KR20150050306A - Coil component, manufacturing method thereof, coil component embedded substrate, module having the same - Google Patents

Abstract

The present invention relates to a coil component, a manufacturing method thereof, and a substrate embedding the same, capable of facilitating a manufacturing process and minimizing a DC resistance element of a wire. For this, the coil component according to the embodiment of the present invention includes a coil assembly which includes a core substrate and a coil pattern which is formed on the core substrate and a magnetic part which embeds the coil assembly inside.

Description

TECHNICAL FIELD [0001] The present invention relates to a coil component, a method of manufacturing the coil component, a substrate having a coil component therein, and a voltage control module including the coil component.

The present invention relates to a coil component, a method of manufacturing the same, and a substrate on which the coil component is manufactured. More specifically, the present invention relates to a coil component that is easy to manufacture and can minimize a DC resistance component of a wiring, And a voltage regulation module including the same.

As devices for mobile devices have become thinner and smaller in recent years, miniaturization of mounting parts and complex functionalization of substrates are progressing rapidly. Here, the multi-functionalization of the substrate means that passive components and active components are incorporated in the substrate, or a part of the function is realized in the pattern of the substrate, in addition to the electrical connection between the components, which is a basic role of the substrate.

For example, various attempts have been made to incorporate capacitors, resistors, coils, etc. in a substrate.

The technique of embedding a coil or an inductor in a substrate can be classified into a method of completing a coil by forming a coil shape with a wiring pattern in the process of manufacturing a substrate and a method of separately manufacturing a coil part and then embedding the coil part in a substrate have.

However, most of these conventional coil components and substrates incorporating such coil components are directed to low-capacity inductors. That is, the conventional substrate-embedded inductor can perform basic inductor functions, but it is difficult to use it as a power supply inductor (or power inductor) requiring a high capacity.

The power inductor has a high capacity (several μH ), a low DC resistance, and a high rated current, which is difficult to implement in a substrate. Nevertheless, there is a growing demand for power inductors and substrates that can be embedded in a substrate as electronic devices become smaller.

Japanese Laid-Open Patent Publication No. 1996-055723

SUMMARY OF THE INVENTION An object of the present invention is to provide a coil component which is high in capacity, easy to manufacture, and can be embedded in a substrate, and a manufacturing method thereof.

It is another object of the present invention to provide a substrate having a high-capacity coil part embedded therein and a voltage control module including the same.

A coil component according to the present invention comprises at least one core substrate; An inner conductor formed on at least one surface of the core substrate; And a magnetic body formed outside the core substrate, wherein a width of the internal conductor is equal to a width of the core substrate.

In the present embodiment, the core substrate and the inner conductor may be formed in a ring shape.

In the present embodiment, the magnetic body portion may be formed by embedding the core substrate and the internal conductor therein.

In the present embodiment, the inner conductor may be formed on both sides of the core substrate, and may further include at least one connection conductor for electrically connecting the inner conductors.

In the present embodiment, the connection conductors may be formed in the form of conductive vias passing through the core substrate.

In this embodiment, an insulating layer may be formed between the inner conductor and the magnetic body.

In this embodiment, an insulating layer may be formed between the inner conductor and the magnetic body.

In this embodiment, an insulating layer is formed between one surface of the inner conductor and the magnetic body, and an insulating oxide film may be formed between the side surface of the inner conductor and the magnetic body.

In this embodiment, the magnetic body portion may be formed of an insulating material containing magnetic powder or metal powder.

In the present embodiment, an insulator portion formed outside the magnetic body portion; At least one external electrode formed outside the insulator portion; And at least one through vias electrically connecting the internal electrode and the external electrode.

In the present embodiment, the external electrodes may be formed on the upper surface and the lower surface of the insulator portion, respectively.

Also, a coil component according to an embodiment of the present invention includes: at least one core substrate; An inner conductor formed on at least one surface of the core substrate; And a magnetic body formed on the outer side of the core substrate, wherein an outer circumference and an inner circumference of the inner conductor and an outer circumference and an inner circumference of the core substrate are formed to be equal to each other.

 According to another aspect of the present invention, there is provided a method of manufacturing a coil component, comprising: preparing a core substrate having a metal layer formed on at least one surface thereof; Cutting the core substrate into a ring shape by cutting the core substrate in a pressing manner; And forming a magnetic body portion on the outer surface of the ring-shaped core substrate.

In the present embodiment, the step of preparing the core substrate may further include forming the multi-layer pattern by processing the core substrate.

