TW202035330A - Electronic device production method and glass substrate - Google Patents

Abstract

This production method for an electronic device 1 having glass substrates GS1, GS2, comprises a preparation step S1 of preparing a glass substrate GS1 having formed on one surface GS1b of the glass substrate GS1, a protective film 12 protecting the one surface GS1b, and a production step S2 of using the glass substrate GS1 to produce the electronic device 1. In the production step S2, the electronic device 1 is produced by supporting the side on which the protective film 12 of the glass substrate GS1 has been formed.

Description

Manufacturing method of electronic component and glass substrate

The present invention relates to a method for manufacturing an electronic device (device) and a glass substrate, and more particularly to a technology for preventing the strength of the glass substrate from decreasing during manufacturing.

In recent years, from the viewpoint of space saving, flat panel displays such as liquid crystal displays (liquid crystal displays) and organic electroluminescence (EL) displays, thin-film batteries, and touch panels have become popular. ), various electronic components such as organic EL lighting. For these electronic components, further thinning is required. In order to advance the thinning, it is necessary to make the glass substrates used in electronic components thinner.

However, when the glass substrate constituting the electronic component is thinned as described above, the strength of the glass substrate is greatly reduced. Therefore, there are problems such as the following: The glass substrate is used as a substrate under the impact of falling or bending load caused by pressing. There is a growing concern that the starting point causes damage to electronic components.

Therefore, for example, Patent Document 1 discloses a method of manufacturing a liquid crystal display panel provided with a reinforcing structure. The manufacturing method is performed in the following order. First, a predetermined layered structure is formed on one of the two glass substrates facing each other. In this state, the two glass substrates are bonded together, and liquid crystal is sealed between the two bonded glass substrates. Thus, a liquid crystal display panel is formed. Then, on the other surface of each glass substrate directed to the outside of the liquid crystal display panel, a hard coat layer formed of a silicon-based material is formed, thereby manufacturing a liquid crystal display panel provided with a reinforcing structure on the outside. [Prior Art Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 2008-262160

[The problem to be solved by the invention] Here, in fact, the cause of the decrease in the strength of the glass substrate in the manufacturing process of the electronic component was investigated. As a result, it was found that not only the thinning of the glass substrate, but also the handling of the glass substrate in the manufacturing process had problems. Take the manufacturing process of a liquid crystal display panel as an example. After finishing the processing of the glass substrate itself, the glass substrate is conveyed to the process for manufacturing the liquid crystal panel with at least a part of the lower surface supported by a predetermined conveying device. . In addition, in the step of using the glass substrate to produce a liquid crystal display panel such as the bonding step of the glass substrate, the bonding of the glass substrate is performed in a state where the lower surface is supported. Therefore, it is understood that friction occurs between the supported surface (lower surface) of the glass substrate and the member supporting the glass substrate during transportation or panel production, and the supported surface is damaged due to the friction. In this way, even if the manufacturing method described in Patent Document 1 is applied, it is unavoidable that the surface of the glass substrate is damaged before the reinforcement structure is provided. Therefore, a new countermeasure is required.

In view of the above, the technical problem to be solved is to prevent or suppress damage to the surface of the glass substrate during the manufacture of the electronic component, thereby ensuring the strength of the electronic component.

[Means to solve the problem] The above-mentioned problem is solved by the manufacturing method of the electronic component of the present invention. That is, the manufacturing method is a manufacturing method of electronic components, including: a preparation step of preparing a glass substrate; and a manufacturing step of using the glass substrate to manufacture electronic components; in the manufacturing method, in the preparation step, one of the protective devices is prepared The glass substrate of the protective film on the surface is used as a glass substrate, and in the production step, the side of the glass substrate on which the protective film is formed is supported to produce an electronic component.

As described above, in the method of manufacturing an electronic component of the present invention, a glass substrate with a protective film is prepared. The glass substrate with a protective film is preliminarily formed with a protective film to protect one of the surfaces of the glass substrate and supports the The protective film is formed on the side of the glass substrate with a protective film to produce an electronic component. If so, even if friction occurs between the glass substrate and the supporting member during the transportation of the glass substrate or the production process of the electronic component using the glass substrate, the protective film can prevent or suppress damage to the surface of the glass substrate. . Thereby, the strength (for example, bending strength) of the electronic component including the glass substrate can be ensured.

