JP2020120115A - Wafer peeling and cleaning device - Google Patents

Abstract

To reduce the time for transporting a wafer to a sheet cleaning unit from peeling work by means of a delivery device and improve overall efficiency without damaging the wafer.SOLUTION: In a wafer peeling and cleaning device, a wafer peeling slicing unit 100 has first and second suctioning pads 200, 201 for peeling, an overturn prevention plate 214, and a two-sheet pick-up preventing plate 216 having a slit 216a formed in an upper portion of the overturn prevention plate 214. A delivery device 118 has a suctioning pad 300 for delivery, and a pressure switch that detects that a wafer W has been suctioned and held by the suctioning pad 300 for delivery. In response to a detection signal from the pressure switch, the vacuum suctioning of the first and second suctioning pads 200, 201 for peeling is released and the retraction of the suctioning pad 300 for delivery and the lowering of the first and second suctioning pads 200, 201 for peeling are started.SELECTED DRAWING: Figure 7

Description

The present invention relates to a wafer peeling/cleaning apparatus, and more particularly to a wafer peeling/cleaning apparatus for peeling wafers batch-cut (bundled) simultaneously with a wire saw from a slice base to separate them into single wafers for cleaning.

When the ingot is cut with a wire saw, all the wafers are cut out while being bonded to the slice base. Therefore, it is necessary to separate the wafer from the slice base to form a single wafer. Further, since the working liquid and the like are attached to the wafer immediately after being cut with the wire saw, it is necessary to wash and remove the working liquid.

Conventionally, the wafer stripping and cleaning operations have been performed by a single wafer stripping and cleaning apparatus. The wafer peeling/cleaning device is composed of a rough cleaning unit, a wafer peeling sheet unit, a cleaning unit, and a recovery unit. The wafer immediately after cutting is first transported to the rough cleaning unit for rough cleaning. Then, the batch-wise roughly cleaned wafers are conveyed to the wafer separation sheet-fed portion, where they are separated one by one from the slice base to be separated into individual sheets. The wafer separated from the slice base is transferred to the single-wafer cleaning unit by the delivery device. Then, the sheet is washed separately, collected one by one in the collection unit, and stored in the cassette.

In the wafer separation sheet unit, in order to efficiently separate the wafer, a pair of separation suction pads are arranged at a predetermined interval, and the pair of separation suction pads holds the wafer by vacuum suction. It is known that the peeling suction pad is oscillated in the front-rear direction, and is vertically moved by a lifting rotary actuator to stop at a predetermined delivery position, which is described in Patent Document 1.

JP, 11-288902, A

In the one described in Patent Document 1, the wafer is simply vacuum-adsorbed by the pair of peeling suction pads, swings in the front-rear direction, and moves up and down, which is desirable in terms of efficiently peeling the wafer, but peeled off. It is not enough to reliably lift the wafer to the delivery suction pad at the delivery position. In particular, if the speed of the vertical movement is increased to improve the efficiency, the wafer may be dropped or the posture of the wafer may become unstable and the wafer may be damaged.
In addition, when the wafer is tilted, there is a problem that it cannot be adsorbed well by the exfoliation adsorption pad.

The object of the present invention is to solve the above-mentioned problems of the prior art, and even if the wafer is tilted, the wafer is reliably sucked by the suction pad for peeling, and the wafers are easily peeled one by one with a small force and peeled. It is an object to obtain a wafer peeling/cleaning device that shortens the time and improves the efficiency as a whole by reliably transporting the wafer to the delivery device or the single wafer cleaning unit.

In order to solve the above-mentioned problems, the present invention separates a large number of wafers in a batch state, which are simultaneously cut, from a slice base one by one in a wafer separation sheet-fed portion, and separates the separated wafers into a single-wafer cleaning section. In the wafer stripping and cleaning apparatus for transporting the wafer to single-wafer cleaning and cleaning, and then collecting in a cassette in the collecting unit, the wafer-peeling single-wafer portion is a hot water tank in which hot water is stored and formed in a rectangular box shape, A work holder installed in the hot water tank for holding the wafer, and a first holder arranged such that the central axis thereof coincides with the central axis of the wafer in a state where the wafer is held by the workpiece holder. A peeling suction pad, a second peeling suction pad which is arranged below the first peeling suction pad and expands and contracts in the axial direction, and a first guide rail which is arranged along the longitudinal direction of the hot water tank. A first feed motor for moving the first and second peeling adsorption pads along the first guide rail along the longitudinal direction of the hot water tank, and the first and second peeling adsorption pads vertically. And a rotary actuator for vertically moving up and down.

Further, in the above, it is preferable that the second peeling suction pad is a bellows type vacuum suction pad.

Further, it is preferable that the first peeling suction pad is a flat vacuum pad having a flat surface, and has a stronger suction force than the second peeling suction pad.

Further, when the wafers in a batch state are peeled one by one to be separated into single wafers, the wafers are sucked and held by bringing the second peeling suction pads into contact with the end faces of the wafers and then pulling the wafers. It is preferable that the peeling suction pad is used to suck the central axis of the wafer.

Further, the wafer in the batch state has a stop plate for preventing the wafers from falling forward when the wafers in the batch state are peeled one by one to be separated into single wafers. It is desirable to pull the wafer toward the fall-off plate side with the vicinity of the bonding portion of the center as the center.

Further, a swinging rotary actuator for swinging the first and second peeling suction pads in a direction along the axis of the wafer is provided, and the swinging rotary actuator is driven to drive the first and second peeling suction pads. It is desirable to peel the wafer from the slice base by rocking the pad.

Further, it is preferable that a water supply nozzle is provided above the wafer vertically and hot water or water is supplied from near the center above the wafer vertically when the wafers are separated one by one.

Further, it has air nozzles provided on both side surfaces of the wafer, and the end surfaces of the wafer set in the hot water tank are suction-held by the first and second suction pads for peeling to separate the wafers one by one. In doing so, it is desirable to blow and supply air to the side surface of the wafer by the air nozzle.

Further, it is preferable that the air nozzle blow-supply air from the lower side to the upper side of the wafer.

Further, it is desirable that the air nozzle blow-supply air to a plurality of wafers in a batch state when peeling one wafer.

According to the present invention, even if the wafer is tilted, the wafer is reliably sucked by the peeling suction pad, and the time from the peeling work to transfer to the single wafer cleaning unit by the transfer device is shortened to improve the efficiency as a whole. The wafer peeling cleaning device can be obtained.

Plan view showing the overall configuration of the wafer peeling cleaning device Plan view showing the configuration of the wafer separation sheet-fed portion The top view which shows the structure of a peeling apparatus. Plane partial cross-sectional view showing the configuration of the delivery device Front view showing the configuration of the peeling device Side view showing the configuration of the peeling device Front view showing the structure of the wafer separation sheet-fed part Front view showing the configuration of the delivery device Side view partial cross-sectional view showing the configuration of the delivery device Enlarged side view of the main part showing the details of the adsorption part for peeling Enlarged front view of essential parts showing details of adsorption section for peeling Explanatory diagram of action of peeling Side view showing the structure of the single-wafer cleaning unit Plan view showing the configuration of the transport unit The top view which shows the structure of a collection part

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view showing the configuration of a wafer stripping and cleaning apparatus 1 according to the present invention, and FIG. 2 is a plan view showing the configuration of a wafer stripping single-wafer unit 100. As shown in FIG. 1, the wafer peeling/cleaning apparatus 1 of the present embodiment mainly includes a rough cleaning unit 10, a wafer peeling single-wafer unit 100, a transfer unit 310, a single-wafer cleaning unit 350, a detection unit 400, and a recovery unit 500. It is organized as a section. The outline of each main part is explained.