In the present embodiment, the step of forming the multi-layer pattern may include forming a connection conductor on the core substrate and electrically connecting the metal layers formed on both surfaces of the core substrate to each other; And forming a separation groove by removing a part of the metal layers.

In this embodiment, the step of forming the separation grooves may include the step of forming one separation groove in each of the two metal layers, and forming the separation groove on both sides of the connection conductor.

The method may further include forming an insulating layer on an outer surface of the metal layers after the step of forming the isolation trench.

The method may further include forming an insulating layer on an outer surface of the inner conductor formed by cutting the metal layer.

In the present embodiment, the step of forming the insulating film may be a step of forming an oxide film on the exposed surface of the internal conductor.

The method may further include the step of forming an insulator layer on the outside of the magnetic body portion after the step of forming the magnetic body portion on the outside of the core substrate.

Forming at least one through vias in the insulator layer, the at least one through vias being electrically connected to the inner conductor, after forming the insulator layer in this embodiment; And forming at least one external electrode electrically connected to the through via on an outer surface of the insulator layer.

Also, a coil-embedded board according to an embodiment of the present invention includes at least one insulating layer; And a magnetic body portion formed on an outer surface of the core substrate, wherein the width of the inner conductor is the same as the width of the core substrate, Components.

According to another aspect of the present invention, there is provided a voltage adjustment module including: a substrate; A power inductor comprising: a core substrate having an inner conductor formed on at least one surface thereof and a magnetic body portion formed outside the core substrate, the width of the inner conductor being equal to the width of the core substrate; And at least one voltage regulating element mounted on the substrate and electrically connected to the power inductor.

In the present embodiment, the voltage regulator may be an element for adjusting a voltage provided to the RF power amplification according to the magnitude of a radio signal in an ET (Envelope Tracking) power amplifier.

In the present embodiment, the magnetic substance portions disposed on the upper and lower portions of the core substrate may each have a thickness of 50 mu m or more.

The coil component manufacturing method according to the present invention forms a coil pattern by a method of cutting a substrate without forming a coil pattern by a method such as etching as in the conventional method. Therefore, the manufacturing process can be simplified, and manufacturing cost and manufacturing time can be reduced.

Further, in the conventional case, a coil pattern is generally formed by a method such as etching, so that there is a limit in expanding the width of the coil pattern. However, the coil component manufacturing method according to the present invention forms a coil pattern by a cutting method, so that the width of the coil pattern can be formed to be the same as the width of the substrate.

Therefore, the coil component according to the present invention can maximize the amount of current flowing through the coil pattern, thereby minimizing the DC resistance component generated in the coil. This improves power conversion efficiency and can be used as a high-capacity power inductor.

1 is a perspective view schematically showing a coil part according to a first embodiment of the present invention;
2 is a perspective view schematically showing a coil assembly of the coil part shown in Fig.
3 is a cross-sectional view along AA of the coil part shown in Fig.
4A is a perspective view schematically showing a coil part according to a second embodiment of the present invention.
4B is a cross-sectional view taken along line BB in Fig.
4C is a perspective view schematically illustrating the coil assembly of the coil component shown in Fig. 4A. Fig.
5A to 10B are views for explaining a method of manufacturing a coil component according to the first embodiment of the present invention.
11 is a cross-sectional view schematically showing a component-embedded board according to a third embodiment of the present invention.
Figs. 12 to 19 are views for explaining the coil component built-in substrate manufacturing method shown in Fig.
20 is a cross-sectional view schematically showing a component-embedded board according to a fourth embodiment of the present invention;
21 is a cross-sectional view schematically showing a component-embedded board according to a fifth embodiment of the present invention;
22 is a cross-sectional view schematically illustrating a voltage regulating module according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Note that, in the drawings, the same components are denoted by the same reference symbols as possible. Further, the detailed description of known functions and configurations that may obscure the gist of the present invention will be omitted. For the same reason, some of the elements in the accompanying drawings are exaggerated, omitted, or schematically shown, and the size of each element does not entirely reflect the actual size.

FIG. 1 is a perspective view schematically showing a coil part according to a first embodiment of the present invention, FIG. 2 is a perspective view showing a coil assembly of the coil part shown in FIG. 1, and FIG. 3 is a cross- Sectional view taken along AA of the component. 1 schematically shows only the coils among the coil assemblies embedded in the coil parts.

Referring to FIGS. 1 to 3, the coil component 100 according to the present embodiment may include a coil assembly 10 and a magnetic body portion 50.

