JP2020161655A - Cooling system - Google Patents

Abstract

To provide a cooling system stabilizing cooling performance.SOLUTION: A cooling system includes: a vaporizer 2 having ducts of cooling medium formed internally, and cooling multiple heating components by evaporating the cooling medium in a liquid state; a condenser for condensing the cooling medium; a first duct R1 for guiding the cooling medium from the condenser to the vaporizer 2; and a second duct R2 for guiding the cooling medium from the vaporizer 2 to the condenser. The vaporizer 2 is formed with: a preheating chamber R4 connected with the first duct R1 and provided with low temperature electronic components 200 on an external surface; and multiple micro-channels 2c connected with the preheating chamber R4 and the second duct R2, and provided with high temperature semiconductor chips 100 on an external surface, wherein the multiple micro-channels are provided respectively correspondingly to the high temperature semiconductor chips 100.SELECTED DRAWING: Figure 2

Description

The present invention relates to a cooling system.

For example, Patent Document 1 discloses a latent heat utilization type cooling device that cools a plurality of heating elements. In this latent heat utilization type cooling device (cooling system), the liquid refrigerant arranged in contact with the heating element is evaporated, and the heating element is cooled by the latent heat of the liquid refrigerant. In such a latent heat utilization type cooling device, the refrigerant evaporated in the evaporation chamber and turned into a gaseous state is put into a liquid state again in the condensation chamber and circulated to the evaporation chamber again.

Japanese Unexamined Patent Publication No. 2000-216578

In the above latent heat utilization type cooling device, heating elements are arranged along the flow direction of the refrigerant. With such an arrangement, the temperature of the refrigerant in contact differs between the heating element arranged on the upstream side in the flow direction of the refrigerant and the heating element arranged on the downstream side, and the timing at which the refrigerant boils is different. Unlike, the cooling performance is not stable.

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to stabilize the cooling performance in a cooling system.

In order to achieve the above object, in the present invention, as a first means, evaporation is performed to cool a plurality of high-temperature electronic components by forming a flow path of the cooling medium inside and evaporating the cooling medium in a liquid state. A device, a condenser for condensing the cooling medium, a first flow path for guiding the cooling medium from the condenser to the evaporator, and a first flow path for guiding the cooling medium from the evaporator to the condenser. The evaporator is provided with two flow paths, and the evaporator is connected to the first flow path and a preheating chamber in which a low-temperature electronic component is provided on an outer surface, and is connected to the preheating chamber and the second flow path to generate high-temperature electrons. A configuration is adopted in which the parts are provided on the outer surface and a plurality of evaporation chambers are provided corresponding to each of the high-temperature electronic parts.

As a second means, in the first means, the evaporator adopts a configuration in which the evaporation chamber is provided with a surface area expanding member for expanding the surface area of the flow path surface.

According to the present invention, an evaporation chamber is provided corresponding to each high-temperature electronic component, and a preheating chamber in which low-temperature electronic components are arranged is provided on the upstream side of the evaporation chamber. As a result, the cooling medium is in thermal contact with each high-temperature electronic component in a preheated state. Therefore, it is possible to suppress the variation in the timing at which the cooling medium boils, and to boil the cooling medium at an early stage, thereby stabilizing the cooling performance.

It is a schematic diagram of the cooling system which concerns on one Embodiment of this invention. It is a schematic diagram which shows the internal structure of the evaporator in the cooling system which concerns on one Embodiment of this invention.

Hereinafter, an embodiment of the cooling system according to the present invention will be described with reference to the drawings.

As shown in FIG. 1, the cooling system 1 according to the present embodiment includes an evaporator 2, a condenser 3, a pump 4, an evaporator inflow flow path R1 (first flow path), and an evaporator discharge flow path. It has R2 (second flow path) and a return flow path R3.

As shown in FIG. 2, the evaporator 2 has a casing 2a, a flow path member 2b, and a microchannel 2c (surface area expansion member). The casing 2a is a hollow member having a substantially rectangular parallelepiped shape and is made of a material having high thermal conductivity. The casing 2a has two heat transfer surfaces facing each other, one surface is provided with a plurality of power semiconductor chips 100 (high temperature electronic components), and the other surface is provided with another electronic component 200 (low temperature electronic component). Electronic components) are provided. The electronic component 200 has a characteristic that the heat generation temperature is lower than that of the power semiconductor chip 100. Further, the evaporator inflow flow path R1, the evaporator discharge flow path R2, and the return flow path R3 are connected to the casing 2a, and the cooling medium flows into the casing 2a.

The flow path member 2b is a partition member provided in the internal space of the casing 2a and guides the cooling medium in a certain direction. The flow path member 2b is provided so as to partition between each power semiconductor chip 100 and each electronic component 200. Inside the casing 2a, a preheating chamber R4 in which the electronic component 200 is provided on the outer surface by the flow path member 2b, and a plurality of evaporation chambers R5 corresponding to each power semiconductor chip 100 while the power semiconductor chip 100 is provided on the outer surface. Is formed. The preheating chamber R4 is connected to the evaporator inflow flow path R1. The evaporation chamber R5 is connected to the preheating chamber R4 and the evaporator discharge flow path R2.

The microchannel 2c is a member in which a fine flow path is formed inside, and is arranged inside the surface of the casing 2a where the power semiconductor chip 100 is provided so as to overlap the power semiconductor chip 100.

