JP2020072105A - Transport device, deposition apparatus, manufacturing system of organic el element, and manufacturing method of organic el element - Google Patents

Transport device, deposition apparatus, manufacturing system of organic el element, and manufacturing method of organic el element Download PDF

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JP2020072105A
JP2020072105A JP2018202623A JP2018202623A JP2020072105A JP 2020072105 A JP2020072105 A JP 2020072105A JP 2018202623 A JP2018202623 A JP 2018202623A JP 2018202623 A JP2018202623 A JP 2018202623A JP 2020072105 A JP2020072105 A JP 2020072105A
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substrate
holding unit
sub
movable holding
drive mechanism
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JP7265336B2 (en
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石川 明
Akira Ishikawa
明 石川
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Canon Tokki Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00Gripping heads and other end effectors
    • B25J15/08Gripping heads and other end effectors having finger members
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract

To transport a tabular object, such as a glass substrate, without causing positional deviation, and without causing breakdown or deformation, in a transport device for use in a deposition system, or the like.SOLUTION: A substrate 31 is held by using a substrate receiver 3 on the top face of a hand, and a substrate gripping claw 15 movable therefor. A first drive mechanism 351 moves the substrate gripping claw 15 between an upper position of the substrate receiver 3, and a saving position on the farther outside of the hand. A second drive mechanism drives the substrate gripping claw 15 to descend toward the substrate receiver 3 from above, or to ascend reversely. In the holding operation, the substrate gripping claw 15 is moved from the saving position to an upper position of the substrate 31 placed on the substrate receiver 3, and then lowered thus holding the substrate 31 by means of the substrate gripping claw 15 and the substrate receiver 3. In the disengagement operation, the substrate gripping claw 15 is raised to the upper position of the substrate 31, and then moved from the upper position of the object to the saving position.SELECTED DRAWING: Figure 7

Description

本発明は、搬送装置、成膜装置、有機EL素子の製造システム、および有機EL素子の製造方法に関する。   The present invention relates to a transport device, a film forming device, an organic EL element manufacturing system, and an organic EL element manufacturing method.

従来より、蒸着装置、例えば、ガラス基板上に下部金属電極、有機薄膜、上部透明電極などを順次積層することにより有機EL素子を製造する有機EL素子の製造システムにおいて、ガラス基板の搬送を行う搬送装置が用いられている。この種の搬送装置は、例えば基板を保持するハンドを備えた水平多関節ロボットによって構成され、例えばそれぞれ工程の異なる複数の成膜チャンバ間で基板を搬送する。   Conventionally, in a vapor deposition apparatus, for example, an organic EL element manufacturing system for manufacturing an organic EL element by sequentially stacking a lower metal electrode, an organic thin film, an upper transparent electrode, etc. on a glass substrate, the glass substrate is transferred. The device is being used. This type of transfer device is configured by, for example, a horizontal articulated robot equipped with a hand for holding the substrate, and transfers the substrate, for example, between a plurality of film forming chambers each having a different process.

この種の基板は、例えば厚みの非常に薄いガラス基板などであって、ハンドやグリッパなどにより大きな把持力を加えて保持、搬送することができない。そのため、搬送装置は、破損や変形なく基板を搬送するため、基板を掬い上げるようにハンドを動作させ、ハンド上に載置した基板を搬送する。このような、掬い上げ保持の形態から、搬送装置のハンドは例えば、フォークなどと呼ばれる場合もある。   This type of substrate is, for example, a glass substrate having an extremely thin thickness, and cannot be held and transported by applying a large gripping force with a hand or a gripper. Therefore, the transport device transports the substrate without damage or deformation, and thus operates the hand to scoop up the substrate and transports the substrate placed on the hand. Due to this type of scooping and holding, the hand of the carrier may be called, for example, a fork.

この掬い上げ保持による搬送形態では、搬送中に基板の位置がずれて、落下させたり、基板割れのような破損を生じたりする可能性がある。また、カメラなどを介して保持部上で大きな基板の位置ずれを検出した場合には、基板の持ち直し操作などを行わなければならない場合もある。   In the carrying mode by the scooping and holding, the position of the substrate may be displaced during the carrying, and the substrate may be dropped or may be damaged such as the substrate is broken. In addition, when a large displacement of the substrate is detected on the holding unit via a camera or the like, it may be necessary to perform a re-holding operation of the substrate.

そこで、掬い上げ保持を行う保持部では、フォーク個々の先端部を傾斜部として構成し、このフォーク先端の傾斜部に滑り止めのパッドを配置する、あるいはさらにフォークの先端に変形可能な突出片を設ける構成が提案されている(下記の特許文献1)。   Therefore, in the holding portion that performs scooping and holding, the tip end of each fork is configured as an inclined portion, and a non-slip pad is arranged on the inclined portion of the fork tip, or a deformable protruding piece is further provided at the tip of the fork. A configuration to be provided is proposed (Patent Document 1 below).

特開2017−208451号公報JP, 2017-208451, A

特許文献1の構成は、パッドや突出片が基板の縁部と接触して生じる変形応力や摩擦力を利用しており、能動的に把持力を印加して基板の位置を規制するものではない。このような構成は、基板サイズや重量がそれ程大きくなければ良好に機能する場合もある。しかしながら、昨今のように基板が大型化し、しかも高速搬送が求められる環境においては、基板搬送に伴う慣性力や遠心力が大きくなる傾向があり、数ミクロンオーダで基板が位置ずれを生じる可能性がある。   The configuration of Patent Document 1 utilizes the deformation stress and the frictional force generated when the pad or the protruding piece comes into contact with the edge portion of the substrate, and does not actively apply the gripping force to regulate the position of the substrate. .. Such a configuration may work well if the substrate size and weight are not too large. However, in an environment in which a substrate is large-sized and high-speed transportation is required as in recent years, the inertial force and the centrifugal force accompanying the substrate transportation tend to be large, and the substrate may be displaced on the order of several microns. is there.

そこで、本発明の課題は、成膜システムなどで用いられる搬送装置において、位置ずれを生じることなく、また、破損や変形を生じることなくガラス基板のような板状の対象物を搬送できるようにすることにある。   Therefore, an object of the present invention is to make it possible to transfer a plate-shaped object such as a glass substrate in a transfer device used in a film forming system or the like without causing positional displacement and without causing damage or deformation. To do.

上記課題を解決するため、本発明においては、ハンドに板状の対象物を載置して搬送する搬送装置において、前記ハンドの構成部材の上面に固定的に装着された保持部と、前記保持部に対して移動可能に配置された可動保持部と、前記可動保持部を、前記保持部の上方位置と、前記保持部よりも前記ハンドの外側の退避位置と、の間で移動させるよう駆動する第1の駆動機構と、前記可動保持部を、前記保持部の上方位置から前記保持部に向かう方向に下降、または、前記保持部から離れ前記保持部の上方位置に向かう方向に上昇させるよう駆動する第2の駆動機構と、を備え、前記第1の駆動機構により前記可動保持部を前記退避位置から前記保持部の上に載置された前記対象物の上方位置に移動させた後、前記第2の駆動機構により前記可動保持部を前記対象物の上方位置から、前記対象物に向かって下降させて、前記可動保持部と前記保持部とにより前記対象物を保持する保持動作と、前記第2の駆動機構により前記可動保持部を前記対象物の上方位置へ上昇させた後、前記第1の駆動機構により前記可動保持部を前記対象物の上方位置から前記退避位置に移動させる解放動作と、を行う構成を採用した。   In order to solve the above-mentioned problems, in the present invention, in a transfer device for mounting and transferring a plate-shaped object on a hand, a holding part fixedly mounted on an upper surface of a constituent member of the hand, and the holding part. And a movable holding portion that is movably arranged with respect to the holding portion, and the movable holding portion that moves between the upper position of the holding portion and the retracted position of the hand outside the holding portion. The first drive mechanism and the movable holding unit are lowered in a direction from the upper position of the holding unit toward the holding unit, or are raised in a direction away from the holding unit and toward the upper position of the holding unit. A second drive mechanism for driving, and after moving the movable holding part from the retracted position to the upper position of the object placed on the holding part by the first drive mechanism, By the second drive mechanism, A holding operation of lowering the moving holding part from the upper position of the object toward the object, and holding the object by the movable holding part and the holding part, and by the second drive mechanism, After the movable holding part is raised to the upper position of the object, a releasing operation of moving the movable holding part from the upper position of the object to the retracted position by the first drive mechanism is adopted. did.

上記構成によれば、成膜システムなどで用いられる搬送装置において、位置ずれを生じることなく、また、破損や変形を生じることなくガラス基板のような板状の対象物を搬送することができる。   According to the above configuration, a transporting device used in a film forming system or the like can transport a plate-shaped object such as a glass substrate without causing positional displacement and without causing damage or deformation.

