JP2020129571A - Electrical element, actuator, and communication device - Google Patents

Abstract

To provide an electrical element that can prevent a change in sensitivity of a hall element even when a base material is thin.SOLUTION: In an electrical element 1, a coil 2 and a hall element 3 are connected to one base material 4. The base material 4 is made of a flexible resin material, and has a thin first region R1 and a thick second region R2. The coil 2 is connected to the first region R1, and the hall element 3 is connected to the second region R2.SELECTED DRAWING: Figure 1

Description

The present invention relates to an electric element, an actuator, and a communication device.

Conventionally, there has been proposed an actuator configured by using an electromagnet in which a coil having a conductor pattern is formed in a plurality of layers.

For example, in Patent Document 1, a coil having a conductor pattern is provided on four sides of a printed coil board which is a rectangular frame-shaped insulating base material, and a plurality of such printed coil boards are prepared and laminated to form a laminated coil. Form. In Patent Document 1, the laminated coil is arranged to face the lower surface of the movably arranged permanent magnet to form an actuator.

JP, 2016-191849, A

However, the electric element of Patent Document 1 is not suitable for use in, for example, a portable device that tends to be thinned because the base material for arranging the Hall element is laminated to be thick. On the other hand, when the base material is thinned for use in mobile devices, etc., the deformation of the base material places stress on the Hall element package, resulting in a change in the sensitivity of the Hall element. It was

An object of the present invention is to provide an electric element capable of suppressing a change in sensitivity of the Hall element even when the base material is thin.

A first aspect of the present invention is an electric element in which a coil and a Hall element are connected to a single base material, wherein the base material is made of a flexible resin base material and has a small thickness. It has one region and a thick second region, the coil is connected in the first region, and the Hall element is connected to the second region.

According to the present invention, even if the base material is made thin, it is possible to suppress the change in the sensitivity of the Hall element.

(A) is a side sectional view schematically showing the structure of the electric element according to the first embodiment of the present invention, and (B) is a plan view schematically showing the coil of (A). (A), (B) is a figure for explaining a manufacturing method of coil 2. FIG. 5 is a diagram for explaining the manufacturing method for the electric element according to the first embodiment. It is a side surface sectional view which shows typically the structure of the electric element in the 2nd Embodiment of this invention. (A) is a side sectional view schematically showing the structure of an electric element according to the third embodiment of the present invention, and (B) is a plan view schematically showing the electric element according to the third embodiment of the present invention. Is. It is a top view which shows typically the insulating base material in each layer which comprises the coil in the 4th Embodiment of this invention. (A) is a plan view schematically showing an electric element according to a fourth embodiment, and (B) is a side sectional view schematically showing an electric element according to a fourth embodiment. It is a side surface sectional view showing the actuator of the example of application of the present invention typically. It is a side sectional view showing typically the communication apparatus of the example of application of the present invention.

Hereinafter, various embodiments for carrying out the present invention will be described with reference to the drawings. Corresponding members having the same function are designated by the same reference numerals throughout the drawings. The embodiments are shown separately for the sake of convenience of explanation and understanding of the main points, but partial replacement or combination of the configurations shown in the different embodiments is possible. In the second and subsequent embodiments, description of matters common to the first embodiment will be omitted, and only different points will be described. In particular, similar operational effects due to the similar configuration will not be sequentially described for each embodiment.
In all the drawings, the thickness direction of the insulating base material, that is, the stacking direction is shown as the Z-axis direction, and in the plane orthogonal to the Z-axis, the longitudinal direction corresponding to the moving direction of the permanent magnet is the X-axis direction, and the width orthogonal to it. The direction is shown as the Y-axis direction.

<First Embodiment>
FIG. 1(A) is a side sectional view schematically showing the structure of an electric element 1 according to the first embodiment of the present invention, and FIG. 1(B) schematically shows the coil 2 of FIG. 1(A). It is a top view shown. The coil 2 in FIG. 1A shows a cross section taken along the line AA′ in FIG.

The electric element 1 of this embodiment includes a coil 2, a Hall element 3, and a base material 4. The electric element 1 is used, for example, in an actuator, an RFID (Radio Frequency Identifier) reader, or the like.