In addition, in the method of manufacturing an electronic component of the present invention, the protective film may be a low-friction film exhibiting a static friction coefficient lower than that of a glass substrate.

As described above, by setting the protective film as a low-friction film exhibiting a lower static friction coefficient than the glass substrate, the glass substrate can be made to slide more easily during transportation or during panel production. Thereby, damage to the glass substrate can be suppressed more effectively.

In addition, when the protective film is a low-friction film, the static friction coefficient of the low-friction film may be 0.42 or less in the method for manufacturing an electronic component of the present invention.

Specifically, by using a protective film (low-friction film) with a static friction coefficient of 0.42 or less, sufficient sliding between the surface of the glass substrate and the target surface can be ensured. Therefore, damage to the surface of the glass substrate can be sufficiently suppressed, thereby ensuring the cost of electronic components. Required strength. In addition, the static friction coefficient refers to the protective film formed on the glass substrate and the wrapping film (wrapping film) LWFS- manufactured by Sankyo Chemical Co., Ltd. in accordance with Japanese Industrial Standard (JIS) K 7125: 1999. The static friction coefficient between 30#4000 is measured.

In addition, the solution of the above-mentioned problem is also achieved by the glass substrate of the present invention. That is, the glass substrate is a glass substrate for electronic components, in which a protective film for protecting the non-guaranteed surface is formed on the non-guaranteed surface.

As described above, in the glass substrate of the present invention, a protective film for protecting the non-guaranteed surface is formed on the non-guaranteed surface. Generally, for such a glass substrate, the surface (guaranteed surface) for which the required quality should be guaranteed is as non-contact as possible, and each step of the glass substrate is conveyed and processed. At this time, the non-guaranteed surface located on the back side of the guaranteed surface becomes the contacted surface at the time of transportation or processing. Therefore, if the non-guaranteed surface is a glass substrate protected by a protective film, friction will occur between the non-guaranteed surface of the glass substrate and the member contacting the non-guaranteed surface even during the transportation of the glass substrate or the production step of electronic components. In the case of, the protective film can also be used to prevent or suppress damage to the surface of the glass substrate. Thereby, the strength of the electronic component including the glass substrate can be ensured.

[Effects of the invention] As described above, according to the method for manufacturing an electronic component and the glass substrate of the present invention, it is possible to prevent or suppress damage to the surface of the glass substrate during the manufacture of the electronic component, thereby ensuring the strength of the electronic component.

Hereinafter, an embodiment of the present invention will be described.

FIG. 1 shows a liquid crystal display panel 1 as an example of an electronic component, which is an application target of the present invention. The liquid crystal display panel 1 includes: a first glass substrate GS1; a second glass substrate GS2; a spacer SP; a liquid crystal layer 2, arranged between the first glass substrate GS1 and the second glass substrate GS2; a first build-up layer The part 3 is arranged between the first glass substrate GS1 and the liquid crystal layer 2; and the second build-up part 4 is arranged between the second glass substrate GS2 and the liquid crystal layer 2.

The shapes of the first glass substrate GS1 and the second glass substrate GS2 are rectangular in this embodiment, but of course they are not limited to this shape. As the material of each glass substrate GS1 and glass substrate GS2, silicate glass and silica glass are used, preferably borosilicate glass, soda lime glass, aluminosilicate glass, chemically strengthened glass, and most preferably used Alkali-free glass. By using alkali-free glass as each of the glass substrate GS1 and the glass substrate GS2, it can become a chemically stable glass. Here, the so-called alkali-free glass is a glass that does not substantially contain an alkali component (alkali metal oxide), and specifically refers to a glass in which the weight ratio of the alkali component is 3000 ppm or less. The weight ratio of the alkali component of the present invention is preferably 1000 ppm or less, more preferably 500 ppm or less, and most preferably 300 ppm or less.

The glass substrate GS1 and the glass substrate GS2 can be made by the well-known float method, roll out method, slot down draw method, and redraw method. It is formed by the like, but it is preferably formed by an overflow down draw method.

The thickness of each glass substrate GS1 and glass substrate GS2 is set to 1000 μm or less, preferably 10 μm or more and 700 μm or less, more preferably 20 μm or more and 500 μm or less, and most preferably 200 μm or more and 500 μm or less.