本発明の実施形態に係る搬送装置のハンドの上面図である。It is a top view of the hand of the conveyance apparatus which concerns on embodiment of this invention. 本発明の実施形態に係る搬送装置のメインシャフトとサブシャフトの要部を示した正面図である。It is the front view which showed the main part of the main shaft and sub-shaft of the conveying apparatus which concerns on embodiment of this invention. 本発明の実施形態に係る搬送装置の可動保持部を昇降させる駆動機構を示した正面図である。It is the front view which showed the drive mechanism which raises / lowers the movable holding part of the conveyance apparatus which concerns on embodiment of this invention. 本発明の実施形態に係る搬送装置の可動保持部を水平に移動させる駆動機構を示した正面図である。It is the front view which showed the drive mechanism which moves the movable holding part of the conveying apparatus which concerns on embodiment of this invention horizontally. 図3、図4に示した駆動機構の平面図である。FIG. 5 is a plan view of the drive mechanism shown in FIGS. 3 and 4. 図3、図4に示した駆動機構の側方から見た状態を紙面上の高さの異なる位置に並べて図示する様式を用いて、可動保持部を水平に移動させる動作を示した説明図である。FIG. 6 is an explanatory diagram showing an operation of horizontally moving the movable holding unit by using a mode in which the state of the drive mechanism shown in FIGS. 3 and 4 viewed from the side is arranged side by side at different heights on the paper surface. is there. 図3、図4に示した駆動機構の側方から見た状態を紙面上の高さの異なる位置に並べて図示する様式を用いて、可動保持部を昇降させる動作を示した説明図である。FIG. 6 is an explanatory diagram showing an operation of raising and lowering the movable holding unit by using a mode in which the states of the drive mechanism shown in FIGS. 3 and 4 as viewed from the side are arranged side by side at different heights on the paper surface. 本発明の実施形態に係る搬送装置のハンドの上方から示した斜視図である。It is the perspective view shown from the upper part of the hand of the conveyance machine concerning the embodiment of the present invention. 図3、図4に示した駆動機構の要部を上方から示した斜視図である。FIG. 5 is a perspective view showing an essential part of the drive mechanism shown in FIGS. 3 and 4 from above. 本発明の実施形態に係る搬送装置のハンドにおける力学的な作用を示した説明図である。It is explanatory drawing which showed the dynamic action in the hand of the conveying apparatus which concerns on embodiment of this invention. 本発明の実施形態に係る搬送装置と、この搬送装置を用いた成膜システムの上面図である。FIG. 2 is a top view of a transfer device according to the embodiment of the present invention and a film forming system using the transfer device. 本発明の実施形態に係る搬送装置と、この搬送装置を用いた成膜システムの全体構成の一例を示した上面図である。FIG. 1 is a top view showing an example of the overall configuration of a transfer device according to an embodiment of the present invention and a film forming system using this transfer device.

以下、添付図面を参照して本発明を実施するための形態につき説明する。なお、以下に示す構成はあくまでも一例であり、例えば細部の構成については本発明の趣旨を逸脱しない範囲において当業者が適宜変更することができる。また、本実施形態で取り上げる数値は、参考数値であって、本発明を限定するものではない。   Embodiments for carrying out the present invention will be described below with reference to the accompanying drawings. It should be noted that the configuration shown below is merely an example, and for example, a detailed configuration can be appropriately changed by those skilled in the art without departing from the spirit of the present invention. The numerical values taken in this embodiment are reference numerical values and do not limit the present invention.

以下では、有機薄膜形成を行う成膜システムにおいて搬送装置として用いられるロボットアームとそのハンドの構成を例示する。ここでは、まず、図11に本実施形態の搬送装置を含む成膜システムの構成例を示す。この成膜システムは、例えばガラス基板に有機薄膜を成膜する成膜システムであって、同基板を用いて有機EL素子を製造する有機EL素子の製造システムの一部を構成する。図11の成膜システムでは、成膜チャンバ100、成膜チャンバ101、成膜チャンバ102、搬送室235、搬送経路103が、ゲートバルブ234を介して互いに接続されている。   Below, the structure of the robot arm and its hand used as a conveyance apparatus in the film-forming system which forms an organic thin film is illustrated. Here, first, FIG. 11 shows an example of the configuration of a film forming system including the transfer device of the present embodiment. This film forming system is, for example, a film forming system for forming an organic thin film on a glass substrate, and constitutes a part of an organic EL element manufacturing system for manufacturing an organic EL element using the same substrate. In the film forming system of FIG. 11, the film forming chamber 100, the film forming chamber 101, the film forming chamber 102, the transfer chamber 235, and the transfer path 103 are connected to each other via a gate valve 234.

図11の成膜システム(成膜装置)において、成膜チャンバ100、成膜チャンバ101、成膜チャンバ102は、その内部が所定の真空度に保たれた状態で有機材料を基板31に蒸着して有機薄膜を成膜する成膜手段であり、各チャンバの基本構成は同一である。なお、各成膜チャンバが同一種の有機材料を成膜するように成膜システムを構成してもよいし、成膜チャンバ毎に異種の有機材料を成膜するように構成してもよい。   In the film forming system (film forming apparatus) of FIG. 11, the film forming chamber 100, the film forming chamber 101, and the film forming chamber 102 deposit an organic material on the substrate 31 while keeping the inside of the film forming chamber at a predetermined vacuum degree. It is a film forming means for forming an organic thin film by means of the above, and the basic configuration of each chamber is the same. Note that the film formation system may be configured such that each film formation chamber deposits the same type of organic material, or the film formation chambers may be configured to deposit different kinds of organic materials.

搬送室235はロボットアーム104を備え、このロボットアーム104により各成膜チャンバに搬送経路103から基板31を搬入したり、各成膜チャンバから搬送経路103に基板31を搬出したりすることができる。ロボットアーム104は、基板31を保持するためのハンド233を備え、各成膜チャンバで成膜が行われる蒸着エリア232に基板31を搬入したり搬出したりする動作を行う。そのため、ロボットアーム104は、ハンド233の基板に対する相対的な位置および/または姿勢を制御できるよう構成される。ロボットアーム104のリンク、関節の構成は、真空装置内で安定して基板31をハンドリングできるものであれば、どのような形式の機構でもよい。ハンド233の構成例については以下で詳細に説明する。   The transfer chamber 235 includes a robot arm 104, and the robot arm 104 can carry the substrate 31 into and from each film forming chamber from the transfer path 103 and can carry out the substrate 31 from each film forming chamber to the transfer path 103. .. The robot arm 104 includes a hand 233 for holding the substrate 31, and carries out an operation of loading or unloading the substrate 31 into or from the vapor deposition area 232 in which film deposition is performed in each film deposition chamber. Therefore, the robot arm 104 is configured to control the relative position and / or posture of the hand 233 with respect to the substrate. The structure of the links and joints of the robot arm 104 may be any type of mechanism as long as it can stably handle the substrate 31 in the vacuum device. A configuration example of the hand 233 will be described in detail below.

なお、図11は、成膜チャンバ100の蒸着エリア232と搬送室235とを接続するゲートバルブ234が開かれ、ロボットアームが輪郭を破線で示した基板31をハンド233に載置した状態で搬送(搬入または搬出)している状態を模式的に示している。また、図中のX、Y、Zは、3次元座標軸の方向を示している(後述の図も同様)。   Note that in FIG. 11, the gate valve 234 connecting the vapor deposition area 232 of the film forming chamber 100 and the transfer chamber 235 is opened, and the robot arm transfers the substrate 31 whose outline is indicated by a broken line to the hand 233. The state of being carried in or carried out is schematically shown. In addition, X, Y, and Z in the drawings indicate the directions of the three-dimensional coordinate axes (the same applies to the drawings described below).

搬送経路103は、大気中に基板31を出し入れ可能なロードロック室や、別の成膜システムに基板31を搬送するための搬送路である。なお、図11では、搬送室235の周囲の4面に成膜チャンバや搬送経路を配置したが、成膜システムの形態はこの構成に限定される必要はなく、例えば搬送室を中心に周囲の6面あるいは8面に成膜チャンバや搬送経路を配置してもよい。また、基板31の搬送装置としてのロボットアームにはシングルアームに限らず、マルチアーム構成の配置を用いてもよい。   The transport path 103 is a load-lock chamber in which the substrate 31 can be taken in and out of the atmosphere, or a transport path for transporting the substrate 31 to another film forming system. Note that in FIG. 11, the film forming chambers and the transfer paths are arranged on the four surfaces around the transfer chamber 235, but the form of the film forming system is not limited to this configuration. The film forming chamber or the transfer path may be arranged on the 6th or 8th surface. Further, the robot arm as the transfer device for the substrate 31 is not limited to the single arm, but may be arranged in a multi-arm configuration.

図1、図8は、図11に示した上述のロボットアーム104のハンド233の構成例を示している。図1、図8に示すように、このハンド233は、ハンド233の手首側から手先側へと伸びる2本のメインフレーム37を備えている。メインフレーム37には、メインフレーム37と交差する方向に、それぞれ左右7本ずつのサブフレーム1が突設されている。   1 and 8 show a configuration example of the hand 233 of the robot arm 104 shown in FIG. As shown in FIGS. 1 and 8, the hand 233 includes two main frames 37 extending from the wrist side to the hand side of the hand 233. The main frame 37 is provided with seven sub-frames 1 on the left and right in a direction intersecting with the main frame 37.