The coil 2 is formed of conductor patterns 20 and 21 and insulating base materials 2a, 2b and 2c (see FIG. 2A). 2A and 2B are views for explaining the method for manufacturing the coil 2. First, as shown in FIG. 2(A), three insulating base materials 2a, 2b, 2c each having a copper foil stretched over one surface are prepared. As the insulating base materials 2a, 2b, 2c, for example, a thermoplastic resin such as a liquid crystal polymer (LCP: Liquid Crystal Polymer) can be used. Next, the conductor patterns 20 and 21 and the electrode 22 are formed by a patterning process such as photolithography. The conductor patterns 20 and 21 are formed on the lower surfaces of the insulating base materials 2a and 2b when viewed from the Z-axis direction, and the electrodes 22 are formed on the lower surface of the insulating base material 2c when viewed from the Z-axis direction. Next, laser processing or the like is performed from the upper surface side of the insulating base materials 2a and 2b of the conductor patterns 20 and 21 on which the copper foil is not stretched, and from the upper surface side of the insulating base material 2c of the electrode 22 on which the copper foil is not stretched. Thus, a via hole penetrating the insulating base materials 2a, 2b, 2c is formed. This via hole is filled with a conductive paste containing a conductive material such as Sn—Cu alloy.

Next, the conductive patterns 20 and 21 and the electrode 22 are formed, and the insulating base materials 2a, 2b, and 2c in which the via holes are filled with the conductive paste are stacked and integrated by a heat press or the like. At this time, the conductive paste filled in the via holes is also heated and hardened to form interlayer connection conductors 6a, 6b, 6c, 6d for electrically connecting the conductor patterns of the insulating base materials. The inter-layer connection conductors 6a, 6b, 6c, 6d electrically connect the conductor patterns 20, 21 and the electrode 22. As described above, the coil 2 as shown in FIG. 2B is formed.

As shown in FIG. 2A, the conductor patterns 20 and 21 are wound two turns on the lower surfaces of the insulating base materials 2a and 2b to form a rectangular coil. The end portion 20a of the conductor pattern 20 is connected to the electrode 22 via the interlayer connecting conductors 6b and 6c. Further, the end portion 21a of the conductor pattern 21 is connected to the electrode 22 via the interlayer connecting conductor 6d. The electrode 22 is connected to a current supply source via an electrode 41 of the base material 4 described later.

The Hall element 3 detects the magnetic field and outputs an analog signal proportional to its magnitude. It is used to detect the position of a member or the like arranged facing the electric element 1. The Hall element 3 may be packaged with resin, or may be potted with silicone resin, epoxy resin, or the like. Alternatively, the hall element 3 may be covered with a cover made of zirconia or the like. In the present embodiment, as an example, the Hall element packaged with resin is used. As shown in FIG. 1A, an electrode 30 for taking out an analog signal output from the Hall element 3 is provided on the lower surface of the Hall element 3 when viewed from the Z-axis direction.

The base material 4 is made of the same resin material as the insulating materials 2a, 2b, 2c forming the coil 2. For example, the base material 4 can be formed by using a thermoplastic resin such as a liquid crystal polymer (LCP: Liquid Crystal Polymer). As shown in FIG. 1A, the base substrate 4 of the present embodiment has a first region R1 having a thin thickness in the Z-axis direction and a second region R2 having a large thickness. The thick second region R2 is formed, for example, by laminating liquid crystal polymers in a portion corresponding to the thick second region R2 and integrating them by heating press or the like. Further, in the present embodiment, an electrode 41 corresponding to the electrode 22 of the coil 2 and an electrode 42 corresponding to the electrode 30 of the Hall element 3 are formed on the upper surface of the base substrate 4 when viewed from the Z-axis direction. .. The electrodes 41 and 42 are formed of copper foil, for example.

The base material 4 of this embodiment can be formed by the following manufacturing method. First, two resin base materials each having a copper foil overlaid on one side are prepared. Next, the electrode 41, the electrode 42, and a wiring pattern (not shown) are formed by a patterning process such as photolithography. Next, the resin base material on which the electrode 41 and the wiring pattern are formed and the resin base material on which the electrode 42 and the wiring pattern are formed are laminated at a position corresponding to the thick second region R2 and integrated by a heat press or the like. Turn into The base material 4 is formed as described above.

