JP2020106827A - 発光ダイオードディスプレイ - Google Patents
発光ダイオードディスプレイ Download PDFInfo
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- JP2020106827A JP2020106827A JP2019211963A JP2019211963A JP2020106827A JP 2020106827 A JP2020106827 A JP 2020106827A JP 2019211963 A JP2019211963 A JP 2019211963A JP 2019211963 A JP2019211963 A JP 2019211963A JP 2020106827 A JP2020106827 A JP 2020106827A
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- 230000002159 abnormal effect Effects 0.000 description 6
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 6
- BCCOBQSFUDVTJQ-UHFFFAOYSA-N octafluorocyclobutane Chemical compound FC1(F)C(F)(F)C(F)(F)C1(F)F BCCOBQSFUDVTJQ-UHFFFAOYSA-N 0.000 description 6
- 235000019407 octafluorocyclobutane Nutrition 0.000 description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 6
- 229920001601 polyetherimide Polymers 0.000 description 6
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- 239000005020 polyethylene terephthalate Substances 0.000 description 6
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
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- 239000010936 titanium Substances 0.000 description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
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- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
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- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical compound [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
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- 238000006243 chemical reaction Methods 0.000 description 1
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- 239000011810 insulating material Substances 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H01—ELECTRIC ELEMENTS
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
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- G09G2300/0421—Structural details of the set of electrodes
- G09G2300/0426—Layout of electrodes and connections
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract
Description
電気接触層301は、N型接点301_N、P型接点301_P1、301_P2、301_P3を含み、2種類の接点のサイズは同一であってもよいし、異なってもよい。図4おいて、N型接点201_NはN型接点301_Nに接続され、P型接点201_P1はP型接点301_P1に接続され、P型接点201_P2はP型接点301_P2に接続され、P型接点201_P3はP型接点301_P3に接続されることで、発光ユニット10、20、30をそれぞれ制御するように、外部の信号をN型接点及びP型接点を介してそれぞれ伝送することができる。P型接点301_P1、301_P2、301_P3の間の距離は、(第1搭載板200上の)電極10P、20P、30Pの間の距離よりも大きく、例えば、P型接点301_P1とP型接点301_P2との間の間隔d3は、電極10Pと電極20Pとの間の間隔d1(又は電極10Nと電極20Nとの間の間隔d2)よりも大きい。このため、発光ユニット10、20、30が同一の面積の第1搭載板200又は第2搭載板300に配置される場合、第1搭載板200の間隔(例えば、d1、d2)が第2搭載板300の間隔(例えばd3)よりも小さいため、第1搭載板200により多くの発光ユニットを配置することができる。言い換えれば、発光ユニット10、20、30を第1搭載板200に配置した後に第2搭載板に接続することによって形成されたディスプレイの解像度は、発光ユニット10、20、30を第2搭載板300に直接配置することによって形成されたディスプレイの解像度よりも高い。また、同一のタイプの電極間の距離も略同一であり、例えば、P型接点301_P1とP型接点301_P2の間隔d3は、P型接点301_P2とP型接点301_P3の間隔に略等しい。もう1つの実施例では、発光ユニット10、20、30のP型半導体層は、同一のP型接点に共通に接続されて共通P型接点の構造を形成し、発光ユニット10、20、30のN型半導体層のそれぞれは、異なるN型接点(図示せず)に接続されている。さらに、第2搭載板300の上面(第1搭載板200と接触する表面)及び下面(第1搭載板200から離れた表面)に何れも2種類の接点が配置され、これらの接点のサイズは同一であってもよいし、異なってもよい。1つの実施例では、電気接触層201、301は、第2搭載板300又は第1搭載板200の表面に完全に配置されている(言い換えれば、電気接触層201、301は、第2搭載板300及び第1搭載板200の表面からそれぞれ突出する)が、電気接触層201、301が薄いため、第1搭載板200の一部と第2搭載板300の一部とは接合後に直接接触する。
1000、1001、1002、1003、1004、1005、1006、1007、1008、1009、2000、2001、2002、2003、2004、2005、2006、2007、2008、2009、3000A、3000B、3000C、3000D、4000、5000 ディスプレイユニット
100、101、102、100_1、100_2 画素ユニット
10L、20L、30L 発光半導体スタック
10E、20E、30E 電極層
100A 画素領域
10、20、30 発光ユニット
200、200A、200B、200C、300、300A 搭載板
202N、202P、201_N、301_N、201_P1、201_P2、201_P3、301_P1、301_P2、301_P3、301_N1、301_N2、301_N3 接点
203_P1、203_P2、203_P3、203N 電極線
10N、20N、30N、10N’、20N’、30N’ N型電極
10P、20P、30P、10P’、20P’、30P’ P型電極
3001、3002 凹穴
201、301、400、400A、400B、400C、400D 電気接触層
40 保護層
50 枠体
60 導電層
500 制御回路
A−A’、B−B’ 線分
d、d1、d2、d3 間隔
Claims (10)
- 第1電極及び第2電極を含む第1搭載板と、
前記第1搭載板の下に形成され、前記第1搭載板に近い側に位置する第1接点及び第2接点を含む第2搭載板と、
前記第1搭載板の上に形成され、前記第1電極に直接接触する発光ユニットと、
前記発光ユニットを囲む枠体と、
前記発光ユニットを覆う保護層と、を含み、
前記第1電極と前記第2電極との間隔は、前記第1接点と前記第2接点との間隔よりも小さい、ディスプレイ。 - 前記枠体は、不透明な材料を含む、請求項1に記載のディスプレイ。
- 前記発光ユニットと前記第1搭載板との間に位置する導電層、をさらに含む、請求項1に記載のディスプレイ。