The coil assembly 10 includes a core substrate 11, internal conductors 20 formed on both sides of the core substrate 11, and core conductors 20 extending through the core substrate 11 along the vertical direction, (Not shown).

The core substrate 11 may be a general insulating substrate. For example, the core substrate 11 may be formed of a resin material. For example, the core substrate 11 may be formed of a resin material such as polyphenylene sulfide (PPS), liquid crystal polyester (LCP), polybutylene terephthalate (PBT) FR-4 in which glass fibers are laminated can be used.

Further, a substrate having rigidity or a substrate having flexibility may all be used. For example, the core substrate 11 may be a PCB, a glass substrate, a ceramic substrate, a silicon substrate, a film substrate, a substrate on which a metal thin film is formed, or the like.

In this embodiment, the single-layered core substrate 11 is used as an example, but it is also possible to use a multi-layered core substrate 11 as required.

The internal conductors 20 are each formed in an annular shape and can be stacked via the core substrate 11. [ That is, the core substrate 11 is interposed between the laminated inner conductors 20a and 20b to electrically insulate the inner conductors 20a and 20b. Therefore, when the core substrate 11 of the present embodiment is the multilayer core substrate 11, the inner conductors 20 can be disposed for each layer of the core substrate 11. [

Each of the inner conductors 20 includes a disconnected portion as shown in FIG. 1, and both ends of the inner conductors 20a and 20b formed by the disconnected portions are connected by the connecting conductor 25 to the upper layer or the lower layer And are electrically connected to the other internal conductors 20a and 20b disposed in the other internal conductors 20a and 20b.

The connection conductors 25 electrically connect the internal conductors 20a and 20b formed in the two adjacent layers formed through the core substrate 11 in the vertical direction. Therefore, conductive vias may be used for the connection conductors 25.

In particular, the internal conductors 20 according to the present embodiment are formed in a substantially planar shape with the core substrate 11. [ In other words, the internal conductor 20 is formed in such a shape that the remaining portion except for the disconnected portion covers the entire one surface of the core substrate 11, and the pattern width of the internal conductor 20 is set such that the core substrate 11 The widths of the first and second electrodes are equal to each other.

Therefore, the outer and inner peripheries formed by the inner conductor 20 and the outer and inner peripheries formed by the core substrate 11 may be substantially the same.

As the material of the coil configured as described above, gold, silver, copper, aluminum or the like, which is electric transfer, can be used. However, the present invention is not limited thereto.

On the other hand, in this embodiment, the inner conductor 20 is formed in a circular ring shape as an example. However, the present invention is not limited thereto, and various applications such as a polygonal ring shape, an elliptical shape, or a polygonal shape having curved corners are possible.

In the coil component 100 according to the present embodiment, the insulating layer 30 may be formed on the outer surface of the inner conductor 20. The insulating layer 30 is formed for insulating between the internal conductor 20 and a magnetic body portion 50 described later. Therefore, the insulating layer 30 may be formed only on the outer surface of the inner conductor 20, or may be formed on both sides of the core substrate 11 on which the inner conductor 20 is formed, as in the present embodiment.

In addition, in the coil assembly 10 according to the present embodiment, the insulating film 40 may be formed on the side surface of the internal conductor 20.

The inner conductor 20 according to the present embodiment is formed on the entire one surface of the core substrate 11 so that the side surface of the inner conductor 20 is disposed on the same outer surface as the side surface of the core substrate 11. Accordingly, the internal conductor 20 is exposed to the outside of the core substrate 11.

In this case, the side surface of the internal conductor 20 can be electrically connected to the magnetic body portion 50 described later. Therefore, in order to prevent this, the insulating film 40 is formed on the side surface of the internal conductor 20.

The insulating film 40 may be variously used as long as it can electrically insulate the internal conductor 20 and the magnetic body portion 50 from each other. For example, an oxide film may be used for the insulating film 40. [ That is, an oxide film may be formed on the side surface of the internal conductor 20 and used as the insulating film 40. However, the present invention is not limited thereto.

The magnetic body portion 50 is formed on the outside of the coil assembly 10 in a form of embedding the coil assembly 10 therein. The magnetic body portion 50 may be made of a magnetic material such as ferrite or magnetite. Further, in order to improve the performance of the inductor, an insulating material containing a magnetic material powder or a metal powder may be used. In this case, at least one of ferrite, carbonyl iron, molybdenum permalloy and sendust may be used as the powder. As the insulating material, a thermosetting resin such as epoxy resin or polyimide may be used.

