JP2020088245A - Wiring board, electronic device, and electronic module - Google Patents

Abstract

To provide a wiring board, an electronic device, and an electronic module that can be operated for a long period.SOLUTION: A wiring board 1 comprises: an insulating substrate 11 that has a square shape in plan view, opens on principal faces and lateral faces, and has notch parts 12 that are long in a side direction; inner face electrodes 13 that are located on inner faces of the notch parts 12; and a via conductor group 14G that includes a plurality of via conductors 14 both end parts of each of which are located in a thickness direction of the insulating substrate 11, and is located in the insulating substrate 11. In a side direction of the insulating substrate 13, the width W2 of the via conductor group 14G is larger than the width W1 of the notch parts 12.SELECTED DRAWING: Figure 1

Description

The present invention relates to a wiring board, an electronic device and an electronic module.

Conventionally, a wiring board is known in which an electronic component is mounted on the main surface of an insulating substrate made of ceramics.

Such a wiring board is an insulating substrate having a notch portion that is open in the main surface and the side surface and that is long in the side direction, an inner surface electrode that is located on the inner surface of the notch portion, and an insulating substrate that is connected to the inner surface electrode. And a wiring conductor provided on the inside (see, for example, Patent Document 1).

JP 2013-232610

In recent years, miniaturization and high functionality of electronic devices have been demanded. When the electronic component is operated for a long time, the heat of the electronic component is transferred to the notch, and the stress due to the heat may cause a poor connection at the connection between the wiring conductor and the inner surface electrode.

The wiring substrate of the present disclosure has a rectangular shape in a plan view, an insulating substrate that has a notch portion that is open in the main surface and side surfaces and that is long in the side direction, and an inner surface electrode that is located on the inner surface of the notch portion. , Each end portion includes a plurality of via conductors located in the thickness direction of the insulating substrate, and has a via conductor group located in the insulating substrate, in the side direction of the insulating substrate, the via conductor group Is larger than the width of the cutout portion.

The electronic device of the present disclosure includes the wiring board having the above configuration and electronic components mounted on the wiring board.

The electronic module of the present disclosure includes a module substrate having a connection pad, and the electronic device having the above-described configuration connected to the connection pad via solder.

The wiring board of the present disclosure has a rectangular shape in a plan view, an insulating substrate having a notch portion that is open in the main surface and the side surface and is long in the side direction, and an inner surface electrode that is located on the inner surface of the notch portion, Each end part includes a plurality of via conductors positioned in the thickness direction of the insulating substrate, and has a via conductor group positioned in the insulating substrate, and the width of the via conductor group is notched in the side direction of the insulating substrate. It is larger than the width of the part. With the above configuration, the heat of the electronic component spreads to the outside of the wiring board more than the width of the cutout portion in plan view, so that the heat of the electronic component is less likely to be transmitted to the cutout portion, and the heat to the cutout portion is reduced. By reducing the stress due to, it is possible to suppress disconnection at the connection between the inner surface electrode and the wiring conductor at the corner of the notch.

Since the electronic device of the present disclosure has the wiring board having the above-described configuration and the electronic components mounted on the wiring board, the electronic apparatus can be a small-sized electronic device with high functionality and excellent long-term reliability.

An electronic module according to an embodiment of the present disclosure includes a module substrate having a connection pad, a device having the above-configured electronic device connected to the connection pad via solder, and a module substrate to which the electronic device is connected. Thus, the long-term reliability can be improved.

(A) is a top view showing the electronic device according to the first embodiment, and (b) is a bottom view of (a). 1A is a top view showing a wiring board in the electronic device shown in FIG. 1, and FIG. 1B is an internal top view of the wiring board. 1A is a vertical sectional view taken along line AA of the wiring board shown in FIG. 1A, and FIG. 1B is a vertical sectional view taken along line BB of the wiring board shown in FIG. 1A. It is a figure. (A) is a top view showing an electronic device according to a second embodiment, and (b) is a bottom view of (a). 4A is a top view showing a wiring board in the electronic device shown in FIG. 4, and FIG. 6B is an inner top view of the wiring board. 4A is a vertical sectional view taken along line AA of the wiring board shown in FIG. 4A, and FIG. 4B is a vertical sectional view taken along line BB of the wiring board shown in FIG. 4A. It is a figure. (A) is a top view which shows the electronic device in 3rd Embodiment, (b) is a bottom view of (a). FIG. 8A is a top view showing a wiring board in the electronic device shown in FIG. 7, and FIG. 8B is an internal top view of the wiring board. 7A is a vertical sectional view taken along line AA of the wiring board shown in FIG. 7A, and FIG. 7B is a vertical sectional view taken along line BB of the wiring board shown in FIG. 7A. It is a figure.

