JP2020188120A - Power conversion device and method of manufacturing the same - Google Patents

Abstract

To provide a power conversion device having improved insulation performance.SOLUTION: A power conversion device 1 includes a metal case 7, a first circuit board 15, a first circuit component 17, and an insulating seal member 12. The metal case 7 includes a bottom plate 8. The first circuit board 15 includes a first main surface 15a facing the bottom plate 8. The first circuit component 17 is mounted on the first main surface 15a of the first circuit board 15. A first through hole 16 is provided in the first circuit board 15. The insulating seal member 12 seals the first circuit component 17. The insulating seal member 12 fills a first space between the first main surface 15a of the first circuit board 15 and the bottom plate 8.SELECTED DRAWING: Figure 3

Description

The present invention relates to a power converter and a method for manufacturing the same.

Japanese Unexamined Patent Publication No. 2001-357986 (Patent Document 1) discloses a discharge lighting device including a metal case, a circuit board housed in the metal case, and an insulating sheet made of resin. Circuit components such as transformers or inductance elements are mounted on the circuit board. The insulating sheet is arranged between the metal case and the circuit board. The insulating sheet electrically insulates the circuit board from the metal case.

Japanese Unexamined Patent Publication No. 2001-357986

In the discharge lighting device disclosed in Patent Document 1, an air layer and an insulating sheet are interposed between a circuit component or a circuit board and a metal case. The insulating sheet is easily warped and has a very thin thickness compared to the distance between the metal case and the circuit component or circuit board. The position of the insulating sheet in the space between the metal case and the circuit component or circuit board varies greatly. The intermediate voltage at the interface between the insulating sheet and the air layer is the voltage applied between the metal case and the circuit component or circuit board, the capacitance of the capacitor having the insulating sheet as an insulator, and as an insulator. It depends on the capacitance of the capacitor with the air layer. If the position of the insulating sheet varies greatly, these capacitances will vary greatly. Therefore, the intermediate voltage at the interface between the insulating sheet and the air layer also varies greatly.

When a large voltage is applied between a circuit component or circuit board and a metal case, due to this large variation in intermediate voltage, between the circuit component or circuit board and the interface between the insulating sheet and the air layer, Alternatively, a partial discharge may occur between the interface between the insulating sheet and the air layer and the metal case. In this way, dielectric breakdown may occur in the insulating sheet. The present invention has been made in view of the above problems, and an object of the present invention is to provide a power conversion device having improved insulation performance and a method for manufacturing the same.

The power conversion device of the present invention includes a metal case, a first circuit board, a first circuit component, and an insulation sealing member. The metal case includes a bottom plate and side walls protruding from the bottom plate. The first circuit board is housed in a metal case. The first circuit board includes a first main surface facing the bottom plate of the metal case and a second main surface opposite to the first main surface. The first circuit component is mounted on the first main surface of the first circuit board. The insulation sealing member seals the first circuit component. A first through hole connecting between the first main surface and the second main surface is provided on the first circuit board. The first space between the first main surface of the first circuit board and the bottom plate of the metal case is filled with an insulating sealing member.

The method of manufacturing the power conversion device of the present invention includes supplying an insulating sealing material in a metal case. The metal case includes a bottom plate and side walls protruding from the bottom plate. The method for manufacturing a power conversion device of the present invention includes mounting a first circuit board on an insulating sealing material. The first circuit board is housed in a metal case. The first circuit board includes a first main surface facing the bottom plate of the metal case and a second main surface opposite to the first main surface. A first through hole connecting between the first main surface and the second main surface is provided on the first circuit board. The first circuit component is mounted on the first main surface. The method for manufacturing the power conversion device of the present invention is to press the first circuit board toward the insulating sealing material and cure the insulating sealing material to form a first main surface of the first circuit board and a metal case. It includes forming an insulating sealing member that fills the first space between the bottom plate. The first circuit component is sealed by an insulating sealing member.

Bubbles are removed from the insulation sealing member through the first through hole of the first circuit board. The first space between the first main surface and the bottom plate of the first circuit board on which the first circuit component is arranged is filled with an insulating sealing member. It is possible to prevent a partial discharge from occurring between the metal case and the first circuit component or the first circuit board during the operation of the power converter. It is possible to prevent dielectric breakdown from occurring in the insulating sealing member. The power converter of the present invention has improved insulation performance. The method for manufacturing a power conversion device of the present invention can manufacture a power conversion device having improved insulation performance.

It is a circuit diagram of the power conversion apparatus of Embodiment 1 to Embodiment 6. It is the schematic plan view of the power conversion apparatus of Embodiment 1. FIG. It is schematic cross-sectional view of the power conversion apparatus of Embodiment 1 in the cross-sectional line III-III shown in FIG. It is a figure which shows the flowchart of the manufacturing method of the power conversion apparatus of Embodiment 1 to Embodiment 3. It is a schematic partial enlarged sectional view of the power conversion apparatus of Embodiment 1. FIG. It is a figure which shows the equivalent circuit of the power conversion apparatus of Embodiment 1. It is the schematic partial enlarged sectional view of the power conversion apparatus of the comparative example. It is a figure which shows the equivalent circuit of the power conversion apparatus of the comparative example. It is a schematic plan view of the power conversion apparatus of Embodiment 2. 9 is a schematic cross-sectional view taken along the cross-sectional line XX shown in FIG. 9 of the power conversion device of the second embodiment. It is the schematic sectional drawing of the power conversion apparatus of Embodiment 3. FIG. It is the schematic sectional drawing of the power conversion apparatus of Embodiment 4. FIG. It is a figure which shows the flowchart of an example of the manufacturing method of the power conversion apparatus of Embodiment 4. It is a figure which shows the flowchart of another example of the manufacturing method of the power conversion apparatus of Embodiment 4. It is the schematic sectional drawing of the power conversion apparatus of Embodiment 5. It is a figure which shows the flowchart of an example of the manufacturing method of the power conversion apparatus of Embodiment 5. It is a figure which shows the flowchart of another example of the manufacturing method of the power conversion apparatus of Embodiment 5. It is the schematic sectional drawing of the power conversion apparatus of Embodiment 6. It is a figure which shows the flowchart of an example of the manufacturing method of the power conversion apparatus of Embodiment 6. It is a figure which shows the flowchart of another example of the manufacturing method of the power conversion apparatus of Embodiment 6.

Hereinafter, embodiments of the present invention will be described. The same reference number will be assigned to the same configuration, and the description will not be repeated.

Embodiment 1.
An example of the circuit configuration of the power conversion device 1 of the present embodiment will be described with reference to FIG. The power converter 1 is, for example, an isolated full-bridge AC / DC converter. The power conversion device 1 includes input terminals 60a and 60b, a first rectifier circuit 51, a first smoothing circuit 52, a full bridge circuit 53, a transformer circuit 54, a second rectifier circuit 55, and a second smoothing circuit 56. And output terminals 70a and 70b are mainly provided. The power conversion device 1 may further include a voltage / current detection circuit 57 and a control circuit 59. The power conversion device 1 may further include a photocoupler 58.

The AC input voltage V _in is input to the input terminals 60a and 60b. The first rectifier circuit 51 is connected to the input terminals 60a and 60b. The first rectifier circuit 51 is configured to rectify the AC input voltage V _in . The first rectifier circuit 51 includes first semiconductor elements 61a, 61b, 61c, 61d such as a diode, for example. The first smoothing circuit 52 is connected to the first rectifier circuit 51. The first smoothing circuit 52 is configured to smooth the voltage output from the first rectifier circuit 51. The first smoothing circuit 52 includes, for example, a first capacitor 62.

The full bridge circuit 53 is connected to the first smoothing circuit 52. The voltage (primary smoothing voltage) V _c smoothed by the first smoothing circuit 52 is input to the full bridge circuit 53. The full bridge circuit 53 includes second semiconductor elements 63a, 63b, 63c, 63d, such as transistors. Diodes may be connected in parallel to the second semiconductor elements 63a, 63b, 63c, and 63d, respectively. The full bridge circuit 53 (second semiconductor elements 63a, 63b, 63c, 63d) can be driven, for example, by the control circuit 59 to output an AC voltage having a square wave.

The transformer circuit 54 (primary coil 64a) is connected to the full bridge circuit 53. The transformer circuit 54 includes, for example, a primary coil 64a, a magnetic core 64b, and a secondary coil 64c. Voltage output from the full bridge circuit 53 (i.e., primary voltage V _T of the transformer circuit 54) is input to the transformer circuit 54 (primary coil 64a). The transformer circuit 54 converts the primary voltage V _T to the secondary voltage.

The second rectifier circuit 55 is connected to the transformer circuit 54 (secondary coil 64c). The second rectifier circuit 55 is configured to perform full-wave rectification of the secondary voltage of the transformer circuit 54. The second rectifier circuit 55 includes, for example, third semiconductor elements 65a, 65b, 65c, 65d such as a diode. The second rectifier circuit 55 outputs the secondary rectifier voltage V _2R .

The second smoothing circuit 56 is connected to the second rectifier circuit 55. The second smoothing circuit 56 is configured to smooth the secondary rectified voltage V _2R output from the second rectified circuit 55. The second smoothing circuit 56 includes, for example, a second coil component 66 configured to function as a reactor and a second capacitor 67. The second coil component 66 and the second capacitor 67 form an LC filter. The second smoothing circuit 56 outputs the smoothed voltage to the output terminals 70a and 70b. The second smoothing circuit 56 is connected to the output terminals 70a and 70b. The power conversion device 1 outputs an output voltage V _o and an output current I _o from the output terminals 70a and 70b.

A voltage / current detection circuit 57 may be provided between the second smoothing circuit 56 and the output terminals 70a and 70b. The voltage / current detection circuit 57 is connected to the second smoothing circuit 56 and the output terminals 70a and 70b. The voltage-current detection circuit 57 is configured to detect the output voltage V _o and the output current I _o from the power converter 1. The voltage-current detection circuit 57 is configured to output an electric signal (hereinafter referred to as “feedback signal”) corresponding to the output voltage V _o and the output current I _o to the control circuit 59 via the photocoupler 58. ing. The voltage-current detection circuit 57 may be configured by, for example, an integrated circuit (IC).

