JP2020134649A5 - Forming method, pattern forming system, and manufacturing method of articles - Google Patents

Forming method, pattern forming system, and manufacturing method of articles Download PDF

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JP2020134649A5
JP2020134649A5 JP2019026671A JP2019026671A JP2020134649A5 JP 2020134649 A5 JP2020134649 A5 JP 2020134649A5 JP 2019026671 A JP2019026671 A JP 2019026671A JP 2019026671 A JP2019026671 A JP 2019026671A JP 2020134649 A5 JP2020134649 A5 JP 2020134649A5
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forming
pattern
mode
mark
measurement
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JP2020134649A (en
JP7336201B2 (en
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Priority to JP2019026671A priority Critical patent/JP7336201B2/en
Priority to KR1020217028623A priority patent/KR102661409B1/en
Priority to CN202080014196.3A priority patent/CN113439238A/en
Priority to PCT/JP2020/000398 priority patent/WO2020170631A1/en
Priority to TW109101923A priority patent/TWI791940B/en
Publication of JP2020134649A publication Critical patent/JP2020134649A/en
Publication of JP2020134649A5 publication Critical patent/JP2020134649A5/en
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Claims (12)

第1装置と第2装置とを用いて基板上の1つの層にパターンを形成する形成方法であって、
前記第1装置で基板上にマークを形成するマーク形成工程と、
前記第1装置で基板上に第1パターンを形成する第1形成工程と、
前記第2装置で基板上に第2パターンを形成する第2形成工程と、
を含む処理を基板ごとに行い、
前記処理のモードとして、前記第1装置で前記マークの位置を計測する計測工程を行い、当該計測工程の計測結果に基づいて前記第2パターンの形成を制御する第1モードと、前記計測工程を省略し、前回の計測工程の計測結果に基づいて前記第2パターンの形成を制御する第2モードとを含む、ことを特徴とする形成方法。
It is a forming method for forming a pattern on one layer on a substrate by using a first device and a second device.
The mark forming step of forming a mark on the substrate by the first apparatus,
The first forming step of forming the first pattern on the substrate by the first apparatus,
The second forming step of forming the second pattern on the substrate by the second apparatus, and
Perform processing including
As the mode of the processing, the first mode in which the measurement step of measuring the position of the mark by the first apparatus is performed and the formation of the second pattern is controlled based on the measurement result of the measurement step, and the measurement step are performed. A forming method, which is omitted and includes a second mode for controlling the formation of the second pattern based on the measurement result of the previous measurement step.
前記第1モードでの複数回の前記処理における前記計測工程の計測結果の変動が許容範囲に収まっている場合、前記処理のモードを前記第1モードから前記第2モードに移行する、ことを特徴とする請求項1に記載の形成方法。 When the fluctuation of the measurement result of the measurement step in the plurality of times of the first mode is within the permissible range, the mode of the process is changed from the first mode to the second mode. The forming method according to claim 1. 前記計測工程の計測結果の変動を、前記第1モードでの複数回の前記処理における前記計測工程の計測結果の差に基づいて求める、ことを特徴とする請求項2に記載の形成方法。 The forming method according to claim 2, wherein the variation in the measurement result of the measurement step is obtained based on the difference in the measurement result of the measurement step in the plurality of times of the processing in the first mode. 前記第2モードでは、複数枚の基板ごとの前記処理に前記計測工程が含まれ、
前記第2モードでの前記計測工程の計測結果の変動が許容範囲に収まっていない場合、前記処理のモードを第2モードから前記第1モードに移行する、ことを特徴とする請求項1乃至3のいずれか1項に記載の形成方法。
In the second mode, the measurement step is included in the processing for each of a plurality of substrates.
Claims 1 to 3 are characterized in that, when the fluctuation of the measurement result of the measurement step in the second mode is not within the permissible range, the mode of the process is changed from the second mode to the first mode. The forming method according to any one of the above.
前記処理は、前記第2装置で前記マークの位置を計測する第2計測工程を更に含み、
前記第2計測工程では、前記第2計測工程の計測結果に更に基づいて前記第2パターンの形成を制御する、ことを特徴とする請求項1乃至4のいずれか1項に記載の形成方法。
The process further includes a second measurement step of measuring the position of the mark with the second device.
The formation method according to any one of claims 1 to 4, wherein in the second measurement step, the formation of the second pattern is controlled based on the measurement result of the second measurement step.
