JP2020101616A - Electronic device manufacturing method and glass substrate - Google Patents

Abstract

To secure the strength of an electronic device by preventing or suppressing scratches on a surface of a glass substrate when the electronic device is manufactured.SOLUTION: A method for manufacturing an electronic device 1 having glass substrates GS1 and GS2 includes: a preparation step of preparing a glass substrate GS1 with a protection film 12, which protects one surface GS1b of the glass substrate GS1, formed on the one surface GS1b; and a manufacturing step of manufacturing the electronic device 1 using the glass substrate GS1. In the manufacturing step, the side on which the protection film 12 of the glass substrate GS1 is formed is supported to manufacture the electronic device 1.SELECTED DRAWING: Figure 1

Description

The present invention relates to a method for manufacturing an electronic device and a glass substrate, and more particularly to a technique for preventing a decrease in strength of the glass substrate during manufacturing.

In recent years, from the viewpoint of space saving, various electronic devices such as flat panel displays such as liquid crystal displays and organic EL displays, thin film batteries, touch panels, and organic EL lighting have become widespread. Further thinning is required for these electronic devices. In order to promote this thinning, it is necessary to further thin the glass substrate used for the electronic device.

However, when the glass substrate constituting the electronic device is thinned as described above, the strength of the glass substrate is significantly reduced, and the electronic device is damaged by the bending load due to the impact or the pressure caused by the drop and the glass substrate as a starting point. There is a problem that the fear increases.

Therefore, for example, Patent Document 1 discloses a method for manufacturing a liquid crystal display panel provided with a reinforcing structure. This manufacturing method is performed in the following procedure. First, in a state where a predetermined laminated structure is formed on one surface of each of the two glass substrates facing each other, the two glass substrates are bonded together, and a liquid crystal is applied between the bonded two glass substrates. The encapsulation forms a liquid crystal display panel. After that, by forming a hard coat layer made of a silicon-based material on the other surface of each glass substrate that faces the outside of the liquid crystal display panel, a liquid crystal display panel having a reinforcing structure on the outside is manufactured. ..

JP, 2008-262160, A

Here, as a result of actually investigating the cause of the strength decrease of the glass substrate in the manufacturing process of the electronic device, it was found that not only the thinning of the glass substrate but also the handling of the glass substrate in the manufacturing process is problematic. Taking the manufacturing process of a liquid crystal display panel as an example, this type of glass substrate has a lower surface of a lower surface with a predetermined transport device toward the process for manufacturing the liquid crystal panel after finishing the processing of the glass substrate itself. At least a part of the sheet is transported while being supported. Further, in a process of manufacturing a liquid crystal display panel using the glass substrate such as a process of bonding the glass substrate, the glass substrates are bonded with the lower surface being supported. Therefore, during transportation or panel production, rubbing occurs between the supported surface (lower surface) of the glass substrate and the member supporting the glass substrate, and the supported surface is scratched due to this rubbing. It has been found. In this case, even if the manufacturing method described in Patent Document 1 is applied, it is inevitable that the surface of the glass substrate is scratched before the reinforcing structure is provided, and therefore new measures are required.

In view of the above circumstances, it is a technical problem to be solved to prevent or suppress the situation where the surface of the glass substrate is scratched during the manufacturing of the electronic device and secure the strength of the electronic device.

The solution to the above problem is achieved by the method for manufacturing an electronic device according to the present invention. That is, this manufacturing method is a method of manufacturing an electronic device including a preparatory step of preparing a glass substrate and a manufacturing step of manufacturing an electronic device using the glass substrate. Is characterized in that a glass substrate on which a protective film for protecting the surface of is protected is prepared, and an electronic device is manufactured by supporting a side of the glass substrate on which the protective film is formed in a manufacturing process.

As described above, in the method for manufacturing an electronic device according to the present invention, a glass substrate with a protective film in which a protective film for protecting one surface is formed in advance on one surface of the glass substrate is prepared, and An electronic device was manufactured by supporting the side of the glass substrate on which the protective film was formed. By doing so, even when rubbing occurs between the glass substrate and the supporting member during the transportation of the glass substrate or during the manufacturing process of the electronic device using the glass substrate, the surface of the glass substrate is protected by the protective film. It is possible to prevent or suppress scratching. Therefore, it becomes possible to secure the strength (for example, bending strength) of the electronic device having this glass substrate.

