JP2020093318A - Grinding method for work piece - Google Patents

Abstract

To provide a grinding method for a work piece, whereby burrs resulting from grinding can be reduced.SOLUTION: A grinding method for a work piece comprises: a first grinding step ST1 in which after a grinding stone is positioned at a height where the work piece is ground a predetermined amount, a chuck table is horizontally moved to a processing area from a conveyance entry/exit area, thereby passing the rotating grinding stone from one side surface of the work piece to the opposing other side surface thereof to grind the work piece; a moving step ST2 in which, after the first grinding step ST1, the grinding stone is retracted to a height where the grinding stone is not in contact with the work piece, and, in this state, the chuck table is moved from the processing area to the conveyance entry/exit area; and a second grinding step ST3 in which after the work piece is rotated 180 degrees and the grinding stone is positioned at a height where the work piece is ground a predetermined amount, the chuck table is horizontally moved from the conveyance entry/exit area to the processing area, thereby passing the rotating grinding stone from one side surface of the work piece to the opposing other side surface thereof to grind the work piece. The foregoing steps are carried out at least one or more times.SELECTED DRAWING: Figure 4

Description

The present invention relates to a method of grinding a work piece.

As a grinding method for thinning an object to be processed such as a wafer, various methods of grinding an object to be processed have been implemented (for example, refer to Patent Document 1 and Patent Document 2).

JP, 2009-246098, A JP, 2011-18858, A

In the method for grinding a work piece shown in the above-mentioned Patent Documents 1 and 2, when the work piece contains a metal such as a copper (Cu) alloy or a nickel (Ni) alloy, the metal is ground. At that time, burr is likely to occur.

An object of the present invention is to provide a method for grinding a work piece that can suppress burrs after grinding.

In order to solve the above-mentioned problems and achieve the object, a method of grinding a workpiece according to the present invention includes a chuck table provided with a horizontal moving unit that horizontally moves between a loading/unloading area and a processing area, and a rotatable chuck table. Object to be subjected to creep feed grinding by a processing device, which is held by the tip of a spindle and grinds a workpiece held by the chuck table, and a vertical moving means for vertically moving the spindle. The grinding method of claim 1, wherein after the grinding wheel is positioned at a height for grinding a workpiece by a predetermined amount, the chuck table is rotated horizontally by moving the chuck table from the loading/unloading area to the processing area. A first grinding step in which the grinding wheel is removed from one side surface of the work piece to the other side surface of the opposite side and creep feed grinding is performed, and a height at which the grinding wheel is not in contact with the work piece after the grinding step is performed. Moving step for moving the chuck table from the working area to the carry-in/out area in a state of being retracted to, and a height at which the workpiece is rotated 180 degrees and the grinding wheel grinds the workpiece by a predetermined amount. After moving the chuck table horizontally from the loading/unloading area to the processing area, the rotating grinding wheel is pulled out from one side surface of the workpiece to the other side surface of the opposite side. The second grinding step of creep feed grinding is performed at least once.

The method of grinding a workpiece according to the present invention includes a chuck table provided with a horizontal moving unit that horizontally moves between a loading/unloading area and a processing area, and a rotatable chuck for grinding a workpiece held on the chuck table. What is claimed is: 1. A grinding method for a workpiece, which is creep feed-ground by a processing device comprising a grinding wheel held at a tip of a spindle and a vertical moving means for moving the spindle in a vertical direction. By moving the chuck table in the horizontal direction from the loading/unloading area to the processing area in a state in which the grinding table is positioned at a height for grinding by a predetermined amount. Side to the other side surface and creep feed grinding is performed, and the chuck table is moved to and from the processing area in a state where the grinding wheel is retracted to a height at which the grinding wheel does not contact the workpiece. Moving step to the area, and with the grinding wheel positioned at a height for grinding the workpiece by a predetermined amount, the spindle rotation direction is reversed to move the chuck table from the loading/unloading area to the processing area. A second grinding step in which the grinding wheel is moved from one side surface side to the other side surface side on the opposite side by moving in the horizontal direction and creep feed grinding is performed at least once or more. And

A method of grinding a workpiece according to the present invention is a method of grinding a workpiece held by a rotatable chuck table by in-feed grinding with a grinding wheel held by a tip of a rotatable spindle. Positioning the grinding wheel so that it is always in contact with the center of rotation of the chuck table, and grinding the grinding wheel by a predetermined amount in the direction perpendicular to the holding surface of the chuck table to thin the workpiece. A first grinding step of the workpiece, a reversing step of reversing the rotation direction of the spindle in a state where the grinding wheel is retracted to a height that does not contact the workpiece after the grinding step, and the chuck table Positioning the grinding wheel so that it is always in contact with the center of rotation of the workpiece, and grinding the grinding wheel by a predetermined amount in the direction perpendicular to the holding surface of the chuck table while thinning the workpiece. The second grinding step is performed at least once.

The method for grinding a workpiece according to the present invention has an effect of suppressing burr after grinding.