前記第2計測工程では、前記計測工程で計測された前記マークの位置情報と前記第2計測工程で計測された前記マークの位置情報との差に基づいて、前記第2パターンの形成を制御する、ことを特徴とする請求項5に記載の形成方法。 In the second measurement step, the formation of the second pattern is controlled based on the difference between the position information of the mark measured in the measurement step and the position information of the mark measured in the second measurement step. , The forming method according to claim 5. 前記第2計測工程では、前記差に基づいて前記第1装置と前記第2装置とにおける基板の倍率差を補正する補正値を決定し、前記第2パターンを形成すべき目標位置を示す情報を前記補正値で補正した結果に基づいて、基板上に前記第2パターンを形成する、ことを特徴とする請求項6に記載の形成方法。 In the second measurement step, a correction value for correcting the magnification difference between the first apparatus and the second apparatus is determined based on the difference, and information indicating a target position where the second pattern should be formed is obtained. The forming method according to claim 6, wherein the second pattern is formed on a substrate based on the result corrected by the correction value. 前記第1パターンと前記第2パターンとは、同じ形状を有し、基板上に形成される向きが互いに異なる、ことを特徴とする請求項1乃至7のいずれか1項に記載の形成方法。 The forming method according to any one of claims 1 to 7, wherein the first pattern and the second pattern have the same shape and are formed on a substrate in different directions. 前記マーク形成工程では、前記第1装置における複数の形成部により基板上にマークが形成され、
前記複数の形成部の相対位置の変動が許容範囲に収まっている場合、前記処理のモードを前記第1モードから前記第2モードに移行する、ことを特徴とする請求項1乃至8のいずれか1項に記載の形成方法。
In the mark forming step, a mark is formed on the substrate by a plurality of forming portions in the first apparatus.
One of claims 1 to 8, wherein when the variation in the relative positions of the plurality of forming portions is within the permissible range, the mode of the processing is shifted from the first mode to the second mode. The forming method according to item 1.
前記複数の形成部の相対位置の変動が許容範囲に収まっていない場合、前記処理のモードを前記第2モードから前記第1モードに移行する、ことを特徴とする請求項9に記載の形成方法。 The forming method according to claim 9, wherein when the fluctuation of the relative positions of the plurality of forming portions is not within the permissible range, the mode of the processing is changed from the second mode to the first mode. .. 請求項1乃至10のいずれか1項に記載の形成方法を用いて基板上にパターンを形成する形成工程と、
前記形成工程でパターンが形成された前記基板を加工する加工工程と、を含み、
前記加工工程で加工された前記基板から物品を製造することを特徴とする物品の製造方法。
A forming step of forming a pattern on a substrate by using the forming method according to any one of claims 1 to 10.
Including a processing step of processing the substrate on which a pattern is formed in the forming step.
A method for manufacturing an article, which comprises manufacturing an article from the substrate processed in the processing step.
基板上に第1パターンを形成する第1装置と、前記第1パターンを形成する層における前記第1パターンが形成された領域とは異なる領域に第2パターンを形成する第2装置とを含むパターン形成システムであって、A pattern including a first device for forming the first pattern on the substrate and a second device for forming the second pattern in a region different from the region where the first pattern is formed in the layer forming the first pattern. It ’s a formation system,
前記第1装置は、The first device is
基板上にマークを形成する形成部と、A forming part that forms a mark on the substrate,
前記形成部により基板上に形成された前記マークの位置を計測する計測部と、を含み、Includes a measuring unit that measures the position of the mark formed on the substrate by the forming unit.
前記第2装置は、前記形成部によって形成された前記マークの位置の計測結果に基づいて前記第2パターンの形成を行うことが可能であり、The second device can form the second pattern based on the measurement result of the position of the mark formed by the forming portion.
前記第1装置の前記計測部により前記マークの位置を計測することで得られる当該マークの位置の計測結果に基づいて、前記第2装置において前記第2パターンを形成する第1モードと、前記第1装置の前記計測部による前記マークの位置の計測を省略し、以前のマークの位置の計測結果に基づいて、前記第2装置において前記第2パターンを形成する第2モードとを含む複数のモードから選択されたモードでパターン形成を行う、ことを特徴とするパターン形成システム。Based on the measurement result of the position of the mark obtained by measuring the position of the mark by the measuring unit of the first device, the first mode of forming the second pattern in the second device and the first mode. A plurality of modes including a second mode in which the measurement of the mark position by the measurement unit of one device is omitted and the second pattern is formed in the second device based on the measurement result of the previous mark position. A pattern forming system characterized in that pattern formation is performed in a mode selected from.
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JP2019026671A JP7336201B2 (en) 2019-02-18 2019-02-18 Forming methods, patterning systems, and methods of manufacturing articles
KR1020217028623A KR102661409B1 (en) 2019-02-18 2020-01-09 Forming method, forming apparatus, and manufacturing method of article
CN202080014196.3A CN113439238A (en) 2019-02-18 2020-01-09 Forming method, forming apparatus, and method of manufacturing article
PCT/JP2020/000398 WO2020170631A1 (en) 2019-02-18 2020-01-09 Formation method, formation apparatus, and method of manufacturing product
TW109101923A TWI791940B (en) 2019-02-18 2020-01-20 Forming method, forming device and manufacturing method of article

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