Further, in the method for manufacturing an electronic device according to the present invention, the protective film may be a low friction film having a static friction coefficient lower than that of the glass substrate.

Thus, by forming the protective film as a low-friction film having a lower coefficient of static friction than that of the glass substrate, the glass substrate can be made more slippery during transportation or panel production. Therefore, it is possible to more effectively prevent the glass substrate from being scratched.

When the protective film is a low-friction film, in the method for manufacturing an electronic device according to the present invention, the low-friction film may have a coefficient of static friction of 0.42 or less.

Specifically, by using a protective film (low-friction film) having a coefficient of static friction of 0.42 or less, sufficient slip between the glass substrate surface and the mating surface can be secured, so that the surface of the glass substrate is not scratched. It is possible to sufficiently suppress the attachment and secure the strength required for the electronic device. The above-mentioned static friction coefficient is a value obtained by measuring the static friction coefficient between the protective film formed on the glass substrate and the wrapping film LWFS-30#4000 manufactured by Sankyo Rikagaku Co., Ltd. according to JIS K 7125:1999. Shall be pointed out.

The solution to the above-mentioned problems can also be achieved by the glass substrate according to the present invention. That is, this glass substrate is a glass substrate for an electronic device and is characterized in that a protective film for protecting the non-guaranteed surface is formed on the non-guaranteed surface.

Thus, in the glass substrate according to the present invention, the protective film for protecting the non-guaranteed surface was formed on the non-guaranteed surface. Usually, in this type of glass substrate, each process such as transportation and processing of the glass substrate is performed with the surface (guarantee surface) for which the required quality is to be guaranteed being as non-contact as possible. In this case, the non-guaranteed surface located on the back side of the guaranteed surface becomes the contacted surface at the time of each step such as transportation or processing. Therefore, in the case of a glass substrate whose non-guaranteed surface is protected by a protective film, it is provided between the non-guaranteed surface of the glass substrate and the member in contact with the non-guaranteed surface during the transportation of the glass substrate or the manufacturing process of the electronic device. Even when rubbing occurs, the protective film can prevent or suppress scratches on the surface of the glass substrate. Therefore, it becomes possible to secure the strength of the electronic device having this glass substrate.

As described above, according to the method for manufacturing an electronic device and the glass substrate according to the present invention, it is possible to prevent or suppress the situation where the surface of the glass substrate is scratched during the manufacturing of the electronic device, and secure the strength of the electronic device. It becomes possible to do.

1 is a cross-sectional view of a liquid crystal display panel according to an exemplary embodiment of the present invention. 3 is a flowchart showing a procedure of a method for manufacturing the liquid crystal display panel shown in FIG. 1. 3 is a flowchart showing the procedure of the preparation process shown in FIG. 2. FIG. 3 is a perspective view of (a) first mother glass and (b) second mother glass prepared in the preparation step shown in FIG. 2. It is a perspective view of the 1st mother glass which formed the protective film. 3 is a flowchart showing a procedure of a manufacturing process shown in FIG. 2. It is a perspective view of the 1st laminated body containing the (a) 1st mother glass and the 2nd laminated body containing the (b) 2nd mother glass prepared for the assembly process shown in FIG. It is sectional drawing of the (a) 1st laminated body shown in FIG. 7, and sectional drawing of the (b) 2nd laminated body. 7A and 7B are cross-sectional views showing an example of the assembling process shown in FIG. 6. It is a perspective view of the assembly of the liquid crystal display panel obtained by the assembly process. It is a perspective view which shows an example of a cutting process.

An embodiment of the present invention will be described below.