FIG. 1 is a perspective view showing an example of a workpiece to be processed by the method for grinding a workpiece according to the first embodiment. FIG. 2 is a sectional view of a main part of the workpiece shown in FIG. FIG. 3 is a perspective view showing a configuration example of a grinding device used in the method for grinding a workpiece according to the first embodiment. FIG. 4 is a flowchart showing the flow of the method for grinding a workpiece according to the first embodiment. FIG. 5 is a side view schematically showing a state in which the grinding wheel is positioned at a height for grinding a first predetermined amount in the first grinding step of the method for grinding a workpiece shown in FIG. 4. FIG. 6 is a side view schematically showing a state in which the grinding wheel grinds the workpiece in the first grinding step of the method for grinding the workpiece shown in FIG. FIG. 7 is a cross-sectional view of a main part of the work piece after the first grinding step of the work piece grinding method shown in FIG. 4. FIG. 8 is a plan view schematically showing the surface of the work piece after the first grinding step of the work piece grinding method shown in FIG. 4. FIG. 9: is a side view which shows typically the moving step of the grinding method of the workpiece shown in FIG. FIG. 10 is a cross-sectional view of a main part of the workpiece after the moving step of the method for grinding the workpiece shown in FIG. FIG. 11 is a side view schematically showing a state in which the grinding wheel is positioned at a height for grinding a first predetermined amount in the second grinding step of the method for grinding a workpiece shown in FIG. FIG. 12 is a side view schematically showing a state in which the grinding wheel grinds the workpiece in the second grinding step of the method for grinding the workpiece shown in FIG. FIG. 13 is a cross-sectional view of a main part of the work after the second grinding step of the method for grinding the work shown in FIG. FIG. 14 is a plan view schematically showing the surface of the workpiece after the second grinding step of the method for grinding the workpiece shown in FIG. FIG. 15 is a cross-sectional view of the main part of the workpiece after the second moving step of the method for grinding a workpiece shown in FIG. FIG. 16 is a cross-sectional view of a main part of the work piece after the second first grinding step of the work piece grinding method shown in FIG. 4. FIG. 17 is a cross-sectional view of the main part of the workpiece after the second moving step of the method for grinding a workpiece shown in FIG. FIG. 18 is a cross-sectional view of the main part of the workpiece after the second grinding step for the second time in the method of grinding the workpiece shown in FIG. FIG. 19 is a flowchart showing the flow of the method for grinding a workpiece according to the second embodiment. FIG. 20 is a perspective view showing a configuration example of a grinding device used in the method for grinding a workpiece according to the third embodiment. FIG. 21 is a flowchart showing the flow of the method for grinding a workpiece according to the third embodiment. FIG. 22 is a side view schematically showing the first grinding step of the method for grinding a workpiece shown in FIG. FIG. 23 is a plan view schematically showing the first grinding step of the method for grinding a workpiece shown in FIG. FIG. 24 is a cross-sectional view in the circumferential direction of the grinding wheel of the main part of the work after the first grinding step of the method for grinding a work shown in FIG. FIG. 25 is a plan view schematically showing the surface of the work piece after the first grinding step of the work piece grinding method shown in FIG. FIG. 26 is a side view schematically showing a reverse step of the method for grinding a workpiece shown in FIG. FIG. 27 is a side view schematically showing the second grinding step of the method for grinding a workpiece shown in FIG. FIG. 28 is a plan view schematically showing a second grinding step of the method for grinding a workpiece shown in FIG. FIG. 29 is a cross-sectional view in the circumferential direction of the grinding wheel of the main part of the work after the second grinding step of the method for grinding a work shown in FIG. 21. FIG. 30 is a plan view schematically showing the surface of the work piece after the second grinding step of the work piece grinding method shown in FIG. 21. FIG. 31 is a cross-sectional view in the circumferential direction of the grinding wheel of the main part of the workpiece after the second first grinding step of the method for grinding a workpiece shown in FIG. FIG. 32 is a circumferential cross-sectional view of the grinding wheel of the essential part of the workpiece after the second grinding step for the second time in the method of grinding the workpiece shown in FIG. 21.

Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the embodiments below. Further, the constituent elements described below include those that can be easily conceived by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

[Embodiment 1]
A method for grinding a workpiece according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of a workpiece to be processed by the method for grinding a workpiece according to the first embodiment. FIG. 2 is a sectional view of a main part of the workpiece shown in FIG. FIG. 3 is a perspective view showing a configuration example of a grinding device used in the method for grinding a workpiece according to the first embodiment.

The method for grinding a work piece according to the first embodiment is a method for grinding the work piece 1 shown in FIG. 1 for thinning. In the first embodiment, as shown in FIG. 1, the work piece 1 is a wafer such as a disk-shaped semiconductor wafer or optical device wafer having a substrate 2 made of silicon, sapphire, gallium arsenide, or the like. The surface 3 is covered with the resin 4. In the workpiece 1, the devices 6 are formed in respective regions defined by a plurality of planned dividing lines 5 formed in a lattice shape on the surface 3 of the substrate 2. As shown in FIGS. 1 and 2, the device 6 includes a plurality of electrodes 7 protruding from the respective surfaces, and the plurality of electrodes 7 are embedded in the resin 4. The electrode 7 is a metal component made of a metal such as a copper alloy or a nickel alloy. The resin 4 is made of insulating synthetic resin.

The workpiece 1 is ground along the resin 4 side to be thinned to a predetermined thickness, and after the electrodes 7 are exposed on the surface 3 of the resin 4, etc. Device 6 is divided. In the first embodiment, the workpiece 1 is a wafer in which the surface 3 of the substrate 2 is covered with the resin 4 and the electrodes 7 project from the surface of the device 6, but in the present invention, the surface of the substrate 2 is shown. A wafer in which various metal parts made of metal such as a probe are formed at 3 may be used. In short, the work piece 1 of the present invention may be any one as long as a component made of metal is ground.

The method of grinding a work piece according to the first embodiment is a method of performing creep field grinding, which is grinding, on the resin 4 side of the work piece 1 by a grinding device 10 which is a processing device shown in FIG.

(Grinding device)
As shown in FIG. 3, the grinding device 10 includes a device base 11, a chuck table 20, a grinding unit 30, a machining feed unit 40 that is a horizontal moving unit, and a cutting feed unit 50 that is a vertical moving unit. , And a control unit 100.

The chuck table 20 holds the back surface 8 side, which is the back side of the front surface 3 of the workpiece 1, with a holding surface 21. In the first embodiment, the chuck table 20 has a holding surface 21 having a porous shape, and is connected to a vacuum suction source (not shown) via a vacuum suction path (not shown) formed below the holding surface 21. .. In the chuck table 20, the back surface 8 of the workpiece 1 is placed on the holding surface 21, and the space between the support pins of the holding surface 21 is sucked by the vacuum suction source, so that the workpiece placed on the holding surface 21 is sucked. The workpiece 1 is sucked and held. Further, the chuck table 20 is provided rotatably around an axis parallel to the vertical direction by a rotary drive source (not shown).

The processing feed unit 40 is installed on the apparatus base 11 and relatively moves the chuck table 20 in the X-axis direction which is a processing feed direction parallel to the holding surface 21. The processing feed unit 40 moves the support base 22 supporting the chuck table 20 in the X-axis direction parallel to the horizontal direction, thereby moving the chuck table 20 away from the grinding unit 30 into the loading/unloading area 101 and the grinding unit 30. It horizontally moves to and from the lower processing area 102.

The grinding unit 30 is a resin that coats the surface 3 of the substrate 2 of the workpiece 1 held on the chuck table 20 with the grinding wheel 32 including the grinding wheel 31 mounted on the lower end of the spindle 33 rotatable about the axis. 4 is to be ground. The grinding unit 30 is supported by a column 12 standing on the apparatus base 11 via a cutting feed unit 50, and a motor 34 for rotating a spindle 33 around an axis and a grinding wheel held at the tip of the spindle 33. 32 and 32. The axis of the spindle 33 of the grinding unit 30 is arranged along the Z-axis direction which is parallel to the vertical direction. The grinding wheel 32 grinds the resin 4 of the workpiece 1 held by the chuck table 20 by the grinding wheel 31 when the spindle 33 is rotated around the axis by the motor 34. A plurality of grinding wheels 31 are provided at intervals on the outer edge of the grinding wheel 32, are held by the tip of the spindle 33, and grind the workpiece 1 held by the chuck table 20.