The first build-up portion 3 is formed on the inner surface GS1a of the first glass substrate GS1 (the inner side here refers to the inner side of the liquid crystal display panel 1), and includes, for example, a first electrode layer 5 (pixel electrode) including a transparent conductive film TCF ) And a first alignment film 6 laminated on the first electrode layer 5.

The material of the first electrode layer 5 (transparent conductive film TCF) is not particularly limited as long as it has translucency and conductivity. The first electrode layer 5 is made of, for example, indium tin oxide (ITO), fluorine doped tin oxide (FTO), indium zinc oxide (IZO), aluminum doped zinc oxide (Aluminum doped Zinc Oxide, AZO) and so on.

The first alignment film 6 is a transparent film, and is formed of, for example, a polyimide film having micro grooves formed by rubbing treatment and other materials. The liquid crystal molecules contained in the liquid crystal layer 2 may be aligned at a pretilt angle under the action of the first alignment film 6.

The second build-up portion 4 is formed on the inner surface GS2a of the second glass substrate GS2, and includes, for example, a color filter layer (color filter layer) 7, a second electrode layer 8 (opposing electrode) including a transparent conductive film TCF, and a first Two alignment film 9. The color filter layer 7 is formed of a black matrix and a plurality of colored pixels. The material, thickness and sheet resistance of the second electrode layer 8 are the same as those of the first electrode layer 5. The structure, material, and thickness of the second alignment film 9 are the same as those of the first alignment film 6.

The sealing portion S is a sealing member formed in a frame shape so as to surround the periphery of the liquid crystal layer 2. Here, the sealing portion S is formed of a sealing material such as ultraviolet (Ultraviolet, UV) curable resin or thermosetting resin, but of course it is not limited to any of these materials. In addition, the spacer SP has a spherical shape, for example, and contains resin or silicon dioxide. With the spacers SP arranged in a manner dispersed in the liquid crystal layer 2, the interval between the first glass substrate GS1 and the second glass substrate GS2 is maintained constant.

The liquid crystal layer 2 contains nematic liquid crystals and the like. The liquid crystal layer 2 is formed in the space partitioned by the first glass substrate GS1, the second glass substrate GS2, and the sealing portion S.

The first polarizing plate 10 is arranged on the outermost side of the first glass substrate GS1, and the second polarizing plate 11 is arranged on the outermost side of the second glass substrate GS2. In addition, although illustration is omitted, a retardation plate may be provided in addition to the polarizing plate 10 and the polarizing plate 11.

In addition, in this embodiment, a protective film 12 for protecting the outer surface GS1b is formed on the surface of the first glass substrate GS1 on the opposite side to the side on which the first electrode layer 5 is formed (ie, the outer surface GS1b). At this time, the protective film 12 is arranged between the first glass substrate GS1 and the first polarizing plate 10.

Here, the protective film 12 is configured to exhibit a lower friction coefficient (static friction coefficient, dynamic friction coefficient) than the first glass substrate GS1 (low friction film). Specifically, it is formed of a material with a lower friction coefficient than glass.

Here, when the protective film 12 of the structure is selected in terms of the self-friction coefficient (especially in the case of a low-friction film), for example, the static friction coefficient of the protective film 12 is preferably 0.42 or less, preferably 0.35 or less, and more preferably To show below 0.30. As a material exhibiting such a coefficient of friction, a fluorine-based material can be exemplified.

On the other hand, when the protective film 12 of the above-mentioned configuration is selected in terms of characteristics and performance, for example, the protective film 12 may be a functional film. The functional film referred to here includes a film that imparts various properties to the glass substrate GS1 formed with the protective film 12, such as anti-reflection (AR) and anti-fingerprint contamination (Anti-reflection). -fingerprint, AF), anti-glare (anti-glare) function (Anti-glare, AG), infrared cut function (IR), conductivity imparting function, cold mirror function, ultraviolet cut function (UV) )Wait. Among them, for example, from the viewpoint of film formation efficiency, a film (anti-fouling film) that can be formed by spraying and has an antifouling function is suitable.

Alternatively, when the protective film 12 of the above-mentioned composition is selected in terms of its material, the protective film 12 may be a thin film (organic film) formed of an organic material, or may be an inorganic material such as SiO ₂ , Nb ₂ O ₅ , SiNx, and ITO. Thin film (inorganic film) formed by material.

