagram showing a cross-sectional structure taken along the line II-II in FIG. FIG. 3 is a diagram showing a cross-sectional structure taken along the line III-III in FIG. 4 (a) and 4 (b) are views showing a manufacturing process of a laminated coil component. 5 (a) and 5 (b) are views showing a manufacturing process of a laminated coil component. FIG. 6 is a diagram showing a manufacturing process of a laminated coil component. FIG. 7 is a diagram showing a cross-sectional structure of the laminated body. 8 (a) and 8 (b) are diagrams showing a manufacturing process of a laminated coil component according to another embodiment. FIG. 9 is a diagram showing a manufacturing process of a laminated coil component according to another embodiment. FIG. 10 is a diagram showing a manufacturing process of a laminated coil component according to another embodiment. FIG. 11 is a diagram showing a cross-sectional configuration of a laminated coil according to another embodiment.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements are designated by the same reference numerals, and duplicate description will be omitted.

[Structure of laminated coil parts]
As shown in FIG. 1, the laminated coil component (laminated electronic component) 1 includes a element body 2 and a first terminal electrode 3 and a second terminal electrode 4 arranged at both ends of the element body 2, respectively. ing. The laminated coil component 1 is, for example, a “1005” type (length 1.0 mm, width 0.5 mm) chip component.

The element body 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which the corners and ridges are chamfered, and a rectangular parallelepiped in which the corners and ridges are rounded. The element body 2 has, as its outer surface, a pair of end faces 2a and 2b facing each other, a pair of main surfaces 2c and 2d facing each other, and a pair of side surfaces 2e and 2f facing each other. have. In the present embodiment, the main surface 2d is defined as a mounting surface facing the other electronic device when the laminated coil component 1 is mounted on another electronic device (for example, a circuit board or a laminated electronic component). .. The element body 2 is configured by laminating an insulator resin layer described later. In the actual body 2, each insulator resin layer is integrated to the extent that the boundary between the insulator resin layers cannot be visually recognized.

The first terminal electrode 3 is arranged on the side surface 2e of the element body 2. The first terminal electrode 3 has a rectangular shape (rectangular shape) when viewed from the opposite direction of the pair of side surfaces 2e and 2f. The first terminal electrode 3 extends along the opposite direction of the pair of end faces 2a and 2b, and extends along the opposite direction of the pair of main surfaces 2c and 2d. The surface of the first terminal electrode 3 is flush with the side surface 2e. The second terminal electrode 4 is arranged on the side surface 2f of the element body 2. The second terminal electrode 4 has a rectangular shape (rectangular shape) when viewed from the opposite direction of the pair of side surfaces 2e and 2f. The second terminal electrode 4 extends along the opposite direction of the pair of end faces 2a and 2b, and extends along the opposite direction of the pair of main surfaces 2c and 2d. The surface of the second terminal electrode 4 is flush with the side surface 2f.

As shown in FIGS. 2 and 3, in the laminated coil component 1, the coil 5 is arranged in the element body 2. As shown in FIG. 2, the first terminal electrode 3 and one end of the coil 5 are connected by a first connecting portion 3a. As shown in FIG. 3, the second terminal electrode 4 and the other end of the coil 5 are connected by a second connecting portion 4a.

[Manufacturing method of laminated coil parts]
Subsequently, a method of manufacturing the laminated coil component 1 will be described. In the method for manufacturing the laminated coil component 1, first, as shown in FIG. 4A, the insulator resin layer RL1 and the insulator resin layer RL2 are formed on the substrate B (first step). The substrate B is a plate-shaped base material, and may be made of, for example, a metal such as stainless steel or Al, glass, a film such as PET or polyimide, or a resin material such as glass epoxy. The upper surface of the substrate B may be subjected to a mold release process. Silicone coating, fluororesin processing and the like can be used for the mold release treatment. The upper surface of the substrate B is a substantially flat surface.