In the present embodiment, the thickness of the first region R1 of the base substrate 4 is set to 80 μm, and the thickness of the thick second region R2 is set to 130 μm. However, these thicknesses are examples, and can be appropriately changed depending on the application of the electric element 1 and the like.

FIG. 3 is a diagram for explaining a method of manufacturing the electric element 1 of this embodiment. As shown in FIG. 3, first, the base material 4 manufactured as described above, the coil 2 manufactured as described above, and the Hall element 3 are prepared. Next, the electrode 22 of the coil 2 and the electrode 41 of the base material 4 are soldered using the solder 7 (see FIG. 1A), and the electrode 30 of the Hall element 3 and the electrode 42 of the base material 4 are soldered. And are soldered using the solder 7 (see FIG. 1A).

As described above, the electric element 1 in which the coil 2 is connected to the thin first region R1 of the base substrate 4 and the hall element 3 is connected to the thick second region R2 of the base substrate 4 is manufactured. The electric element 1 manufactured in this manner generates a magnetic field in a direction from the upper surface to the lower surface of the coil 2 or from the lower surface to the upper surface by supplying a current to the conductor patterns 20 and 21 of the coil 2. This magnetic field can be used as an actuator or a communication device. Further, by using the coil 2 as an antenna, it can be used as a communication device.

In the present embodiment, the electric element 1 can be thinned because the base material 4 is formed of a flexible resin material, and the base material 4 can be deformed to various types. It can be easily attached to the device. Further, in the electric element 1, since the region to which the hall element 3 is connected is the thick second region R2 of the base material 4, the connection part of the hall element 3 is less likely to be deformed and the base material 4 It is possible to prevent the stress generated by the deformation from being transmitted to the Hall element 3, and it is possible to prevent the sensitivity of the Hall element 3 from changing.

Further, in the present embodiment, since the base material 4 is formed of the same flexible resin material as the insulating material forming the coil 2, after the coil 2 is mounted on the base material 4, the Distortion due to contraction or the like can be made difficult to occur, and stress caused by the distortion can be made difficult to be transmitted to the Hall element 3. As a result, it is possible to prevent the sensitivity of the Hall element 3 from changing.

Further, in the present embodiment, the Hall element 3 is connected to the thick second region R2 of the base material 4 to form a coil in the height direction (Z-axis direction) as shown in FIG. At least a part of the Hall element 3 can be arranged so as to overlap the region B, and the sensitivity of the Hall element 3 can be increased.

As described above, according to the present embodiment, since the coil 2 is connected to the thin first region R1 of the base substrate 4 and the Hall element 3 is connected to the thick second region R2 of the base substrate 4, the electric element is formed. It is possible to prevent the stress generated by the deformation of the base material 4 from being transmitted to the Hall element 3 and to prevent the sensitivity of the Hall element 3 from changing while realizing the thinning of the Hall element 3.

<Modification>
In the present embodiment, as an example, the thin first region R1 of the base substrate 4 is used as one layer of resin base material, and the thick second region R2 of the base substrate 4 is used as two layers of resin base material. However, the present invention is not limited to such an aspect, and the number of layers stacked in each region can be appropriately changed.

In the present embodiment, as an example, the mode in which the coil 2 is configured by the three layers of the insulating base materials 2a, 2b, 2c has been described, but the present invention is not limited to this mode, and the coil 2 is laminated. The number can be changed appropriately.

In the present embodiment, as an example, a mode in which the rectangular pattern coil is formed by the conductor patterns 20 and 21 has been described, but the present invention is not limited to such a mode, and the coil shape is circular. Alternatively, it may be oval or the like.

Further, in the present embodiment, as an example, the mode in which the number of turns of the conductor patterns 20 and 21 is set to 2 has been described, but the present invention is not limited to such a mode, and the number of turns can be appropriately changed. Is. The number of turns of the conductor patterns 20 and 21 may be plural, and the numbers of turns may be different. In this case, the number of turns of the conductor pattern 20 on the upper surface side of the coil 2 is preferably larger than the number of turns of the conductor pattern 21.

In the present embodiment, as an example, the mode in which the conductor patterns 20 and 21 have the same line width has been described, but the present invention is not limited to such a mode, and the line width of the conductor pattern 20 and the conductor pattern The line width of 21 may be different.

<Second Embodiment>
Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 4 is a side sectional view schematically showing the structure of the electric element 1A in the present embodiment.