Hereinafter, the method of manufacturing the liquid crystal display panel 1 of the above-mentioned structure is demonstrated. As shown in FIG. 2, the manufacturing method of the liquid crystal display panel 1 of the present embodiment includes: a preparation step S1 of preparing a predetermined glass substrate; and a manufacturing step S2 of using the predetermined glass substrate to manufacture the liquid crystal display panel 1.

(S1) Preparation steps As shown in FIG. 3, the preparation step S1 includes: obtaining step S3, obtaining first mother glass GM1 and second mother glass GM2; and protective film forming step S4, in which at least one of the obtained mother glass GM1 and mother glass GM2 is obtained Those (in this embodiment, the first mother glass GM1) form the protective film 12.

(S3) Steps for obtaining mother glass In this step, the first mother glass GM1 (refer to FIG. 4A) and the second mother glass GM2 (refer to FIG. 4B) of a predetermined shape and a predetermined size are obtained. Here, both the first mother glass GM1 and the second mother glass GM2 are glass substrates that become the first glass substrate GS1 and the second glass substrate GS2 shown in FIG. 1. In other words, the first glass substrate GS1 and the second glass substrate GS2 shown in FIG. 1 are processed from the first mother glass GM1 and the second mother glass GM2 by the so-called multi-face processing after bonding (after the assembly step S6 described later). The cut glass substrate (refer to the area surrounded by the dotted chain line in Figure 4A and Figure 4B). Thereby, the thickness dimension, material (composition) and forming method of each mother glass GM1 and mother glass GM2 are basically the same as the thickness dimension, material and forming method of the glass substrate GS1 and the glass substrate GS2. At this time, the first laminated portion 3 is formed on one surface GM1a of the mother glass GM1, the second laminated portion 4 is formed on one surface GM2a of the mother glass GM2, and the other surface GM1b of the first mother glass GM1 is formed with Protective film 12. In addition, the dot chain line in FIG. 4A and FIG. 4B is the planned cutting line of the cutting step S7 mentioned later. The dot chain lines in FIGS. 7A to 9B are also the planned cutting lines.

(S4) Protective film forming step In this step, the protective film 12 is formed on the surface (the other surface GM1b) opposite to the one surface GM1a of the first mother glass GM1 forming the first build-up portion 3 (see FIG. 1). Here, the method of forming the protective film 12 is arbitrary, and a known film-forming method can be appropriately selected according to the type of the protective film 12. For example, when the protective film 12 is formed of an antifouling film such as an AF coating (coat), the protective film 12 is formed on the entire surface of the other surface GM1b by a method such as spraying. Thereby, as shown in FIG. 5, the 1st mother glass GM1 (glass substrate with a protective film) in the state in which the protective film 12 was formed in the other surface GM1b was obtained. Here, the other surface GM1b of the first mother glass GM1 is the outer surface GS1b of the first glass substrate GS1 that is the cutting target (the outer side here refers to the outer side of the liquid crystal display panel 1). In addition, the outer surface GS1b is also a non-guaranteed surface.

(S2) Production steps The manufacturing step S2 of the liquid crystal display panel 1 includes a build-up portion forming step S5, an assembling step S6, and a cutting step S7 (see FIG. 6), which are all manufacturing-related processing steps.

(S5) Step of forming build-up portion In this step, the first layered portion 3 is formed on one surface GM1a side of the first mother glass GM1 on which the protective film 12 is formed, and the second layered portion 4 is formed on one surface GM2a of the second mother glass GM2 (refer to FIG. 7A and Figure 7B). In this embodiment, the first electrode layer 5 including the transparent conductive film TCF and the first alignment film 6 are formed as the first layered portion 3 on one of the surfaces GM1a of the first mother glass GM1. In addition, the color filter layer 7, the second electrode layer 8 including the transparent conductive film TCF, and the second alignment film 9 are formed as the second layered portion 4 on one of the surfaces GM2a of the second mother glass GM2.