FIG. 1 shows a liquid crystal display panel 1 as an example of an electronic device to which the present invention is applied. The liquid crystal display panel 1 includes a first glass substrate GS1, a second glass substrate GS2, a spacer SP, a liquid crystal layer 2 arranged between the first glass substrate GS1 and the second glass substrate GS2, A first laminated portion 3 arranged between the one glass substrate GS1 and the liquid crystal layer 2 and a second laminated portion 4 arranged between the second glass substrate GS2 and the liquid crystal layer 2.

The shapes of the first glass substrate GS1 and the second glass substrate GS2 are rectangular in the present embodiment, but of course, are not limited to this shape. As a material for each of the glass substrates GS1 and GS2, silicate glass or silica glass is used, preferably borosilicate glass, soda lime glass, aluminosilicate glass, or chemically strengthened glass, and most preferably alkali-free glass. Is used. By using non-alkali glass as the glass substrates GS1 and GS2, chemically stable glass can be obtained. Here, the non-alkali glass is a glass that does not substantially contain an alkali component (alkali metal oxide), and specifically, a glass in which the weight ratio of the alkali components is 3000 ppm or less. is there. The weight ratio of the alkaline component in the present invention is preferably 1000 ppm or less, more preferably 500 ppm or less, and most preferably 300 ppm or less.

Each of the glass substrates GS1 and GS2 can be formed by a known float method, roll-out method, slot down draw method, redraw method, or the like, but is preferably formed by the overflow down draw method.

The thickness of each glass substrate GS1, GS2 is set to 1000 μm or less, preferably 10 μm or more and 700 μm or less, more preferably 20 μm or more and 500 μm or less, and most preferably 200 μm or more and 500 μm or less.

The first laminated portion 3 is formed on the inner surface GS1a of the first glass substrate GS1 (the inner side here means the inner side of the liquid crystal display panel 1), and is made of, for example, a transparent conductive film TCF. And a first alignment film 6 laminated on the first electrode layer 5.

The material of the first electrode layer 5 (transparent conductive film TCF) is not particularly limited as long as it has translucency and conductivity. The first electrode layer 5 is formed of, for example, indium-doped tin oxide (ITO), fluorine-doped tin oxide (FTO), indium zinc oxide (IZO), aluminum-doped zinc oxide (AZO), or the like.

The first alignment film 6 is a transparent film formed of, for example, a polyimide film or other material in which minute grooves are formed by rubbing. The liquid crystal molecules included in the liquid crystal layer 2 can be aligned at a pretilt angle by the action of the first alignment film 6.

The second laminated portion 4 is formed on the inner surface GS2a of the second glass substrate GS2, and includes, for example, a color filter layer 7, a second electrode layer 8 (counter electrode) composed of a transparent conductive film TCF, and It is composed of two alignment films 9. The color filter layer 7 is formed of a black matrix and a plurality of colored pixels. The material, thickness and sheet resistance of the second electrode layer 8 are the same as those of the first electrode layer 5. The configuration, material and thickness of the second alignment film 9 are the same as those of the first alignment film 6.

The seal portion S is a frame-shaped seal member that surrounds the liquid crystal layer 2. Here, the seal portion S is formed of a sealing material such as a UV curable resin or a thermosetting resin, but it is not limited to any of these materials, of course. The spacer SP has, for example, a spherical shape and is made of resin or silica. By disposing the spacers SP so as to be dispersed in the liquid crystal layer 2, the distance between the first glass substrate GS1 and the second glass substrate GS2 is maintained constant.

The liquid crystal layer 2 is made of nematic liquid crystal or the like. The liquid crystal layer 2 is formed in a space defined by the first glass substrate GS1, the second glass substrate GS2, and the seal portion S.

The first polarizing plate 10 is arranged on the outermost side of the first glass substrate GS1, and the second polarizing plate 11 is arranged on the outermost side of the second glass substrate GS2. Although not shown, a retardation plate may be provided in addition to these polarizing plates 10 and 11.

In addition, in the present embodiment, the protective film 12 that protects the outer surface GS1b is formed on the surface of the first glass substrate GS1 opposite to the side on which the first electrode layer 5 is formed (that is, the outer surface GS1b). Has been done. In this case, the protective film 12 is arranged between the first glass substrate GS1 and the first polarizing plate 10.