The cutting feed unit 50 is fixed to the column 12 provided upright on the apparatus base 11, and moves the spindle 33 of the grinding unit 30 in the Z-axis direction which is the cutting feed direction orthogonal to the holding surface 21. The cutting feed unit 50 lowers the spindle 33 of the grinding unit 30 to bring the grinding wheel 31 closer to the workpiece 1 held on the chuck table 20 in the processing area 102, and raises the grinding unit 30 to process the grinding wheel 31. It is moved away from the workpiece 1 held on the chuck table 20 in the area 102.

The processing feed unit 40 and the cutting feed unit 50 are a well-known ball screw 51 rotatably provided around an axis, a well-known pulse motor 52 for rotating the ball screw 51 around the axis, the chuck table 20 or the grinding unit 30. A well-known guide rail 53 that movably supports in the Y-axis direction or the Z-axis direction is provided.

The control unit 100 controls each of the above-mentioned constituent elements of the grinding device 10. That is, the control unit 100 causes the grinding device 10 to perform a machining operation on the workpiece 1. The control unit 100 includes an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input/output interface device. And a computer program capable of executing a computer program.

The arithmetic processing unit of the control unit 100 executes the computer program stored in the ROM on the RAM to generate a control signal for controlling the grinding device 10. The arithmetic processing unit of the control unit 100 outputs the generated control signal to each component of the grinding device 10 via the input/output interface unit. Further, the control unit 100 is connected to a display unit (not shown) configured by a liquid crystal display device for displaying a state of a machining operation, an image and the like, and an input unit used when an operator registers machining content information and the like. .. The input unit includes at least one of a touch panel provided on the display unit and a keyboard.

In the grinding device 10 shown in FIG. 3 described above, the cutting feed unit 50 positions the spindle 33 of the grinding unit 30 at a height at which the grinding wheel 31 grinds the back surface 8 of the workpiece 1 by a predetermined amount, and the spindle 33 is driven by the motor 34. The chuck table 20 holding the work piece 1 is moved from the loading/unloading area 101 to the working area 102 in a state of being rotated about the axis without rotating, and the work piece 1 is subjected to creep feed grinding.

(Grinding method of work piece)
Next, the present specification describes a method of grinding a workpiece according to the first embodiment. FIG. 4 is a flowchart showing the flow of the method for grinding a workpiece according to the first embodiment. As shown in FIG. 4, the method for grinding a workpiece according to the first embodiment includes a first grinding step ST1, a moving step ST2, a second grinding step ST3, and a second moving step ST5. ..

(First grinding step)
FIG. 5 is a side view schematically showing a state in which the grinding wheel is positioned at a height for grinding a first predetermined amount in the first grinding step of the method for grinding a workpiece shown in FIG. 4. FIG. 6 is a side view schematically showing a state in which the grinding wheel grinds the workpiece in the first grinding step of the method for grinding the workpiece shown in FIG. FIG. 7 is a cross-sectional view of a main part of the work piece after the first grinding step of the work piece grinding method shown in FIG. 4. FIG. 8 is a plan view schematically showing the surface of the work piece after the first grinding step of the work piece grinding method shown in FIG. 4.

In the first grinding step ST1, after positioning the grinding wheel 31 at a height for grinding the workpiece 1 by the first predetermined amount 201 (shown in FIG. 2), the chuck table 20 is moved from the loading/unloading area 101 to the processing area 102. This is a step in which the rotating grinding wheel 31 is removed from one side surface 1-1 side of the workpiece 1 to the other side surface 1-2 side by the horizontal movement to perform creep feed grinding. In the first grinding step ST1, the operator places the back surface 8 of the workpiece 1 on the holding surface 21 of the chuck table 20 in the loading/unloading area 101, and then the grinding device 10 holds the workpiece 1 on the holding surface 21. Hold by suction.

In the first grinding step ST1, as shown in FIG. 5, the grinding device 10 rotates the grinding wheel 32 in one direction 61 about the axis by the spindle 33 while the grinding wheel 31 is on the resin 4 side of the workpiece 1. Is positioned at a height for grinding a first predetermined amount 201. In the second grinding step ST3, as shown in FIG. 6, the grinding device 10 does not rotate the chuck table 20 around the axis (in a state where the rotation around the axis is stopped), and the loading/unloading area 101. Is moved in the X-axis direction toward the processing area 102.

Then, in the first grinding step ST1, the grinding device 10 causes the grinding wheel 31 to grind the resin 4 from the one side surface 1-1 side of the processing area 102 side of the workpiece 1 as shown by a solid line in FIG. .. In the first grinding step ST1, the grinding device 10 moves the chuck table 20 to a position where the other side surface 1-2 of the work piece 1 on the loading/unloading area 101 side indicated by a chain double-dashed line in FIG. 6 passes through the grinding wheel 31. Then, the resin 4 side of the workpiece 1 is ground by the first predetermined amount 201 from the one side surface 1-1 side of the workpiece 1 to the other side surface 1-2 side of the opposite side. The method of grinding the workpiece proceeds to the moving step ST2.

In the first embodiment, the work piece 1 after the first grinding step ST1 is thinned by the first predetermined amount 201 as a whole as shown in FIG. 7, and the first grinding step ST1 is performed. In, the electrode 7 is ground together with the resin 4, and the electrode 7 is exposed on the surface of the resin 4. Further, the work piece 1 after the first grinding step ST1 has a burr extending from the one side surface 1-1 side to the other side surface 1-2 side at the tip of the electrode 7 on the side away from the surface of the device 6. 300 is formed. After the first grinding step ST1, the burr 300 extends from the tip of each electrode 7 in the direction in which the grinding wheel 31 is removed during grinding. Further, in the first embodiment, the work piece 1 after the first grinding step ST1 has a Y-axis direction parallel to the horizontal direction on the surface of the resin 4 and orthogonal to the X-axis direction as shown in FIG. A plurality of arc-shaped saw marks (also referred to as grinding marks) 401 whose center is convex on the side of the other side surface 1-2 are formed from one side surface 1-1 to the other side surface 1-2. The electrode 7 is omitted in FIG.

(Movement step)
FIG. 9: is a side view which shows typically the moving step of the grinding method of the workpiece shown in FIG. FIG. 10 is a cross-sectional view of a main part of the workpiece after the moving step of the method for grinding the workpiece shown in FIG.