Here, if the specific formation procedure of the first laminated part 3 on the first mother glass GM1 is described, first, a transparent conductive film TCF is formed on one surface GM1a of the first mother glass GM1 on which the protective film 12 is formed. Next, after coating a photoresist (photosensitive resin) on the transparent conductive film TCF to form a resist layer, the resist layer covers the photomask and irradiates the photomask with light such as ultraviolet rays, thereby forming a predetermined shape on the photomask. The pattern is transferred to the resist layer. Then, when a positive photoresist is used, for example, a resist developer is supplied to remove the exposed part of the resist layer, and an etching process is performed to remove unnecessary parts of the resist layer and the transparent conductive film TCF, and the transparent conductive film The conductive film TCF forms a pattern corresponding to the photomask. Then, by removing the resist layer remaining on the transparent conductive film TCF, the first electrode layer 5 including the transparent conductive film TCF and having a predetermined electrode pattern is formed (see FIG. 8A). Afterwards, the first alignment film 6 is formed to cover the first electrode layer 5, thereby obtaining the first mother glass GM1 in a state in which the first electrode layer 5 is formed by the first alignment film on one surface GM1a 6-covered first build-up portion 3 (refer to FIGS. 7A and 8A). Hereinafter, the first mother glass GM1 in this state is also referred to as a first laminate LM1.

In addition, the procedure for forming the second build-up portion 4 on the second mother glass GM2 will be described. First, after forming, for example, a black matrix on one surface GM2a of the second mother glass GM2, the color resist coating step and exposure are repeated. Steps, developing and baking steps, thereby forming a color filter layer 7 corresponding to multiple colors (RGB). Then, after the transparent conductive film TCF is formed on the surface of the color filter layer 7, if necessary, the same patterning process as that of the first mother glass GM1 is performed, thereby forming the transparent conductive film TCF and having a predetermined electrode pattern The second electrode layer 8 (the extending direction of each electrode is orthogonal to the first electrode layer 5 and the second electrode layer 8). After that, by forming the second alignment film 9 to cover the second electrode layer 8, the second mother glass GM2 is obtained in a state in which the second electrode layer 8 is formed on one surface GM2a by the second alignment The second build-up portion 4 covered with the film 9 (see FIGS. 7B and 8B). Hereinafter, the second mother glass GM2 in this state is also referred to as a second laminate LM2.

In addition, when the liquid crystal display panel 1 is an active matrix driving type instead of a passive matrix driving type, the first electrode layer 5 is formed by photolithography and other methods to form source, gate, drain, insulating layers, Switch components (Thin Film Transistor (TFT), etc.).

In addition, the method of forming the transparent conductive film TCF is arbitrary. For example, it can be formed by a known film forming method such as sputtering, vapor deposition, and chemical vapor deposition (Chemical Vapor Deposition, CVD). In addition, the type of transparent conductive film TCF that can be formed is also arbitrary, and an ITO film can be cited as an example.

In addition, the method of forming the first alignment film 6 and the second alignment film 9 is also arbitrary, and for example, they can be formed by a known method such as a spin coating method. In addition, rubbing treatment may be performed on each alignment film 6 and alignment film 9. Although illustration is omitted, countless minute grooves are formed on the surfaces of the alignment film 6 and the alignment film 9 by this rubbing treatment.

(S6) Assembly steps In this step, the assembly 13 of the liquid crystal display panel 1 is assembled. First, as shown in FIG. 9A, the first layered body LM1 and the second layered body LM2 are opposed to each other, and between the layered body LM1 and the layered body LM2, the sealing material forming the sealing portion S and the spacer SP are supplied. In this embodiment, the sealing material forming the sealing part S is preliminarily coated on the first alignment film 6 of the first laminate LM1 so that the sealing part S is in a grid shape in a plan view (see FIG. 9A ). A plurality of regions surrounded by the sealing portion S, that is, a plurality of regions forming a space (see FIG. 1) for forming the liquid crystal layer 2 are filled with liquid crystal, and the spacers SP are dispersed. At this time, the first layered body LM1 is arranged below the second layered body LM2, and the first layered body LM1 and the second layered body LM2 are arranged such that the first alignment film 6 and the second alignment film 9 face each other. As a result, the protective film 12 is arranged on the lowermost side of the first laminate LM1. In addition, the sealing material S may be in a form that is not applied to the part of the planned cutting line. In other words, what is necessary is just to make the sealing material S a division structure in the width direction (the left-right direction of the paper surface of FIG. 9A), and what is necessary is just to make a space between the divided sealing materials S.