On the other hand, in this embodiment, the coil assembly 10 is completely embedded in the magnetic body portion 50 as an example. However, the configuration of the present invention is not limited thereto, and various modifications are possible as needed, for example, a part of the coil assembly 10 is exposed to the outside of the magnetic body part 50.

Although not shown, when the magnetic body portion 50 is formed of ferrite or the like, it is also possible to form a shielding layer on the outer surface. The shielding layer may be formed by applying an insulating material (e.g., resin) containing magnetic powder or metal powder to the outer surface of the magnetic body portion 50.

The coil component 100 according to this embodiment may be a coil component 100 for embedding the substrate. Therefore, the external electrode 70 is not provided, and after embedded in the substrate, the internal coil is electrically connected to the wiring pattern 2 of the substrate through the substrate manufacturing process.

This will be described in more detail in the following description of the manufacturing method.

In the coil component according to the present embodiment configured as described above, the pattern of the coil (that is, the inner conductor) is formed with the same width as the width of the core substrate embedded in the magnetic body portion. That is, the width of the coil pattern in the magnetic body portion can be maximized.

Therefore, since the amount of current flowing in the coil pattern can be increased, the DC resistance component generated in the coil can be minimized. It can increase the power conversion efficiency and can be used as a high capacity power inductor.

Conversely, since the size of the core substrate can be minimized corresponding to the pattern size of the coil, the overall size of the coil component can be minimized.

The present invention is not limited to the above-described embodiments, and various applications and modifications are possible.

4A is a perspective view schematically showing a coil part according to a second embodiment of the present invention, Fig. 4B is a cross-sectional view along BB of Fig. 4A, Fig. 4C shows a coil of the coil part shown schematically in Fig. It is a perspective. 4B is a cross section according to BB of FIG. 4A, only the connecting conductors 25 connecting substantially the inner conductors 20 are shown and other through vias 60 are not shown, but for convenience of explanation , And through vias 60 are all shown.

4A to 4C, the coil component 200 according to the present embodiment has the insulator portion 80 formed on the outer surface of the magnetic body portion 50. An external electrode 70 is formed on the insulator portion 80.

The external electrode 70 may be formed on the insulator portion 80 and may be formed on the internal conductor 20 of the coil assembly 10 and the internal conductor 50 of the coil assembly 10, And can be electrically connected.

The external electrodes 70 may be formed as a pair on the upper and lower surfaces of the insulator 80 and may be electrically connected to both ends of the coils 20 and 25 respectively by the connection conductor 25 have. That is, the inner conductors 20a and 20b disposed in the uppermost layer and the lowermost layer of the coils 20 and 25 are electrically connected to the external electrode 70 through the through vias 60 penetrating the magnetic body portion 50 and the insulator portion 80, Respectively.

By providing the insulator portion 80, the coil component 200 according to the present embodiment can protect the magnetic body portion 50 from the external environment and ensure insulation from the outside. And can be mounted on one side of the circuit board with the independent coil part 200 or embedded in the inside of the circuit board.

On the other hand, in this embodiment, the case where the insulator portion 80 is formed on the entire outer surface of the magnetic body portion 50 is taken as an example. However, the present invention is not limited thereto, and the present invention is not limited thereto. For example, the insulator portion 80 may be formed on only one side or both sides of the magnetic body portion 50, or only the portion where the external electrode 70 is to be formed.

In addition, the insulator portion 80 according to the present embodiment may contain a magnetic material powder or a metal powder therein. In this case, the insulator portion 80 can also function as a shielding electromagnetic wave or noise.

Next, a method of manufacturing a coil component according to an embodiment of the present invention will be described.

5A to 10B are views for explaining a method of manufacturing a coil component according to a first embodiment of the present invention.

Referring to FIG. 5A and FIG. 5B, a method of manufacturing a coil component (100 of FIG. 1) first prepares a core substrate 11 having metal layers 20 formed on both sides thereof.

Here, the core substrate 11 may be an insulating substrate, and the metal layer 20 may be a copper thin film.

Subsequently, as shown in FIG. 6, at least one conductive via is formed in the core substrate 11, that is, the connection conductor 25.

The connection conductors 25 may be formed by a general method for manufacturing conductive vias. That is, the through hole may be formed by a method such as laser drilling or etching, and then the conductive material may be filled in the through hole by plating or the like.

Then, a step of forming the separation groove 21 in the metal layer 20 is performed as shown in Figs. 7A and 7B. The separation grooves 21 may be formed by removing a part of the metal layer 20. Therefore, the bottom surface of the separation groove 21 is formed by one surface of the core substrate 11.

