JP2020089902A - Soldering device and soldering method - Google Patents

Abstract

To provide a soldering device and a soldering method which can solve a problem that may occur when achieving at least one of miniaturization and acceleration of the soldering device and stabilization of solder piece supply.SOLUTION: A soldering device 1 according to the present embodiment includes: a head part 3 which is an upper unit for supplying solder; a thread solder cutting mechanism part 40 which is a cut unit for cutting thread solder 2 being solder on the lower side thereof to make it a solder piece 2b and will be described later; a nozzle 60 which is on the lower side of the thread solder cutting mechanism part 40; and a heater 51 which heats the nozzle 60. The thread solder cutting mechanism part 40 is movable between the upper position of the nozzle 60 and the retreat position on the side thereof, and has a fan 80 which blows air to the upper position of the nozzle 60 when the thread solder cutting mechanism part 40 is located at the retreat position.SELECTED DRAWING: Figure 4

Description

The present invention relates to a soldering device for soldering a first conductor (terminal, land, lead wire, etc.) and a second conductor (terminal, land, lead wire, etc.) in an appropriate product such as a printed circuit board and a motor, and Regarding soldering method.

Conventionally, a soldering device for mechanically soldering an electronic component to a printed circuit board has been provided. In this soldering device, a flow soldering method in which a printed circuit board is brought into contact with the liquid surface of the solder for soldering, or cream solder is printed on the substrate according to a pattern in advance and the cream solder is heated and melted. Various methods have been proposed, such as a reflow soldering method of soldering with.

Here, the applicant uses a cylindrical nozzle as a soldering iron, inserts a pin of an electronic component inserted into a through hole of a printed circuit board into the nozzle, and melts the solder inside for soldering. A soldering device has been developed and provided (see Patent Document 1).

Further, by confirming the temperature of the nozzle, the position of the nozzle, the load of the nozzle, and the supply amount of the solder at a predetermined timing such as when the device is started or during operation, the reliability and reliability of soldering can be further improved. (See Patent Document 2).

However, in the soldering device in which the temperature control of the nozzle greatly affects the soldering accuracy, various problems occur when attempting further improvement such as downsizing of the device, speeding up of soldering speed, or stabilization of supply of solder pieces. Come on.

JP, 2013-120869, A JP, 2005-115427, A

In view of the above problems, the present invention provides a soldering device and a soldering method capable of solving a problem that may occur due to heat when soldering a soldering device, and aims to improve user satisfaction. To do.

The present invention includes an upper unit for supplying solder, a cutting unit below which cuts the solder into solder pieces, a nozzle below the cutting unit, and a heater for heating the nozzle. Is a soldering device provided with a fan that is movable to an upper position of the nozzle and a retracted position on the side of the nozzle, and that blows air to the upper position of the nozzle when the cutting unit is in the retracted position, and It is a soldering method that blows air.

According to the present invention, it is possible to provide a soldering device and a soldering method capable of solving a problem that may occur due to heat when the solder of the soldering device melts.

The right view of a soldering device. The front view of a soldering apparatus. Explanatory drawing by the perspective view of the structure of a fan, and the movement of heat. Explanatory drawing of the structure of a fan, and heat transfer. The block diagram which shows the structure of the drive system and control system of a soldering apparatus. Explanatory drawing explaining the structure of a thread solder cutting mechanism part. Explanatory drawing of the operation|movement of the cutting of a solder piece. Explanatory drawing of the supply operation to the nozzle of the cut|disconnected solder piece. Explanatory drawing by the perspective view of a structure of a nozzle and a heater. FIG. 3 is a vertical sectional view of a nozzle and a heater. FIG. 3 is a cross-sectional view of a nozzle and a heater. Explanatory drawing by the perspective view of a structure of an intermediate body. Explanatory drawing of the structure of an intermediate body.

An embodiment of the present invention will be described below with reference to the drawings.

1 and 2 are explanatory views of the external configuration of the soldering apparatus 1. FIG. 1 is a right side view and FIG. 2 is a front view. FIG. 3 is a perspective view around the head portion 3 (upper unit) of the soldering device 1, and FIG. 4 is a front view around the head portion 3 of the soldering device 1.

As shown in FIG. 1, the soldering apparatus 1 includes a head portion 3 in which a nozzle 60 (soldering iron) for soldering is arranged in a through hole of a printed circuit board P to be soldered, a head portion 3, and a head portion 3 and The printed circuit board P includes a proximity separation direction moving unit 6 (relative distance changing unit) that moves the nozzle 60 in a direction (closer direction in FIG. 1) to move closer to/separate from the soldering target, and the proximity separation direction moving unit 6 and the nozzle 60. The conveying direction moving unit 7 for moving in the conveying direction (the depth direction in FIG. 1, the left-right direction in FIG. 2) to be conveyed, and the conveying direction moving unit 7 and the nozzle 60 in the conveying width direction of the conveying direction moving unit 7 (in FIG. 1). And a transport width direction moving unit 8 for moving in the left-right direction and the front-back direction in FIG.

The upper surface of the transport width direction moving unit 8 is configured to have substantially the same height as the upper surface of the transport path 9 that transports the printed circuit board P.

On the upper part of the head portion 3, the thread solder 2 wound on a reel is provided. This wire solder 2 can use φ0.3 to φ2.0 mm, and preferably φ0.6 to φ1.6 mm.

A nozzle 60 is provided below the head portion 3, and a heater 51 (heating means) is connected to the nozzle 60. The nozzle 60 and the heater 51 are provided in the nozzle unit 5 shown in FIG.

As shown in FIG. 3, the soldering device 1 includes a head portion 3 for supplying solder and a thread solder cutting mechanism portion 40 (cutting unit, cut below the thread solder 2 which is solder) into solder pieces 2b. (Solder piece supply means), a nozzle 60 below the thread solder cutting mechanism 40, and a heater 51 for heating the nozzle 60. The solder wire cutting mechanism 40 is movable to an upper position of the nozzle 60 and a retracted position on the side thereof. The head portion 3 of the soldering device 1 is provided with a fan 80 that blows air to the upper position of the cheek 60 when the wire solder cutting mechanism portion 40 is at least at the retracted position.

A support plate 90 (partition plate) is provided on the lower side of the head unit 3. The suspension unit 4 (supporting means) is provided on the support plate 90 so as to project downward, and the nozzle unit 5 is provided on the suspension unit 4. The suspension unit 4 is provided at two diagonal positions on the upper portion 50a of the peripheral region of the nozzle 60 and the intermediate body 70 in the nozzle unit 5. As a result, the nozzle unit 5 is stably mounted in a well-balanced manner so as to be suspended by the suspension unit 4 on the support plate 90 below the head unit 3, and the head unit 3 moves toward and away from the printed circuit board P in the approaching/separating direction. It is movably supported in parallel with. The upper part 50a is formed in a plate shape perpendicular to the vertical separation direction.

