JP2020123847A - 光電変換装置、撮像システム、移動体 - Google Patents
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Abstract
Description
本発明の第1実施形態による光電変換装置及びその駆動方法について、図1乃至図3を用いて説明する。
本実施形態の光電変換装置について、第1実施形態と異なる点を中心に説明する。
本実施形態の光電変換装置について、第1実施形態と異なる点を中心に説明する。
本実施形態の光電変換装置について、第1実施形態と異なる点を中心に説明する。
本発明の第5実施形態による撮像システムについて、図12を用いて説明する。図12は、本実施形態による撮像システムの概略構成を示すブロック図である。
本発明の第6実施形態による撮像システム及び移動体について、図13を用いて説明する。図13は、本実施形態による撮像システム及び移動体の構成を示す図である。
本発明は、上記実施形態に限らず種々の変形が可能である。
13 パルス生成回路(生成回路)
14 PD制御回路(第1制御回路)
15 信号制御回路(第2制御回路)
16 カウンタ
Claims (12)
- アバランシェ増倍を行うフォトダイオードと、
制御信号を生成する生成回路と、
前記制御信号によって、前記フォトダイオードによる前記アバランシェ増倍が可能な待機状態と、前記アバランシェ増倍が行われた前記フォトダイオードを前記アバランシェ増倍が再び可能な状態に戻すリチャージ状態とに制御される第1制御回路と、
前記制御信号と前記フォトダイオードの出力に対応した信号とを用いて、前記待機状態にある複数の期間のうち、前記アバランシェ増倍が生じた期間の数をカウントする第2制御回路とを有することを特徴とする光電変換装置。 - 前記第2制御回路は、カウンタと、論理回路を備え、
前記論理回路に、前記フォトダイオードの出力に対応した信号と、前記制御信号とが入力され、前記論理回路の出力が、前記カウンタに入力されることを特徴とする請求項1に記載の光電変換装置。 - 前記第2制御回路は、カウンタと、選択回路を備え、
前記選択回路に、前記フォトダイオードの出力に対応した信号と、所定の電圧とが入力され、
前記選択回路が、前記制御信号に基づいて、前記フォトダイオードの出力に対応した信号と、前記所定の電圧の一方を選択して前記カウンタに出力することを特徴とする請求項1に記載の光電変換装置。 - アバランシェ増倍を行うフォトダイオードと、
制御信号を生成する生成回路と、
前記フォトダイオードに接続され、前記制御信号によって、前記フォトダイオードに接続されたノードをフローティングにする待機状態と、前記ノードを所定の電位に戻すためのリチャージ状態とに制御される第1制御回路と、
第2制御回路とを有し、
前記第2制御回路は、前記生成回路と前記フォトダイオードに接続された論理回路と、前記論理回路に接続されたカウンタとを有することを特徴とする光電変換装置。 - 前記制御信号が第1レベルにある場合に前記第1制御回路は前記待機状態であり、前記制御信号が第2レベルにある場合に前記第1制御回路は前記リチャージ状態であり、
前記制御信号が前記第1レベルから前記第2レベルに遷移するのと同時に、前記カウンタの入力部の電位が初期状態にリセットされることを特徴とする請求項2〜4のいずれか1項に記載の光電変換装置。 - 前記生成回路は、位相の異なる複数の制御信号を前記第1制御回路に出力し、
前記第2制御回路は、前記複数の制御信号が入力されるとともに、前記複数の制御信号の位相差と、前記フォトダイオードの出力に対応した信号とを用いて前記待機状態にある期間において前記アバランシェ増倍が生じたか否かを検出することを特徴とする請求項1〜5のいずれか1項に記載の光電変換装置。 - 前記フォトダイオードに接続された入力部を有するレベルシフト回路をさらに有し、
前記第2制御回路の入力部に、前記レベルシフト回路の出力部と前記第1制御回路が接続されることを特徴とする請求項1〜6のいずれか1項に記載の光電変換装置。 - 前記フォトダイオードが第1の半導体基板に配され、前記第2制御回路が第2の半導体基板に配され、
前記第1の半導体基板と、前記第2の半導体基板とが積層されていることを特徴とする請求項1〜7のいずれか1項に記載の光電変換装置。 - 前記制御信号は、所定の周期で繰り返し信号レベルが変化する信号であることを特徴とする請求項1〜8のいずれか1項に記載の光電変換装置。
- 請求項1〜9のいずれか1項に記載の光電変換装置と、
前記光電変換装置から出力される信号を処理する信号処理部と
を有することを特徴とする撮像システム。 - 移動体であって、
請求項1〜9のいずれか1項に記載の光電変換装置と、
前記光電変換装置からの信号に基づく視差画像から、対象物までの距離情報を取得する距離情報取得手段と、
前記距離情報に基づいて前記移動体を制御する制御手段と、
を有することを特徴とする移動体。 - 制御信号を生成する生成回路と、
アバランシェ増倍を行うフォトダイオードに接続される第1ノードを備え、前記制御信号によって、前記ノードをフローティングにする待機状態と、前記第1ノードを所定の電位に戻すためのリチャージ状態とに制御される第1制御回路と、
第2制御回路とを有し、
前記第2制御回路は、前記生成回路と前記フォトダイオードに接続される第2ノードを有する論理回路と、前記論理回路に接続されたカウンタとを有することを特徴とする半導体基板。
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US16/751,099 US11937004B2 (en) | 2019-01-30 | 2020-01-23 | Photoelectric conversion apparatus, imaging system, movable object, and semiconductor substrate |
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Cited By (7)
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---|---|---|---|---|
WO2022149576A1 (ja) | 2021-01-07 | 2022-07-14 | キヤノン株式会社 | 光電変換装置、光検出システム |
JP2022112740A (ja) * | 2021-01-22 | 2022-08-03 | キヤノン株式会社 | 光電変換装置及び光検出システム |
WO2023062944A1 (ja) * | 2021-10-15 | 2023-04-20 | ソニーセミコンダクタソリューションズ株式会社 | 光検出素子、および、光検出装置 |
EP4221247A1 (en) | 2022-01-28 | 2023-08-02 | Canon Kabushiki Kaisha | Photoelectric conversion apparatus, control method for controlling the same, and program |
US11784195B2 (en) | 2021-01-07 | 2023-10-10 | Canon Kabushiki Kaisha | Photoelectric conversion apparatus and photodetection system |