- 前記第2搭載板の前記第1搭載板とは反対側に設けられた電気接触層、をさらに含む、請求項1に記載のディスプレイ。
- 前記第1搭載板の下方に位置する第1電気接触層と、
前記第2搭載板の上方に位置し、前記第1電気接触層に電気的に接続される第2電気接触層と、をさらに含む、請求項1に記載のディスプレイ。 - 前記第1電極は、前記第1接点に電気的に接続される、請求項1に記載のディスプレイ。
- 前記枠体の最上面と前記保護層の最上面とは面一にされている、請求項1に記載のディスプレイ。
- 前記第2搭載板は、凹穴をさらに含む、請求項1に記載のディスプレイ。
- 第1搭載板と、
前記第1搭載板の上に形成された第2搭載板と、
前記第1搭載板の上に形成され、前記第2搭載板と直接接触していない第3搭載板と、
前記第2搭載板の上に形成された第1発光ユニットと、
前記第3搭載板の上に形成された第2発光ユニットと、
前記第1発光ユニットを囲む枠体と、
前記第1発光ユニットを覆う保護層と、を含む、ディスプレイ。 - 前記保護層は、前記枠体の前記発光ユニットに近い側と直接接触する、請求項9に記載のディスプレイ。
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2022086688A (ja) * | 2020-11-30 | 2022-06-09 | 日亜化学工業株式会社 | 光源、光源装置および光源の製造方法 |
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---|---|---|---|---|
CN113270443A (zh) * | 2020-02-17 | 2021-08-17 | 群创光电股份有限公司 | 电子装置 |
US20230178700A1 (en) * | 2021-11-29 | 2023-06-08 | Seoul Viosys Co., Ltd. | Pixel module and display apparatus having the same |
CN114899298B (zh) * | 2022-07-12 | 2022-10-25 | 诺视科技(苏州)有限公司 | 一种像素单元及其制作方法、微显示屏、分立器件 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100646094B1 (ko) * | 2005-07-04 | 2006-11-14 | 엘지전자 주식회사 | 표면 실장형 발광 소자 패키지 및 그의 제조 방법 |
JP2015220431A (ja) * | 2014-05-21 | 2015-12-07 | 日亜化学工業株式会社 | 発光装置の製造方法及び発光装置 |
US20160293811A1 (en) * | 2015-03-31 | 2016-10-06 | Cree, Inc. | Light emitting diodes and methods with encapsulation |
JP2017038024A (ja) * | 2015-08-13 | 2017-02-16 | ローム株式会社 | 半導体発光素子およびその製造方法、ならびに、半導体発光素子を備えた発光素子パッケージおよび発光装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7792489B2 (en) * | 2003-12-26 | 2010-09-07 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device, electronic appliance, and method for manufacturing light emitting device |
US9018655B2 (en) | 2005-02-03 | 2015-04-28 | Epistar Corporation | Light emitting apparatus and manufacture method thereof |
KR100722118B1 (ko) * | 2006-09-04 | 2007-05-25 | 삼성에스디아이 주식회사 | 유기전계발광 표시 장치 |
CN101304059B (zh) * | 2007-05-09 | 2010-09-08 | 富士迈半导体精密工业(上海)有限公司 | 发光二极管组件及发光二极管显示装置 |
KR101258261B1 (ko) * | 2010-04-21 | 2013-04-25 | 엘지디스플레이 주식회사 | 유기전계발광표시장치 |
KR101182233B1 (ko) * | 2010-06-11 | 2012-09-12 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
JP5754173B2 (ja) * | 2011-03-01 | 2015-07-29 | ソニー株式会社 | 発光ユニットおよび表示装置 |
US9356070B2 (en) * | 2012-08-15 | 2016-05-31 | Epistar Corporation | Light-emitting device |
US9092088B2 (en) | 2012-08-16 | 2015-07-28 | Eastman Kodak Company | Pixel-aligned ground micro-wire device |
US9276055B1 (en) * | 2014-08-31 | 2016-03-01 | Lg Display Co., Ltd. | Display device with micro cover layer and manufacturing method for the same |
US9698134B2 (en) * | 2014-11-27 | 2017-07-04 | Sct Technology, Ltd. | Method for manufacturing a light emitted diode display |
WO2018100476A1 (en) * | 2016-11-30 | 2018-06-07 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting element, light-emitting device, electronic device, and lighting device |
-
2018
- 2018-12-26 TW TW107147253A patent/TWI816727B/zh active
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2019
- 2019-09-25 CN CN201910909577.7A patent/CN111370561A/zh active Pending
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-
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- 2022-02-21 US US17/676,749 patent/US11749181B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100646094B1 (ko) * | 2005-07-04 | 2006-11-14 | 엘지전자 주식회사 | 표면 실장형 발광 소자 패키지 및 그의 제조 방법 |
JP2015220431A (ja) * | 2014-05-21 | 2015-12-07 | 日亜化学工業株式会社 | 発光装置の製造方法及び発光装置 |
US20160293811A1 (en) * | 2015-03-31 | 2016-10-06 | Cree, Inc. | Light emitting diodes and methods with encapsulation |
JP2017038024A (ja) * | 2015-08-13 | 2017-02-16 | ローム株式会社 | 半導体発光素子およびその製造方法、ならびに、半導体発光素子を備えた発光素子パッケージおよび発光装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022086688A (ja) * | 2020-11-30 | 2022-06-09 | 日亜化学工業株式会社 | 光源、光源装置および光源の製造方法 |
JP7328557B2 (ja) | 2020-11-30 | 2023-08-17 | 日亜化学工業株式会社 | 光源、光源装置および光源の製造方法 |
US11810998B2 (en) | 2020-11-30 | 2023-11-07 | Nichia Corporation | Light source and light source device |
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