The rough cleaning unit 10 shower-cleans the wafers W (wafers W adhered to the slice base S) in a batch state immediately after being cut with a wire saw to remove the slurry attached at the time of cutting. The rough cleaning unit 10 includes a rough cleaning device 12 that cleans the wafer W. The rough cleaning device 12 has a cleaning step of immersing the mounting plate M on the upper side and the slice groove on the lower side for cleaning. When shaking, shake it up and down to create a water flow in the groove for cleaning. When the cleaning is completed, the wafer carried out from the rough cleaning unit 10 is directly conveyed to the next wafer separation sheet-fed unit 100 by the lifter.

In the wafer-separating sheet-by-wafer unit 100, the wafers W in a batch state are separated from the slice base S one by one to be separated into individual sheets. Then, the wafer separation sheet unit 100 is configured with a hot water tank 112, a separation device 114, and a delivery device 118 as main devices, as shown in FIG. The transfer device 118 is a device that receives the wafer separated from the slice base S by the separation device 114 and transfers it to the shuttle conveyor 312 of the transfer unit 310.

The transport unit 310 receives the wafer W that has been separated and separated into single wafers by the wafer separation single-wafer unit 100, and transfers the wafer W to the next single-wafer cleaning unit 350. Then, the wafer W is transferred to the single wafer cleaning unit 350 by the shuttle conveyor 312 provided in the transfer unit 310.

The single-wafer cleaning unit 350 performs single-wafer cleaning of the wafers W that have been separated and separated by the wafer separation and separation unit 100. The single-wafer cleaning unit 350 includes a single-wafer brush cleaning unit 352, a single-wafer pre-rinse unit 354, and a single-wafer rinse unit 356. The single-wafer brush cleaning unit 352 performs brush cleaning while applying a cleaning liquid to the back surface of the transferred wafer W. After the cleaning, in order to prevent the cleaning liquid from being brought into the next step, compressed air is sprayed to drain the cleaning liquid. Then, the wafer W for which the brush cleaning has been completed is transferred to the single-wafer pre-rinsing unit 354 in the next step.

The single-wafer pre-rinse unit 354 performs brush cleaning with a rotating brush while applying the pre-rinse liquid from the pre-rinse liquid nozzle to the back surface of the conveyed wafer. After cleaning, the compressed air is jetted to drain the liquid. Then, it is conveyed to the single-wafer rinse unit 356 in the next step.

The single-wafer rinse unit 356 cleans the back surface of the wafer with a rotary brush while applying the rinse liquid from the rinse liquid nozzle. After the cleaning, the drained wafer W is transferred onto the round belt conveyor 411 of the detection unit 400 and conveyed to a predetermined receiving position of the detection unit 400.

The detection unit 400 detects the presence or absence of cracks, chips, and adhesive residue for each wafer W that has been cleaned, and measures the thickness of each wafer W. Then, the wafer W that has been detected is delivered to the wafer transfer robot 508 of the recovery unit 500.

The wafer transfer robot 508 is an articulated robot, and has a rotatable hand unit 520 provided at the tip thereof, and the wafer W is sucked and held by a suction pad 522 provided at the tip of the hand unit 520 to be transferred. To be done. The recovery unit 500 separates the adhesive remaining wafers and defective wafers (cracked wafers, defective wafers, defective wafers, and scraps), so that two normal wafer recovery units 502A and 502B and a defective wafer are collected. And a residual adhesive wafer recovery unit 506 for recovering adhesive residual wafers.

Then, the wafer transfer robot 508 receives the wafer W from the detection unit 400, and sorts and stores the wafer W in the cassettes of the wafer recovery units 502, 504, and 506 based on the detection result.

Next, the details of the wafer separation sheet-by-sheet unit 100 will be described. 2 is a plan view showing the structure of the wafer separation sheet-fed portion 100, FIG. 3 is a plan view showing the structure of the separation device 114, FIG. 4 is a plan partial sectional view showing the structure of the delivery device 118, and FIG. 6 is a side view showing the configuration of the stripping device 114, FIG. 7 is a front view showing the configuration of the wafer stripping single-wafer unit 100, and FIG. 8 is a front view showing the configuration of the delivery device 118. 9 is a partial side sectional view showing the structure of the delivery device 118. The wafer-peeling single-wafer unit 100 is mainly composed of a hot water tank 112, a peeling device 114, and a delivery device 118.

The configuration of the hot water tank 112 will be described. The hot water tank 112 is formed in a rectangular box shape, and the hot water 120 is stored therein. The wafer W separated from the slice base S is set in the work holding part 122 provided in the hot water tank 112. Then, the wafer W is set on the work holding part 122, so that the slice base S bonded to the wafer W is immersed in the hot water 120. At this time, it is preferable that not all of the wafer W is immersed in the hot water 120 but up to 2-3 cm above the portion of the wafer W fixed with wax.

A schematic configuration of the peeling device 114 will be described mainly with reference to FIG. The peeling device 114 is a device that peels the wafers W set in the hot water tank 112 from the slice base S one by one. As shown in FIG. 2, FIG. 5, and FIG. 7, a pair of first guide rails 136, 136 are arranged near the right side portion of the hot water tank 112 along the longitudinal direction of the hot water tank 112. A first slide table (traveling body) 140 is slidably supported on the first guide rails 136 and 136 via linear guides 138 and 138 (FIG. 5).

A nut member 142 (FIG. 5) is fixed to the lower surface of the first slide table 140, and the nut member 142 is screwed to a screw rod 144 arranged between the pair of first guide rails 136, 136. ing. Both ends of the screw rod 144 are rotatably supported by bearing members 146 and 146, and one end of the screw rod 144 is provided with a first guide rail 136 or a first guide rail 136. The feed motor 148 (FIG. 6) is connected. The screw rod 144 is rotated by driving the first feed motor 148, and as a result, the first slide table 140 moves along the first guide rails 136, 136.

A peeling unit 150 for peeling the wafer W from the slice base S is provided on the first slide table 140. As shown in FIGS. 3, 5, and 6, the peeling unit 150 has a bearing block 152 provided on the first slide table 140. A support shaft 156 provided at the base end of the swing frame 154 is swingably supported by the bearing block 152.

A swing rotary actuator 160 is installed on the first slide table 140 via a bracket 158, and a drive gear 162 is fixed to the output shaft of the swing rotary actuator 160. A driven gear 164 is meshed with the drive gear 162, and the driven gear 164 is fixed to the tip of the rotary shaft 168. The rotating shaft 168 is rotatably supported by a bearing member 170, and the bearing member 170 is supported by a support plate 172 fixed to the swing rotary actuator 160.

A rotary plate 174 (FIGS. 5 and 6) formed in a disk shape is coaxially fixed to the driven gear 164, and one end of a connecting rod 176 is connected to the rotary plate 174 by a pin 178. .. The other end of the connecting rod 176 is connected to the swing frame 154 by a pin 180.

With the above configuration, the swing frame 154 swings around the support shaft 156 provided at the base end portion thereof by driving the swing rotary actuator 160. That is, when the swinging rotary actuator 160 is driven, the rotating plate 174 rotates reciprocally within the range of 180°, and the reciprocating rotation is transmitted to the swinging frame 154 via the connecting rod 176, and the swinging frame 154 swings.

A bearing unit 182 is provided on the upper end portion of the swing frame 154, and two rotary shafts 186 and 188 are rotatably supported by the bearing unit 182. Arms 190 and 192 are fixed to the tip ends of the rotary shafts 186 and 188, respectively, and the tip ends of the arms 190 and 192 are connected to the pad support plate 198 via pins 194 and 196, respectively. A pair of first and second peeling suction pads 200 and 201 are arranged on the pad support plate 198 at a predetermined interval. The first and second peeling suction pads 200 and 201 vacuum-chuck the wafer W. And hold.

