JP2020134649A5 - Forming method, pattern forming system, and manufacturing method of articles - Google Patents
Forming method, pattern forming system, and manufacturing method of articles Download PDFInfo
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- JP2020134649A5 JP2020134649A5 JP2019026671A JP2019026671A JP2020134649A5 JP 2020134649 A5 JP2020134649 A5 JP 2020134649A5 JP 2019026671 A JP2019026671 A JP 2019026671A JP 2019026671 A JP2019026671 A JP 2019026671A JP 2020134649 A5 JP2020134649 A5 JP 2020134649A5
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- forming
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- measurement
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- 238000000034 method Methods 0.000 title claims 17
- 238000004519 manufacturing process Methods 0.000 title claims 3
- 238000005259 measurement Methods 0.000 claims 28
- 239000000758 substrate Substances 0.000 claims 14
- 230000015572 biosynthetic process Effects 0.000 claims 6
- 230000007261 regionalization Effects 0.000 claims 1
Claims (12)
前記第1装置で基板上にマークを形成するマーク形成工程と、
前記第1装置で基板上に第1パターンを形成する第1形成工程と、
前記第2装置で基板上に第2パターンを形成する第2形成工程と、
を含む処理を基板ごとに行い、
前記処理のモードとして、前記第1装置で前記マークの位置を計測する計測工程を行い、当該計測工程の計測結果に基づいて前記第2パターンの形成を制御する第1モードと、前記計測工程を省略し、前回の計測工程の計測結果に基づいて前記第2パターンの形成を制御する第2モードとを含む、ことを特徴とする形成方法。 It is a forming method for forming a pattern on one layer on a substrate by using a first device and a second device.
The mark forming step of forming a mark on the substrate by the first apparatus,
The first forming step of forming the first pattern on the substrate by the first apparatus,
The second forming step of forming the second pattern on the substrate by the second apparatus, and
Perform processing including
As the mode of the processing, the first mode in which the measurement step of measuring the position of the mark by the first apparatus is performed and the formation of the second pattern is controlled based on the measurement result of the measurement step, and the measurement step are performed. A forming method, which is omitted and includes a second mode for controlling the formation of the second pattern based on the measurement result of the previous measurement step.
前記第2モードでの前記計測工程の計測結果の変動が許容範囲に収まっていない場合、前記処理のモードを第2モードから前記第1モードに移行する、ことを特徴とする請求項1乃至3のいずれか1項に記載の形成方法。 In the second mode, the measurement step is included in the processing for each of a plurality of substrates.
Claims 1 to 3 are characterized in that, when the fluctuation of the measurement result of the measurement step in the second mode is not within the permissible range, the mode of the process is changed from the second mode to the first mode. The forming method according to any one of the above.
前記第2計測工程では、前記第2計測工程の計測結果に更に基づいて前記第2パターンの形成を制御する、ことを特徴とする請求項1乃至4のいずれか1項に記載の形成方法。 The process further includes a second measurement step of measuring the position of the mark with the second device.
The formation method according to any one of claims 1 to 4, wherein in the second measurement step, the formation of the second pattern is controlled based on the measurement result of the second measurement step.
前記複数の形成部の相対位置の変動が許容範囲に収まっている場合、前記処理のモードを前記第1モードから前記第2モードに移行する、ことを特徴とする請求項1乃至8のいずれか1項に記載の形成方法。 In the mark forming step, a mark is formed on the substrate by a plurality of forming portions in the first apparatus.
One of claims 1 to 8, wherein when the variation in the relative positions of the plurality of forming portions is within the permissible range, the mode of the processing is shifted from the first mode to the second mode. The forming method according to item 1.
前記形成工程でパターンが形成された前記基板を加工する加工工程と、を含み、
前記加工工程で加工された前記基板から物品を製造することを特徴とする物品の製造方法。 A forming step of forming a pattern on a substrate by using the forming method according to any one of claims 1 to 10.
Including a processing step of processing the substrate on which a pattern is formed in the forming step.
A method for manufacturing an article, which comprises manufacturing an article from the substrate processed in the processing step.
前記第1装置は、The first device is
基板上にマークを形成する形成部と、A forming part that forms a mark on the substrate,
前記形成部により基板上に形成された前記マークの位置を計測する計測部と、を含み、Includes a measuring unit that measures the position of the mark formed on the substrate by the forming unit.
前記第2装置は、前記形成部によって形成された前記マークの位置の計測結果に基づいて前記第2パターンの形成を行うことが可能であり、The second device can form the second pattern based on the measurement result of the position of the mark formed by the forming portion.