The electric element 1A of the present embodiment differs from that of the first embodiment in that the base material 4 is bent in the thin first region R1-2. As shown in FIG. 4, in the electric element 1A of the present embodiment, the thin first region in the base material 4 is located at two locations, the first region R1-1 and the first region R1-2, and the thick second region. The regions are provided at two locations, the second region R2-1 and the second region R2-2. The thin first region R1-1 to which the coil 2 is connected and the thick second region R2-1 to which the Hall element 3 is connected are respectively the first region R1 and the second region R2 of the first embodiment. It is the same. However, in the electric element 1A of the present embodiment, as shown in FIG. 4, the coil 2 is arranged on the negative side in the X-axis direction around the thick second region R2-1 where the hall element 3 is arranged. The thin first region R1-1 is provided, and the thin first region R1-2 is provided on the positive side in the X-axis direction. The base material 4 is bent in the thin first region R1-2 provided on the positive side in the X-axis direction with respect to the second region R2-1.

Further, in the electric element 1A of the present embodiment, a thick second region R2-2 is provided on the bending direction side of the thin first region R1-2 in which the base substrate 4 is bent, and the second region R2- A connector 8 as an external mounting portion is connected to 2.

Also in this embodiment, the base material 4 is formed of a resin material such as a liquid crystal polymer which is the same type as the insulating materials 2a, 2b and 2c forming the coil 2. The two thick second regions R2-1 and R2-2 in the base substrate 4 of the present embodiment are, for example, thin first regions R1-1 and R1-2 formed of a single-layer resin substrate, and It is formed by laminating resin base materials at the portions corresponding to the thick second regions R2-1 and R2-2 and integrating them by heating press or the like. Further, in the present embodiment, as shown in FIG. 4, in addition to the electrodes 41 and 42, the electrode 43 corresponding to the electrode 80 of the connector 8 is formed on the upper surface of the base substrate 4. The electrode 43 is formed of, for example, a copper foil, like the electrodes 41 and 42.

The base material 4 of this embodiment can be formed by the following manufacturing method. First, three resin base materials each having a copper foil stretched on one side are prepared. Next, the electrode 41, the electrode 42, the electrode 43, and a wiring pattern (not shown) are formed by a patterning process such as photolithography. Next, the resin base material on which the electrode 41 and the wiring pattern are formed, the resin base material on which the electrode 42 and the wiring pattern are formed, and the resin base material on which the electrode 43 and the wiring pattern are formed are thick at two locations. The layers are laminated at the positions corresponding to the second regions R2-1 and R2-2, and integrated by heating press or the like. The base material 4 is formed as described above.

In the present embodiment, the thickness of the first regions R1-1 and R1-2 of the base substrate 4 is set to 80 μm, and the thickness of the thick second region R2-1 to which the Hall element 3 is connected is , 130 μm. The thickness of the thick second region R2-2 to which the connector 8 is connected is set to 130 μm. However, these thicknesses are examples, and can be appropriately changed according to the application of the electric element 1A and the like.

In the present embodiment, the coil 2 and the Hall element 3 are soldered to the base substrate 4 manufactured as described above with the solder 7 as in the first embodiment. Next, the electrode 43 formed on the base material 4 and the electrode 80 of the connector 8 are soldered with the solder 7. Then, the thin first region R1-2 on the positive side in the X-axis direction is bent more than the thin first region R1-1 to which the coil 2 is connected, and the thin first region R1-to which the coil 2 is connected. 1 and the thick second region R2-1 to which the Hall element 3 is connected are attached at predetermined positions.

In the present embodiment, as described above, when the electric element 1A is attached, the base substrate 4 is bent. However, since the region to be bent is the thin first region R1-2, the bending is easily performed. be able to. Further, since the Hall element 3 is connected to the thick second region R2-1, it is possible to make it difficult for the stress due to the bending process to be transmitted to the Hall element 3 even when the above bending process is performed. As a result, it is possible to prevent the sensitivity of the Hall element 3 from changing.

Further, when the base material 4 is bent and attached to an external attachment portion such as the connector 8 as in the present embodiment, it is considered that internal stress or residual stress is generated. Since the Hall element 3 is connected to the thick second region R2-1, it is possible to make it difficult for the above-mentioned internal stress or residual stress to be transmitted to the Hall element 3. As a result, it is possible to prevent the sensitivity of the Hall element 3 from changing.

