JP2020157532A - Mold device and method of producing molded product - Google Patents

Abstract

To remove dust attached to an extruding pin 32 by washing out the dust attached to the extruding pin 32 with a cleaning agent.SOLUTION: A mold device of this invention includes: a molded product extruding mechanism 3 including a first passage 31 formed in a movable die 21 so as to communicate with a cavity 23 and an extruding pin 32 movably inserted in the first passage 31 and causing a molded product to be released from the movable die 21 by causing the extruding pin 32 to move so that a tip of the extruding pin protrudes from a first opening part 311 on a side of the cavity 23 in the first passage 31; and a cleaning mechanism 4 including a second passage 41 formed in the movable die 21 so as to communicate to the first passage 31, supplying a cleaning agent to the second passage 41, and circulating the cleaning agent, in which the cleaning agent supplied to the second passage 41 is caused to flow into the first passage 31.SELECTED DRAWING: Figure 1

Description

The present invention relates to a mold apparatus used for producing a molded product of a thermosetting resin composition containing nanoparticles, and a method for producing a molded product using the mold apparatus.

In a mold device for injection molding, a molding material (thermocurable resin composition) is injected into a cavity formed inside by combining a first mold and a second mold on a split surface to form a molded product. After molding, a molded product extrusion mechanism is used in which an extrusion pin attached to one of the molds is projected into the cavity to separate the molded product from the mold. In the molded product extrusion mechanism of such a mold device, a pin insertion passage is formed which is communicated with the cavity and the extrusion pin is inserted, and the extrusion pin is projected into the cavity through the pin insertion passage. As a result, the molded product itself, the sprue, and the runner are brought into contact with each other to push the molded product out of the mold, and then the molded product is returned to the pin insertion passage.

In such a molded product extrusion mechanism, when the extrusion pin is projected into the cavity, resin residue (debris of the molding material; the same applies hereinafter) remaining in the cavity may adhere to the extrusion pin, or even extrude. When the pin was returned to the pin insertion passage, the resin residue sometimes invaded and adhered to the inside of the pin insertion passage. The resin residue adhering to the extrusion pin or invading and adhering to the pin insertion passage hinders the advance / retreat operation of the extrusion pin in the pin insertion passage, which may lead to a malfunction of the molded product extrusion mechanism. ..

Therefore, conventionally, as a means for removing the resin residue remaining in the cavity after the molded product is detached, the resin residue is removed by suction disposal (Patent Document 1), or the temperature of the extrusion pin is changed by electromagnetic induction heating. Thereby, it has been proposed to control the clearance between the extrusion pin and the pin insertion passage during the injection of the resin composition into the cavity and the ejection operation of the extrusion pin (Patent Document 2).

Japanese Unexamined Patent Publication No. 5-283459 Japanese Unexamined Patent Publication No. 2012-868

Here, when the molding material contains nanoparticles, the nanoparticles are prevented from agglomerating in the molding material before or during injection into the cavity, and are uniformly dispersed in the molding material. From this point of view, the surface of the nanoparticles to be blended is coated with a dispersant made of a surfactant or the like. When injection molding is performed using a molding material containing such nanoparticles, not only the resin residue but also the nanoparticles liberated from the molding material and the gasified dispersant adhere to the extrusion pin or invade the pin insertion passage. There was a risk of doing so.

However, it has been difficult to remove nanoparticles liberated from the molding material by both techniques according to Patent Documents 1 and 2. In this way, if nanoparticles or dispersants adhere to the extrusion pin or the pin insertion passage, the advance / retreat operation of the extrusion pin is also hindered, and the extrusion pin does not return to its original position in the pin insertion passage. , There was a risk of malfunction of the molded product extrusion mechanism.
Further, if the extrusion pin does not return to the pin insertion passage, the first mold and the second mold cannot be opened and closed, and eventually injection molding cannot be performed. On the other hand, if the first mold and the second mold are forcibly fastened in such a situation, the mold device itself may be destroyed.

The present invention is a mold apparatus capable of removing not only resin debris adhering to an extrusion pin or a pin insertion passage through which an extrusion pin is inserted, but also nanoparticles liberated from a molding material and a gasified dispersant. , A method of manufacturing a molded product using this, and an object of the present invention.