A support plate 202 is attached to the back surface of the swing frame 154, and a lift rotary actuator 204 is installed on the support plate 202. A fan-shaped rotating plate 206 is fixed to the output shaft of the lifting rotary actuator 204, and one end of a connecting rod 208 is connected to the rotating plate 206 by a pin 210. The other end of the connecting rod 208 is connected to the one arm 190 by a pin 212.

With the above-described configuration, the first and second peeling suction pads 200 and 201 provided on the pad support plate 198 are moved vertically upward and downward by driving the vertical rotary actuator 204. That is, when the lifting rotary actuator 204 is driven, the rotary plate 206 reciprocally rotates in the range of 180°, and the reciprocal rotation is transmitted to the arm 190 via the connecting rod 208, and one arm 190 moves vertically in a reciprocal angular motion. I do. When the arm 190 makes a reciprocating angular motion, the arm 192 on the other side also performs a reciprocating angular motion to make a reciprocating angular motion, and as a result, the first and second peeling suction pads 200, 201 provided on the pad support plate 198. Is lifted vertically upwards.

The first and second peeling suction pads 200 and 201 for sucking and holding the wafer W are moved up and down by driving the lifting rotary actuator 204. Further, since the pad supporting plate 198 provided with the first and second peeling suction pads 200, 201 is connected to the swing frame 154 via the arms 190, 192, the swing frame 154 swings. By doing so, it swings back and forth.

That is, the first and second peeling suction pads 200 and 201 swing in the front-rear direction when the swing rotary actuator 160 drives, and move up and down when the lift rotary actuator 204 drives. Then, the wafer W is peeled from the slice base S by the first and second peeling suction pads 200 and 201 as follows.

The end surface of the wafer W set in the hot water tank 112 is sucked and held by the first and second peeling suction pads 200 and 201. Then, the swing rotary actuator 160 is driven to swing the first and second peeling suction pads 200, 201 in the front-rear direction (direction along the axis of the wafer). Here, since the adhesive that bonds the wafer W and the slice base S is immersed in the hot water 120, the adhesive is sufficiently softened. Therefore, the wafer W is separated from the slice base S by being shaken a plurality of times.

When the wafer W is peeled from the slice base S, the lift rotary actuator 204 is driven, and the first and second peeling suction pads 200 and 201 move upward while holding the peeled wafer W. Then, it stops at a predetermined delivery position. The wafer W transferred to the transfer position is transferred to the transfer device 118, then transferred to the shuttle conveyor 312 by the transfer device 118, and transferred to the next process by the shuttle conveyor 312.

On the other hand, the first and second peeling suction pads 200, 201 for which the transfer of the wafer W has been completed are driven by the lifting rotary actuator 204 to move downward and return to the original peeling work position. The wafer W is peeled from the slice base S by swinging the end surface of the wafer W by the first and second peeling suction pads 200 and 201. In the wafer W, the first and second peeling suction pads are included. Some of them have been peeled off from the slice base S before being rocked by 200 and 201.

In this case, the wafer W may fall forward and cannot be recovered. For this reason, a fall stop plate 214 for preventing the wafer W from falling forward is disposed at a position in front of the wafer W to be peeled off. The fall prevention plate 214 is provided on the support plate 202 on which the lifting rotary actuator 204 is installed, and swings together with the first and second peeling suction pads 200, 201.

The first and second adsorption pads 200 and 201 for peeling move up and down through a passage 214a formed in the fall plate 214. Further, a two-piece prevention plate 216 is fixed to the upper part of the fall prevention plate 214, and the wafer W separated from the slice base S passes through a slit 216 a formed in the two-piece prevention plate 216 and is predetermined. Will be transferred to the delivery position. The slit 216a is formed with a width that allows exactly one wafer W to pass therethrough (for example, a width of 1.1 to 1.5 times the thickness of the wafer W), so that two wafers are separated at the same time. In such a case, it is possible to prevent the two wafers from sticking to each other and being simultaneously transferred to the delivery position. Specifically, the width of the slit 216a is 1.1 to 1.5 times the thickness of the wafer W to prevent simultaneous transfer of two wafers and prevent damage to the surface. it can.

Here, it is preferable that the surface of the fall stop plate 214 be subjected to water repellent processing such as fluororesin processing. When the fall prevention plate 214 is not water-repellent processed, a water film is formed on the surface thereof, and the wafer W sticks to the fall prevention plate 214, so that when the wafer W is transferred to the delivery position through the slit 216a, This is because the first and second suction pads 200 and 201 for peeling may be displaced from or separated from each other, which makes it difficult to transfer. Since the water film is not formed by subjecting the surface of the stop plate 214 to the water repellent process, it is possible to prevent the wafer W from sticking to the stop plate 214.

Further, by making the surface of the fall stop plate 214 not a mirror-finished surface but a slightly rough surface, it is possible to suppress or prevent the wafer W from adsorbing to the fall stop plate 214, and this and the water repellent treatment are performed. By using them together, it is possible to more reliably prevent the wafer W from sticking to the stop plate 214.

As a result, even when two wafers are simultaneously peeled from the slice base and adhered to each other, the two wafers are adhered to the first wafer when passing through the slit 216a of the two-piece prevention plate 216. Since the second wafer cannot pass through the slit 216a and falls, it can always be transferred one by one to the delivery position. In this case, since the wafer which cannot pass through the slit 216a and is dropped is prevented from falling forward by the stop plate 214, the wafer can be reliably collected at the next peeling.

Next, a schematic configuration of the delivery device 118 will be described. The delivery device 118 is a device that receives the wafer W peeled from the slice base S by the first peeling suction pad 200 of the peeling device 114 from the first peeling suction pad 200 and delivers it to the shuttle conveyor 312. The delivery device 118 is provided on the second slide table 240 of the drive unit 222 as shown in FIGS. 2, 4 and 7, 8, and 9, and drives the second feed motor 248 to move the second device. It moves along the guide rails 236, 236.

On the second slide table 240 of the drive unit 222, a column 274 is erected vertically. A support frame 276 is vertically installed upright on the top of the column 274, and a rotary rotary actuator 278 is horizontally installed on the support frame 276. A drive gear 280 is meshed with the output shaft of the rotary rotary actuator 278, and a driven gear 282 fixed to the rotary shaft 284 is meshed with the drive gear 280. The swivel shaft 284 is rotatably supported by a bearing unit 286 installed on the top of the support frame 276, and swivels in a range of 180° by driving a swiveling rotary actuator 278.

A swivel frame 288 is fixed to the base end of the swivel shaft 284, and a rotary shaft 290 is rotatably supported by the swivel frame 288. An output shaft of a direction changing rotary actuator 292 installed on the revolving frame 288 is fixed to a base end portion of the rotating shaft 290. By driving the direction changing rotary actuator 292, the rotation shaft is rotated within a range of 90°. Move.

An L-shaped swivel arm 294 is fixed to the tip of the rotary shaft 290, and a support plate 296 is fixed to the tip of the swivel arm 294. A pad advancing/retreating cylinder 298 is provided on the support plate 296, and a delivery suction pad 300 is provided at the tip of the rod of the pad advancing/retreating cylinder 298. The wafer W peeled by the first and second peeling suction pads 200 and 201 of the peeling device 114 is transferred to a predetermined transfer position and then transferred to the transfer suction pad 300.