Further, in the present embodiment, since the connecting portion with the connector 8 is the thick second region R2-2, the defective joint with the connector 8 can be suppressed.

<Modification>
In the present embodiment, as an example, the thin first region is two places of the first region R1-1 and the first region R1-2, and the thick second region is the second region R2-1 and the second region R2-2. Although the mode has been described as a place, the present invention is not limited to such a mode, and the number of places where the thin first region and the thick second region are provided can be appropriately changed.

In the present embodiment, as an example, the thin first region R1 of the base substrate 4 is one layer of resin base material, and the two thick second regions R2-1 and R2-2 are two layers of resin base material. Although the embodiment has been described, the present invention is not limited to such an embodiment, and the number of stacked layers in each region can be appropriately changed.

Also in this embodiment, the shape of the coil formed by the conductor patterns 20 and 21 is not limited to the rectangular coil, and the number of turns of the conductor patterns 20 and 21 is not limited to two. Also, the line widths of the conductor patterns 20 and 21 can be changed as appropriate.

<Third Embodiment>
Next, a third embodiment of the present invention will be described with reference to the drawings. FIG. 5A is a side sectional view schematically showing the structure of the electric element 1B in the present embodiment. FIG. 5B is a plan view schematically showing the structure of the electric element 1B in this embodiment. 5A shows a cross section taken along the line AA′ in FIG.

The electric element 1B of this embodiment is different from that of the second embodiment in that two coils 2 are connected to a base material 4. As shown in FIG. 5A, in the electric element 1B of the present embodiment, two thin first regions are provided on both sides of the thick second region R2-1 to which the Hall element 3 is connected in the X-axis direction. R1-1 and R1-3 are provided, and the coil 2 is connected to each of these two thin first regions R1-1 and R1-3. In other words, the connection portion of the Hall element 3 is provided at a position sandwiched by the connection portions with the coil 2 at two locations. Furthermore, in the X-axis direction, when viewed from the thick second region R2-1 to which the Hall element 3 is connected, the thin first region outside the thin first regions R1-1 and R1-3 to which the coil 2 is connected is located. R1-4 and R1-5 are bent.

Also in this embodiment, the base material 4 is formed of a resin material such as a liquid crystal polymer which is the same type as the insulating materials 2a, 2b and 2c forming the coil 2. The two thick second regions R2-1 in the base substrate 4 of the present embodiment are, for example, thin first regions R1-1, R1-3, R1-4 and R1-5 made of a single layer resin substrate. It is formed by laminating resin base materials in a portion corresponding to the thick second region R2-1 and integrating them by heating press or the like. Further, in the present embodiment, on the upper surface of the base substrate 4, as shown in FIG. 5A, the electrodes 41 corresponding to the two coils 2 have thin first regions R1-1 and R1 respectively. -3.

The base material 4 of this embodiment can be formed by the following manufacturing method. First, two resin base materials each having a copper foil overlaid on one side are prepared. Next, the electrode 41, the electrode 42, and a wiring pattern (not shown) are formed by a patterning process such as photolithography. At this time, the electrode 41 is formed in each of the thin first regions R1-1 and R1-3 so as to correspond to the two coils 2 as described above. Next, the resin base material on which the electrode 41 and the wiring pattern are formed and the resin base material on which the electrode 42 and the wiring pattern are formed are laminated at a position corresponding to the thick second region R2-1, and a hot press or the like is performed. To integrate. The base material 4 is formed as described above.

In the present embodiment, the Hall element 3 is soldered to the base substrate 4 manufactured as described above with the solder 7, and the two coils 2 are soldered with the solder 7, as in the first embodiment. Next, the thin first regions R1-4 and R1-5 at both ends are bent to attach the electric element 1B at a predetermined position.

In this embodiment, the bending of the base material 4 is performed when the electric element 1B is attached as described above. However, as shown in FIGS. 5A and 5B, the mounting portion of the two coils 2 is used. Since the Hall element 3 is arranged at the sandwiched position, it is possible to suppress the generation of stress associated with the bending process and prevent the sensitivity of the Hall element 3 from changing. Further, since the regions to be bent are the thin first regions R1-4 and R1-5, the bending can be easily performed. Further, even after the bending process, even if deformation occurs near the mounting portion of the Hall element 3, it is possible to suppress the generation of stress due to the deformation and prevent the sensitivity of the Hall element 3 from changing. You can

<Modification>
In the present embodiment, the mode in which the two coils 2 are attached to the base substrate 4 has been described as an example, but the present invention is not limited to such a mode, and the coil 2 and an IC other than the coil 2 or the like. May be attached.

