JP2020150095A - Method for manufacturing glass circuit board - Google Patents

Abstract

To reduce investment and running cost of a polishing facility.SOLUTION: A method for manufacturing a glass circuit board obtained by forming a pattern wiring on a glass surface of a glass substrate 2 includes forming a through hole 3 on the glass substrate, forming a trench wiring pattern for forming a trench wiring part 5 on the surface of the glass substrate with an insulating material, seed plating the glass substrate formed with the through hole and the trench wiring pattern, subjecting the seed plating to through hole plating, filling the through hole subjected to the through hole plating with a resin and embedding a hole, partially removing the hole-embedding resin, subjecting the surface of the glass substrate from which the hole-embedding resin has been partially removed to lid plating, polishing the portion of the lid plating and the through hole plating and a part of the trench wiring pattern formed of the insulating material by machining processing, and forming a pattern wiring formed of a through hole plating part 4 and a trench wiring part 5.SELECTED DRAWING: Figure 1

Description

The present invention relates to a method for manufacturing a glass circuit board obtained by forming pattern wiring on the glass surface of the glass substrate.

A glass circuit board in which pattern wiring is formed on the glass surface of a glass substrate, for example, both front and back surfaces, is known. When manufacturing such a glass circuit board, it is necessary to provide through holes in the glass substrate and to plate the through holes with a metal such as copper in order to make the pattern wiring on both the front and back surfaces conductive. In this case, when the wiring is subsequently formed by SAP or the like, it is necessary to remove the plated metal remaining on the glass surface. It is also necessary to remove the protective film on the pattern wiring. The above treatment on the glass substrate is usually performed by CMP (chemical mechanical polishing) so as not to damage the underlying glass substrate (for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2016-154252

However, the equipment for carrying out CMP is expensive, and the abrasives and the like used in CMP are expensive. Therefore, in the method of manufacturing a glass circuit board in which CMP is carried out, there is a problem that equipment investment and running cost are high. Further, since polishing is performed by CMP, there is also a problem that it takes a long time to manufacture a glass circuit board.

The method for manufacturing a glass circuit board according to the present invention is a method for manufacturing a glass circuit board in which pattern wiring is formed on the glass surface of the glass substrate, and a through hole is formed in the glass substrate to insulate the surface of the glass substrate. A trench wiring pattern for forming a trench wiring part was formed from a material, seed plating was applied to a glass substrate on which a through hole and a trench wiring pattern were formed, through hole plating was applied on the seed plating, and through hole plating was applied. Fill the holes with resin by filling the through holes, partially remove the hole filling resin, apply lid plating to the surface of the glass substrate from which the hole filling resin has been partially removed, and perform trench wiring consisting of the lid plating and through hole plating parts and the insulating material. A part of the pattern is machined to form a pattern wiring consisting of a through-hole plating portion and a trench wiring portion.

According to the embodiment of the present invention, since the through hole and the wiring are formed at the same time, the polishing target is the lid plating portion, the through hole portion and the trench wiring portion made of the insulating material (resin), and the brittle glass surface of the glass substrate. It is not necessary to add polishing to the glass, and it is not necessary to use CMP. Polishing can be performed by machining with a grinder or a cutting tool. Therefore, investment in polishing equipment and running cost can be reduced.

It is sectional drawing which shows an example of the glass wiring board manufactured according to the manufacturing method of the glass wiring board which concerns on this invention. It is sectional drawing which shows one step of the usual manufacturing method of the glass circuit board which is the object of this invention. It is sectional drawing which shows the other process of the usual manufacturing method of the glass circuit board which is the object of this invention. It is sectional drawing which shows the other process of the usual manufacturing method of the glass circuit board which is the object of this invention. It is sectional drawing which shows the other process of the usual manufacturing method of the glass circuit board which is the object of this invention. It is sectional drawing which shows the other process of the usual manufacturing method of the glass circuit board which is the object of this invention. It is sectional drawing which shows the other process of the usual manufacturing method of the glass circuit board which is the object of this invention. It is sectional drawing which shows the other process of the usual manufacturing method of the glass circuit board which is the object of this invention. It is sectional drawing which shows the other process of the usual manufacturing method of the glass circuit board which is the object of this invention. It is sectional drawing which shows the other process of the usual manufacturing method of the glass circuit board which is the object of this invention. It is sectional drawing which shows one step of the manufacturing method of the glass circuit board which concerns on this invention. It is sectional drawing which shows the other process of the manufacturing method of the glass circuit board which concerns on this invention. It is sectional drawing which shows the other process of the manufacturing method of the glass circuit board which concerns on this invention. It is sectional drawing which shows the other process of the manufacturing method of the glass circuit board which concerns on this invention. It is sectional drawing which shows the other process of the manufacturing method of the glass circuit board which concerns on this invention. It is sectional drawing which shows the other process of the manufacturing method of the glass circuit board which concerns on this invention. It is sectional drawing which shows the other process of the manufacturing method of the glass circuit board which concerns on this invention. It is sectional drawing which shows the other process of the manufacturing method of the glass circuit board which concerns on this invention. It is sectional drawing which shows the other process of the manufacturing method of the glass circuit board which concerns on this invention.