In the delivery device 118, the wafer W sucked and held by the delivery suction pad 300 is swung in the range of 180° on the vertical plane by driving the swiveling rotary actuator 278 to drive the direction changing rotary actuator 292. By doing so, the direction is changed from the vertical state to the horizontal state.

The reception of the wafer W separated by the separation device 114 and the transfer of the received wafer W onto the shuttle conveyor 312 are performed as follows. The wafer W separated from the slice base S is lifted while being sucked and held by the first and second peeling suction pads 200 and 201, and is transferred to a predetermined delivery position. The delivery suction pad 300 is already on standby at the delivery position, and the wafer W is located coaxially with the axis of the delivery suction pad 300.

When the wafer W is transferred to the delivery position, the pad advancing/retreating cylinder 298 is then driven to advance the delivery suction pad 300 by a predetermined amount toward the wafer W. As a result, the delivery suction pad 300 comes into close contact with the end surface of the wafer W. Next, the delivery suction pad 300 is driven, and the wafer W is suction-held by the delivery suction pad 300. The fact that the wafer W is suction-held on the delivery suction pad 300 is detected by a pressure switch (not shown) provided on the delivery suction pad 300 side.
Here, the pressure switch can be installed at any position where the pressure in the delivery suction pad 300 can be detected and at a position where suction of the wafer W is not hindered. For example, a pressure switch can be installed in an air suction pipe (not shown) for operating the delivery suction pad 300, which is arranged in the swivel arm 294. It is not limited to the inside of the swivel arm 294 as long as the pressure in the pipe can be detected, and it may be installed anywhere between the part where the air suction pipe goes out of the swivel arm 294 and is connected to the air suction pump (not shown). Is also good. Alternatively, a pressure switch may be installed inside the part of the swivel arm 294 to which the delivery suction pad 300 is connected so that the pressure in the delivery suction pad 300 can be directly detected.
Then, according to this detection signal, the vacuum suction of the first peeling suction pad 200 is released, that is, air is flowed in. As a result, the wafer W is transferred from the first peeling suction pad 200 to the delivery suction pad 300. The vacuum suction of the second peeling suction pad 201 may be released at the same time as the release of the first peeling suction pad 200. However, it may be released before the wafer W is raised or transferred to the delivery position, and the posture of the wafer W is more stable in that case.

The delivery suction pad 300 that has received the wafer W starts driving the pad advancing/retreating cylinder 298 in response to the detection signal from the pressure switch, and retracts from the first peeling suction pad 200. Similarly, the first peeling suction pad 200 that has delivered the wafer W starts to descend by the detection signal from the pressure switch and returns to the original peeling work position. When the delivery suction pad 300 moves backward, the rotary rotary actuator 278 is driven, and the rotary arm 294 pivots 180°. As a result, the wafer W is transferred to the position above the shuttle conveyor 312. Note that a sensor, a device, or the like having a similar function such as a touch sensor can be used instead of the pressure switch.

Since the wafer W transferred above the shuttle conveyor 312 is orthogonal to the shuttle conveyor 312, the rotary actuator 292 for direction change is driven after the transfer so that the revolving arm 294 moves around the rotation axis 290. Rotate 90°. As a result, the wafer W is positioned horizontally from the shuttle conveyor 312 at a predetermined height.

After driving the direction changing rotary actuator 292, the pad advancing/retreating cylinder 298 is driven to advance the delivery suction pad 300 toward the shuttle conveyor 312 by a predetermined amount. As a result, the wafer W is placed on the shuttle conveyor 312. When the wafer W is placed on the shuttle conveyor 312, the driving of the delivery suction pad 300 is stopped. Then, the pad advancing/retreating cylinder 298 is driven, and the delivery suction pad 300 retreats from the shuttle conveyor 312.

After the delivery work of the wafer W is completed, the delivery suction pad 300 returns to the original delivery position by the operation reverse to the above. On the other hand, the shuttle conveyor 312 to which the wafer W has been transferred is driven by a driving unit (not shown) to transfer the transferred wafer W to the next process. Note that the drive of the wafer separation sheet unit 100 is all automatically controlled by a control device (not shown), and each component device operates based on a drive signal output from the control device.

Next, the details of the wafer peeling method in the wafer peeling single-wafer unit 100 will be described. In the state before starting, the first slide table 140 on which the peeling unit 150 is installed is located at one end (lower end in FIG. 2) of the first guide rail 136 (this position is referred to as a peeling work start position). .. On the other hand, the second slide table 240 on which the delivery device 118 is installed is located at the other end (upper end in FIG. 2) of the second guide rail 236.

The wafer W multi-cut with a wire saw is set in the work holding part 122 provided in the hot water tank 112. As a result, the slice base S to which the wafer W is bonded is immersed in the hot water 120 stored in the hot water tank 112. The wafer W may be set manually by an operator, or may be automatically conveyed to the work holding unit 122 by a manipulator (not shown) and automatically set.

When the wafer W is set in the hot water tank 112, the control device first drives the second feed motor 248 to move the second slide table 240 downward in FIG. Next, the second slide table 240 is positioned at a predetermined start position of the delivery work. Then, when the second slide table 240 is located at the start position of the delivery work, the peeling work of the wafer W is started.

Next, the control device drives the first feed motor 148 and the second feed motor 248 in synchronization with each other to move the first slide table 140 and the second slide table 240 forward (move them upward in FIG. 2). A non-contact type position sensor 214S is provided on the pad supporting plate 198 of the peeling device 114 provided on the first slide table 140, and the position sensor 214S has a predetermined distance to the end surface of the wafer W. It works when it reaches.

The control device stops driving the first feed motor 148 and the second feed motor 248 by inputting the operation signal of the position sensor 214S, and stops the first slide table 140 and the second slide table 240. As a result, the first and second peeling suction pads 200 and 201 of the peeling device 114 provided on the first slide table 140 come into contact with the end surface of the wafer W. The control device drives the first and second peeling suction pads 200 and 201 that are in contact with the end surface of the wafer W, and causes the first and second peeling suction pads 200 and 201 to suck and hold the wafer W.

FIG. 10 is an enlarged side view of an essential part showing the details of the peeling adsorption portion, and FIG. 11 is an enlarged front view. The tilting plate 214 has the end surface side of the wafer W as a reference surface, and the pressing plate 214-1 made of resin for protecting the surface and the stainless plate 214 made of stainless steel for ensuring flatness of the pressing plate 214-1 on the opposite side. It is -2. Here, it is preferable that the surface of the resin pressing plate 214-1, which is the surface on the side where the wafer W contacts, is subjected to water repellent treatment such as fluororesin treatment as described above. It is more preferable that the surface is not a mirror surface and has a surface roughness such that the wafer W is not adsorbed. Further, the first peeling suction pad 200 is arranged such that its central axis coincides with the central axis of the wafer W, and the second peeling suction pad 201 is arranged below the first peeling suction pad 200. .. The first peeling suction pad 200 is a flat vacuum pad suitable for transporting a work having a flat surface, and has a stronger suction force than the second peeling suction pad 201. The second peeling suction pad 201 is a bellows-type vacuum suction pad having a bellows shape that expands and contracts in the axial direction.

The wafer W is bonded to the slice base S with an adhesive, and is arranged so as to be on the upper side of the mounting plate M, and then set on the work holding portion 122 of the hot water tank 112. Here, since the adhesive that bonds the wafer W and the slice base S is immersed in the hot water 120, the adhesive is sufficiently softened. An air supply mechanism is provided beside the slice base S, and air nozzles 80 and 81 are provided on both lower side surfaces of the wafer W. The air nozzles 80 and 81 are installed so as to blow air from the lower side to the upper side of the side surface 2 of the wafer W, that is, to blow the air vigorously. A water supply nozzle (not shown) is provided vertically above the wafer W near the center of the wafer.

