JP2002116433A - Liquid crystal display device, method for manufacturing the same and information communication appliance - Google Patents

Abstract

PROBLEM TO BE SOLVED: To avoid the problems that when the film thickness of a transparent electrode is increased to decrease the resistance of the electrode, not only the substrate causes warpage but cracks are produced in the transparent electrode. SOLUTION: The liquid crystal display device is formed by disposing two substrates having transparent electrode patterns formed facing each other in which a resin substrate 4 is used for at least one of the two substrates, and holding a liquid crystal layer between the substrates. An insulating film 2 having <=1.5 GPa elastic modulus is formed between the resin substrate 4 and the transparent electrode pattern consisting of an ITO film 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device in which at least one substrate is formed of a resin substrate, a method of manufacturing the same, and an information communication device.

[0002]

2. Description of the Related Art In a liquid crystal display device, a glass substrate is generally used as a transparent substrate for maintaining a liquid crystal layer at a constant thickness and forming electrodes. As a method for forming an ITO (indium tin oxide) film, which is one of the transparent electrodes, on a glass substrate, there is a sputtering method. When an ITO film is formed by this method, it is general that heat of 100 ° C. or higher is applied to the glass substrate.

Similarly, when a method of forming an ITO film by heating a substrate is applied to a resin substrate, the resin substrate on which the transparent electrode is formed is heated at the time of forming the transparent electrode and at room temperature after the formation. Due to the difference in thermal expansion between the substrate and the transparent electrode, warpage occurs such that the side on which the transparent electrode is formed becomes convex.

The coefficient of thermal expansion of a glass substrate differs depending on the type of glass. In the case of soda glass, it is 4.0 × 10 ⁻⁶ /.
° C. The thermal expansion coefficient of the ITO film changes depending on the composition ratio, the film forming method, and the like.
It is from 6.0 × 10 ⁻⁷ / ° C. to 2.0 × 10 ⁻⁶ / ° C. As described above, since the transparent electrode and the glass substrate have almost no difference in their thermal expansion coefficients, the substrate warpage due to the difference in substrate temperature before and after the formation of the transparent electrode hardly occurs.

On the other hand, the thermal expansion coefficient of a general organic material used as a resin substrate is considered. For example, polycarbonate is 2 × 10 ⁻⁵ / ° C., polyethylene terephthalate is 1.8 × 10 ⁻⁵ / ° C., and polyether sulfone is 4.8.
× 10 ^-5 / ° C, acrylic resin is 2 × 10 ^-5 / ° C,
Larger than ITO or glass.

Therefore, when the ITO film is formed by using the sputtering method, the resin substrate is heated, so that the resin substrate expands more than the transparent electrode. When the temperature is returned to room temperature after the formation of the ITO film, the resin substrate shrinks more than the ITO film. Generally, the thickness of a resin substrate used for a liquid crystal display device is 0.5 mm or less, and in that case, a convex warpage occurs on the side of the resin substrate where the ITO film is formed.

As a method of forming a transparent electrode on a substrate at room temperature, there is an ion plating method. When an ITO film is formed on a resin substrate by this method, the substrate does not warp at room temperature. However, the manufacturing process of the liquid crystal display device includes heating processes such as drying after washing the substrate, formation of an alignment film, formation of a color filter, and formation of an overcoat film.
Therefore, even on a resin substrate on which a transparent electrode is formed at room temperature,
In the above-described heating step, a difference in thermal expansion occurs between the resin substrate and the transparent electrode, and a warp occurs in which the transparent electrode side becomes concave.