The support plate 90 has a plate shape perpendicular to the approaching/separating direction, and is provided with the nozzle unit 5 and an area above the head portion 3 where the thread solder supply guide 16 and the thread solder feeding mechanism section 17 (feeding means) are provided. This support plate 90 also functions as a partition plate that partitions the lower region of the head unit 3 that is partitioned off, and partitions at least the upper region of the nozzle unit 5 of the entire region of the head unit 3 in plan view, and 60% or more of the entire area of the head portion 3 in plan view can be partitioned, preferably 70% or more, more preferably 80% or more, and more preferably 90% or more. is there. By partitioning in this manner, it is possible to prevent or suppress the heated gas due to the heat of the heater 51 (see FIGS. 1 and 2) of the nozzle unit 5 from flowing into the upper region of the head unit 3. Further, by providing the suspension unit 4 on the diagonal line at the peripheral position of the nozzle unit 60 and the intermediate body 70, the solder paste cutting mechanism section 40 moves from the upper position of the nozzle unit 60 and the intermediate body 70 to the side retracted position thereof. The suspension unit 4 does not hinder the movement. Further, by disposing the two suspension units 4 on the diagonal line in this way, it is possible to prevent the heat of the nozzle unit 60 from being physically transferred from the suspension unit 4 to the head unit 3 as much as possible, and to stably stabilize the nozzle unit. Since 60 is supported, it is possible to smoothly move the printed circuit board P in the approaching/separating direction.

The suspension unit 4 has a slide shaft that allows a sliding movement in a close distance (up and down direction in the drawing) and a cylindrical body around the slide shaft, and one end of the slide shaft and the cylindrical body is the lower surface of the support plate 90. And the other end is fixed to the upper surface of the nozzle unit 5. One end of a helical spring is fixed to the slide shaft on the slide shaft and the tubular body, and the other end of the helical spring is fixed to the tubular body. With this suspension unit 4, the nozzle unit 5 is mounted so as to be suspended from the support plate 90, and is configured to be movable in the approaching and separating directions with respect to the head portion 4 by the elastic force (expansion and contraction) of the helical spring. ing. Therefore, when the nozzle 60 of the nozzle unit 5 descends and comes into contact with the land of the printed circuit board P, the shock is absorbed by the elastic force of the spring (spring spring) of the suspension unit 4 even if the head 3 descends further. The pressure of the printed circuit board P by the nozzle 60 is reduced.

The suspension unit 4 reduces the weight of the nozzle unit 5 (including the nozzle 60) relative to the printed circuit board P. The degree of lightening can be set appropriately by, for example, making the weight of the nozzle unit 5 10% when the normal weight is 100%.

A fan 80 that blows air to a lower region of the support plate 90, particularly an upper region of the nozzle unit 5, is provided on the lower portion of the back surface side of the head portion 3 (lower side behind the rear end of the support plate 90). As shown in FIGS. 3 and 4, the fan 80 is fixed to the head portion 3 in the present embodiment, and has a substantially rectangular parallelepiped casing 81 and a rotation inside the casing 81. The fins 82 that can be arranged are the main components. In addition to the housing 81 and the fins 82, the fan 82 has, of course, a drive source for rotating the fin 82, a mechanism for supplying electric power to the drive source, and a mechanism for controlling the rotation of the fin 82. However, since various existing configurations can be appropriately used for these configurations and mechanisms, detailed description thereof will be omitted in the present embodiment.

Further, in this embodiment, the nozzle unit 5 is provided from the head portion 3 via the suspension unit 4.
The nozzle unit 5 is mainly configured by a nozzle 60, a heater 51 (see FIG. 1) that heats the nozzle 60, and an intermediate body 70 that is provided above the nozzle 60 and functions as a partition. The heaters 51 (see FIG. 1) provided on both sides of the nozzle 60 are surrounded by a heater cover 50 (see FIG. 4). That is, the heater cover 50 is not shown in FIGS. 1 and 2, and the heater 51 is covered and hidden by the heater cover 50 in FIGS. 3 and 4.

Then, the soldering device 1 according to the present embodiment induces convective heat H toward the upper side of the nozzle 60, as shown in FIGS. 3 and 4. This is because the temperature of the heater 60 is raised to about 550° C., for example, in order to set the temperature of the nozzle 60 to 520° C. for melting the solder piece 2b. Further, the suspension unit 4 is provided in the present embodiment in order to further provide a space between the intermediate body 70 and the head portion 3, but the nozzle 60 is also provided via this suspension unit 4 (in particular, the slide shaft of the suspension unit 4). The convective heat H caused by the heat transfer is transferred to the solder wire cutting mechanism section 40.

Therefore, in the present embodiment, the fan 80 that blows air toward the space above the nozzle 60, that is, the space between the upper portion 50a and the support plate 90 is provided. As a result, for example, the cold air W, which is a room temperature, is fed from a direction orthogonal to the operation direction of the solder paste cutting mechanism 40 to create the air curtain AC in the space. When viewed from the front, this space is a region surrounded by the support plate 90, the nozzle unit 5, and the suspension units 4 and 5, as shown in FIG. By blowing air toward this region, the upper part of the nozzle 60 in the nozzle unit 5 (that is, the upper part of the intermediate body 70) is cooled by the center part of the air blow, and the suspension unit 4 is also cooled by the side part of the air blow.

As a result, if the fan 80 operates when the solder wire cutting mechanism 40 is in the retracted position not above the nozzle 60, it is difficult to transfer the heat of 520° C. from the nozzle 60 upward. As a result, even if the heater is heated to 550° C., not only the air curtain AC made of the cold air W but also the above-described action of the intermediate body 70 is combined, and the temperature rise is effectively suppressed to not more than 80° C., for example, 55° C. or less. Be done. This prevents unintentional melting of a part of the solder piece 2b from accidentally starting.

That is, it is possible to effectively avoid the possibility that the solder piece 2b is unnecessarily attached to the thread solder cutting mechanism section 40, and thus the operation of the soldering apparatus 1 is hindered. Therefore, in this embodiment, the wind above the nozzle 60, in other words, the cold air W that is a laminar flow, is passed so that the temperature above the nozzle 60 does not exceed 55° C. As a result, the temperature of the thread solder cutting mechanism 40 is It doesn't rise unnecessarily.

More specifically, the temperature of the nozzle 60 needs to be increased as described above for soldering a device having large heat dissipation in the quantitative soldering method as in the present embodiment. On the other hand, the solder wire cutting mechanism portion 40 and other mechanism portions need to be at or below the allowable temperature.

Therefore, in the present embodiment, the convection heat H shown as an upward arrow in FIGS. 3 and 4 is provided with the fan 80 so as to prevent the heat transfer to the upper portion by providing the air curtain AC by the laminar cold air W.

As a result, in the present embodiment, the temperature of the space above the intermediate body 70 was epoch-makingly suppressed to 55° C. or less, and high-speed and stable supply of the solder pieces 2b was realized. As a result, it is possible to reliably prevent the heat from the heater 51 from being transferred and the flux being melted at a position other than the melting point (that is, in the solder piece supply passage 63) during soldering in which the flux may start melting at 80° C. It is possible to always realize stable soldering. Further, since the flow of gas is controlled so as to blow air above the upper portion 50a, the influence on the temperature of the nozzle 60 can be suppressed as much as possible, and in this embodiment, the temperature drop can be suppressed to about 2°C to 10°C. In addition, even if the fumes generated when the solder pieces 2b are melted in the solder piece supply passage 63 of the nozzle 60 are moved upward by the hot air, they are diffused by the air blown by the fan 80 and discharged to the outside. As a result, fumes are attached to the respective mechanical parts of the soldering device 1 (particularly the thread solder supply guide 16, the solder wire feeding mechanism 17, the pushing rod 18, the solder wire cutting mechanism 40, etc. in the head part 3) to function. Failure can be prevented.

The fan 80 blows air while the wire solder cutting mechanism 4 is in the retracted position, or while the heater 51 is heating the soldering operation, or the nozzle 60 is blown. When the solder piece 2b is supplied to the solder piece supply passage 63 or slightly before that, and when the soldering is completed and the soldering is completed, the air supply is started and the solder is not melted at the time of soldering, but otherwise the air is blown. Etc., and an appropriate configuration can be adopted. By doing so, it is possible to appropriately cool and suitably melt the solder.