The suction holding of the wafer W by the first and second peeling suction pads 200 and 201 is performed as follows. First, the second peeling suction pad 201 contacts the end surface of the wafer W. The second peeling suction pad 201 is arranged below the central axis of the wafer W, and can be expanded and contracted in the axial direction like a bellows type vacuum suction pad. Even if the surface of the adsorbent is inclined to some extent, the adsorption part of the adsorption pad is of a type that can be inclined to the surface of the adsorbed object to some extent.

As a result, even if the wafer W is tilted as shown in FIG. 12, the suction portion of the second peeling suction pad 200 can surely suck the wafer W by the inclination of the wafer W. The root of the wafer W can be pulled toward the fall stop plate 214 side with the vicinity of the bonded portion of W as the center. As a result, the peeling work is started reliably and efficiently.

FIG. 12 is an explanatory diagram of the operation of the peeling work. When peeling one wafer W, the air nozzles 80 and 81 are used to remove the wafer W from both sides as shown by arrows F and G. Air is blown from side to side.

Specifically, air is blown and supplied between at least the first and second wafers W, which are the leftmost first wafer W to be separated in FIG. In addition, it is desirable that the air is blown between the second and third sheets and between the third and fourth sheets in order to separate efficiently. However, since the adhesive agent that adheres the wafer W and the slice base S to each other while performing the peeling work of several sheets is sufficiently softened because it is immersed in the hot water 120, the peeling work is performed. It is also possible to reduce the number of sheets to be blow-fed at the same time as the above procedure.

On the other hand, by supplying hot water or water from near the center above the wafer W in the vertical direction as shown by the arrow H, the water is supplied from the center, and it is possible to ensure a certain gap in the center. Then, by flowing air from both side surfaces of the wafer W, the gaps on both sides can be maintained in a well-balanced manner, and the edges of the wafer can be cut cleanly.

That is, the water film is removed by supplying air, the wafers W are prevented from sticking to each other due to the surface tension of water, the edge is cut off, and when one wafer W is lifted, the next wafer is lifted together. It can be prevented. Further, air is blow-supplied to a plurality of wafers, in particular, air is blown between the first wafer and the second wafer and between the second wafer and the third wafer, so that It is also possible to avoid the contact between the standby wafer W (second sheet) and the next standby wafer W (third sheet). As a result, the efficiency can be improved in continuing the peeling work in sequence.

After pulling the wafer W toward the stop plate 214 by the second peeling suction pad 201, the central axis of the wafer W is firmly sucked by the first peeling suction pad 200 which is a flat vacuum pad having a flat surface. To do. Therefore, the wafer W can be handled in a short time in a state suitable for transporting the wafer W, and the risk of dropping or the like can be eliminated during the process.

Next, the control device drives the swinging rotary actuator 160 to swing the swinging frame 154 back and forth to move the first and second peeling suction pads 200 and 201 back and forth (direction along the axis of the wafer). Rock to. In addition, the first and second peeling suction pads 200 and 201 swing around the bonded portion between the wafer W and the slice base S as the swing center. Therefore, the wafer W is swung a plurality of times by the first and second suction pads 200 and 201 for peeling, and is easily peeled from the slice base S. Further, the wafer W can be peeled from the root by swinging back and forth during peeling, and the wafer W can be efficiently peeled as a whole.

The control device stops the drive of the swing rotary actuator 160 when the first and second peeling suction pads 200, 201 are swung a predetermined number of times. Next, the lifting rotary actuator 204 is driven to rotate the arms 190 and 192 upward, and the first and second peeling suction pads 200 and 201 are moved upward. At this time, the central axis of the wafer W is firmly fixed by the first peeling suction pad 200.

The wafer W sucked and held by the first peeling suction pad 200 is guided by a pressing plate 214-1 made of resin (for example, fluorocarbon resin) having good slidability and fixed to the upper portion of the fall prevention plate 214. It also passes through the slit 216a (FIG. 3) of the two-sheet removal prevention plate 216. This prevents double picking.

That is, even when the wafer W to be next peeled is adhered to the wafer W mainly sucked and held by the first peeling suction pad 200, the stuck wafer W is slit when passing through the slit 216a. Since it is peeled off when passing through 216a, it is possible to always take out only one wafer W that is adsorbed by the first exfoliation adsorption pad 200.

Further, the falling plate that cannot pass through the slit 216a is prevented from falling forward by the stop plate 214, so that the wafer is reliably collected at the next peeling. At this time, since the end surface side of the wafer W contacts the pressing plate 214-1 made of resin (for example, fluororesin) having very high surface lubricity, scratches are prevented.

The first and second peeling suction pads 200, 201 that have moved upward stop with the chain line position in FIG. 8 as the delivery position. At the delivery position, the delivery suction pad 300 of the delivery device 118 is on standby, and the wafer W whose end surface is suction-held by the first peeling suction pad 200 that firmly sucks the central axis of the wafer W is used for delivery. It is located coaxially with the axis of the suction pad 300.

The delivery position is a position where the delivery suction pad 300 is substantially horizontal (the position where the revolving arm 294 is horizontal in FIG. 8) and the wafer W remains in the vertical state, so that the influence of wafer deflection due to gravity is exerted. It is a difficult position to receive. Further, after the transfer, the suction pads 200 and 201 can immediately return to the peeling operation of the next wafer W, and the efficient peeling work can be sequentially continued.

When the first and second peeling suction pads 200, 201 stop at a predetermined delivery position, the control device drives the pad advancing/retreating cylinder 298 to advance the delivery suction pad 300 toward the wafer W by a predetermined amount. .. As a result, the delivery suction pad 300 is in close contact with the back surface of the end surface of the wafer W sucked by the first peeling suction pad 200. Then, the wafer W is suction-held by the delivery suction pad 300 on the back surface as well as the end surface on the first peeling suction pad 200 side.

The fact that the wafer W is suction-held on the delivery suction pad 300 is detected by a pressure switch (not shown) provided on the delivery suction pad 300 side. Then, according to this detection signal, the vacuum suction of the first and second peeling suction pads 200, 201 is released, that is, air is introduced. The delivery suction pad 300 is a flat vacuum pad having a flat surface like the first peeling suction pad 200, and firmly sucks the central axis of the wafer W. As a result, the wafer W is transferred from the first peeling suction pad 200 to the delivery suction pad 300, and the central axis of the wafer W is firmly sucked by the delivery suction pad 300. Therefore, it becomes possible to handle the wafer W in a state suitable for transporting the wafer W, and it is possible to eliminate the risk of dropping during the process.

Next, the control device drives the pad advancing/retreating cylinder 298 to retract the delivery suction pad 300 from the first peeling suction pad 200. With the retraction of the delivery suction pad 300, the control device drives the elevating rotary actuator 204 to rotate the arms 190 and 192 downward to move the first and second peeling suction pads 200 and 201 downward. , Return to the original peeling work position.

On the other hand, after driving the pad advancing/retreating cylinder 298, the control device drives the revolving rotary actuator 278 to revolve the revolving arm 294 by 180° and transfers the wafer W to a position above the shuttle conveyor 312. After the transfer, the direction changing rotary actuator 292 is driven. The swivel arm 294 rotates 90° about the rotation axis 290.

As a result, both end surfaces of the wafer W become parallel to the shuttle conveyor 312. The control device drives the pad advancing/retreating cylinder 298 to advance the delivery suction pad 300 toward the shuttle conveyor 312. As a result, the wafer W is placed on the shuttle conveyor 312. Next, the control device stops the driving of the transfer suction pad 300 and transfers the wafer W to the shuttle conveyor 312.