The insulator resin layer RL1 and the insulator resin layer RL2 are formed of an insulator resin paste (insulation paste). The insulator resin paste contains a resin component, a solvent and the like. The resin component includes a thermosetting resin. As the thermosetting resin, for example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin is used. The insulator resin paste may contain a small amount of glass powder or ceramic powder. The insulator resin layer RL1 is formed by applying an insulator resin paste on the substrate B, for example, with a die coater, and drying the insulator resin paste. As the die coater, various die coaters such as a pump type and a plunger type can be adopted. The insulator resin layer RL2 is formed by applying an insulator resin paste on the insulator resin layer RL1 and drying it. As a result, the insulator resin layer RL2 is laminated on the insulator resin layer RL1. The thicknesses of the insulator resin layer RL1 and the insulator resin layer RL2 are appropriately set according to the size of the laminated coil component 1.

Next, as shown in FIG. 4B, a conductor pattern is formed on the insulator resin layer RL2. The conductive paste used to form the conductor pattern contains a conductive metal (eg, Ag). The conductive paste is a low temperature baking paste. The low temperature baking paste is sintered at a temperature of 500 ° C. or lower. As the conductive paste, for example, UA-201 (trade name) manufactured by Daiken Kagaku Kogyo Co., Ltd. can be used. By using the conductive paste, in addition to being able to be fired at a relatively low temperature of 500 ° C. or lower, it is possible to obtain a conductor pattern having a desired resistance value. The terminal patterns T11 and T12 and the conductor pattern C1 are formed by applying a conductive paste on the insulator resin layer RL2, for example, by screen printing and drying. As the conductor pattern, the terminal patterns T11 and T12 and the conductor pattern C1 are formed (second step). The terminal patterns T11 and T12 and the conductor pattern C1 are patterned by screen printing. As a result, the terminal patterns T11 and T12 and the conductor pattern C1 are formed.

Subsequently, as shown in FIG. 5A, the insulator resin layer RL3 is formed on the insulator resin layer RL2. The insulator resin layer RL3 is also formed (overcoated) on the terminal patterns T11 and T12 and the conductor pattern C1. Therefore, as shown in FIG. 5B, the insulator resin layer RL3 formed on the terminal patterns T11 and T12 and the conductor pattern C1 is removed.

Subsequently, as shown in FIG. 6, the terminal patterns T12 and T22 and the conductor pattern C2 are formed on the insulator resin layer RL3. The terminal patterns T12, T22 and the conductor pattern C2 are directly formed on the terminal patterns T11, T12 and the conductor pattern C1 by screen printing. Then, by repeating the above steps and laminating (building up) the insulator resin layer and each pattern (conductor layer), the laminated body 10 is obtained as shown in FIG. The laminate 10 includes insulator resin layers RL1, RL2, RL3, RL4, RL5, RL6, RL7, RL8, RL8, RL9, RL10, terminal patterns T11, T12, T13, T14, T15, T16, and terminal patterns T21. , T22, T23, T24, T25, T26 and conductor patterns C1, C2, C3, C4, C5, C6, C7, C8.

The insulator resin layers RL1, RL2, RL3, RL4, RL5, RL6, RL7, RL8, RL8, RL9, and RL10 constitute the element body 2. The terminal patterns T11, T12, T13, T14, T15, and T16 form the first terminal electrode 3. The terminal patterns T21, T22, T23, T24, T25, and T26 constitute the second terminal electrode 4. The conductor patterns C1, C2, C3, C4, C5, C6, C7 and C8 form the coil 5.

Subsequently, the laminated body 10 is peeled from the substrate B. Then, the laminate 10 is fired at a temperature of 500 ° C. or lower (third step). The firing temperature is set according to the characteristics of the conductive paste. In this embodiment, the firing temperature is set to, for example, 400 ° C. or higher and 500 ° C. or lower. When the laminate 10 is fired, the insulator resin layers RL1, RL2, RL3, RL4, RL5, RL6, RL7, RL8, RL8, RL9, and RL10 are cured to form the element body 2. Further, the terminal patterns T11, T12, T13, T14, T15, and T16 are sintered to form the first terminal electrode 3. Further, the terminal patterns T21, T22, T23, T24, T25, and T26 are sintered to form the second terminal electrode 4. Further, the conductor patterns C1, C2, C3, C4, C5, C6, C7 and C8 are sintered to form the coil 5. As described above, the laminated coil component 1 is manufactured.