For example, when an ITO film is formed by sputtering at 120 ° C. on an acrylic substrate having a size of 300 × 300 mm ² and a thickness of 0.4 mm, and then the substrate is heated to 20 ° C., The change is 0 per side.
6 mm. On the other hand, the thermal expansion coefficient of the ITO film is 2.0 ×
At 10 ⁻⁶ / ° C., the dimensional change of the ITO film is 0.06
mm. Therefore, the difference in dimensional change between the acrylic substrate and the ITO film is as large as 0.54 mm, and the acrylic substrate on which the ITO film is formed is greatly warped so that the ITO film side becomes convex. When an ITO film having a thermal expansion coefficient of 6.0 × 10 ⁻⁷ / ° C. is formed, the dimensional change of the ITO film is 0.018 mm.
The difference in dimensional change between the acrylic substrate and the ITO film is as large as 0.582 mm, and the acrylic substrate on which the ITO film is formed is greatly warped so that the ITO film side is convex.
An acrylic substrate on which an ITO film was formed at 20 ° C.
When heated to 20 ° C., since the dimensional change of the ITO film is smaller than that of the resin substrate, warpage occurs such that the ITO film side becomes concave.

As described above, it has been found that, from room temperature to the substrate heat-resistant temperature, the dimensional change of the resin substrate due to heat increases, thereby causing the resin substrate on which the transparent electrode is formed to warp.

A liquid crystal display device using a resin substrate is manufactured mainly for a mobile phone, and is often of an STN type driven at a duty of 1/80 or less. In that case,
It was sufficient if the resistance value of the transparent electrode was about 50Ω / □.

However, in recent years, in a liquid crystal display device using a resin substrate, there is a demand for a higher definition and lower resistance of a transparent electrode pattern due to a larger screen of a mobile phone, gradation display, and color display. As a method of reducing the resistance of a transparent electrode, it is common to increase the thickness of the transparent electrode. If the resistance value is 50Ω / □, the thickness of the transparent electrode should be around 0.10 μm. However, to perform gradation display or color display,
The resistance value of the transparent electrode must be 30Ω / □ or less. To make the resistance value 30Ω / □, about 0.15μm, 20Ω
A film thickness of 0.22 μm or more is required to reduce the thickness to / □ or less.

As described above, the manufacturing process of the liquid crystal display device includes heating processes such as drying after washing the substrate, formation of an alignment film, formation of a color filter, and formation of an overcoat film. When the thickness of the transparent electrode is increased, the resin substrate on which the transparent electrode forming side becomes convex at the time of this heating becomes smooth once, or the transparent electrode forming side becomes concave when the temperature is higher than the environmental temperature at the time of forming the transparent electrode. Become. When the temperature is returned to room temperature, the side on which the transparent electrode is formed becomes convex again. When the transparent electrode cannot reduce the stress due to such thermal history, cracks occur in the transparent electrode.

In the case of a resin substrate on which a transparent electrode is formed at room temperature, the transparent electrode side is warped in a concave shape during heating, and cracks are generated in the transparent electrode by repeating the heating process. As described above, in a liquid crystal display device using a resin substrate, when the thickness of the transparent electrode is increased, cracks are generated in the transparent electrode. There is a problem that display failure occurs due to the above.

[0014]

In a conventional resin substrate on which a transparent electrode is formed, an insulating film may be provided between the transparent electrode and the resin substrate. However, the insulating film in this case is intended for chemical resistance, solvent resistance, gas barrier properties, or scratch prevention. Therefore, the material of the insulating film is generally a highly crosslinked or highly rigid epoxy resin, a highly crosslinked or highly rigid acrylic resin, and their elastic modulus is as high as 3.0 GPa or more. The film thickness was as thin as about 1 μm.

Therefore, the conventional resin substrate on which the transparent electrode is formed is warped due to the difference in the dimensional change between the transparent electrode and the resin substrate at room temperature and during heating. In addition, when the thickness of the transparent electrode is increased to reduce the resistance of the transparent electrode, cracks occur in the transparent electrode in addition to the warpage of the substrate. There is a problem that a problem occurs.