Several exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings.

(First embodiment)
The wiring board 1 in the first embodiment is located on the insulating substrate 11, the cutout portion 12 formed in the insulating substrate 11, and the inner surface of the cutout portion, as in the example shown in FIGS. 1 to 3. It includes an inner surface electrode 13, a plurality of via conductors 14 positioned in the thickness direction of the insulating substrate, and wiring conductors 15 positioned on the surface and inside of the insulating substrate 11. The electronic device includes a wiring board 1 and an electronic component 2 mounted on the wiring board 1. The electronic device is connected to a connection pad on a module substrate that constitutes an electronic module, for example, using a bonding material.

The wiring board 1 in the present embodiment has a rectangular shape in a plan view, and is located on the inner surface of the notch 12 and the insulating board 11 that has a notch 12 that is open in the main surface and side surfaces and that is long in the side direction. The inner surface electrode 13 and a plurality of via conductors 14 each having both ends located in the thickness direction of the insulating substrate 13 and a via conductor group 14G located on the insulating substrate 11; In the direction, the width W2 of the via conductor group 14G is larger than the width W1 of the cutout portion 12 (W2>W1). 1 to 3, the upward direction means the positive direction of the virtual z axis. The distinction between upper and lower sides in the following description is for convenience, and does not limit the upper and lower sides when the wiring board 1 or the like is actually used.

The inner surface electrode 13 is shown by hatching in the examples shown in FIGS. In the example shown in FIG. 2, the via conductor 14 shows a region overlapping with the side surface of the via conductor 14 by a dotted line. The wiring conductor 15 is shaded in the examples shown in FIGS.

The insulating substrate 11 has one main surface (upper surface in FIGS. 1 to 3), the other main surface (lower surface in FIGS. 1 to 3) facing the one main surface, and side surfaces. The insulating substrate 11 is composed of a plurality of insulating layers,
It has a notch 12 that is open in the main surface and the side surface and is long in the side direction in a plan view. The insulating substrate 11 has a rectangular shape when seen in a plan view, that is, a direction perpendicular to the main surface. The insulating substrate 11 functions as a support for supporting the electronic component 2.

The insulating substrate 11 may be made of a ceramic such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, a silicon nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. it can. If the insulating substrate 11 is, for example, an aluminum oxide sintered body, raw material powder of aluminum oxide (Al ₂ O ₃ ), silicon oxide (SiO ₂ ), magnesium oxide (MgO), calcium oxide (CaO), or the like. An appropriate organic binder, a solvent, etc. are added and mixed to prepare a slurry. A ceramic green sheet is produced by forming this sludge into a sheet shape by employing a conventionally known doctor blade method, calendar roll method, or the like. Next, the ceramic green sheet is appropriately punched, a plurality of ceramic green sheets are laminated to form a green body, and the green body is fired at a high temperature (about 1400° C.), so that the insulating substrate 11 is formed. It is produced.

The cutout portion 12 is provided on the side surface of the insulating substrate 11 with an opening in the main surface and the side surface of the insulating substrate 11. The notch 12 is formed in a rectangular shape whose corners are arcuate in plan view, as in the example shown in FIGS. 1 to 3. The cutout 12 may have a semi-elliptical shape, a semi-elliptical shape, or a rectangular shape having a plurality of steps in a plan view. The notch 12 is formed long along the side direction of the insulating substrate 11 and has a width larger than its depth. The notch 12 may be provided from one main surface to the other main surface of the insulating substrate 11, or may be provided from the middle of the side surface of the insulating substrate 14 to the main surface. The notch 12 is formed by forming through holes to be the notch 12 in some of the ceramic green sheets for the insulating substrate 11 by laser processing, punching with a die or the like. It

The inner surface electrode 13 is located on the inner surface of the notch 12 as in the example shown in FIGS. 1 to 3, and is located in the thickness direction of the insulating substrate 11. The wiring conductor 15 is located on the main surface and the inside of the insulating substrate 11. The wiring conductor 15 includes a wiring layer located on the surface and inside of the insulating substrate 11 and a penetrating conductor that penetrates through the insulating layer forming the insulating substrate 11 and electrically connects the wiring layers located above and below. The wiring conductor 15 is located on the main surface of the insulating substrate 11 in the example shown in FIGS. The inner surface electrode 13 is electrically connected to the wiring conductor 15 as in the example shown in FIGS. The inner surface electrodes 13 and the wiring conductors 15 are for electrically connecting the electronic component 2 mounted on the wiring board 1 and an external module substrate.