After stopping the driving of the delivery suction pad 300, the control device drives the pad advancing/retreating cylinder 298 to retract the delivery suction pad 300 from the shuttle conveyor 312, and drives the shuttle conveyor 312 to move the wafer W to the next position. Transfer to the process. After driving the pad advancing/retreating cylinder 298, the control device drives the direction changing rotary actuator 292 and the turning rotary actuator 278 to return the delivery suction pad 300 to the original delivery position.

By the time the delivery suction pad 300 returns to the delivery position, the suction pads 200 and 201 are peeling off the next wafer W, so the peeling work of the second wafer W is completed. Therefore, the wasteful time is reduced and the efficient peeling work is sequentially continued.

That is, the delivery of the first wafer W is completed in a series of steps, the suction pads 200 for delivery are retracted, and the suction pads 200 and 201 are returned to the original peeling work positions. Then, the control device drives the first feed motor 148 and the second feed motor 248 in synchronization with each other to advance the first slide table 140 and the second slide table 240 by a predetermined amount. As a result, the first and second peeling suction pads 200, 201 come into contact with the end surface of the wafer W to be peeled off for the second sheet. The control device separates the second wafer W by the same method as described above.

As described above, the wafer W adhered to the slice base S is sequentially peeled off and conveyed to the next step, and the one cycle peeling work is completed. Next, the transfer unit 310 receives the wafer W separated and separated by the wafer separation and separation unit 100, and conveys the wafer W to the next single-wafer cleaning unit 350. The transfer section 310 is provided with a shuttle conveyor 312, and the wafer W is transferred to the single-wafer cleaning section 350 by the shuttle conveyor 312.

The single-wafer cleaning unit 350 performs single-wafer cleaning of the wafers W that have been separated and separated by the wafer separation and separation unit 100. The single-wafer cleaning unit 350 includes a single-wafer brush cleaning unit 352, a single-wafer pre-rinsing unit 354, and a single-wafer rinsing unit 356.

FIG. 13 is a side view showing the structure of the single-wafer cleaning unit 350. The single-wafer brush cleaning unit 352 has a chamber-structured cleaning tank (not shown). As shown, a pair of rotating brushes 378, 378, a pair of cleaning liquid nozzles 380, 380 for flowing a cleaning liquid, two pairs of wafer conveying roller conveyors 382, 382, 382, 382, and a pair of liquid removing air. Knife nozzles 384, 384 are provided.

In the single-wafer brush cleaning unit 352, brush cleaning is performed by the rotating brushes 378 and 378 while applying the cleaning liquid from the cleaning liquid nozzles 380 and 380 to the back surface of the wafer W transferred by the shuttle conveyor 312 of the transfer unit 310. After the cleaning, in order to prevent the cleaning liquid from being brought into the next step, compressed air is jetted from the air knife nozzles 384 and 384 to drain the liquid. Then, the wafer W for which the brush cleaning has been completed is transferred to the single-wafer pre-rinse unit 354 in the next step by the roller conveyor 382.

The single-wafer pre-rinsing unit 354 has the same configuration as the single-wafer brush cleaning unit 352. In the single-wafer pre-rinsing unit 354, brush cleaning is performed by the rotating brush while applying the pre-rinse liquid from the pre-rinse liquid nozzle to the back surface of the wafer conveyed by the roller conveyor 382 of the single-wafer brush cleaning unit 352. After cleaning, the compressed air is jetted to drain the liquid. Then, the wafer W after the brush cleaning is carried to the single-wafer rinse unit 356 in the next process by the roller conveyor.

The single-wafer rinse unit 356 has substantially the same structure as the single-wafer brush cleaning unit 352. In the single-wafer rinsing unit 356, the back surface of the wafer conveyed by the roller conveyor of the single-wafer rinsing unit is brush-cleaned by the rotary brush while applying the rinsing liquid from the rinsing liquid nozzle. After cleaning, the wafer W is transported to the next detection unit 400 by the roller conveyor.

The detection unit 400 detects the presence or absence of cracks, chips, and adhesive residue for each cleaned wafer W and measures the thickness of each wafer W. The detection unit 400 lifts the transfer unit 402 for transferring the wafer W, which has been cleaned by the single-wafer cleaning unit 350, to a predetermined receiving position and the wafer W transferred to the receiving position to a predetermined detection position. A rotary drive unit that rotates, a thickness measurement unit that measures the thickness of the wafer W that is rotated by the rotary drive unit, and a crack, a chip, or an adhesive residue on the wafer W that is rotated by the rotary drive unit. The defective wafer detection unit is composed of a defective wafer detection unit and a delivery unit for delivering the detected wafer W to the wafer transfer robot of the next recovery unit 500.

FIG. 14 is a plan view showing the configuration of the transport unit 402, and the transport unit 402 includes a round belt conveyor 411. The round belt conveyor 411 is connected to the terminal end of the single-wafer cleaning unit 350. A pair of guide members 411a and 411a are provided on both sides of the round belt conveyor 411, and the wafer W is guided by the guide members 411a and 411a so as to move straight.

At the end position of the round belt conveyor 411, five positioning pins 412, 412,... Are arranged so as to form an arc, as shown in FIG. 14, and the positioning pins 412, 412,. The wafer W conveyed by 411 is brought into contact with the wafer W so that the wafer W is positioned at a predetermined receiving position. Further, when the wafer W comes into contact with the positioning pins 412, 412,..., A sensor (not shown) is activated, and by driving this sensor, the driving of the round belt conveyor 411 is stopped. Then, the wafer W that has been detected is delivered to the wafer transfer robot 508 of the recovery unit 500.

FIG. 15 is a plan view showing the configuration of the recovery unit 500. The wafer recovery units 502A and 502B are each provided with upper and lower two-stage cassette holders (not shown). The cassette holder is supported by a cassette positioning mechanism (not shown) so as to be movable up and down, and two wafer recovery cassettes 510A and 510B for recovering the wafer W are set in the cassette holder two by two.

Like the wafer recovery units 502A and 502B, the defective wafer recovery unit 504 and the adhesive remaining wafer recovery unit 506 each include a cassette holder (not shown), and the cassette holder is movably supported by a cassette positioning mechanism (not shown). ing. Then, a defective wafer recovery cassette 512 for recovering the defective wafer W and an adhesive residual wafer recovery cassette 514 for recovering the adhesive residual wafer W are set in the cassette holder.

Further, when one wafer W is stored, a cassette positioning mechanism (not shown) is driven to raise the wafer collecting cassette 510A for one partition. The wafer peeling/cleaning apparatus 1 of the present embodiment is configured as described above. It should be noted that each of the components of the wafer peeling/cleaning apparatus 1 is drive-controlled by a controller (not shown), and operates based on a drive signal output by the controller.

The wafer peeling/cleaning apparatus 1 described above is a case of peeling and cleaning a sliced wafer cut by a normal cutting method (a method of cutting only one ingot for one cutting). Wafers W in a batch state cut by a wire saw are transferred to the wafer peeling/cleaning apparatus 1 by a transfer device (not shown).

Then, the wafer peeling/cleaning apparatus 1 is mounted on a lifter (not shown). The wafer W mounted on the lifter is first transferred to the rough cleaning unit 10 by the lifter. Then, there is shower cleaning, and the slurry attached at the time of cutting is removed. The shower cleaning in the rough cleaning unit 10 is performed while being mounted on the lifter, and when the shower cleaning is completed, the wafer is transferred to the wafer-separated single-wafer unit 100.