The control circuit 59 is composed of, for example, a microcontroller or a processor such as a digital signal processor (DSP). The control circuit 59 is configured to output on signals S _a , S _b , _Sc , and S _d to the gate terminals of the second semiconductor elements 63a, 63b, 63c, and 63d. When the on signals S _a , S _b , _Sc , and S _d are output from the control circuit 59, the second semiconductor elements 63a, 63b, 63c, and 63d are turned on. When the outputs of the on signals S _a , S _b , _Sc , and S _d from the control circuit 59 are stopped, the second semiconductor elements 63a, 63b, 63c, and 63d are turned off. The control circuit 59 switches the second semiconductor elements 63a, 63b, 63c, 63d between the on state and the off state, and controls the second semiconductor elements 63a, 63b, 63c, 63d by pulse width modulation (PWM). Can be done. The control circuit 59 uses the feedback signals, to properly adjust the output voltage V _o and the output current I _o, on signal _{S a, S b, S c} , sets the pulse width of the S _d.

The control circuit 59 outputs, for example, the second semiconductor element 63a, on signal S _a for 63 b, and S _b, the second semiconductor device 63c, on signal S _c for 63d, and S _d alternately. The second semiconductor elements 63a and 63b and the second semiconductor elements 63c and 63d are alternately turned on. Voltage output from the full bridge circuit 53 (i.e., primary voltage V _T of the transformer circuit 54) is an AC voltage having a rectangular wave.

The photocoupler 58 is configured to transmit the feedback signal output from the voltage / current detection circuit 57 to the control circuit 59 while electrically insulating the voltage / current detection circuit 57 and the control circuit 59 from each other. The photocoupler 58 includes, for example, a light emitting element 58a electrically connected to the voltage / current detection circuit 57 and a light receiving element 58b electrically connected to the control circuit 59. The light emitting element 58a is, for example, a light emitting diode. The light receiving element 58b is, for example, a phototransistor.

The power converter 1 may be applied to, for example, an onboard charger (OBC). Specifically, the power conversion device 1 may be mounted on an electric vehicle (EV), a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHEV), or the like. The input terminals 60a and 60b are electrically connected to, for example, an AC power source provided outside any of these electric vehicles. The output terminals 70a and 70b are electrically connected to a battery mounted on any of these electric vehicles. The battery, the output voltage V _o, is charged.

The configuration of the power conversion device 1 will be described with reference to FIGS. 2 and 3. The power conversion device 1 mainly includes a metal case 7, a first circuit board 15, a first circuit component 17, and an insulation sealing member 12. The power converter 1 may further include a second circuit component 18. The power converter 1 may further include a cap 20.

The metal case 7 is not particularly limited, but is made of a non-magnetic metal material such as aluminum. The metal case 7 includes a bottom plate 8 and a side wall 9 protruding from the bottom plate 8. The metal case 7 is provided with an opening 7a. The opening 7a of the metal case 7 is defined by the side wall 9, and is located on the side opposite to the bottom plate 8 with respect to the first circuit board 15.

The first circuit board 15 is housed in the metal case 7. The first circuit board 15 includes a first insulating base material, a first wiring (not shown), and a first coil conductor (not shown). The first circuit board 15 includes a first main surface 15a facing the bottom plate 8 of the metal case 7 and a second main surface 15b opposite to the first main surface 15a.

One or more first through holes 16 connecting between the first main surface 15a and the second main surface 15b are provided on the first circuit board 15. The width (or diameter) of the first through hole 16 may be 1.5 mm or more. Therefore, the bubbles contained in the insulating sealing material are easily discharged from the first through hole 16. The first through hole 16 can be easily filled with an insulating sealing material. The one or more first through holes 16 may be a plurality of first through holes 16. A plurality of first through holes 16 may be provided on the first main surface 15a of the first circuit board 15, for example, one per area of 400 mm ² or more and 1600 mm ² or less. In a plan view of the second main surface 15b of the first circuit board 15, the plurality of first through holes 16 may be arranged at equal intervals.

The end surface of the first circuit board 15 connecting the first main surface 15a and the second main surface 15b faces the side wall 9 of the metal case 7. The end face of the first circuit board 15 may be separated from the side wall 9 of the metal case 7. A gap 22 may be provided between the end surface of the first circuit board 15 and the side wall 9 of the metal case 7.

The first insulating base material may be formed of, for example, a resin material such as a glass fiber reinforced epoxy resin, a phenol resin, or polyphenylene sulfide (PPS). The first insulating base material may be formed of a ceramic material such as aluminum oxide (Al ₂ O ₃ ) or aluminum nitride (Al N). The first wiring and the first coil conductor are the back surface of the first insulating base material (first main surface 15a of the first circuit board 15) or the front surface of the first insulating base material (first surface of the first circuit board 15). 2 It is provided on the main surface 15b). The first wiring and the first coil conductor are formed of a conductive material such as copper or aluminum.

One or more first circuit components 17 are mounted on the first main surface 15a of the first circuit board 15. The one or more first circuit components 17 may be a plurality of first circuit components 17. One or more second circuit components 18 may be mounted on the second main surface 15b of the first circuit board 15. The one or more second circuit components 18 may be a plurality of second circuit components 18. The first circuit component 17 and the second circuit component 18 include input terminals 60a and 60b shown in FIG. 1, a first rectifier circuit 51, a first smoothing circuit 52, a full bridge circuit 53, and a transformer circuit 54. It may be any of the second rectifier circuit 55, the second smoothing circuit 56, and the output terminals 70a and 70b. The first circuit component 17 and the second circuit component 18 are integrated circuit (IC) components constituting the voltage / current detection circuit 57 (see FIG. 1) or a processor constituting the control circuit 59 (see FIG. 1). There may be.

The insulation sealing member 12 seals the first circuit component 17. The first space between the first main surface 15a of the first circuit board 15 and the bottom plate 8 of the metal case 7 is filled with an insulating sealing member 12. The first space is a space in which the first circuit component 17 is arranged. The insulating sealing member 12 may be an insulating resin member formed of an insulating resin material such as an epoxy resin, a polyimide resin, a polyamide resin, or a silicone resin.

The insulation sealing member 12 may contain a filler such as fine particles. The filler may be dispersed in the insulating sealing member 12. The filler is, for example, silica (SiO ₂ ), alumina (Al ₂ O ₃ ), aluminum nitride (AlN), boron nitride (BN), silicon nitride (Si ₃ N ₄ ), diamond (C) or silicon carbide (SiC). It may be formed of an inorganic ceramic material such as. The filler may have a higher thermal conductivity than the insulating sealing material which is the main component of the insulating sealing member 12, and may improve the thermal conductivity of the insulating sealing member 12.

The insulation sealing member 12 may include a central anchor portion 13. The central anchor portion 13 fixes the central portion of the first circuit board 15. The central anchor portion 13 includes a neck portion 13a in the first through hole 16 of the first circuit board 15, and a head portion 13b on the second main surface 15b of the first circuit board 15. The first through hole 16 may be filled by the neck portion 13a. The head portion 13b is connected to the neck portion 13a and has a width (or diameter) larger than that of the first through hole 16. The insulation sealing member 12 may be separated from the second circuit component 18.

The cap 20 is provided on the second main surface 15b of the first circuit board 15. As shown in FIG. 2, in a plan view from the second main surface 15b of the first circuit board 15, the cap 20 closes the corresponding first through hole 16. The cap 20 is fixed to the second main surface 15b of the first circuit board 15 by using an adhesive or solder. As shown in FIG. 3, the cap 20 is provided with a cavity communicating with the first through hole 16. The head portion 13b is provided in the cavity of the cap 20. There is a gap between the head portion 13b and the cap 20. The cap 20 separates the insulating sealing member 12 (head portion 13b) from the second circuit component 18.

An example of the manufacturing method of the power conversion device 1 of the present embodiment will be described with reference to FIG.
The manufacturing method of the power conversion device 1 of the present embodiment includes supplying an insulating sealing material into the metal case 7 (S1). The insulating sealing material may be, for example, a liquid curable resin material, an elastic semi-curable resin material, or an adhesive curable resin material.

The method for manufacturing the power conversion device 1 of the present embodiment includes mounting the first circuit board 15 on the insulating sealing material (S2). The first circuit board 15 is housed in the metal case 7. The first circuit board 15 includes a first main surface 15a facing the bottom plate 8 of the metal case 7 and a second main surface 15b opposite to the first main surface 15a. The first circuit board 15 is provided with a first through hole 16 for connecting between the first main surface 15a and the second main surface 15b. The first circuit component 17 is mounted on the first main surface 15a of the first circuit board 15. The second circuit component 18 may be mounted on the second main surface 15b of the first circuit board 15. The cap 20 may be provided on the second main surface 15b of the first circuit board 15. In a plan view from the second main surface 15b of the first circuit board 15, the cap 20 closes the corresponding first through hole 16.

The manufacturing method of the power conversion device 1 of the present embodiment includes pressing the first circuit board 15 toward the insulating sealing material (S3). The air bubbles contained in the insulating sealing material are discharged from the first through hole 16 to the outside of the first space between the first main surface 15a of the first circuit board 15 and the bottom plate 8 of the metal case 7. .. The air bubbles contained in the insulating sealing material may also be discharged from the gap 22 between the end surface of the first circuit board 15 and the side wall 9 of the metal case 7. In order to promote the discharge of air bubbles, the first circuit board 15 is pressed toward the insulating sealing material while swinging the first circuit board 15 in the direction along the first main surface 15a of the first circuit board 15. You may.

Pressing the first circuit board 15 toward the insulating sealing material (S3) causes the insulating sealing material to be pressed into the first through hole 16 of the first circuit board 15 and the second main surface of the first circuit board 15. It may include feeding on and on 15b. The neck portion of the insulating sealing material is formed in the first through hole 16 of the first circuit board 15. The first through hole 16 of the first circuit board 15 may be filled with an insulating sealing material. The head portion of the insulating sealing material is formed on the second main surface 15b of the first circuit board 15. The head portion of the insulating sealing material has a width (or diameter) larger than that of the first through hole 16 of the first circuit board 15. The head portion of the insulating sealing material is connected to the neck portion of the insulating sealing material.

Pressing the first circuit board 15 toward the insulating sealing material (S3) may include supplying the insulating sealing material into the cavity of the cap 20. As shown in FIG. 2, in a plan view from the second main surface 15b of the first circuit board 15, the cap 20 closes the corresponding first through hole 16. The cap 20 dams the insulating sealing material supplied from the first through hole 16 onto the second main surface 15b of the first circuit board 15. A head portion of an insulating sealing material is formed in the cavity of the cap 20. The cavity of the cap 20 is not completely filled with the insulating sealing material. There is a gap between the insulation sealing material and the cap 20. The gas in the bubbles contained in the insulation sealing material passes through the first through hole 16 of the first circuit board 15 and collects in this gap. The cap 20 separates the insulating sealing material from the second circuit component 18.