The inner surface electrode 13 or the wiring conductor 15 is made of metal powder metallization such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper (Cu). When a refractory metal material such as W or Mo is used, it may be mixed with or alloyed with Cu, for example.

For the inner surface electrode 13 or the wiring conductor 15, for example, a ceramic green sheet for the insulating substrate 11 is printed and applied with a metallizing paste for the wiring conductor 15 by a printing means such as a screen printing method, and is baked together with the ceramic green sheet for the insulating substrate 11. Formed by. Further, the through conductor is formed by forming a through hole for the through conductor in a ceramic green sheet for the insulating substrate 11 by a processing method such as punching by a die or punching or laser processing, and metalizing the through conductor in the through hole. It is formed by filling the paste with the above-mentioned printing means and firing it together with the ceramic green sheet for the insulating substrate 11.

The via conductors 14 are for releasing the heat generated in the electronic component 2 mounted on the wiring board 1 to the outside of the wiring board 1 to enhance the heat dissipation of the wiring board 1, and both ends thereof have the thickness of the insulating board 11. Located in the direction. The via conductor 14 has a circular columnar shape. A plurality of via conductors 14 are located in the insulating substrate 11 and form a via conductor group 14G. In the example shown in FIGS. 1 to 3, the via conductor group 14G is formed by nine via conductors. The via conductor group 14G is formed at a position overlapping the electronic component 2 mounted on the wiring board 1 when seen in a plan view. Each via conductor 14 contains CuW as a main component.

Such a plurality of via conductors 14, after forming a plurality of holes in the ceramic green sheet for the insulating substrate 11 by punching or laser processing by a die or punching, the via conductors 14 for the via conductor 14 in the plurality of holes provided. It is made by placing a metal paste.

The via conductor 14 is made of metal powder metallization containing CuW as a main component. The metal powder may be in the form of a mixture or an alloy. For example, a metallized paste for a via conductor 14 made by adding an organic binder, an organic solvent, and a dispersant if necessary to a metal powder of W and a metal powder of Cu is formed in a plurality of holes formed in a ceramic green sheet. It is manufactured by printing by using a screen printing method or the like and filling. Among the components forming the via conductor 14, the content of CuW which is the main component is the largest. Further, in the component forming the via conductor 14, it is sufficient that CuW is contained at 50% by mass or more, and preferably CuW is contained at 80% by mass or more.

Further, as in the example shown in FIG. 2, the metal layers 16 may be located at both ends of the via conductor group 14G in the thickness direction of the insulating substrate 11 so as to overlap the via conductor group 14G in a plan view. Like the via conductor 14, such a metal layer 16 preferably contains CuW as a main component.

The metal layer 16 is formed by a method similar to that of the via conductor 16 so that the metallizing paste for the metal layer 16 is overlapped with the metallizing paste for the plurality of via conductors 14 embedded on the ceramic green sheet by a screen printing method. It is manufactured by printing using the etc. Further, in the component forming the metal layer 16, it is sufficient that CuW is contained in an amount of 50% by mass or more, and preferably 80% by mass or more.

The wiring conductor of the electronic device of the present embodiment is connected to the connection pad of the module substrate via solder, for example, to form an electronic module. In the electronic device, the inner surface electrode 13 located on the inner surface of the notch 12 and the wiring conductor 15 located on the other main surface of the wiring board 1 are connected to the connection pads of the module board.