In the present embodiment, as an example, two thin first regions R1-1 and R1-3 as mounting parts for the coil 2 and one thick second region R2-1 as mounting parts for the Hall element 3 are provided, and The mode in which the thin first regions R1-4 and R1-5 as the bent portions are provided at two locations has been described. However, the present invention is not limited to such an aspect, and the number of places where each region is provided can be appropriately changed.

In the present embodiment, as an example, the thin first regions R1-1, R1-3, R1-4, and R1-5 of the base substrate 4 are used as one layer of resin substrate and two thick second regions R2- are formed. Although the embodiment in which 1 is a two-layer resin base material has been described, the present invention is not limited to such an embodiment, and the number of layers stacked in each region can be appropriately changed.

Also in this embodiment, the shape of the coil formed by the conductor patterns 20 and 21 is not limited to the rectangular coil, and the number of turns of the conductor patterns 20 and 21 is not limited to two. Also, the line widths of the conductor patterns 20 and 21 can be changed as appropriate.

<Fourth Embodiment>
Next, a fourth embodiment of the present invention will be described with reference to the drawings. FIG. 6 is a plan view schematically showing the insulating base materials 2a, 2b, 2b in each layer constituting the coil 2 in the present embodiment. FIG. 7A is a plan view schematically showing the electric element 1C in the present embodiment, and FIG. 7B is a side sectional view schematically showing the electric element 1C in the present embodiment. FIG. 7B shows a cross section taken along the line AA′ in FIG.

The coil 2 in the electric element 1C of this embodiment is different from that of the first embodiment in that, as shown in FIG. 6, it is formed by using insulating base materials 2a, 2b, 2b in which a through hole 9 is formed in the central portion. .. The manufacturing method of the coil 2 is the same as that of the first embodiment, and the insulating base materials 2a, 2b, 2b may be laminated so that the through holes 9 overlap each other, and integrated by heating press or the like.

Further, as shown in FIG. 7B, the base substrate 4 in the present embodiment has a thin first electrode 41 in the X-axis direction in which two electrodes 41 corresponding to the two electrodes 22 of the coil 2 are formed. A thick second region R2-1 for connecting the Hall element 3 is provided between the first regions R1-6 and R1-7. The base material 4 is formed of a resin material such as a liquid crystal polymer of the same kind as the insulating materials 2a, 2b, 2c forming the coil 2, as in the above-described embodiments. In the thick second region R2-1 in the base substrate 4 of the present embodiment, for example, the thin first regions R1-6 and R1-7 are formed of a single layer resin substrate, and the thick second region R2-1 is formed in the thick second region R2-1. It is formed by laminating resin base materials in a corresponding portion and integrating them by a hot press or the like.

The base material 4 of this embodiment can be formed by the following manufacturing method. First, two resin base materials each having a copper foil overlaid on one side are prepared. Next, a patterning process such as photolithography is performed to form two electrodes 41, 42, and a wiring pattern (not shown). At this time, an opening is provided between the two electrodes 41 so that a mounting portion of the Hall element 3 can be formed. Next, the electrode 42 and the resin base material on which the wiring pattern is formed are laminated on the resin base material on which the electrodes 41 are formed at two locations so as to be positioned between the electrodes 41 at the two locations. To integrate. The base material 4 is formed as described above.

In this embodiment, the Hall element 3 is soldered to the base substrate 4 manufactured as described above with the solder 7 as in the first embodiment. Next, the coil 2 is soldered to the base material 4 with the solder 7 so that the Hall element 3 is arranged in the through hole 9 of the coil 2.

In the present embodiment, as described above, since the thick second region R2-1 is formed inside the coil 2 and the hall element 3 is arranged, after the coil 2 is mounted, the hall element 3 It is possible to make the surroundings less likely to be deformed, and it is possible to suppress the sensitivity change of the Hall element 3 due to the generation of stress.