Here, the protective film 12 is configured to have a friction coefficient (static friction coefficient, dynamic friction coefficient) lower than that of the first glass substrate GS1 (low friction film). Specifically, it is formed of a material having a coefficient of friction lower than that of glass.

Here, when the protective film 12 (especially in the case of a low friction film) having the above structure is selected from the viewpoint of the coefficient of friction, for example, the static friction coefficient of the protective film 12 should be 0.42 or less, and 0.35 or less. It is preferable to show, and it is more preferable to show 0.30 or less. As a material showing such a friction coefficient, a fluorine-based material can be exemplified.

On the other hand, when the protective film 12 having the above structure is selected in terms of characteristics and performance, the protective film 12 may be a functional film, for example. The functional film referred to here is, for example, an antireflection function (AR), a fingerprint antifouling function (AF), a glare prevention (antiglare) with respect to the glass substrate GS1 on which the protective film 12 is formed. ) Function (AG), infrared ray cutting function (IR), conductivity imparting function, cold mirror function, ultraviolet ray cutting function (UV), and the like are included in the thin film. Among them, from the viewpoint of film formation efficiency, for example, a thin film (antifouling film) having a stain prevention function capable of forming a film by spraying is preferable.

Alternatively, when the protective film 12 having the above structure is selected in terms of material, the protective film 12 may be a thin film (organic film) made of an organic material, or may be SiO ₂ , Nb ₂ O ₅ , SiN _x. It may be a thin film (inorganic film) formed of an inorganic material such as ITO.

Hereinafter, a method for manufacturing the liquid crystal display panel 1 having the above structure will be described. As shown in FIG. 2, the manufacturing method of the liquid crystal display panel 1 according to the present embodiment includes a preparing step S1 of preparing a predetermined glass substrate and a manufacturing step of manufacturing the liquid crystal display panel 1 using the predetermined glass substrate. And S2.

(S1) Preparation Step As shown in FIG. 3, the preparation step S1 includes an acquisition step S3 for acquiring the first and second mother glasses GM1 and GM2 and at least one of the acquired mother glasses GM1 and GM2 (this embodiment. Then, there is a protective film forming step S4 of forming the protective film 12 on the first mother glass GM1).

(S3) Mother Glass Obtaining Step In this step, the first mother glass GM1 (see FIG. 4A) and the second mother glass GM2 (see FIG. 4B) having a predetermined shape and a predetermined size are obtained. Here, both the first and second mother glasses GM1 and GM2 are glass substrates to be the first and second glass substrates GS1 and GS2 shown in FIG. In other words, the first and second glass substrates GS1 and GS2 shown in FIG. 1 are cut out from the first and second mother glasses GM1 and GM2 by so-called multiple cutting after being bonded (after the assembling step S6 described later). Glass substrate (see the area surrounded by the alternate long and short dash line in FIGS. 4A and 4B). Therefore, the thickness dimension, material (composition), and molding means of each mother glass GM1, GM2 are basically the same as the thickness dimension, material, and molding means of the glass substrates GS1, GS2 described above. In this case, the first and second laminated portions 3 and 4 are respectively formed on one surface GM1a and GM2a of each mother glass GM1 and GM2, and the protective film 12 is formed on the other surface GM1b of the first mother glass GM1. To be done. The alternate long and short dash line in FIGS. 4A and 4B is a planned cutting line in the cutting step S7 described later. The dashed-dotted line in FIGS. 7 to 9 is also the same planned cutting line.

(S4) Protective Film Forming Step In this step, one surface GM1a of the first mother glass GM1 on which the first laminated portion 3 (see FIG. 1) is formed is opposite to the surface (other surface GM1b), The protective film 12 is formed. Here, the means for forming the protective film 12 is arbitrary, and a known film forming means can be appropriately selected according to the type of the protective film 12. For example, when the protective film 12 is formed of an antifouling film such as an AF coat, the protective film 12 is formed on the entire surface of the other surface GM1b by a method such as spraying. Thereby, as shown in FIG. 5, the first mother glass GM1 (glass substrate with a protective film) in which the protective film 12 is formed on the other surface GM1b is obtained. Here, the other surface GM1b of the first mother glass GM1 is an outer surface GS1b of the first glass substrate GS1 to be cut out (the outer side here means the outer side of the liquid crystal display panel 1). The outer surface GS1b is also a non-guaranteed surface.