US11937006B2 (en) | 2022-05-16 | 2024-03-19 | Canon Kabushiki Kaisha | Photoelectric conversion apparatus and photoelectric conversion system |
JP7516460B2 (ja) | 2021-09-08 | 2024-07-16 | キヤノン株式会社 | 光電変換装置、光電変換システム |
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---|---|---|---|---|
US11137607B2 (en) * | 2019-06-28 | 2021-10-05 | Canon Kabushiki Kaisha | Image capturing and display apparatus and wearable device |
KR102455691B1 (ko) * | 2020-06-02 | 2022-10-20 | 한국전자통신연구원 | 단일 광자 검출 방법 및 장치 |
TW202312679A (zh) | 2021-09-08 | 2023-03-16 | 日商佳能股份有限公司 | 光電轉換裝置和光電轉換系統 |
KR20230061032A (ko) * | 2021-10-28 | 2023-05-08 | 삼성전자주식회사 | 이미지 센서, 영상 획득 장치 및 이를 포함하는 전자 장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008538606A (ja) * | 2005-04-22 | 2008-10-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Tof−pet用のディジタルシリコン光電子増倍管 |
WO2016042734A1 (ja) * | 2014-09-19 | 2016-03-24 | パナソニックIpマネジメント株式会社 | 固体撮像装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3029363B2 (ja) | 1993-08-23 | 2000-04-04 | 株式会社東芝 | 固体撮像装置 |
JP2011226922A (ja) | 2010-04-20 | 2011-11-10 | Nippon Telegr & Teleph Corp <Ntt> | 光子検出器 |
US8410416B2 (en) * | 2010-04-29 | 2013-04-02 | King Abdulaziz City For Science And Technology | Reduction of delay between subsequent capture operations of a light-detection device |
GB2485995B (en) * | 2010-11-30 | 2014-01-01 | St Microelectronics Res & Dev | Improved proximity sensor and associated method, computer readable medium and firmware |
JP7129182B2 (ja) | 2017-06-23 | 2022-09-01 | キヤノン株式会社 | 固体撮像素子、撮像装置及び撮像方法 |
JP7043218B2 (ja) * | 2017-10-26 | 2022-03-29 | シャープ株式会社 | 光センサ、距離測定装置、および電子機器 |
JP7218191B2 (ja) * | 2019-01-30 | 2023-02-06 | キヤノン株式会社 | 光電変換装置、撮像システム、移動体 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008538606A (ja) * | 2005-04-22 | 2008-10-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Tof−pet用のディジタルシリコン光電子増倍管 |
WO2016042734A1 (ja) * | 2014-09-19 | 2016-03-24 | パナソニックIpマネジメント株式会社 | 固体撮像装置 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022149576A1 (ja) | 2021-01-07 | 2022-07-14 | キヤノン株式会社 | 光電変換装置、光検出システム |
KR20230128061A (ko) | 2021-01-07 | 2023-09-01 | 캐논 가부시끼가이샤 | 광전변환장치, 광 검출 시스템, 및 이동체 |
US11784195B2 (en) | 2021-01-07 | 2023-10-10 | Canon Kabushiki Kaisha | Photoelectric conversion apparatus and photodetection system |
JP2022112740A (ja) * | 2021-01-22 | 2022-08-03 | キヤノン株式会社 | 光電変換装置及び光検出システム |
JP7358410B2 (ja) | 2021-01-22 | 2023-10-10 | キヤノン株式会社 | 光電変換装置及び光検出システム |
JP7516460B2 (ja) | 2021-09-08 | 2024-07-16 | キヤノン株式会社 | 光電変換装置、光電変換システム |
WO2023062944A1 (ja) * | 2021-10-15 | 2023-04-20 | ソニーセミコンダクタソリューションズ株式会社 | 光検出素子、および、光検出装置 |
EP4221247A1 (en) | 2022-01-28 | 2023-08-02 | Canon Kabushiki Kaisha | Photoelectric conversion apparatus, control method for controlling the same, and program |
US11937006B2 (en) | 2022-05-16 | 2024-03-19 | Canon Kabushiki Kaisha | Photoelectric conversion apparatus and photoelectric conversion system |
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US20240171876A1 (en) | 2024-05-23 |
US20200244909A1 (en) | 2020-07-30 |
JP7321713B2 (ja) | 2023-08-07 |
JP2023155231A (ja) | 2023-10-20 |
US11937004B2 (en) | 2024-03-19 |
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