<Modification>
Also in the present embodiment, a bent portion may be provided as in the second and third embodiments. The bent portion is preferably the thin first region R1.

In the present embodiment, as an example, the thin first regions R1-6 and R1-7 of the base substrate 4 are used as one layer of resin base material, and the thick second regions R2-1 are used as two layers of resin base material. However, the present invention is not limited to such an aspect, and the number of layers stacked in each region can be appropriately changed.

Also in this embodiment, the shape of the coil formed by the conductor patterns 20 and 21 is not limited to the rectangular coil, and the number of turns of the conductor patterns 20 and 21 is not limited to two. Also, the line widths of the conductor patterns 20 and 21 can be changed as appropriate.

<Application example>
The electric elements 1, 1A, 1B, 1C of the above-described embodiment can be applied to various devices. For example, as shown in FIG. 8, it can be used for the actuator 30. FIG. 8 is a side sectional view schematically showing the actuator 30 of the application example. As shown in FIG. 8, the actuator 30 is provided above the electric element 1C described in the third embodiment (Z-axis direction) so that the moving body 10 can move in the positive and negative directions of the X-axis direction. There is. Two permanent magnets 11 are provided on the lower surface of the moving body 10 in the Z-axis direction. In such an actuator 30, a magnetic field is generated from the coil 2 by supplying a current to the conductor patterns 20 and 21 of the coil 2, and the actuator 30 is moved by utilizing the repulsive force and attractive force of the electromagnetic force and the permanent magnet 11. The body 10 can be moved in the positive and negative directions along the X-axis.

When configuring such an actuator, it is possible to use an electric element of another embodiment other than the electric element 1C described in the third embodiment.

Further, the electric elements 1, 1A, 1B, and 1C of the above-described embodiments can be used in the communication device 40, for example, as illustrated in FIG. 9. FIG. 9 is a side sectional view schematically showing the communication device 40 of the application example. In the communication device 40 shown in FIG. 9, the electric element 1 described in the first embodiment is used as an RFID reader. In this communication device 40, by bringing the RF tag 50 above the electric element 1 serving as an RFID reader (Z-axis direction), the tag information is detected while the position of the RF tag 50 is detected by the hall element 3. It can be read by the electric element 1 as an RFID reader.

Note that when configuring such a communication device, it is possible to use an electric element of another embodiment other than the electric element 1 described in the first embodiment.

In addition to the above-described examples, the present invention can be applied to various devices using magnetic field coupling.

The above description of the embodiments is illustrative in all respects and not restrictive. Those skilled in the art can appropriately make modifications and changes. The scope of the invention is indicated by the claims rather than the embodiments described above. Further, the scope of the present invention includes modifications from the embodiments within the scope equivalent to the claims.

1, 1A, 1B, 1C Electric element 2 Coil 3 Hall element 4 Base substrate 8 Connector 20, 21 Conductor pattern 30 Actuator 40 Communication device R1 First area R1-1 to R1-7 First area R2 Second area R2- 1,R2-2 Second area

Claims (11)

An electric element in which a coil and a Hall element are connected to one base material,
The base substrate is made of a flexible resin substrate,
It has a thin first region and a thick second region,
The coils are connected in the first region,
The hall element is connected to the second region,
An electric element characterized by the above. The coil is formed of an insulating base material and a conductor pattern,
An insulating base material that forms the coil, and the base material is made of the same resin base material,
The electric element according to claim 1, wherein: Hall elements are arranged in the coil formation region in the height direction so as to at least partially overlap with each other,
The electric element according to claim 1 or 2, characterized in that. The base substrate is folded in the first region,
The electric element according to any one of claims 1 to 3, wherein: The base substrate is bent in the first region and attached to an external attachment portion,
The electric element according to claim 4, wherein: A plurality of at least one of the first region and the second region is provided,
The electric element according to any one of claims 1 to 5, which is characterized by the above. The Hall element is arranged in a region sandwiched by the coils,
The electric element according to claim 6, wherein: The bent first region is on the opposite side of the region in which the Hall element is disposed, as viewed from the region in which the coil is disposed,
The electric element according to any one of claims 4 to 7, wherein The Hall element is arranged inside the coil,
The electric element according to any one of claims 1 to 8, which is characterized by the above. An actuator comprising the electric element according to any one of claims 1 to 8. A communication device comprising the electric element according to claim 1.