From this state, for example, the first layered body LM1 is raised to approach the second layered body LM2, the spacer SP is sandwiched between the two layered bodies LM1 and LM2, and the pre-coated on the first layered body LM1 The sealing material of the sealing part S contacts the 2nd laminated body LM2 (refer FIG. 9B). Here, by curing the sealing material (for example, when a UV curable resin is used as the sealing material, curing is performed by irradiating ultraviolet rays), a sealing portion S is formed between the laminate LM1 and the laminate LM2, and is in contact with the sealing material Each of the laminated body LM1 and the laminated body LM2 are then fixed to the sealing portion S. As a result, the first layered body LM1 and the second layered body LM2 are bonded to each other via the sealing portion S.

In addition, by applying the sealing material so that the sealing portion S is grid-like in a plan view, the first layered body LM1 and the second layered body LM2 are bonded to each other. A plurality of liquid crystal layers 2 are formed in the area surrounded by the two-layered body LM2 and the sealing portion S (see FIG. 9B). In this way, the assembly 13 of the liquid crystal display panel 1 in which the plurality of liquid crystal layers 2 are formed between the first laminate LM1 and the second laminate LM2 is assembled (see FIG. 10 ).

In such assembling step S6, the first layered body LM1 is supported from below by, for example, a roller of a conveying device for carrying in and out of the first layered body LM1, an elevating member for raising the first layered body LM1, and the like.

(S7) Cutting step After that, by cutting the assembly 13 along a predetermined cutting plan line (for example, the cutting plan line shown by the dotted chain line in FIGS. 7A to 9B), a pair of glass substrates GS1 and GS2 are attached to each other. The base body 1a of the multiple liquid crystal display panel 1 (refer FIG. 11) formed together. Then, by fixing the polarizing plate 10 and the polarizing plate 11 on both surfaces of the base 1a, and mounting necessary electronic components, etc., the liquid crystal display panel 1 shown in FIG. 1 is manufactured.

According to the above description, in the method of manufacturing an electronic component of the present invention, before the implementation of the production step S2, a glass substrate with a protective film (the first mother glass GM1 on which the protective film 12 is formed) is prepared, and the glass substrate The liquid crystal display panel 1 is produced in a state where the side on which the protective film 12 is formed is supported. Thereby, even in the following cases, for example, in the step of forming a laminated portion on the first mother glass GM1, the assembly step S6 of the liquid crystal display panel 1 using the first mother glass GM1, the assembly 13 of the liquid crystal display panel 1 When cutting along the planned cutting line, friction occurs between the first mother glass GM1 side and various supporting members, and the protective film 12 can also prevent or suppress damage to the surface of the first mother glass GM1. Thereby, the strength of the liquid crystal display panel 1 including the first glass substrate GS1 obtained by cutting the first mother glass GM1 can be ensured.

In addition, when the first laminate LM1 (first mother glass GM1) is supported and transported by the rollers of the transport device as in the present embodiment, the friction between the roller and the first mother glass GM1 side cannot be avoided. As described above, the protective film 12 is formed on the supporting side of the first mother glass GM1 (the other surface GM1b side), which can prevent or suppress damage to the first mother glass GM1 due to friction when positioning is stopped.

As mentioned above, although one embodiment of this invention was described, the manufacturing method of the electronic component of this invention, and a glass substrate are not limited to the said illustration form. The manufacturing method and glass substrate can take various forms within the scope of the present invention.

For example, in the above-mentioned embodiment, the case where the protective film 12 is formed on the whole surface of the other surface GM1b of the 1st mother glass GM1 was illustrated, but of course it is not limited to this. The support of the member supporting the first mother glass GM1 in the roller or the lifting member in the assembly step S6, the supporting form of the member supporting the first mother glass GM1 in the layer formation step S5, and the support of the member supporting the first mother glass GM1 when transported between these steps For the form, the protective film 12 is formed on a predetermined part of the other surface GM1b.

In addition, in the above-mentioned embodiment, the case where the lifting member as the supporting member is raised to bring the first laminated body LM1 close to the second laminated body LM2 is illustrated. However, for example, the first laminated body may be supported from below. In the body LM1, the second laminated body LM2 is lowered from above to sandwich the spacer SP. In short, as long as the spacer SP can be sandwiched by the relative movement of the first laminated body LM1 and the second laminated body LM2, the movement form is arbitrary.