The separation groove 21 is a structure for forming a portion where the pattern is disconnected from the internal conductor (i.e., coil pattern) formed later. Therefore, the separation groove 21 can be formed as a groove having a width equal to or greater than the width of the coil pattern.

The separation grooves 21 according to the present embodiment may be formed on the metal layer 20 formed on both sides of the core substrate 11. [ Further, in order to complete the coil structure, the two separation grooves 21 may be vertically formed at different positions.

Specifically, the two separation grooves 21 may be formed on both sides adjacent to each other with respect to the connection conductor 25 as shown in FIG. 7B. This can be more clearly understood through the structure of the coil described later.

These separation grooves 21 can be formed through a method such as laser processing or etching.

Next, as shown in FIGS. 8A and 8B, an insulating layer 30 is formed on the outer surface of the metal layer 20.

The insulating layer 30 may be formed by applying an insulating material to the surface of the metal layer 20 or by impregnating the core substrate 11 in an insulating material.

At this time, the insulating layer 30 may be filled in the separating groove 21.

Next, as shown in FIG. 9, the core substrate 11 on which the metal layer 20 and the insulating layer 30 are formed is cut to form a coil shape. The core substrate 11 may be cut by a press cutting method. That is, after the core substrate 11 is placed in the cutting apparatus, it can be cut along the cutting line (P in Fig. 8) in a pressing manner and processed into the shape shown in Fig.

As the core substrate 11 is cut in this manner, only the portion of the metal layer 20 that actually forms the coil, that is, the inner conductor 20, is left, and all the remaining portions are removed.

In this process, the above-described separation groove 21 and the connection conductor 25 are left. The metal layer 20 left on the core substrate by the separation grooves 21 may be formed of an internal conductor 20 partially in the form of an annular ring (see Fig. 2). Also, the internal conductors 20 formed on both sides of the core substrate are electrically connected by the connection conductor 25 to complete the shape of the continuous coil.

As described above, in the method of manufacturing the coil component 100 according to the present embodiment, the coil structure can be completed only by a process of forming the conductive via and a single cutting process without performing a complex process to form a specific pattern on the core substrate do. Therefore, there is an advantage that manufacturing is very easy.

On the other hand, in the present embodiment, since the inner conductor is formed in a circular shape, the substrate is also cut into a circular ring shape. However, the present invention is not limited thereto. That is, when the inner conductor is formed into a square ring shape, the shape of the core substrate can be formed corresponding to the shape of the coil, such as cutting the substrate into a rectangular ring shape.

Next, an insulating film 40 is formed as shown in FIGS. 10A and 10B. The insulating film 40 is formed on the side surface of the internal conductor 20 exposed to the outside by cutting.

The insulating film 40 according to the present embodiment can be formed in the form of an oxide film. Therefore, when the internal conductor 20 is formed of copper (Cu), the insulating film 40 may be an oxide film made of copper oxide (CuO, CuO ₂ ).

The insulating film 40 may be formed to a thickness of several hundreds nm to several tens of micrometers, and may be determined depending on a current or voltage applied to the coil component.

On the other hand, when it is necessary to form the insulating film 40 thicker than the oxide film, the insulating film 40 may be formed through a separate insulating material. For example, the insulating film 40 may be formed thicker by spraying or applying an insulating material to the exposed portion (or the outer surface of the oxide film) of the inner conductor 20 and then drying or bonding the insulating film.

When the coil assembly 10 is completed through the above-described process, the magnetic body portion 50 is formed outside the coil assembly 10 to complete the coil component 100 shown in FIGS. 1 to 3 .

The magnetic body part 50 may be formed by arranging the coil assembly 10 in a specific frame, filling and curing the magnetic material in the form of a paste, or stacking magnetic material in the form of a sheet on the top and bottom of the substrate, And can be formed by pressing.

The coil component 100 formed in the above process can be utilized as a coil component 100 for substrate embedding in the form of a semi-finished product. This will be described later.

Meanwhile, the coil part 200 according to the second embodiment shown in FIG. 4B is formed by forming the insulator part 80 on the outer surface of the coil part 100 of FIG. 1 and inserting the insulator part 80 Through vias 60 penetrating the magnetic body portion 50 and then forming the external electrodes 70 on the external surface of the insulator portion 80. [

At this time, the through vias 60 can electrically connect the external electrode 70 and the internal conductor 20 of the coil assembly 10.