The moving step ST2 is a step of moving the chuck table 20 from the processing area 102 to the loading/unloading area 101 in a state where the grinding wheel 31 is retracted to a height that does not contact the workpiece 1 after the first grinding step ST1 is performed. Is. The moving step ST2 is also a step of rotating the workpiece 1 held on the chuck table 20 by 180 degrees around the axis parallel to the Z-axis direction.

In the moving step ST2, the grinding device 10 separates the grinding wheel 32 from the height after the first grinding step ST1 shown by the chain double-dashed line in FIG. Raise it up. Further, in the moving step ST2, the grinding device 10 moves the chuck table 20 from the processing area 102 after the first grinding step ST1 shown by the two-dot chain line in FIG. 9 to the loading/unloading area 101 shown by the solid line in FIG. 9 in the X-axis direction. Move to. Further, in the moving step ST2, the grinding device 10 rotates the chuck table 20 by 180 degrees around the axis. The method of grinding the work piece proceeds to the second grinding step ST3.

In the first embodiment, the workpiece 1 after the moving step ST2 has a burr extending from the one side surface 1-1 side of the tip portion of the electrode 7 toward the other side surface 1-2 side, as shown in FIG. 300 extends from the tip of each electrode 7 in a direction approaching the grinding wheel 31.

(Second grinding step)
FIG. 11 is a side view schematically showing a state in which the grinding wheel is positioned at a height for grinding a first predetermined amount in the second grinding step of the method for grinding a workpiece shown in FIG. FIG. 12 is a side view schematically showing a state in which the grinding wheel grinds the workpiece in the second grinding step of the method for grinding the workpiece shown in FIG. FIG. 13 is a cross-sectional view of a main part of the work after the second grinding step of the method for grinding the work shown in FIG. FIG. 14 is a plan view schematically showing the surface of the workpiece after the second grinding step of the method for grinding the workpiece shown in FIG.

In the second grinding step ST3, after the grinding wheel 31 is positioned at a height for grinding the workpiece 1 by the first predetermined amount 201, the chuck table 20 is moved horizontally from the loading/unloading area 101 to the processing area 102. Thus, the rotating grinding wheel 31 is pulled out from the other side surface 1-2 side of the workpiece 1 to the opposite one side surface 1-1 side and creep feed grinding is performed.

In the second grinding step ST3, as shown in FIG. 11, the grinding device 10 causes the grinding wheel 31 to rotate the grinding wheel 32 in one direction 61 about the axis by the spindle 33 while the grinding wheel 31 is on the resin 4 side of the workpiece 1. Is positioned at a height for grinding a first predetermined amount 201. In the second grinding step ST3, as shown in FIG. 12, the grinding device 10 does not rotate the chuck table 20 around the axis (in a state where the rotation around the axis is stopped), and the loading/unloading area 101. Is moved in the X-axis direction toward the processing area 102.

Then, in the second grinding step ST3, the grinding apparatus 10 causes the grinding wheel 31 to grind the resin 4 from the other side surface 1-2 side of the processing area 102 side of the workpiece 1 as shown by the solid line in FIG. .. In the second grinding step ST3, the grinding device 10 moves the chuck table 20 to a position where one side surface 1-1 of the work piece 1 on the carry-in/out area 101 side shown by a chain double-dashed line in FIG. 12 passes through the grinding wheel 31. Then, the resin 4 side of the work piece 1 is ground by the first predetermined amount 201 from the other side surface 1-2 side of the work piece 1 to the opposite one side surface 1-1 side. As described above, in the second grinding step ST3, the workpiece 1 is ground by the first predetermined amount 201 in the same manner as in the first grinding step ST1.

In the first embodiment, the workpiece 1 after the second grinding step ST3 is thinned by the first predetermined amount 201 as a whole from the first grinding step ST1 as shown in FIG. The electrode 7 is exposed on the surface of No. 4. Further, the work piece 1 after the second grinding step ST3 has a burr extending from the other side surface 1-2 side toward the one side surface 1-1 side at the tip of the electrode 7 on the side away from the surface of the device 6. 300 is formed. Thus, the burr 300 formed in the second grinding step ST3 and the burr 300 formed in the first grinding step ST1 differ from each other in the direction extending from the electrode 7 in the X-axis direction by 180 degrees.

The burr 300 formed in the second grinding step ST3 is formed by grinding the tip of the electrode 7 including the burr 300 formed in the first grinding step ST1. The protrusion amount 302 in the X-axis direction is smaller than the protrusion amount 301 of the burr 300 from the electrode 7 after the first grinding step ST1. Further, in the second embodiment, the workpiece 1 after the second grinding step ST3 has the saw mark 401 on the surface of the resin 4 and the center in the Y-axis direction has the one side surface 1-1 side as shown in FIG. A plurality of convex arc-shaped saw marks (also referred to as grinding marks) 402 are formed from the other side surface 1-2 to the one side surface 1-1. Note that the electrode 7 is omitted in FIG.

After that, the method for grinding the workpiece determines whether the grinding device 10 or the operator has repeated the first grinding step ST1 and the second grinding step ST3 a predetermined number of times (step ST4). The method for grinding the workpiece is that the grinding device 10 or the operator determines that the first grinding step ST1 and the second grinding step ST3 have not been repeated a predetermined number of times (step ST4: No). 2 to move step ST5. In the first embodiment, the predetermined number of times is two, but the present invention is not limited to two, and may be one or a plurality of three or more. In short, in the present invention, the first grinding step ST1, the moving step ST2, and the second grinding step ST3 are performed at least once.

(Second moving step)
FIG. 15 is a cross-sectional view of the main part of the workpiece after the second moving step of the method for grinding a workpiece shown in FIG. In the second movement step ST5, the chuck table 20 is moved from the processing area 102 to the loading/unloading area 101 in a state where the grinding wheel 31 is retracted to a height that does not contact the workpiece 1 after the second grinding step ST3 is performed. This is the step of moving. The second moving step ST5 is also a step of rotating the workpiece 1 held on the chuck table 20 by 180 degrees around an axis parallel to the Z-axis direction.

In the second moving step ST5, the grinding device 10 raises the grinding wheel 32 from the height after the second grinding step ST3 to the height at which the grinding wheel 31 is separated from the workpiece 1, and the chuck table 20 is moved to the second position. After the grinding step ST3, it is moved in the X-axis direction from the processing area 102 to the loading/unloading area 101. Further, in the second movement step ST5, the grinding device 10 rotates the chuck table 20 by 180 degrees around the axis. The method of grinding the workpiece returns to the first grinding step ST1.