In addition, in the said embodiment, the case where the protective film 12 is formed only on the 1st mother glass GM1 in the preparation step S1 is illustrated, but of course, you may form the protective film 12 on both of the mother glass GM1, and mother glass GM2.

In addition, in the above-mentioned embodiment, the following sequence is illustrated by forming the protective film 12 on one of the mother glass GM1, forming the first layered portion 3 on the mother glass GM1, and forming the second layered portion 4 on the mother glass GM2 to form the second layer. A laminated body LM1 and a second laminated body LM2, the produced laminated body LM1 and the laminated body LM2 are bonded to each other to produce the assembly 13 of the liquid crystal display panel 1, and then cut to obtain the liquid crystal display panel 1, but of course it can be Based on other orders. Although the illustration is omitted, for example, each mother glass GM1 and mother glass GM2 may be cut into each glass substrate GS1 and glass substrate GS2, and then the laminated portion formation step S5 and the assembly step S6 may be performed on each glass substrate GS1 and the glass substrate GS2. . At this time, the protective film 12 can be formed at any stage before and after cutting.

In addition, in the above-mentioned embodiment, the case where the protective film 12 is formed on the mother glass in the preparation step S1 and the protective film 12 is not formed again in the manufacturing step S2 is illustrated. However, if necessary, a protective film 12 may be formed in the manufacturing step S2 step.

In addition, in the above embodiment, a rectangular single-piece glass substrate is illustrated as each of the mother glass GM1 and the mother glass GM2, but of course it can also be formed on the mother glass GM1 and the mother glass GM2 in other forms. Protective film 12. Although illustration is omitted, for example, a glass substrate (glass film) whose thickness is so thin that it can be wound is used as the mother glass, and the protective film 12 is formed on the glass film. At this time, the step of forming the protective film 12 in the glass film can be performed by continuously performing a film forming process on one of the surfaces of the glass film supplied by a so-called roll to roll type. It is only necessary to perform cutting after the protective film 12 is continuously formed, and to perform the build-up portion forming step S5 and the assembling step S6 in this order.

In addition, in the above description, the case where the liquid crystal display panel 1 is produced as an electronic component has been exemplified, but of course the present invention can also be applied when producing other electronic components. Although illustration is omitted, for example, the present invention can also be applied when producing organic EL lighting (components) or touch panels as electronic components. [Example 1]

Hereinafter, the contents of experiments to prove the usefulness of the present invention will be described.

In this example, 0.5 t of OA-11 manufactured by NEG Glass Co., Ltd. was prepared as a glass substrate, and OPTOOL UF503 manufactured by Daikin Industries Co., Ltd. was used as an AF coating agent. A mixture of Novec 72DE manufactured by 3M Japan Co., Ltd. is used as a protective film material. After cleaning the glass substrate, spray-coating the mixed solution on the glass substrate and wipe it, dry it at room temperature, and then perform a heat treatment at 150°C for 30 minutes to obtain a protective film formed on the surface of the glass substrate. A glass substrate in the state of AF coating. The coefficient of static friction between the glass substrate and the packaging film LWFS-30#4000 manufactured by Sankyo Rika Chemical Co., Ltd. was measured in accordance with JIS K 7125: 1999, and the result was 0.26.

In contrast, a glass substrate (the glass substrate) on which any protective film is not formed on the glass substrate is prepared. The static friction coefficient of the glass substrate was measured by the method, and the result was 0.59.

The damage test was performed for the purpose of reproducing the damage that occurred during the production on the glass substrate with a protective film (Example) and the glass substrate without a protective film (Comparative Example). The damage test was performed by rubbing the packaging film LWFS-30#4000 manufactured by Sankyo Chemical Co., Ltd. on the surface of each glass substrate. For a glass substrate with a protective film, a damage test was performed by rubbing the packaging film on the side where the protective film was formed. The conditions at this time are that the surface load is 500 g, the moving speed is 3 m/min, and the number of rubbings is 10 round trips. The damaged glass substrate with a protective film was referred to as Example 1. In addition, the damaged glass substrate without a protective film was referred to as Comparative Example 1.