(S2) Manufacturing Step The manufacturing step S2 of the liquid crystal display panel 1 includes a laminated portion forming step S5, an assembling step S6, and a cutting step S7, which are all manufacturing-related processing steps (see FIG. 6).

(S5) Laminated portion forming step In this step, the first laminated portion 3 is formed on the one surface GM1a side of the first mother glass GM1 on which the protective film 12 is formed, and the one surface GM2a of the second mother glass GM2 is formed. The second laminated portion 4 is formed on the substrate (see FIG. 7). In the present embodiment, as the first laminated portion 3, the first electrode layer 5 formed of the transparent conductive film TCF and the first alignment film 6 are formed on the one surface GM1a of the first mother glass GM1. Further, as the second laminated portion 4, the color filter layer 7, the second electrode layer 8 formed of the transparent conductive film TCF, and the second alignment film 9 are formed on the one surface GM2a of the second mother glass GM2. To be done.

Here, a specific procedure for forming the first laminated portion 3 on the first mother glass GM1 will be described. First, the transparent conductive film TCF is formed on the one surface GM1a of the first mother glass GM1 on which the protective film 12 is formed. .. Next, a photoresist (photosensitive resin) is applied on the transparent conductive film TCF to form a resist layer, and then the resist layer is covered with a photomask and irradiated with light such as ultraviolet rays to form a photomask. The formed pattern having the predetermined shape is transferred to the resist layer. After that, when a positive photoresist is used, for example, a resist developer is supplied to remove the exposed portion of the resist layer and an etching process is performed to remove unnecessary portions of the resist layer and the transparent conductive film TCF. After that, a pattern corresponding to the photomask is formed on the transparent conductive film TCF. Then, by removing the resist layer remaining on the transparent conductive film TCF, the first electrode layer 5 having a predetermined electrode pattern of the transparent conductive film TCF is formed (see FIG. 8A). After that, by forming the first alignment film 6 so as to cover the first electrode layer 5, the first laminated portion 3 formed by covering the first electrode layer 5 with the first alignment film 6 has one surface. The first mother glass GM1 formed on the GM1a is obtained (see FIGS. 7A and 8A). Hereinafter, the first mother glass GM1 in this state is also referred to as the first stacked body LM1.

The procedure for forming the second laminated portion 4 on the second mother glass GM2 will be described. First, for example, a black matrix is formed on one surface GM2a of the second mother glass GM2, and then a color resist coating step, an exposure step, and a development step are performed. The color filter layer 7 corresponding to a plurality of colors (RGB) is formed by repeating the baking process. Then, after forming the transparent conductive film TCF on the surface of the color filter layer 7, the second electrode having the predetermined electrode pattern by the transparent conductive film TCF is formed by performing the same patterning process as that of the first mother glass GM1 if necessary. The layer 8 is formed (the extending direction of each electrode is orthogonal to the first electrode layer 5 and the second electrode layer 8). After that, by forming the second alignment film 9 so as to cover the second electrode layer 8, the second laminated portion 4 formed by covering the second electrode layer 8 with the second alignment film 9 has one surface. The second mother glass GM2 formed on the GM2a is obtained (see FIGS. 7B and 8B). Hereinafter, the second mother glass GM2 in this state is also referred to as the second laminated body LM2.

When the liquid crystal display panel 1 is of the active matrix driving type rather than the simple matrix driving type, the first electrode layer 5 has a source electrode, a gate electrode, a drain electrode, an insulating layer, a switching element (TFT, etc.). It is formed by photolithography or another method.

Further, the transparent conductive film TCF can be formed by any means and can be formed by a known film forming method such as a sputtering method, a vapor deposition method, a CVD method or the like. Further, the type of the transparent conductive film TCF that can be formed is arbitrary, and an example thereof is an ITO film.