In the method of manufacturing the power conversion device 1 of the present embodiment, the insulating sealing material is cured to fill the first space between the first main surface 15a of the first circuit board 15 and the bottom plate 8 of the metal case 7. The insulation sealing member 12 is formed (S4). The first circuit component 17 is sealed by the insulating sealing member 12.

Curing the insulating sealing material (S4) may include forming a central anchor portion 13 on the insulating sealing member 12. Specifically, in curing the insulating sealing material (S4), the head portion 13b of the insulating sealing member 12 is placed on the second main surface 15b of the first circuit board 15, and the first circuit board 15 is first. It may include forming the neck portion 13a of the insulating sealing member 12 in the through hole 16. The central anchor portion 13 includes a neck portion 13a in the first through hole 16 and a head portion 13b on the second main surface 15b. The first through hole 16 may be filled by the neck portion 13a. The head portion 13b is connected to the neck portion 13a and has a width (or diameter) larger than that of the first through hole 16. Specifically, the head portion 13b of the insulation sealing member 12 may be formed in the cavity of the cap 20. There is a gap between the insulation sealing member 12 and the cap 20.

The operation of the power conversion device 1 of the present embodiment will be described with reference to FIGS. 5 to 8 with reference to the power conversion device 1a of the comparative example.

As described above, in the power conversion device 1 of the present embodiment, air bubbles are removed from the insulation sealing member 12. As shown in FIG. 5, in the insulation sealing member 12, the first space between the first main surface 15a of the first circuit board 15 on which the first circuit component 17 is arranged and the bottom plate 8 of the metal case 7 Is filled. The equivalent circuit between the power converters 1 is as shown in FIG. The first circuit component 17 or the first circuit board 15 is connected to one terminal of the power supply 24. The bottom plate 8 of the metal case 7 is connected to the other terminal of the power supply 24. A capacitor C ₁ having an insulating sealing member 12 as an insulator is formed between the first circuit component 17 or the first circuit board 15 and the bottom plate 8 of the metal case 7. However, unlike the power conversion device 1a of the comparative example shown in FIGS. 7 and 8, the capacitor C ₂ having the air layer 25 as an insulator is not formed, and the interface 26 and the intermediate potential that varies are not present.

Therefore, even if a high voltage is applied between the metal case 7 and the first circuit component 17 or the first circuit board 15 during the operation of the power converter 1, the metal case 7 and the first circuit component 17 or the first circuit board 15 are used. It can be prevented that a partial discharge occurs between the 15 and the 15th. In the power conversion device 1, it is possible to prevent dielectric breakdown from occurring in the insulation sealing member 12.

On the other hand, in the power conversion device 1a of the comparative example, the insulating sheet 12s disclosed in Patent Document 1 is provided instead of the insulating sealing member 12. As shown in FIG. 7, the air layer 25 and the insulating sheet 12s are interposed between the first circuit component 17 or the first circuit board 15 and the metal case 7. The equivalent circuit of the power conversion device 1a of the comparative example is as shown in FIG. The first circuit component 17 or the first circuit board 15 is connected to one terminal of the power supply 24. The bottom plate 8 of the metal case 7 is connected to the other terminal of the power supply 24. The air layer 25 and the insulating sheet 12s are sandwiched between the first circuit component 17 or the first circuit board 15 and the bottom plate 8 of the metal case 7. A capacitor C ₁ and a capacitor C ₂ are formed between the first circuit component 17 or the first circuit board 15 and the bottom plate 8 of the metal case 7. Capacitor C ₁ has an insulating sheet 12s as an insulator. The capacitor C ₂ has an air layer 25 as an insulator. Capacitor C ₁ and capacitor C ₂ are connected in series with each other.

The insulating sheet 12s is easily warped and has a thickness very thin compared to the distance between the metal case 7 and the first circuit component 17 or the first circuit board 15. The position of the insulating sheet 12s in the first space between the first main surface 15a of the first circuit board 15 and the bottom plate 8 of the metal case 7 varies greatly. The intermediate voltage at the interface 26 between the insulating sheet 12s and the air layer 25 is the voltage applied between the metal case 7 and the first circuit component 17 or the first circuit board 15, and the capacitance of the capacitor C _1. And the capacitance of the capacitor C ₂ . If the position of the insulating sheet 12s varies greatly, the capacitances of the capacitors C ₁ and C ₂ vary greatly. Therefore, the intermediate voltage at the interface 26 between the insulating sheet 12s and the air layer 25 also varies greatly.

When a large voltage is applied between the first circuit component 17 or the first circuit board 15 and the metal case 7, the interface with the first circuit component 17 or the first circuit board 15 due to the large variation in the intermediate voltage. A partial discharge may occur between the 26 and the interface 26 between the insulating sheet 12s and the air layer 25 and the metal case 7. In this way, dielectric breakdown may occur in the insulating sheet 12s.

The effect of the power conversion device 1 of the present embodiment and the manufacturing method thereof will be described.
The power conversion device 1 of the present embodiment includes a metal case 7, a first circuit board 15, a first circuit component 17, and an insulation sealing member 12. The metal case 7 includes a bottom plate 8 and a side wall 9 protruding from the bottom plate 8. The first circuit board 15 is housed in the metal case 7. The first circuit board 15 includes a first main surface 15a facing the bottom plate 8 of the metal case 7 and a second main surface 15b opposite to the first main surface 15a. The first circuit component 17 is mounted on the first main surface 15a of the first circuit board 15. The insulation sealing member 12 seals the first circuit component 17. The first circuit board 15 is provided with a first through hole 16 for connecting between the first main surface 15a and the second main surface 15b. The first space between the first main surface 15a of the first circuit board 15 and the bottom plate 8 of the metal case 7 is filled with an insulating sealing member 12.

Bubbles are removed from the insulating sealing member 12 through the first through hole 16 of the first circuit board 15. The first space between the first main surface 15a of the first circuit board 15 and the bottom plate 8 of the metal case 7 on which the first circuit component 17 is arranged is filled with the insulating sealing member 12. It is possible to prevent a partial discharge from occurring in the power conversion device 1 during the operation of the power conversion device 1. It is possible to prevent dielectric breakdown from occurring in the insulating sealing member 12. The power converter 1 has improved insulation performance.

The first space between the first main surface 15a of the first circuit board 15 and the bottom plate 8 of the metal case 7 on which the first circuit component 17 is arranged is filled with the insulating sealing member 12. Therefore, the heat generated in the first circuit component 17 or the first circuit board 15 can be transferred to the metal case 7 through the insulation sealing member 12. This heat can be dissipated from the metal case 7 to the outside of the power converter 1. The power converter 1 has improved heat dissipation. Since the power conversion device 1 does not require an additional heat dissipation member, the power conversion device 1 can be miniaturized.

The first space between the first main surface 15a of the first circuit board 15 and the bottom plate 8 of the metal case 7 on which the first circuit component 17 is arranged is filled with the insulating sealing member 12. Therefore, in the power conversion device 1, dew condensation can be prevented from occurring in the power conversion device 1.

In the power conversion device 1 of the present embodiment, the insulation sealing member 12 may include the central anchor portion 13. The central anchor portion 13 includes a neck portion 13a in the first through hole 16 and a head portion 13b on the second main surface 15b of the first circuit board 15. The head portion 13b is connected to the neck portion 13a and has a width larger than that of the first through hole 16. The central anchor portion 13 fixes the first circuit board 15 to the insulation sealing member 12. Even if vibration is applied to the power conversion device 1, the central anchor portion 13 can prevent the first circuit board 15 from vibrating. The vibration resistance of the power converter 1 can be improved.

The power conversion device 1 of the present embodiment may further include a cap 20 provided on the second main surface 15b of the first circuit board 15. The head portion 13b is provided in the cavity of the cap 20. The cap 20 protects the head portion 13b of the insulating sealing member 12 from mechanical impact. Even if a mechanical impact is applied to the power converter 1, the cap 20 can prevent the first circuit board 15 from coming off from the insulation sealing member 12. The mechanical impact resistance of the power converter 1 can be improved.

The manufacturing method of the power conversion device 1 of the present embodiment includes supplying an insulating sealing material into the metal case 7 (S1). The metal case 7 includes a bottom plate 8 and a side wall 9 protruding from the bottom plate 8. The method for manufacturing the power conversion device 1 of the present embodiment includes mounting the first circuit board 15 on the insulating sealing material (S2). The first circuit board 15 is housed in the metal case 7. The first circuit board 15 includes a first main surface 15a facing the bottom plate 8 of the metal case 7 and a second main surface 15b opposite to the first main surface 15a. The first circuit board 15 is provided with a first through hole 16 for connecting between the first main surface 15a and the second main surface 15b. The first circuit component 17 is mounted on the first main surface 15a of the first circuit board 15. The method of manufacturing the power conversion device 1 of the present embodiment is to press the first circuit board 15 toward the insulating sealing material (S3) and cure the insulating sealing material to form the first circuit board 15. It includes forming an insulating sealing member 12 (S4) that fills a first space between the first main surface 15a and the bottom plate 8 of the metal case 7. The first circuit component 17 is sealed by the insulating sealing member 12.

When the first circuit board 15 is pressed toward the insulating sealing material (S3), the bubbles contained in the insulating sealing material pass through the first through hole 16 of the first circuit board 15 and the insulating sealing member. Removed from 12. The first space between the first main surface 15a of the first circuit board 15 on which the first circuit component 17 is arranged and the bottom plate 8 of the metal case 7 is filled with the insulating sealing member 12. It is possible to prevent a partial discharge from occurring in the power conversion device 1 during the operation of the power conversion device 1. It is possible to prevent dielectric breakdown from occurring in the insulating sealing member 12. The method for manufacturing the power conversion device 1 of the present embodiment can manufacture the power conversion device 1 having improved insulation performance.

In the method for manufacturing the power conversion device 1 of the present embodiment, it is not necessary to introduce an expensive vacuum device in order to remove air bubbles contained in the insulating sealing material. The method of manufacturing the power conversion device 1 of the present embodiment makes it possible to inexpensively and mass-produce the power conversion device 1 having improved insulation performance.

The first space between the first main surface 15a of the first circuit board 15 and the bottom plate 8 of the metal case 7 on which the first circuit component 17 is arranged is filled with the insulating sealing member 12. Therefore, the heat generated in the first circuit component 17 or the first circuit board 15 can be transferred to the metal case 7 through the insulation sealing member 12. This heat can be dissipated from the metal case 7 to the outside of the power converter 1. The method of manufacturing the power conversion device 1 of the present embodiment can improve the heat dissipation of the power conversion device 1. Further, the power conversion device 1 does not require an additional heat dissipation member. Therefore, according to the method for manufacturing the power conversion device 1 of the present embodiment, the miniaturized power conversion device 1 can be manufactured.