In the first embodiment, the workpiece 1 after the second moving step ST5 is, as shown in FIG. 15, directed from the other side surface 1-2 side of the tip portion of the electrode 7 toward the one side surface 1-1 side. The extended burr 300 extends from the tip of each electrode 7 toward the grinding wheel 31.

(Second 1st grinding step, moving step and 2nd grinding step)
FIG. 16 is a cross-sectional view of a main part of the work piece after the second first grinding step of the work piece grinding method shown in FIG. 4. FIG. 17 is a cross-sectional view of the main part of the workpiece after the second moving step of the method for grinding a workpiece shown in FIG. FIG. 18 is a cross-sectional view of the main part of the workpiece after the second grinding step for the second time in the method of grinding the workpiece shown in FIG.

The second first grinding step ST1 is the same as the first first grinding step ST1, but the second grinding amount 202 may be smaller than the first predetermined amount 201. That is, in the first grinding step ST1 for the second time, the grinding device 10 causes the grinding wheel 31 to move the grinding wheel 32 to the resin 4 side of the workpiece 1 while rotating the grinding wheel 32 in the one direction 61 about the axis by the spindle 33. The workpiece 1 is processed by moving the chuck table 20 in the X-axis direction from the loading/unloading area 101 toward the processing area 102 without rotating the chuck table 20 about the axis, and positioning the chuck table 20 at a grinding height. The grinding wheel 31 grinds the resin 4 from the one side surface 1-1 side of the area 102 side toward the other side surface 1-2 side. In the second first grinding step ST1, the grinding device 10 moves the chuck table 20 to a position where the other side surface 1-2 of the workpiece 1 on the loading/unloading region 101 side passes through the grinding wheel 31, and the workpiece is machined. A second predetermined amount 202 of the resin 4 side of the workpiece 1 is ground from the one side surface 1-1 side of the article 1 to the other side surface 1-2 side of the opposite side.

In the first embodiment, the work piece 1 after the second first grinding step ST1 is thinned by the second predetermined amount 202 as a whole as shown in FIG. The burr 300 formed at the tip portion extends from the one side surface 1-1 side to the other side surface 1-2 side, and the protrusion amount 303 of the burr 300 from the electrode 7 in the X-axis direction is larger than the protrusion amount 302. It has been reduced.

In the second moving step ST2, similarly to the first moving step, the chuck table 20 is moved to the processing area 102 in a state where the grinding wheel 31 is retracted to a height that does not contact the workpiece 1 after the first grinding step ST1. To the loading/unloading area 101, the workpiece 1 held on the chuck table 20 is rotated by 180 degrees around the axis parallel to the Z-axis direction.

In the first embodiment, the workpiece 1 after the second moving step ST2 is, as shown in FIG. 17, directed from the one side surface 1-1 side of the tip portion of the electrode 7 toward the other side surface 1-2 side. The extended burr 300 extends from the tip of each electrode 7 toward the grinding wheel 31.

The second grinding step ST3 of the second time is the same as the second grinding step ST3 of the first time, except that the grinding amount is the second predetermined amount 202 which is smaller than the first predetermined amount 201. That is, in the second grinding step ST3 of the second time, the grinding device 10 causes the grinding wheel 31 to move the grinding wheel 31 to the resin 4 side of the workpiece 1 while rotating the grinding wheel 32 in the one direction 61 about the axis by the spindle 33. The workpiece 1 is processed by moving the chuck table 20 in the X-axis direction from the loading/unloading area 101 toward the processing area 102 without rotating the chuck table 20 about the axis, and positioning the chuck table 20 at a grinding height. The grinding wheel 31 grinds the resin 4 from the other side surface 1-2 side of the area 102 side toward the one side surface 1-1 side. In the second second grinding step ST3, the grinding device 10 moves the chuck table 20 to a position where the one side surface 1-1 of the work piece 1 on the loading/unloading region 101 side passes through the grinding wheel 31 to be processed. The second predetermined amount 202 of the resin 4 side of the workpiece 1 is ground from the other side surface 1-2 side of the workpiece 1 to the opposite one side surface 1-1 side. In this way, in the second grinding step ST3 of the second time, the workpiece 1 is ground by the second predetermined amount 202 similarly to the first grinding step ST1 of the second time.

Further, in the first embodiment, the workpiece 1 after the second second grinding step ST3 is thinned by the second predetermined amount 202 as a whole as shown in FIG. The burr 300 formed at the tip portion extends from the other side surface 1-2 side toward the one side surface 1-1 side, and the protrusion amount 304 of the burr 300 from the electrode 7 in the X-axis direction is larger than the protrusion amount 303. It has been reduced.

As described above, the method of grinding a workpiece according to the present invention rotates the workpiece 1 by 180 degrees around the axis in the moving steps ST2 and ST5, so that the first grinding step ST1 and the second grinding step ST3 are performed. With, the horizontal relative movement direction of the grinding wheel 31 with respect to the work piece 1 is reversed, and the same predetermined amount 201, 202 of the work piece 1 is ground. Further, in the method for grinding a work piece of the present invention, the predetermined amounts 201, 202 for grinding the work piece 1 are gradually reduced as the first grinding step ST1 and the second grinding step ST3 are repeated. Is also good.

The method of grinding the workpiece ends when the grinding device 10 or the operator determines that the first grinding step ST1 and the second grinding step ST3 have been repeated a predetermined number of times (step ST4: Yes).

The method for grinding a work piece according to the first embodiment rotates the work piece 1 about the axis by 180 degrees in the moving steps ST2 and ST5 when the work piece 1 is ground and thinned. In the first grinding step ST1 and the second grinding step ST3, the horizontal relative movement direction of the grinding wheel 31 with respect to the workpiece 1 is reversed. For this reason, in the method of grinding the workpiece, in each of the grinding steps ST1 and ST3, the burr 300 formed in the previous grinding steps ST1 and ST3 is ground, and the protrusion of the burr 300 after the first grinding step ST1 is performed. The direction and the protruding direction of the burr 300 after the second grinding step ST3 are opposite to each other, and the protruding amounts 301, 302, 303, 304 of the burr 300 can be gradually reduced. As a result, the method of grinding the workpiece has the effect of suppressing the burr 300 after grinding.

In addition, the method of grinding the workpiece is the same as that in the first grinding step ST1 and the second grinding step ST3, the horizontal relative movement direction of the grinding wheel 31 with respect to the workpiece 1 is reversed and the same. Since the predetermined amount 201, 202 of the workpiece 1 is ground, the protrusion amount 301, 302, 303, 304 of the burr 300 after each grinding step ST1, ST3 can be gradually reduced.