Further, the means for forming the first and second alignment films 6 and 9 is also arbitrary, and can be formed by a known means such as a spin coating method. Further, rubbing treatment may be applied to each of the alignment films 6 and 9. By this rubbing treatment, although not shown, innumerable minute groove portions are formed on the surfaces of the respective alignment films 6 and 9.

(S6) Assembly Step In this step, the assembly 13 of the liquid crystal display panel 1 is assembled. First, as shown in FIG. 9A, the first laminated body LM1 and the second laminated body LM2 are opposed to each other, and a sealing material and a spacer SP forming a seal portion S are provided between the laminated bodies LM1 and LM2. Supply. In the present embodiment, the sealing material forming the sealing portion S is applied in advance on the first alignment film 6 of the first stacked body LM1 so that the sealing portion S has a lattice shape in a plan view (see FIG. 9(a)). A plurality of regions surrounded by the seal portion S, that is, a plurality of regions serving as spaces (see FIG. 1) in which the liquid crystal layer 2 is formed is filled with liquid crystal and the spacers SP are dispersed. At this time, the first stacked body LM1 is arranged below the second stacked body LM2, and the first stacked body LM1 and the second stacked body LM2 are arranged so that the first alignment film 6 and the second alignment film 9 face each other. To place. As a result, the protective film 12 is placed on the lowermost side of the first stacked body LM1. Note that the sealing material S may not be applied on the planned cutting line. In other words, the sealing material S may have a divided structure in the width direction (left and right direction of the paper surface of FIG. 9), and the space between the divided sealing materials S may be used.

From this state, for example, by raising the first stacked body LM1 to approach the second stacked body LM2, the spacer SP is sandwiched between both the stacked bodies LM1 and LM2, and is applied in advance on the first stacked body LM1. The sealing material of the seal portion S that has been set is brought into contact with the second stacked body LM2 (see FIG. 9B). Here, by solidifying the sealing material (for example, when a UV curable resin is used for the sealing material, by irradiating and curing with ultraviolet rays), the sealing portion S is formed between the stacked bodies LM1 and LM2, and The laminated bodies LM1 and LM2 that come into contact with the sealing material are adhesively fixed to the seal portion S. As a result, the first stacked body LM1 and the second stacked body LM2 are bonded to each other via the seal portion S.

Further, by applying the sealing material so that the seal portion S has a lattice shape in a plan view, in the state where the first stacked body LM1 and the second stacked body LM2 are bonded to each other, A plurality of liquid crystal layers 2 are formed in a region surrounded by the one stacked body LM1, the second stacked body LM2, and the seal portion S (see FIG. 9B). In this way, the assembly 13 of the liquid crystal display panel 1 including the plurality of liquid crystal layers 2 formed between the first stacked body LM1 and the second stacked body LM2 is assembled (see FIG. 10).

In such an assembling step S6, the first stacked body LM1 is fed from below by, for example, the rollers of the transport device for loading and unloading the first stacked body LM1 and the elevating member for raising the first stacked body LM1. Supported.

(S7) Cutting Step After that, the pair of glass substrates GS1 and GS2 are attached to each other by cutting the assembly 13 along a predetermined planned cutting line (for example, a planned cutting line shown by a dashed line in FIGS. 7 to 9). The substrates 1a of the plurality of liquid crystal display panels 1 that are combined are cut out (see FIG. 11). After that, the polarizing plates 10 and 11 are fixed on both surfaces of the base body 1a, and necessary electronic parts and the like are mounted, so that the liquid crystal display panel 1 shown in FIG. 1 is manufactured.

As can be seen from the above description, in the method for manufacturing an electronic device according to the present invention, the glass substrate with the protective film (the first mother glass GM1 on which the protective film 12 is formed) is prepared before the production step S2. The liquid crystal display panel 1 is manufactured while the side of the glass substrate on which the protective film 12 is formed is supported. As a result, for example, during the step of forming a laminated portion on the first mother glass GM1 or the assembling step S6 of the liquid crystal display panel 1 using the first mother glass GM1, the assembly 13 of the liquid crystal display panel 1 is scheduled to be cut. Even when the first mother glass GM1 side and various supporting members are rubbed when cut along, the protective film 12 prevents or suppresses the surface of the first mother glass GM1 from being scratched. can do. Therefore, it becomes possible to secure the strength of the liquid crystal display panel 1 having the first glass substrate GS1 obtained by cutting out the first mother glass GM1.