The first space between the first main surface 15a of the first circuit board 15 and the bottom plate 8 of the metal case 7 on which the first circuit component 17 is arranged is filled with the insulating sealing member 12. Therefore, according to the manufacturing method of the power conversion device 1 of the present embodiment, the power conversion device 1 in which the occurrence of dew condensation is prevented can be manufactured.

In the manufacturing method of the power conversion device 1 of the present embodiment, pressing the first circuit board 15 toward the insulating sealing material (S3) causes the insulating sealing material to be pressed into the first through hole 16 and the first circuit. It may include supplying on the second main surface 15b of the substrate 15. In the method of manufacturing the power conversion device 1 of the present embodiment, curing the insulating sealing material (S4) may include forming a central anchor portion 13 on the insulating sealing member 12. The central anchor portion 13 includes a neck portion 13a in the first through hole 16 and a head portion 13b on the second main surface 15b. The head portion 13b is connected to the neck portion 13a and has a width larger than that of the first through hole 16.

The central anchor portion 13 fixes the first circuit board 15 to the insulation sealing member 12. Even if vibration is applied to the power conversion device 1, the central anchor portion 13 can prevent the first circuit board 15 from vibrating. According to the method for manufacturing the power conversion device 1 of the present embodiment, the power conversion device 1 having improved vibration resistance can be manufactured.

In the method of manufacturing the power conversion device 1 of the present embodiment, the cap 20 may be provided on the second main surface 15b of the first circuit board 15. Pressing the first circuit board 15 toward the insulating sealing material (S3) may include supplying the insulating sealing material into the cavity of the cap 20. Curing the insulating sealing material (S4) is to place the head portion 13b of the insulating sealing member 12 in the first through hole 16 on the second main surface 15b of the first circuit board 15 and in the cavity of the cap 20. It may include forming the neck portion 13a of the insulation sealing member 12.

The cap 20 facilitates the formation of the central anchor portion 13 of the insulating sealing member 12. The cap 20 protects the head portion 13b of the insulating sealing member 12 from mechanical impact. According to the method for manufacturing the power conversion device 1 of the present embodiment, the power conversion device 1 having improved vibration resistance and mechanical impact resistance can be easily manufactured.

Embodiment 2.
The power conversion device 1b according to the second embodiment will be described with reference to FIGS. 1, 9 and 10. The power conversion device 1b of the present embodiment has the same configuration as the power conversion device 1 of the first embodiment, but is mainly different in the following points.

The insulation sealing member 12 includes a side anchor portion 14. The side anchor portion 14 holds the edge portion 15e of the first circuit board 15. The gap 22 provided between the end surface of the first circuit board 15 and the side wall 9 of the metal case 7 is filled with the side anchor portion 14.

The metal case 7 may include a protrusion 11 projecting from the side wall 9 to the inside of the metal case 7. The protrusion 11 faces the gap 22. The protrusion 11 is, for example, a plate-shaped member. The protrusion 11 may be formed of the same metal material as the metal case 7, or may be formed of a material different from that of the metal case 7. The protrusion 11 is arranged on the side distal to the bottom plate 8 with respect to the second main surface 15b of the first circuit board 15. The side anchor portion 14 is in contact with the protruding portion 11.

A method of manufacturing the power conversion device 1b according to the present embodiment will be described with reference to FIG. The manufacturing method of the power conversion device 1b of the present embodiment includes the same steps as the manufacturing method of the power conversion device 1 of the first embodiment, but is mainly different in the following points.

In the method of manufacturing the power conversion device 1b of the present embodiment, pressing the first circuit board 15 toward the insulating sealing material (S3) causes the insulating sealing material to be pressed against the end face of the first circuit board 15 and the metal. It includes supplying the first circuit board 15 onto the edge portion 15e from the gap 22 between the case 7 and the side wall 9. The insulating sealing material is supplied on the edge portion of the first main surface 15a and on the edge portion of the second main surface 15b. The protruding portion 11 functions as a guide member that guides the insulating sealing material to the edge portion 15e of the first circuit board 15. The protrusion 11 facilitates the formation of the side anchor portion 14. Curing the insulating sealing material (S4) includes forming a side anchor portion 14 on the insulating sealing member 12. The side anchor portion 14 holds the edge portion 15e of the first circuit board 15.

In the modified example of the present embodiment, the insulating sealing member 12 includes the side anchor portion 14, but does not have to include the central anchor portion 13. When the area of the first main surface 15a of the first circuit board 15 is small, for example, 5000 mm ² or less, even if the first circuit board 15 is fixed to the insulation sealing member 12 only by the side anchor portion 14. Good.

The power conversion device 1b of the present embodiment and its manufacturing method have the following effects in addition to the effects of the power conversion device 1 of the first embodiment and the manufacturing method thereof.

In the power conversion device 1b of the present embodiment, the first circuit board 15 is separated from the side wall 9. The insulation sealing member 12 includes a side anchor portion 14 that holds the edge portion 15e of the first circuit board 15. Therefore, the first circuit board 15 is fixed to the insulation sealing member 12 by the side anchor portion 14. Even if vibration is applied to the power conversion device 1b, the side anchor portion 14 can prevent the first circuit board 15 from vibrating. The vibration resistance of the power converter 1b can be improved.

In the power conversion device 1b of the present embodiment, the metal case 7 includes a protrusion 11 projecting from the side wall 9 to the inside of the metal case 7. The protrusion 11 is arranged on the side distal to the bottom plate 8 with respect to the second main surface 15b of the first circuit board 15. The side anchor portion 14 is in contact with the protruding portion 11. The protrusion 11 protects the side anchor portion 14 from mechanical impact. Even if a mechanical impact is applied to the power conversion device 1b, the protruding portion 11 can prevent the first circuit board 15 from coming off from the insulation sealing member 12. The mechanical impact resistance of the power converter 1b can be improved.

In the method of manufacturing the power conversion device 1b of the present embodiment, pressing the first circuit board 15 toward the insulating sealing material (S3) causes the insulating sealing material to be pressed against the end face of the first circuit board 15 and the metal. It includes supplying the first circuit board 15 onto the edge portion 15e from the gap 22 between the case 7 and the side wall 9. Curing the insulating sealing material (S4) includes forming a side anchor portion 14 on the insulating sealing member 12. Therefore, the first circuit board 15 is fixed to the insulation sealing member 12 by the side anchor portion 14. Even if vibration is applied to the power conversion device 1b, the side anchor portion 14 can prevent the first circuit board 15 from vibrating. According to the method for manufacturing the power conversion device 1b of the present embodiment, the power conversion device 1b with improved vibration resistance can be manufactured.

In the method of manufacturing the power conversion device 1b of the present embodiment, the metal case 7 may include a protrusion 11 projecting from the side wall 9 to the inside of the metal case 7. Pressing the first circuit board 15 toward the insulating sealing material (S3) may include the protrusion 11 guiding the insulating sealing material to the edge 15e of the first circuit board 15. The protrusion 11 guides the insulating sealing material to the edge 15e of the first circuit board 15. The protrusion 11 facilitates the formation of the side anchor portion 14. The protrusion 11 protects the side anchor portion 14 from mechanical impact. According to the method for manufacturing the power conversion device 1b of the present embodiment, the power conversion device 1b having improved vibration resistance and mechanical impact resistance can be easily and inexpensively manufactured.

Embodiment 3.
The power conversion device 1c according to the third embodiment will be described with reference to FIGS. 1 and 11. The power conversion device 1c of the present embodiment has the same configuration as the power conversion device 1b of the second embodiment, but is mainly different in the following points.

The power conversion device 1c further includes one or more spacers 28 provided between the first main surface 15a of the first circuit board 15 and the bottom plate 8 of the metal case 7. One or more spacers 28 may come into contact with the first main surface 15a of the first circuit board 15 and the bottom plate 8 of the metal case 7. One or more spacers 28 may be fitted in recesses provided in the bottom plate 8 of the metal case 7. The height of the spacer 28 is higher than the height of the first circuit component 17 (or the maximum height of the plurality of first circuit components 17). The spacer 28 makes it possible to secure an insulating distance between the first circuit component 17 or the first circuit board 15 and the bottom plate 8 of the metal case 7. The insulation distance is determined by the safety standard required for the power converter 1c.

The spacer 28 may be made of, for example, an insulating material. The spacer 28 may be fixed to the first main surface 15a of the first circuit board 15. The spacer 28 may be composed of, for example, a dummy pad (not shown) on the first main surface 15a of the first circuit board 15 and a dummy circuit component (not shown) soldered to the dummy pad. .. The dummy pad is electrically insulated from the wiring (not shown) included in the first circuit board 15. The spacer 28 may be fixed to the bottom plate 8 of the metal case 7. The one or more spacers 28 may be a plurality of spacers 28. In a plan view of the second main surface 15b of the first circuit board 15, the plurality of spacers 28 may be arranged at equal intervals.

A method of manufacturing the power conversion device 1c according to the present embodiment will be described with reference to FIG. The manufacturing method of the power conversion device 1c of the present embodiment includes the same steps as the manufacturing method of the power conversion device 1b of the second embodiment, but is mainly different in the following points.

In the method of manufacturing the power conversion device 1c according to the present embodiment, pressing the first circuit board 15 toward the insulating sealing material (S3) causes the spacer 28 to be pressed against the first main surface 15a of the first circuit board 15. It is included to be provided between the metal case 7 and the bottom plate 8 of the metal case 7. In an example of this embodiment, the spacer 28 is provided on the first main surface 15a of the first circuit board 15. Pressing the first circuit board 15 toward the insulating sealing material (S3) brings the spacer 28 into contact with the bottom plate 8 of the metal case 7 and brings the spacer 28 into contact with the first main surface 15a of the first circuit board 15. The metal case 7 is provided between the metal case 7 and the bottom plate 8. In another example of this embodiment, the spacer 28 is fixed on the bottom plate 8 of the metal case 7. Pressing the first circuit board 15 toward the insulating sealing material (S3) brings the first main surface 15a of the first circuit board 15 into contact with the spacer 28, and brings the spacer 28 to the first circuit board 15. 1 Includes the provision between the main surface 15a and the bottom plate 8 of the metal case 7.

The power conversion device 1c and its manufacturing method of the present embodiment have the following effects in addition to the effects of the power conversion device 1b of the second embodiment and the manufacturing method thereof.

