JPS59153214U - Ejector device for resin molding molds - Google Patents

Ejector device for resin molding molds

Info

Publication number
JPS59153214U
JPS59153214U JP4731983U JP4731983U JPS59153214U JP S59153214 U JPS59153214 U JP S59153214U JP 4731983 U JP4731983 U JP 4731983U JP 4731983 U JP4731983 U JP 4731983U JP S59153214 U JPS59153214 U JP S59153214U
Authority
JP
Japan
Prior art keywords
ejector
ejector device
resin molding
hole
turbine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4731983U
Other languages
Japanese (ja)
Inventor
王島 典久
Original Assignee
トヨタ自動車株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by トヨタ自動車株式会社 filed Critical トヨタ自動車株式会社
Priority to JP4731983U priority Critical patent/JPS59153214U/en
Publication of JPS59153214U publication Critical patent/JPS59153214U/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は成形時の本考案にかかるエジェクタービンの位
置を示す断面図、第2図は成形後脱型時のエジェクター
ビンを作動上昇させた状態を示す断面図、第3図はスク
レーパの斜視図である。 1・・・・・・エジェクタービン、2・・・・・・エジ
ェクター穴、3・・・・・・溝部、4・・・・・・スク
レーパ、5・・・・・・上部角稜部、6・・・・・・下
部角稜部。
Fig. 1 is a cross-sectional view showing the position of the ejector turbine according to the present invention during molding, Fig. 2 is a cross-sectional view showing the ejector turbine in a raised state during demolding after molding, and Fig. 3 is a perspective view of the scraper. It is a diagram. 1... Ejector turbine, 2... Ejector hole, 3... Groove, 4... Scraper, 5... Upper corner ridge, 6...Lower corner ridge.

Claims (1)

【実用新案登録請求の範囲】 熱硬化性樹脂の成形後、入子型に成形されたエジェクタ
ー穴を、エジェクタービンが摺動して成形製品を型から
押し出すエジェクター装置であって、 前記エジェクタービンの上部に環状の溝部を凹設し、該
溝部に、エジェクタービンがエジェクター穴壁面を摺動
する時に、エジェクタービンとエジェクター穴の壁面の
間の間隙に入った樹脂材を削り取り、型外に排出させる
円筒状のスクレーパを、挿嵌したことを特徴としたエジ
ェクター穴のクリーニング機構付きエジェクター装置。
[Claims for Utility Model Registration] An ejector device for extruding a molded product from a mold by sliding an ejector turbine through an ejector hole molded into a nested mold after molding a thermosetting resin, the ejector device comprising: An annular groove is formed in the upper part, and when the ejector turbine slides on the wall of the ejector hole, the resin material that has entered the gap between the ejector turbine and the wall of the ejector hole is scraped off and discharged out of the mold. An ejector device with an ejector hole cleaning mechanism characterized by a cylindrical scraper inserted therein.
JP4731983U 1983-03-30 1983-03-30 Ejector device for resin molding molds Pending JPS59153214U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4731983U JPS59153214U (en) 1983-03-30 1983-03-30 Ejector device for resin molding molds

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4731983U JPS59153214U (en) 1983-03-30 1983-03-30 Ejector device for resin molding molds

Publications (1)

Publication Number Publication Date
JPS59153214U true JPS59153214U (en) 1984-10-15

Family

ID=30177867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4731983U Pending JPS59153214U (en) 1983-03-30 1983-03-30 Ejector device for resin molding molds

Country Status (1)

Country Link
JP (1) JPS59153214U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015228450A (en) * 2014-06-02 2015-12-17 Towa株式会社 Semiconductor compression resin sealing method and semiconductor compression resin sealing device
JP2020157532A (en) * 2019-03-26 2020-10-01 ソマール株式会社 Mold device and method of producing molded product

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015228450A (en) * 2014-06-02 2015-12-17 Towa株式会社 Semiconductor compression resin sealing method and semiconductor compression resin sealing device
JP2020157532A (en) * 2019-03-26 2020-10-01 ソマール株式会社 Mold device and method of producing molded product

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