Hereinafter, in order to facilitate understanding of the present invention, the drawings will be described with reference to the drawings showing the embodiments of the present invention, but the present invention is not limited thereto.

In order to achieve the above object, the feature of the mold apparatus (1) used for producing a molded product of a thermosetting resin composition containing nanoparticles according to the present invention is.
A mold device (1) in which a cavity (23) is formed inside by combining a first mold (21) and a second mold (22) on a split surface.
A first passage (31) formed in the first mold (21) so as to communicate with the cavity (23), and an extrusion pin (32) movably inserted through the first passage (31). Molding that separates the molded product from the first mold (21) by moving the extrusion pin (32) so that its tip protrudes from the opening (311) on the cavity (23) side in the first passage (31). Product extrusion mechanism (3) and
It is provided with a second passage (41) formed in the first mold (21) so as to communicate with the first passage (31), and has a cleaning mechanism 4 for supplying a cleaning agent to the second passage (41). And
The point is that the extruding pin (32) moving in the first passage (31) is cleaned by allowing the cleaning agent supplied to the second passage (41) to flow into the first passage (31). ..

According to the mold apparatus (1) according to the present invention, a cleaning agent is supplied to the second passage (41), and the first passage (31) of the first mold (21) is supplied via the second passage (41). By pouring the cleaning agent into the resin residue, the resin residue adhering to the extrusion pin (32) by the cleaning agent, as well as dust such as nanoparticles liberated from the resin composition and the gasified dispersant can be washed away.

In the mold device (1) according to the present invention, a continuous portion with the second passage (41) on the inner wall of the first passage (31) and an opening on the cavity (23) side of the first passage (31). A sealing member (421, 422) for preventing leakage of the cleaning agent may be arranged between the two. By adopting such a configuration, it is possible to prevent the cleaning agent from accidentally leaking from the first passage (31), so that the leaked cleaning agent causes a malfunction in the mold apparatus (1). Can be prevented.

In the mold apparatus (1) according to the present invention, dust invades into the first passage (31) on the opening (311) side of the arrangement of the sealing member (421) on the inner wall of the first passage (31). A dustproof member (36) may be arranged to prevent the above. By adopting such a configuration, it is possible to reduce the intrusion of dust and the like from the cavity (23) into the first passage (31).

In the mold apparatus (1) according to the present invention, the cleaning agent supplied to the second passage (41) of the cleaning mechanism (4) may be circulated and supplied to the second passage (41). By adopting such a configuration, the cleaning agent can be reused and waste can be eliminated.

A feature of the method for producing a molded product of a thermosetting resin composition containing nanoparticles using the mold apparatus (1) according to the present invention is.
A mold clamping step of forming a cavity (23) between the first mold (21) and the second mold (22) by combining the first mold (21) with the second mold (22). ,
A molding step of obtaining a molded product by supplying a thermosetting resin composition containing nanoparticles into the cavity (23), and
A mold opening step of moving the first mold (21) relative to the second mold (22) in the mold opening direction,
After the molded product is separated from the first mold (21) by projecting the extrusion pin (32) from the opening (311) on the cavity (23) side in the first passage (31), the extrusion pin (32) is removed. Extrusion process to return to the first passage (31) and
In a state where the extrusion pin (32) is housed in the first passage (31), a cleaning agent is allowed to flow into the first passage (31) through the second passage (41) to clean the extrusion pin (32). The point is that it has a process.

According to the method for producing a molded product according to the present invention, the cleaning agent supplied to the second passage (41) is allowed to flow into the first passage (31), and the resin residue adhered to the extrusion pin (32) by the cleaning agent is also included. , Dust such as nanoparticles liberated from the resin composition and gasified dispersant can be washed away.

In the method for producing a molded product according to the present invention, the cured state of the molded product obtained in the molding step is not particularly limited and may be the main cured state, but a semi-cured state is preferable. Compared with the case of the main cured state, the semi-cured state has an advantage that the molded product can be easily peeled off from the mold without fear of explosion due to gasification of the dispersant coating the nanoparticles. There is expected.