Returning to FIG. 1, the condenser 3 has a heat exchanger (not shown) and an internal flow path, and condenses the cooling medium in a gaseous state in the evaporator 2 by cooling it. Such a condenser 3 is connected to the evaporator inflow flow path R1 and the evaporator discharge flow path R2. That is, the cooling medium in the liquid state in the condenser 3 flows through the evaporator inflow flow path R1, and the cooling in the gaseous state (or gas-liquid mixed state) in the evaporator 2 flows in the evaporator discharge flow path R2. The medium flows. The return flow path R3 has a downstream end connected to the evaporator inflow flow path R1 and returns the discharged cooling medium to the evaporator 2.

The pump 4 is provided on the evaporator inflow flow path R1 and pumps a liquid cooling medium from the condenser 3 to the evaporator 2.

In such a cooling system 1, the liquid cooling medium supplied from the condenser 3 is pumped by the pump 4 and flows into the evaporator 2 through the evaporator inflow flow path R1. Then, the cooling medium in the liquid state is guided to the preheating chamber R4 inside the evaporator 2. The cooling medium exchanges heat with the electronic component 200 in the preheating chamber R4. As a result, the temperature of the cooling medium rises from that immediately after being discharged from the condenser 3.

Then, the cooling medium is guided from the preheating chamber R4 to the evaporation chamber R5. The cooling medium exchanges heat with the power semiconductor chip 100 by passing through the microchannel 2c in the evaporation chamber R5, and boils and evaporates. The latent heat of vaporization at this time cools the power semiconductor chip 100. The cooling medium in the gaseous state is discharged from the evaporation chamber R5 to the evaporator discharge flow path R2, and flows into the condenser 3 again. Further, a part of the cooling medium is discharged from the evaporation chamber R5 to the return flow path R3, and flows into the evaporator 2 again through the evaporator inflow flow path R1. That is, a part of the cooling medium is circulated by the evaporator inflow flow path R1 and the return flow path R3 without passing through the condenser 3. The cooling medium discharged from the evaporation chamber R5 located on the side far from the evaporator discharge flow path R2 passes outside the evaporation chamber R5 located on the side closer to the evaporator discharge flow path R2, and passes through the outside of the evaporation chamber R5. It is discharged to R2.

According to this embodiment, heat exchange between the electronic component 200 and the cooling medium is performed upstream of heat exchange between the power semiconductor chip 100 and the cooling medium. As a result, the cooling medium is preheated and heat exchanged with the power semiconductor chip 100 in the evaporation chamber R5. As a result, the cooling medium is likely to evaporate during heat exchange with the power semiconductor chip 100, and it is possible to stabilize the cooling performance due to the latent heat of vaporization.

Further, according to the present embodiment, the evaporator 2 has a microchannel 2c at a position corresponding to the power semiconductor chip 100. As a result, the evaporator 2 can increase the surface area inside, and the cooling efficiency of the evaporator 2 can be improved.

Further, according to the present embodiment, the evaporator 2 is divided into a preheating chamber R4 and an evaporation chamber R5, and it is possible to easily guide the cooling medium flowing into the evaporator 2. Therefore, the temperature distribution of the cooling medium in the evaporator 2 can be easily controlled, and the cooling performance can be stabilized.

Further, according to the present embodiment, a plurality of evaporators 2 are provided in the evaporation chamber R5 corresponding to each power semiconductor chip 100. Therefore, cooling media having substantially the same temperature are supplied to each evaporation chamber R5, and the cooling efficiency does not differ for each power semiconductor chip 100. Therefore, it is possible to stabilize the cooling performance by this as well.

Although the preferred embodiment of the present invention has been described above with reference to the drawings, the present invention is not limited to the above embodiment. The various shapes and combinations of the constituent members shown in the above-described embodiment are examples, and can be variously changed based on design requirements and the like without departing from the spirit of the present invention.

In the above embodiment, the power semiconductor chip 100 is given as an example as a high-temperature electronic component, but the present invention is not limited thereto. Further, the low temperature electronic component 200 can be, for example, a reactor, a semiconductor having a low heat generation temperature, or the like.

In the above embodiment, the surface area expanding member is assumed to have the microchannel 2c, but the present invention is not limited thereto. For example, the surface area expansion member may have a shape in which a plurality of fins are erected.

1 Cooling system 2 Evaporator 2b Flow path member 2c Microchannel 3 Condenser 100 Power semiconductor chip 200 Electronic component R1 Evaporator Inflow flow path R2 Evaporator discharge flow path R3 Flow path R4 Preheating chamber R5 Evaporation chamber

Claims (2)

An evaporator that cools a plurality of high-temperature electronic components by forming a flow path of the cooling medium inside and evaporating the cooling medium in a liquid state.
A condenser that condenses the cooling medium and
A first flow path that guides the cooling medium from the condenser to the evaporator,
A second flow path for guiding the cooling medium from the evaporator to the condenser is provided.
The evaporator is
A preheating chamber connected to the first flow path and provided with low-temperature electronic components on the outer surface,
A cooling system connected to the preheating chamber and the second flow path, in which high-temperature electronic components are provided on the outer surface and a plurality of evaporation chambers are provided corresponding to each of the high-temperature electronic components. .. The cooling system according to claim 1, wherein the evaporator is provided with a surface area expanding member for expanding the surface area of the flow path surface in the evaporation chamber.

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