For the three glass substrates (Examples and Comparative Examples), the breaking load in a ring-on-ring test was measured. The conditions at this time are that the diameter of the piston side ring is 12.5 mm, the diameter of the support side ring is 25 mm, and the lowering speed of the piston side ring is 0.5 mm/s. The damage test and the ring-to-ring test were performed on 30 glass substrates each, and the median of the measured breaking load [N] was used as an evaluation value.

The test results are shown in Table 1. According to the results of the comparative example, if the surface of the glass substrate is damaged, the breaking load is greatly reduced. In contrast, in the case of the glass substrate with a protective film as an example, a relatively excellent breaking strength (breaking load) was also exhibited in a ring-to-ring test after damage. Based on this, it is considered that the protective film makes it difficult to cause damage at the time of manufacturing, thereby suppressing the deterioration of the breaking strength. [Table 1] Protective film damage Breaking load [N] Example ○ ○ 480 Comparative example X ○ 219

1: LCD panel 1a: matrix 2: liquid crystal layer 3: The first layer 4: The second layer 5: The first electrode layer 6: The first alignment film 7: Color filter layer 8: second electrode layer 9: The second alignment film 10: The first polarizer 11: The second polarizer 12: Protective film 13: aggregate LM1: The first laminate LM2: Second multilayer body GM1: The first mother glass GM1a, GM2a: one of the surfaces GM1b: another surface GM2: The second mother glass GS1: The first glass substrate GS1a, GS2a: inside surface GS1b: Outer surface (one of the surfaces) GS2: Second glass substrate S: Sealing part SP: Spacer TCF: Transparent conductive film S1: Preparation steps S2: production steps S3: Obtaining steps S4: protective film formation step S5: Steps for forming build-up part S6: Assembly steps S7: Cutting step

FIG. 1 is a cross-sectional view of a liquid crystal display panel according to an embodiment of the present invention. FIG. 2 is a flowchart (flowchart) showing the procedure of the method of manufacturing the liquid crystal display panel shown in FIG. 1. Fig. 3 is a flowchart showing the sequence of the preparation steps shown in Fig. 2. 4A is a perspective view of the first mother glass prepared in the preparation step shown in FIG. 2. 4B is a perspective view of the second mother glass prepared in the preparation step shown in FIG. 2. Fig. 5 is a perspective view of a first mother glass formed with a protective film. Fig. 6 is a flowchart showing the sequence of the production steps shown in Fig. 2. Fig. 7A is a perspective view of a first laminate including a first mother glass prepared in the assembling step shown in Fig. 6. Fig. 7B is a perspective view of a second laminate including a second mother glass prepared in the assembling step shown in Fig. 6. Fig. 8A is a cross-sectional view of the first laminate shown in Fig. 7. Fig. 8B is a cross-sectional view of the second laminate shown in Fig. 7. Fig. 9A is a cross-sectional view showing an example of the assembly procedure shown in Fig. 6. Fig. 9B is a cross-sectional view showing an example of the assembly procedure shown in Fig. 6. Fig. 10 is a perspective view of an assembly of liquid crystal display panels obtained in an assembling step. Fig. 11 is a perspective view showing an example of a cutting step.

1: LCD panel

1a: matrix

2: liquid crystal layer

3: The first layer

4: The second layer

5: The first electrode layer

6: The first alignment film

7: Color filter layer

8: second electrode layer

9: The second alignment film

10: The first polarizer

11: The second polarizer

12: Protective film

GS1: The first glass substrate

GS1a, GS2a: inside surface

GS1b: Outer surface (one of the surfaces)

GS2: Second glass substrate

S: Sealing part

SP: Spacer

TCF: Transparent conductive film

Claims (4)

A manufacturing method of an electronic component, comprising: a preparation step of preparing a glass substrate; and a manufacturing step of using the glass substrate to manufacture an electronic component; and In the preparation step, a glass substrate formed with a protective film for protecting one surface is prepared as the glass substrate, In the manufacturing step, the electronic component is manufactured by supporting the side of the glass substrate on which the protective film is formed. In the method for manufacturing an electronic component as described in claim 1, wherein the protective film is a low-friction film exhibiting a lower static friction coefficient than the glass substrate. The method for manufacturing an electronic component as described in item 2 of the scope of patent application, wherein the static friction coefficient of the low friction film is 0.42 or less. A glass substrate is a glass substrate for electronic components, and A protective film for protecting the non-guaranteed surface is formed on the non-guaranteed surface.

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