As described above, in the method for manufacturing the laminated coil component 1 according to the present embodiment, the conductor patterns C1, C2, C3, C4, C5, C6 are coated with a conductive paste that is sintered at a temperature of 500 ° C. or lower. , C7, C8 are formed, and the laminate is fired at a temperature of 500 ° C. or lower. As a result, in the method for manufacturing the laminated coil component 1, heat shrinkage occurs in the conductor patterns C1, C2, C3, C4, C5, C6, C7, and C8 (heat load is increased) as compared with the case of firing at 800 ° C. or higher. (Joining) can be suppressed. Therefore, in the method for manufacturing the laminated coil component 1, it is possible to prevent the conductor patterns C1, C2, C3, C4, C5, C6, C7, and C8 from being displaced due to heat shrinkage. As a result, in the method for manufacturing the laminated coil component 1, desired element characteristics can be obtained in the laminated coil component 1.

Further, in the method for manufacturing the laminated coil component 1 according to the present embodiment, the sintering temperature can be further lowered by using a conductive paste containing Ag particles having a lower sintering start temperature, and the sintering can be performed. It is also possible to set the temperature to about 300 to 100 ° C. As a result, in the method for manufacturing the laminated coil component 1, firing in a lower temperature region becomes possible, and the element characteristics can be further improved.

Further, in the method of manufacturing the laminated coil component 1, the insulator resin layer and the conductor pattern are sequentially laminated (stacked) in order from the substrate B to form the laminated body 10. Therefore, in the method for manufacturing the laminated coil component 1, the position accuracy of the conductor pattern can be improved as compared with other laminating methods (for example, the sheet transfer method). Therefore, in the method for manufacturing the laminated coil component 1, the displacement of the conductor pattern can be suppressed, so that the desired element characteristics can be obtained in the laminated coil component 1.

Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the gist thereof.

In the above embodiment, in the manufacturing process of the laminated coil component 1, the embodiment in which the insulator resin layer RL1 is first formed on the substrate B has been described as an example. However, in the method for manufacturing the laminated coil component 1, a conductor pattern or the like may be formed first. Hereinafter, a manufacturing method for first manufacturing a conductor pattern or the like on the substrate B will be described.

First, as shown in FIG. 8A, the terminal patterns T11 and T12 and the conductor pattern C1 are formed on the substrate B. The terminal patterns T11 and T12 and the conductor pattern C1 are formed by screen printing. Subsequently, as shown in FIG. 8B, the insulator resin layer RL3 is formed on the substrate B. The insulator resin layer RL3 is also formed (overcoated) on the terminal patterns T11 and T12 and the conductor pattern C1. Therefore, the insulator resin layer RL3 formed on the terminal patterns T11 and T12 and the conductor pattern C1 is removed.

Subsequently, as shown in FIG. 9, terminal patterns T12 and T22 and conductor patterns C2 and C3 are formed on the insulator resin layer RL3 by screen printing. After that, the above steps are repeated to laminate (build up) the insulator resin layer and each pattern (conductor layer), and as shown in FIG. 10, the insulator resin layers RL4, RL5, RL6, RL7, RL8, RL8, RL9, RL10, terminal patterns T11, T12, T13, T14, T15, T16, terminal patterns T21, T22, T23, T24, T25, T26, and conductor patterns C1, C2, C3, C4, C5, C6. , C7, C8 are formed. Then, the insulator resin layer RL3, the terminal patterns T11, T12 and the conductor pattern C1 are peeled off from the substrate B to form the insulator resin layer RL2 and the insulator resin layer RL1 to obtain the laminate 10. The laminated coil component 1 is manufactured by firing the laminated body 10 at a temperature of 500 ° C. or lower.

In the above embodiment, in the laminated body 10, a mode in which the conductor pattern of one layer and the conductor pattern of the other layer are connected by a conductor pattern formed by screen printing has been described as an example. However, the conductor pattern of one layer and the conductor pattern of the other layer may be connected by a through-hole conductor.