各々のサブフレーム1の先端には、基板受け3が配置される。さらに、ハンド233の基板載置領域の四隅に相当するサブフレーム1の先端には、保持機構としての基板把持ユニット35(35A、35B、35C、35D)が配置されている。基板把持ユニット35(35A、35B、35C、35D)は、基板受け3に対して移動可能に配置された可動保持部としての基板把持爪15(図3)を備える。基板受け3は、ハンドの構成部材の上面に固定的に装着された保持部であって、基板把持ユニット35(35A、35B、35C、35D)は、後述するように、可動保持部としての基板把持爪15を基板受け3に対して接近、離間させることができる。この基板把持ユニット35(35A、35B、35C、35D)は、ハンド233に載置した基板31の四隅付近を上下方向から基板受け3、基板把持爪15によって把持する。   A substrate receiver 3 is arranged at the tip of each sub-frame 1. Further, substrate holding units 35 (35A, 35B, 35C, 35D) as a holding mechanism are arranged at the tips of the sub-frames 1 corresponding to the four corners of the substrate mounting area of the hand 233. The board holding unit 35 (35A, 35B, 35C, 35D) includes a board holding claw 15 (FIG. 3) as a movable holding portion that is movably arranged with respect to the board receiver 3. The substrate receiver 3 is a holding unit fixedly mounted on the upper surface of a component member of the hand, and the substrate holding unit 35 (35A, 35B, 35C, 35D) is a substrate as a movable holding unit, as described later. The grip claw 15 can be moved toward and away from the board receiver 3. The substrate gripping unit 35 (35A, 35B, 35C, 35D) grips the vicinity of the four corners of the substrate 31 placed on the hand 233 from above and below by the substrate receiver 3 and the substrate grip claw 15.

また、手首側、手先側のサブフレーム1には、それぞれメインフレーム37と平行に伸びるサブフレーム311、311…が装着されており、その先端にも基板受け3が配置され、これらの基板受け3、3…によって基板31の後縁、前縁が支持される。   Further, sub-frames 311, 311 ... Which extend in parallel with the main frame 37 are mounted on the wrist side and the hand side sub-frames 1, respectively, and the board receiver 3 is arranged at the tip thereof. The rear edge and the front edge of the substrate 31 are supported by 3.

基板把持ユニット35(35A、35B、35C、35D)は、基板把持爪15を水平動作させる第1の駆動機構と、基板把持爪15を昇降(上下駆動)させる第2の駆動機構と、を備える。これらの駆動機構は、メインフレーム37、37上にそれぞれ配置された2本のメインシャフト33、33(図1、図2、図4)と、基板把持ユニット35が設けられたサブフレーム1上に配置された4本のサブシャフト17によって駆動される。   The substrate gripping unit 35 (35A, 35B, 35C, 35D) includes a first drive mechanism that horizontally moves the substrate grip claw 15 and a second drive mechanism that moves the substrate grip claw 15 up and down (up and down drive). .. These drive mechanisms are provided on the main frame 37, two main shafts 33, 33 (FIGS. 1, 2, and 4) respectively arranged on the main frame 37, 37, and the sub-frame 1 provided with the substrate gripping unit 35. It is driven by the four sub-shafts 17 arranged.

図2に示すように、メインシャフト33、33は、軸受32、32(…)を介してメインフレーム37、37上に回転可能に支持されている。これらメインシャフト33、33は、ハンド233の例えば手首側に配置されたステッピングモータやサーボモータなどの駆動源(不図示)によりそれぞれ回転駆動される。これにより、例えば図示のような楕円のカム面を備えた偏心カム34の回動位置を選択することができる。   As shown in FIG. 2, the main shafts 33, 33 are rotatably supported on the main frames 37, 37 via bearings 32, 32 (...). The main shafts 33, 33 are rotationally driven by a drive source (not shown) such as a stepping motor or a servomotor arranged on the wrist side of the hand 233, for example. As a result, the turning position of the eccentric cam 34 having the elliptical cam surface as shown in the drawing can be selected.

軸受36、36(…)に軸支されたサブシャフト17の後端は、偏心カム34に当接し、サブフレーム1上で往復移動し、これによりサブシャフト17の先端が後述の機構を操作することによって、基板把持爪15を水平および上下方向に動作させる。本実施形態の基板把持ユニット35(35A、35B、35C、35D)は、サブシャフト17の水平直線運動によって、基板把持爪15を水平方向および上下方向の2方向に動作させる。基板把持ユニット35(35A、35B、35C、35D)は、下記のように、リニアガイド、板カム、バネ、係合爪、などによって構成することができる。   The rear end of the sub-shaft 17, which is rotatably supported by the bearings 36, 36 (...), contacts the eccentric cam 34 and reciprocates on the sub-frame 1, whereby the tip of the sub-shaft 17 operates a mechanism described later. Thus, the board gripping claws 15 are moved horizontally and vertically. The substrate gripping unit 35 (35A, 35B, 35C, 35D) of the present embodiment moves the substrate gripping claw 15 in two directions, a horizontal direction and a vertical direction, by the horizontal linear motion of the sub shaft 17. The board holding unit 35 (35A, 35B, 35C, 35D) can be configured by a linear guide, a plate cam, a spring, an engaging claw, etc. as described below.

基板把持動作では、基板把持ユニット35は、まず、基板把持爪15を、基板受け3上に載置されている基板31の上方位置であって、かつ基板31の外側の位置から水平に侵入するよう水平に移動させる。続いて、設定したストローク位置で、基板把持爪15に基板面に対してほぼ垂直に下降させ、基板把持爪15が基板31に当接し、基板把持爪15および基板受け3で基板31を把持する。基板開放動作では、基板把持ユニット35は、まず、基板把持爪15を基板面から上昇、離間させ、続いて、基板31の上空を基板輪郭の外側の退避位置まで水平に移動させる。   In the board holding operation, the board holding unit 35 first intrudes the board holding claw 15 horizontally from a position above the board 31 placed on the board receiver 3 and outside the board 31. Move horizontally. Subsequently, at the set stroke position, the substrate gripping claw 15 is lowered substantially perpendicularly to the substrate surface, the substrate gripping claw 15 contacts the substrate 31, and the substrate 31 is gripped by the substrate gripping claw 15 and the substrate receiver 3. .. In the substrate opening operation, the substrate gripping unit 35 first raises and separates the substrate gripping claw 15 from the substrate surface, and then horizontally moves the sky above the substrate 31 to the retracted position outside the substrate contour.

以下、図1〜図10を参照して、基板把持ユニット35(35A、35B、35C、35D)の構成および動作につき詳細に説明する。これらの図のうち、まだ言及していない図4は、上述した可動保持部としての基板把持爪15を水平に移動させる第1の駆動機構351を、また、図3は、可動保持部としての基板把持爪15を昇降させる第2の駆動機構352を示している。また、図5は、基板把持爪15を、水平移動、ないし昇降させる第1、第2の駆動機構を上面から示している。また、図6、図7は、機構の動作の理解を容易にするため、本来ほぼ同じ高さに配置される図3、図4の第1、第2の駆動機構を、紙面上の高さの異なる位置に側方から見た状態で並べて図示する様式を用いて図示したもので、図6は基板31の解放状態を、図7は基板31の把持状態に相当する。また、図9は、基板把持爪15を駆動する上記の第1、第2の駆動機構を斜視状態で示したものである。また、図10は、基板把持ユニット35の作用と配置の要件に係るもので、基板受け3と基板の相互作用を基板の側面方向から示したものである。   Hereinafter, the configuration and operation of the substrate gripping unit 35 (35A, 35B, 35C, 35D) will be described in detail with reference to FIGS. Of these drawings, FIG. 4, which has not been referred to yet, shows the first drive mechanism 351 for horizontally moving the substrate gripping claw 15 as the above-mentioned movable holding portion, and FIG. 3 shows as the movable holding portion. A second drive mechanism 352 for raising and lowering the board gripping claw 15 is shown. Further, FIG. 5 shows, from the top surface, first and second drive mechanisms for horizontally moving or raising and lowering the board gripping claw 15. In addition, in order to facilitate understanding of the operation of the mechanism, FIGS. 6 and 7 show the first and second drive mechanisms of FIGS. 6A and 6B correspond to different positions of the substrate 31 when viewed from the side by using the illustrated manner, and FIG. 6 corresponds to the released state of the substrate 31, and FIG. 7 corresponds to the grasped state of the substrate 31. Further, FIG. 9 shows the first and second drive mechanisms for driving the board gripping claw 15 in a perspective state. Further, FIG. 10 relates to the action and arrangement requirements of the substrate gripping unit 35, and shows the interaction between the substrate receiver 3 and the substrate from the side surface direction of the substrate.