Further, when the first laminated body LM1 (first mother glass GM1) is supported and conveyed by the rollers of the conveying device as in the present embodiment, the friction between the rollers and the first mother glass GM1 side. However, as described above, by forming the protective film 12 on the support side (the other surface GM1b side) of the first mother glass GM1, the first mother glass GM1 is rubbed by rubbing when positioning is stopped. It is possible to prevent or suppress scratching.

Although one embodiment of the present invention has been described above, the method for manufacturing an electronic device and the glass substrate according to the present invention are not limited to the above-described exemplary embodiments. The manufacturing method and the glass substrate can take various forms within the scope of the present invention.

For example, in the above-described embodiment, the case where the protective film 12 is formed on the entire surface of the other surface GM1b of the first mother glass GM1 has been exemplified, but the present invention is not limited to this. Of the rollers and the lifting members in the assembling step S6, the supporting form of the members that support the first mother glass GM1 in the laminated portion forming step S5, and the members that support the first mother glass GM1 when conveying between those steps. It is also possible to form the protective film 12 on a predetermined part of the other surface GM1b depending on the support form and the like.

Further, in the above-described embodiment, the case where the elevating member as the support member is raised to bring the first stacked body LM1 closer to the second stacked body LM2 is illustrated, but the first stacked body LM1 in a state of being supported from below, for example. On the other hand, the second stacked body LM2 may be lowered from above to sandwich the spacer SP. In short, the movement form is arbitrary as long as the spacer SP can be sandwiched by the relative movement of the first stacked body LM1 and the second stacked body LM2.

Further, in the above-described embodiment, the case where the protective film 12 is formed only on the first mother glass GM1 in the preparation step S1 is illustrated, but it goes without saying that the protective film 12 may be formed on both mother glasses GM1 and GM2.

Further, in the above embodiment, the protective film 12 is formed on one mother glass GM1, and the first and second laminated portions 3 and 4 are formed on both mother glasses GM1 and GM2 to form the first and second laminated bodies. The procedure for obtaining the liquid crystal display panel 1 by forming the LM1 and LM2 and then laminating the produced laminated bodies LM1 and LM2 to each other to produce the assembly 13 of the liquid crystal display panel 1 is illustrated. It is also possible to take steps other than. For example, although not shown, even if the mother glasses GM1 and GM2 are first cut into the glass substrates GS1 and GS2, the laminated portion forming step S5 and the assembling step S6 are performed on the glass substrates GS1 and GS2. Good. In this case, the protective film 12 may be formed before or after cutting.

In the above embodiment, the case where the protective film 12 is formed on the mother glass in the preparation step S1 and the protective film 12 is not formed again in the preparation step S2 has been described as an example, but the protection film 12 may be formed in the preparation step S2 if necessary. A step of forming again may be provided.

In addition, in the above-described embodiment, a rectangular single-wafer glass substrate is illustrated as each of the mother glasses GM1 and GM2, but it is of course possible to form the protective film 12 on the mother glasses GM1 and GM2 having other forms. Is. For example, although not shown, a glass substrate (glass film) that is thin enough to be wound up may be used as mother glass, and the protective film 12 may be formed on this glass film. In this case, the step of forming the protective film 12 on the glass film can be performed by continuously performing a film forming process on one surface of the glass film supplied by a so-called roll-to-roll method. After the protective film 12 is continuously formed, the protective film 12 may be cut and the laminated portion forming step S5 and the assembling step S6 may be sequentially performed.

Further, in the above description, the case where the liquid crystal display panel 1 is manufactured as an electronic device is illustrated, but the present invention can be applied to the case of manufacturing other electronic devices. For example, although not shown, the present invention can be applied to the case of manufacturing an organic EL lighting (element) or a touch panel as an electronic device.