The movable range of the head unit 3 is a standby position (position P1 shown in FIG. 1) located above the transport width direction moving unit 8 and soldering areas E1 and E2 for soldering the printed circuit board P (FIG. 1). The area surrounded by E1 of 1 and E2 of FIG. 2). The head unit 3 is moved by the approaching/separating direction moving unit 6 at any of these standby positions and soldering regions.

With this configuration, the soldering apparatus 1 keeps the nozzle 60 on standby at the height and position of the standby position P1 during standby, and when performing the soldering process, it is positioned in the soldering areas E1 and E2 more than the standby position P1. Soldering is performed at a low (close to the soldering target) height of the soldering position P2.

FIG. 5 is a block diagram showing a configuration of a drive system and a control system of the soldering device 1. The soldering device 1 is a conveyance guide in the Y direction (conveyance width direction, depth direction in FIG. 2) that is fixed to the conveyance width direction movement unit 8 (see FIG. 1) and extends straight toward the conveyance path 9 (see FIG. 1). 7f and a conveyance guide 7c in the X direction (conveyance direction, left-right direction in FIG. 2) that moves along the conveyance guide 7f in the Y direction by a drive mechanism section 7e such as a stepping motor. The drive mechanism portion 7e and the Y-direction conveyance guide 7f are housed in the conveyance width direction movement unit 8 (see FIG. 1). The X-direction transport guide 7c extends straight in the transport direction (X direction) of the transport path 9.

A moving body 7a that moves in the X direction along the X-direction transport guide 7c is provided above the X-direction transport guide 7c, and stepping that moves the moving body 7a in the X-direction along the X-direction transport guide 7c. A drive mechanism section 7b including a motor and the like is provided. The moving body 7a, the drive mechanism portion 7b, and the X-direction transport guide 7c are housed in the transport direction moving unit 7 (see FIG. 1). The moving body 7a, the drive mechanism section 7b, the X-direction transport guide 7c, the drive mechanism section 7e, and the Y-direction transport guide 7f function as a nozzle position moving unit that moves the nozzle 60 to an arbitrary position to be operated. ..

The movable body 7a is provided with a conveyance guide 5c in the Z direction (height direction) that extends in a direction in which the nozzle 60 approaches/separates from the through hole. The transport guide 5c is provided with a head fixing portion 5a that moves in the Z direction and a drive mechanism portion 5b that includes a stepping motor and the like. The head fixing portion 5a, the drive mechanism portion 5b, and the transport guide 5c function as a proximity separating direction moving unit that moves the nozzle 60 in a direction of approaching/separating from the soldering target, and the proximity separating direction moving unit 6 (see FIG. 1). ) Is stored inside.

The Y-direction transport guide 7f, the X-direction transport guide 7c, and the drive mechanism portions 7b and 7e configured as described above function as nozzle position moving means, so that the position of the nozzle 60 is moved to an arbitrary position for soldering. Can be moved. Further, the Z-direction transport guide 5c and the drive mechanism portion 5b function as the approaching/separating direction moving means, so that the nozzle 60 is moved in the approaching direction at the moved position to form a hole of the nozzle 60 (a solder piece supply passage described later). 63) A pin to be soldered can be inserted into the inside of the 63) to bring the tip of the nozzle 60 into contact with the through hole, or to bring the tip of the nozzle 60 into contact with or close to the object to be soldered, and to separate after soldering. Further, the transfer guide 5c and the drive mechanism portion 5b in the Z direction move the nozzle station (not shown) in the direction of approaching the replacement nozzle 60 or the heater 51, and after the nozzle 60 or the heater 51 is replaced, the nozzle guide is separated. You can

The head portion 3 is fixed to the head fixing portion 5a.
The head portion 3 is fixed to the floating unit 15, and a thread solder supply guide 16 through which the thread solder 2 (see FIG. 1) is inserted, and a thread solder delivery mechanism section that sandwiches the thread solder in the thread solder supply guide 16 with a roller and sends it out. 17 is provided, and a thread solder cutting mechanism 40 (solder piece supply means) is provided at the bottom. This wire solder cutting mechanism section 40 is provided with a rotation mechanism section 19 (moving means) constituted by a stepping motor or the like from the upper position of the nozzle unit 5 to the retracted position on the side thereof, in the solder piece supply direction (close proximity or separation). The wire solder 2 (see FIG. 1) supplied to the wire solder supply guide 16 is cut under the control of the rotation mechanism unit 19.

An intermediate body 70 (heat transfer preventing body) is provided below the solder wire cutting mechanism portion 40 with a slight distance therebetween, and a nozzle 60 is provided below the intermediate body 70 with a little distance therebetween. In this way, the thread solder cutting mechanism section 40, the intermediate body 70, and the nozzle 60 are arranged side by side in this order downward in the supply direction of the solder piece 2 b, and the thread solder cutting mechanism section 40 causes the thread solder 2 to move. The cut solder pieces pass through the intermediate body 70 and are supplied to the nozzle 60.

Further, each element is controlled by the control unit 21 in order to drive these constituent elements. The control unit 21 includes a drive mechanism unit 5b, a drive mechanism unit 7b, a drive mechanism unit 7e, a floating unit 15, a solder solder feeding mechanism unit 17, a rotation mechanism unit 19, a heater unit contact confirmation sensor 22, a temperature sensor 23, and a detachable unit. The air cylinder 24, the camera 25, and the storage unit 26 are connected.

The camera 25 is used when confirming and positioning the positions of through holes and pins of a printed circuit board to be soldered, and when detecting a soldering abnormality such as when a soldering turtle occurs.

The storage unit 26 associates an image of a soldering target work such as a printed circuit board with a tool (nozzle 60 or heater 51) to be used for this soldering target work, and presents the tool data for each soldering target work. It stores data such as the type of tool, the number of times the tool is currently mounted and the time it has been used.

6A and 6B are explanatory views for explaining the configuration of the thread solder cutting mechanism section 40. FIG. 6A is an exploded perspective view of the thread solder cutting mechanism section 40, and FIG. FIG.

The solder solder cutting mechanism 40 includes a solder solder supply guide 16 having a passage for passing the solder solder 2a fed downward, a solder piece container 44 for storing a plurality of cut solder pieces 2b, and a solder piece container. The rotation mechanism section 19 (see FIG. 5) for moving the 44 is configured. Further, the solder piece storage body 44 is provided with a shutter 36 that controls storage/release of the stored solder pieces 2b and a biasing body 35 (biasing means) that biases the shutter 36. Further, a shutter operation section 49 (shutter movement restricting body) for releasing the shutter 36 is provided separately from the solder piece container 44. The solder piece container 44, the rotation mechanism portion 19, the shutter 36, and the shutter operation portion 49 serve as solder piece supply means for supplying the solder piece 2b to the hole (solder piece supply passage 63 described later) of the nozzle 60. Function.

The solder paste supply guide 16 is formed of a metal member in a cylindrical shape, and allows the solder paste 2a to pass through the inner hole (passage) in the longitudinal direction. Further, the thread solder supply guide 16 is fixed so as not to move in a direction perpendicular to the passing direction of the thread solder 2a (radial direction of the thread solder 2a).

The urging body 35 can be configured by an appropriate spring, and is configured by a metal crane spring in this embodiment.

