JP2020077862A - エッチング方法及びプラズマ処理装置 - Google Patents
エッチング方法及びプラズマ処理装置 Download PDFInfo
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- 238000001020 plasma etching Methods 0.000 description 3
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
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Abstract
Description
Claims (20)
- プラズマ処理装置を用いて実行されるエッチング方法であって、該エッチング方法は、該プラズマ処理装置のチャンバ内に設けられた基板支持台上に基板が載置された状態で実行され、
前記チャンバ内のガスからプラズマを生成するために高周波電力を供給する工程と、
前記プラズマからの正イオンによって前記基板をエッチングするために、前記高周波電力を供給する前記工程の実行中に前記基板支持台の下部電極に負極性の直流電圧を印加する工程と、
負イオンを生成するために、前記下部電極に対する前記負極性の直流電圧の印加及び前記高周波電力の供給を停止する工程と、
前記負イオンを前記基板に供給するために、前記高周波電力の供給が停止された状態で、前記下部電極に正極性の直流電圧を印加する工程と、
を含む、エッチング方法。 - 高周波電力を供給する前記工程、負極性の直流電圧を印加する前記工程、停止する前記工程、及び正極性の直流電圧を印加する前記工程を含むエッチングシーケンスの一回以上の実行の後に、前記高周波電力の供給が停止され、且つ、前記下部電極に対する直流電圧の印加が停止された状態で、前記チャンバの内部空間から気体を排出する工程を更に含む、請求項1に記載のエッチング方法。
- 前記エッチングシーケンスの一回以上の実行と排出する前記工程とを含む別のシーケンスが繰り返される、請求項2に記載のエッチング方法。
- 前記別のシーケンスの実行期間において、排出する前記工程は10μ秒以上実行される、請求項3に記載のエッチング方法。
- 前記別のシーケンスの実行回数の増加につれて、排出する前記工程の実行期間の時間長が増加される、請求項3又は4に記載のエッチング方法。
- 停止する前記工程の実行中に、前記チャンバ内での電子密度を表すパラメータが測定され、
前記パラメータから前記チャンバ内での電子密度が所定の基準を満たすように減少していると判定される場合に、正極性の直流電圧を印加する前記工程が開始される、
請求項1〜5の何れか一項に記載のエッチング方法。 - 停止する前記工程において、前記高周波電力の供給が停止される前に、前記下部電極に対する前記負極性の直流電圧の印加が停止される、請求項1〜6の何れか一項に記載のエッチング方法。
- 高周波電力を供給する前記工程において、前記プラズマを生成するために、前記高周波電力の複数のパルスが断続的に供給される、請求項1〜7の何れか一項に記載のエッチング方法。
- 負極性の直流電圧を印加する前記工程において、前記負極性の直流電圧の複数のパルスが、断続的に前記下部電極に印加される、請求項1〜8の何れか一項に記載のエッチング方法。
- 正極性の直流電圧を印加する前記工程において、前記正極性の前記直流電圧の複数のパルスが、断続的に前記下部電極に印加される、請求項1〜9の何れか一項に記載のエッチング方法。
- チャンバと、
下部電極を有し、前記チャンバ内に設けられた基板支持台と、
前記チャンバ内でガスからプラズマを生成するために高周波電力を供給するように構成された高周波電源と、
正極性の直流電圧及び負極性の直流電圧を発生するように構成されており、前記下部電極に電気的に接続された電源ユニットと、
前記高周波電源及び前記電源ユニットを制御するように構成された制御部と、
を備え、
前記制御部は、
前記チャンバ内のガスからプラズマを生成するために高周波電力を供給するよう、前記高周波電源を制御する第1制御と、
前記プラズマからの正イオンによって基板をエッチングするために、前記高周波電力の供給中に、前記基板支持台の下部電極に負極性の直流電圧を印加するよう、前記電源ユニットを制御する第2制御と、
負イオンを生成するために、前記下部電極に対する前記負極性の直流電圧の印加及び前記高周波電力の供給を停止するよう、前記電源ユニット及び前記高周波電源を制御する第3制御と、
前記負イオンを前記基板に供給するために、前記高周波電力の供給が停止された状態で、前記下部電極に正極性の直流電圧を印加するよう、前記電源ユニットを制御する第4制御と、
を実行するように構成されている、プラズマ処理装置。 - 前記チャンバに接続された排気装置を更に備え、
前記制御部は、前記第1制御、前記第2制御、前記第3制御、及び前記第4制御を含むエッチング制御シーケンスの一回以上の実行の後に、前記高周波電力の供給が停止され、且つ、前記下部電極に対する直流電圧の印加が停止された状態で、前記チャンバの内部空間から気体を排出するよう、前記排気装置を制御する第5制御を更に実行するように構成されている、請求項11に記載のプラズマ処理装置。 - 前記制御部は、前記エッチング制御シーケンスの一回以上の実行と前記第5制御とを含む別の制御シーケンスを繰り返して実行する、請求項12に記載のプラズマ処理装置。
- 前記別の制御シーケンスの実行期間において、前記第5制御は10μ秒以上実行される、請求項13に記載のプラズマ処理装置。
- 前記制御部は、前記別の制御シーケンスの実行回数の増加につれて、前記第5制御の実行期間の時間長を増加させる、請求項13又は14に記載のプラズマ処理装置。
- 前記第3制御の実行中に、前記チャンバ内での電子密度を表すパラメータを測定する測定装置を更に備え、
前記制御部は、前記パラメータから前記チャンバ内での電子密度が所定の基準を満たすように減少していると判定される場合に、前記第4制御の実行を開始する、
請求項11〜15の何れか一項に記載のプラズマ処理装置。 - 前記第3制御において、前記制御部は、前記高周波電力の供給を停止する前に、前記下部電極に対する前記負極性の直流電圧の印加を停止するように、前記電源ユニットを制御する、請求項11〜16の何れか一項に記載のプラズマ処理装置。
- 前記第1制御において、前記制御部は、前記プラズマを生成するために前記高周波電力の複数のパルスを断続的に供給すうよう、前記高周波電源を制御する、請求項11〜17の何れか一項に記載のプラズマ処理装置。
- 前記第2制御において、前記制御部は、前記負極性の直流電圧の複数のパルスを断続的に前記下部電極に印加するよう、前記電源ユニットを制御する、請求項11〜18の何れか一項に記載のプラズマ処理装置。
- 前記第4制御において、前記制御部は、前記正極性の前記直流電圧の複数のパルスを断続的に前記下部電極に印加するよう、前記電源ユニットを制御する、請求項11〜19の何れか一項に記載のプラズマ処理装置。
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