According to the wiring board 1 of the present embodiment, the insulating substrate 11 has a rectangular shape in a plan view, has a notch 12 that is open in the main surface and side surfaces, and is long in the side direction, and the inner surface of the notch 12. And an inner surface electrode 13 located on the insulating substrate 11 and a plurality of via conductors 14 each having both ends located in the thickness direction of the insulating substrate 11, and a via conductor group 14G located on the insulating substrate 11. The width W2 of the via conductor group 14G is larger than the width W1 of the cutout portion 12 in the side direction (W2>W1). With the above configuration, the heat of the electronic component 2 spreads to the outside of the wiring board 1 more than the width of the cutout portion 12 in a plan view, so that the heat of the electronic component 2 is less likely to be transferred to the cutout portion 12. By reducing the stress on the notch 12 due to heat, it is possible to suppress disconnection at the connection between the inner surface electrode 13 and the wiring conductor 15 at the corner of the notch 12.

Further, when the electronic component 2 is a light emitting element, the stress due to heat to the cutout 12 is reduced for a long period of time, so that the connection portion between the inner surface electrode 13 and the wiring conductor 15 is formed at the corner of the cutout 12. It is possible to obtain the wiring board 1 for a small-sized light emitting device which can suppress the disconnection in the above and can satisfactorily emit light.

Further, when the widthwise both ends of the notch 12 are located inside the widthwise both ends of the via conductor group 14G in the side direction of the insulating substrate 11, the heat of the electronic component 2 is seen in a plan view. The heat is more easily radiated to the outside of the wiring board 1 than the corners of the notch 12, and the stress due to the heat to the notch 12 is reduced, so that the inner surface electrode 13 and the wiring conductor are formed at the corners of the notch 12. It is possible to more effectively suppress disconnection in the connection portion with 15.

It should be noted that the widthwise both ends of the notch 12 are, as in the example shown in FIGS. 1 to 3, both ends in the width direction of the notch 12 in the side direction of the insulating substrate 11 where the notch 12 is located. Parts are shown.

In addition, the widthwise ends of the via conductor group 14G mean the widthwise direction of the via conductor group 14G in the side direction of the insulating substrate 11 where the above-mentioned cutout 12 is located, as in the example shown in FIGS. Shows both ends of.

In addition, as in the example shown in FIGS. 1 to 3, when seen in a plan view, the via conductor group 14G has an inclined portion that is inclined with respect to the direction from the via conductor group 14G to the cutout portion 12, Since the width of the via conductor group 14G on the side of the cutout portion 12 becomes smaller and the heat transfer to the side of the cutout portion 12 is reduced, the stress due to the heat on the cutout portion 12 is reduced, and thus the cutout portion 12 is reduced. It is possible to suppress disconnection at the connection between the inner surface electrode 13 and the wiring conductor 15 at the corner of the. In the plan view perspective, the inclined portion of the via conductor group 14G is formed by arranging a plurality of via conductors 14 inclined with respect to the direction from the via conductor group 14G to the notch 12.

The metal layers 16 located at both ends of the via conductor group 14G are positioned so as to overlap the plurality of via conductors 14 forming the via conductor group 14G in plan view, as in the example shown in FIGS. 1 to 3. Then, heat can be efficiently transferred between each of the plurality of via conductor groups 14 and the metal layer 16, and by reducing the stress due to heat to the notch 12, the corner of the notch 12 can be reduced. Therefore, it is possible to more effectively suppress the disconnection in the connection portion between the inner surface electrode 13 and the wiring conductor 15.

Since the electronic device has the wiring board 1 having the above-described configuration and the electronic component 2 mounted on the wiring board 1, the electronic device can be a small-sized electronic device with high functionality and excellent long-term reliability.

The electronic module has a module substrate having a connection pad, a device having the electronic device of the above configuration connected to the connection pad via solder, and a module substrate to which the electronic device is connected. It can be made highly reliable.

(Second embodiment)
Next, the wiring board 1 according to the second embodiment will be described with reference to FIGS. 4 to 6.

The wiring board 1 according to the second embodiment is different from the wiring board 1 according to the above-described embodiment in that the via conductor group 14G has a side portion parallel to the longitudinal direction of the cutout portion 12 in plan view. That is the point.

The inner surface electrode 13 is shown by hatching in the examples shown in FIGS. In the example shown in FIG. 5, the via conductor 14 is shown by a dotted line in a region overlapping the side surface of the via conductor 14. The wiring conductor 15 is shaded in the examples shown in FIGS.

In the wiring board 1 according to the second embodiment, in the example shown in FIGS. 4 to 6, the via conductor group 14G is formed by 19 via conductors. The via conductor group 14G is formed at a position overlapping the electronic component 2 mounted on the wiring board 1 when seen in a plan view. Each via conductor 14 contains CuW as a main component.