The shutter 36 is composed of a metal plate bent in an L shape, and the bottom portion of the L shape is a storage/release control plate portion 38 in a horizontal state (a state vertical to the approaching/separating direction). The vertical surface portion is the pressing operation portion 37 that is pressed by the urging body 35. The storage/release control plate portion 38 is provided with a plurality of release holes 38a (through holes or through grooves) at equal intervals in a straight line. In this embodiment, four release holes 38a are provided. The adjacent portion of the release hole 38a (including the portion between the release hole 38a and the release hole 38a) functions as a closing portion that prevents the solder piece 2b from falling. Although the shutter 36 is provided with a plurality of release holes 38a, the present invention is not limited to this, and a plurality of release grooves may be provided so that the storage/release control plate portion 38 of the shutter 36 looks like a comb in a plan view. .. In this case, the same function can be secured.

In the solder piece storage body 44, a guide portion 48, which is wider than the width of the block portion 43 in the lateral direction and has the same length in the longitudinal direction, is integrally formed on the lower surface of the horizontally long cubic block portion 43. The guide portion 48 is provided with a shutter insertion hole 47 penetrating in the longitudinal direction. The shutter insertion hole 47 is formed so that the height and width thereof are slightly larger than the height and width of the storage/release control plate portion 38 of the shutter 36, so that the shutter 36 can be smoothly slid in the longitudinal direction without blurring. There is. The block portion 43 and the guide portion 48 are provided with a plurality of solder piece storage portions 45 penetrating in the up-down direction (approaching direction) in a straight line at equal intervals. In this embodiment, four holes are provided, which are the same size as the opening holes 38 a of the shutter 36 and are provided at the same intervals.

The release hole 38a of the shutter 36 may be formed larger than the solder piece storage portion 45. As a result, the solder piece 2b can be reliably dropped in the open state. Further, the solder piece storage portion 45 is formed by a hole, but the present invention is not limited to this, and the solder piece 2b is dropped such that it is surrounded by a plurality of members so that the solder piece 2b can be housed inside. It can be formed in an appropriate shape so that it can be stored as much as possible.

One end of a guide plate 42, which is long in the longitudinal direction of the solder piece container 44, is connected to an upper portion of one end of the solder piece container 44 in the longitudinal direction. A hole 41 for screwing is provided at the other end of the guide plate 42, and the locking plate 32 is screwed into the hole 41 with a screw 31.

The locking plate 32 is provided with a screw hole 33 at the top thereof, into which the screw 41 is inserted. A pressing counter surface 34 that faces the pressing operation portion 37 of the shutter 36 is provided below the screw hole 33 of the locking plate 32. One end of the urging body 35 comes into contact with the pressing opposing surface 34, and the other end of the urging body 35 comes into contact with the pressing operating portion 37 of the shutter 36, so that the distance from the pressing opposing surface 34 to the pressing operating portion 37 becomes larger. The urging body 35, which is in a normal state when extended for a long time, urges the pressing opposing surface 34 and the pressing operation portion 37 in the direction of separating from each other. As a result, the shutter 36 is maintained in a state in which the pressing operation portion 37 is in contact with the one end surface of the solder piece storage body 44. At this time, as shown in FIG. 6B, the solder piece storage portion 45 of the solder piece storage body 44 and the release hole 38a of the shutter 36 are displaced from each other, and the solder piece storage portion 45 of the solder piece storage body 44 is displaced. The shutter 36 is closed by the storage/release control plate 38. Therefore, the solder pieces 2b existing in the solder piece storage portion 45 are stored by the storage/release control plate portion 38 of the shutter 36 so as not to drop downward.

On the opposite side of the solder piece storage body 44 from the guide plate 42, a shutter operation section 49 is provided at a position separated from the solder piece storage body 44, independently of the solder piece storage body 44. The shutter operating portion 49 is arranged to face the end surface of the storage/release control plate portion 38 of the shutter 36 opposite to the pressing operating portion 37. Therefore, when the solder piece container 44 is moved to the shutter operating portion 49 side together with the shutter 36 by the rotational driving of the rotating mechanism portion 19 (see FIG. 5), the end surface of the shutter 36 contacts the shutter operating portion 49. When the solder piece storage body 44 is further moved by the rotational drive of the rotation mechanism portion 19 (see FIG. 5), the shutter 36 is not moved any more by the shutter operation portion 49, and therefore the solder piece storage body 44 and the shutter 36 are not moved. As the relative position changes, the positions of the solder piece storage portion 45 of the solder piece storage body 44 and the release hole 38a of the shutter 36 become the same position, and the release state is established, and the solder piece 2b drops downward.

The solder piece accommodating body 44 and the thread solder supply guide 16 are disposed so that their opposing surfaces are in contact with each other, and are configured to be relatively movable in the radial direction of the supplied thread solder 2a. In this embodiment, the solder solder supply guide 16 is fixed, and the solder piece container 44 can slide in the radial direction of the solder solder 2a. Therefore, with the part of the thread solder 2a fed from the thread solder supply guide 16 being supplied to the solder piece storage portion 45 of the solder piece storage body 44, the solder piece storage body 44 is moved in the radial direction of the thread solder 2a. When moved, the wire solder 2a is cut at the contact surfaces of the solder piece container 44 and the thread solder supply guide 16 due to the relative movement of the solder piece container 44 and the thread solder supply guide 16. Therefore, the solder piece container 44 and the thread solder supply guide 16 serve as a solder piece cutting means for cutting the solder piece 2b. The cut solder piece 2b is stored in the solder piece storage portion 45 of the solder piece storage body 44.

Further, the upper surface of the solder piece container 44, the lower surface of the thread solder supply guide 16, and the storage/release control plate portion 38 of the shutter 36 are all parallel to the moving direction of the solder piece container 44 (particularly in the horizontal direction in this embodiment). Is configured. Further, the longitudinal direction of the solder piece accommodating portion 45 (solder piece passing direction) and the longitudinal direction of the solder piece supply passage 63 (solder piece supply passage, see FIG. 8) of the nozzle 60 (solder piece passing direction) are all solder piece accommodating. It is configured to be perpendicular to the moving direction of the body 44 (particularly the vertical direction in this embodiment).

7 and 8, the thread solder 2 is cut by the solder piece container 44 to store a plurality of solder pieces 2b, and then the shutter 36 is opened and the plurality of solder pieces 2b are dropped to remove the intermediate body 70. It is explanatory drawing explaining the operation|movement which passes and it supplies to the nozzle 60 by sectional drawing. This operation is executed by the control unit 21 (see FIG. 5) controlling the drive of the thread solder feeding mechanism unit 17 and the rotation mechanism unit 19.

As shown in the cross-sectional view of FIG. 7(A), by the rotational driving of the rotation mechanism section 19 (see FIG. 5), the solder piece storage body 44 is supplied with the solder solder supply section 45 closest to the shutter operation section 49. It stops at a position below the guide 16 in a state of communicating in a straight line. In this state, the rod-shaped thread solder 2a that has been drawn out from the tip end side of the wound thread solder 2 (see FIG. 1) is sent out by the thread solder sending-out mechanism section 17 (see FIG. 5), and as shown in FIG. As shown in B), the tip of the solder wire 2 a is stored in the solder piece storage portion 45. Then, when the length of the solder piece 2b from the facing surface portion (contact surface portion) of the solder piece container 44 and the thread solder supply guide 16 to the tip of the solder piece 2a reaches the required length of the solder piece 2b, the thread solder 2a is unwound. The solder delivery mechanism 17 (see FIG. 5) stops the supply (feeding) of the thread solder 2a.