The present invention has been made in view of the above-mentioned conventional problems. Even if a resin substrate is used, cracks do not occur in the transparent electrode, and display failure due to disconnection of the transparent electrode does not occur. And a liquid crystal display device provided with an insulating film for protecting the transparent resin substrate. It is another object of the present invention to establish a method of manufacturing such a liquid crystal display device and to provide an information communication device using the liquid crystal display device.

[0017]

According to a first aspect of the present invention, two substrates having transparent electrodes formed on one surface thereof are opposed to each other, and a resin substrate is used for at least one of the two substrates. In a liquid crystal display device having a liquid crystal layer sandwiched between the two substrates, a layer made of an insulating film having an elastic modulus of 1.5 GPa or less is formed between the transparent electrode and the resin substrate. I do.

According to a second aspect of the present invention, in the liquid crystal display device of the first aspect, the insulating film is made of an acrylic resin, an epoxy resin, a polyethylene resin, a polyester resin, a silicon resin, or a fluorine resin. It is a film containing any of them.

The invention of claim 3 of the present application is directed to claim 1 or 2
In the liquid crystal display device, the insulating film has a thickness of 1.5 μm to
It has a thickness of 20 μm.

According to a fourth aspect of the present invention, in the liquid crystal display device according to any one of the first to third aspects, the resin substrate is made of an acrylic resin, a polycarbonate resin, an epoxy resin, or a polyether terephthalate resin. , Polyethersulfone-based resin, polyethylene-based resin, and silicon-based resin.

According to a fifth aspect of the present invention, there is provided a liquid crystal display comprising two substrates arranged facing each other, a resin substrate used as at least one of the two substrates, and a liquid crystal layer sandwiched between the two substrates. In the method for manufacturing a device, an insulating film having an elastic modulus of 1.5 GPa or less is formed on one surface of the resin substrate, and a transparent electrode is formed on an upper surface of the insulating film.

According to a sixth aspect of the present invention, in the method for manufacturing a liquid crystal display device according to the fifth aspect, the insulating film is made of an acrylic resin, an epoxy resin, a polyethylene resin, a polyester resin, a silicon resin, a fluorine resin. It is characterized by being a film containing any of the base resins.

The invention of claim 7 of the present application is directed to claim 5 or 6
In the method for manufacturing a liquid crystal display device according to
It is characterized by a film thickness of 1.5 μm to 20 μm.

The invention of claim 8 of the present application is directed to claims 5, 6,
7. The method for manufacturing a liquid crystal display device according to any one of items 7,
The resin substrate may be formed of at least one transparent resin of an acrylic resin, a polycarbonate resin, an epoxy resin, a polyether terephthalate resin, a polyether sulfone resin, a polyethylene resin, and a silicon resin. Features.

According to a ninth aspect of the present invention, there is provided a liquid crystal display device according to any one of the first to fourth aspects.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a liquid crystal display device according to an embodiment of the present invention, a method for manufacturing the same, and an information communication device using the liquid crystal display device will be described. In the liquid crystal display device of the present embodiment, a substrate on which an insulating film and a transparent electrode are formed is arranged to face each other, a transparent resin substrate is used as the substrate, and a liquid crystal layer is held between the substrates. In particular, a layer made of an insulating film having an elastic modulus of 1.5 GPa or less is formed between the resin substrate and the transparent electrode.

The insulating film is made of an acrylic resin, an epoxy resin, a polyethylene resin, a polyester resin,
The film contains either a silicon-based resin or a fluorine-based resin. The thickness of the insulating film is preferably 1.5 μm to 20 μm.

The resin substrate is made of an acrylic resin,
It shall be formed of at least one transparent resin among a polycarbonate resin, an epoxy resin, a polyether terephthalate resin, a polyether sulfone resin, a polyethylene resin, and a silicon resin.