According to the wiring board 1 of the second embodiment, as in the wiring board 1 of the above-described embodiment, the heat of the electronic component 2 is outside the width of the notch 12 in the plan view to the outside of the wiring board 1. Since it spreads greatly, the heat of the electronic component 2 is less likely to be transferred to the cutout portion 12, and the stress due to the heat to the cutout portion 12 is reduced, so that the inner surface electrode 13 and the wiring conductor are formed at the corners of the cutout portion 12. It is possible to suppress disconnection at the connection portion with 15.

Further, in the plan view, when the via conductor group 14G has a side portion parallel to the longitudinal direction of the cutout portion 12 as in the examples shown in FIGS. The heat can be easily transferred evenly along the corners, heat transfer at the corners of the notch 12 can be suppressed, and disconnection at the connection between the inner surface electrode 13 and the wiring conductor 15 can be suppressed. In plan view, a plurality of via conductors 14 are arranged in parallel with the longitudinal direction of the notch 12 in the side portion of the via conductor group 14G.

Further, as in the examples shown in FIGS. 4 to 6, both ends of the side portion of the via conductor group 14G are located inside the both ends of the cutout portion 12 in the width direction in the side direction of the insulating substrate 11. Then, the heat of the electronic component 2 is less likely to be transferred to the notch 12, and the stress due to the heat to the notch 12 is reduced, so that the inner surface electrodes 13 and the wiring conductors 15 are formed at the corners of the notch 12. It is possible to suppress disconnection at the connection portion of. Further, the width W1 of the cutout portion 12 is larger than the width W3 of the side portion of the via conductor group 14G (W1>W3).

The wiring board 1 of the second embodiment can be manufactured by using the same manufacturing method as that of the wiring board 1 of the above-described embodiment except for the above.

(Third Embodiment)
Next, the wiring board 1 according to the third embodiment will be described with reference to FIGS. 7 to 9.

The wiring board 1 of the third embodiment is different from the wiring board 1 of the above-described embodiment in that the stepped portions 12 a are located at both ends of the cutout portion 12 in the width direction, and the area having the inner electrode 13 is formed. The point is that a region not having the inner surface electrode 13 is located outside the.

The inner surface electrode 13 is shown by hatching in the examples shown in FIGS. In the example shown in FIG. 8, the via conductor 14 is indicated by a dotted line in a region overlapping the side surface of the via conductor 14. The wiring conductor 15 is shaded in the examples shown in FIGS.

In the wiring board 1 according to the third embodiment, in the example shown in FIGS. 7 to 9, the via conductor group 14G is formed by 19 via conductors. The via conductor group 14G is formed at a position overlapping the electronic component 2 mounted on the wiring board 1 when seen in a plan view. Each via conductor 14 contains CuW as a main component.

In the wiring board according to the third embodiment, the notch 12 having the inner electrode 13 is formed at both end portions in the width direction of the notch 12 as in the examples shown in FIGS. 7 to 9. The region, that is, the region located closer to the center than the step 12a of the cutout 12 is shown.

According to the wiring board 1 of the third embodiment, as in the wiring board 1 of the above-described embodiment, the heat of the electronic component 2 is located outside the wiring board 1 beyond the width of the notch 12 in plan view. Since it spreads greatly, the heat of the electronic component 2 is less likely to be transferred to the cutout portion 12, and the stress due to the heat to the cutout portion 12 is reduced, so that the inner surface electrode 13 and the wiring conductor are formed at the corners of the cutout portion 12. It is possible to suppress disconnection at the connection portion with 15.

Further, as in the example shown in FIGS. 7 to 9, the width W2 of the via conductor group 14G is larger than the width W1 of the cutout portion 12 in the side direction of the insulating substrate 13, and the widthwise end portions of the cutout portion 12 are If the stepped portion 12a is located at, and the region not having the inner surface electrode 13 is located outside the region having the inner surface electrode 13, it becomes difficult for the heat of the electronic component 2 to be transferred to the notch portion 12. By reducing the stress due to heat to the notch 12 at the corner of the notch 12 having the inner electrode 13, it is possible to suppress disconnection at the connection between the inner electrode 13 and the wiring conductor 15.