上述のように、2本のメインフレーム37にそれぞれ複数(この例では左右7本ずつ)のサブフレーム1が配置されている。各サブフレーム1の先端には、少なくとも基板受け3が配置される。基板受け3は、例えばフッ素ゴムなどの材質から、例えばサブフレーム311の先端側の方が高くなった形状などにその上面が形成されている(図10の基板受け310参照)。基板把持ユニット35が配置されていないサブフレーム1では、基板31は単に基板受け3の上に載置された状態で下方から支持する。ハンド233の四隅に相当するサブフレーム1の先端には、ベース2によって支持された基板受け3が設けられる(図3)。さらに可動保持部としての基板把持爪15を上記のように上下、水平に移動させる基板把持ユニット35(35A、35B、35C、35D)が配置される。   As described above, a plurality of subframes 1 (in this example, seven left and right) are arranged on each of the two main frames 37. At least the substrate receiver 3 is arranged at the tip of each sub-frame 1. The substrate receiver 3 is made of a material such as fluororubber and has an upper surface formed in a shape such that the tip side of the sub-frame 311 is higher (see substrate receiver 310 in FIG. 10). In the subframe 1 in which the substrate gripping unit 35 is not arranged, the substrate 31 is simply placed on the substrate receiver 3 and is supported from below. Substrate holders 3 supported by the base 2 are provided at the ends of the sub-frame 1 corresponding to the four corners of the hand 233 (FIG. 3). Further, the substrate holding unit 35 (35A, 35B, 35C, 35D) for moving the substrate holding claw 15 as the movable holding portion vertically and horizontally as described above is arranged.

本実施形態では、基板把持ユニット35(35A、35B、35C、35D)はハンド233の四隅に相当するサブフレーム1の先端に配置されているが、より多数の基板把持ユニット35が任意のサブフレーム1に配置されていてもよい。基板把持ユニット35(35A、35B、35C、35D)は、後述のように共通のメインシャフト33、33の回転駆動力によって動作するものであり、ハンド233の四隅以外にさらに基板把持ユニット35を増設するのは容易である。   In the present embodiment, the substrate gripping units 35 (35A, 35B, 35C, 35D) are arranged at the tips of the subframes 1 corresponding to the four corners of the hand 233, but a larger number of substrate gripping units 35 are used in any subframe. 1 may be arranged. The board gripping units 35 (35A, 35B, 35C, 35D) are operated by the rotational driving force of the common main shafts 33, 33 as described later, and the board gripping units 35 are additionally installed in addition to the four corners of the hand 233. It's easy to do.

以下、図3〜図5、図9を参照して、本実施形態の基板把持ユニット35の第1、第2の駆動機構351、352の構成例につき説明する。第1の駆動機構351は、図4のように、第1のリニアガイド21によって、サブシャフト17と平行な方向に直線移動できるよう支持されたL字型のベース20を備える。即ち、このL字型のベース20は、往復運動するサブシャフト17の先端に当接可能な位置に第1のリニアガイド21に支持されている。   Hereinafter, a configuration example of the first and second drive mechanisms 351 and 352 of the substrate gripping unit 35 of the present embodiment will be described with reference to FIGS. 3 to 5 and 9. As shown in FIG. 4, the first drive mechanism 351 includes an L-shaped base 20 supported by a first linear guide 21 so as to be linearly movable in a direction parallel to the sub shaft 17. That is, the L-shaped base 20 is supported by the first linear guide 21 at a position where it can contact the tip of the reciprocating sub-shaft 17.

図4、図5、図9において、L字型のベース20の後端部のブラケット22は、ブラケット26との間で圧縮バネガイド25に弾装された圧縮バネ24(第1の付勢手段)によって、ベース20の前端がサブシャフト17の先端と当接するように付勢されている。   4, 5, and 9, the bracket 22 at the rear end of the L-shaped base 20 is compressed by the compression spring guide 25 between the bracket 26 and the compression spring 24 (first urging means). Thus, the front end of the base 20 is urged to come into contact with the tip of the sub-shaft 17.

図4の状態は、偏心カム34の最も高いカム面がサブシャフト17の後端に当接している。この状態では、基板把持爪15は基板31よりも外側の退避位置に水平移動されている。図4の実線の状態から、鎖線の状態に偏心カム34を回転させると、矢印のようにL字型のベース20、ないし板カム18に対してサブシャフト17が後退する。これにより、基板把持爪15は基板31上空に進入するように水平移動する。   In the state of FIG. 4, the highest cam surface of the eccentric cam 34 is in contact with the rear end of the sub shaft 17. In this state, the board gripping claw 15 is horizontally moved to a retracted position outside the board 31. When the eccentric cam 34 is rotated from the solid line state in FIG. 4 to the chain line state, the sub-shaft 17 retracts with respect to the L-shaped base 20 or the plate cam 18 as indicated by the arrow. As a result, the board gripping claw 15 horizontally moves so as to enter the space above the board 31.

即ち、メインシャフト33が回転駆動され、偏心カム34を介してサブシャフト17に伝達される駆動力により、サブシャフト17がサブフレーム1に沿って往復移動し、サブシャフト17の前端部を介して第1の駆動機構351または前記第2の駆動機構352が駆動される。   That is, the main shaft 33 is rotationally driven, and the driving force transmitted to the sub-shaft 17 through the eccentric cam 34 causes the sub-shaft 17 to reciprocate along the sub-frame 1 and through the front end portion of the sub-shaft 17. The first drive mechanism 351 or the second drive mechanism 352 is driven.

サブシャフト17が後退すると、L字型のベース20、ないし板カム18は圧縮バネ24に付勢されて偏心カム34に当接した状態で同じ矢印方向に水平移動する。このベース20、ないし板カム18の、基板31上空への進入する方向への水平移動の限界位置は、ストッパ調整ネジ29と、L字型のベース20に設けられたストッパ19とが当接することによって規制される。ストッパ調整ネジ29の係止位置は、サブフレーム1上に配置されたブラケット30に対するねじ込み量によって調節できる。ストッパ調整ネジ29によるベース20の係止位置は、基板把持爪15を昇降させる基板31の縁部の内側の所定位置に調節される。   When the sub-shaft 17 retracts, the L-shaped base 20 or the plate cam 18 is urged by the compression spring 24 and horizontally moves in the same arrow direction while being in contact with the eccentric cam 34. At the limit position of the horizontal movement of the base 20 or the plate cam 18 in the direction of entering the space above the substrate 31, the stopper adjusting screw 29 and the stopper 19 provided on the L-shaped base 20 contact each other. Regulated by. The locking position of the stopper adjusting screw 29 can be adjusted by the screwing amount with respect to the bracket 30 arranged on the sub-frame 1. The position where the base 20 is locked by the stopper adjusting screw 29 is adjusted to a predetermined position inside the edge portion of the substrate 31 which raises and lowers the substrate holding claw 15.

図5、図9に示すようにL字型のベース20の側面には、板カム18が固定されている。この板カム18は、第2の駆動機構352のカムフォロワ7と協働して、基板把持爪15の昇降を制御するためのものである。板カム18のカム面は、サブシャフト17の側が高く、カム面のこの部分によって基板把持爪15の上昇高さ(退避高さ)が決定される。板カム18のカム面のL字型のベース20後方に相当する部分は、基板把持爪15を下降させる傾斜面となっている。本実施形態では、上記の板カム18のカム面の形状はいずれも直線状であり、板カム18は全体として台形形状であるが、これらカム面は基板把持爪15の任意の昇降タイミングや昇降の軌道を得られるよう考慮された任意の形状であってよい。   As shown in FIGS. 5 and 9, a plate cam 18 is fixed to the side surface of the L-shaped base 20. The plate cam 18 cooperates with the cam follower 7 of the second drive mechanism 352 to control the lifting and lowering of the board gripping claw 15. The cam surface of the plate cam 18 is high on the side of the sub-shaft 17, and the rising height (retraction height) of the substrate gripping claw 15 is determined by this portion of the cam surface. A portion of the cam surface of the plate cam 18 corresponding to the rear of the L-shaped base 20 is an inclined surface for lowering the substrate gripping claw 15. In this embodiment, the shape of the cam surface of the plate cam 18 is linear, and the plate cam 18 has a trapezoidal shape as a whole. Can be any shape that is considered to obtain the trajectory of

一方、第2の駆動機構352は、第2のリニアガイド11によって、サブシャフト17と平行な方向に直線移動できるようベース10により支持されたブラケット9を備える。基板把持爪15は、図3、図9に示すようにブラケット6の先端に固定されている。なお、図3、図9では、ブラケット6の形状や、カムフォロワ7廻りの形状が一部異なるものとなっているが、これらの構造の機械的な機能は同等である。特にカムフォロワ7はこれらの図に示すように、例えばローラ形式のカムフォロワで、小さな摩擦抵抗で板カム18のカム面に従動できるよう配慮されている。   On the other hand, the second drive mechanism 352 includes the bracket 9 supported by the base 10 so as to be linearly movable in the direction parallel to the sub shaft 17 by the second linear guide 11. The board gripping claw 15 is fixed to the tip of the bracket 6 as shown in FIGS. 3 and 9. 3 and 9, the shape of the bracket 6 and the shape around the cam follower 7 are partially different, but the mechanical functions of these structures are the same. In particular, as shown in these drawings, the cam follower 7 is, for example, a roller type cam follower, and is designed so that it can be driven by the cam surface of the plate cam 18 with a small frictional resistance.