In the present embodiment, the spacer 28 is provided between the first main surface 15a of the first circuit board 15 and the bottom plate 8 of the metal case 7. Even if the first circuit board 15 is warped, the spacer 28 makes it possible to secure an insulating distance between the first circuit component 17 or the first circuit board 15 and the bottom plate 8 of the metal case 7. The power converter 1c has improved insulation performance. According to the method for manufacturing the power conversion device 1c of the present embodiment, the power conversion device 1c with improved insulation performance can be manufactured.

Embodiment 4.
The power conversion device 1d according to the fourth embodiment will be described with reference to FIGS. 1 and 12. The power conversion device 1d of the present embodiment has the same configuration as the power conversion device 1 of the first embodiment, but is mainly different in the following points.

The power conversion device 1d further includes a lid 40. The lid 40 closes the opening 7a of the metal case 7. The lid 40 may be a metal lid. The lid 40 may be made of the same metal material as the metal case 7. The lid 40 may be made of an insulating material. The lid 40 includes an inner surface 40a facing the second main surface 15b of the first circuit board 15, and an outer surface 40b on the side opposite to the inner surface 40a. The lid 40 is provided with a hole 41 for connecting the inner surface 40a and the outer surface 40b.

The first circuit board 15 is embedded in the insulation sealing member 12. The second space between the second main surface 15b of the first circuit board 15 and the inner surface 40a of the lid 40 is filled with the insulating sealing member 12. The second space is a space in which the second circuit component 18 is arranged. The insulation sealing member 12 seals the second circuit component 18. The first space and the second space communicate with each other through a gap 22 provided between the end surface of the first circuit board 15 and the side wall 9 of the metal case 7. The gap 22 is filled with the insulating sealing member 12. The insulation sealing member 12 holds the edge portion 15e of the first circuit board 15.

The insulation sealing member 12 may include a central anchor portion 13. The central anchor portion 13 fixes the central portion of the lid 40. The central anchor portion 13 includes a neck portion 13a in the hole 41 of the lid 40 and a head portion 13b on the outer surface 40b. The hole 41 of the lid 40 may be filled by the neck portion 13a. The head portion 13b is connected to the neck portion 13a and has a width (or diameter) larger than that of the hole 41 of the lid 40.

The cap 20 is provided on the outer surface 40b of the lid 40. In a plan view from the outer surface 40b of the lid 40, the cap 20 closes the corresponding hole 41. The cap 20 is fixed to the outer surface 40b of the lid 40 by using an adhesive or solder. The cap 20 is provided with a cavity communicating with the hole 41. The head portion 13b is provided in the cavity of the cap 20. There is a gap between the head portion 13b and the cap 20.

The power conversion device 1d of the present embodiment further includes a spacer 28 provided between the first main surface 15a and the bottom plate 8 of the metal case 7, similarly to the power conversion device 1c of the third embodiment.

An example of the manufacturing method of the power conversion device 1d of the present embodiment will be described with reference to FIG. An example of the manufacturing method of the power conversion device 1d of the present embodiment includes the following steps S5 to S8 instead of the step S4 of the manufacturing method of the power conversion device 1 of the first embodiment (see FIG. 4). It is mainly different in that it is.

In the method for manufacturing the power conversion device 1d according to the present embodiment, the first circuit board 15 is pressed toward the insulating sealing material in the same manner as the method for manufacturing the power conversion device 1c according to the third embodiment (S3). ) Includes the spacer 28 being provided between the first main surface 15a and the bottom plate 8 of the metal case 7.

Then, the method of manufacturing the power conversion device 1d according to the present embodiment includes supplying the insulating sealing material on the second main surface 15b of the first circuit board 15 (S5). The insulating sealing material may be, for example, a liquid curable resin material, an elastic semi-curable resin material, or an adhesive curable resin material.

The method for manufacturing the power conversion device 1d of the present embodiment includes placing the lid 40 on the insulating sealing material (S6). The lid 40 closes the opening 7a of the metal case 7. The lid 40 includes an inner surface 40a facing the second main surface 15b of the first circuit board 15, and an outer surface 40b on the side opposite to the inner surface 40a. The lid 40 is provided with a hole 41 for connecting the inner surface 40a and the outer surface 40b. The cap 20 may be provided on the outer surface 40b of the lid 40. In a plan view from the outer surface 40b of the lid 40, the cap 20 closes the corresponding hole 41.

The method of manufacturing the power conversion device 1d of the present embodiment includes pressing the lid 40 toward the insulating sealing material (S7). The air bubbles contained in the insulating sealing material are discharged from the holes 41 to the outside of the second space between the second main surface 15b of the first circuit board 15 and the inner surface 40a of the lid 40. In order to promote the discharge of air bubbles, the lid 40 may be pressed toward the insulating sealing material while swinging the lid 40 in the direction along the inner surface 40a of the lid 40.

Pressing the lid 40 against the insulating sealing material (S7) may include supplying the insulating sealing material into the holes 41 of the lid 40 and on the outer surface 40b of the lid 40. The neck portion of the insulating sealing material is formed in the hole 41 of the lid 40. The holes 41 of the lid 40 may be filled with an insulating sealing material. The head portion of the insulating sealing material is formed on the outer surface 40b of the lid 40. The head portion of the insulating sealing material has a width (or diameter) larger than that of the hole 41 of the lid 40. The head portion of the insulating sealing material is connected to the neck portion of the insulating sealing material.

Pressing the lid 40 against the insulating sealing material (S7) may include supplying the insulating sealing material into the cavity of the cap 20. In a plan view from the outer surface 40b of the lid 40, the cap 20 closes the corresponding hole 41. The cap 20 dams the insulating sealing material supplied from the hole 41 onto the outer surface 40b of the lid 40. A head portion of an insulating sealing material is formed in the cavity of the cap 20. The cavity of the cap 20 is not completely filled with the insulating sealing material. There is a gap between the insulation sealing material and the cap 20. The gas in the bubbles contained in the insulating sealing material passes through the hole 41 of the lid 40 and collects in this gap.

In the method of manufacturing the power conversion device 1d of the present embodiment, the insulating sealing material is cured to fill the second space between the second main surface 15b of the first circuit board 15 and the inner surface 40a of the lid 40. The insulation sealing member 12 is formed (S8). The second circuit component 18 is sealed by the insulating sealing member 12.

Curing the insulating sealing material (S8) may include forming a central anchor portion 13 on the insulating sealing member 12. Specifically, curing the insulating sealing material (S8) means placing the head portion 13b of the insulating sealing member 12 on the outer surface 40b of the lid 40 and the neck of the insulating sealing member 12 in the hole 41 of the lid 40. It may include forming the portion 13a. The central anchor portion 13 includes a neck portion 13a in the hole 41 of the lid 40 and a head portion 13b on the outer surface 40b of the lid 40. The hole 41 of the lid 40 may be filled by the neck portion 13a. The head portion 13b is connected to the neck portion 13a and has a width (or diameter) larger than that of the hole 41 of the lid 40. Specifically, the head portion 13b of the insulation sealing member 12 may be formed in the cavity of the cap 20. There is a gap between the insulation sealing member 12 and the cap 20.

In an example of the manufacturing method of the power conversion device 1d of the present embodiment, the insulating sealing materials supplied in a plurality of times are collectively cured in the step S8.

Another example of the manufacturing method of the power conversion device 1d of the present embodiment will be described with reference to FIG. Another example of the manufacturing method of the power conversion device 1d of the present embodiment includes the same steps as the example of the manufacturing method of the power conversion device 1d of the present embodiment (see FIG. 13), but the step S3 Step S4 of an example (see FIG. 4) of the manufacturing method of the power conversion device 1 of the first embodiment is further provided between the step S5 and the step S5. In another example of the method of manufacturing the power conversion device 1d of the present embodiment, the insulating sealing material is cured each time the insulating sealing material is supplied and pressed.

The power conversion device 1d of the present embodiment exerts the following effects in addition to the effects of the power conversion device 1 of the first embodiment.

The power conversion device 1d of the present embodiment further includes a lid 40 and a second circuit component 18. The lid 40 closes the opening 7a of the metal case 7. The opening 7a of the metal case 7 is defined by the side wall 9, and is located on the side opposite to the bottom plate 8 with respect to the first circuit board 15. The lid 40 includes an inner surface 40a facing the second main surface 15b of the first circuit board 15, and an outer surface 40b on the side opposite to the inner surface 40a. The lid 40 is provided with a hole 41 for connecting the inner surface 40a and the outer surface 40b. The second circuit component 18 is mounted on the second main surface 15b of the first circuit board 15. The first circuit board 15 is embedded in the insulation sealing member 12. The second space between the second main surface 15b of the first circuit board 15 and the inner surface 40a of the lid 40 is filled with the insulating sealing member 12. The insulation sealing member 12 seals the second circuit component 18.

Air bubbles are removed from the insulating sealing member 12 through the hole 41 of the lid 40. The second space between the second main surface 15b of the first circuit board 15 and the inner surface 40a of the lid 40 on which the second circuit component 18 is arranged is filled with the insulating sealing member 12. Even if a high voltage is applied between the lid 40 and the second circuit component 18 or the first circuit board 15 during the operation of the power converter 1d, the lid 40 and the second circuit component 18 or the first circuit board 15 It can be prevented that a partial discharge occurs between them. It is possible to prevent dielectric breakdown from occurring in the insulating sealing member 12. The power converter 1d has improved insulation performance.

The second space between the second main surface 15b of the first circuit board 15 and the inner surface 40a of the lid 40 on which the second circuit component 18 is arranged is filled with the insulating sealing member 12. Therefore, the heat generated in the first circuit component 17, the second circuit component 18, or the first circuit board 15 can be transferred to the metal case 7 and the lid 40 through the insulation sealing member 12. This heat can be dissipated from the metal case 7 and the lid 40 to the outside of the power converter 1d. The power converter 1d has improved heat dissipation. Since the power conversion device 1d does not require an additional heat dissipation member, the power conversion device 1d can be miniaturized.

The second space between the second main surface 15b of the first circuit board 15 and the inner surface 40a of the lid 40 on which the second circuit component 18 is arranged is filled with the insulating sealing member 12. Therefore, in the power conversion device 1d, it is possible to prevent dew condensation from occurring in the power conversion device 1d.

The lid 40 protects the first circuit board 15, the first circuit component 17, and the second circuit component 18 from mechanical impact. Even if a mechanical impact is applied to the power converter 1d, the lid 40 can prevent the first circuit board 15, the first circuit component 17, and the second circuit component 18 from being destroyed. The mechanical impact resistance of the power converter 1d can be improved.

The first circuit board 15 is embedded in the insulation sealing member 12. Therefore, even if vibration is applied to the power conversion device 1d, the insulation sealing member 12 can prevent the first circuit board 15 from vibrating. The vibration resistance of the power converter 1d can be improved.