In the method for producing a molded product according to the present invention, after the molded product is obtained in a semi-cured state in the molding step, the molded product in the semi-cured state is extruded from the first mold (21) in the extrusion step and washed after the extrusion step. The process may be performed. As a result, the molded product is extruded from the first mold (21) by the extrusion pin (32) in a semi-cured state to be separated from the first mold (21) and the second mold (22). A semi-cured molded product can be obtained without heating to a temperature higher than the boiling point of the cleaning agent. Therefore, it is possible to perform a cleaning step of cleaning the extrusion pin (32) with a cleaning agent through the molding / extrusion process without complicated temperature adjustment.

In the method for producing a molded product according to the present invention, the cleaning agent supplied to the second passage (41) may be circulated and supplied to the second passage (41) in the cleaning step. By adopting such a configuration, the cleaning agent can be reused and waste can be eliminated.

According to the mold apparatus and the method for manufacturing a molded product according to the present invention, the dust adhering to the extrusion pin can be removed by washing away the dust adhering to the extrusion pin with a cleaning agent, and the movement of the extrusion pin is hindered. It is possible to prevent malfunction due to this and damage to the mold device itself.

It is sectional drawing which shows one state at the time of operation of the mold apparatus which concerns on one Embodiment of this invention. It is sectional drawing which shows one state at the time of operation of the mold apparatus which concerns on one Embodiment of this invention. It is sectional drawing which shows one state at the time of operation of the mold apparatus which concerns on one Embodiment of this invention. It is sectional drawing which shows one state at the time of operation of the mold apparatus which concerns on one Embodiment of this invention. It is an enlarged view which shows the part (W) of FIG. It is a flowchart which shows the process of manufacturing the molded article made from the resin composition using the mold apparatus shown in FIGS. 1 to 4.

Hereinafter, an example of the mold apparatus according to the present invention will be described with reference to FIGS. 1 to 6.

As shown in FIGS. 1 to 4, the mold apparatus 1 according to the present embodiment has an injection molding mechanism 2 for injection molding a molded product of a thermosetting resin composition as a molding material.

The injection molding mechanism 2 has a movable mold (an example of a first mold) 21 and a fixed mold (an example of a second mold) 22, and the movable mold 21 is not shown in the present embodiment. By being driven by the drive device, the position of the mold-tightened state pressed against the fixed mold 22 shown in FIG. 1 and the position of the mold-opened state separated from the fixed mold 22 shown in FIG. 2 are moved in contact with each other. ing.

A cavity 23 filled with a molding material is formed in the inside formed by combining the movable mold 21 and the fixed mold 22 on a split surface so that the fixed mold 22 and the movable mold 21 are in a molded state. The fixed mold 22 is formed with an injection path 24 for injecting a molding material into the cavity 23 from outside the fixed mold 22.

The thermosetting resin composition as a molding material used in the present embodiment contains at least a thermosetting resin and nanoparticles. The nanoparticles that can be used may be magnetic nanoparticles (magnetic nanoparticles) or non-magnetic nanoparticles (non-magnetic nanoparticles). Examples of the magnetic nanoparticles include magnetic particles in which at least a part of the surface is coated with a dispersant. Examples of the magnetic particles include magnetite, γ-iron oxide, manganese ferrite, cobalt ferrite, ferromagnetic oxides such as composite ferrites of zinc and nickel and barium ferrite, and ferromagnetic metals such as iron, cobalt and rare earths. , Metal nitride and the like. Examples of the dispersant include known surfactants and polymer dispersants.
Hereinafter, the case where magnetic nanoparticles are used will be described as an example.

Then, the injection molding mechanism 2 molds the molded product by filling the cavity 23 in the movable mold 21 and the fixed mold 22 with the thermosetting resin composition containing the magnetic nanoparticles via the injection path 24. It has become like.

Further, the mold device 1 according to the present embodiment has a molded product extrusion mechanism 3 that separates the molded product from the movable mold 21.