The wafer W transferred to the wafer separation sheet-by-sheet unit 100 is first inverted upside down by the inversion mechanism provided in the lifter (wafer W is placed above the mounting plate M). After that, it is set in the work holding part 122 of the hot water tank 112. The wafers W set in the work holding unit 122 are peeled from the slice base S one by one by the first and second peeling suction pads 200 and 201, and the peeled wafers W are sequentially transported by the shuttle conveyor of the transport unit 310. Transferred to 312. Then, it is conveyed to the single-wafer cleaning unit 350 by the shuttle conveyor 312.

The above operation is performed for each wafer W separated from the slice base S, and the operation ends when all the wafers W are stored in the cassette. After completion, each device returns to the state before starting.

The wafer peeling/cleaning apparatus 1 can peel and clean a sliced wafer cut by a multi-cutting method (a method of simultaneously cutting different types of ingots for one cutting). A case where a wafer cut by the multi-cutting method is peeled off and washed will be described.

Wafers cut by the multi-cutting method need to be collected for each type of wafer, and thus are processed as follows. The steps until the wafer is transferred to the wafer separation sheet-fed portion 100 are the same as those of the wafer cut by the above-described normal cutting method.

When the multi-cut wafer W is set on the work holding unit 122 of the wafer separation sheet unit 100, a partition plate (not shown) of a partitioning device is set between lots of the wafers W. Then, when the partition plate is set, the peeling work by the first peeling suction pad 200 is started. The peeling operation is first performed from the first lot of wafers W, and the peeled wafers W are sequentially transferred onto the shuttle conveyor 312 of the transfer unit 310.

When the peeling of the wafers W of the first lot is completed, the first partition plate (not shown) inserted between the first lot and the second lot is detected. When the first partition plate is detected, the control device determines that the wafer to be subsequently peeled is the wafer W of the second lot. As a result, the wafers can be sorted for each lot, and the wafers can be collected without mixing different types of wafers.

When the separation of the wafers W of the second lot is completed, the second partition plate (not shown) inserted between the second lot and the third lot is detected, and the control device detects the second partition plate. To do. After that, the wafer to be peeled is determined to be the wafer W of the third lot.

According to the above, in the wafer peeling single-wafer unit 100, when the end face of the wafer is sucked and held by the peeling suction pad and peeled one by one, the air is blown by the air nozzle, so that the gap between the wafers in the batch state A good balance can be secured, damage to the wafer can be eliminated, and only one wafer can be efficiently lifted. Then, after that, the steps of the transport unit 310, the single-wafer cleaning unit 350, the detection unit 400, and the recovery unit 500 can be smoothly progressed, and an efficient wafer peeling and cleaning apparatus 1 can be provided.

[Appendix A]
The present invention also includes the following.
(Appendix A Item 1)
A large number of wafers in a batch state, which have been simultaneously cut, are separated from the slice base one by one in the wafer separation sheet-by-sheet separation section to be separated into single wafers, and the separated wafers are conveyed to a single-wafer cleaning section for single-wafer cleaning and after cleaning. , In the wafer peeling cleaning device that collects in the cassette in the collecting unit,
The wafer separation sheet-fed portion,
A hot water tank formed in a rectangular box shape and storing hot water,
A work holding unit installed in the hot water tank to hold the wafer to be peeled,
A peeling suction pad for sucking and holding one end surface of the wafer,
A first guide rail arranged along the longitudinal direction of the hot water tank;
A first feed motor for moving the peeling adsorption pad along the first guide rail along the longitudinal direction of the hot water tank;
A lifting rotary actuator that vertically moves the peeling suction pad vertically,
An air nozzle provided on the side surface of the wafer,
And blowing air to the side surface of the wafer by the air nozzle when peeling the wafers one by one by suction holding the end face of the wafer set in the hot water tank with the peeling suction pad. Wafer stripping and cleaning device.

(Appendix A Item 2)
The wafer peeling and cleaning apparatus according to appendix A, wherein the air nozzles are provided on both side surfaces of the wafer.

(Appendix A Item 3)
The wafer peeling and cleaning apparatus according to item A or 1 above, wherein the air nozzle is provided below the wafer.

(Appendix A Item 4)
4. The wafer peeling cleaning apparatus according to any one of appendices A to 1, wherein the air nozzle blows and supplies air from the lower side to the upper side of the wafer.

(Appendix A Item 5)
5. The wafer peeling/cleaning apparatus according to any one of Supplementary Notes A to 4, wherein the air nozzle blows air to a plurality of wafers in a batch state when the wafer is peeled off. ..

(Appendix A Item 6)
6. The air nozzle blows and supplies air between at least the first and second wafers when peeling off one of the wafers, according to any one of Supplementary Notes A to 1-5. Wafer stripping and cleaning equipment.

(Appendix A Item 7)
Note A, wherein the air nozzle blows air between the first and second sheets and between the second and third sheets when peeling one of the wafers. 7. The wafer peeling cleaning apparatus according to any one of 1 to 6.

(Appendix A Item 8)
A water supply nozzle is provided above the wafer in the vertical direction, and when peeling the wafers one by one, hot water or water is supplied from near the center above the wafer in the vertical direction. The wafer peeling cleaning apparatus according to any one of 1.

(Appendix A Item 9)
A swing rotary actuator that swings the peeling suction pad in the direction along the axis of the wafer is provided, and the peeling suction pad is swung to swing the peeling suction pad to move the wafer. The wafer peeling/cleaning apparatus according to any one of appendices A to 1, which is peeled from the slice base.

(Appendix A Item 10)
10. The wafer peeling cleaning apparatus according to appendix A, wherein the center of the swing is set in the vicinity of a bonded portion between the slice base and the wafer.

According to the wafer peeling cleaning apparatus of the present invention, the following problems of the invention described in Patent Document 1 can be solved.
In the invention described in Patent Document 1, since the wafer is rocked in the direction along the axis, it is desirable in terms of efficiently separating the wafer, but when the wafer is lifted at the wafer separation sheet-fed portion, the next wafer Can be lifted with him.
・The standby wafer next to the lifted wafer and the second standby wafer next to it may adhere to each other, which may cause damage such as cracks, chips, chipping, and microcracks on the wafer. ..

According to the wafer peeling/cleaning apparatus of the present invention, the air nozzle is provided on the side surface of the wafer, and when the edge surface of the wafer is sucked and held by the suction pad for peeling and peeled one by one, air is blown by the air nozzle. It is possible to secure a well-balanced gap between batch-shaped wafers. Therefore, when the wafer is lifted, the next wafer is not lifted up together, and it is possible to efficiently lift one wafer without damaging the wafer.

[Appendix B]
The present invention also includes the following.
(Appendix B Item 1)
A large number of batch-cut wafers that have been cut at the same time are separated one by one from the slice base in the wafer separation sheet-feeding unit, and the separated wafers are delivered to a delivery device at a delivery position, and the delivery device performs single-wafer cleaning. In the wafer peeling and cleaning apparatus, in which the wafer is conveyed to the cleaning unit and washed single-wafer, and after cleaning, it is collected in the cassette in the collecting unit.
A peeling suction pad that sucks and holds the end face of the wafer, a lifting rotary actuator that vertically moves the peeling suction pad vertically, and a fall plate provided on a support plate on which the lifting rotary actuator is installed. And a wafer separation sheet-fed part having a two-piece removal prevention plate having a slit formed on the top of the stop plate and fixed to the stop plate,
A delivery suction pad that receives the wafer that has been stripped by the wafer stripping sheet from the stripping suction pad, and a pressure switch that detects that the wafer has been suction-held on the delivery suction pad, A delivery device,
With a detection signal from the pressure switch, the vacuum suction of the peeling suction pad is released, and a control device that starts retreating from the peeling suction pad of the delivery suction pad and lowering of the peeling suction pad,
A wafer peeling/cleaning apparatus comprising:

(Appendix B Item 2)
The wafer peeling/cleaning apparatus according to Appendix B, wherein the fall prevention plate is provided with a resin pressing plate on the end face side of the wafer.