In the power conversion device 1d of the present embodiment, the insulation sealing member 12 may include the central anchor portion 13. The central anchor portion 13 includes a neck portion 13a in the hole 41 of the lid 40 and a head portion 13b on the outer surface 40b of the lid 40. The head portion 13b is connected to the neck portion 13a and has a width larger than that of the hole 41 of the lid 40. The central anchor portion 13 fixes the lid 40 to the insulating sealing member 12. Even if vibration is applied to the power conversion device 1d, the central anchor portion 13 can prevent the lid 40 from coming off from the insulation sealing member 12. The vibration resistance of the power converter 1d can be improved.

The power conversion device 1d of the present embodiment further includes a cap 20 provided on the outer surface 40b of the lid 40. The head portion 13b is provided in the cavity of the cap 20. The cap 20 protects the head portion 13b of the insulating sealing member 12 from mechanical impact. Even if a mechanical impact is applied to the power converter 1d, the cap 20 can prevent the lid 40 from coming off from the insulating sealing member 12. The mechanical impact resistance of the power converter 1d can be improved.

In the power conversion device 1d of the present embodiment, the spacer 28 is provided between the first main surface 15a of the first circuit board 15 and the bottom plate 8 of the metal case 7. Even if the first circuit board 15 is warped, the spacer 28 makes it possible to secure an insulating distance between the first circuit component 17 or the first circuit board 15 and the bottom plate 8 of the metal case 7. The power converter 1d has improved insulation performance.

Embodiment 5.
The power conversion device 1e according to the fifth embodiment will be described with reference to FIGS. 1 and 15. The power conversion device 1e of the present embodiment has the same configuration as the power conversion device 1c of the third embodiment, but further includes a second circuit board 30, a third circuit component 32, and a fourth circuit component 33. The main difference is that the spacer 28 (see FIG. 11) is replaced with the first spacer 35 and the second spacer 36.

The second circuit board 30 is housed in the metal case 7. The second circuit board 30 includes a second insulating base material, a second wiring (not shown), and a second coil conductor (not shown). The second circuit board 30 includes a third main surface 30a facing the bottom plate 8 of the metal case 7 and a fourth main surface 30b opposite to the third main surface 30a. The second circuit board 30 is arranged between the bottom plate 8 of the metal case 7 and the first circuit board 15. The fourth main surface 30b of the second circuit board 30 faces the first main surface 15a of the first circuit board 15.

The second circuit board 30 is provided with one or more second through holes 31 connecting between the third main surface 30a and the fourth main surface 30b. The width (or diameter) of the second through hole 31 may be 1.5 mm or more. Therefore, the bubbles contained in the insulating sealing material are easily discharged from the second through hole 31. The second through hole 31 can be easily filled with an insulating sealing material. The one or more second through holes 31 may be a plurality of second through holes 31. A plurality of second through holes 31 may be provided on the third main surface 30a of the second circuit board 30, for example, one per area of 400 mm ² or more and 1600 mm ² or less. In a plan view of the fourth main surface 30b of the second circuit board 30, the plurality of second through holes 31 may be arranged at equal intervals.

The end surface of the second circuit board 30 connecting the third main surface 30a and the fourth main surface 30b faces the side wall 9 of the metal case 7. The end face of the second circuit board 30 may be separated from the side wall 9 of the metal case 7. A gap 37 may be provided between the end surface of the second circuit board 30 and the side wall 9 of the metal case 7.

The second insulating base material may be formed of, for example, a resin material such as a glass fiber reinforced epoxy resin, a phenol resin, or polyphenylene sulfide (PPS). The first insulating base material may be formed of a ceramic material such as aluminum oxide (Al ₂ O ₃ ) or aluminum nitride (Al N). The second wiring and the second coil conductor are the back surface of the second insulating base material (third main surface 30a of the second circuit board 30) or the front surface of the second insulating base material (the first surface of the second circuit board 30). 4 It is provided on the main surface 30b). The second wire and the second coil conductor are made of a conductive material such as copper or aluminum.

One or more third circuit components 32 may be mounted on the third main surface 30a of the second circuit board 30. The one or more third circuit components 32 may be a plurality of third circuit components 32. One or more fourth circuit components 33 may be mounted on the fourth main surface 30b of the second circuit board 30. The one or more fourth circuit components 33 may be a plurality of fourth circuit components 33. The third circuit component 32 and the fourth circuit component 33 include input terminals 60a and 60b shown in FIG. 1, a first rectifier circuit 51, a first smoothing circuit 52, a full bridge circuit 53, and a transformer circuit 54. It may be any of the second rectifier circuit 55, the second smoothing circuit 56, and the output terminals 70a and 70b. The third circuit component 32 and the fourth circuit component 33 are integrated circuit (IC) components constituting the voltage / current detection circuit 57 (see FIG. 1) or a processor constituting the control circuit 59 (see FIG. 1). There may be.

The second circuit board 30 is embedded in the insulation sealing member 12. The insulation sealing member 12 seals the third circuit component 32. The first partial space between the third main surface 30a of the second circuit board 30 and the bottom plate 8 of the metal case 7 is filled with the insulating sealing member 12. The first subspace is a space in which the third circuit component 32 is arranged. The insulation sealing member 12 seals the fourth circuit component 33. The second partial space between the fourth main surface 30b of the second circuit board 30 and the first main surface 15a of the first circuit board 15 is filled with the insulating sealing member 12. The second subspace is a space in which the first circuit component 17 and the fourth circuit component 33 are arranged. The second circuit board 30 divides the first space between the first main surface 15a of the first circuit board 15 and the bottom plate 8 of the metal case 7 into a first subspace and a second subspace. The gap 22 and the gap 37 are filled with an insulating sealing member 12. The insulation sealing member 12 holds the edge portion 30e of the second circuit board 30.

One or more first spacers 35 are provided between the third main surface 30a of the second circuit board 30 and the bottom plate 8 of the metal case 7. One or more first spacers 35 may come into contact with the third main surface 30a of the second circuit board 30 and the bottom plate 8 of the metal case 7. One or more first spacers 35 may be fitted in recesses provided in the bottom plate 8 of the metal case 7. The height of the first spacer 35 is higher than the height of the third circuit component 32 (or the maximum height of the plurality of third circuit components 32).

The first spacer 35 may be made of, for example, an insulating material. The first spacer 35 may be fixed to the third main surface 30a of the second circuit board 30. The first spacer 35 is composed of, for example, a dummy pad (not shown) on the third main surface 30a of the second circuit board 30 and a dummy circuit component (not shown) soldered to the dummy pad. May be good. The first spacer 35 may be fixed to the bottom plate 8 of the metal case 7. The one or more first spacers 35 may be a plurality of first spacers 35. In a plan view of the fourth main surface 30b of the second circuit board 30, the plurality of first spacers 35 may be arranged at equal intervals.

One or more second spacers 36 are provided between the first main surface 15a of the first circuit board 15 and the fourth main surface 30b of the second circuit board 30. One or more second spacers 36 may come into contact with the first main surface 15a of the first circuit board 15 and the fourth main surface 30b of the second circuit board 30. The height of the second spacer 36 is higher than the height of the first circuit component 17 (or the maximum height of the plurality of first circuit components 17). The height of the second spacer 36 is higher than the height of the fourth circuit component 33 (or the maximum height of the plurality of fourth circuit components 33).

The second spacer 36 may be made of, for example, an insulating material. The second spacer 36 may be fixed to the first main surface 15a of the first circuit board 15. The second spacer 36 includes, for example, a dummy pad (not shown) on the first main surface 15a of the first circuit board 15 and a dummy pad (not shown) on the fourth main surface 30b of the second circuit board 30. And a dummy circuit component (not shown) soldered to these dummy pads. The second spacer 36 may be fixed to the fourth main surface 30b of the second circuit board 30. The one or more second spacers 36 may be a plurality of second spacers 36. In a plan view of the second main surface 15b of the first circuit board 15, the plurality of second spacers 36 may be arranged at equal intervals.

An example of the manufacturing method of the power conversion device 1e of the present embodiment will be described with reference to FIG.
The method for manufacturing the power conversion device 1e of the present embodiment includes supplying an insulating sealing material into the metal case 7 (S11). The metal case 7 includes a bottom plate 8 and a side wall 9 protruding from the bottom plate 8. The insulating sealing material may be, for example, a liquid curable resin material, an elastic semi-curable resin material, or an adhesive curable resin material.

The method for manufacturing the power conversion device 1e of the present embodiment includes mounting the second circuit board 30 on the insulating sealing material (S12). The second circuit board 30 is housed in the metal case 7. The second circuit board 30 includes a third main surface 30a facing the bottom plate 8 of the metal case 7 and a fourth main surface 30b opposite to the third main surface 30a. A second through hole 31 connecting between the third main surface 30a and the fourth main surface 30b is provided on the second circuit board 30. The third circuit component 32 is mounted on the third main surface 30a of the second circuit board 30. The fourth circuit component 33 may be mounted on the fourth main surface 30b of the second circuit board 30.

The method of manufacturing the power conversion device 1e of the present embodiment includes pressing the second circuit board 30 toward the insulating sealing material (S13). The air bubbles contained in the insulating sealing material are discharged from the second through hole 31 to the outside of the first partial space between the third main surface 30a of the second circuit board 30 and the bottom plate 8 of the metal case 7. To. The air bubbles contained in the insulating sealing material may also be discharged from the gap 37 between the end surface of the second circuit board 30 and the side wall 9 of the metal case 7. In order to promote the discharge of air bubbles, the second circuit board 30 is pressed toward the insulating sealing material while swinging the second circuit board 30 in the direction along the third main surface 30a of the second circuit board 30. You may.

In the method of manufacturing the power conversion device 1e according to the present embodiment, pressing the second circuit board 30 toward the insulating sealing material (S13) causes the first spacer 35 to be pressed against the third main circuit board 30. It includes being provided between the surface 30a and the bottom plate 8 of the metal case 7. In an example of this embodiment, the first spacer 35 is provided on the third main surface 30a of the second circuit board 30. Pressing the second circuit board 30 toward the insulating sealing material (S13) causes the first spacer 35 to come into contact with the bottom plate 8 of the metal case 7, and the first spacer 35 to be brought into contact with the third of the second circuit board 30. It includes the provision between the main surface 30a and the bottom plate 8 of the metal case 7. In another example of this embodiment, the first spacer 35 is fixed on the bottom plate 8 of the metal case 7. Pressing the second circuit board 30 toward the insulating sealing material (S13) brings the third main surface 30a of the second circuit board 30 into contact with the first spacer 35, and brings the first spacer 35 into the second circuit. It includes the provision between the third main surface 30a of the substrate 30 and the bottom plate 8 of the metal case 7.