<Glass circuit board targeted by the present invention>
FIG. 1 is a cross-sectional view showing an example of a glass wiring board manufactured according to the method for manufacturing a glass wiring board according to the present invention. In FIG. 1, the glass wiring board 1 has two through holes 3 formed in the glass substrate 2, and through hole plating portions 4 and trench wiring portions 5 are provided on both the front and back surfaces of the glass substrate 2. Reference numeral 6 denotes a hole-filling resin portion provided inside the through-hole plating portion 4.

<Normal manufacturing method of glass circuit board targeted by the present invention>
Hereinafter, a normal manufacturing method of the glass circuit board targeted by the present invention will be described with reference to FIGS. 2A to 2I. In the examples shown in FIGS. 2A to 2I, the dimensions such as the number of through holes and the thickness of each layer are schematically shown as an example, and are not matched to the actual number and dimensions. Further, although the reference numerals are given for one through hole, the other through holes are also not marked but have the same configuration.

First, a glass substrate having a desired size is removed from the glass substrate, and a glass substrate 10 as shown in FIG. 2A is prepared. Next, as shown in FIG. 2B, a through hole 11 is formed in the glass substrate 10. Next, as shown in FIG. 2C, the entire surface of the glass substrate 10 on which the through holes 11 are formed is lightly plated to form the seed plating layer 12. Next, as shown in FIG. 2D, copper plating is applied on the seed plating layer 12 to form a through-hole plating layer 13. Next, as shown in FIG. 2E, the space of the through-hole plating layer 13 of the through-hole 11 is filled with resin to form the hole-filling resin layer 14. Next, as shown in FIG. 2F, a part of the hole-filling resin layer 14 is removed so that it is lower than the surface of the through-hole plating layer 13. Next, as shown in FIG. 2G, copper plating is applied to the entire glass substrate 10 from which a part of the hole-filling resin layer 14 has been removed to form a lid plating layer 15.

Then, both the front and back surfaces of the glass substrate 10 on which the lid plating layer 15 is formed are polished by chemical mechanical polishing (GMP), and both surfaces of the glass substrate 10 are polished. By polishing with this CMP, the lid plating layer 15, the through-hole plating layer 13 and the seed plating layer 12 on the surface of the glass substrate 10 are removed, and the surface of the glass substrate 10 is exposed. Then, according to the semi-additive method (SAP), the through-hole plating portion 4 is formed on the through-hole plating layer 13, and the trench wiring portion 5 is formed on the surface of the exposed glass substrate 10.

According to the usual manufacturing method of the glass circuit board targeted by the present invention according to FIGS. 2A to 2I, the glass circuit board having the configuration shown in FIG. 1 can be manufactured. However, since it is necessary to polish the glass substrate 10, it is necessary to use an expensive CMP. Therefore, the investment of polishing equipment and the running cost are high.

<Manufacturing method of glass circuit board according to the present invention>
Hereinafter, a method for manufacturing a glass circuit board according to the present invention will be described with reference to FIGS. 3A to 3I. In the examples shown in FIGS. 3A to 3I, the dimensions such as the number of through holes and the thickness of each layer are schematically shown as an example, and are not matched to the actual number and dimensions. Further, although the reference numerals are given for one through hole, the other through holes are also not marked but have the same configuration.

First, a glass substrate having a desired size is removed from the glass substrate, and a glass substrate 10 as shown in FIG. 3A is prepared. As the material of the glass substrate 10, any commonly used glass substrate material can be used. For example, the glass substrate 10 can be made of borosilicate glass, non-alkali glass, soda-lime glass, aluminosilicate glass, and synthetic quartz glass.