A portable information communication device using a liquid crystal display device is required to be thin, light, and robust. In particular, in information communication devices such as mobile phones, the reduction in thickness and weight is an important evaluation target as a product. By making the thickness of the resin substrate thinner, a display panel that is curved in accordance with the external shape of the device can be realized. Also, if it is a resin substrate, even if a sharp object hits the display panel surface,
The situation where the display panel itself is broken can be avoided. There is a large demand for a mobile phone among the liquid crystal display devices having such characteristics.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A liquid crystal display device having the above-described configuration will be described in detail with reference to evaluation results, mainly focusing on the structure of a substrate and a method of forming the same.

(Embodiment 1) FIG. 1 is a sectional view of a substrate in Embodiment 1. An acrylic resin substrate 1 (also referred to as an acrylic substrate) having a thickness of 400 μm is used as a base material. On one surface of the resin substrate 1, an insulating film 2 made of a polyester resin was formed to a thickness of 5 μm at 100 ° C. by a laminating method. Further, an ITO film 3 was formed on the insulating film 2 to a thickness of 0.16 μm at 40 ° C. by an ion plating method. Thus creating a resin substrate 0.99 × 150 mm ² square. The elastic modulus of this polyester resin is 1.5
GPa.

Next, a method of manufacturing a liquid crystal display device using the resin substrate will be described. The transparent electrode of this resin substrate was patterned by photolithography to form a transparent electrode pattern as a liquid crystal display. Then, after forming an alignment film on the transparent electrode pattern by printing, 250 °
In order to realize a twisted STN mode liquid crystal, an alignment process was performed by rotational rubbing using rayon cloth.
A counter substrate was prepared in the same manner.

An ultraviolet-curable sealing resin containing glass fiber mixed at 1.0 wt% was prepared, and this ultraviolet-curable sealing resin was printed on the periphery of one substrate. On the other substrate, resin beads having a predetermined diameter were sprayed at a rate of 200 beads / mm ² . Then, the two substrates were bonded to each other, and the sealing resin was cured by ultraviolet irradiation. Then, Δn = 0.14
A mixed liquid crystal obtained by mixing a predetermined amount of a chiral agent into the ester type nematic liquid crystal was vacuum-injected and sealed with an ultraviolet curable resin. Then, after curing by irradiation with ultraviolet rays, heat treatment was performed to form a liquid crystal cell, and a liquid crystal display device was prototyped.

Then, for the liquid crystal display device using the substrate of Example 1, the presence or absence of display failure due to the disconnection of the ITO and the threshold unevenness were visually evaluated. A liquid crystal display device using the substrate of Comparative Example 1 was also prototyped in the same manner as that using the substrate of Example 1. Then, Example 1 and Comparative Example 1 were evaluated. As a result, display failure occurred in the liquid crystal display device using the substrate of Comparative Example 1, but in the liquid crystal display device using the substrate of Example 1, display failure due to disconnection and threshold unevenness due to substrate warpage did not occur. And good results were obtained.

Comparative Example 1 As Comparative Example 1, a resin substrate was formed in the same manner as in Example 1 except that the insulating film made of the polyester resin of Example 1 was not formed, and only a conventional transparent electrode was formed.

(Comparative Results) The resin substrate obtained in Example 1 was heated from 20 ° C. to 150 ° C. for 10 minutes,
It was kept at 50 ° C. for 30 minutes. Thereafter, cooling was performed for 30 minutes at an environment temperature of 20 ° C. Such a test was repeated three times, and the ITO surface of the obtained sample was observed using an optical microscope. Twenty locations within a range of 100 × 100 mm ² were observed and evaluated for the presence or absence of cracks in ITO.

As a result, cracks were observed at an average rate of 2.7 / mm ^{2 on} the substrate of Comparative Example 1, but no crack was observed on the substrate of Example 1. The resistance change rate of ITO of this sample was measured. The resistance change rate was represented by (resistance after test) / (resistance before test). As a result, the resistance change rate of Comparative Example 1 was 7.8, and no good result was obtained. On the other hand, the resistance change rate of Example 1 was 1.0, there was no change before and after the test, and good results were obtained.