ブラケット6は、ブラケット9に対して、上下方向に移動できるようリニアガイド8を介して装着されている。ブラケット6は、ブラケット9との間に弾装された引張バネ16によって、下方に付勢されている。ブラケット6および基板把持爪15の昇降高さは、ブラケット6に装着されたカムフォロワ7と当接する板カム18のカム面の高さによって決定される。   The bracket 6 is attached to the bracket 9 via a linear guide 8 so as to be vertically movable. The bracket 6 is biased downward by a tension spring 16 elastically mounted between the bracket 6 and the bracket 9. The vertical heights of the bracket 6 and the board gripping claw 15 are determined by the height of the cam surface of the plate cam 18 that comes into contact with the cam follower 7 mounted on the bracket 6.

第1、第2の駆動機構351、352のサブシャフト17と平行な水平方向の連動は、引張バネ13と、互いに係合可能な係合爪として構成されたストッパ27、28(図5)によって制御される。引張バネ13(第2の付勢手段)は、ブラケット9の後端に突設されたアーム14と、L字型のベース20のブラケット23の間に弾装され、これらを近接させる方向に付勢する。なお、引張バネ13と圧縮バネ24の力関係は、例えば(圧縮バネ24の復元力)>(引張バネ13)の引張力、のように設定しておく。   The horizontal interlocking movement of the first and second drive mechanisms 351 and 352 parallel to the sub-shaft 17 is performed by the tension spring 13 and the stoppers 27 and 28 (FIG. 5) configured as engaging claws that can engage with each other. Controlled. The tension spring 13 (second urging means) is elastically mounted between the arm 14 projecting from the rear end of the bracket 9 and the bracket 23 of the L-shaped base 20, and is attached in a direction to bring them close to each other. Energize. The force relationship between the tension spring 13 and the compression spring 24 is set as, for example, (restoring force of the compression spring 24)> (tensile spring 13).

図5のように、第2の駆動機構352のブラケット9ないし6には、ストッパ27が、第1の駆動機構352のL字型のベース20にはストッパ28が突設されている。図5に示した状態では、ストッパ27、28が係止し、水平方向に関しては、引張バネ13の付勢力によって第1の駆動機構352のL字型のベース20と、第2の駆動機構352のブラケット9ないし6が一体となって移動できる。   As shown in FIG. 5, a stopper 27 is provided on the brackets 9 to 6 of the second drive mechanism 352, and a stopper 28 is provided on the L-shaped base 20 of the first drive mechanism 352. In the state shown in FIG. 5, the stoppers 27 and 28 are locked, and in the horizontal direction, the L-shaped base 20 of the first drive mechanism 352 and the second drive mechanism 352 are urged by the urging force of the tension spring 13. The brackets 9 to 6 can be moved together.

ただし、第2の駆動機構352のブラケット9がサブシャフト17に向かう方向への水平移動位置は、サブフレーム1に配置されたブラケット5により支持されたストッパ調整ネジ4とストッパ12(図3)とが当接することによって規制される。このブラケット9の規制位置は、ストッパ調整ネジ4によって調整可能である。そして、図5〜図7に示すように、サブシャフト17の先端を基準とすると、このストッパ調整ネジ4のサブフレーム1上における配置位置は、上述のストッパ調整ネジ29の位置よりも遠い。   However, the horizontal movement position of the bracket 9 of the second drive mechanism 352 in the direction toward the sub-shaft 17 is the same as that of the stopper adjusting screw 4 and the stopper 12 (FIG. 3) supported by the bracket 5 arranged on the sub-frame 1. Are regulated by abutting against each other. The regulating position of the bracket 9 can be adjusted by the stopper adjusting screw 4. Then, as shown in FIGS. 5 to 7, with the tip of the sub-shaft 17 as a reference, the position of the stopper adjusting screw 4 on the sub-frame 1 is farther than the position of the stopper adjusting screw 29 described above.

上記構成において、図5、図6に示すようにブラケット9がストッパ調整ネジ4と当接した後は、第2の駆動機構352のブラケット9、6、基板把持爪15はこの基板31の外縁内側の所定の昇降位置よりも右方へは水平移動できない。この状態から、さらにサブシャフト17を後退させると、第1の駆動機構351のL字型のベース20のみが圧縮バネ24の付勢力によって右方へ移動する。この時、ストッパ27、28は離間して、ブラケット9の水平位置(基板把持爪15の昇降位置)は、引張バネ13によってストッパ調整ネジ4と当接するよう付勢されることによって維持される。図5、図6の状態では、カムフォロワ7が板カム18の水平な高いカム面の位置に当接しており、基板把持爪15は、まだ基板受け3上に載置された基板31の縁部には下降していない。   In the above structure, after the bracket 9 comes into contact with the stopper adjustment screw 4 as shown in FIGS. 5 and 6, the brackets 9 and 6 of the second drive mechanism 352 and the board gripping claw 15 are located inside the outer edge of the board 31. It cannot move horizontally to the right of the predetermined lifting position. When the sub-shaft 17 is further retracted from this state, only the L-shaped base 20 of the first drive mechanism 351 moves to the right by the biasing force of the compression spring 24. At this time, the stoppers 27 and 28 are separated from each other, and the horizontal position of the bracket 9 (the vertical position of the substrate gripping claw 15) is maintained by being urged by the tension spring 13 to come into contact with the stopper adjusting screw 4. In the state of FIGS. 5 and 6, the cam follower 7 is in contact with the position of the horizontal high cam surface of the plate cam 18, and the substrate gripping claw 15 has the edge portion of the substrate 31 still mounted on the substrate receiver 3. Has not fallen to.

図5、図6の状態からさらにサブシャフト17を後退させると、第1の駆動機構351のL字型のベース20のみが圧縮バネ24の付勢力によって停止しているブラケット9よりも右方へ移動する。その結果、図7に示すように、引張バネ16により付勢されたカムフォロワ7が板カム18のカム面の斜面に沿って下降して、これにより基板把持爪15が下降し、基板受け3上に載置された基板31の縁部上面に当接する。   When the sub-shaft 17 is further retracted from the state of FIGS. 5 and 6, only the L-shaped base 20 of the first drive mechanism 351 is moved to the right of the bracket 9 stopped by the urging force of the compression spring 24. Moving. As a result, as shown in FIG. 7, the cam follower 7 urged by the tension spring 16 descends along the inclined surface of the cam surface of the plate cam 18, whereby the substrate gripping claw 15 descends, and the substrate receiver 3 moves upward. It contacts the upper surface of the edge portion of the substrate 31 placed on.

以上のようにして、四隅の基板把持ユニット35(35A、35B、35C、35D)において、基板把持爪15、および基板受け3によって、基板31の縁部が上下方向から把持する保持動作が行われる。なお、この保持状態において、基板把持爪15と基板受け3(例えば共にフッ素ゴムなどから製作する)の寸法、基板31の厚みなどを選択することによって、カムフォロワ7と板カム18の間に適当な間隙ができるよう設定しておく。これにより、基板把持爪15に加わる適宜選んでおいた引張バネ16の付勢力と、基板把持爪15と基板受け3を構成するフッ素ゴムなどの弾性部材の反発力などに起因する軽い保持力で基板31を保持できる。これにより、基板31を破損、変形させることなく、また、ハンド233への載置位置ずれを起すことなく確実に基板31を保持できる。   As described above, in the board holding units 35 (35A, 35B, 35C, 35D) at the four corners, the holding operation is performed in which the board holding claws 15 and the board receiver 3 hold the edge of the board 31 in the vertical direction. .. In this holding state, by selecting the dimensions of the substrate gripping claw 15 and the substrate receiver 3 (for example, both are made of fluororubber), the thickness of the substrate 31, and the like, an appropriate distance between the cam follower 7 and the plate cam 18 can be obtained. Set so that there is a gap. As a result, the biasing force of the appropriately selected tension spring 16 applied to the substrate gripping claw 15 and the light holding force resulting from the repulsive force of the elastic member such as the fluororubber forming the substrate gripping claw 15 and the substrate receiver 3 are set. The substrate 31 can be held. As a result, the substrate 31 can be reliably held without damaging or deforming the substrate 31 and without causing displacement of the placement position on the hand 233.

一方、この基板31の把持状態から、基板把持爪15を上昇させ、さらに基板31の縁部より外側の退避位置に移動させる解放動作は次のようにして行われる。この解放動作は、図7の状態から、図6の状態への上記と逆の方向、逆の順序の動作である。図7の状態から、サブシャフト17の前端を図中左方に前進させて、板カム18の前縁などを介してL字型のベース20を押圧すると、カムフォロワ7が板カム18のカム面の斜面に沿って上昇する。これにより、基板把持爪15が基板受け3上に載置された基板31の縁部上面から離間する。ストッパ27、28は、図5に示すようにカムフォロワ7が板カム18のカム面の斜面を昇り切ると、ようやく当接するような位置関係となっている。そのため、ストッパ27、28が当接するまでは、第2の駆動機構352のブラケット9ないし6は、引張バネ13の付勢力を介してストッパ調整ネジ4と当接した状態を保つ。そして、その間にカムフォロワ7が板カム18のカム面の斜面を昇り切り、図6のように基板把持爪15が基板31の縁部上面から離間する。   On the other hand, the releasing operation of raising the substrate gripping claw 15 from the gripped state of the substrate 31 and further moving it to the retracted position outside the edge of the substrate 31 is performed as follows. This releasing operation is an operation in the opposite direction and order from the state of FIG. 7 to the state of FIG. From the state of FIG. 7, when the front end of the sub-shaft 17 is advanced to the left in the figure and the L-shaped base 20 is pressed through the front edge of the plate cam 18, the cam follower 7 causes the cam surface of the plate cam 18 to move. Rise along the slopes of. As a result, the substrate gripping claw 15 is separated from the upper surface of the edge portion of the substrate 31 placed on the substrate receiver 3. As shown in FIG. 5, the stoppers 27 and 28 have such a positional relationship that they finally come into contact with each other when the cam follower 7 rises up the slope of the cam surface of the plate cam 18. Therefore, until the stoppers 27 and 28 come into contact with each other, the brackets 9 to 6 of the second drive mechanism 352 are kept in contact with the stopper adjusting screw 4 via the biasing force of the tension spring 13. Then, during that time, the cam follower 7 ascends the slope of the cam surface of the plate cam 18, and the substrate gripping claw 15 is separated from the upper surface of the edge portion of the substrate 31 as shown in FIG.