Next, as shown in FIG. 3B, a through hole 11 is formed in the glass substrate 10. As a method of forming the through hole 11 on the glass substrate 10, a conventionally known method such as drilling or laser processing can be used. If necessary, the inner wall of the through hole 11 is subjected to desmear treatment as is conventionally known.

Next, as shown in FIG. 3C, a trench wiring pattern 21 for forming the trench wiring portion 5 with an insulating material is formed on the surface of the glass substrate 10 on which the through holes 11 are formed. As is conventionally known, the trench wiring pattern 21 can be formed by forming an insulating layer made of an insulating material on the surface of the glass substrate 10 and etching the insulating layer with a mask. it can.

Next, as shown in FIG. 3D, the entire surface of the glass substrate 10 on which the through holes 11 and the trench wiring pattern 21 are formed is lightly plated to form the seed plating layer 12. As is conventionally known, the seed plating layer 12 is provided for forming a copper plating layer on the seed plating layer 12, and forms a metal layer such as nickel or chromium by sputtering or electroless plating. Obtainable.

Next, as shown in FIG. 3E, copper plating is performed on the seed plating layer 12 to form the through-hole plating layer 13. As is conventionally known, the through-hole plating layer 13 can be formed by electroplating copper or the like using the seed plating layer 12 as a cathode. At this time, the seed plating layer 12 has a function of stabilizing the adhesion strength between the glass substrate 10 and the through-hole plating layer 13.

Next, as shown in FIG. 3F, the space of the through-hole plating layer 13 of the through-hole 11 is filled with resin to form the hole-filling resin layer 14. The hole-filling resin layer 14 can be formed by screen-printing a resin paste on the through holes 11, as is conventionally known. Alternatively, it can be formed by laminating ABF. At this time, the hole filling resin layer 14 is used to secure a mounting space for the parts.

Next, as shown in FIG. 3G, a part of the hole-filling resin layer 14 is removed so that it is lower than the surface of the through-hole plating layer 13. Partial removal of the hole-filling resin layer 14 can be performed by laser processing or blasting, as is conventionally known.

Next, as shown in FIG. 3H, copper plating is applied to the entire glass substrate 10 from which a part of the hole-filling resin layer 14 has been removed to form a lid plating layer 15. The lid plating layer 15 can be formed by electrolytic plating such as copper, as is conventionally known.

After that, as shown in FIG. 3I, a part of the trench wiring pattern 21 made of the lid plating layer 15 and the through hole plating layer 13 and the insulating material is machined, and the through hole plating part 4 and the trench wiring part 5 are polished. A pattern wiring consisting of is formed. Here, the machining can be performed by a grinder or a cutting tool.

For machining using a cutting tool, for example, flattening can be performed using a surface planner of DAS8930 manufactured by DISCO Corporation. As an example of the cutting conditions at this time, the rotation speed: 100 to 5000 rpm and the feed rate of the stage: 0.5 to 5 mm / sec are preferable.

According to the embodiment of the present invention shown in FIGS. 3A to 3I, the object to be polished is a lid plating portion, a through-hole portion, and a trench wiring portion made of an insulating material (resin), and it is necessary to polish the portion of the glass substrate. Absent. Therefore, it is not necessary to use CMP, and polishing can be performed by machining with a grinder or a cutting tool as in the damascene process, and investment in polishing equipment and running cost can be reduced.

1 Glass wiring board 2, 10 Glass substrate 3, 11 Through hole 4 Through hole plating part 5 Trench wiring part 6 Hole filling resin part 12 Seed plating layer 13 Through hole plating layer 14 Hole filling resin layer 15 Lid plating layer 21 Trench wiring pattern

Claims (2)

A method for manufacturing a glass circuit board in which pattern wiring is formed on the glass surface of the glass substrate.
Through holes are formed on the glass substrate,
A trench wiring pattern for forming a trench wiring part with an insulating material is formed on the surface of the glass substrate.
Seed plating is applied to the glass substrate on which the through-hole and trench wiring patterns are formed.
Through-hole plating is applied on the seed plating,
Through-holes The plated through-holes are filled with resin to fill the holes.
Partially remove the fill-in-the-blank resin
The surface of the glass substrate from which the hole-filling resin has been partially removed is plated with a lid.
A part of the trench wiring pattern made of the lid plating and the through hole plating part and the insulating material is polished by machining to form the pattern wiring consisting of the through hole plating part and the trench wiring part. The method for manufacturing a glass circuit board according to claim 1.
The machining is machining with a grinder or a cutting tool.

Images