In addition, the method of grinding the work piece includes performing the first grinding step ST1 and the second grinding step ST3 one or more times, and in the embodiment, a plurality of the first grinding step ST1 and the second grinding step ST3 are performed. Since the process is repeated, the protrusion amounts 301, 302, 303, 304 of the burr 300 after each grinding step ST1, ST3 can be gradually reduced.

Further, in the first embodiment, the method of grinding the work piece is such that the predetermined amounts 201 and 202 for grinding the work piece 1 are gradually reduced as the first grinding step ST1 and the second grinding step ST3 are repeated. Therefore, the protrusion amount 301, 302, 303, 304 of the burr 300 after each grinding step ST1, ST3 can be gradually reduced.

[Embodiment 2]
A method of grinding a workpiece according to a second embodiment of the present invention will be described with reference to the drawings. FIG. 19 is a flowchart showing the flow of the method for grinding a workpiece according to the second embodiment. In FIG. 19, the same parts as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

In the grinding method of the workpiece according to the second embodiment, in the moving steps ST2-2 and ST5-2, the rotation direction of the spindle 33 of the grinding unit 30 is reversed instead of rotating the workpiece 1 by 180 degrees. Except for this, it is the same as the first embodiment.

That is, in the method for grinding a workpiece according to the second embodiment, in the moving step ST2-2, the grinding apparatus 10 rotates in one direction 61 to the other direction 62 (shown in FIG. 5 and the like) in the opposite direction. The rotation direction of the spindle 33 is reversed so that the rotation direction of the spindle 33 is reversed from the other direction 62 to the one direction 61 in the second movement step ST5-2.

In this way, in the method for grinding a workpiece according to the second embodiment, the first grinding step ST1 and the second grinding step ST3 are performed by reversing the rotation direction of the spindle 33 in the moving steps ST2-2 and ST5-2. The relative movement direction of the grinding wheel 32 in the circumferential direction of the grinding wheel 31 with respect to the workpiece 1 is reversed.

The grinding method of the workpiece according to the second embodiment is such that, when the workpiece 1 is ground and thinned, the rotation direction of the spindle 33 is reversed in the moving steps ST2-2 and ST5-2, thereby In the grinding step ST1 and the second grinding step ST3, the relative movement direction of the grinding wheel 32 with respect to the workpiece 1 in the circumferential direction of the grinding wheel 32 is reversed. For this reason, in the method of grinding the workpiece, in each of the grinding steps ST1 and ST3, the burr 300 formed in the previous grinding steps ST1 and ST3 is ground, and the protrusion of the burr 300 after the first grinding step ST1 is performed. The direction and the protruding direction of the burr 300 after the second grinding step ST3 are opposite to each other, and the protruding amounts 301, 302, 303, 304 of the burr 300 after each grinding step ST1, ST3 can be gradually reduced. Therefore, it is possible to suppress the burr 300 after grinding.

[Embodiment 3]
A method for grinding a workpiece according to a third embodiment of the present invention will be described with reference to the drawings. FIG. 20 is a perspective view showing a configuration example of a grinding device used in the method for grinding a workpiece according to the third embodiment. In the present description, in the description of the third embodiment, the same parts as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

The method of grinding a work piece according to the third embodiment is a method of grinding the work piece 1 for thinning, and the work piece held on the chuck table 20 of the grinding device 10-3 shown in FIG. 1 is a method of performing in-field grinding, which is a grinding process, on the resin 4 side of the workpiece 1 by the grinding wheel 31 held at the tip of the spindle 33.

(Grinding device)
In the grinding device 10-3 shown in FIG. 20 used in the method for grinding a workpiece according to the third embodiment, the holding surface 21 of the chuck table 20 is made of porous ceramics or the like, and suction holding is performed on the holding surface 21 of the chuck table 20. The processed work piece 1 is positioned in the processing area 102, and the grinding wheel 31 rotated by the spindle 33 is always in contact with the portion of the work piece 1 on the rotation center 23 (shown in FIG. 20) of the chuck table 20. Then, the workpiece 1 is in-feed ground while the grinding wheel 31 is ground and fed in the Z-axis direction.

(Grinding method of work piece)
Next, the present specification describes a method for grinding a workpiece according to the third embodiment. FIG. 21 is a flowchart showing the flow of the method for grinding a workpiece according to the third embodiment. As shown in FIG. 21, the method for grinding a workpiece according to the third embodiment includes a first grinding step ST1-3, a reverse rotation step ST6, a second grinding step ST3-3, and a second reverse rotation step. And ST7.

(First grinding step)
FIG. 22 is a side view schematically showing the first grinding step of the method for grinding a workpiece shown in FIG. FIG. 23 is a plan view schematically showing the first grinding step of the method for grinding a workpiece shown in FIG. FIG. 24 is a cross-sectional view in the circumferential direction of the grinding wheel of the main part of the work after the first grinding step of the method for grinding a work shown in FIG. FIG. 25 is a plan view schematically showing the surface of the work piece after the first grinding step of the work piece grinding method shown in FIG.

In the first grinding step ST1-3, the grinding wheel 31 is positioned so as to always contact the workpiece 1 on the rotation center 23 of the chuck table 20, and the grinding wheel 31 is perpendicular to the holding surface 21 of the chuck table 20. This is a step of thinning the work piece 1 while feeding the first predetermined amount 201 by grinding in the Z-axis direction, which is a different direction. In the first grinding step ST1-3, after the operator places the back surface 8 of the workpiece 1 on the holding surface 21 of the chuck table 20 in the loading/unloading area 101, the grinding device 10-3 touches the holding surface 21. The workpiece 1 is held by suction.

In the first grinding step ST1-3, the grinding device 10-3 has the grinding wheel 32 rotated by the spindle 33 in one direction 61 about the axis, and the chuck table 20 rotated about the axis is processed in the processing area. After moving to 102, the grinding wheel 32 is lowered to bring the grinding wheel 31 into contact with the surface of the resin 4 of the workpiece 1 on the rotation center 23 of the chuck table 20 as shown in FIGS. 22 and 23. The first predetermined amount 201 is fed by grinding. In the first grinding step ST1-3, the grinding device 10-3 grinds the resin 4 side of the workpiece 1 by the first predetermined amount 201. The method of grinding the workpiece proceeds to the reverse rotation step ST6.