(Comparative Example 2) Next, a substrate of Comparative Example 2 will be described. An acrylic substrate having a thickness of 400 μm was prepared as a base material, and an insulating film made of a polystyrene resin was formed on one surface of the substrate by lamination at 100 ° C. for 5 μm.
m was formed. Further, an ITO film was formed on the insulating film to a thickness of 0.16 μm at 40 ° C. by an ion plating method. Thus creating a resin substrate 0.99 × 150 mm ² square. The elastic modulus of this polystyrene resin is 2.
It was 3 GPa.

Next, the resin substrate of Comparative Example 2 was heated from 20 ° C. to 15 ° C.
Heated to 0 ° C. for 10 minutes. After being kept at 150 ° C. for 30 minutes, it was cooled at a place where the environmental temperature was 20 ° C. for 30 minutes. This test is repeated three times, and the I
Using a light microscope, the TO surface was observed at 20 locations within a range of 100 × 100 mm ² to evaluate the presence or absence of cracks in ITO.

As a result, in the substrate of Comparative Example 2, cracks were observed at an average rate of 1.2 pieces / mm ² , and good results were not obtained. The resistance change rate of ITO of this sample was measured. The rate of change in resistance is (resistance after test) /
(Resistance before test). As a result, the rate of change in resistance of Comparative Example 2 was 3.7, and no good result was obtained.

From the results of Example 1, Comparative Example 1, and Comparative Example 2, if the insulating film has an elastic modulus of 1.5 GPa or less,
It was found that good results were obtained.

Embodiment 2 Next, a substrate according to Embodiment 2 will be described. FIG. 2 is a sectional view of a resin substrate according to the second embodiment. A 400 μm thick polycarbonate resin substrate 4 (also referred to as a polycarbonate substrate) is used as a base material. An inorganic film 5 made of silicon oxide was formed on both surfaces of the substrate by sputtering at a temperature of 120 ° C. to a thickness of 0.02 μm. Further, an insulating film 6 made of an epoxy resin was formed on the inorganic film 5 to a thickness of 5 μm by a spin coating method. Next, an ITO film 3 was formed on the insulating film 6 by sputtering at a temperature of 120 ° C. to a thickness of 0.16 μm. Thus was created the resin substrate 0.99 × 150 mm ² square. The elastic modulus of the insulating film 6 made of the epoxy resin was 0.7 GPa.

Then, the resin substrate of Example 2 was heated from 20 ° C. to 150 ° C. for 10 minutes, and heated at 150 ° C. for 30 minutes.
Hold for minutes. Then, this resin substrate was cooled for 30 minutes at a place where the environmental temperature was 20 ° C. Such a test was repeated three times, and the ITO surface of the sample was measured using an optical microscope for 100 times.
Twenty locations within the range of × 100 mm ² were observed. Then, the presence or absence of cracks in ITO was evaluated.

As a result, no crack was observed on the substrate of Example 2, and good results were obtained. The resistance change rate of ITO of this sample was measured. The resistance change rate was represented by (resistance after test) / (resistance before test). As a result, the resistance change rate of Example 2 was 1.0, there was no change before and after the test, and good results were obtained.

Using such a resin substrate, a liquid crystal display device was prototyped in the same manner as in Example 1. And Example 2
With respect to the liquid crystal display device, the presence or absence of display failure due to the disconnection of the ITO and the threshold unevenness were visually evaluated. as a result,
In Example 2, good display results were obtained without display failure due to disconnection and threshold unevenness due to substrate warpage.

Embodiment 3 Next, a substrate according to Embodiment 3 will be described. An epoxy-based substrate having a thickness of 400 μm was prepared as a base material, and an insulating film made of an acrylic resin was formed on one surface of the resin substrate by a roll coating method.
A film was formed to a predetermined thickness at 00 ° C. Further, an ITO film was formed on the insulating film to a predetermined thickness at 120 ° C. by a sputtering method. Thus creating a resin substrate 0.99 × 150 mm ² square. The elastic modulus of this acrylic resin is 1.2 GP
a.