The molded product extrusion mechanism 3 includes a first passage (pin insertion passage) 31 formed inside the movable mold 21 so as to communicate with the cavity 23, and the extrusion pin 32 is provided in the first passage 31. It is inserted so as to be movable back and forth between the storage position in the first passage 31 and the extrusion position protruding from the first opening 311 (see FIG. 2) on the cavity side in the first passage 31. More specifically, the storage position of the extrusion pin 32 is such that one end surface (tip surface) of the extrusion pin 32 is flush with the first opening 311 of the first passage 31 as shown in FIGS. 1, 2 and 4. As shown in FIG. 3, the extrusion position is a position where one end side of the extrusion pin 32 protrudes from the first opening 311 in the first passage 31.

As described above, when the extrusion pin 32 advances to the extrusion position, one end thereof is projected from the first opening 311 while the other end (rear end) of the extrusion pin 32 is transmitted. It is connected to a pin drive device 33 that drives the extrusion pin 32 via a member 34. Further, a spring 35 that is urged in a direction that separates the transmission member 34 and the movable mold 21 is arranged between the transmission member 34 and the movable mold 21. Then, the transmission member 34 transmits the driving force of the pin driving device 33 and the urging force of the spring 35 to the extrusion pin 32.

Further, as shown in FIG. 5, magnetic nanoparticles and magnetic nanoparticles liberated from the resin composition are placed on the edge of the first opening 311 in the inner wall of the first passage 31 in addition to the resin residue emitted from the resin composition. A dust seal 36 is attached as a dustproof member for preventing dust such as a dispersant to be coated from entering the inside of the first passage 31.

Then, in the molded product extrusion mechanism 3, the extrusion pin 32 advances and moves to the extrusion position shown in FIG. 3 via the transmission member 34 by the drive of the pin drive device 33, and one end portion of the extrusion pin 32 opens at the first opening. It is designed to protrude from part 311. At this time, the pressure generated by driving the pin driving device 33 is applied to the spring 35. Further, when the drive of the pin drive device 33 is turned off, the pressure on the spring 35 is released, and in the molded product extrusion mechanism 3, the extrusion pin 32 is moved through the transmission member 34 by the urging force of the spring 35, as shown in FIG. It is designed to regress to the storage position in the first passage 31 shown.

Further, the mold apparatus 1 according to the present embodiment has a cleaning mechanism 4 for cleaning the inside of the extrusion pin 32 and the first passage 31 with a cleaning agent.

The cleaning mechanism 4 has a second passage 41 (cleaning passage) formed so as to be connected to the first passage 31 in the movable mold 21, and the second passage 41 is outside the movable mold 21. The second passage 41 is provided with a supply port 411 for supplying the cleaning agent to the second passage 41, and a discharge port 412 for discharging the cleaning agent supplied to the second passage 41 to the outside of the movable mold 21.

As the cleaning agent, a solvent capable of washing away magnetic particles is used, and examples thereof include an organic solvent such as water and methyl ethyl ketone, and an alkaline cleaning agent.

A first О ring 421 is attached as a sealing member for preventing leakage of the cleaning agent between the continuous portion of the second passage 41 and the first opening 311 on the inner wall of the first passage 31. The 1О ring may be attached at a position close to the dust seal 36 attached to the inner wall of the first passage 31.

Further, a second O ring 422 is also attached between the continuous portion of the second passage 41 and the second opening 312 on the inner wall of the first passage 31 as a sealing member for preventing the cleaning agent from leaking. ..

In the present embodiment, an О ring is used as the sealing member, but the present invention is not limited to this, and an oil seal or the like may be used, for example. The material of the sealing member is appropriately selected according to the characteristics of the cleaning agent used. For example, when water is used as the cleaning agent, a material having alkali resistance is used, and when an organic solvent such as methyl ethyl ketone is used, a fluorine-based material is used. The material should be used.

Further, the cleaning mechanism 4 in the present embodiment has a filter pump (not shown) that filters the cleaning agent discharged from the discharge port 412 of the second passage 41, and cleans after being filtered by the filter pump. The agent is supplied to the second passage 41.

Then, the cleaning mechanism 4 invades the extrusion pin 32 located in the first passage 31 and the first passage 31 by allowing the cleaning agent supplied to the second passage 41 to flow into the first passage 31. The dust adhering to the inner wall of the first passage 31 can be washed.

Subsequently, based on FIG. 6, a method for producing a molded product of a thermosetting resin composition containing magnetic nanoparticles using the mold device 1 for injection molding in the present embodiment will be described.

First, the movable mold 21 is moved to a position where it is in contact with the fixed mold 22 on the split surface by being driven by the mold drive device, and the movable mold 21 and the fixed mold 22 are combined on the split surface to be in a mold clamping state. As a result, the cavity 23 is formed between the movable mold 21 and the fixed mold 22 (STEP 1).

Subsequently, a thermosetting resin composition containing magnetic nanoparticles is supplied from the injection path 24 of the fixed mold 22 and filled in the cavity 23 to mold a molded product (STEP 2).
The cured state of the molded product obtained here may be the main cured state, but is preferably a semi-cured state. If a part is in the semi-cured state, there is no concern about explosion due to gasification of the dispersant consisting of the surfactant attached to the magnetic nanoparticles, as compared with the case in the main cured state, from the mold. It is expected that the molded product can be easily peeled off.

The semi-cured state is an intermediate state in which, in the reaction of a certain thermosetting resin, the material swells when it comes into contact with a certain liquid and softens when heated, but does not completely melt or melt. It means a stage, for example, a state in which heat generation of 20% or more to less than 60% of the total heat generation amount of curing is completed. The main cured state is the final state of curing of the thermosetting resin, which is insoluble and insoluble, and the completely cured thermosetting resin is in this state. For example, a state in which heat generation of 60% or more to 100% of the total heat generation amount of curing is completed can be said to be a main curing state.

In addition, there is an initial state before the semi-cured state. The initial state is an initial state of the formation reaction of the thermosetting resin, and is a state in which the thermosetting resin is completely dissolved in a solvent and melts when heated. In addition to the case where the calorific value is zero, for example, a heat generation state of less than 20% of the total heat generation amount of curing is also included in the initial state. Total curing calorific value and calorific value are measured using differential scanning calorimetry (DSC). Hereinafter, the molded product obtained by STEP 2 will be described as being in a semi-cured state.

Next, when the thermosetting resin composition filled in the cavity 23 is in a semi-cured state, the movable mold 21 is relatively moved to a position away from the fixed mold 22 by being driven by the mold driving device. The movable mold 21 and the fixed mold 22 are opened in the mold open state (STEP 3). As a result, the fixed mold 22 is separated from the semi-cured molded product molded in the movable mold 21 and the cavity 23, and the semi-cured molded product remains in the movable mold 21.

In this state, while driving the pin driving device 33 and applying pressure to the spring 35 via the transmission member 34, the extrusion pin 32 is extruded into the cavity 23 from the first opening 311 in the first passage 31. The tip surface of the pin 32 comes into contact with the runner of the semi-cured molded product, and the semi-cured molded product is extruded from the movable mold 21. As a result, the semi-cured molded product is separated from the movable mold 21 (STEP 4). In the present embodiment, the extrusion pin 32 comes into contact with the runner of the semi-cured molded product and is extruded, but the present invention is not limited to this, and the extrusion pin 32 is brought into contact with the sprue or the molded product itself. You may.

Here, in the present embodiment, the reasons for separating the molded product from the movable mold 21 in the semi-cured state are as follows.

First, the molding material of the mold apparatus 1 in the present embodiment is a thermocurable resin composition containing magnetic nanoparticles whose surface is coated with a dispersant at least in part, and the movable mold 21 is fixed. This is because when the temperature of the mold 22 is set to a high temperature, the dispersant that coats the surface of the magnetic nanoparticles disappears, the magnetic nanoparticles cause aggregation, and the magnetic properties deteriorate.
Further, it is also possible to heat the resin composition in the cavity 23 to a temperature higher than the injection temperature so that the dispersant does not disappear, and to perform the main curing. In this case, the movable mold 21 and the fixing mold Since it is necessary to cool the mold apparatus 1 after heating the mold 22, workability is lowered and temperature control is difficult.
Further, when the thermosetting resin composition is heated to a temperature at which the thermosetting resin composition is finally cured, a large amount of gas derived from the dispersant that covers the surface of the magnetic nanoparticles is generated depending on the temperature adjustment, and the molded product is formed in the cavity 23 by this gas. In addition, the movable mold 21 and the fixed mold 22 which are molded with a pressure of about 40 tons may be distorted, and the mold device 1 may be damaged.