In the third embodiment, the work piece 1 after the first grinding step ST1-3 is thinned by the first predetermined amount 201 as a whole as shown in FIG. In step ST1-3, the electrode 7 is ground together with the resin 4, and the electrode 7 is exposed on the surface of the resin 4. Further, the work piece 1 after the first grinding step ST1-3 has a tip end portion of the electrode 7 on the side away from the surface of the device 6 and a side surface 1-3 side of the grinding wheel 32 in the circumferential direction from the other side surface 1-3 side. A burr 300-3 extending toward the side surface 1-4 is formed. Further, in the third embodiment, the workpiece 1 after the first grinding step ST1-3 is, as shown in FIG. 25, on the surface of the resin 4 from the rotation center 23 of the chuck table 20 to the outer edge of the workpiece 1. A plurality of saw marks (also referred to as grinding marks) 401-3 extending toward each other and curved in the same direction are formed. Note that the electrode 7 is omitted in FIG.

(Reverse step)
FIG. 26 is a side view schematically showing a reverse step of the method for grinding a workpiece shown in FIG. The reverse rotation step ST6 is a step in which the rotation direction of the spindle 33 is reversed in a state where the grinding wheel 31 is retracted to a height that does not contact the workpiece 1 after the first grinding step ST1-3.

In the reverse rotation step ST6, the grinding device 10-3 raises the grinding wheel 32 from the height after the first grinding step ST1-3 to the height at which the grinding wheel 31 is separated from the workpiece 1, as shown in FIG. .. Further, in the reverse rotation step ST6, the grinding device 10-3 reverses the rotation direction of the spindle 33 about the axis from the one direction 61 in the first grinding step ST1-3 to the other direction 62 which is the reverse direction 61. .. The method of grinding the work piece proceeds to the second grinding step ST3.

(Second grinding step)
FIG. 27 is a side view schematically showing the second grinding step of the method for grinding a workpiece shown in FIG. FIG. 28 is a plan view schematically showing a second grinding step of the method for grinding a workpiece shown in FIG. FIG. 29 is a cross-sectional view in the circumferential direction of the grinding wheel of the main part of the work after the second grinding step of the method for grinding a work shown in FIG. 21. FIG. 30 is a plan view schematically showing the surface of the work piece after the second grinding step of the work piece grinding method shown in FIG. 21.

In the second grinding step ST3-3, the grinding wheel 31 is positioned so as to always contact the workpiece 1 on the rotation center 23 of the chuck table 20, and the grinding wheel 31 is ground by the first predetermined amount 201 in the Z-axis direction. This is a step of thinning the workpiece 1 while feeding. In the second grinding step ST3-3, the grinding device 10-3 causes the grinding wheel 32 to rotate in the other direction 62 about the axis by the spindle 33, and lowers the grinding wheel 32 to generate the grinding wheel 32 as shown in FIGS. As shown in, the grinding wheel 31 comes into contact with the surface of the resin 4 of the workpiece 1 on the rotation center 23 of the chuck table 20 and then feeds the first predetermined amount 201 by grinding. In the second grinding step ST3-3, the grinding device 10-3 grinds the resin 4 side of the workpiece 1 by the first predetermined amount 201. As described above, in the second grinding step ST3, the work piece 1 is ground by the first predetermined amount 201 as in the first grinding step ST1-3.

In the third embodiment, the workpiece 1 after the second grinding step ST3-3 is thinned by the first predetermined amount 201 minutes as a whole from the first grinding step ST1-3, as shown in FIG. Thus, the electrode 7 is exposed on the surface of the resin 4. Further, the work piece 1 after the second grinding step ST3-3 is directed from the other side surface 1-4 side to the one side surface 1-3 side at the tip of the electrode 7 on the side away from the surface of the device 6. The burr 300 is extended. Thus, the burrs 300 formed in the second grinding step ST3-3 and the burrs 300 formed in the first grinding step ST1-3 differ from each other in the direction extending from the electrode 7 by 180 degrees.

The burr 300 formed in the second grinding step ST3-3 is formed by grinding the tip of the electrode 7 including the burr 300 formed in the first grinding step ST1-3. The horizontal protrusion amount 302 from the electrode 7 is smaller than the protrusion amount 301 from the electrode 7 of the burr 300 formed in the first grinding step ST1-3. Further, in the second embodiment, the work piece 1 after the second grinding step ST3-3 has the saw mark 401-3 on the surface of the resin 4 and the work piece 1 from the rotation center 23 as shown in FIG. A plurality of saw marks 402-3 are formed which extend toward the outer edge of and are curved in the opposite direction of the saw mark 401-3. Note that the electrode 7 is omitted in FIG.

After that, the method of grinding the workpiece determines whether the grinding device 10-3 or the operator has repeated the first grinding step ST1-3 and the second grinding step ST3-3 a predetermined number of times. (Step ST4). In the method for grinding the workpiece, it is determined that the grinding device 10-3 or the operator has not repeated the first grinding step ST1-3 and the second grinding step ST3-3 a predetermined number of times (step ST4). : No), and proceeds to the second reverse rotation step ST7. In addition, in the third embodiment, the predetermined number of times is two times, but the present invention is not limited to two times and may be one time or three or more times. In short, in the present invention, the first grinding step ST1-3, the reverse rotation step ST6, and the second grinding step ST3-3 are performed at least once.

(Second reverse step)
The second reversing step ST7 is a step of reversing the rotation direction of the spindle 33 in a state where the grinding wheel 31 is retracted to a height that does not contact the workpiece 1 after the second grinding step ST3-3. .. In the second reversing step ST7, the grinding device 10-3 raises the grinding wheel 32 from the height after the first grinding step ST1 to the height at which the grinding wheel 31 is separated from the workpiece 1, and the spindle 33 has an axial center. The rotational direction of rotation is reversed from the other direction 62 in the second grinding step ST3-3 to the one direction 61. The method of grinding the workpiece returns to the first grinding step ST1-3.

(Second 1st grinding step, reverse rotation step and 2nd grinding step)
FIG. 31 is a cross-sectional view in the circumferential direction of the grinding wheel of the essential part of the workpiece after the second first grinding step of the method for grinding a workpiece shown in FIG. 32 is a circumferential cross-sectional view of the grinding wheel of the main part of the workpiece after the second grinding step for the second time in the method of grinding the workpiece shown in FIG.

The first grinding step ST1-3 of the second time is the same as the first grinding step ST1-3 of the first time, except that the grinding amount is the second predetermined amount 202 which is smaller than the first predetermined amount 201. Yes, the second grinding step ST3-3 of the second time is the same as the second grinding step ST3-3 of the first time except that the grinding amount is the second predetermined amount 202 smaller than the first predetermined amount 201. Is the same. Therefore, in the second grinding step ST3-3 of the second time, the work piece 1 is ground by the second predetermined amount 202 similarly to the first grinding step ST1-3 of the second time.