Further, as in the case of the wiring board 1 of the second embodiment described above, the via conductor group 14G has a side parallel to the longitudinal direction of the cutout portion 12 as seen in a plan view, as in the example shown in FIGS. 7 to 9. With the portion, heat is likely to be evenly transferred along the side of the cutout portion 12, heat transfer at the corners of the cutout portion 12 is suppressed, and the connection portion between the inner surface electrode 13 and the wiring conductor 15 is suppressed. Can be suppressed. In plan view, a plurality of via conductors 14 are arranged in parallel with the longitudinal direction of the notch 12 in the side portion of the via conductor group 14G.

Further, similar to the wiring board 1 of the second embodiment described above, as in the example shown in FIGS. 7 to 9, in the side direction of the insulating substrate 11, both ends of the side portion of the via conductor group 14G are notched. If it is located inside both ends in the width direction of the portion 12, it becomes difficult for the heat of the electronic component 2 to be transferred to the notch portion 12, and the stress due to heat to the notch portion 12 is reduced, so that the notch It is possible to suppress disconnection at the connection between the inner surface electrode 13 and the wiring conductor 15 at the corner of the portion 12. Further, the width W1 of the cutout portion 12 is larger than the width W3 of the side portion of the via conductor group 14G (W1>W3).

The wiring board 1 of the third embodiment can be manufactured by using the same manufacturing method as that of the wiring board 1 of the above-described embodiment except for the above.

The present invention is not limited to the example of the above-described embodiment, and various modifications can be made. For example, the insulating substrate 11 may have a rectangular shape having a notch or a chamfer on a side surface or a corner portion in a plan view.

In the wiring board 1 according to the second embodiment and the wiring board 1 according to the third embodiment, the inner surface of the cavity 17 is formed perpendicularly to the upper surface of the insulating substrate 11 in the longitudinal sectional view. The inner surface of the cavity 17 may be inclined so that the opening side is wider than the bottom surface side of the cavity 17.

Further, in the wiring board 1 of the first embodiment to the wiring board 1 of the third embodiment, the configurations of other embodiments may be combined. For example, in the wiring board 1 of the first embodiment, the cutout portion 12 may have the step portion 12a as in the wiring board 1 of the third embodiment. In this case, like the wiring board 1 of the third embodiment, the width W2 of the via conductor group 14G is larger than the width W1 of the notch 12 in the side direction of the insulating substrate 13, and the width direction of the notch 12 is It is preferable that the stepped portions 12a are located at both ends of the above, and the region not having the inner surface electrode 13 is located outside the region having the inner surface electrode 13.

Further, the wiring board 1 of the first embodiment may be provided with the cavity 17 as in the wiring board 1 of the second embodiment and the wiring board 1 of the third embodiment.

The electronic component mounting board 1 may be manufactured in the form of a multi-piece board.

1...Wiring board
11... Insulating substrate
12... Cutout
12a...Step
13....Inner electrode
14... Via conductor
14G-via conductor group
15...Wiring conductor
16... Metal layer
17... Cavity 2... Electronic component 3... Connection member

Claims (7)

An insulating substrate having a rectangular shape in a plan view, having openings in the main surface and side surfaces and having a notch that is long in the side direction;
An inner surface electrode located on the inner surface of the cutout portion,
Each end portion includes a plurality of via conductors located in the thickness direction of the insulating substrate, and has a via conductor group located in the insulating substrate,
A wiring board, wherein a width of the via conductor group is larger than a width of the cutout portion in a side direction of the insulating board. The wiring board according to claim 1, wherein, in the side direction of the insulating substrate, both end portions in the width direction of the cutout portion are located inside the both end portions in the width direction of the via conductor group. The wiring according to claim 1 or 2, wherein the via conductor group has an inclined portion that is inclined with respect to a direction from the via conductor group toward the cutout portion when seen in a plan view. substrate. The wiring board according to claim 1, wherein the via conductor group has a side portion parallel to the longitudinal direction of the cutout portion when seen in a plan view. The both end portions of the side portion of the via conductor group are located inside the both end portions of the cutout portion in the width direction in the side direction of the insulating substrate. The wiring board according to any one. A wiring board according to any one of claims 1 to 5,
An electronic device comprising: an electronic component mounted on the wiring board. A module substrate having a connection pad,
The electronic device according to claim 6, which is connected to the connection pad via solder.

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