The contents of the experiment for demonstrating the usefulness of the present invention will be described below.

In the present example, OA-11 0.5t manufactured by Nippon Electric Glass Co., Ltd. was prepared as a glass substrate, and as a material for the protective film, AF tool, Daikin Industries Co., Ltd. OPTOOL UF503 and 3M Japan Co., Ltd. A mixture with Novec 72DE was used. After the glass substrate is washed, the mixed solution is spray-coated on the glass substrate, wiped off, dried at room temperature, and then heat-treated at 150° C. for 30 minutes to perform AF as a protective film on the surface of the glass substrate. A glass substrate with a coat formed was obtained. The static friction coefficient between the glass substrate and the wrapping film LWFS-30#4000 manufactured by Sankyo Rikagaku Co., Ltd. was measured according to JIS K 7125:1999, and it was 0.26.

On the other hand, a glass substrate having no protective film formed thereon (the glass substrate) was prepared. When the coefficient of static friction of this glass substrate was measured by the above-mentioned method, it was 0.59.

A scratch test was performed on a glass substrate with a protective film (Example) and a glass substrate without a protective film (Comparative Example) for the purpose of reproducing scratches generated during manufacturing. The scratch test was performed by rubbing a wrapping film LWFS-30#4000 manufactured by Sankyo Rikagaku Co., Ltd. on the surface of each glass substrate. For the glass substrate with the protective film, a scratch test was conducted by rubbing the above wrapping film on the side on which the protective film was formed. The conditions at this time were a surface load of 500 g, a moving speed of 3 m/min, and a rubbing frequency of 10 reciprocations. The glass substrate with a protective film after scratching was set as Example 1. In addition, a glass substrate without a protective film after scratching was used as Comparative Example 1.

Breaking loads in a ring-on-ring test were measured for the above-mentioned three types of glass substrates (Examples and Comparative Examples). The conditions at this time were a diameter of the piston side ring of 12.5 mm, a diameter of the support side ring of 25 mm, and a descending speed of the piston side ring of 0.5 mm/s. The above-mentioned scratch test and ring-on-ring test were carried out 30 times for each glass substrate, and the median value of the measured breaking load [N] was taken as the evaluation value.

The test results are shown in Table 1. From the results of the comparative example, it is understood that when the surface of the glass substrate is scratched, the breaking load is significantly reduced. On the other hand, in the case of the glass substrate with the protective film as the example, relatively excellent breaking strength (breaking load) was shown even in the ring-on-ring test after scratching. From this, it is considered that the protective film makes it difficult for scratches to be produced at the time of manufacturing, and thereby suppresses the decrease in breaking strength.

1 Liquid Crystal Display Panel 1a Liquid Crystal Display Panel Substrate 2 Liquid Crystal Layers 3, 4 Laminated Parts 5, 8 Electrode Layers 6, 9 Alignment Film 7 Color Filter Layers 10, 11 Polarizing Plate 12 Protective Film 13 Liquid Crystal Display Panel Assembly GM1, GM2 Mother glass GS1, GS2 Glass substrate LM1, LM2 Laminated body S1 Preparation step S2 Preparation step S3 Acquisition step S4 Protective film formation step S5 Laminated part formation step S6 Assembly step S7 Cutting step SP Spacer TCF Transparent conductive film

Claims (4)

A method of manufacturing an electronic device, comprising a preparatory step of preparing a glass substrate, and a manufacturing step of manufacturing an electronic device using the glass substrate,
In the preparing step, as the glass substrate, prepare a glass substrate on which a protective film for protecting one surface is formed,
A method of manufacturing an electronic device, comprising supporting the side of the glass substrate on which the protective film is formed in the manufacturing step to manufacture the electronic device. The method for manufacturing an electronic device according to claim 1, wherein the protective film is a low-friction film having a static friction coefficient lower than that of the glass substrate. The method for manufacturing an electronic device according to claim 2, wherein the low friction film has a coefficient of static friction of 0.42 or less. A glass substrate for an electronic device,
A glass substrate having a protective film formed on the non-guaranteed surface to protect the non-guaranteed surface.

Images