Comparative Example 3 As Comparative Example 3, the thickness was 400 μm.
A substrate was prepared by forming an inorganic film and ITO to a predetermined thickness on a soda glass substrate having a thickness of m under the same conditions as in Example 3. Next, the resin substrate of Example 3 was heated from 20 ° C. to 150 ° C. for 10 minutes.
And then kept at 150 ° C. for 30 minutes, and then cooled at a place at an environmental temperature of 20 ° C. for 30 minutes. Such a test was repeated three times, and the ITO surface of the sample was observed using an optical microscope at 20 locations within a range of 100 × 100 mm ² to evaluate the presence or absence of cracks in the ITO. Further, the resistance change of ITO of this sample was measured. Further, a heating and cooling test was performed using the substrate of Comparative Example 3 in the same manner as in the case of the resin substrate, and a comparative material was obtained. The resistance ratio was (resistance of resin substrate after test) / (resistance of glass substrate after test).

Next, a liquid crystal display device was prototyped in the same manner as in Example 1 except that the resin substrate of Example 3 was used. Using the glass substrate of Comparative Example 3 as in Example 3, a liquid crystal display device was prototyped. Then, with respect to the liquid crystal display devices of Example 3 and Comparative Example 3, the presence or absence of display failure due to the disconnection of ITO and the threshold unevenness were visually evaluated. The results of Example 3 and Comparative Example 3 are collectively shown in FIGS. FIG. 3 shows the evaluation results of Example 3 when the film thickness of ITO was 0.08 μm and 0.16 μm, and FIG.
The evaluation result of Example 3 in the case of μm and each evaluation result in Comparative Example 3 are shown.

From these figures, it can be seen that when the thickness of the insulating film made of an acrylic resin is 1.5 μm or more, the cracks and the resistance value of the ITO do not depend on the thickness of the ITO, and good results are obtained. Obtained. In the evaluation of a liquid crystal display device as a prototype, no display failure due to disconnection of the ITO was observed when the thickness of the insulating film made of an acrylic resin was 1.5 μm or more. However, when the thickness of the insulating film made of an acrylic resin was 25 μm, threshold unevenness due to unevenness in the thickness of the insulating film was observed, and good results could not be obtained.

From these results, it was found that good results were obtained when the thickness of the insulating film made of an acrylic resin was 1.5 μm to 20 μm.

The modulus of elasticity of polyethylene is 0.6 to 0.5.
8 GPa, elastic modulus of silicone resin is 0.1-0.8G
Pa, the elastic modulus of the fluororesin is 0.3 to 0.9 GPa. In the above embodiments, as the insulating film, an acrylic resin film, an epoxy resin film, and a polyethylene resin film were used. However, the present invention is not limited thereto, and polyester, silicon resin, and an insulating film containing a fluorine resin may be used. Has confirmed that the same effect can be obtained. In addition, it has been confirmed that the same effect can be obtained by using a resin film in which an inorganic filler is dispersed.

Although the laminating method, the spin coating method, and the roll coating method were used as the method of forming the insulating film in the above embodiments, the present invention is not limited thereto, and the printing method and the dip method may be used. It is confirmed that the effect of can be obtained.

Although the polycarbonate resin, the epoxy resin, and the acrylic resin are used as the resin substrate in the above embodiments, the resin substrate is not limited thereto, and may be, for example, a phenoxy resin, a phenol resin, or a polyether terephthalate resin. It has been confirmed that a similar effect can be obtained even when a resin substrate containing a polyethersulfone-based resin, a polyethylene-based resin, and a silicon-based resin as components is used.

In the second embodiment, the inorganic film is formed on both surfaces of the resin substrate. However, the present invention is not limited to this, and the same effect can be obtained when the inorganic film is formed on one of the surfaces of the resin substrate. Make sure that.