The method for manufacturing the power conversion device 1e of the present embodiment includes supplying an insulating sealing material on the fourth main surface 30b of the second circuit board 30 (S15). The insulating sealing material may be a liquid curable resin material, a semi-curable resin material having elasticity, or a curable resin material having adhesiveness.

The method for manufacturing the power conversion device 1e of the present embodiment includes mounting the first circuit board 15 on the insulating sealing material (S16). The first circuit board 15 is housed in the metal case 7. The first circuit board 15 has a first main surface 15a facing the bottom plate 8 of the metal case 7 and a fourth main surface 30b of the second circuit board 30, and a second main surface opposite to the first main surface 15a. Includes 15b and. A first through hole 16 connecting between the first main surface 15a and the second main surface 15b is provided on the first circuit board 15. The first circuit component 17 is mounted on the first main surface 15a of the first circuit board 15. The second circuit component 18 may be mounted on the second main surface 15b of the first circuit board 15. The cap 20 may be provided on the second main surface 15b of the first circuit board 15. The cap 20 may be fixed to the second main surface 15b of the first circuit board 15 using an adhesive or solder. In a plan view from the second main surface 15b of the first circuit board 15, the cap 20 closes the corresponding first through hole 16.

The method of manufacturing the power conversion device 1e of the present embodiment includes pressing the first circuit board 15 toward the insulating sealing material (S17). The air bubbles contained in the insulating sealing material are the second partial space between the first main surface 15a of the first circuit board 15 and the fourth main surface 30b of the second circuit board 30 from the first through hole 16. It is discharged to the outside of. The air bubbles contained in the insulating sealing material may also be discharged from the gap 22 between the end surface of the first circuit board 15 and the side wall 9 of the metal case 7. In order to promote the discharge of air bubbles, the first circuit board 15 is pressed toward the insulating sealing material while swinging the first circuit board 15 in the direction along the first main surface 15a of the first circuit board 15. You may.

Pressing the first circuit board 15 toward the insulating sealing material (S17) causes the second spacer 36 to come into contact with the first main surface 15a of the first circuit board 15 and the fourth main surface 30b of the second circuit board 30. Including the provision between. In an example of this embodiment, the second spacer 36 is provided on the first main surface 15a of the first circuit board 15. Pressing the first circuit board 15 toward the insulating sealing material (S17) brings the second spacer 36 into contact with the fourth main surface 30b of the second circuit board 30 and brings the second spacer 36 into the first circuit. It includes the provision between the first main surface 15a of the substrate 15 and the fourth main surface 30b of the second circuit board 30. In another example of this embodiment, the second spacer 36 is provided on the fourth main surface 30b of the second circuit board 30. Pressing the first circuit board 15 toward the insulating sealing material (S17) brings the first main surface 15a of the first circuit board 15 into contact with the second spacer 36, and brings the second spacer 36 into the first circuit. It includes the provision between the first main surface 15a of the substrate 15 and the fourth main surface 30b of the second circuit board 30.

Pressing the first circuit board 15 toward the insulating sealing material (S17) causes the insulating sealing material to be pressed into the first through hole 16 of the first circuit board 15 and the second main surface of the first circuit board 15. It may include feeding on and on 15b. The neck portion of the insulating sealing material is formed in the first through hole 16 of the first circuit board 15. The head portion of the insulating sealing material is formed on the second main surface 15b of the first circuit board 15. The head portion of the insulating sealing material has a width (or diameter) larger than that of the first through hole 16 of the first circuit board 15. The head portion of the insulating sealing material is connected to the neck portion of the insulating sealing material.

Pressing the first circuit board 15 toward the insulating sealing material (S17) may include supplying the insulating sealing material into the cavity of the cap 20. In a plan view from the second main surface 15b of the first circuit board 15, the cap 20 closes the corresponding first through hole 16. The cap 20 dams the insulating sealing material supplied from the first through hole 16 onto the second main surface 15b of the first circuit board 15. A head portion of an insulating sealing material is formed in the cavity of the cap 20. The cavity of the cap 20 is not completely filled with the insulating sealing material. There is a gap between the insulation sealing material and the cap 20. The gas in the bubbles contained in the insulation sealing material passes through the first through hole 16 of the first circuit board 15 and collects in this gap.

In the method of manufacturing the power conversion device 1e of the present embodiment, pressing the first circuit board 15 toward the insulating sealing material (S17) causes the insulating sealing material to be pressed against the end face of the first circuit board 15 and the metal. It includes supplying the first circuit board 15 onto the edge portion 15e from the gap 22 between the case 7 and the side wall 9. The insulating sealing material is supplied on the edge portion of the first main surface 15a and on the edge portion of the second main surface 15b. The protruding portion 11 functions as a guide member that guides the insulating sealing material to the edge portion 15e of the first circuit board 15. The protrusion 11 facilitates the formation of the side anchor portion 14.

In the method of manufacturing the power conversion device 1e of the present embodiment, the insulating sealing material is cured to be between the first main surface 15a of the first circuit board 15 and the fourth main surface 30b of the second circuit board 30. The insulation sealing member 12 for filling the second subspace is formed (S18). The first circuit component 17 is sealed by the insulating sealing member 12.

Curing the insulating sealing material (S18) may include forming a central anchor portion 13 on the insulating sealing member 12. Specifically, in curing the insulating sealing material (S18), the head portion 13b of the insulating sealing member 12 is placed on the second main surface 15b of the first circuit board 15, and the first circuit board 15 is first. It may include forming the neck portion 13a of the insulating sealing member 12 in the through hole 16. The central anchor portion 13 includes a neck portion 13a in the first through hole 16 and a head portion 13b on the second main surface 15b. The head portion 13b is connected to the neck portion 13a and has a width (or diameter) larger than that of the first through hole 16. Specifically, the head portion 13b of the insulation sealing member 12 may be formed in the cavity of the cap 20. There is a gap between the insulation sealing member 12 and the cap 20.

Curing the insulating sealing material (S18) may include forming a side anchor portion 14 on the insulating sealing member 12. The side anchor portion 14 holds the edge portion 15e of the first circuit board 15.

In an example of the manufacturing method of the power conversion device 1e of the present embodiment, the insulating sealing materials supplied in a plurality of times are collectively cured in the step S18.

Another example of the manufacturing method of the power conversion device 1e according to the present embodiment will be described with reference to FIG. Another example of the manufacturing method of the power conversion device 1e of the present embodiment includes the same steps as the example of the manufacturing method of the power conversion device 1e of the present embodiment (see FIG. 16), but the step S13 A step S14 is further provided between the step S15 and the step S15. In step S14, the insulating sealing material is cured to form an insulating sealing member 12 that fills the first partial space between the third main surface 30a of the second circuit board 30 and the bottom plate 8 of the metal case 7. To. The third circuit component 32 is sealed by the insulating sealing member 12. In another example of the method of manufacturing the power conversion device 1e of the present embodiment, the insulating sealing material is cured each time the insulating sealing material is supplied and pressed.

In the modified example of this embodiment, the insulating sealing member 12 may include the central anchor portion 13 or the side anchor portion 14. When the area of the first main surface 15a of the first circuit board 15 is small, for example, 5000 mm ² or less, the first circuit board 15 may be fixed only by the side anchor portion 14. When the area of the first main surface 15a of the first circuit board 15 is further large, the first circuit board 15 may be fixed only by the central anchor portion 13. When the area of the first main surface 15a of the first circuit board 15 is further larger, the first circuit board 15 may be fixed by the central anchor portion 13 and the side anchor portion 14.

The power conversion device 1e of the present embodiment and the manufacturing method thereof have the following effects in addition to the effects of the power conversion device 1c of the third embodiment.

The power conversion device 1e of the present embodiment further includes a second circuit board 30 and a third circuit component 32. The second circuit board 30 is housed in the metal case 7. The second circuit board 30 is arranged between the bottom plate 8 of the metal case 7 and the first circuit board 15. The second circuit board 30 is on the side opposite to the third main surface 30a facing the bottom plate 8 of the metal case 7 and the third main surface 30a and faces the first main surface 15a of the first circuit board 15. Includes the fourth main surface 30b. A second through hole 31 connecting between the third main surface 30a and the fourth main surface 30b is provided on the second circuit board 30. The third circuit component 32 is mounted on the third main surface 30a of the second circuit board 30. The second circuit board 30 is embedded in the insulation sealing member 12. The insulation sealing member 12 seals the third circuit component 32.

Air bubbles are removed from the insulation sealing member 12 through the first through hole 16 of the first circuit board 15 and the second through hole 31 of the second circuit board 30. The first partial space between the third main surface 30a of the second circuit board 30 and the bottom plate 8 of the metal case 7 where the third circuit component 32 is arranged, and the first circuit component 17 are arranged. The second partial space between the first main surface 15a of the first circuit board 15 and the fourth main surface 30b of the second circuit board 30 is filled with the insulating sealing member 12. It is possible to prevent a partial discharge from occurring in the power conversion device 1e during the operation of the power conversion device 1e. It is possible to prevent dielectric breakdown from occurring in the insulating sealing member 12. The power converter 1e has improved insulation performance.

The power conversion device 1e includes a second circuit board 30 in addition to the first circuit board 15. The circuit of the power conversion device 1e (see FIG. 1 as an example) is composed of a first circuit board 15 and a second circuit board 30. Further, the second circuit board 30 is arranged between the bottom plate 8 of the metal case 7 and the first circuit board 15. Therefore, the size of the power conversion device 1e in the plan view of the second main surface 15b of the first circuit board 15 can be reduced.

The second circuit board 30 is embedded in the insulation sealing member 12. Therefore, even if vibration is applied to the power conversion device 1e, the insulation sealing member 12 can prevent the second circuit board 30 from vibrating. The vibration resistance of the power converter 1e can be improved.

The power conversion device 1e of the present embodiment further includes a first spacer 35 and a second spacer 36. The first spacer 35 is provided between the third main surface 30a of the second circuit board 30 and the bottom plate 8 of the metal case 7. The second spacer 36 is provided between the first main surface 15a of the first circuit board 15 and the fourth main surface 30b of the second circuit board 30. Even if the second circuit board 30 is warped, the first spacer 35 makes it possible to secure an insulation distance between the third circuit component 32 or the second circuit board 30 and the bottom plate 8 of the metal case 7. Even if the first circuit board 15 is warped, the second spacer 36 ensures an insulation distance between the first circuit board 17 or the first circuit board 15 and the fourth circuit board 33 or the second circuit board 30. To enable. The power converter 1e has improved insulation performance.

Embodiment 6.
The power conversion device 1f according to the sixth embodiment will be described with reference to FIGS. 1 and 18. The power conversion device 1f of the present embodiment has the same configuration as the power conversion device 1d of the fourth embodiment, but further includes a second circuit board 30, a third circuit component 32, and a fourth circuit component 33. The main difference is that the spacer 28 (see FIG. 11) is replaced with a first spacer 35 and a second spacer 36.

The second circuit board 30, the third circuit component 32, and the fourth circuit component 33 of the present embodiment are the same as the second circuit board 30, the third circuit component 32, and the fourth circuit component 33 of the fifth embodiment, respectively. Is. The first spacer 35 and the second spacer 36 of the present embodiment are the same as the first spacer 35 and the second spacer 36 of the fifth embodiment, respectively.

An example of the manufacturing method of the power conversion device 1f of the present embodiment will be described with reference to FIG. An example of the manufacturing method of the power conversion device 1f of the present embodiment includes the same steps as the example of the manufacturing method of the power conversion device 1d of the fourth embodiment (see FIG. 13), but in the following points. Mainly different. The manufacturing method of an example of the power conversion device 1f of the present embodiment replaces steps S1 to S3 of the example of the manufacturing method of the power conversion device 1d of the fourth embodiment, and the power conversion device 1e according to the fifth embodiment A step S11 to a step S13 and a step S15 to a step S17 of an example of the manufacturing method of (see FIG. 16) are provided. In an example of the manufacturing method of the power conversion device 1f of the present embodiment, the insulating sealing materials supplied in a plurality of times are collectively cured in the step S8.

With reference to FIG. 20, another example of the manufacturing method of the power conversion device 1f according to the present embodiment will be described. Another example of the manufacturing method of the power conversion device 1f of the present embodiment includes the same steps as the example of the manufacturing method of the power conversion device 1d of the fourth embodiment (see FIG. 13), but has the following steps. It is mainly different in that. Another method of manufacturing the power conversion device 1f of the present embodiment is to replace the steps S1 to S3 of the example of the manufacturing method of the power conversion device 1d of the fourth embodiment with the power conversion device according to the fifth embodiment. A step S11 to a step S18 of another example of the manufacturing method of 1e (see FIG. 17) is provided. In another example of the manufacturing method of the power conversion device 1f of the present embodiment, the insulating sealing material is cured each time the insulating sealing material is supplied and pressed.

The power conversion device 1f of the present embodiment has the same effect as the effects of the power conversion devices 1d and 1e of the fourth and fifth embodiments. One of the effects of the power conversion device 1f of the present embodiment is as follows.

The power conversion device 1f of the present embodiment further includes a second circuit board 30 and a third circuit component 32. The second circuit board 30 is housed in the metal case 7. The second circuit board 30 is arranged between the bottom plate 8 of the metal case 7 and the first circuit board 15. The second circuit board 30 is on the side opposite to the third main surface 30a facing the bottom plate 8 of the metal case 7 and the third main surface 30a and facing the first main surface 15a of the first circuit board 15. Includes the fourth main surface 30b. The third circuit component 32 is mounted on the third main surface 30a of the second circuit board 30. The second circuit board 30 is embedded in the insulation sealing member 12. The insulation sealing member 12 seals the third circuit component 32. A second through hole 31 connecting between the third main surface 30a and the fourth main surface 30b is provided on the second circuit board 30. The second through hole 31 is filled with the insulating sealing member 12.

Air bubbles are removed from the insulation sealing member 12 through the first through hole 16 of the first circuit board 15, the second through hole 31 of the second circuit board 30, and the hole 41 of the lid 40. The first partial space between the third main surface 30a of the second circuit board 30 and the bottom plate 8 of the metal case 7 where the third circuit component 32 is arranged, and the first circuit component 17 are arranged. The first circuit board 15 in which the second partial space between the first main surface 15a of the first circuit board 15 and the fourth main surface 30b of the second circuit board 30 and the second circuit component 18 are arranged. The second space between the second main surface 15b and the inner surface 40a of the lid 40 is filled with the insulating sealing member 12. During the operation of the power conversion device 1f, it is possible to prevent a partial discharge from occurring in the power conversion device 1f. It is possible to prevent dielectric breakdown from occurring in the insulating sealing member 12. The power converter 1f has improved insulation performance.

It should be considered that Embodiments 1-6 disclosed this time are exemplary in all respects and not restrictive. The scope of the present invention is shown by the scope of claims rather than the above description, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

1,1a, 1b, 1c, 1d, 1e, 1f Power converter, 7 metal case, 7a opening, 8 bottom plate, 9 side wall, 11 protrusion, 12 insulation sealing member, 12s insulation sheet, 13 center anchor, 13a Neck part, 13b head part, 14 side anchor part, 15 1st circuit board, 15a 1st main surface, 15b 2nd main surface, 15e, 30e edge part, 16 1st through hole, 17 1st circuit component, 18th 2 circuit parts, 20 caps, 22, 37 gaps, 24 power supplies, 25 air layers, 26 interfaces, 28 spacers, 30 second circuit boards, 30a third main surface, 30b fourth main surface, 31 second through holes, 32 3rd circuit component, 33 4th circuit component, 35 1st spacer, 36 2nd spacer, 40 lid, 40a inner surface, 40b outer surface, 41 holes, 51 1st rectifying circuit, 52 1st smoothing circuit, 53 full bridge circuit, 54 Transformer circuit, 55 Second rectifier circuit, 56 Second smoothing circuit, 57 Voltage / current detection circuit, 58 Photocoupler, 58a light emitting element, 58b light receiving element, 59 control circuit, 60a, 60b input terminal, 61a, 61b, 61c, 61d 1st semiconductor element, 62 1st capacitor, 63a, 63b, 63c, 63d 2nd semiconductor element, 64a primary coil, 64b magnetic core, 64c secondary coil, 65a, 65b, 65c, 65d 3rd semiconductor element, 66th 2-coil component, 67 second capacitor, 70a, 70b output terminals.

Claims (14)

A metal case including a bottom plate and a side wall protruding from the bottom plate,
A first circuit board housed in the metal case is provided, and the first circuit board has a first main surface facing the bottom plate and a second main surface opposite to the first main surface. Including,
The first circuit component mounted on the first main surface and
It is provided with an insulation sealing member that seals the first circuit component.
A first through hole connecting the first main surface and the second main surface is provided on the first circuit board.
A power conversion device in which a first space between the first main surface of the first circuit board and the bottom plate is filled with the insulation sealing member. The insulating sealing member includes a central anchor portion and includes a central anchor portion.
The central anchor portion includes a neck portion in the first through hole and a head portion on the second main surface.
The power conversion device according to claim 1, wherein the head portion is connected to the neck portion and has a width larger than that of the first through hole. Further provided with a cap provided on the second main surface,
The power conversion device according to claim 2, wherein the head portion is provided in the cavity of the cap. The first circuit board is separated from the side wall and is separated from the side wall.
The power conversion device according to any one of claims 1 to 3, wherein the insulating sealing member includes a side anchor portion that holds an edge portion of the first circuit board. The metal case includes a protrusion that projects from the side wall to the inside of the metal case.
The protrusion is arranged on the side distal to the bottom plate with respect to the second main surface.
The power conversion device according to claim 4, wherein the side anchor portion is in contact with the protruding portion. The power conversion device according to any one of claims 1 to 5, further comprising a spacer provided between the first main surface and the bottom plate. A lid is further provided to close the opening of the metal case, and the opening of the metal case is defined by the side wall and is located on the side opposite to the bottom plate with respect to the first circuit board. The lid includes an inner surface facing the second main surface and an outer surface opposite to the inner surface, and further
A second circuit component mounted on the second main surface is provided.
The lid is provided with a hole for connecting the inner surface and the outer surface.
The first circuit board is embedded in the insulation sealing member.
The second space between the second main surface of the first circuit board and the inner surface of the lid is filled with the insulating sealing member.
The power conversion device according to claim 1, wherein the insulation sealing member seals the second circuit component. The power conversion device according to claim 7, further comprising a spacer provided between the first main surface and the bottom plate. A second circuit board housed in the metal case is further provided, the second circuit board is arranged between the bottom plate and the first circuit board, and the second circuit board is the bottom plate. A third main surface facing the third main surface and a fourth main surface on the opposite side of the third main surface and facing the first main surface, and further
A third circuit component mounted on the third main surface is provided.
The second circuit board is embedded in the insulation sealing member, and is embedded in the insulation sealing member.
The insulation sealing member seals the third circuit component.
The power conversion according to any one of claims 1 to 5, wherein a second through hole connecting the third main surface and the fourth main surface is provided on the second circuit board. apparatus. A second circuit board housed in the metal case is further provided, the second circuit board is arranged between the bottom plate and the first circuit board, and the second circuit board is the bottom plate. A third main surface facing the third main surface and a fourth main surface on the opposite side of the third main surface and facing the first main surface, and further
A third circuit component mounted on the third main surface is provided.
The second circuit board is embedded in the insulation sealing member, and is embedded in the insulation sealing member.
The insulation sealing member seals the third circuit component.
A second through hole connecting the third main surface and the fourth main surface is provided on the second circuit board.
The power conversion device according to claim 7, wherein the second through hole is filled with the insulation sealing member. The insulating sealing member includes a central anchor portion and includes a central anchor portion.
The central anchor portion includes a neck portion in the hole and a head portion on the outer surface.
The power conversion device according to any one of claims 7, 8 and 10, wherein the head portion is connected to the neck portion and has a width larger than that of the hole. Further provided with a cap provided on the outer surface
The power conversion device according to claim 11, wherein the head portion is provided in the cavity of the cap. A first spacer provided between the third main surface and the bottom plate,
The power conversion device according to claim 9 or 10, further comprising a second spacer provided between the first main surface and the fourth main surface. The metal case comprises supplying an insulating sealing material into the metal case, the metal case including a bottom plate and a side wall protruding from the bottom plate, and further.
The first circuit board is provided on the insulating sealing material, and the first circuit board is housed in the metal case and has a first main surface facing the bottom plate and the above. The first circuit board is provided with a first through hole that includes a second main surface opposite to the first main surface and connects the first main surface and the second main surface. The first circuit component is mounted on the first main surface, and further
Pressing the first circuit board toward the insulating sealing material and
The first circuit comprises curing the insulating sealing material to form an insulating sealing member that fills a first space between the first main surface of the first circuit board and the bottom plate. A method for manufacturing a power conversion device, in which parts are sealed by the insulation sealing member.

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