前記第1装置の前記計測部により前記マークの位置を計測することで得られる当該マークの位置の計測結果に基づいて、前記第2装置において前記第2パターンを形成する第1モードと、前記第1装置の前記計測部による前記マークの位置の計測を省略し、以前のマークの位置の計測結果に基づいて、前記第2装置において前記第2パターンを形成する第2モードとを含む複数のモードから選択されたモードでパターン形成を行う、ことを特徴とするパターン形成システム。Based on the measurement result of the position of the mark obtained by measuring the position of the mark by the measuring unit of the first device, the first mode of forming the second pattern in the second device and the first mode. A plurality of modes including a second mode in which the measurement of the mark position by the measurement unit of one device is omitted and the second pattern is formed in the second device based on the measurement result of the previous mark position. A pattern forming system characterized in that pattern formation is performed in a mode selected from.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019026671A JP7336201B2 (en) | 2019-02-18 | 2019-02-18 | Forming methods, patterning systems, and methods of manufacturing articles |
KR1020217028623A KR102661409B1 (en) | 2019-02-18 | 2020-01-09 | Forming method, forming apparatus, and manufacturing method of article |
CN202080014196.3A CN113439238A (en) | 2019-02-18 | 2020-01-09 | Forming method, forming apparatus, and method of manufacturing article |
PCT/JP2020/000398 WO2020170631A1 (en) | 2019-02-18 | 2020-01-09 | Formation method, formation apparatus, and method of manufacturing product |
TW109101923A TWI791940B (en) | 2019-02-18 | 2020-01-20 | Forming method, forming device and manufacturing method of article |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019026671A JP7336201B2 (en) | 2019-02-18 | 2019-02-18 | Forming methods, patterning systems, and methods of manufacturing articles |
Publications (3)
Publication Number | Publication Date |
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JP2020134649A JP2020134649A (en) | 2020-08-31 |
JP2020134649A5 true JP2020134649A5 (en) | 2022-02-18 |
JP7336201B2 JP7336201B2 (en) | 2023-08-31 |
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JP2019026671A Active JP7336201B2 (en) | 2019-02-18 | 2019-02-18 | Forming methods, patterning systems, and methods of manufacturing articles |
Country Status (5)
Country | Link |
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JP (1) | JP7336201B2 (en) |
KR (1) | KR102661409B1 (en) |
CN (1) | CN113439238A (en) |
TW (1) | TWI791940B (en) |
WO (1) | WO2020170631A1 (en) |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1064782A (en) * | 1996-08-14 | 1998-03-06 | Nikon Corp | Scanning aligner |
JP2000284492A (en) | 1999-03-30 | 2000-10-13 | Seiko Epson Corp | Device and method for exposure and storage medium recording program |
JP4353498B2 (en) | 2002-04-30 | 2009-10-28 | キヤノン株式会社 | Management apparatus and method, device manufacturing method, and computer program |
JP2004172471A (en) * | 2002-11-21 | 2004-06-17 | Nikon Corp | Exposure method and apparatus |
JP4694102B2 (en) | 2003-03-27 | 2011-06-08 | 大日本印刷株式会社 | Exposure method |
JP2005092137A (en) | 2003-09-19 | 2005-04-07 | Nikon Corp | Aligner and exposure method |
KR20080087787A (en) * | 2005-12-28 | 2008-10-01 | 가부시키가이샤 니콘 | Exposure system, device manufacturing system, exposure method and device manufacturing method |
JP2011009309A (en) | 2009-06-23 | 2011-01-13 | Canon Inc | Exposure system, control apparatus of exposure apparatus, and method of manufacturing device |
TWI502623B (en) * | 2010-01-07 | 2015-10-01 | Hoya Corp | Method of manufacturing a photomask, photomask, and method of manufacturing a display device |
JP5762072B2 (en) * | 2011-03-24 | 2015-08-12 | 株式会社Screenホールディングス | Position detection method, pattern drawing method, pattern drawing apparatus, and computer program |
US10095131B2 (en) * | 2014-06-12 | 2018-10-09 | Asml Netherlands B.V. | Alignment modeling and a lithographic apparatus and exposure method using the same |
-
2019
- 2019-02-18 JP JP2019026671A patent/JP7336201B2/en active Active
-
2020
- 2020-01-09 KR KR1020217028623A patent/KR102661409B1/en active IP Right Grant
- 2020-01-09 WO PCT/JP2020/000398 patent/WO2020170631A1/en active Application Filing
- 2020-01-09 CN CN202080014196.3A patent/CN113439238A/en active Pending
- 2020-01-20 TW TW109101923A patent/TWI791940B/en active
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