For this reason, in the present embodiment using a thermosetting resin composition containing magnetic nanoparticles coated with a dispersant as a molding material, the molded product is separated from the movable mold 21 in a semi-cured state. It is good to let it.

After that, in the molded product extrusion mechanism 3, the drive of the pin drive device 33 is turned off and the pressure on the spring 35 is released, so that the extrusion pin 32 is first moved through the transmission member 34 by the urging force of the spring 35. It regresses to the storage position in the passage 31. Here, a part of the dust adhering to the extrusion pin 32 when the extrusion pin 32 is projected into the cavity 23 is arranged in the first opening 311 of the first passage 31 when the extrusion pin 32 moves backward. The dust seal 36 is removed from the surface of the extrusion pin 32, but some dust, magnetic nanoparticles liberated from the semi-cured molded product, and the gasified dispersant remain attached to the surface of the extrusion pin 32. It will return to the storage position of 1 passage 31.

Next, the cleaning agent is supplied from the supply port 411 of the second passage 41. As a result, this cleaning agent flows through the second passage 41 into the first passage 31 in which the extrusion pin 32 is housed, and only the resin residue that adheres to the extrusion pin 32 or further penetrates and adheres to the first passage 31. Instead, the dust such as magnetic nanoparticles and gasified dispersant is washed away (STEP 5). At this time, in the mold apparatus 1 of the present embodiment, the thermosetting resin composition containing the magnetic nanoparticles filled in the cavity 23 is in a semi-cured state without being main-cured in the cavity 23. The temperature of the movable mold 21 and the fixed mold 22 after the extrusion process of STEP 4 is lower than the boiling point of the cleaning agent and can be set to about 20 to 25 ° C. Therefore, the cleaning step of STEP 5 can be performed immediately after the extrusion process of STEP 4, and the dust can be washed away with a cleaning agent before it sticks to the surface of the extrusion pin 32 or the inner wall of the first passage 31. ..

After this, the cleaning agent is discharged from the discharge port 412 of the second passage 41 (STEP 6). At this time, the first O-ring 421 and the second O-ring 422 prevent the cleaning agent from leaking from the first passage 31. Further, the cleaning agent discharged from the discharge port 412 is filtered by the filter pump when the predetermined conditions considered from the viewpoint of the number of times of use, the use time, etc. are satisfied, and then the extrusion pin 32 and the first passage are again used. It is used for cleaning 31 (STEP 7). On the other hand, the cleaning agent that does not meet the predetermined conditions is discarded (STEP 8).

The method for producing a molded product of a thermosetting resin composition containing magnetic nanoparticles according to the present invention is not limited to the above-described embodiment.
For example, the cleaning step does not have to be performed immediately after the molding / extrusion step, and if the extrusion pin 32 is located at the storage position of the first passage 31, the mold clamping step (STEP1) or the molding step (STEP1) It may be done before STEP2).
Further, in the present embodiment, the semi-cured molded product is separated from the movable mold 21, but the thermosetting resin composition containing magnetic nanoparticles is main-cured in the cavity 23 and extruded. After being separated from the movable mold 21 by using the pin 32, the cleaning step may be performed via a step of cooling the mold to a temperature lower than the boiling point of the cleaning agent.

According to the mold apparatus 1 according to the present embodiment, the cleaning agent is supplied from the injection port of the second passage 41 and the cleaning agent is poured into the first passage 31 of the movable mold 21 via the second passage 41. Not only the resin residue adhering to the surface of the extrusion pin 32 but also the dust such as magnetic nanoparticles and the gasified dispersant can be washed away by the cleaning agent, and the dust adhering to the inside of the first passage 31 is also washed away. be able to. As a result, the mold apparatus 1 according to the present embodiment can remove dust from the extrusion pin 32 and the first passage 31.

Further, by attaching the first O-ring 421 between the continuous portion of the inner wall of the first passage 31 with the second passage 41 and the first opening 311 on the cavity 23 side of the first passage 31, the cleaning agent can be removed. It is possible to prevent leakage from the first opening 311 and to provide a second O-ring 422 between the continuous portion with the second passage 41 and the second opening 312 on the inner wall of the first passage 31. By attaching it, it is possible to prevent the cleaning agent from leaking from the second opening 312.