In this state, when the solder piece storage body 44 is slid by the rotational drive of the rotating mechanism portion 19 (see FIG. 5), the solder solder storage body 44 and the solder solder supply guide 16 face each other (contact surface portion) and the solder wire 2a Are cut into the solder pieces 2b, and the solder pieces 2b are stored (stored) in the solder piece storage portion 45 as shown in FIG. 7C. FIG. 7C shows a state in which the cutting is repeated by the number of the solder piece storage portions 45 (a necessary number) and the cutting is completed. At this time, the distance by which the solder piece storage body 44 is slid is the same as the distance between the centers of the adjacent solder piece storage portions 45. Therefore, immediately below the thread solder supply guide 16, the solder piece storage portion 45 adjacent to the corresponding solder piece storage portion 45 is located.

When the solder piece storage body 44 is slid by the rotational drive of the rotation mechanism portion 19 (see FIG. 5), the tip of the shutter 36 abuts against the shutter operation portion 49 and is pressed, as shown in FIG. Shrinks, the solder piece storage portion 45 of the solder piece storage body 44 and the release hole 38a of the shutter 36 are all communicated with each other, and the plurality of solder pieces 2b are dropped all at once and pass through the through hole 73 of the intermediate body 70 below. Further, it is supplied to the solder piece supply passage 63 of the nozzle 60 below. When the solder pieces 2b are dropped, the push rods 18 (see FIG. 3) are inserted into all the solder piece accommodating portions 45 from the upper side to the lower side, and the solder pieces 2b are pushed out to force the solder pieces 2b. May be supplied to the lower nozzle 60 (see FIG. 5).

As shown in the vertical cross-sectional view of FIG. 8, the intermediate body 70 is provided between the solder piece storage body 44 of the thread solder cutting mechanism section 40 and the nozzle 60, and in which of the thread solder cutting mechanism section 40 and the solder piece storage body 44. It is arranged a little apart from it.

The intermediate body 70 is integrally molded of aluminum. The material of the intermediate body 70 is not limited to this, and other materials such as stainless steel and heat insulating ceramics can be used.

In the intermediate body 70, a plurality of through holes 73 through which the solder pieces 2b pass are formed so as to face the solder piece supply passages 63 at the same intervals as the solder piece supply passages 63 of the nozzle 60. The plurality of through-holes 73 are also arranged in the solder piece housing body 44 by the same number as the solder piece housing portions 45 and at the same intervals as opposed to the solder piece housing portions 45.

The size of the intermediate body 70 in the surface direction orthogonal to the direction in which the solder piece 2b passes through the through hole 73 is such that the facing surface (lower surface in the drawing) of the solder piece housing body 44 of the thread solder cutting mechanism section 40 and the nozzle 60 face each other. The surface (upper surface in the drawing) has a size equal to or larger than the area of the smaller one, and is formed to have a shape that substantially covers or completely covers the entire facing surface of the smaller one. Preferably, the size is equal to or larger than the larger one of the facing surface (lower surface in the drawing) of the solder piece housing 44 of the thread solder cutting mechanism 40 and the facing surface (upper surface in the drawing) of the nozzle 60. Is preferred. It is preferable to have a configuration that substantially covers both the facing surface (the lower surface in the drawing) of the solder piece container 44 and the facing surface (the upper surface in the drawing) of the nozzle 60, and it is more preferable that the both surfaces are completely covered. ..

The through hole 73 is configured such that the shortest length of the opening on the nozzle 60 side is the same as the shortest length of the opening on the intermediate body 70 side in the solder piece supply passage 63 of the nozzle 60. In this example, the length of one side which is the shortest length of the opening of the solder piece supply passage 63 which is a square and the diameter which is the shortest length of the opening of the through hole 73 which is a circle have the same length. The shortest length of the opening of the through hole 73 on the nozzle 60 side is preferably shorter than the shortest length of the opening of the solder piece supply passage 63 on the intermediate body 70 side. As a result, when the solder piece 2b moves from the intermediate body 70 to the nozzle 60, it is possible to more reliably prevent the solder piece 2b from being caught in the separated gap S1.

Further, the through hole 73 is configured such that the shortest length of the opening on the solder piece storage body 44 side is the same as the shortest length of the opening on the intermediate body 70 side in the solder piece storage portion 45 of the solder piece storage body 44. ing. In this example, the diameter which is the shortest length of the opening of the circular solder piece storage portion 45 and the diameter which is the shortest length of the opening of the through hole 73 which is circular are the same length. The shortest length of the opening of the through-hole 73 on the solder piece storage body 44 side is preferably longer than the shortest length of the opening of the solder piece storage portion 45 on the intermediate body 70 side. As a result, when the solder piece 2b moves from the solder piece storage body 44 to the intermediate body 70, it is possible to more reliably prevent the solder piece 2b from being caught in the separated gap S2.

The gap S1 between the intermediate body 70 and the nozzle 60 is formed shorter than the length of the solder piece 2b, more preferably half or less of the length of the solder piece 2b, and further preferably 3 minutes of the length of the solder piece 2b. No. 1 or less. As a result, it is possible to prevent the solder piece 2b from jumping out of the nozzle 60 in the gap S1 without being passed from the through hole 73 to the solder piece supply passage 63. Further, the gap S1 in the present embodiment is formed shorter than the shortest length of the opening of the solder piece supply passage 63 and the shortest length of the opening of the through hole 73 of the intermediate body 70. This more reliably prevents the solder piece 2b from being caught in the gap S1.

The gap S1 is within a range in which the solder piece 2b is not caught due to the size and distance between the opening of the solder piece supply passage 63 and the opening of the through hole 73 which are opposed to each other and the length and thickness of the solder piece 2b. It is desirable to make a gap. It is preferable that the gap S1 is wide in order to prevent heat from being transferred, but by doing so, stable supply of the solder pieces 2b can be realized, and heat can be released by other means (heat sink or cooling). It can be reinforced with air).

The gap S2 between the solder piece housing 44 and the intermediate body 70 is formed shorter than the length of the solder piece 2b, more preferably half or less of the length of the solder piece 2b, and further preferably the length of the solder piece 2b. It is formed in one third or less. As a result, it is possible to prevent the solder piece 2b from jumping out of the intermediate body 70 in the gap S2 without being passed from the solder piece storage portion 45 to the through hole 73. Further, the gap S2 in the present embodiment is formed shorter than the shortest length of the opening of the solder piece storage portion 45 and the shortest length of the opening of the through hole 73 of the intermediate body 70. This more reliably prevents the solder piece 2b from being caught in the gap S2.

The gap S2 is within a range in which the solder piece 2b is not caught due to the relationship between the size and distance between the opening of the solder piece storage portion 45 and the opening of the through hole 73 which are opposed to each other, and the length and thickness of the solder piece 2b. It is desirable to make a gap. It is preferable that the gap S2 is wide in order to prevent heat from being transferred, but by doing so, stable supply of the solder piece 2b can be realized, and heat can be released by other means (heat sink or cooling purpose). It can be reinforced with air).

9 and 10 are explanatory views for explaining the configurations of the nozzle 60 and the heater 51. FIG. 9(A) is an exploded perspective view, FIG. 9(B) is a perspective view, and FIG. 10 is a vertical sectional view. FIG. 11 shows a cross-sectional view of the nozzle 60 and the heater 51.

The nozzle 60 is formed by stacking (contacting) two members, a first member 61 and a second member 65. Both the first member 61 and the second member 65 are made of ceramic.

In the first member 61, a plurality of parallel solder piece guide grooves 63a (grooves) are formed in parallel in a vertical direction (approaching direction) on one surface of a rectangular parallelepiped shape integrally formed as one member. Further, the first member 61 is provided with the fixing groove 62 on the side surface adjacent to the surface on which the solder piece guiding groove 63a is provided.

The second member 65 is formed in a rectangular parallelepiped having the same size and a shape that is symmetrical with respect to the first member 61. That is, in the second member 65, the facing surface 65a facing the first member 61 is a flat surface without the solder piece guiding groove 63a, and the surfaces contacting the first member 61 have the same size and shape. Has been formed. Further, the second member 65 is provided with a fixing groove 66 on the side surface adjacent to the surface facing the first member 61. The position and depth of this fixing groove 66 are. It is formed in the same manner as the fixed groove 62 of the first member 61.

The second member 65 is provided with a heater through hole 67 penetrating in the arrangement direction in which the plurality of solder piece guide grooves 63a are arranged, at a position close to the surface facing the first member 61. The heating portion 52 of the heater 51 is inserted into the heater through hole 67. In the illustrated example, the heating parts 52 of the two heaters 51 are respectively inserted from the openings at both ends of the heater through hole 67. The two heating units 52 are arranged in a straight line in the arrangement direction of the solder piece supply passages 63 (left and right direction in FIG. 11) so as to correspond to all the solder piece supply passages 63 (see FIG. 11 ), and all the solder piece supply passages are supplied. It is arranged so that the distance from the passage 63 is equidistant. Accordingly, almost the same heating can be performed on all the solder piece supply passages 63, and there is no difference in the wall surface temperature of the solder piece supply passages 63 and the melting rate of the solder pieces 2b for each solder piece supply passage 63. I am trying.

The second member 65 has a hole 68 in the center of the surface opposite to the surface facing the first member 61, and the thermocouple 57 is inserted into the hole 68. The thermocouple 57 functions as the temperature sensor 23 (see FIG. 5) and measures the temperature of the nozzle 60.

When all of these are combined, as shown in FIG. 9B, the facing surfaces of the first member 61 and the second member 65 are brought into contact with each other without a gap, and the solder piece guide groove 63a of the first member 61 (see FIG. 9A) and a facing portion 65b (facing portion, see FIG. 11) of the facing surface 65a of the second member 65 facing the solder piece guiding groove 63a, the solder piece 2b is brought into contact with the terminal T. A solder piece supply passage 63 is formed which guides to the position where the solder piece is supplied. The solder piece supply passages 63 are arranged in a straight line in the vertical direction (approaching direction), and a plurality (four in this embodiment) are arranged in parallel at equal intervals. Further, in the present embodiment, the solder piece supply passage 63 is formed to have a square cross section. The solder piece supply passage 63 is not limited to have a square cross section, but may have an appropriate shape such as a polygonal cross section, an elliptical cross section, and a circular cross section, and preferably a circular cross section.

The solder piece supply passages 63 (and the solder piece guide grooves 63a) are formed in the same size and at the same intervals as the solder piece storage portions 45 of the solder piece storage body 44 (see FIG. 8).

Therefore, as shown in FIG. 8, the solder pieces 2b that drop all at once (almost at the same time) are arranged so that the solder piece storage portion 45, the through hole 73, and the solder piece supply passage 63 communicate with each other in a straight line at the lower position. In this state, it passes through the through hole 73 of the intermediate body 70 and is supplied all at once (almost simultaneously) to the solder piece supply passage 63 of the nozzle 60 as shown in FIG.

When soldering, the nozzle 60 is lowered to a position where the lower end contacts the land R of the printed circuit board P, and the solder piece 2b is supplied at this position. At this time, the solder piece 2b is the most convex end (FIG. 10) in the tip of the terminal T of the electronic component C of the printed board P (or in the solder piece guide direction of the solder piece supply passage 63 (downward in FIG. 10)). Top))) and stop. In the illustrated example, the solder piece 2b is stopped on the terminal T when it is stopped.

Then, the solder piece 2b supplied to the solder piece supply passage 63 of the nozzle 60 is melted by receiving heat from the heating portion 52 of the heater 51. At this time, the heat of the heating portion 52 is transferred from the solder piece 2b to the terminal T, and the terminal T is gradually heated by the transferred heat. Further, the land R receives heat directly from the nozzle 60 and is heated before the terminal T.

Then, when the solder piece 2b reaches the melting temperature, the solder piece 2b melts, but the solder piece 2b is still placed on the terminal T in a substantially spherical shape. During this time, the terminal T is heated by the transferred heat. Then, when the heating of the terminal T further progresses, a plurality (four) of molten solder in which the solder pieces 2b are melted flows out along the terminal T, and a plurality (four) of the terminals T (second conductor) and the land R ( The first conductors are half-attached all at once (simultaneously) and electrically connected. After that, the nozzle 60 is moved upward and separated, and the molten solder is cooled and solidified, so that soldering at a plurality of points is completed all at once (simultaneously).

12 and 13 are explanatory views showing the configuration of the intermediate body 70.
FIG. 12(A) is a perspective view of the intermediate body 70 as seen from the upper left front side, FIG. 12(B) is a perspective view of the intermediate body 70 as seen from the lower left front side, and FIG. FIG. 13 is a bottom view of the intermediate body 70, and FIG. 13B is a front view of the intermediate body 70.

As shown in FIG. 12(A), the intermediate body 70 has a substantially rectangular parallelepiped shape that is horizontally long and flat in the vertical direction, and is provided with vent holes 71 that penetrate left and right in the longitudinal direction. The vent hole 71 is formed in a straight line parallel to the center line on the front side of the center of the intermediate body 70 in the lateral direction (depth direction in the drawing).

In the intermediate body 70, a plurality of through holes 73 penetrating straight in the thickness direction (vertical direction, solder piece passing direction) are arranged at equal intervals.

Each through hole 73 is provided with a connection hole 76 that is formed in a straight line obliquely from the inner side near the upper opening where the wire solder cutting mechanism section 40 (see FIG. 8) is present toward the vent hole 71. By this connection hole 76, each through hole 73 is communicated with the ventilation hole 71, and the air (refrigerant) supplied from the ventilation hole 71 flows into the through hole 73 through the connection hole 76. The refrigerant is not limited to gas such as air and gas, but may be liquid such as cooling water.

In the vent hole 71, a plurality of exhaust holes 72 penetrating straight toward the front side, which is the opposite side of the through hole 73, are arranged at the same intervals so as to face each through hole 73. The exhaust hole 72 is arranged at right angles to the vent hole 71 and communicates therewith, and exhausts the air supplied from the vent hole 71.

Due to the vent hole 71, the exhaust hole 72, and the through hole 73, the inflow air a1 for cooling supplied from the vent hole inlet side 71a is not only discharged as the exhaust air a4 from the vent hole outlet side 71b, but also The air flows into the through hole 73 through the connection hole 76 and is discharged as exhaust air a2 from above and below, and is discharged as exhaust air a3 from the plurality of exhaust holes 7.

On the lower surface side of the intermediate body 70, a plurality of grooves 74 formed by cutting or die cutting in the front-rear direction are provided in a portion where the vent hole 71, the through hole 73, and the exhaust hole 72 do not exist. The rib-shaped portion where the groove 74 is not provided forms the heat sink 75. Thereby, the heat received from the nozzle 60 can be efficiently radiated by the heat sink 75.

As described above, the intermediate body 70 radiates the heat received from the nozzle 60 by the cooling air passing through the ventilation hole 71, the exhaust hole 72, and the through hole 73, and also radiates the heat by the heat sink 75. Therefore, even if the heat from the nozzle 60 is received, it is possible to efficiently dissipate the heat and prevent the heat from being transferred to the wire solder cutting mechanism section 40.

Next, the soldering operation will be described in detail.
<Soldering operation>
As shown in the cross-sectional view of FIG. 10, in a printed circuit board P on which lands R are formed as a base material for soldering, through holes of the printed circuit board P are arranged from the front surface side to the rear surface side (lower surface in FIG. 10) of the printed circuit board P. From the side to the upper surface side), the one in which the terminal T of the electronic component C is inserted is prepared.

<Alignment process>
The controller 21 moves the positions of the plurality of solder piece supply passages 63 of the nozzle 60 on the XY plane by the Y-direction transport guide 7f, the X-direction transport guide 7c, and the drive mechanism units 7b and 7e to perform soldering. The plurality of lands R to be opposed. At this time, the position is such that the center of the land R on the back surface side of the printed board P and the center of the solder piece supply passage 63 are substantially coincident with each other, or the center of the tip of the terminal T and the center of the solder piece supply passage 63 are almost the same. The position should match.

<Solder piece cutting and storing process>
The control section 21 supplies the thread solder 2 a to the required length by the thread solder sending-out mechanism section 17 to one solder piece storage section 45 in the solder piece storage section 44, and drives the rotation mechanism section 19 to drive the solder piece storage section 44. Is moved in the radial direction (thickness direction) of the thread solder 2a, and the thread solder 2 is cut by the thread solder cutting mechanism section 40 (thread solder cutting means) to obtain the solder piece 2b and stored in the solder piece storage section 45. .. At this time, since the shutter 36 is in the closed state, the solder piece 2b does not drop from the solder piece storage portion 45. By repeating this operation, the solder pieces 2b each having a required length are stored in each of the solder piece storage portions 45 one by one. The solder piece cutting and accommodating step can be performed at an appropriate timing, such as before the nozzle approaching step, or in parallel with the nozzle approaching step.

<Nozzle proximity process>
The control unit 21 moves the floating head unit 3 along the transport guide 5c in the direction close to the land R by the drive mechanism unit 5b so that the front end surface (lower end surface in the drawing) of the nozzle 60 is the back surface of the printed circuit board P. The land R on the side is brought into contact with the surface. As a result, the tip of the terminal T is inserted inside the solder piece supply passage 63 of the nozzle 60.

At this time, the terminal T is separated from the inner wall of the solder piece supply passage 63 of the nozzle 60 by an equal distance, and the terminal T and the nozzle 60 are kept in a non-contact state and separated from each other. This prevents heat from being directly transferred from the nozzle 60 to the terminal T, and the terminal T is gradually heated by radiant heat transfer and convective heat transfer. On the other hand, the land R of the printed circuit board P is rapidly heated by direct heat conduction from the contacting nozzle 60 and heat transfer by convection heat transfer.

<Solder piece supply process>
The control unit 21 drives the rotating mechanism unit 19 to further move the solder piece container 44, and moves the shutter 36 until it abuts and is pressed by the shutter operation unit 49. As a result, the plurality of release holes 38a of the shutter 36 communicate with the plurality of solder piece storage portions 45, the plurality of solder pieces 2b drop all at once, pass through the through holes 73 of the intermediate body 70, and further, the nozzle 60. Are supplied one by one to the plurality of solder piece supply passages 63. At this time, the solder piece storage body 44 with the shutter 36 opened is in a state of substantially filling the space between the support plate 90 and the nozzle 60 and the intermediate body 70. Further, at this time, by pushing the solder piece 2b from above by the pushing rod 18 (see FIG. 3), even if there is a solder piece 2b that does not fall freely, the solder piece 2b surely descends until it contacts the tip of the terminal T. To do. The solder piece 2b supplied so as to drop from above is preheated while passing through the solder piece supply passage 63, the end portion of the solder piece 2b comes into contact with the terminal T and stops at the contact position, and the position and the drop are regulated. At this time, the inner wall of the solder piece supply passage 63 functions as a drop restriction portion that restricts the solder piece 2b from falling from a state of standing vertically or obliquely on the tip of the terminal T.

<Melting process>
The solder piece 2b before melting guided to the contact position does not fall from that position, and at least a part of the end portion on the side opposite to the terminal T is located near the heating portion 52 of the heater 51. It contacts the inner wall of the solder piece supply passage 63. Therefore, the plurality of unmelted solder pieces 2b at the abutting position are collectively heated by heat conduction through one end portion, both end portions, or side portions of the solder piece 2b that abuts the inner wall of the solder piece supply passage 63. To be melted. When the solder piece 2b is melted, in addition to direct heat conduction in contact with the nozzle 60, radiant heat transfer from the nozzle 60 and indirect heat transfer such as convective heat transfer due to convection in the nozzle 60. Is also done.

When melted, the plurality of solder pieces 2b tend to be rounded and become substantially spherical due to the surface tension, but cannot be a true sphere because they are restricted by the inner wall of the solder piece supply passage 63 of the nozzle 60 and the tip of the terminal T. It deforms into a thick and short shape in a state of being in contact with the tip of T (a state of being placed on the terminal T). This shape is such that both ends of a short cylinder are spherical.

When melted in this way, heat is transferred from the nozzle 60 to the plurality of solder pieces 2b, and further, heat is transferred from the plurality of solder pieces 2b to the plurality of terminals T, respectively, so that the plurality of terminals T are heated more rapidly than before. To be done. During this heating, the molten solder piece 2b is in contact with the terminal T, that is, in a state of being placed on the terminal T, and is stopped without moving in the solder piece supply direction (downward). The solder piece 2b melts at 217° C. or higher.

When the terminals T are heated to an appropriate temperature via the melted solder pieces 2b, the plurality of melted solder pieces 2b start to get wet and flow from the tip of the terminal T along the side surface of the terminal T all at once. Here, the solder piece 2b that has started to melt and before flowing out may continue to change in shape due to the influence of heat or the like while the position is stopped. Then, the melted solder piece 2b flowing out along the side surface of the terminal T spreads to the land R on the back surface side, and further flows into the gap between the side surface of the terminal T and the land R facing the through hole due to the capillary phenomenon. To do. Then, it spreads to the land R on the front side.

At this time, the fumes that come out of the molten solder pass through the solder piece supply passage 63, flow into the through holes 73 of the intermediate body 70, and are discharged from the ventilation holes 71, the exhaust holes 72, and the through holes 73. Therefore, the intermediate body 70 can also serve as a fume discharging function.

<Nozzle separation process>
After that, the control unit 21 moves the floating head unit 3 along the transport guide 5c in the direction away from the land R by the drive mechanism unit 5b, and the tip end surface of the nozzle 60 is land on the back surface side of the printed circuit board P. Separate from the surface of R. As a result, the land R, the terminal T, and the molten solder piece 2b are rapidly cooled, the molten solder piece 2b is solidified, and the soldering operation ends.

Due to such movement of the melted solder piece 2b, the terminals T are reliably soldered to the lands R, respectively. In this way, the solder is soldered all at once (at almost the same time), and the finished appearance of the solder is beautiful, and the back fillet shape is also neatly formed.

Further, after the nozzles 60 are separated from each other in this manner, the cooling air is flown into the ventilation holes 71 and is discharged from the exhaust holes 72 and the through holes 73, so that the heated intermediate body 70 close to the nozzles 60 can be efficiently used. Well cooled. As a result, heat is transmitted to the solder wire cutting mechanism 40, and the lower portion of the solder solder cutting mechanism 40 becomes hot, and the solder piece 2b stored in the solder piece storage portion 45 and placed on the shutter 36 is melted by heat. It can be prevented.

It should be noted that the solder piece guide groove 63a is preferably plural, but may be one. In this case, it is preferable that the solder piece accommodating portion 45 of the thread solder cutting mechanism 40 is also one, and the through hole 73 of the intermediate body 70 is also one. In the case of such a configuration, it is possible to form the nozzle 60 that can be soldered one by one.

With the above configuration and operation, it is possible to solve a problem that may occur due to heat when the solder of the soldering device 1 is melted. That is, it is possible to prevent the heat of the nozzle 60 from being transmitted to the thread solder cutting mechanism 40 and being melted by the heat, that is, the convective heat H, of the solder piece 2b stored in the solder piece storage portion 45 and placed on the shutter 36. it can.

In particular, in the present embodiment, preventing the heat of the nozzle 60 from being transferred to the thread solder cutting mechanism section 40 serving as a solder piece supply means reduces the size and speed of the soldering device and stabilizes the supply of the solder piece 2b. Further contribute to Therefore, it is possible to more effectively prevent the solder piece 2b from being melted in the middle and not properly supplied to the solder piece supply passage 63 of the nozzle 60.

More specifically, for example, in order to reduce the size and weight of the soldering device 1, it is conceivable to shorten the supply path of the solder piece 2b from the thread solder cutting mechanism 40 to the nozzle 60. In this case, it is preferable to bring the thread solder cutting mechanism 40 as close as possible to the nozzle 60, but the closer it is, the more the heat of the nozzle 60 that is heated to a high temperature for soldering is transferred to the solder solder cutting mechanism 40. It will be. Then, the solder pieces 2b and the flux may partially melt in the thread solder cutting mechanism 40. When this happens, the solder piece 2b does not drop, a part of the solder piece 2b remains, the remaining falling solder piece 2b becomes insufficient, and the next solder piece 2b is clogged. Troubles may occur. This can be prevented by operating the fan 80 as well as the intermediate body 70.

Further, in order to shorten the supply time of the solder piece 2b from the thread solder cutting mechanism 40 to the nozzle 60 even when the soldering device 1 is speeded up, the thread solder cutting mechanism 40 is brought as close to the nozzle 60 as possible. It is possible that Also in this case, it is possible to prevent the solder piece 2b from melting in the solder cutting mechanism section 40 by further providing the intermediate body 70 functioning as a partition, and to prevent the above-mentioned problems due to such melting. it can.

In addition, since the intermediate body 70 includes the ventilation hole 71, the exhaust hole 72, the through hole 73, and the connection hole 76, it is possible to allow the cooling air to pass therethrough and efficiently cool it. Thereby, even when the soldering device 1 is continuously operated for a long time, it is possible to prevent the heat from being gradually accumulated in the intermediate body 70, and to prevent the heat from being gradually accumulated in the thread solder cutting mechanism section 40. ..

Further, since the fan 80 sends out the cool air W in a direction orthogonal to the operation direction of the thread solder cutting mechanism 40, the cool air W can be efficiently supplied when the thread solder cutting mechanism 40 is in the retracted posture. The air curtain AC can be suitably created by feeding Further, the support plate 90 prevents the gas moved by the fan 80 from flowing into the mechanism above the head portion 3, that is, the region where the solder paste supply guide 16, the solder solder delivery mechanism 17, and the push rod 18 are present. Therefore, even if the cold air W is heated by the heater 51 or the nozzle 60 to become a hot gas, the heated gas passes through the mechanisms such as the thread solder supply guide 16, the thread solder delivery mechanism section 17, and the pushing rod 18. It is possible to prevent heating.

It should be noted that the present invention is not limited to the above-described embodiments, but can be variously modified.

For example, in the above-described embodiment, only one fan is attached, but it is also possible to use a plurality of fans to blow air from a plurality of directions. Also, instead of fixing the fan to the head portion as in the above-described embodiment, the fan is positioned separately from the head portion, or a fan that exerts the action of removing the air above the nozzle rather than sending in the wind is applied. For example, various modifications can be made without departing from the spirit of the present invention.

In addition, the first conductor and the second conductor to be soldered are not limited to the terminals T and the lands R of the printed circuit board P, and may be laid on wirings of the printed circuit board, for example, terminals of the motor and lead wires. Appropriate soldering targets such as the placed terminal and the wiring can be used. Also in these cases, similarly, the first conductor and the second conductor can be soldered and electrically connected in a state where the nozzle is close to or in contact with the first conductor.

INDUSTRIAL APPLICABILITY The present invention can be used in industries in which soldering is performed in production equipment.

DESCRIPTION OF SYMBOLS 1... Soldering device 2b... Solder piece 3... Upper unit (head part)
4... Suspension unit 5... Nozzle unit 17... Thread solder feeding mechanism 40... Cut unit (thread solder cutting mechanism)
51... Heater 52... Heating part 60... Nozzle 70... Intermediate 80... Fan H... Convective heat W... Wind (cold air)
AC...air curtain

Claims (5)

A soldering device for soldering a first conductor and a second conductor with molten solder, comprising:
A nozzle having a solder piece supply passage for passing the solder piece;
Relative distance changing means for changing the relative distance between the first conductor and the nozzle in the approaching/separating direction to bring the first conductor and the nozzle into proximity or contact.
Solder piece supply means for supplying the solder piece to the solder piece supply passage of the nozzle;
Heating means for heating and melting the solder piece in the solder piece supply passage of the nozzle;
Moving means for moving the solder piece supply means to a solder piece supply position for supplying the solder piece to the solder piece supply passage of the nozzle; and a retreat position separated from the solder piece supply passage,
A soldering device comprising: a blowing unit that blows air toward a space on the solder piece supplying unit side of the nozzle, which is generated when the solder piece supplying unit moves from the solder piece supplying position to the retracted position side. The soldering device according to claim 1, wherein the air blowing unit blows air into the space in a direction orthogonal to a moving direction of the solder piece supplying unit by the moving unit. A head portion to which the sending means is fixed and which is moved by the relative distance changing means,
A feed means that is fixed to the head portion and that feeds out the solder piece or the thread solder before cutting to the solder piece supply means,
The head unit includes a partition plate on the nozzle side of the blowing unit so as to prevent the air blown by the air blowing unit from moving to the blowing unit side.
The solder piece supply means is arranged on the nozzle side of the partition plate,
The nozzle is supported by a support means that is supported separately from the partition plate,
The support means is
The soldering device according to claim 1 or 2, wherein the soldering device is provided outside the soldering piece supplying means located at the soldering piece supplying position and at a position where the air blown out by the air blowing means hits. Between the solder piece supply means at the solder piece supply position and the nozzle,
The soldering device according to claim 1, 2 or 3, further comprising a heat transfer preventing member that prevents heat of the nozzle from being transferred to the solder piece supply means. A nozzle having a solder piece supply passage for passing a solder piece; and a relative distance changing means for changing the relative distance between the first conductor and the nozzle in the approaching/separating direction to bring the first conductor and the nozzle into close proximity or to abut. A solder piece supply means for supplying the solder piece to the solder piece supply passage of the nozzle; and a heating means for heating and melting the solder piece in the solder piece supply passage of the nozzle, A soldering method in which a conductor and a second conductor are soldered by a soldering device for soldering with molten solder,
The solder piece supply means is moved by a moving means to a solder piece supply position for supplying the solder piece to the solder piece supply passage of the nozzle, and a retracted position separated from the solder piece supply passage,
A soldering method in which air is blown by a blower toward a space on the solder piece supply means side of the nozzle, which occurs when the solder piece supply means moves from the solder piece supply position to the retracted position side.

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