さらに、サブシャフト17の前端を図中左方に移動させると、ストッパ27、28が当接し、これらストッパの係止を介して、第1の駆動機構351のL字型のベース20が第2の駆動機構352のブラケット9ないし6を左方に移動させる。これにより、基板把持爪15が基板受け3上に載置された基板31の縁部上面よりも外側の退避位置に移動させる。   Further, when the front end of the sub-shaft 17 is moved to the left in the figure, the stoppers 27 and 28 come into contact with each other, and the L-shaped base 20 of the first drive mechanism 351 is moved to the second position via the engagement of these stoppers. The brackets 9 to 6 of the drive mechanism 352 are moved to the left. As a result, the substrate gripping claws 15 are moved to a retracted position outside the upper surface of the edge portion of the substrate 31 placed on the substrate receiver 3.

以上のようにして、L字型のハンドの四隅の基板把持ユニット35(35A、35B、35C、35D)において、上記の基板31の把持状態から、基板把持爪15を上昇させ、さらに基板31の縁部より外側の退避位置に移動させる解放動作が行われる。上述の基板把持ユニット35(35A、35B、35C、35D)の保持動作と、解放動作は、メインシャフト33、33を駆動することにより、同期的に、連動して実行することができる。   As described above, in the board holding unit 35 (35A, 35B, 35C, 35D) at the four corners of the L-shaped hand, the board holding claw 15 is raised from the holding state of the board 31 described above, and A releasing operation is performed to move it to a retracted position outside the edge. The holding operation and the releasing operation of the substrate gripping unit 35 (35A, 35B, 35C, 35D) described above can be synchronously and interlocked by driving the main shafts 33, 33.

なお、以上では、図1、図8などに示すように、ハンド233の手首、手先側の四隅に基板把持ユニット35(35A、35B、35C、35D)を配置する構成を示した。上述のように、基板把持ユニット35の配置数はこれよりも多くても良いが、逆に、ハンドのより少ない個所に配置する構成も考えられる。   In the above description, as shown in FIGS. 1 and 8, the configuration is such that the substrate gripping unit 35 (35A, 35B, 35C, 35D) is arranged at the wrist and the four corners of the hand side of the hand 233. As described above, the number of the board gripping units 35 to be arranged may be larger than this, but conversely, a structure in which the board gripping units 35 are arranged at a place where the number of hands is smaller can be considered.

その場合、この種の基本構成を有するハンドでは、ハンドの手首側の例えば2個所、例えば基板把持ユニット35A、35Bのみを設ける構成が好ましい。この構成は、基板把持ユニット35A、35Bを省略して、手先側の基板把持ユニット35C、35Dのみを設ける構成よりも、以下のような理由で利点が大きい(図10)。   In that case, in a hand having this type of basic configuration, it is preferable that only two positions on the wrist side of the hand, for example, only the substrate gripping units 35A and 35B are provided. This configuration is more advantageous than the configuration in which the substrate holding units 35A and 35B are omitted and only the hand-side substrate holding units 35C and 35D are provided for the following reasons (FIG. 10).

図10は、図1のA−A’線に沿った断面を示しており、図10において上方が図1の上方の手先側、下方が図1の下方の手首側に対応する。また、同図において、311は、サブフレーム1に対して直角に配置されたサブフレーム311を、また310は、それらサブフレーム311の先端に配置されたフッ素ゴムなどの弾性部材から成る基板受けを示している。この基板受け310は、上述の基板受け3と同等の構成で、その上面は例えばサブフレーム311の先端側の方が高くなった形状に形成されている。   10 shows a cross section taken along the line A-A 'in FIG. 1. In FIG. 10, the upper side corresponds to the upper hand side of FIG. 1, and the lower side corresponds to the lower wrist side of FIG. Further, in the figure, reference numeral 311 denotes a subframe 311 arranged at right angles to the subframe 1, and 310 denotes a substrate receiver made of an elastic member such as fluororubber arranged at the tip of the subframe 311. Shows. The substrate receiver 310 has the same configuration as the substrate receiver 3 described above, and the upper surface thereof is formed, for example, in a shape such that the front end side of the sub-frame 311 is higher.

また、図10において、CFは、図1のハンドをロボットアーム104で操作した時に生じるハンド233や載置、保持している基板31に加わる遠心力の方向を示している。複数リンク、関節から成るロボットアーム104の構成では、多くの場合、ハンドの部分を旋回させると、CFのような方向に遠心力が作用する。また、遠心力CFの大きさは、多くの場合、図上側の手先側の方が、手首側よりも大きい。   Further, in FIG. 10, CF indicates the direction of the centrifugal force applied to the hand 233 and the substrate 31 which is placed and held when the hand of FIG. 1 is operated by the robot arm 104. In the configuration of the robot arm 104 including a plurality of links and joints, in many cases, when a hand portion is turned, a centrifugal force acts in a direction like CF. In many cases, the magnitude of the centrifugal force CF is larger on the hand side on the upper side of the drawing than on the wrist side.

そして、ロボットアーム104のリンクが揺動され、遠心力CFが作用すると、基板31は例えば図中の鎖線〜実線のように変形し、その前端縁は、図上側(手先側)の基板受け310の斜面に喰い込むように働く。一方、基板31の後端縁は、図下側(手首側)の基板受け310の斜面から滑落するように働く。上記のような事情で、ロボットアーム104のリンクが揺動された場合、基板31の保持力は図上側(手先側)の基板受け310では比較的高く、図下側(手首側)の基板受け310ではそれよりも低くなる傾向を生じる。   Then, when the link of the robot arm 104 is swung and the centrifugal force CF acts, the substrate 31 is deformed, for example, as shown by a chain line to a solid line in the figure, and its front end edge is at the upper side (hand side) of the substrate receiver 310 in the figure. Works to bite into the slopes of. On the other hand, the rear edge of the substrate 31 works so as to slide off the slope of the substrate receiver 310 on the lower side (wrist side) of the drawing. When the link of the robot arm 104 is swung under the above circumstances, the holding force of the substrate 31 is relatively high in the substrate receiver 310 on the upper side (hand side) of the drawing, and the substrate receiving on the lower side (wrist side) in the drawing. At 310, it tends to be lower.

以上のような理由で、基板把持ユニット35の配置を2個所に限定するのであれば、ハンド233の手首側の2個所、例えば図1の基板把持ユニット35C、35Dを省略し、基板把持ユニット35A、35Bのみを設ける構成が好ましい。これにより、図下側(手首側)の基板受け310の弱い保持力を補い、また、遠心力CFの小さい側で効率よく、小さな保持力でも確実に基板を保持することができる。以上のようにして、手首側の基板把持ユニット35A、35Bのみを設ける構成によれば、効果的に基板31の位置ずれを防ぎ、確実な基板保持が可能となる。   For the reasons described above, if the arrangement of the board gripping unit 35 is limited to two, the two parts on the wrist side of the hand 233, for example, the board gripping units 35C and 35D in FIG. 1 are omitted, and the board gripping unit 35A is omitted. , 35B is preferable. This makes it possible to compensate for the weak holding force of the substrate receiver 310 on the lower side (wrist side) of the figure, and to efficiently hold the substrate on the small centrifugal force CF side even with a small holding force. As described above, according to the configuration in which only the substrate holding units 35A and 35B on the wrist side are provided, it is possible to effectively prevent the positional displacement of the substrate 31 and securely hold the substrate.

以上の実施形態によれば、成膜システムなどで用いられる搬送装置において、位置ずれを生じることなく、また、破損や変形を生じることなくガラス基板のような板状の対象物を搬送することができる。なお、以上では板状の対象物として、成膜システムなどで取り扱われる薄板のガラス基板のような対象物を例示したが、上述の基本構成は他の板状の対象物を搬送する搬送装置においても上述同様に有用であるのはいうまでもない。   According to the above-described embodiments, in a transfer device used in a film forming system or the like, it is possible to transfer a plate-shaped object such as a glass substrate without causing positional displacement and without causing damage or deformation. it can. In the above, as the plate-shaped object, an object such as a thin glass substrate handled in a film forming system or the like has been illustrated, but the basic configuration described above is used in a transfer device that transfers another plate-shaped object. Needless to say, is also useful as described above.