Meanwhile, the insulator portion 80 may be formed by applying an insulating material to the outside of the magnetic material portion 50, but the present invention is not limited thereto. The coil portion 100 of FIG. 1 may be impregnated with a liquid insulating material, Or by attaching an insulating film or the like to the substrate.

Further, the external electrode 70 may be formed in a wide area along the surface of the insulator portion 80, and may be formed in various shapes as needed, such as extended to other surfaces.

In the coil component manufacturing method according to the present embodiment having the above-described structure, the coil pattern is formed by a method of cutting the core substrate through a pressing process without forming a coil pattern by etching or the like. Therefore, the manufacturing process can be simplified, and manufacturing cost and manufacturing time can be reduced.

Further, in the conventional case, a coil pattern is generally formed by a method such as etching, so that there is a limit in expanding the width of the coil pattern. However, in the coil component manufacturing method according to the present embodiment, since the coil pattern is formed by the cutting method, the width of the coil pattern can be formed to be the same as the width of the substrate.

Therefore, the amount of the current flowing in the coil pattern can be maximized, so that the DC resistance component generated in the coil can be minimized. It can increase the power conversion efficiency and can be used as a high capacity power inductor.

In addition, the coil component according to the present invention can be easily embedded in a substrate.

11 is a cross-sectional view schematically showing a component-embedded board according to a third embodiment of the present invention. 11, the through vias 60 connected to the wiring patterns 2 of the component-embedded board 1 are arranged on a different vertical plane from the connecting conductors 25 interconnecting the internal conductors 20, It should not be shown substantially but is shown for convenience of explanation.

11, the component-embedded board 1 according to the present embodiment includes a plurality of wiring patterns 2 disposed between a plurality of insulating layers 3 and an insulating layer 3. [ And includes a coil component 100 embedded therein.

The coil component 100 to be embedded in the component-embedded board 1 may be the coil component 100 in the semi-product state shown in Fig. The coil pattern of the coil part 100 is electrically connected to the wiring pattern 2 of the embedded board 1 by the through vias 60 penetrating the component built-in board 1 and the coil part 100 together.

For this, the component-embedded board 1 may be formed to have a thicker thickness than the coil component 100 in the semi-finished product state so that the coil component 100 can be completely embedded therein.

On the other hand, the method of embedding the coil component 100 in the component built-in substrate 1 can be carried out as follows.

12 to 19 are views for explaining the method of manufacturing the coil component built-in substrate shown in Fig.

Referring to FIG. 12, first, a substrate 1 having a cavity 5 formed therein is prepared. Here, the substrate 1 may be a multi-layer substrate and may be in a state in which the fabrication is not completed.

Then, as shown in FIG. 13, the coil part 100 in the semi-finished product state is inserted into the cavity 5. Therefore, the cavity 5 may be formed to have a size corresponding to the size of the coil component 100. However, in the case of further embedding other components than the coil component 100, the cavity 5 can be formed in a larger space.

Then, as shown in FIG. 14, the cavity 5 is hermetically sealed with an insulating material such as resin and the coil part 100 is completely covered with the coil part 100, so that the coil part 100 is embedded in the substrate 1.

Then, through vias 60 are formed on both sides of the coil component 100 as shown in FIG. At this time, the through vias 60 may be formed by filling the via hole 61 with a conductive material after the via hole 61 is formed so as to penetrate the substrate 1 and the coil part 100 together . Thus, one end or end of the through via 60 may be electrically connected to the internal conductor 20 of the coil component 100, respectively.

15 to 18, the through vias 60 are disposed on a vertical plane different from the connection conductors 25 connecting the internal conductors 20, and therefore, they are not shown in the drawings, but are shown for convenience of explanation .

Then, a wiring pattern 2 is formed on the substrate as shown in Fig. At this time, the wiring pattern 2 is electrically and physically connected to the other end of the through via 60. Therefore, the coil component 100 can be electrically connected to the wiring pattern 2 of the substrate through the through vias 60.

Next, a new insulating layer 8 is formed on the wiring pattern 2 as shown in FIG. 17 to complete the component-embedded substrate 1 according to the present embodiment.

On the other hand, in the case of using the insulating material containing the metal powder as the magnetic body part 50 of the coil part 100, the through vias 60 and the magnetic body part 50 of the coil part 100 in the state of Fig. A short circuit may be generated electrically.

Therefore, in this case, it is necessary to mutually isolate the magnetic body portion 50 and the through vias 60 from each other.

14, after the via hole 61 for the through via 60 is formed, the insulating layer 61 is formed on the bottom surface and the wall surface in the via hole 61, as shown in FIG. 18, (62). Here, the insulating layer 62 may be a solder resist or the like.