Further, by attaching the dust seal 36 on the side of the first opening 311 rather than the arrangement of the sealing member on the inner wall of the first passage 31, it is possible to reduce the invasion of dust or the like from the cavity 23 into the first passage 31. be able to.

Furthermore, according to the present embodiment, since the molded product is extruded from the movable mold 21 by the extrusion pin 32 in a semi-cured state and separated from the movable mold 21, the temperature at which the movable mold 21 and the fixed mold 22 are higher than the boiling point of the cleaning agent is higher. It can be set so that it is not heated to. As a result, the surface of the extrusion pin 32 and the inside of the first passage 31 are cleaned with a cleaning agent through the molding / extrusion process without complicated temperature adjustment such as cooling the mold device after the molding / detaching process. The process can be performed.

The present invention is not limited to the above-described embodiment, and is appropriately modified or improved based on the ordinary knowledge of those skilled in the art without departing from the spirit of the present invention. Is also included in the scope of the present invention.

1 ... Mold device 2 ... Injection molding mechanism 21 ... Movable mold (first mold)
22 ... Fixed mold (second mold)
23 ... Cavity 24 ... Injection path 3 ... Molded product extrusion mechanism 31 ... First passage (pin insertion passage)
311 ... 1st opening 312 ... 2nd opening 32 ... Extrusion pin 33 ... Pin drive device 34 ... Transmission member 35 ... Spring 36 ... Dust seal (dustproof member)
4 ... Cleaning mechanism 41 ... Second passage (cleaning passage)
411 ... Supply port 412 ... Discharge port 421 ... 1st O-ring (sealing member)
422 ... 2nd O-ring (sealing member)

Claims (7)

A mold device used to manufacture molded products of thermosetting resin compositions containing nanoparticles, in which a cavity is formed inside by combining a first mold and a second mold on a split surface. There,
A first passage formed in the first mold so as to communicate with the cavity, and an extrusion pin movably inserted through the first passage are provided, and the extrusion pin is opened at the tip of the extrusion pin on the cavity side in the first passage. A molded product extrusion mechanism that separates the molded product from the first mold by moving it so that it protrudes from the portion.
It is provided with a second passage formed in the first mold so as to communicate with the first passage, and has a cleaning mechanism for supplying a cleaning agent to the second passage.
A mold device configured to clean an extrusion pin moving in the first passage by allowing a cleaning agent supplied to the second passage to flow into the first passage. A claim characterized in that a sealing member for preventing leakage of a cleaning agent is arranged between a portion of the inner wall of the first passage that is connected to the second passage and an opening on the cavity side of the first passage. Item 1. The mold apparatus according to item 1. The mold apparatus according to claim 2, wherein a dustproof member for preventing dust from entering the first passage is arranged closer to the opening side than the arrangement of the sealing member on the inner wall of the first passage. .. The mold apparatus according to any one of claims 1 to 3, wherein in the cleaning mechanism, the cleaning agent supplied to the second passage is circulated and supplied to the second passage. A method for producing a molded product of a thermosetting resin composition containing nanoparticles by using the mold apparatus according to any one of claims 1 to 4.
A mold clamping step of forming a cavity between the first mold and the second mold by combining the first mold with the second mold,
A molding process for obtaining a molded product by supplying a thermosetting resin composition containing nanoparticles into the cavity.
A mold opening process in which the first mold is moved relative to the second mold in the mold opening direction,
An extrusion step of returning the extrusion pin to the first passage after separating the molded product from the first mold by projecting the extrusion pin from the opening on the cavity side in the first passage.
A method for manufacturing a molded product, which comprises a cleaning step of inflowing a cleaning agent into the first passage through the second passage and cleaning the extrusion pin while the extrusion pin is housed in the first passage. .. The manufacturing method according to claim 5, wherein the molded product is obtained in a semi-cured state in the molding step, the molded product is extruded in the extrusion step, and a cleaning step is performed after the extrusion step. The manufacturing method according to claim 5 or 6, wherein in the cleaning step, the cleaning agent supplied to the second passage is circulated and supplied to the second passage.

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