In the third embodiment, the workpiece 1 after the second first grinding step ST1-3 is, as shown in FIG. 31, the second grinding step ST3-3 from the first second grinding step ST3-3 as a whole. While being thinned by a predetermined amount 202, the burr 300 formed at the tip of the electrode 7 extends from one side surface 1-3 side toward the other side surface 1-4 side. Further, the horizontal protrusion amount 303 of the burr 300 formed in the second first grinding step ST1-3 from the electrode 7 is smaller than the protrusion amount 302.

Further, in the third embodiment, the workpiece 1 after the second grinding step ST3-3 of the second time is, as shown in FIG. 32, the second grinding step ST1-3 of the second time as a whole from the second grinding step ST1-3 of the second time. While being thinned by a predetermined amount 202, the burr 300 formed at the tip of the electrode 7 extends from the other side surface 1-4 side toward the one side surface 1-3 side. The horizontal protrusion amount 304 of the burr 300 formed in the second second grinding step ST3-3 from the electrode 7 is smaller than the protrusion amount 303.

As described above, in the method for grinding a workpiece according to the present invention, the rotation direction of the spindle 33, that is, the grinding wheel 31 is reversed in the reverse steps ST6 and ST7, so that the first grinding step ST1-3 and the second grinding step ST1-3. At ST3-3, the relative movement direction of the grinding wheel 32 of the grinding wheel 31 with respect to the workpiece 1 in the circumferential direction is reversed, and the same predetermined amount 201, 202 of the workpiece 1 is ground. Further, in the method for grinding a work piece of the present invention, the predetermined amounts 201 and 202 for grinding the work piece 1 are stepwise as the first grinding step ST1-3 and the second grinding step ST3-3 are repeated. It may be reduced to

As in the first embodiment, the grinding method for the workpiece is that the grinding device 10-3 or the operator repeats the first grinding step ST1-3 and the second grinding step ST3-3 a predetermined number of times. When the determination is made (step ST4: Yes), the process ends.

In the grinding method for the workpiece according to the third embodiment, when the workpiece 1 is ground and thinned, the rotation direction of the spindle 33, that is, the grinding wheel 31 is reversed in the reverse rotation steps ST6 and ST7. In the grinding step ST1-3 and the second grinding step ST3-3, the relative movement direction of the grinding wheel 32 with respect to the workpiece 1 in the circumferential direction of the grinding wheel 32 is reversed. Therefore, in the grinding method of the workpiece, in each of the grinding steps ST1-3 and ST3-3, the burr 300 formed in the previous grinding steps ST1-3 and ST3-3 is ground and each grinding step ST1. The amount of protrusion 301, 302, 303, 304 of the burr 300 after -3 and ST3-3 can be gradually reduced. As a result, the method of grinding the workpiece has the effect of suppressing the burr 300 after grinding, as in the first embodiment.

The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the gist of the present invention.

1 Workpiece 1-1 One side 1-2 Other side 10 Grinding device (processing device)
20 chuck table 23 center of rotation 31 grinding wheel 33 spindle 40 processing feed unit (horizontal moving means)
50 Cutting feed unit (vertical moving means)
101 loading/unloading area 102 processing area 201 first predetermined amount (predetermined amount)
202 Second predetermined amount (predetermined amount)
ST1, ST1-3 First grinding step ST2 Moving step ST3, ST3-3 Second grinding step ST6 Reverse rotation step

Claims (3)

A chuck table provided with a horizontal moving means that horizontally moves between a carry-in/out area and a processing area, a grinding wheel held by a tip of a rotatable spindle and for grinding a workpiece held on the chuck table, A vertical movement means for moving the spindle in a vertical direction, and a method of grinding a workpiece by creep feed grinding with a processing device comprising:
After the grinding wheel is positioned at a height for grinding a workpiece by a predetermined amount, the chuck table is moved horizontally from the loading/unloading area to the processing area to rotate the grinding wheel to the workpiece. A first grinding step of creep feed grinding by pulling out from one side surface to the other side surface on the opposite side;
A moving step of moving the chuck table from the processing area to the loading/unloading area in a state where the grinding wheel is retracted to a height at which it does not come into contact with a workpiece after the grinding step is performed,
By rotating the workpiece by 180 degrees, positioning the grinding wheel at a height for grinding the workpiece by a predetermined amount, and moving the chuck table horizontally from the loading/unloading area to the processing area, A second grinding step in which the rotating grinding wheel is pulled out from one side surface of the workpiece to the other side surface on the opposite side and creep feed grinding is performed;
The method for grinding a work piece, characterized in that the above is performed at least once. A chuck table provided with a horizontal moving means that horizontally moves between a loading/unloading area and a processing area,
Creep feed grinding by a processing device including a grinding wheel held by a tip of a rotatable spindle for grinding a workpiece held on the chuck table and a vertical moving means for vertically moving the spindle. A method of grinding a workpiece,
The rotating grinding wheel is processed by horizontally moving the chuck table from the loading/unloading area to the processing area in a state where the grinding wheel is positioned at a height for grinding a workpiece by a predetermined amount. A first grinding step of creep feed grinding by pulling from one side of the object to the other side of the opposite side,
A moving step of moving the chuck table from the processing area to the loading/unloading area in a state where the grinding wheel is retracted to a height at which it does not come into contact with a workpiece.
In a state where the grinding wheel is positioned at a height for grinding a workpiece by a predetermined amount, the rotation direction of the spindle is reversed, and the chuck table is moved horizontally from the loading/unloading area to the processing area. A second grinding step in which the grinding wheel is pulled from one side surface of the workpiece to the other side surface on the opposite side and creep feed grinding is performed;
The method for grinding a work piece, characterized in that the above is performed at least once. A method of grinding a workpiece held on a rotatable chuck table by in-feed grinding with a grinding wheel held at a tip of a rotatable spindle,
A workpiece that is positioned so that the grinding wheel is always in contact with the center of rotation of the chuck table, and thins the workpiece while feeding the grinding wheel by a predetermined amount in a direction perpendicular to the holding surface of the chuck table. A first grinding step of the object,
A reversing step of reversing the rotation direction of the spindle in a state where the grinding wheel is retracted to a height that does not contact the workpiece after the grinding step is performed,
A workpiece that is positioned so that the grinding wheel is always in contact with the center of rotation of the chuck table, and thins the workpiece while feeding the grinding wheel by a predetermined amount in a direction perpendicular to the holding surface of the chuck table. A second grinding step of the object,
The method for grinding a work piece, characterized in that the above is performed at least once.

Images