As shown in FIG. 11, the laminated body 10A includes insulator resin layers 20A, 20B, 20C, 20D, 20E, 20F, conductor patterns 30A, 30B, 30C, 30D, and through-hole conductors 40A, 40B, 40C. , Is included. The insulator resin layers 20A, 20B, 20C, 20D, 20E, and 20F are formed of the insulator resin paste. The conductor patterns 30A, 30B, 30C, and 30D are formed by screen printing a conductive paste, which is a low-temperature baking paste. Through-hole conductors 40A, 40B, 40C have through-holes at positions corresponding to the conductor patterns 30A, 30B, 30C, 30D in the insulator resin layers 20B, 20C, 20D covering the conductor patterns 30A, 30B, 30C, 30D. It is formed and formed by filling the through holes with a low-temperature baking paste. Through holes are formed, for example, by a photolithography process.

In this method, through-hole conductors 40A, 40B, 40C are formed of the above conductive paste. As a result, in the method for manufacturing the laminated coil component 1, it is possible to suppress the occurrence of heat shrinkage in the through-hole conductors 40A, 40B, and 40C. Therefore, in the method for manufacturing the laminated coil component 1, it is possible to suppress the displacement of the positions of the through-hole conductors 40A, 40B, and 40C due to heat shrinkage, so that desired element characteristics can be obtained.

In the above embodiment, a mode in which the resin component of the insulator resin paste forming the insulator resin layer contains a thermosetting resin has been described as an example. However, the resin component may include a photocurable resin. The photocurable resin is, for example, an ultraviolet curable resin. In this case, the insulator resin layer is formed by applying the insulator resin paste and then irradiating it with ultraviolet rays to cure it.

In the above embodiment, the first terminal electrode 3 of the laminated coil component 1 is formed by the terminal patterns T11, T12, T13, T14, T15, T16, and the second terminal electrode 4 is formed by the terminal patterns T21, T22, T23, T24, The morphology formed by T25 and T26 has been described as an example. However, the first terminal electrode and the second terminal electrode may be formed on the outer surface of the element body.

In the above embodiment, a mode in which the conductor pattern is formed by screen printing has been described as an example. However, it is also possible to form a conductor pattern by a photolithography process by using a conductive paste that can be fired at low temperature and has photosensitivity. Examples of conductive pastes that can be fired at low temperatures and have photosensitivity include known scaly, needle-shaped Ag particles or silver nanoparticles having a particle size of 0.5 μm or less, which are generally called silver nanoparticles. Alternatively, a conductor paste obtained by mixing scaly, needle-shaped Ag particles and Ag nanoparticles mixed particles with a photosensitive resin (for example, an acrylic resin) is used. According to the photolithography process, the conductor pattern can be formed at a predetermined position with high accuracy, and the fine line pattern can be formed with high accuracy in a small product.

1 ... Laminated coil component (laminated electronic component), 10,10A ... Laminated body, C1, C2, C3, C4, C5, C6, C7, C8 ... Conductor pattern, RL1, RL2, RL3, RL4, RL5, RL6, RL7 , RL8, RL8, RL9, RL10 ... Insulator resin layer, 40A, 40B, 40C ... Through-hole conductor.

Claims (3)

The first step of forming an insulator resin layer with an insulating paste containing a resin component, and
A second step of forming a conductor pattern on the insulator resin layer with a conductor paste sintered at a temperature of 500 ° C. or lower.
A method for manufacturing a laminated electronic component, which comprises a third step of firing a laminated body formed by repeating the first step and the second step at a temperature of 500 ° C. or lower. The second step is described in claim 1, wherein the conductor paste is applied onto the insulator resin layer to form a conductor layer, and the conductor pattern is formed by performing a photolithography process on the conductor layer. Method of manufacturing laminated electronic components. A claim comprising a step of forming a through hole in the insulator resin layer, filling the through hole with the conductor paste, and forming a through hole conductor connecting one of the conductor patterns and the other conductor pattern. Item 2. The method for manufacturing a through-hole electronic component according to Item 1 or 2.

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