In the above embodiments, the resin substrate is used for both the upper and lower substrates as the liquid crystal display device.
Without being limited to this, a heterogeneous substrate in which one is a resin substrate and the other is a glass substrate can be used.

[0056]

As described above, according to the present invention, the thickness of the transparent electrode is increased by providing an insulating film having an elastic modulus of 1.5 GPa or less between the resin substrate and the transparent electrode. Even in such a case, a substrate free of cracks in the transparent electrode can be obtained. Therefore, a liquid crystal display device capable of gradation display and color display can be manufactured.

[Brief description of the drawings]

FIG. 1 is a sectional view of a resin substrate used in a liquid crystal display device according to a first embodiment of the present invention.

FIG. 2 is a sectional view of a resin substrate used in a liquid crystal display device according to a second embodiment of the present invention.

FIG. 3 is a diagram showing evaluation of a liquid crystal display device in which the thickness of an ITO film and the thickness of an insulating film are used as parameters (part 1).

FIG. 4 is a diagram showing an evaluation of a liquid crystal display device in which the thickness of the ITO film and the thickness of the insulating film are used as parameters (part 2).

[Explanation of symbols]

 Reference Signs List 1 resin substrate (acrylic substrate) 2 insulating film (polyester resin) 3 ITO film 4 resin substrate (polycarbonate substrate) 5 inorganic film (silicon oxide) 6 insulating film (epoxy resin)

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Ikuhiro Hosokawa 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. 72) Inventor Naomi Kaneko 1006 Kadoma, Kazuma, Osaka Pref.F-term in Matsushita Electric Industrial Co., Ltd.

Claims (9)

[Claims] 1. Two substrates having transparent electrodes formed on one surface thereof are opposed to each other, a resin substrate is used for at least one of the two substrates, and a liquid crystal layer is sandwiched between the two substrates. In the liquid crystal display device, the elastic modulus is 1.5 G between the transparent electrode and the resin substrate.
A liquid crystal display device comprising a layer made of an insulating film having a thickness of Pa or less. 2. The insulating film according to claim 1, wherein the insulating film is a film containing any one of an acrylic resin, an epoxy resin, a polyethylene resin, a polyester resin, a silicon resin, and a fluorine resin.
The liquid crystal display device according to the above. 3. The liquid crystal display device according to claim 1, wherein the insulating film has a thickness of 1.5 μm to 20 μm. 4. The resin substrate is made of at least one transparent resin of an acrylic resin, a polycarbonate resin, an epoxy resin, a polyether terephthalate resin, a polyether sulfone resin, a polyethylene resin, and a silicon resin. The liquid crystal display device according to claim 1, wherein the liquid crystal display device is formed. 5. A method for manufacturing a liquid crystal display device, comprising: two substrates facing each other, a resin substrate used as at least one of the two substrates, and a liquid crystal layer sandwiched between the two substrates. A method for manufacturing a liquid crystal display device, comprising: forming an insulating film having an elastic modulus of 1.5 GPa or less on one surface of a resin substrate; and forming a transparent electrode on an upper surface of the insulating film. 6. The insulating film according to claim 5, wherein the insulating film is a film containing any one of an acrylic resin, an epoxy resin, a polyethylene resin, a polyester resin, a silicon resin, and a fluorine resin.
The manufacturing method of the liquid crystal display device according to the above. 7. The method according to claim 5, wherein the insulating film has a thickness of 1.5 μm to 20 μm. 8. The resin substrate is made of at least one transparent resin of an acrylic resin, a polycarbonate resin, an epoxy resin, a polyether terephthalate resin, a polyether sulfone resin, a polyethylene resin, and a silicon resin. 8. The method for manufacturing a liquid crystal display device according to claim 5, wherein the liquid crystal display device is formed. 9. An information communication device comprising the liquid crystal display device according to claim 1. Description: