JP2020088374A - Conveyance system, conveyance method, device manufacturing apparatus, and device manufacturing method - Google Patents

Abstract

To prevent a positional deviation of a processing body at the time of movement of a conveyance robot.SOLUTION: A device manufacturing apparatus includes a conveyance system including: a conveyance robot 14 for conveying a processing body (mask M) loaded on a robot hand part 24; a control unit for controlling a conveyance motion of the conveyance robot; and detection means 30 for detecting the existence of a positional deviation of the processing body on the robot hand part on a conveyance path for the processing body. The conveyance motion includes: a first motion of moving the robot hand part to a position facing a carrying-in opening part 11a of a carrying-in destination chamber in a state in which the processing body is loaded on the robot hand part; and a second motion of straightly advancing robot hand part from the position facing the carrying-in opening part toward the carrying-in opening part to advance the robot hand part into the carrying-in destination chamber. The control unit controls the conveyance robot so as to perform the second motion when it is determined by the detection means that no positional deviation of the processing body on the robot hand part exists at the position facing the carrying-in opening part of the carrying-in destination chamber.SELECTED DRAWING: Figure 6A

Description

The present invention relates to a transfer system, a transfer method, a device manufacturing apparatus, and a device manufacturing method.

Recently, an organic EL display device as a flat panel display device has been in the spotlight. The organic EL display device is a self-luminous display, and has characteristics such as response speed, viewing angle, and thinness that are superior to liquid crystal panel displays. Existing liquid crystal panel displays for monitors, televisions, various types of mobile terminals represented by smartphones, etc. Is replaced with a fast speed. The field of application is also expanding to automobile displays.

In an organic light emitting element (organic EL element; OLED) that constitutes an organic EL display device, a functional layer including a light emitting layer that is an organic material layer that emits light is formed between two facing electrodes (cathode electrode, anode electrode). Has a basic structure. The functional layer and the electrode layer of the organic light emitting device are manufactured by, for example, depositing a deposition material on a substrate through a mask in which a pixel pattern is formed in a vacuum chamber.

In a manufacturing line of such an organic EL display device, a transfer robot in which a hand is connected to an articulated arm having a link structure is used to deposit a substrate and/or a mask into a film forming chamber, a pass chamber, a buffer chamber, a mask stock chamber, etc. The above-mentioned electrodes and various functional layers are sequentially formed on the processed surface of the substrate while being sequentially transported.

The transfer operation by the transfer robot with the processing object such as the substrate and the mask placed on the transfer robot includes the forward/backward movement for moving between the various chambers described above, the lateral movement operation, and the swiveling operation. Various movement operations can be included, and during this movement, positional displacement of a processing object such as a substrate or a mask on the robot hand may occur.

Even if such a position shift occurs, it cannot be recognized and if the transfer operation by the transfer robot is continued, for example, a robot hand on which a processing object such as a substrate or a mask is placed in a displaced state is formed. If an attempt is made to enter the film chamber, the processing objects collide with each other at the carry-in opening portion of the chamber, and the film cannot be normally carried into the film forming chamber.

The present invention is to solve such a problem, and detects the positional deviation of the processing object on the robot hand during the transportation of the processing object by the transfer robot to detect the processing object at the loading opening. An object of the present invention is to provide a transfer system, a transfer method, a device manufacturing apparatus, and a device manufacturing method capable of preventing collision.

A transfer system according to an embodiment of the present invention is a transfer system that carries out a process body from a carry-out source chamber and carries it into a carry-in destination chamber, and a carry robot that places and carries the process body on a robot hand unit. A transfer unit for controlling the transfer operation of the transfer robot; and a detection unit for detecting the presence or absence of positional displacement of the process object on the robot hand unit in the transfer path of the process object. The operation includes a first operation of moving the robot hand portion to a position facing the loading opening of the loading destination chamber with the processing object placed on the robot hand portion, and the loading of the robot hand portion. Including a second operation of linearly moving toward the carry-in opening from a position facing the opening to enter the carry-in destination chamber, wherein the controller is located at a position facing the carry-in opening of the carry-in destination chamber, The transfer robot is controlled so as to perform the second operation when the detection unit determines that there is no positional deviation of the processing object on the robot hand unit.

A transfer method according to an embodiment of the present invention is a transfer robot that places and transfers a processing object on a robot hand section, a control unit that controls a transfer operation of the transfer robot, and a transfer path of the processing object, A transfer method that uses a transfer system having a detection unit that detects the presence or absence of positional displacement of the processing object on the robot hand part, and transfers the processing object from the transfer source chamber to the transfer destination chamber. A first step of moving the robot hand part to a position facing the carry-in opening part of the carry-in destination chamber in a state where the processing object is placed on the robot hand part; and the robot hand part, the carry-in opening part. And a second step of advancing into the carry-in destination chamber by linearly moving toward the carry-in opening from a position facing the carry-in opening, wherein the second step is a position facing the carry-in opening of the carry-in destination chamber, The transfer robot is controlled so as to be performed when the detection unit determines that there is no positional displacement of the processing object on the robot hand unit.

According to the present invention, it is possible to detect the positional deviation of the processing body on the robot hand during the transportation of the processing body by the transfer robot and prevent the collision of the processing body at the carry-in opening.

FIG. 1 is a schematic view of a part of a manufacturing line of an organic EL display device. FIG. 2 is a diagram schematically showing the configuration of the film forming chamber. FIG. 3 is a schematic diagram showing the configuration of the transfer robot. FIG. 4A is a diagram illustrating a series of transfer operations of transferring a mask from the mask stock chamber to the film forming chamber by the transfer robot. FIG. 4B is a diagram illustrating a series of transfer operations in which the transfer robot takes out the mask from the mask stock chamber and transfers the mask into the film forming chamber. FIG. 4C is a diagram illustrating a series of transfer operations in which the transfer robot takes out the mask from the mask stock chamber and transfers the mask into the film forming chamber. FIG. 5A is a diagram illustrating a series of transfer operations in which the transfer robot takes out the mask from the mask stock chamber and transfers the mask into the film forming chamber. FIG. 5B is a diagram illustrating a series of transfer operations in which the transfer robot takes out the mask from the mask stock chamber and transfers the mask into the film forming chamber. FIG. 5C is a diagram illustrating a series of transfer operations in which the transfer robot takes out the mask from the mask stock chamber and transfers the mask into the film forming chamber. FIG. 6A is a diagram showing an example of installation of detection positions of the positional deviation detection means according to the embodiment of the present invention. FIG. 6B is a diagram showing an example of installation of detection positions of the positional deviation detection means according to the embodiment of the present invention. FIG. 7A is a schematic view showing an example of the position adjusting means according to the embodiment of the present invention. FIG. 7B is a schematic view showing an example of the position adjusting means according to the embodiment of the present invention. FIG. 7C is a schematic view showing an example of the position adjusting means according to the embodiment of the present invention. FIG. 8 is a diagram showing an embodiment in which the present invention is applied to the operation of transferring a mask to a dual stage type film forming chamber. FIG. 9 is a schematic diagram showing an electronic device.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples exemplify preferable configurations of the present invention, and the scope of the present invention is not limited to these configurations. In the following description, the hardware configuration and software configuration of the device, the flow of processing, the manufacturing conditions, the size, the material, the shape, etc. will limit the scope of the present invention to this unless otherwise specified. It does not mean that.

INDUSTRIAL APPLICABILITY The present invention can be applied to an apparatus that deposits various materials on the surface of a substrate to form a film while sequentially transporting the substrate to a plurality of film forming chambers, and forms a thin film (material It can be suitably applied to a device for forming a layer). Any material such as glass, resin or metal can be selected as the material of the substrate, and any material such as organic material or inorganic material (metal, metal oxide, etc.) can be selected as the vapor deposition material. it can. Specifically, the technique of the present invention can be applied to an apparatus for manufacturing an organic electronic device (for example, an organic light emitting element, a thin film solar cell), an optical member, or the like. Among them, an apparatus for manufacturing an organic light emitting element that forms an organic light emitting element by evaporating a vapor deposition material and depositing it on a substrate through a mask is a preferable application example of the present invention.

<Electronic device manufacturing line>
FIG. 1 is a plan view schematically showing a part of the configuration of an electronic device manufacturing line. The manufacturing line of FIG. 1 is used for manufacturing a display panel of an organic EL display device for a smartphone, for example. In the case of a display panel for a smartphone, for example, after the organic EL film is formed on the substrate of the sixth generation substrate full size (about 1500 mm x about 1850 mm) or the sixth generation substrate half cut size (about 1500 mm x about 925 mm). Then, the substrate is cut to manufacture a plurality of small-sized panels.

Generally, as shown in FIG. 1, a film forming cluster 1 in a manufacturing line of an organic EL display device includes a plurality of film forming chambers 11 in which a process (for example, film forming) is performed on a substrate S and a mask before and after use. A mask stock chamber 12 to be stored and a transfer chamber 13 arranged in the center thereof are provided.

In the transfer chamber 13, a transfer robot 14 is installed to transfer the substrate S between the film forming chambers 11 and transfer the mask between the film forming chamber 11 and the mask stock chamber 12. The transfer robot 14 is, for example, a robot having a structure in which a robot hand holding the substrate S or the mask is attached to an articulated arm. Details of the structure of the transfer robot 14 will be described later.

The film forming cluster 1 includes a path chamber 15 for transferring the substrate S from the upstream side to the film forming cluster 1 in the conveying direction of the substrate S, and a substrate S for which the film forming process is completed in the film forming cluster 1 on the downstream side. A buffer chamber 16 for transferring to another film forming cluster is connected. The transfer robot 14 in the transfer chamber 13 receives the substrate S from the upstream pass chamber 15 and transfers it to one of the film forming chambers 11 in the film forming cluster 1. Further, the transfer robot 14 receives the substrate S on which the film forming process is completed in the film forming cluster 1 from one of the plurality of film forming chambers 11 and transfers it to the buffer chamber 16 connected to the downstream side. A swirl chamber 17 that changes the direction of the substrate S is provided between the buffer chamber 16 and the pass chamber 15 on the further downstream side. Accordingly, the substrate direction is the same in the upstream film formation cluster and the downstream film formation cluster, which facilitates the substrate processing.

In the mask stock chamber 12, masks used in the film forming process in the film forming chamber 11 and used masks are separately stored in a plurality of cassettes. The transfer robot 14 transfers the used mask from the film forming chamber 11 to the cassette of the mask stock chamber 12, and transfers a new mask stored in another cassette of the mask stock chamber 12 to the film forming chamber 11.

Each chamber such as the film forming chamber 11, the mask stock chamber 12, the transfer chamber 13, the buffer chamber 16 and the swirl chamber 17 is maintained in a high vacuum state during the manufacturing process of the organic EL display panel.

The structure of the film forming chamber 11 and the vapor deposition process performed in the film forming chamber 11 will be described with reference to FIG. As shown in FIG. 2A, the film forming chamber 11 includes an evaporation source unit 100 that evaporates and discharges the vapor deposition material with respect to the substrate S. The evaporation source unit 100 includes an evaporation source 110 configured by a storage unit that stores an evaporation material and a heating unit that heats and evaporates the evaporation material.

The evaporation source 110 has a structure including a plurality of discharge holes or nozzles for discharging the vapor deposition material toward the vapor deposition surface of the substrate S, but is not limited to this, and is adapted to the substrate S, the pattern of the mask M, the type of vapor deposition material, and the like. It may be appropriately selected. For example, a diffusion chamber having a plurality of emission holes for discharging the vapor deposition material is connected to a point evaporation source, a linear evaporation source, or a small accommodating portion for accommodating the vapor deposition material. An evaporation source having the above structure may be used. The film forming chamber 11 can further include other components such as a film thickness monitor 114, a film thickness meter 113, a power supply 116, a substrate holder 111, and a mask holder 112, as shown in FIG. 2B. ..

The film thickness monitor 114 monitors the evaporation rate of the vapor deposition material emitted from the evaporation source 110. The film thickness meter 113 receives the input signal from the film thickness monitor 114 and measures the film thickness. The power supply 116 controls the electric power supplied to the heating device provided in the evaporation source 110. The substrate holder 111 holds the substrate S. The substrate S held by the substrate holder 111 can be moved relative to the mask M and the evaporation source by a moving mechanism (not shown). The mask holder 112 holds the mask M. The mask M held by the mask holder 112 can be moved relatively to the substrate S or the evaporation source 110 by a moving mechanism (not shown). In the illustrated film forming chamber 11, two substrates S are loaded into one chamber, and while one substrate S therein is being vapor-deposited (for example, an A-side stage), another substrate S For S (for example, the B-side stage), the so-called "dual stage" configuration film formation chamber in which the alignment between the mask M and the substrate S is performed is shown.

The vapor deposition process in the film forming chamber 11 is performed through the following processes. The substrate S to be vapor-deposited and the mask M on which the vapor-deposition pattern is formed are carried into the film forming chamber 11 by the above-mentioned transfer robot 14 and placed on the substrate holder 111 and the mask holder 112, respectively. Then, using the alignment mark formed on the mask M and the alignment mark formed on the substrate S, the mask M and the substrate S are aligned. The alignment between the mask M and the substrate S may be performed by moving the substrate holder 111 and moving the substrate S, or by moving the mask holder 112 and moving the mask M. After the alignment is completed, the shutter of the evaporation source 110 is opened, and the evaporation material is deposited on the substrate S along the pattern of the mask M while moving the rotary moving unit 115 connected to the evaporation source 110. At this time, the film thickness monitor 114 such as a crystal oscillator measures the evaporation rate, and the film thickness meter 113 converts it into a film thickness. Vapor deposition is continued until the film thickness converted by the film thickness meter 113 reaches the target film thickness. When the film thickness converted by the film thickness meter 113 reaches the target film thickness, the shutter of the evaporation source 110 is closed to end the vapor deposition.

The film forming cluster of the present invention is not limited to the film forming cluster 1 as described above, and may have other types of chambers, and the arrangement between the chambers may be different.

Hereinafter, a transfer robot 14 that transfers a processing object (substrate or mask) between various chambers (film forming chamber 11, pass chamber 15, buffer chamber 16, mask stock chamber 12) arranged around the transfer chamber 13 will be described. Details of the structure and the transport operation by the transport robot 14 will be described.

<Structure of the transfer robot 14>
FIG. 3 is a schematic diagram showing the configuration of the transfer robot 14 in the transfer chamber 13. In the following description, an XYZ coordinate system is used in which the direction parallel to the rotation axis of the connecting portion between the robot arm portion and the robot hand portion of the transfer robot 14 is the Z axis.

The transfer robot 14 includes a base part 21 installed on the bottom surface of the transfer chamber 13, a shaft part 22 extending from the base part 21 in the Z-axis direction (vertical direction in this embodiment) and movable in the Z-axis direction. The robot arm 23 is rotatably connected to the shaft 22.

The robot arm unit 23 may have a structure in which a plurality of arms are rotatably connected to each other via joints. For example, the robot arm unit 23 includes a first arm 231 whose one end is rotatably connected to the shaft unit 22, and a second arm 232 whose one end is rotatably connected to the other end of the first arm 231. You can Although FIG. 3 illustrates the structure in which the two arms are rotatably connected to each other through the joints, the present invention is not limited to this, and the two arms relatively slide in the longitudinal direction of the arms. It can also have a structure that can be displaced and expanded and contracted. Further, although the first arm 231 is described as being rotatably connected to the shaft portion 22, the present invention is not limited to this, and the first arm 231 is fixedly connected to the shaft portion 22 and instead of the shaft portion 22 itself. Can also rotate.

The robot hand unit 24 is rotatably installed at the other end (tip) of the second arm 232. The robot hand unit 24 has a structure on which a processing object such as a substrate or a mask can be placed. The robot hand unit 24 may have a plurality of fingers extending in a direction from the connection portion with the robot arm unit 23 toward the tip of the free end of the robot hand unit 24 in order to stably mount the processing object. Fluorine coating or the like may be applied to the processing object mounting surface of the fingers of the robot hand unit 24 in order to prevent damage to the processing object.

The transfer robot 14 of the present invention having such a structure has the rotation angle of the first arm 231 about the shaft portion 22, the angle between the first arm 231 and the second arm 232, the second arm 232 and the robot. By adjusting the angle with the hand unit 24 and the height of the shaft unit 22, the linear movement, the rotational movement, and the combined movement of the processing object such as the substrate or the mask placed on the robot hand section 24. The processing body such as the substrate or the mask can be moved to any desired position on the XYZ coordinate system.

The control unit 25 controls the operation of the transfer robot 14. The control unit 25 can be realized by a computer having a processor, memory, storage, I/O, and the like. For example, the control unit 25 is configured to control the transfer robot 14 by executing a memory unit 251 storing a program for controlling the transfer operation of the transfer robot 14 and a program stored in the memory unit 251. Included processor 252. As the computer, a general-purpose personal computer may be used, or a built-in computer or PLC (programmable logic controller) may be used. Alternatively, some or all of the functions of the control unit 25 may be configured by a circuit such as ASIC or FPGA. In the present embodiment, the configuration in which the control unit 25 is provided separately from the transfer robot 14 will be described, but the present invention is not limited to this, and the transfer robot 14 may include the control unit 25.

<Details of transport operation>
Hereinafter, the details of the transfer operation by the transfer robot 14 will be described by taking the transfer of the mask M as an example.

4A to 4C and 5A to 5C show a series of processes in which the mask M before use is carried out from the mask stock chamber 12 by the transfer robot 14 and carried into the film forming chamber 11. In the present embodiment, one substrate S and one mask M are carried into the film forming chamber 11 and vapor deposition is performed, but the present invention is not limited to this and, for example, as described above. The two substrates S and the two masks M are respectively loaded into the film forming chamber, and while one substrate S is being vapor-deposited, the other substrates S and the mask M are It is needless to say that the present invention can be applied to the transfer of the processed body (substrate S or mask M) to the so-called "dual stage" type film forming chamber in which alignment is performed.

First, the transfer robot 14 is located at the first standby position before entering the mask stock chamber 12 for the robot hand unit 24 to carry out the mask M before use (FIG. 4A). At the first standby position, the robot arm unit 23 of the transfer robot 14 is contracted (the joints of the robot arm unit 23 are folded so that the angle between the first arm 231 and the second arm 232 is small), and the robot is The tip (free tip) of the free end of the hand portion 24 is in a state of pointing toward the opening 12 a of the mask stock chamber 12. More specifically, in the first standby position in the present embodiment, the tip of the free end of the robot hand unit 24 is closest to the rotation axis (shaft unit 22) of the transfer robot 14 located in the center of the transfer chamber 13. This is the position where the robot arm 23 is contracted.

Subsequently, the robot arm unit 23 is extended from the first standby position (that is, the joint of the robot arm unit 23 is widened so that the angle between the first arm 231 and the second arm 232 is increased). After the robot hand unit 24 is advanced to the mask carry-out position in the mask stock chamber 12 through the opening 12a, the mask M is received by the robot hand unit 24 (FIG. 4B).

Subsequently, the robot hand unit 24 having received the mask M retracts (retracts) to the outside of the mask stock chamber 12 through the opening 12a by the contraction operation of the robot arm unit 23, and returns to the first standby position (FIG. 4C). ..

Then, the robot arm 23 is swung around the rotation axis (shaft 22) of the transfer robot 14 while maintaining the contracted state, and the free end of the robot hand 24 on which the mask M is placed is the deposition chamber. 11 is moved to the second standby position that is directed to the carry-in opening 11a (FIG. 5A).

Then, the robot arm unit 23 is extended again to move the robot hand unit 24 on which the mask M is placed into the mask carrying-in position in the film forming chamber 11 through the carry-in opening 11a in a straight-forward operation (FIG. 5B). .. Then, after passing the mask M to the mask holder 112 in the film forming chamber 11, the robot hand unit 24 retracts to the outside of the film forming chamber 11 through the carry-in opening 11a by the contraction operation of the robot arm unit 23, and the second Return to the standby position (Fig. 5C). The above series of operations of the transfer robot 14 are performed under the control of the control unit 25 described above.

The mask M may be displaced on the robot hand unit 24 in the above-described series of transportation processes. As described above, after the mask M is placed on the robot hand unit 24 in the mask stock chamber 12, the mask M is carried out of the mask stock chamber 12 and carried into the film forming chamber 11 which is a carry-in destination. The process is roughly divided into an operation in which the robot hand portion 24 retracts to the first standby position, an operation in which the robot hand portion 24 swings from the first standby position to the second standby position, and a straight movement from the second standby position into the film forming chamber 11. It is divided into a motion to enter by entering. Here, the operation of going straight into the film forming chamber 11 which is the loading destination is referred to as “second operation”, and is a series of operations other than the second operation performed before the second operation (contraction of the robot arm unit 23). The retreating operation to the standby position in the transfer chamber 13 and the swiveling operation to the position facing the carry-in opening 11a of the film forming chamber 11) will be referred to as “first operation”.

The misalignment of the mask M on the robot hand unit 24 occurs during the first operation, particularly the operation of turning to a position facing the carry-in opening 11a of the film forming chamber 11, among the above-described transfer operations. Probability is high. That is, the mask M on the robot hand unit 24 may be displaced due to the centrifugal force generated when the turning operation is performed. In particular, as the size of the organic EL display device becomes larger, the substrate S and the mask M also become larger and heavier, and the possibility of positional deviation occurring during such a turning operation is further increasing.

Without being able to recognize the positional deviation of the mask M on the robot hand unit 24, the above-mentioned second operation (the robot arm unit 23 is extended to advance the robot hand unit 24 straight into the film forming chamber 11). When the operation shifts to (Operation), the shifted mask M collides with the outer wall of the carry-in opening 11a of the film forming chamber 11, and the mask M cannot be carried into the film forming chamber 11 normally.

Here, in the present invention, the position of the mask M on the robot hand unit 24 is moved before the robot hand unit 24 on which the mask M is placed is moved straight to the carry-in opening 11a of the film forming chamber 11 (second operation). A detection means (positional deviation detection means) 30 for confirming the presence or absence of deviation is installed in the transfer chamber 13. The detection unit 30 detects whether or not there is a positional deviation of the mask M on the robot hand unit 24 in the transport path of the mask M.

<Position detection means>
FIG. 6 is a schematic diagram showing an example of installation of the detection position of the detection means 30 according to the embodiment of the present invention. FIG. 6A shows the above-described second operation (the operation of extending the robot arm portion 23 and causing the robot hand portion 24 to go straight into the film forming chamber 11) after carrying out the mask M from the mask stock chamber 12. It is a top view which shows the state just before performing. FIG. 6B is a front view of the state of FIG. 6A viewed from the carry-in opening 11a side of the film forming chamber 11. The detection position of the detection means 30 is a position where presence/absence of displacement of the mask M on the robot hand unit 24 is detected.

As shown in FIG. 6A, in one embodiment of the present invention, the detection position of the detection unit 30 faces the carry-in opening 11a of the film forming chamber 11 when the transfer chamber 13 is viewed in the vertical direction (Z direction). The robot arm 23 is installed at two positions close to the carry-in opening 11a side within the range of the radius of gyration (R) in which the robot arm 23 swings while the transfer robot 14 mounts the mask M. Specifically, the detection position of the detection unit 30 is a mask (W2) slightly wider than the width (W1) of the mask M placed on the robot hand unit 24 (width when viewed from the loading/unloading direction). It is provided so as to face each other at two positions on both sides of M. In addition, the detection position of the detection unit 30 is a position facing the carry-in opening 11a of the film forming chamber 11 when the transfer chamber 13 is viewed in the vertical direction, and the robot hand when the robot arm unit 23 pivots. It may be installed at two locations close to the carry-in opening 11a side within the range of the radius of gyration of the tip of the mask M placed on the section 24.

In other words, the tip of the mask M directed to the carry-in opening 11a of the film forming chamber 11 when the above-described second operation (the operation of moving straight into the film forming chamber 11 of the carry-in destination) is started. Detection positions of the detection means 30 are provided at positions on both sides of the section. By providing the detection position of the detection unit 30 at this position, the mask M placed on the robot hand unit 24 is placed at the time when the second operation of moving straight toward the deposition chamber 11 which is the loading destination is withheld. It is possible to confirm the placement state (presence/absence of displacement). That is, the second operation is started to determine whether or not the mask M is displaced on the robot hand unit 24 during the first operation (including the turning operation) performed before the second operation that is the straight movement. The final confirmation is performed by the detection means 30 provided at the positions corresponding to both sides of the tip of the mask M when the mask M is moved. The positions corresponding to both sides of the tip of the mask M may be predetermined positions vertically above or below the mask M on both sides of the tip of the mask M, or on both sides of the tip of the mask M. It may be a predetermined position vertically above and below the mask M.

When viewed in the vertical direction (Z direction), the interval (W2) between the respective detection positions of the two detection means 30 is appropriate within a range larger than the width (W1) of the mask M, which is the displacement detection target. Can be selected. It is also possible to widen the interval (W2) between the detection positions of the detection means 30 according to the range in which the positional deviation is allowed. However, if the detection positions of the detection means 30 are provided at intervals wider than the width (W3) of the carry-in opening 11a of the film forming chamber 11, even if a large positional displacement occurs such that the detection means 30 collides with the outer wall of the carry-in opening 11a. Nevertheless, there may be a problem that such a large displacement cannot be detected. Therefore, the interval (W2) between the detection positions of the detection means 30 is made narrower than the width (W3) of the carry-in opening 11a of the film forming chamber 11. That is, for effective deviation detection, the interval (W2) between the detection positions of the detection means 30 provided at the positions on both sides of the tip of the mask M when the second operation is started is determined by the robot hand unit. The width is set to be larger than the width (W1) of the processing object (mask M) placed on 24 and smaller than the width (W3) of the loading opening 11a of the loading destination (film forming chamber 11). Further, when there is a predetermined width narrower than the width (W3) of the carry-in opening 11a of the film forming chamber 11 on the transport path of the processing body, the interval (W2) between the detection positions of the detection means 30 is set to be smaller than the predetermined width. Is also preferably narrow.

As a specific configuration example of the detecting unit 30, in the present embodiment, as shown in FIG. 6B, a laser sensor including a laser light source unit 31 and a laser light receiving unit 32 is used. For example, the detection unit 30 may include a laser light source unit 31 and a laser light receiving unit 32. The laser light source unit 31 is provided outside the vertical upper surface of the vacuum container 13a forming the transfer chamber 13 at two positions corresponding to both sides of the front end of the mask M when the second operation is started. They are arranged with the aforementioned interval (W2). The laser light receiving unit 32 faces the laser light source units 31 and is arranged outside the vertical lower surface of the vacuum container 13a with the same interval (W2). If the detection positions of the detection means 30 are provided on both sides of the tip portion of the mask M when the second operation is started, the laser light source unit 31 and the laser light receiving unit 32 are arranged at the above-described positions. It is not limited to the example. For example, the space between the two laser light source units 31 may be narrower than the space (W2) described above, and the space between the two laser light receiving units 32 may be wider than the space (W2) described above. In this case, the lasers emitted from the two laser light source units 31 are inclined toward the outside of the mask M, and the light receiving surfaces of the two laser light receiving units 32 are inclined toward the inside of the mask M (two The light receiving surface of the laser light receiving portion 32 faces the inside of the mask M). Further, for example, the interval between the two laser light source units 31 may be wider than the above interval (W2), and the interval between the two laser light receiving units 32 may be smaller than the above interval (W2). In this case, the lasers emitted from the two laser light source units 31 are inclined toward the inside of the mask M, and the light receiving surfaces of the two laser light receiving units 32 are inclined toward the outside of the mask M (two The light receiving surface of the laser light receiving portion 32 faces the outside of the mask M).

In the present embodiment, laser light is emitted from the laser light source unit 31 through a window installed on the upper surface of the vacuum container 13a in the vertical direction, and the irradiated laser light is installed on the lower surface of the vacuum container 13a in the vertical direction. The laser light receiving unit 32 receives the light through the window to check whether the path of the laser light is blocked by the mask M, and thereby detects whether the mask M is displaced.

The arrangement of the laser light source unit 31 and the laser light receiving unit 32 is not limited to this, that is, the opposite arrangement, that is, the laser light source unit 31 is provided on the outer side of the vertical lower surface of the vacuum container 13a and the outer side of the vertical upper surface of the vacuum container 13a. You may install the laser light receiving part 32 in each. Further, when the laser light receiving unit 32 is installed on the same side as the laser light source unit 31 (for example, both are located outside the vertical upper surface of the vacuum container 13a) and the mask M is located in the optical path, reflection from the mask M is reflected. The configuration may be such that the displacement of the mask M is confirmed by detecting the presence or absence of light.

As described above, in the present invention, in order to prevent the problem that the mask M, which has been misaligned during the carrying operation, collides with the carry-in opening 11a of the film forming chamber 11, the robot hand part 24 on which the mask M is placed is prevented. At the starting position of the second operation for finally moving the film M to the film forming chamber 11 which is the loading destination, the detection unit 30 finally confirms whether or not the mask M is displaced on the robot hand unit 24. There is.

When the positional deviation is detected by the detection unit 30, the control unit 25 controls the transfer robot 14 so as to suspend the second operation of moving the robot hand unit 24 straight into the film forming chamber 11.

At the same time, the control unit 25 detects the displacement and detects that the second operation is suspended by a visual notification means such as a lamp and/or an audible notification means such as an alarm. It may be controlled so as to notify the worker. The notification to the worker may include a warning to the worker.

Further, when the position adjusting means is provided in a predetermined area in the transfer chamber 13 and the positional deviation of the mask M on the robot hand unit 24 is detected, it is the linear movement into the film forming chamber 11 as described above. It is also possible to temporarily suspend the two operations and move the robot hand unit 24 toward the position adjusting means to adjust the position of the mask M on the robot hand unit 24.

7A to 7C are schematic views showing an example of such position adjusting means. FIG. 7A is a top view for explaining the arrangement region of the position adjusting means, and FIGS. 7B and 7C are front views for explaining the operation of the position adjusting means.

The position adjusting means 40 includes a pair of mask contact portions 41a and 41b for adjusting the position of the mask M by contacting the end faces of the opposite sides of the mask M from both sides with the mask M interposed therebetween. The pair of mask contact portions 41a and 41b can be moved by respective drive portions 42a and 42b provided outside the vertical upper surface of the vacuum container 13a forming the transfer chamber 13. Specifically, the mask contact portions 41a and 41b move vertically (in the Z direction) in the vertical direction perpendicular to the placement surface of the mask M, and the mask contact portions 41a and 41b face each other across the mask M. So as to be movable back and forth (movement in the Y direction) and in a direction perpendicular to the above two directions along the opposite side of the mask M (movement in the X direction). The drive is controlled by 42b.

In a normal state, the mask contact portions 41a and 41b are in a state of being raised near the vertically upper portion of the vacuum container 13a of the transfer chamber 13 as shown in FIG. 7C. When the position shift of the mask M on the robot hand unit 24 is detected by the detection unit 30 and the robot hand unit 24 on which the mask M is placed moves to the position adjustment unit 40 side, the position adjustment unit 40 contacts the mask. The portions 41a and 41b are driven by the respective driving portions 42a and 42b, and move down in the Z direction to positions where the mask M is sandwiched. In this state, as shown by the arrow in FIG. 7B, the mask contact portions 41a and 41b are moved back and forth in the direction toward the opposite side of the mask M (Y direction) by the control of the drive portions 42a and 42b. , The position shift of the mask on the robot hand unit 24 is corrected through the contact with the end face of the mask M while repeatedly moving in the direction along the side of the mask M (X direction). When the correction of the positional deviation of the mask M is completed, the mask contact portions 41a and 41b again rise to the vicinity of the vertically upper part of the vacuum container 13a of the transfer chamber 13 and move to the retracted position (FIG. 7C).

In this way, when the correction of the positional deviation of the mask M on the robot hand unit 24 is completed, the robot hand unit 24 returns to the position facing the carry-in opening 11a of the film forming chamber 11 into which the mask M is carried in. If it is determined that there is no positional deviation of the mask M by performing the above-described positional deviation detection operation once again, the second operation, which is the linear movement operation to the film forming chamber 11 that has been held, is performed and The mask M is carried in.

Although one embodiment of the present invention has been described above, the present invention is not limited to the configuration of this example. For example, in the above-described embodiment, the example in which the laser sensor is used as the detection unit 30 has been described, but the positional deviation detection unit is a photoelectric sensor or another optical unit such as a camera (including a photoelectric conversion element). May be. For example, the presence or absence of the positional deviation may be detected by performing image analysis on whether the edge of the mask M caused by the positional deviation is detected in the image captured by the camera. The photoelectric conversion element may be a CCD sensor or a CMOS sensor.

Further, in the above-described embodiment, the rotation range in which the robot arm unit 23 of the transfer robot 14 turns at the minimum rotation radius (R), that is, the free end of the robot hand unit 24 on which the mask M is placed is the transfer robot 14. An example (see FIG. 6A) in which the detection position of the detection means 30 is set in the rotation radius range when the robot arm unit 23 rotates in the state of being closest to the rotation axis (shaft portion 22) of FIG. The present invention is not limited to this, and the robot arm section 23 of the transfer robot 14 is configured to rotate at a distance from the rotation axis of the transfer robot 14 at the free end of the robot hand section 24, and detection is performed within the rotation radius range. You may install the detection position of the means 30. However, when a processing object such as the mask M is placed on the transfer robot 14, the smaller the radius of rotation of the robot arm 23 is, the smaller the centrifugal force acting during the turning operation is. Since the possibility that the processing object will be displaced is reduced, the rotation radius of the robot arm 23 of the transfer robot 14 and the detection position of the detection means 30 should be set within the minimum rotation radius range as in the above-described embodiment. Is more preferable.

Further, the number of detection positions of the detection means 30 is also two positions close to the carry-in opening 11a side of the film forming chamber 11 as in the above-described embodiment (the second operation which is a straight movement to the film forming chamber). Not only at the positions on both sides of the front end of the mask M when the start is started, but also at the position at the rear end (the end near the rotation axis of the transfer robot 14) opposite to the front end of the mask M. Alternatively, two or more locations may be provided, and the detection positions of the detection means 30 may be provided at a total of three or more locations. In this case, the detection means 30 is further arranged at a position corresponding to the rear end of the mask M when the second operation is started. As described above, when the detection position of the detection unit 30 is additionally provided at the position of the rear end of the mask M, the presence or absence of the position shift of the mask M on the robot hand unit 24 should be detected more reliably. Therefore, it is possible to further reduce the possibility of collision at the carry-in opening 11a during the carry-in operation to the film forming chamber 11. The position corresponding to the rear end of the mask M may be a predetermined position vertically above or below the mask M at the rear end of the mask M, or at a rear end of the mask M from the mask M. May be a predetermined position above the vertical direction and a predetermined position below the vertical direction.

Further, in the embodiment described above, mainly the operation of unloading the mask M from the mask stock chamber 12 and loading it into the film forming chamber 11 has been mainly described. However, when the substrate S is transported as a processing object, that is, a pass The present invention is also applicable to an operation of carrying out the substrate S from the chamber 15 to the film forming chamber 11 or a carrying operation such as carrying out the substrate S after the film forming process from the film forming chamber 11 to the buffer chamber 16. Applicable.

Further, as shown in FIG. 8, when there are two openings for carrying in the processing body (for example, a “dual stage” type in which two substrates S and two masks M are carried into one film forming chamber 11). Needless to say, the present invention can be applied to the conveyance of the processing body (the substrate S or the mask M) in the case (1). In this case, the transfer operation of the mask M from the mask stock chamber 12 to the film formation chamber 11 is performed by the operation of the robot hand unit 24 of the transfer robot 14 that receives the mask M from the mask stock chamber 12 retracting to the transfer chamber 13, The operation of the robot hand portion 24 on which the M is placed is swung to the central portion of the front surface of the film forming chamber 11, and one of the two carry-in openings 11a and 11b from the central portion of the front surface of the film forming chamber 11 The operation described above includes an operation of moving in parallel to a position facing one (for example, the loading opening 11a) and an operation of moving straight toward the loading opening 11a and finally loading the mask M into the film forming chamber 11. Similar to the form, the operation of moving straight toward the carry-in opening 11a at the end is referred to as a second operation, and the displacement of the mask M on the robot hand unit 24 is detected at the position immediately before the second operation is started.・You can check.

<Electronic device manufacturing method>
Next, an example of a method for manufacturing an electronic device using the film forming apparatus of this embodiment will be described. Hereinafter, a configuration and a manufacturing method of an organic EL display device will be illustrated as an example of an electronic device. First, the organic EL display device to be manufactured will be described. FIG. 9A shows an overall view of the organic EL display device 60, and FIG. 9B shows a sectional structure of one pixel.

As shown in FIG. 9A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. It should be noted that the pixel here refers to a minimum unit that enables display of a desired color in the display area 61. In the case of the organic EL display device 60 according to the present embodiment, the pixel 62 is configured by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B that emit different lights. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element. It is not limited.

FIG. 9B is a schematic partial sectional view taken along the line AB of FIG. 9A. The pixel 62 has an organic EL device including an anode 64, a hole transport layer 65, any one of the light emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a cathode 68 on a substrate 63. There is. Among these, the hole transport layer 65, the light emitting layers 66R, 66G, 66B, and the electron transport layer 67 correspond to organic layers. In the present embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light-emitting elements that emit red, green, and blue (sometimes described as organic EL elements). Further, the anode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the cathode 68 may be formed commonly to the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. An insulating layer 69 is provided between the anodes 64 to prevent the anodes 64 and the cathodes 68 from being short-circuited by foreign matter. Furthermore, since the organic EL layer is deteriorated by water and oxygen, a protective layer 70 is provided to protect the organic EL element from water and oxygen.

In FIG. 9B, the hole transport layer 65 and the electron transport layer 67 are shown as a single layer, but depending on the structure of the organic EL display element, they may be formed as a plurality of layers including a hole block layer and an electron block layer. May be done. Further, between the anode 64 and the hole transport layer 65, a hole injection layer having an energy band structure capable of smoothly injecting holes from the anode 64 to the hole transport layer 65 is provided. It can also be formed. Similarly, an electron injection layer can be formed between the cathode 68 and the electron transport layer 67.

Next, an example of the method for manufacturing the organic EL display device will be specifically described. First, a substrate 63 on which a circuit (not shown) for driving the organic EL display device and the anode 64 are formed is prepared.

An acrylic resin is spin-coated on the substrate 63 on which the anode 64 is formed, and the acrylic resin is patterned by a lithographic method so that an opening is formed in a portion where the anode 64 is formed to form an insulating layer 69. Form. This opening corresponds to a light emitting region where the light emitting element actually emits light.

The substrate 63 on which the insulating layer 69 is patterned is loaded into the first organic material film forming apparatus, the substrate 63 is held by the substrate holding unit and the electrostatic chuck, and the hole transport layer 65 is attached to the anode 64 in the display area. It is formed as a common layer on the above. The hole transport layer 65 is formed by vacuum vapor deposition. Since the hole transport layer 65 is actually formed to have a size larger than that of the display region 61, a high-definition mask is unnecessary.

Next, the substrate 63 on which the hole transport layer 65 has been formed is carried into the second organic material film forming apparatus and held by the substrate holding unit and the electrostatic chuck. The substrate 63 and the mask M are aligned, the substrate 63 is placed on the mask M, and a light emitting layer 66R emitting red light is formed on a portion of the substrate 63 where an element emitting red light is arranged.

Similar to the film formation of the light emitting layer 66R, the light emitting layer 66G emitting green is formed by the third organic material film forming apparatus, and the light emitting layer 66B emitting blue is formed by the fourth organic material film forming apparatus. .. After the film formation of the light emitting layers 66R, 66G, 66B is completed, the electron transport layer 67 is formed over the entire display region 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a layer common to the three color light emitting layers 66R, 66G, and 66B.

The substrate 63 on which the electron transport layer 67 has been formed is moved by a metal vapor deposition material film forming apparatus to form the cathode 68. After that, the organic EL display device 60 is completed by moving to a plasma CVD device to form a protective layer 70.

If the substrate 63 on which the insulating layer 69 is patterned is carried into the film forming apparatus until the film formation of the protective layer 70 is completed, if the substrate 63 is exposed to an atmosphere containing water and oxygen, the light emitting layer made of an organic EL material will be formed. It may be deteriorated by water or oxygen. Therefore, in this embodiment, the loading and unloading of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere. The above embodiment is an example of the present invention, and the present invention is not limited to the configuration of the above embodiment, and may be appropriately modified within the scope of the technical idea thereof.

1: Deposition cluster 11: Deposition chambers 11a and 11b: Deposition chamber opening 12: Mask stock chamber 13: Transfer chamber 14: Transfer robot 23: Robot arm unit 24: Robot hand unit 25: Control unit 30: Position Deviation detection means 31: laser light source section 32: laser light receiving section 40: position adjusting means 41a, 41b: mask contact section

Claims (32)

A transport system for unloading a treatment object from an unloading source chamber and loading it into a loading destination chamber,
A transfer robot that places and transfers the processing body on the robot hand unit,
A control unit for controlling the transfer operation of the transfer robot;
In the transport path of the processing body, it has a detection means for detecting the presence or absence of positional displacement of the processing body on the robot hand unit,
The carrying operation includes a first operation of moving the robot hand portion to a position facing the carry-in opening portion of the carry-in destination chamber with the processing object placed on the robot hand portion, and the robot hand portion. A second operation of linearly moving from a position facing the carry-in opening toward the carry-in opening and entering the carry-in destination chamber;
The control unit performs the second operation when the detection unit determines that there is no displacement of the processing object on the robot hand unit at a position facing the loading opening of the loading destination chamber. And a transfer system for controlling the transfer robot. The transfer system according to claim 1, wherein the transfer robot includes a robot arm unit connected to a rotation shaft, and the robot hand unit connected to a tip of the robot arm unit. The first operation is an operation of retracting the robot hand part on which the processing object is placed on the robot hand part from the carry-out source chamber, and a carry-in opening part of the carry-in destination chamber of the retracted robot hand part. Including an operation of moving to a position facing
The transport system according to claim 2, wherein the operation of moving the robot to a position facing the carry-in opening of the carry-in destination chamber includes a turning operation of rotating the robot arm unit around at least the rotation axis. .. The transfer system according to claim 3, wherein the detection position of the detection unit is provided at a position facing the carry-in opening of the carry-in destination chamber. The detection position of the detection means is a position facing the carry-in opening portion of the carry-in destination chamber, and is on the carry-in opening portion side of the carry-in destination chamber within a range of a radius of gyration in which the robot arm unit swivels. The transport system according to claim 3 or 4, wherein the transport system is provided at positions close to each other. The radius of gyration in which the robot arm unit swivels is the radius of gyration when the tip of the free end of the robot hand unit on which the processing body is placed rotates closest to the rotation axis of the transfer robot. The transport system according to claim 5, wherein the transport system is a transport system. The detection positions of the detection means are provided at positions on both sides of the tip of the processing body when the second operation is started,
7. The transfer system according to claim 1, wherein the front end portion of the processing body is directed to a carry-in opening portion of the carry-in destination chamber. 8. The transfer system according to claim 7, wherein the interval between the detection positions of the detection means is smaller than the width of the carry-in opening of the carry-in destination chamber and larger than the width of the processing body. The detection position of the detection means is further provided at one or more positions at a position of a rear end portion on the opposite side of the front end portion of the processing body when the second operation is started. The transportation system according to 7 or 8. The transport system according to claim 1, wherein the detection unit is a laser sensor. The transport system according to claim 1, wherein the detection unit is a camera. When the control unit determines that there is a positional displacement of the processing body on the robot hand unit as a result of detection by the detection unit at a position facing the carry-in opening of the carry-in destination chamber, The transport system according to claim 1, wherein the two operations are suspended, and control is performed such that notification is performed through a notification unit. When the control unit determines that there is a positional deviation of the processing object on the robot hand unit as a result of the detection by the detection unit at a position facing the carry-in opening of the carry-in destination chamber, 2 operations are suspended, and the robot hand unit is controlled to move to the position adjusting means,
The transfer system according to any one of claims 1 to 11, wherein the position adjusting unit corrects a position shift of the processing body on the robot hand unit. The transport system according to any one of claims 1 to 13, wherein the processing body is a mask. The transport system according to claim 1, wherein the processing body is a substrate. Multiple chambers,
A device manufacturing apparatus, comprising: the transfer system according to any one of claims 1 to 15 as a transfer system for transferring a processing body between the plurality of chambers. A transfer robot that places and transfers the processing object on the robot hand section, a control section that controls the transfer operation of the transfer robot, and a transfer path of the processing object, in which the processing object of the processing object on the robot hand section is transferred. A transfer method that uses a transfer system having a detection unit that detects the presence or absence of positional deviation, and transfers the processing body from the transfer source chamber to the transfer destination chamber.
A first step of moving the robot hand part to a position facing the carry-in opening of the carry-in destination chamber in a state where the processing object is placed on the robot hand part;
A second step of moving the robot hand portion straight from a position facing the loading opening toward the loading opening to enter the loading destination chamber;
The second step is performed when the detection unit determines that there is no displacement of the processing object on the robot hand unit at a position facing the loading opening of the loading destination chamber, A transportation method comprising controlling the transportation robot. 18. The transfer method according to claim 17, wherein the transfer robot includes a robot arm unit connected to a rotation shaft, and the robot hand unit connected to a tip of the robot arm unit. In the first step, an operation of retracting the robot hand part on which the processing body is placed on the robot hand part from the carry-out source chamber and a carry-in opening part of the carry-in destination chamber of the retracted robot hand part Including an operation of moving to a position facing
19. The transfer method according to claim 18, wherein the operation of moving to a position facing the carry-in opening of the carry-in destination chamber includes at least a rotating operation of rotating the robot arm unit about the rotation axis. .. 20. The transfer method according to claim 19, wherein the detection position of the detection unit is provided at a position facing the carry-in opening of the carry-in destination chamber. The detection position of the detection means is a position facing the carry-in opening portion of the carry-in destination chamber, and is on the carry-in opening portion side of the carry-in destination chamber within a range of a radius of gyration in which the robot arm unit swivels. The transport method according to claim 19 or 20, wherein the transport method is provided at positions close to each other. The radius of gyration in which the robot arm unit swivels is the radius of gyration when the tip of the free end of the robot hand unit on which the processing body is placed rotates closest to the rotation axis of the transfer robot. The transport method according to claim 21, wherein the transport method is characterized in that: The detection positions of the detection means are provided at positions on both sides of the tip of the processing body when the second step is started,
The transport method according to any one of claims 17 to 22, wherein the leading end portion of the processing body is directed toward a carry-in opening portion of the carry-in destination chamber. 24. The transfer method according to claim 23, wherein the interval between the detection positions of the detection means is smaller than the width of the carry-in opening of the carry-in destination chamber and larger than the width of the processing body. The detection position of the detection means is further provided at one or more positions at a rear end portion opposite to the front end portion of the processing body when the second step is started. 23. The transportation method according to 23 or 24. 26. The transport method according to claim 17, wherein the detection unit is a laser sensor. 26. The transport method according to claim 17, wherein the detection unit is a camera. At the position facing the carry-in opening of the carry-in destination chamber, when it is determined as a result of the detection by the detection means that the processing body is displaced on the robot hand unit, the second step is suspended. The conveying method according to any one of claims 17 to 27, wherein the notification is performed through a notification unit. At the position facing the carry-in opening of the carry-in destination chamber, as a result of the detection by the detecting means, when it is determined that there is a positional displacement of the processing body in the robot hand unit, the second step is suspended, 28. The position deviation of the processing object on the robot hand unit is corrected by the position adjustment unit after the robot hand unit is moved to the position adjustment unit. The transportation method described in. 30. The transport method according to claim 17, wherein the processing body is a mask. 30. The transport method according to claim 17, wherein the processing body is a substrate. A device manufacturing method, wherein the device is manufactured while the processing body is transferred between a plurality of chambers by using the transfer method according to any one of claims 17 to 31.

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