15, after the insulating layer 62 formed on the bottom surface of the via hole 61, that is, the portion formed on the internal conductor 20, is removed, as shown in FIG. 19, The through vias 60 are formed.

The through vias 60 are electrically connected to the inner conductor 20 and can be insulated from the magnetic body portion 50 by the insulating layer 62. [

In this embodiment, the coil component 100 is completely embedded in the embedded board 1, but the present invention is not limited thereto and various modifications are possible. For example, it is also possible to bury one or both sides of the coil part 100 in the built-in board 1 so as to be exposed to the outside of the built-in board 1.

20 is a cross-sectional view schematically showing a component-embedded board according to a fourth embodiment of the present invention.

Referring to FIG. 20, there is shown a structure in which the coil component 200 shown in FIG. 4B is embedded in the component-embedded board 1. FIG. In this case, since the external electrode 70 is formed on the coil component 100, the coil component 100 is inserted into the substrate 1, and then the coil component 200 is formed only by the step of additionally forming the wiring pattern 2 The wiring pattern 2 of the component built-in board 1 can be electrically connected.

A protective insulating layer 9 may be formed on the wiring pattern 2 and the coil part 100 for protecting the wiring pattern 2 and the coil part 200. [ As the protective insulating layer 9, a solder resist or the like may be used.

In the present embodiment, the coil component 200 is inserted and coupled to a cavity of a through hole formed in the component-embedded board 1, and both surfaces of the coil component 200 are exposed to the outside of the component- have. Therefore, the component-embedded board 1 may be formed to have a thickness substantially equal to or slightly larger than that of the coil component 200.

Thus, the thickness of the component-embedded board 1 according to the present embodiment can be minimized even when the coil component 200 is embedded. Further, in the embedding process of the coil component 200, a separate step of forming the through vias (60 in FIG. 11) of the third embodiment described above can be omitted, which is easy to manufacture.

21 is a cross-sectional view schematically showing a component-embedded board according to a fifth embodiment of the present invention.

Referring to FIG. 21, the coil component 300 according to the present embodiment has a thicker inner conductor 20 than the above-described embodiments. The core substrate 11 between the internal conductors 20 is formed to have a very thin thickness.

If the inner conductor 20 is formed as thick as this, the outer area of the inner conductor 20 is increased. Therefore, the amount of current flowing in the coil pattern can be further increased, so that the DC resistance component generated in the coil can be minimized.

Also, the coil component 300 according to the present embodiment is formed such that the thickness of the magnetic body portion 50 disposed on the upper and lower portions of the internal conductor 20 is thicker than those of the above embodiments. For example, the thickness of the magnetic body portion 50 disposed on the upper and lower portions of the internal conductor 20 may be 50 占 퐉 or more.

In this case, since the cross-sectional area of the magnetic body portion 50 is large, the magnetic flux formed in the magnetic body portion 50 can be easily formed in the magnetic body portion 50 without being easily saturated or leaking to the outside.

Therefore, it is possible to minimize the influence of the leakage flux on the component-embedded board 1 and other electronic components mounted thereon.

22 is a cross-sectional view schematically showing a voltage regulation module according to an embodiment of the present invention.

Referring to FIG. 22, the voltage regulation module 600 according to the present embodiment may be a voltage regulation module used in an ET (Envelope Tracking) power amplifier. That is, the voltage regulation module 600 may be a module for adjusting the voltage supplied to the RF power amplifier according to the magnitude of the radio signal in the ET power amplifier.

The voltage regulation module 600 may include a component in-board 1, a power inductor 400 embedded in the component-embedded board 1, and a voltage regulator 500 mounted on the component-embedded board 1 , And may further include other electronic elements as needed.

Here, the power inductor 400 may be any one of the above-described coil parts, and the component built-in board 1 may be any one of the component built-in boards having the above-described coil components built therein.

Also, the voltage regulator 500 may be an element for regulating the voltage supplied to the RF power amplifier according to the size of the radio signal.

The power inductor 400 of the voltage regulating module 600 having the above structure may be formed such that the thickness of the magnetic body portion 50 disposed on the upper and lower portions of the internal conductor 20 is 50 mu m or more. Further, the inner conductor 20 and the magnetic body portion 50 can be insulated from each other by the insulating layer 40.

Meanwhile, the coil component built-in substrate according to the present invention is not limited to the above-described embodiments. For example, a part of the coil part is embedded in a form protruding from one surface of the component built-in substrate.