本発明は、以上に説明した実施形態に限定されるものではなく、本発明の技術的思想内で多くの変形が可能である。   The present invention is not limited to the embodiments described above, and many modifications can be made within the technical idea of the present invention.

例えば、図12は、本発明を実施した、有機ELパネルを製造する製造システム300の全体構成の一例を示している。製造システム300は、複数の成膜チャンバ100、搬送室1101、搬送室1102、搬送室1103、基板供給室1105、マスクストック室1106、受渡室1107、ガラス供給室1108、貼合室1109、取出室1110等を備えている。各々の成膜チャンバ100は、成膜材料の違いやマスクの違いなど細かい点で相違する部分はあるものの、基本的な構成(特に基板の搬送やアライメントに関わる構成)はほぼ共通している。なお、一つの成膜チャンバは、複数の蒸着エリアを備えていてもよい。このような構成では、一方の蒸着エリアにおける蒸着が完了するまでの間に、他方の蒸着エリアではマスク支持部を蒸着済の基板の搬出と未蒸着の基板の搬入を行う、といった並列的な成膜処理が可能である。   For example, FIG. 12 shows an example of the overall configuration of a manufacturing system 300 for manufacturing an organic EL panel, in which the present invention is carried out. The manufacturing system 300 includes a plurality of film forming chambers 100, a transfer chamber 1101, a transfer chamber 1102, a transfer chamber 1103, a substrate supply chamber 1105, a mask stock chamber 1106, a delivery chamber 1107, a glass supply chamber 1108, a bonding chamber 1109, and an ejection chamber. 1110 etc. are provided. Although the film forming chambers 100 are different from each other in details such as differences in film forming materials and masks, the basic configurations (especially configurations related to substrate transfer and alignment) are almost the same. Note that one film formation chamber may include a plurality of vapor deposition areas. In such a configuration, in parallel with the completion of vapor deposition in one vapor deposition area, in the other vapor deposition area, the mask support section carries out the vapor-deposited substrate and the non-vapor-deposited substrate in parallel. Membrane treatment is possible.

搬送室1101、搬送室1102、搬送室1103には、搬送機構であるロボットアーム1120が配置されている。このロボットアーム1120には、上述のハンド233を設けることができ、上述の構成によって、例えば成膜チャンバ100間で正確かつ確実に搬送することができる。   A robot arm 1120 as a transfer mechanism is arranged in each of the transfer chamber 1101, the transfer chamber 1102, and the transfer chamber 1103. The robot arm 1120 can be provided with the above-mentioned hand 233, and with the above-mentioned configuration, for example, the film can be accurately and reliably transferred between the film forming chambers 100.

製造システム300に含まれる複数の成膜チャンバ100は、お互いが同一材料を成膜する装置であってもよいし、異なる材料を成膜する装置であってもよい。例えば、各成膜チャンバが互いに異なる発光色の有機材料を蒸着する製造システムでもよい。製造システム300では、ロボットアーム1120によって搬送された基板に有機材料を蒸着する、あるいは金属材料等の無機材料の薄膜を例えば蒸着により形成する。   The plurality of film forming chambers 100 included in the manufacturing system 300 may be devices that deposit the same material or devices that deposit different materials. For example, the film forming chamber may be a manufacturing system in which organic materials having different emission colors are deposited. In the manufacturing system 300, an organic material is vapor-deposited on a substrate transported by the robot arm 1120, or a thin film of an inorganic material such as a metal material is formed by vapor deposition, for example.

基板供給室1105には、外部から基板が供給される。マスクストック室1106には、各成膜チャンバ100にて用いられ、膜が堆積したマスクが、ロボットアーム1120によって搬送される。マスクストック室1106に搬送されたマスクを回収することで、マスクを洗浄することができる。また、マスクストック室1106に洗浄済みのマスクを収納しておき、ロボットアーム1120によって成膜チャンバ100にセットすることもできる。   A substrate is supplied to the substrate supply chamber 1105 from the outside. The mask stock chamber 1106 is used in each film forming chamber 100, and the mask on which the film is deposited is transported by the robot arm 1120. The mask can be washed by collecting the mask transported to the mask stock chamber 1106. It is also possible to store a cleaned mask in the mask stock chamber 1106 and set it in the film forming chamber 100 by the robot arm 1120.

ガラス供給室1108には、外部から封止用のガラス材が供給される。貼合室1109において、成膜された基板に封止用のガラス材を貼り合わせることで、有機ELパネルが製造される。製造された有機ELパネルは、取出室1110から取り出される。   A glass material for sealing is supplied to the glass supply chamber 1108 from the outside. In the bonding chamber 1109, an organic EL panel is manufactured by bonding a glass material for sealing to the film-formed substrate. The manufactured organic EL panel is taken out from the take-out chamber 1110.

以上のように、本発明を採用した搬送装置としてのハンド233を備えたロボットアーム1120は、有機EL素子を製造する製造システムないし製造方法に好適に実施することができる。ただし、本発明を採用した搬送装置は、有機膜に限らず種々の成膜を行う成膜システムにおいて、基板などの対象物の搬送に好適に用いることができる。   As described above, the robot arm 1120 provided with the hand 233 as the transfer device adopting the present invention can be preferably implemented in a manufacturing system or a manufacturing method for manufacturing an organic EL element. However, the transporting device adopting the present invention can be suitably used for transporting an object such as a substrate in a film forming system for performing various film formations not limited to an organic film.

1…サブフレーム、2…ベース、5、6、9、22、23、30…ブラケット、3、310…基板受け、4…ストッパ調整ネジ、7…カムフォロワ、8、11、21…リニアガイド、13、16…引張バネ、15…基板把持爪、17、18…板カム、20…L字型のベース、24…圧縮バネ、25…圧縮バネガイド、27、28…ストッパ、29…ストッパ調整ネジ、31…基板、33…メインシャフト、34…偏心カム、35…基板把持ユニット、37…メインフレーム、100、101、102…成膜チャンバ、103…搬送経路、104…ロボットアーム、233…ハンド、300…製造システム、351…第1の駆動機構、352…第2の駆動機構、1101、1102、1103…搬送室、1105…基板供給室、1106…マスクストック室、1107…受渡室、1108…ガラス供給室、1109…貼合室、1110…取出室、1120…ロボットアーム。   DESCRIPTION OF SYMBOLS 1 ... Sub-frame, 2 ... Base, 5, 6, 9, 22, 23, 30 ... Bracket, 3,310 ... Substrate support, 4 ... Stopper adjusting screw, 7 ... Cam follower, 8, 11, 21 ... Linear guide, 13 , 16 ... tension spring, 15 ... substrate gripping claw, 17, 18 ... plate cam, 20 ... L-shaped base, 24 ... compression spring, 25 ... compression spring guide, 27, 28 ... stopper, 29 ... stopper adjusting screw, 31 ... Substrate, 33 ... Main shaft, 34 ... Eccentric cam, 35 ... Substrate gripping unit, 37 ... Main frame, 100, 101, 102 ... Film forming chamber, 103 ... Transport path, 104 ... Robot arm, 233 ... Hand, 300 ... Manufacturing system, 351 ... First drive mechanism, 352 ... Second drive mechanism, 1101, 1102, 1103 ... Transfer chamber, 1105 ... Substrate supply chamber, 1106 ... Mass Stock chamber, 1107 ... delivery chamber, 1108 ... glass supply chamber, 1109 ... Hagoshitsu, 1110 ... ejecting chamber, 1120 ... robot arm.

Claims (15)