(Appendix B Item 3)
The wafer stripping and cleaning apparatus as described in appendix B, wherein a stainless steel plate made of stainless is provided on the opposite side of the pressing plate.

(Appendix B, Item 4)
The wafer sucked and held by the peeling suction pad is guided by the pressing plate, passes through the slit, and stops at the delivery position. The wafer peeling cleaning device according to the item.

(Appendix B, Item 5)
5. The wafer peeling cleaning apparatus according to any one of appendices B to 1 to 4, wherein the delivery suction pad and the peeling suction pad are flat vacuum pads.

(Appendix B, Item 6)
The width of the slit is 1.1 to 1.5 times the thickness of the wafer, and the wafer peeling cleaning apparatus according to any one of appendices B to 1-5.

(Appendix B Item 7)
Item 7. The supplementary item B to any one of items 1 to 6, wherein the delivery suction pad has a swivel arm provided at its tip, and the delivery position is a position where the swivel arm is horizontal. Wafer stripping and cleaning equipment.

(Appendix B, Item 8)
8. The wafer peeling/cleaning apparatus according to any one of appendixes B to 1, wherein the wafer is positioned coaxially with the axis of the delivery suction pad at the delivery position.

The wafer peeling cleaning apparatus according to the present invention can solve the following problems of the invention described in Patent Document 1.
That is, in the device described in Patent Document 1, if the wafer is sucked by the peeling suction pad and the speed of moving the peeling suction pad upward is increased, the surface of the wafer may be damaged. Further, at the delivery position, the delivery suction pad is retracted from the peeling suction pad position and then the peeling suction pad is returned to the original peeling work position. Therefore, the timing of starting the peeling work is delayed, and the peeling work is sequentially performed. There is wasted time above. Furthermore, since the timing at which the wafer is delivered to the delivery suction pad is not clear, if the timing of moving the peeling suction pad downward is too early, the surface of the wafer is rather scratched, or cracks or chips, chipping, microcracks, etc. There is a risk of causing damage.
According to the present invention, it is possible to obtain a wafer peeling/cleaning apparatus which improves the efficiency as a whole by shortening the time from the peeling operation to the time when the wafer is transferred to the single-wafer cleaning section without damaging the wafer. ..

DESCRIPTION OF SYMBOLS 1... Wafer peeling cleaning device, 10... Rough cleaning part, 12... Rough cleaning device, 100... Wafer peeling single-wafer part, 310... Conveying part, 350... Single-wafer cleaning part, 400... Detection part, 500... Collection part 112... Hot water tank, 114... Stripping device, 118... Delivery device, 120 Hot water,
122... Work holding part, 312... Shuttle conveyor, 352... Single-wafer brush cleaning part, 354... Single-wafer pre-rinsing part, 356... Single-wafer rinsing part, 402... Transfer unit, 508... Wafer transfer robot,
136... First guide rail, 138... Linear guide, 140... First slide table, 142... Nut member, 144... Screw rod, 148... First feed motor,
150... Peeling unit 152... Bearing block, 154... Oscillating frame, 160... Oscillating rotary actuator, 162... Drive gear, 164... Followed gear, 168... Rotating shaft, 170... Bearing member, 172... Support plate, 174... Rotation Plates, 176... Connecting rods, 178, 180, 194, 196, 210, 212... Pins, 182... Bearing units, 186, 188... Rotating shafts, 190, 192... Arms, 198... Pad support plates, 200... First peeling Suction pad, 201... Second peeling suction pad, 202... Support plate, 204... Lifting rotary actuator, 206... Rotating plate, 208... Connecting rod, 214... Falling plate, 214a... Passage, 214S... Position sensor, 214-1... Pressing plate, 214-2... Stainless steel plate, 80, 81... Air nozzle, 216... Two sheet picking prevention plate, 216a... Slit,
222... Drive unit, 240... Second slide table, 248... Second feed motor, 236... Second guide rail, 274... Post, 276... Support frame, 278... Rotating rotary actuator, 280... Drive gear, 284... Rotation Shaft, 282... Driven gear, 286... Bearing unit, 288... Revolving frame, 290... Rotating shaft, 292... Direction changing rotary actuator, 294... Revolving arm, 296... Support plate, 298... Pad advancing/retreating cylinder, 300... Delivery Suction pad,
378... Rotating brush, 380... Cleaning liquid nozzle, 382... Roller conveyor, 384... Air knife nozzle,
402... Transport unit 411... Round belt conveyor, 411a... Guide member, 412... Positioning pin,
502, 502A, 502B... Wafer collecting section, 510A, 510B... Wafer collecting cassette, 504... Defective wafer collecting section, 506... Adhesive remaining wafer collecting section, 514... Adhesive remaining wafer collecting cassette,
M...Mounting plate, S...Slice base, W...Wafer

Claims (10)

In a wafer peeling/cleaning apparatus for peeling and cleaning the wafers adhered to the slice base one by one from the slice base,
A first peeling suction pad arranged so that its central axis coincides with the central axis of the wafer;
A second peeling suction pad which is arranged closer to the slice base than the first peeling suction pad and expands and contracts in the axial direction;
A wafer peeling/cleaning apparatus comprising: The wafer peeling cleaning apparatus according to claim 1, wherein the second peeling suction pad is a bellows type vacuum suction pad. The wafer peeling cleaning apparatus according to claim 1 or 2, wherein the first peeling suction pad is a flat vacuum pad having a flat surface, and has a stronger suction force than the second peeling suction pad. When peeling the wafers, which are adhered to the slice base one by one, to make them into single wafers, suction holding of the wafers is brought into contact with the second peeling suction pads on the end faces of the wafers, and then, The wafer peeling cleaning apparatus according to any one of claims 1 to 3, wherein the first peeling suction pad sucks the central axis of the wafer. A separation plate for preventing the wafers from falling forward when separating the wafers one by one from the batch-stated wafers,
The inversion plate has a water-repellent finish on the surface that contacts the wafer,
The wafer peeling according to any one of claims 1 to 4, wherein the second peeling suction pad pulls the wafer toward the tilting plate side around a bonding portion of the wafer in a batch state. Cleaning device. A swinging rotary actuator that swings the first and second peeling suction pads in a direction along the axis of the wafer is provided, and the swinging rotary actuator is driven to move the first and second peeling suction pads. The wafer peeling/cleaning apparatus according to claim 1, wherein the wafer is peeled from the slice base by rocking. 7. A water supply nozzle is provided above the wafer vertically, and when peeling the wafers one by one, hot water or water is supplied from near the center above the wafer vertically. The wafer peeling cleaning apparatus according to any one of claims 1 to 5. A hot water bath for softening the adhesive material that adheres the wafer to the slice base;
Air nozzles provided on both side surfaces of the wafer,
Further equipped with,
When peeling the wafers one by one by suction holding the end face of the wafer bonded to the slice base set in the hot water tank with the first and second peeling suction pads, the air nozzle is used to The wafer peeling cleaning apparatus according to claim 1, wherein air is blown to the side surface of the wafer. 9. The wafer peeling and cleaning apparatus according to claim 8, wherein the air nozzle blows air from the lower side to the upper side of the wafer. 9. The wafer peeling/cleaning apparatus according to claim 8, wherein the air nozzle blows and supplies air to a plurality of wafers in a batch state when peeling one wafer.