Also, in the above-described embodiments, only coil parts are embedded in the component-embedded board as an example, but it is also possible to embed various passive elements and active elements in addition to the coil components.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be obvious to those of ordinary skill in the art.

1: Component built-in board
10: Coil assembly
11: core substrate
20: Internal conductor
30: Insulation layer
40: Insulating film
50:
70: external electrode
80: insulator portion
100. 200, 300: Coil parts

Claims (25)

At least one core substrate;
An inner conductor formed on at least one surface of the core substrate; And
A magnetic body portion formed outside the core substrate;
/ RTI >
Wherein a width of the inner conductor is formed equal to a width of the core substrate.
The method according to claim 1,
Wherein the core substrate and the inner conductor are formed in a ring shape.
The magnetic circuit according to claim 1,
And the core substrate and the inner conductor are embedded in the core.
The method according to claim 1,
Wherein the internal conductors are formed on both sides of the core substrate,
And at least one connection conductor for electrically connecting the inner conductors.
The connector according to claim 4,
And a conductive via formed through the core substrate.
The method according to claim 1,
And an insulating layer formed between the inner conductor and the magnetic body portion.
The method according to claim 1,
And an insulating film formed between the internal conductor and the magnetic body portion.
The method according to claim 1,
Wherein an insulating layer is formed between one surface of the inner conductor and the magnetic body portion, and an insulating oxide film is formed between the side surface of the inner conductor and the magnetic body portion.
The magnetic circuit according to claim 1,
Coil parts formed by insulating material containing magnetic powder or metal powder.
The method according to claim 1,
An insulator formed outside the magnetic body;
At least one external electrode formed outside the insulator portion; And
At least one through via for electrically connecting the internal electrode and the external electrode;
Further comprising:
11. The semiconductor device according to claim 10,
Respectively, on the upper and lower surfaces of the insulator portion.
At least one core substrate;
An inner conductor formed on at least one surface of the core substrate; And
A magnetic body portion formed outside the core substrate;
/ RTI >
Wherein an outer periphery and an inner periphery of the inner conductor and an outer periphery and an inner periphery of the core substrate are formed to be equal to each other.
Preparing a core substrate having a metal layer formed on at least one side thereof;
Cutting the core substrate into a ring shape by cutting the core substrate in a pressing manner; And
Forming a magnetic body portion on the outside of the ring-shaped core substrate;
≪ / RTI >
14. The method of claim 13, wherein after preparing the core substrate,
And processing the core substrate to form a multi-layered pattern.
15. The method of claim 14, wherein forming the multi-
Forming a connection conductor on the core substrate and electrically connecting the metal layers formed on both sides of the core substrate to each other; And
Forming a separation groove by removing a part of the metal layers;
≪ / RTI >
16. The method of claim 15,
Forming one isolation groove in each of the two metal layers, and forming the isolation groove on both sides of the connection conductor.
16. The method of claim 15, wherein after forming the isolation groove,
And forming an insulating layer on an outer surface of the metal layers.
14. The method of claim 13,
And forming an insulating film on an outer surface of the inner conductor formed by cutting the metal layer.
19. The method of claim 18, wherein forming the insulating layer comprises:
And forming an oxide film on the exposed surface of the inner conductor.
19. The method of claim 18, further comprising: after forming the magnetic body portion on the outer surface of the core substrate,
And forming an insulator layer on the outside of the magnetic body portion.
21. The method of claim 20, wherein after forming the insulator layer,
Forming at least one through vias in the insulator layer that are electrically connected to the inner conductor; And
Forming at least one external electrode electrically connected to the through via on an outer surface of the insulator layer;
Further comprising the steps of:
At least one insulating layer; And
And a magnetic body portion formed on an outer surface of the core substrate, wherein a width of the inner conductor is formed to be equal to a width of the core substrate, and a coil portion ;
And a coil component built-in substrate.
Board;
A power inductor comprising: a core substrate having an inner conductor formed on at least one surface thereof and a magnetic body portion formed outside the core substrate, the width of the inner conductor being equal to the width of the core substrate; And
At least one voltage regulating element mounted on the substrate and electrically connected to the power inductor;
And a voltage regulating module.
24. The voltage regulator of claim 23,
An Envelope Tracking (ET) power amplifier, comprising a voltage regulator module that regulates the voltage provided to RF power amplification according to the magnitude of the radio signal.
The magnetic circuit according to claim 24, wherein the magnetic body portions disposed on the upper and lower portions of the core substrate,
And a thickness of each of the first electrode layer and the second electrode layer is 50 mu m or more.

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