ハンドに板状の対象物を載置して搬送する搬送装置において、
前記ハンドの構成部材の上面に固定的に装着された保持部と、
前記保持部に対して移動可能に配置された可動保持部と、
前記可動保持部を、前記保持部の上方位置と、前記保持部よりも前記ハンドの外側の退避位置と、の間で移動させるよう駆動する第1の駆動機構と、
前記可動保持部を、前記保持部の上方位置から前記保持部に向かう方向に下降、または、前記保持部から離れ前記保持部の上方位置に向かう方向に上昇させるよう駆動する第2の駆動機構と、を備え、
前記第1の駆動機構により前記可動保持部を前記退避位置から前記保持部の上に載置された前記対象物の上方位置に移動させた後、前記第2の駆動機構により前記可動保持部を前記対象物の上方位置から、前記対象物に向かって下降させて、前記可動保持部と前記保持部とにより前記対象物を保持する保持動作と、
前記第2の駆動機構により前記可動保持部を前記対象物の上方位置へ上昇させた後、前記第1の駆動機構により前記可動保持部を前記対象物の上方位置から前記退避位置に移動させる解放動作と、を行う搬送装置。
In a transfer device that transfers a plate-shaped object placed on a hand,
A holding portion fixedly attached to the upper surface of the constituent member of the hand,
A movable holding portion movably arranged with respect to the holding portion,
A first drive mechanism that drives the movable holding unit to move between a position above the holding unit and a retracted position outside the hand with respect to the holding unit;
A second drive mechanism for driving the movable holding unit so as to lower the movable holding unit in a direction from the upper position to the holding unit or raise the movable holding unit in a direction to move away from the holding unit and move to the upper position of the holding unit. ,,
After moving the movable holding unit from the retracted position to the upper position of the object placed on the holding unit by the first driving mechanism, the movable holding unit is moved by the second driving mechanism. A holding operation of lowering the object from a position above the object toward the object, and holding the object by the movable holding unit and the holding unit,
Release of moving the movable holding unit from the upper position of the object to the retracted position by the first driving mechanism after raising the movable holding unit to the upper position of the object by the second drive mechanism. A transport device that performs operations.
請求項1に記載の搬送装置において、前記ハンドは、その手首側から手先側に伸びるメインフレームと、前記メインフレームに装着され前記メインフレームに対して交差する方向に伸びるサブフレームと、を前記構成部材として備え、前記保持部と、前記可動保持部を駆動する前記第1の駆動機構および前記第2の駆動機構と、が前記サブフレームに装着されている搬送装置。   The transport apparatus according to claim 1, wherein the hand includes a main frame extending from a wrist side to a hand side, and a subframe attached to the main frame and extending in a direction intersecting the main frame. A conveyance device provided as a member, wherein the holding unit and the first driving mechanism and the second driving mechanism that drive the movable holding unit are mounted on the sub-frame. 請求項2に記載の搬送装置において、前記メインフレームに対して複数の前記サブフレームが装着され、前記複数のサブフレームの上面に前記保持部が固定的に装着され、前記ハンドの手首側に装着された前記サブフレームに対して、前記保持部に加えて、前記可動保持部が配置されている搬送装置。   The transport device according to claim 2, wherein a plurality of the sub-frames are mounted on the main frame, the holding portions are fixedly mounted on upper surfaces of the plurality of sub-frames, and the holding parts are mounted on a wrist side of the hand. In addition to the holding unit, the movable holding unit is arranged for the stored sub-frame. 請求項3に記載の搬送装置において、前記ハンドの手先側の前記サブフレームに対して、前記保持部に加えて、前記可動保持部が配置されている搬送装置。   The transport device according to claim 3, wherein the movable holding unit is arranged in addition to the holding unit with respect to the sub-frame on the hand side of the hand. 請求項2から4のいずれか1項に記載の搬送装置において、前記メインフレームに回転可能に支持されて回転駆動されるメインシャフトと、前記メインシャフトの回転駆動力により前記サブフレームに沿って往復移動し、前記第1の駆動機構または前記第2の駆動機構を駆動するサブシャフトと、を備える搬送装置。   The transport apparatus according to any one of claims 2 to 4, wherein the main shaft is rotatably supported by the main frame and is driven to rotate, and the main shaft is reciprocated along the subframe by a rotational driving force of the main shaft. A sub-shaft that moves and drives the first drive mechanism or the second drive mechanism. 請求項5に記載の搬送装置において、前記メインシャフトに装着されたカムと、前記サブシャフトの後端部と、が当接し、前記メインシャフトが回転駆動され、前記カムを介して前記サブシャフトに伝達される駆動力により、前記サブシャフトが前記サブフレームに沿って往復移動し、前記サブシャフトの前端を介して前記第1の駆動機構または前記第2の駆動機構が駆動される搬送装置。   The transport apparatus according to claim 5, wherein a cam attached to the main shaft and a rear end portion of the sub shaft contact each other, the main shaft is rotationally driven, and the sub shaft is connected to the sub shaft via the cam. A conveyance device in which the sub-shaft reciprocates along the sub-frame by the transmitted driving force, and the first drive mechanism or the second drive mechanism is driven via the front end of the sub-shaft. 請求項6に記載の搬送装置において、
前記第1の駆動機構は、往復運動する前記サブシャフトの先端に当接可能な位置に第1のリニアガイドに支持されたベースと、前記ベースに装着された、傾斜面を有する板カムと、前記第1のリニアガイドを前記サブシャフトの先端に当接する方向に付勢する第1の付勢手段と、前記可動保持部が前記保持部の上方位置にある際、前記ベースを停止させる係止手段と、を有し、
前記第2の駆動機構は、前記可動保持部を支持するブラケットと、前記ブラケットを支持する、前記第1のリニアガイドと平行に配置された第2のリニアガイドと、前記ベースと係合可能な係合爪と、前記係合爪と前記ベースとが係止する方向に前記第2のリニアガイドを付勢する第2の付勢手段と、前記板カムと当接して前記可動保持部の昇降位置を決定するカムフォロワを有し、
前記保持動作においては、前記サブシャフトが後退して、前記ベースが移動し、前記係合爪を介して前記ブラケットを前記可動保持部が前記保持部の上方位置に達するまで移動させた後、前記カムフォロワが前記板カムの前記傾斜面に沿って下降して前記可動保持部を前記対象物に当接させ、
前記解放動作においては、前記サブシャフトが前進して、前記ベースが移動し、前記カムフォロワが前記板カムの前記傾斜面に沿って上昇して前記可動保持部を前記対象物から離間させた後、さらに前記可動保持部が前記保持部の上方位置から前記退避位置に移動するまで前記係合爪を介して前記ブラケットを移動させる搬送装置。
The transport device according to claim 6,
The first drive mechanism includes a base supported by the first linear guide at a position where the first drive mechanism can contact the tip of the reciprocating sub-shaft, and a plate cam mounted on the base and having an inclined surface. A first urging means for urging the first linear guide in a direction in which the first linear guide is brought into contact with the tip of the sub-shaft; and a lock for stopping the base when the movable holding portion is located above the holding portion. And means,
The second drive mechanism is engageable with the base, a bracket that supports the movable holding portion, a second linear guide that supports the bracket and that is arranged in parallel with the first linear guide. An engaging claw, a second urging means for urging the second linear guide in a direction in which the engaging claw and the base are locked, and an elevating and lowering of the movable holding portion by abutting the plate cam. Has a cam follower that determines the position,
In the holding operation, the sub-shaft retracts, the base moves, and the bracket is moved via the engagement claw until the movable holding portion reaches a position above the holding portion, and then, A cam follower descends along the inclined surface of the plate cam to bring the movable holding portion into contact with the object,
In the releasing operation, after the sub-shaft moves forward, the base moves, the cam follower rises along the inclined surface of the plate cam to separate the movable holding portion from the object, Further, the carrying device that moves the bracket via the engaging claw until the movable holding unit moves from a position above the holding unit to the retracted position.
請求項1から7のいずれか1項に記載の搬送装置において、前記保持部が弾性部材により構成されている搬送装置。   The transport device according to any one of claims 1 to 7, wherein the holding portion is made of an elastic member. 請求項1から8のいずれか1項に記載の搬送装置において、前記可動保持部が弾性部材により構成されている搬送装置。   The transport device according to claim 1, wherein the movable holding portion is made of an elastic member. 請求項1から9のいずれか1項に記載の搬送装置において、前記ハンドの前記対象物に対する相対的な位置および/または姿勢を制御するロボットアームを備えた搬送装置。   The transport apparatus according to claim 1, further comprising a robot arm that controls a relative position and / or posture of the hand with respect to the target object. 請求項1から10のいずれか1項に記載の搬送装置と、前記対象物としてのガラス基板に対して成膜を行う成膜チャンバと、を備えた成膜装置。   A film forming apparatus comprising: the transfer device according to any one of claims 1 to 10; and a film forming chamber for forming a film on the glass substrate as the object. 請求項1から10のいずれか1項に記載の搬送装置と、
前記搬送装置により前記対象物として搬送されるガラス基板に対して有機薄膜を成膜する成膜チャンバと、を備え、
前記成膜チャンバにより有機薄膜が成膜された前記ガラス基板を用いて有機EL素子を製造する有機EL素子の製造システム。
The transport device according to any one of claims 1 to 10,
A film forming chamber for forming an organic thin film on a glass substrate conveyed as the object by the conveying device,
An organic EL element manufacturing system for manufacturing an organic EL element using the glass substrate on which an organic thin film is formed by the film forming chamber.
請求項1から10のいずれか1項に記載の搬送装置によって、有機薄膜を成膜する成膜チャンバに対して、前記対象物としてのガラス基板を搬入または搬出する搬送工程と、
前記ガラス基板に対して、前記成膜チャンバにより有機薄膜を成膜する成膜工程と、
を含み、前記ガラス基板を用いて有機EL素子を製造する有機EL素子の製造方法。
A transporting step of loading or unloading the glass substrate as the object into or from a deposition chamber for depositing an organic thin film by the transport device according to claim 1.
A film forming step of forming an organic thin film on the glass substrate by the film forming chamber,
And a method for manufacturing an organic EL element, which comprises manufacturing the organic EL element using the glass substrate.
請求項11に記載の成膜装置を複数台備えたことを特徴とする製造システム。   A manufacturing system comprising a plurality of the film forming apparatuses according to claim 11. 請求項11に記載の成膜装置を複数台備え、そのうち少なくとも一台の前記成膜装置は前記対象物として搬送されるガラス基板に有機薄膜を成膜することを特徴とする有機ELパネルの製造システム。   A plurality of film forming apparatuses according to claim 11, wherein at least one of the film forming apparatuses forms an organic thin film on a glass substrate conveyed as the target object. system.
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CN116926492A (en) * 2023-09-14 2023-10-24 广州广钢气体能源股份有限公司 Clamp table for preparing nanocrystalline film, preparation device and preparation method

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